JP2012169057A - Processing method of superconducting wire material - Google Patents

Processing method of superconducting wire material Download PDF

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JP2012169057A
JP2012169057A JP2011027044A JP2011027044A JP2012169057A JP 2012169057 A JP2012169057 A JP 2012169057A JP 2011027044 A JP2011027044 A JP 2011027044A JP 2011027044 A JP2011027044 A JP 2011027044A JP 2012169057 A JP2012169057 A JP 2012169057A
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superconducting wire
superconducting
wire material
cut
layer
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Yuki Shinkai
優樹 新海
Masaya Konishi
昌也 小西
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International Superconductivity Technology Center
Sumitomo Electric Industries Ltd
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International Superconductivity Technology Center
Sumitomo Electric Industries Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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    • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

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Abstract

PROBLEM TO BE SOLVED: To provide a processing method of a superconducting wire material capable of cutting a material smoothly by minimizing degradation in the superconducting characteristics of the superconducting wire material due to deterioration at an edge part or the proximity thereof, when a wide superconducting wire material having a superconducting film consisting of an oxide superconductor formed on a base plate is cut in the longitudinal direction as a thin wire.SOLUTION: In the processing method of a superconducting wire material where a wide superconducting wire material having a superconducting film consisting of an oxide superconductor formed on a base plate is cut in the longitudinal direction as a thin wire, the superconducting wire material is cut by irradiating continuous laser to the superconducting wire material. A ceramic intermediate layer, an oxide superconducting film, and a silver stabilization layer are formed sequentially on an orientation metal substrate, and a wide superconducting wire material having a copper protective layer formed on the upper and lower surface layers is cut in the longitudinal direction by continuous laser irradiation thus manufacturing a superconducting wire material.

Description

本発明は、超電導線材の加工方法に関し、詳しくは基板上に酸化物超電導体からなる超電導膜が形成された幅広の超電導線材を長手方向に切断して細線化する超電導線材の加工方法に関する。   The present invention relates to a processing method for a superconducting wire, and more particularly to a processing method for a superconducting wire in which a wide superconducting wire having a superconducting film made of an oxide superconductor formed on a substrate is cut in the longitudinal direction to be thinned.

酸化物超電導体からなる超電導膜を用いた超電導線材は、一般に、幅１〜１０ｃｍ程度の金属基板上に中間層、超電導膜、安定化層を形成した後、必要に応じて酸素導入処理を行い、用途に合わせた所定の線材幅に細線加工することにより作製される。   A superconducting wire using a superconducting film made of an oxide superconductor generally forms an intermediate layer, a superconducting film, and a stabilization layer on a metal substrate having a width of about 1 to 10 cm, and then performs oxygen introduction treatment as necessary. The thin wire is processed into a predetermined wire width according to the application.

このような細線加工の方法として、従来より、スリッターなどを用いて機械的に剪断する方法や、レーザーなどを用いて熱的に焼き切る方法などが採用されている（例えば、特許文献１）。   As such a thin wire processing method, conventionally, a method of mechanically shearing using a slitter or the like, a method of thermally burning using a laser or the like, etc. have been adopted (for example, Patent Document 1).

特開２００７−２８７６２９号公報JP 2007-287629 A

しかしながら、機械的に剪断する方法は、速い加工速度を有するものの、部材を引き裂いて切断する方法であるため、切断されたエッジ部分やその近傍が変形して劣化し易く、細線化された超電導線材の超電導特性を低下させる恐れがあった。   However, the mechanical shearing method is a method of tearing and cutting a member, although it has a high processing speed, the cut edge portion and its vicinity are easily deformed and deteriorated, and the thinned superconducting wire There was a risk that the superconducting properties of the steel would deteriorate.

これに対して、レーザーを用いた切断は、一般にスリッターによる切断に比べて劣化範囲を小さくできるという利点を有している。このレーザーとしては、瞬間的に材料を貫通することができる点からパルスレーザーが一般的に用いられているが、超電導線材の切断においては、材料をスムースに切断できないという問題があった。   On the other hand, cutting using a laser generally has an advantage that the degradation range can be made smaller than cutting by a slitter. As this laser, a pulse laser is generally used because it can penetrate the material instantaneously. However, there has been a problem that the material cannot be cut smoothly in cutting the superconducting wire.

本発明は、上記の問題に鑑み、基板上に酸化物超電体からなる超電導膜が形成された幅広の超電導線材を長手方向に切断して細線化するに際して、切断されたエッジ部分やその近傍での劣化による超電導線材の超電導特性の低下を抑制して、材料をスムースに切断することができる超電導線材の加工方法を提供することを課題とする。   In view of the above problems, the present invention provides a thinned superconducting wire having a superconducting film made of an oxide superconductor formed on a substrate. It is an object of the present invention to provide a method for processing a superconducting wire capable of smoothly cutting the material while suppressing a decrease in superconducting characteristics of the superconducting wire due to deterioration at the same time.

本発明者は、上記課題を解決するに当って、まず、パルスレーザーを用いた場合、何故、超電導線材の切断が困難になるのか、種々の実験と検討を行った。その結果、パルスレーザーの特徴である間欠的なレーザー照射に問題があることが分かった。   In order to solve the above-mentioned problems, the present inventor first conducted various experiments and examinations on why it is difficult to cut a superconducting wire when a pulse laser is used. As a result, it was found that there is a problem with intermittent laser irradiation, which is a feature of pulsed lasers.

即ち、パルスレーザーは、間欠的にレーザーを照射、即ち、エネルギーを蓄えて瞬間的に照射することにより、切断部の温度を上昇させて材料を瞬間的に融解、蒸発させて切断した後、凝固させて切断面を形成することを繰り返している。しかし、超電導線材には熱伝導速度が速い銅などの金属材料が使用されており、熱が拡散され易いため、材料の融解が起こり難くなり、融解してもすぐに凝固してしまう。この結果、超電導線材の切断が困難になっていることが分かった。   In other words, pulsed laser is intermittently irradiated with laser, that is, instantly storing energy and increasing the temperature of the cutting part to instantaneously melt and evaporate the material, then cut and solidify. And repeatedly forming the cut surface. However, a metal material such as copper having a high heat conduction speed is used for the superconducting wire, and since heat is easily diffused, the material is hardly melted and solidifies immediately even when melted. As a result, it has been found that it is difficult to cut the superconducting wire.

このような熱の拡散を補うために、１パルスのエネルギーを大きくすることが考えられるが、この場合には、セラミック層である超電導層が熱劣化し、超電導特性の低下を招くことが分かった。   In order to compensate for such heat diffusion, it is conceivable to increase the energy of one pulse. However, in this case, it was found that the superconducting layer, which is a ceramic layer, is thermally deteriorated and the superconducting characteristics are lowered. .

そこで、本発明者は、このように間欠的に出力するパルスレーザーに替えて、連続的に出力する連続レーザーに着目し、実験を行ったところ、連続レーザーを用いた場合、熱伝導速度が速い銅などの金属材料が使用されている超電導線材に対して、スムースな切断が可能となり、さらに、切断速度も速くでき、効率的に切断できることが分かった。   Therefore, the present inventor conducted an experiment by paying attention to a continuous laser that is continuously output instead of the pulse laser that is intermittently output in this way. When a continuous laser is used, the heat conduction speed is high. It was found that a superconducting wire using a metal material such as copper can be cut smoothly, and further, the cutting speed can be increased and the cutting can be performed efficiently.

即ち、連続的なレーザー出力により拡散する熱を連続的に補っているため、パルスレーザーの場合のようにパルス間における凝固の発生がない。このため、材料をスムースに、しかも、速い速度で切断することができる。また、拡散により失われる熱を効率的に補い、短時間で切断することが可能なため、セラミック層である超電導層の熱劣化を抑制することができる。   That is, since the heat diffused by the continuous laser output is continuously compensated, there is no occurrence of coagulation between pulses as in the case of a pulse laser. For this reason, the material can be cut smoothly and at a high speed. In addition, since heat lost by diffusion can be efficiently compensated and cut in a short time, thermal deterioration of the superconducting layer, which is a ceramic layer, can be suppressed.

本発明は、上記の知見に基づく発明であり、請求項１に記載の発明は、
基板上に酸化物超電導体からなる超電導膜が形成された幅広の超電導線材を長手方向に切断して細線化する超電導線材の加工方法であって、
前記超電導線材に連続レーザーを照射することにより前記超電導線材を切断することを特徴とする超電導線材の加工方法である。 The present invention is based on the above findings, and the invention according to claim 1
A superconducting wire processing method in which a wide superconducting wire having a superconducting film made of an oxide superconductor formed on a substrate is thinned by cutting in a longitudinal direction,
A method of processing a superconducting wire, wherein the superconducting wire is cut by irradiating the superconducting wire with a continuous laser.

基板としては、酸化物超電導体をｃ軸配向してエピタキシャル成長させるため、配向金属基板やＩＢＡＤ中間層基板が好ましく用いられ、配向金属基板の具体的な材料としてはＮｉ−Ｗ合金基板、ＳＵＳ等をベース金属としたクラッドタイプの金属基板等を挙げることができる。また、配向金属基板上にＣｅＯ２／ＹＳＺ／ＣｅＯ２からなる３層構造等のセラミックからなる中間層が設けられた基板を用いることもできる。 As the substrate, an oxide superconductor is epitaxially grown by c-axis orientation, and therefore, an oriented metal substrate or an IBAD intermediate layer substrate is preferably used. Specific materials of the oriented metal substrate include Ni-W alloy substrate, SUS and the like. Examples thereof include a clad type metal substrate used as a base metal. It is also possible to use a substrate intermediate layer is provided made of a ceramic of three-layer structure consisting of CeO 2 / YSZ / CeO 2 in textured metal substrate.

請求項２に記載の発明は、
前記連続レーザーの照射エネルギーが５０〜５００（Ｊ／ｓ）であることを特徴とする請求項１に記載の超電導線材の加工方法である。 The invention described in claim 2
2. The superconducting wire processing method according to claim 1, wherein the irradiation energy of the continuous laser is 50 to 500 (J / s).

照射エネルギーが小さ過ぎる場合は、熱量が不足するため、スムースに切断できない。一方、大き過ぎる場合は、熱により超電導膜が劣化する恐れがある。本発明者の実験によれば、好ましい照射エネルギーは５０〜５００Ｊ／ｓであり、具体的な一例として、後述する実施例に示す材料を切断速度９０ｍ／ｍｉｎで加工する場合、好ましい照射エネルギーは２００〜３００Ｊ／ｓである。   If the irradiation energy is too small, the amount of heat is insufficient, so that it cannot be cut smoothly. On the other hand, if it is too large, the superconducting film may be deteriorated by heat. According to the experiment of the present inventor, the preferable irradiation energy is 50 to 500 J / s. As a specific example, when the materials shown in the examples described later are processed at a cutting speed of 90 m / min, the preferable irradiation energy is 200. ~ 300 J / s.

請求項３に記載の発明は、
前記超電導線材が、銅を含有する層を有する超電導線材であることを特徴とする請求項１または請求項２に記載の超電導線材の加工方法である。 The invention according to claim 3
The method of processing a superconducting wire according to claim 1 or 2, wherein the superconducting wire is a superconducting wire having a layer containing copper.

銅は、金属材料の内でも、特に熱伝導速度が速いため、銅を含有する層を有する超電導線材に本発明を適用することにより、本発明の効果が顕著に発揮される。   Since copper has a particularly high heat conduction rate among metal materials, the effect of the present invention is remarkably exhibited by applying the present invention to a superconducting wire having a layer containing copper.

なお、超電導線材には、銅保護層の他に、熱伝導速度が速い銀層が安定化層として設けられているが、その厚みは銅層の厚みに比べてはるかに薄いため、銀層における熱の逃げは充分無視することができる。   In addition to the copper protective layer, the superconducting wire is provided with a silver layer having a high thermal conduction speed as a stabilizing layer, but its thickness is much smaller than the thickness of the copper layer. The escape of heat can be ignored.

請求項４に記載の発明は、
配向金属基板上に、順に、セラミック中間層、酸化物超電導膜、銀安定化層が形成され、さらに上下面の表層に銅保護層が形成された幅広の超電導線材が、連続レーザーにより長手方向に切断されることにより作製されていることを特徴とする超電導線材である。 The invention according to claim 4
A wide superconducting wire in which a ceramic intermediate layer, an oxide superconducting film, and a silver stabilizing layer are formed in this order on an oriented metal substrate, and a copper protective layer is formed on the upper and lower surface layers is formed in the longitudinal direction by a continuous laser. A superconducting wire characterized by being produced by cutting.

配向金属基板上に、順に、セラミック中間層、酸化物超電導膜、銀安定化層が形成され、さらに上下面の表層に銅保護層が形成された幅広の超電導線材は、優れた超電導特性を有する。このような超電導特性が優れた幅広の超電導線材を、連続レーザーを用いてスムースに切断しているため、切断に伴う劣化による超電導特性の低下が抑制されて、優れた超電導特性が維持された超電導線材を提供することができる。   A wide superconducting wire in which a ceramic intermediate layer, an oxide superconducting film, and a silver stabilizing layer are sequentially formed on an oriented metal substrate, and a copper protective layer is formed on the upper and lower surface layers has excellent superconducting properties. . Wide superconducting wires with excellent superconducting properties are cut smoothly using a continuous laser, so that the superconducting properties are maintained by suppressing the deterioration of superconducting properties due to degradation due to cutting. A wire rod can be provided.

本発明によれば、基板上に酸化物超電体からなる超電導膜が形成された幅広の超電導線材を長手方向に切断して細線化するに際して、切断されたエッジ部分やその近傍での劣化による超電導線材の超電導特性の低下を抑制して、材料をスムースに切断することができる超電導線材の加工方法を提供することができる。   According to the present invention, when a thin superconducting wire having a superconducting film made of an oxide superconductor formed on a substrate is thinned by cutting in the longitudinal direction, it is caused by deterioration at or near the cut edge portion. It is possible to provide a method for processing a superconducting wire capable of smoothly cutting the material while suppressing a decrease in superconducting characteristics of the superconducting wire.

超電導線材の構成を模式的に示す断面図である。It is sectional drawing which shows the structure of a superconducting wire typically. 実施例および比較例の超電導線材の切断部の顕微鏡写真である。It is a microscope picture of the cut part of the superconducting wire of an Example and a comparative example.

以下、実施例に基づき、本発明を具体的に説明する。   Hereinafter, based on an Example, this invention is demonstrated concretely.

１．超電導線材
本実施例においては、図１に示す構成の超電導線材を使用した。図１は、本実施例における超電導線材の構成を模式的に示す断面図であり、３は超電導線材、３１は金属基板、３２は中間層、３３は超電導膜、３４および３６は銀安定化層、３５は銅保護層である。 1. Superconducting wire In this example, a superconducting wire having the structure shown in FIG. 1 was used. FIG. 1 is a cross-sectional view schematically showing the structure of a superconducting wire in this example. 3 is a superconducting wire, 31 is a metal substrate, 32 is an intermediate layer, 33 is a superconducting film, and 34 and 36 are silver stabilizing layers. , 35 is a copper protective layer.

（１）金属基板
金属基板３１としては、１００μｍ厚のＳＵＳ層の表面に、２０μｍ厚のＣｕ層および２μｍ厚のＮｉ層が形成された総厚み約１２０μｍのクラッドタイプの金属基板を用いた。 (1) Metal Substrate As the metal substrate 31, a clad type metal substrate having a total thickness of about 120 μm in which a 20 μm thick Cu layer and a 2 μm thick Ni layer were formed on the surface of a 100 μm thick SUS layer was used.

（２）中間層
中間層３２としては、ＣｅＯ２／ＹＳＺ／ＣｅＯ２の３層構造で構成されている総厚０．６μｍの中間層を設けた。なお、各層の形成には、スパッタリング法を用いた。 (2) Intermediate layer As the intermediate layer 32, an intermediate layer having a total thickness of 0.6 μm constituted by a three-layer structure of CeO 2 / YSZ / CeO 2 was provided. Note that a sputtering method was used to form each layer.

（３）超電導膜
超電導膜３３としては、２μｍ厚のＧｄＢａ２Ｃｕ３Ｏ７−ｘ超電導膜を設けた。なお、超電導膜３３の形成には、レーザー蒸着法を用いた。 (3) Superconducting film As the superconducting film 33, a 2 μm thick GdBa 2 Cu 3 O 7-x superconducting film was provided. The superconducting film 33 was formed using a laser vapor deposition method.

（４）銀安定化層
銀安定化層としては、超電導膜３３の表面に８μｍ厚の銀安定化層３４を、また、金属基板３１の表面に２μｍ厚の銀安定化層３６を設けた。なお、各銀安定化層３４および３６の形成には、スパッタリング法を用いた。 (4) Silver Stabilizing Layer As the silver stabilizing layer, an 8 μm thick silver stabilizing layer 34 was provided on the surface of the superconducting film 33, and a 2 μm thick silver stabilizing layer 36 was provided on the surface of the metal substrate 31. A sputtering method was used to form the silver stabilizing layers 34 and 36.

（５）銅保護層
銅保護層３５としては、銀安定化層３４および３６の外側に、２０μｍ厚の銅保護層を設けた。なお、銅保護層の形成には、めっき法を用いた。 (5) Copper protective layer As the copper protective layer 35, a 20 μm thick copper protective layer was provided outside the silver stabilizing layers 34 and 36. In addition, the plating method was used for formation of a copper protective layer.

２．細線加工
以下に示す仕様の連続レーザーを用い、１０ｍｍ幅の上記超電導線材（長さ：２００ｍｍ）の中央部を４ｍｍ幅、両サイドを１ｍｍ幅に切断して、４ｍｍ幅および１ｍｍ幅の細線各２本を得た。なお、細線加工に際しては、切断部の酸化を防ぐためと溶解した材料を吹き飛ばすために、レーザー照射箇所にＡｒガスを吹き付けた。また、この細線加工におけるロス幅は２０μｍであった。 2. Fine wire processing Using a continuous laser with the specifications shown below, the central part of the 10 mm wide superconducting wire (length: 200 mm) is cut to 4 mm width and both sides to 1 mm width, and each 4 mm wide and 1 mm wide thin wire 2 I got a book. In the thin wire processing, Ar gas was sprayed on the laser irradiation portion in order to prevent oxidation of the cut portion and to blow away the dissolved material. Moreover, the loss width in this thin wire processing was 20 μm.

レーザーの波長 １０６４ｎｍ
出力 ３００Ｗ
エネルギー ３００Ｊ／ｓ
切断速度 ９０ｍ／ｍｉｎ Laser wavelength 1064nm
Output 300W
Energy 300J / s
Cutting speed 90m / min

（比較例１）
細線加工を、切断速度２ｍ／ｍｉｎのスリッターを用いて行った他は、実施例と同様にして細線を得た。 (Comparative Example 1)
A fine wire was obtained in the same manner as in the example except that the fine wire processing was performed using a slitter having a cutting speed of 2 m / min.

（比較例２）
細線加工を、以下に示す仕様のパルスレーザーを用いて行った他は、実施例と同様にして細線を得た。 (Comparative Example 2)
A thin wire was obtained in the same manner as in the example except that the thin wire processing was performed using a pulse laser having the following specifications.

レーザーの波長 １０６４ｎｍ
平均出力 ５０Ｗ
パルス幅 １００ｎｓ
繰り返し周波数 １０ｋＨｚ
切断速度 ５０ｍ／ｈｏｕｒ Laser wavelength 1064nm
Average output 50W
Pulse width 100ns
Repetition frequency 10kHz
Cutting speed 50m / hour

３．切断部の観察
顕微鏡を用いて実施例、比較例１、２で得られた細線の切断部を観察した。図２は実施例１および比較例１、比較例２の各々で得られた細線の切断部の顕微鏡写真であり、（ａ）は比較例１、（ｂ）は比較例２、（ｃ）は実施例１である。 3. Observation of the cut part The cut part of the thin wire obtained in Examples and Comparative Examples 1 and 2 was observed using a microscope. FIG. 2 is a photomicrograph of the cut portion of the thin wire obtained in Example 1, Comparative Example 1, and Comparative Example 2, where (a) is Comparative Example 1, (b) is Comparative Example 2, and (c) is Example 1.

図２に示すように、比較例１では、スリッターにより超電導線材を引き裂いて切断しているため、切断箇所が大きく変形している。また、比較例２では、特に右側がスムースに切断されておらず、熱によるとみられる劣化が認められる。これに対して、実施例では、これらの変形や熱による劣化が認められず、スムースに切断されていることが分かる。   As shown in FIG. 2, in the comparative example 1, since the superconducting wire is torn and cut by a slitter, the cut portion is greatly deformed. Moreover, in the comparative example 2, especially the right side is not cut | disconnected smoothly, but the deterioration seen with a heat | fever is recognized. On the other hand, in an Example, these deformation | transformation and deterioration by heat are not recognized, but it turns out that it cut | disconnected smoothly.

４．超電導特性
細線化された各超電導線材について、超電導特性の一例として、７７Ｋ、自己磁場下における臨界電流値Ｉｃを測定した。なお、このとき、細線加工前の幅広の超電導線材についても測定した。 4). Superconducting characteristics With respect to each thinned superconducting wire, as an example of superconducting characteristics, a critical current value Ic under a self magnetic field was measured at 77K. In addition, at this time, it measured also about the wide superconducting wire before thin wire processing.

その結果、細線加工前には３００（Ａ／ｃｍ）であったＩｃが、実施例では２９９（Ａ／ｃｍ）となっており、スムースな切断により、Ｉｃの低下が抑制されていることが分かる。これに対して、比較例１では２７０（Ａ／ｃｍ）、比較例２では２９５（Ａ／ｃｍ）となっており、前記した変形や熱による劣化により、Ｉｃが低下していることが分かる。また、実施例と比較例２においてはＩｃ劣化度合いの差は小さいが加工速度においては連続レーザーの方が素早く綺麗に加工できた。   As a result, Ic, which was 300 (A / cm) before thin wire processing, is 299 (A / cm) in the examples, and it can be seen that the reduction in Ic is suppressed by smooth cutting. . On the other hand, it is 270 (A / cm) in Comparative Example 1 and 295 (A / cm) in Comparative Example 2, and it can be seen that Ic is lowered due to the above-described deformation and deterioration due to heat. Further, in Example and Comparative Example 2, the difference in the degree of Ic deterioration was small, but the continuous laser could be processed more quickly and cleanly at the processing speed.

以上、本発明を実施の形態に基づいて説明したが、本発明は上記の実施の形態に限定されるものではない。本発明と同一および均等の範囲内において、上記の実施の形態に対して種々の変更を加えることができる。   While the present invention has been described based on the embodiments, the present invention is not limited to the above embodiments. Various modifications can be made to the above-described embodiments within the same and equivalent scope as the present invention.

３ 超電導線材
３１ 金属基板
３２ 中間層
３３ 超電導膜
３４、３６ 銀安定化層
３５ 銅保護層 3 Superconducting wire 31 Metal substrate 32 Intermediate layer 33 Superconducting films 34 and 36 Silver stabilizing layer 35 Copper protective layer

Claims (4)

基板上に酸化物超電導体からなる超電導膜が形成された幅広の超電導線材を長手方向に切断して細線化する超電導線材の加工方法であって、
前記超電導線材に連続レーザーを照射することにより前記超電導線材を切断することを特徴とする超電導線材の加工方法。 A superconducting wire processing method in which a wide superconducting wire having a superconducting film made of an oxide superconductor formed on a substrate is thinned by cutting in a longitudinal direction,
A method of processing a superconducting wire, wherein the superconducting wire is cut by irradiating the superconducting wire with a continuous laser. 前記連続レーザーの照射エネルギーが５０〜５００（Ｊ／ｓ）であることを特徴とする請求項１に記載の超電導線材の加工方法。   The method of processing a superconducting wire according to claim 1, wherein the irradiation energy of the continuous laser is 50 to 500 (J / s). 前記超電導線材が、銅を含有する層を有する超電導線材であることを特徴とする請求項１または請求項２に記載の超電導線材の加工方法。   The method of processing a superconducting wire according to claim 1 or 2, wherein the superconducting wire is a superconducting wire having a layer containing copper. 配向金属基板上に、順に、セラミック中間層、酸化物超電導膜、銀安定化層が形成され、さらに上下面の表層に銅保護層が形成された幅広の超電導線材が、連続レーザーにより長手方向に切断されることにより作製されていることを特徴とする超電導線材。   A wide superconducting wire in which a ceramic intermediate layer, an oxide superconducting film, and a silver stabilizing layer are formed in this order on an oriented metal substrate, and a copper protective layer is formed on the upper and lower surface layers is formed in the longitudinal direction by a continuous laser. A superconducting wire characterized by being produced by cutting.
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WO2017078027A1 (en) * 2015-11-05 2017-05-11 住友電気工業株式会社 Thin-film oxide superconducting wire and method for manufacturing same
JP2017091681A (en) * 2015-11-05 2017-05-25 住友電気工業株式会社 Thin film oxide superconducting wire material and manufacturing method therefor
JP2017091679A (en) * 2015-11-05 2017-05-25 住友電気工業株式会社 Manufacturing method of thin film oxide superconducting wire material
JP2017091680A (en) * 2015-11-05 2017-05-25 住友電気工業株式会社 Thin film oxide superconducting wire material and manufacturing method therefor
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