JP2012172178A5 - - Google Patents
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- Publication number
- JP2012172178A5 JP2012172178A5 JP2011033496A JP2011033496A JP2012172178A5 JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5 JP 2011033496 A JP2011033496 A JP 2011033496A JP 2011033496 A JP2011033496 A JP 2011033496A JP 2012172178 A5 JP2012172178 A5 JP 2012172178A5
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- JP
- Japan
- Prior art keywords
- alloy material
- mass
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- fills
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000956 alloy Substances 0.000 claims 4
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 230000008014 freezing Effects 0.000 claims 1
- 238000007710 freezing Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011033496A JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011033496A JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012172178A JP2012172178A (ja) | 2012-09-10 |
| JP2012172178A5 true JP2012172178A5 (cg-RX-API-DMAC7.html) | 2014-03-06 |
| JP5667467B2 JP5667467B2 (ja) | 2015-02-12 |
Family
ID=46975373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011033496A Active JP5667467B2 (ja) | 2011-02-18 | 2011-02-18 | 合金材料、回路基板、電子デバイス及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5667467B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107405729A (zh) * | 2015-03-31 | 2017-11-28 | 住友金属矿山股份有限公司 | 焊膏 |
| WO2017065236A1 (ja) * | 2015-10-15 | 2017-04-20 | 住友精密工業株式会社 | 充填方法および充填装置 |
| CN106001982A (zh) * | 2016-07-08 | 2016-10-12 | 重庆科技学院 | 一种高熔点无铅铋银锡钎料及其制备方法 |
| JP7487471B2 (ja) * | 2019-12-13 | 2024-05-21 | 株式会社レゾナック | 金属ペースト、導電体、並びに、貫通電極を有する基体及びその製造方法 |
| JP7417696B1 (ja) | 2022-08-01 | 2024-01-18 | 千住金属工業株式会社 | 金属及び電子装置 |
| JP7534693B1 (ja) | 2023-12-14 | 2024-08-15 | 千住金属工業株式会社 | 金属及び電子装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3671815B2 (ja) * | 2000-06-12 | 2005-07-13 | 株式会社村田製作所 | はんだ組成物およびはんだ付け物品 |
| EP1705258A3 (en) * | 2001-05-28 | 2007-01-17 | Honeywell International, Inc. | Composition, methods and devices for high temperature lead-free solder |
| JP5067163B2 (ja) * | 2005-11-11 | 2012-11-07 | 千住金属工業株式会社 | ソルダペーストとはんだ継手 |
| KR20090050072A (ko) * | 2006-09-13 | 2009-05-19 | 허니웰 인터내셔널 인코포레이티드 | 전기적 상호 연결부를 위한 개선된 솔더 합금, 그 생산 방법 및 용도 |
| JP4444995B2 (ja) * | 2007-08-10 | 2010-03-31 | 有限会社ナプラ | 基板配線用導電性組成物、回路基板及び電子デバイス |
| JP5194326B2 (ja) * | 2008-12-27 | 2013-05-08 | 千住金属工業株式会社 | Ｂｉ−Ｓｎ系リール巻きはんだ線およびはんだ線の製造方法 |
| US9205513B2 (en) * | 2010-06-30 | 2015-12-08 | Senju Metal Industry Co., Ltd. | Bi—Sn based high-temperature solder alloy |
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2011
- 2011-02-18 JP JP2011033496A patent/JP5667467B2/ja active Active