JP2012168690A - Wiring board for input device and input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board for an input device including a transparent conductive layer where reasonably high surface resistance can be secured easily and which does not have a visible pattern, in spite of including conductive fibers.SOLUTION: A wiring board 1 for an input device of the present invention comprises: a conductive substrate 10 having a transparent conductive layer 12 provided on at least one surface of an insulating substrate, and including an input area α; current collecting electrodes 20 provided on a surface of the transparent conductive layer 12 in the input area α; and an outside lead-out wiring part 30 connected to the current collecting electrodes 20. The transparent conductive layer 12 includes transparent insulating material and conductive fibers arranged in a two-dimensional network shape in the transparent insulating material, and the transparent conductive layer 12 includes respectively independent multiple first insulating parts Bwhere at least a part of the conductive fibers in the transparent insulating material is removed and gaps are formed.

Description

  The present invention relates to a wiring board and an input device used for an input device such as a touch panel.

  In an input device such as a touch panel, a wiring board having a transparent conductive substrate for detecting a contact position of a finger or the like is provided on the front surface of an image display device such as a liquid crystal display. As the conductive substrate, a substrate having a transparent insulating substrate and a transparent conductive layer is used. Patent Document 1 discloses a substrate using a tin-doped indium oxide (ITO) conductive film as the transparent conductive layer. . Patent Documents 2 and 3 disclose a transparent conductive layer containing conductive fibers in a binder resin.

Japanese Patent Application No. 2003-010987 JP 2010-140859 A JP 2010-044968 A

However, indium used for the transparent conductive layer described in Patent Document 1 is a scarce resource that may be depleted. Moreover, when forming an insulating part in the transparent conductive layer made of ITO, it may be possible to remove a part of the transparent conductive layer by laser ablation or various etchings, but the part removed by laser irradiation becomes visible. Had the problem.
Since the surface resistance of the transparent conductive layer containing conductive fibers described in Patent Documents 2 and 3 is as low as 100Ω / □ or less, there is a problem that power consumption increases when applied to a resistive film type touch panel. It was. In order to solve this problem, a method of increasing the surface resistance by reducing the density of the conductive fibers can be considered. However, if the density of the conductive fibers falls below a certain value, the surface resistance increases rapidly. It was difficult to obtain a surface resistance of 500 to 10000Ω / □.
The present invention provides a wiring board for an input device and an input device that include a transparent conductive layer that can easily ensure a certain degree of high surface resistance and has no visible pattern despite containing conductive fibers. With the goal.

The present invention has the following aspects.
[1] A conductive substrate having a transparent conductive layer provided on at least one surface of an insulating substrate and provided with an input region; a current collecting electrode provided on a surface of the transparent conductive layer in the input region; A wiring board for an input device comprising an external lead wiring portion connected to a current collecting electrode, wherein the transparent conductive layer comprises a transparent insulating material and a conductive material arranged in a two-dimensional network within the transparent insulating material A plurality of first insulating portions formed by removing at least a part of the conductive fibers in the transparent insulating material and forming voids in the transparent conductive layer. The wiring board for input devices characterized by the above-mentioned.
[2] The input device wiring board according to [1], wherein the plurality of first insulating portions are combined to form an insulating pattern.
[3] The wiring board for an input device according to [2], wherein the current collecting electrode is a pair of rod-shaped electrodes parallel to each other.
[4] The input device wiring board according to [3], wherein at least a part of the first insulating portion is parallel to the current collecting electrode.
[5] The input device wiring board according to [2], wherein the current collecting electrodes are arranged at four corners of the input region.
[6] The input according to any one of [1] to [5], wherein the transparent conductive layer is formed with a second insulating portion that becomes a part of an outline of the input region. Device wiring board.
[7] The wiring board for an input device according to any one of [1] to [6], wherein the transparent conductive layer in the input region is covered with an insulating layer.
[8] The wiring board for an input device according to any one of [1] to [7], wherein the insulating substrate is transparent.
[9] The input device wiring board according to any one of [1] to [8], wherein the first insulating portion is formed by irradiation with a pulsed laser.
[10] An input device comprising the input device wiring board according to any one of [1] to [9], wherein a voltage is applied to the current collecting electrode.

  The wiring board for an input device and the input device according to the present invention include a transparent conductive layer that can easily secure a certain degree of surface resistance and has no visible pattern despite containing conductive fibers.

It is a top view which shows 1st Embodiment of the wiring board for input devices of this invention. It is I-I 'sectional drawing of FIG. It is II-II 'sectional drawing of FIG. It is a scanning electron micrograph of a transparent conductive layer. It is a scanning electron micrograph of the 1st insulating part. It is a side view which shows an example of a laser beam irradiation apparatus. It is a figure explaining an example of the input device using the wiring board for input devices of 1st Embodiment. It is sectional drawing which shows arrangement | positioning of the wiring board for input devices in the input device of FIG. It is a top view which shows 2nd Embodiment of the wiring board for input devices of this invention. FIG. 10 is a cross-sectional view taken along the line III-III ′ of FIG. 9. It is a figure explaining an example of the input device using the wiring board for input devices of 2nd Embodiment. It is a top view which shows the other example of the 1st insulating part. It is a top view which shows the other example of the 1st insulating part.

“First Embodiment”
<Wiring board for input device>
A first embodiment of a wiring board for an input device (hereinafter abbreviated as “wiring board”) of the present invention will be described.
The wiring board of this embodiment is a wiring board used for a resistive film type touch panel, and has a transparent conductive layer 12 provided on one side of a transparent insulating substrate 11 as shown in FIGS. The rectangular conductive substrate 10 provided with the rectangular input region α, the collector electrode 20 provided on the surface of the transparent conductive layer 12 in the input region α, and the collector electrode 20 are electrically connected The external lead wiring portion 30 is provided.
In the present invention, “transparent” means one having a light transmittance of 50% or more. The conductive substrate 10 composed of the transparent insulating substrate 11 and the transparent conductive layer 12 is transparent.
The size of the input area α corresponds to the size of the image of the image display device used in combination with the resistive touch panel.

As the transparent insulating substrate 11, it is preferable to use a substrate that is transparent and insulative and hardly changes in appearance with respect to laser light irradiation described later. Specific examples include insulating materials such as glass, polycarbonate, polyester typified by polyethylene terephthalate (PET), and acrylonitrile / butadiene / styrene copolymer resin (ABS resin). In the present invention, “insulating” means that the electric resistance value is 1 MΩ, preferably 10 MΩ or more.
As the shape of the transparent insulating substrate 11, a plate-like material, a flexible film-like material, a three-dimensional (three-dimensional) molded product, or the like can be used.

  In the present embodiment, the transparent conductive layer 12 includes a transparent insulating material 12c and conductive fibers 12b arranged in a two-dimensional network within the transparent insulating material 12c (see FIG. 4).

Transparent insulation materials include transparent thermoplastic resins (polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polymethyl methacrylate, nitrocellulose, chlorinated polyethylene, chlorinated polypropylene, polyvinylidene fluoride), heat and active energy rays Examples thereof include a cured product of a transparent curable resin (a melamine acrylate, a urethane acrylate, an epoxy resin, a polyimide resin, a silicone resin such as an acrylic-modified silicate) cured with (ultraviolet rays or an electron beam).
The transparent insulating material is preferably made of the same material as the transparent insulating substrate 11 or a resin material of the same system. For example, when the transparent insulating substrate 11 is a polyethylene terephthalate film, it is preferable to use a polyester resin as the transparent insulating material.

  Each conductive fiber is irregularly arranged in two-dimensionally different directions along the surface direction of the transparent insulating substrate 11 and is densely packed so that at least a part of the conductive fibers overlap (contact with) each other. Are electrically connected to each other. This constitutes a conductive network.

Examples of the conductive fiber include metal nanowires and metal nanotubes made of copper, platinum, gold, silver, nickel, and the like. The conductive fiber has a diameter of 0.3 to 100 nm and a length of 1 to 100 μm, for example.
In addition, silicon nanowires, silicon nanotubes, metal oxide nanotubes, carbon nanotubes, carbon nanofibers, graphite fibrils, and the like can be used as conductive fibers.
Among the conductive fibers, metal nanowires are preferable in that the transparent conductive layer 12 can be easily formed and an insulating portion can be easily formed by laser light irradiation described later. Nanowire) is more preferable.
The arrangement density of the metal nanowires depends on the length and conductivity of the wires, but in the case of randomly arranged silver nanowires with a length of 20 μm, it is preferably 10 to 60 per 1000 μm ² . If it is less than the lower limit, the surface resistance may suddenly increase, and if it exceeds the upper limit, the light transmittance may be lowered.

  The conductive substrate 10 can be formed by applying a coating containing a transparent insulating material and conductive fibers to the transparent insulating substrate 11 and drying it.

The current collection electrode 20 in this embodiment consists of a pair of rod-shaped electrodes parallel to each other along the short side of the input region α. The wiring board 1 provided with such a pair of rod-shaped electrodes is suitable as a wiring board for a resistive touch panel.
The external lead wiring portion 30 is provided outside the input region α on the transparent conductive layer 12 up to a position where external wiring (not shown) can be connected. In the present embodiment, since a pair of collecting electrodes 20 is provided, a pair of external lead-out wiring portions 30 is also provided.
Examples of the metal constituting the current collecting electrode 20 and the external lead wiring portion 30 include silver, copper, aluminum, iron, and nickel.

Examples of a method for forming the current collecting electrode 20 and the external lead wiring portion 30 include a method in which a metal paste is printed on the transparent conductive layer 12 and dried, and a method in which a metal is deposited on the transparent conductive layer 12. The current collecting electrode 20 and the external lead-out wiring part 30 may be formed simultaneously or separately.
When printing a metal paste such as a silver paste, a binder resin (for example, polyester, epoxy resin, acrylic resin, etc.) is included in addition to the metal. As the printing method, the screen printing method is preferable because it can be easily thickened.
In the method of vapor-depositing a metal such as aluminum, the metal is vapor-deposited in a state where a mask is superimposed on a portion of the transparent conductive layer 12 where the current collecting electrode 20 and the external lead-out wiring portion 30 are not formed. The collector electrode 20 and the external lead-out wiring part 30 can be formed on the surface.

In the wiring board 1, a plurality of linear first insulating portions B ₁ in which at least a part of conductive fibers in the transparent insulating material is removed and voids are formed are independent of the transparent conductive layer 12. Is formed. Here, the "independent" means that the first insulating portion B ₁ is not in contact with each other.
In the first insulating portion B _1, as shown in FIG. 5, the transparent insulating material in 12c, since the portion where the conductive fiber is present is in the gap 12d, the conductive network of conductive fibers break It is electrically insulated. The first insulating portion B ₁ represents, since part and appearance comprising conductive fibers (color, transparency) are nearly identical, it is not visible.
In the present embodiment, the first insulating portion B ₁ is arranged in series at a constant interval in the parallel direction of the collecting electrode 20 and arranged in series at a constant interval in the vertical direction of the collecting electrode 20. have. Thereby, a grid-like insulating pattern is formed. As in the present embodiment, in the case of forming the insulating pattern of a plurality of first insulating portion B ₁ represents, it can be increased more easily surface resistance. In addition, a lattice-like insulating pattern can be easily formed.

The interval C between the _first insulating parts B ₁ and B _{1 in} series affects the resistance value. Specifically, a first ratio of the insulating part _B 1, _{B 1} distance between C / (first insulating portion _B 1, _{B 1} interval C + first length of the insulating part _{B 1} of each other) (hereinafter This ratio is called “aperture ratio”), and the surface resistance of the transparent conductive layer 12 can be increased.

In the present embodiment, the second insulating portion B ₂ is formed comprising the outline of the input area alpha. By the second insulating portion B ₂ are formed, it can be insulated and transparent conductive layer 12 and the external lead wire 30 of the input area alpha.
Furthermore, between the adjacent pair of external lead wires 30 and 30, the third insulating portion B ₃ is formed. By the third insulating portion _{B 3,} it can be insulated to external lead wires 30, 30 to each other.
Similarly to the _first insulating part B ₁ , the second insulating part B ₂ and the third insulating part B ₃ were also formed with voids formed by removing at least part of the conductive fibers of the transparent conductive layer 12. This is the part that is electrically insulated.

The first insulating part B ₁ , the second insulating part B ₂ and the third insulating part B ₃ are formed by irradiation with a pulsed laser. Specifically, the conductive substrate 10 (see FIG. 6) including the transparent insulating substrate 11 and the transparent conductive layer a provided on one side of the transparent insulating substrate 11 is irradiated with a laser beam while being scanned. Insulating part B ₁ , second insulating part B ₂ and third insulating part B ₃ are formed.

A laser beam irradiation device 40 as shown in FIG. 6 is used for laser beam irradiation when forming the first insulating portion B ₁ , the second insulating portion B _2, and the third insulating portion B ₃ .
The laser beam irradiation device 40 includes a laser beam generating unit 41 that generates the laser beam L, a condensing lens 42 such as a convex lens that condenses the laser beam L, the transparent insulating substrate 11 and the transparent conductive layer a. And a stage 43 on which the conductive substrate 10 made of is placed.
In the laser beam irradiation device 40, the laser beam L is irradiated from the laser beam generator 41 through the condenser lens 42 to the transparent conductive layer a.
Formation of the insulating portion by irradiation with the laser light L is simple because exposure, development, etching, and the like are unnecessary.

Examples of the laser light L generated by the laser light generating means 41 include pulsed laser light such as YAG and YVO ₄ and continuous wave laser light such as a carbon dioxide gas laser. Among these, a pulsed laser beam having a wavelength of 1064 nm such as YAG or YVO ₄ or a second harmonic thereof is preferable because it is simple.

  The focal point F of the condenser lens 42 is normally set for each surface of the transparent conductive layer a. However, when the conductive substrate 10 has irregularities or the like, or when a laser beam is irradiated over a wide area, It is preferably set at a position away from the transparent conductive layer a. Specifically, the condenser lens 42 is disposed so that the focal point F of the laser light L is located between the transparent conductive layer a and the condenser lens 42. That is, the focal point F of the condensing lens 42 (laser light L) is formed between the transparent conductive layer a and the condensing lens 42. Thereby, the spot diameter of the laser beam L which hits the transparent insulating substrate 11 becomes larger than the spot diameter of the laser beam L which hits the transparent conductive layer a. As a result, the energy density of the laser beam L is ensured in the transparent conductive layer a and the insulating portion is reliably formed, while the energy density of the laser beam L is reduced in the transparent insulating substrate 11, and the focal point F and the transparent conductive layer Even if the distance of the layer a changes, the damage of the transparent insulating substrate 11 can be prevented by suppressing the fluctuation of the energy density of the focused spot S.

  The condensing lens 42 preferably has a low numerical aperture (NA <0.1). That is, by setting the numerical aperture of the condensing lens 42 to NA <0.1, it becomes easy to set the irradiation condition of the laser light L, and in particular, the focal point F of the laser light L is the Therefore, it is possible to prevent energy loss and diffusion of the laser light L due to air plasma at the focal point F.

In forming the first insulating part B ₁ , the second insulating part B ₂ and the third insulating part B ₃ , first, the first insulating part B ₁ , the second insulating part B ₂ and the third insulating part The conductive substrate 10 on which B ₃ is not formed is fixed to the upper surface of the stage 43. At that time, the transparent conductive layer a is positioned above the transparent insulating substrate 11.
Next, the laser light L is emitted from the laser light generation means 41 of the laser light irradiation device 40, and the laser light L is condensed by the condenser lens 42 and scanned by using a galvano mirror while being applied to the transparent conductive layer a. Irradiate.
By the irradiation of the laser beam, the conductive fiber contained in the transparent conductive layer a before the laser beam irradiation is removed, and the portion where the conductive fiber exists becomes a void. Therefore, by irradiating the laser beam with a predetermined pattern while irradiating, the irradiated portions can be used as the first insulating portion B ₁ , the second insulating portion B _2, and the third insulating portion B ₃ .

These values are defined by dividing the output value of the laser beam in the processing area by the condensing spot area of the processing area. For convenience, the output is converted into the output value from the laser oscillator by the optical system. It is obtained by multiplying by the loss factor.
The spot diameter area S is defined by the following formula.
S = S ₀ × D / FL
S ₀ : Laser beam area focused by the lens FL: Lens focal length D: Distance between the surface (upper surface) of the transparent conductive layer a and the focal point

  The focus F described above has been described by taking as an example the case where the aberration is sufficiently small by the condensing means 42 such as a lens. When present, the focal point F is defined as the position where the energy density of the focal point is the highest.

  Here, the distance D is set within a range of 0.2 to 3% of the focal length FL in a normal laser beam machine. Preferably, the distance D is set within a range of 0.5 to 2% of the focal length FL. More preferably, the distance D is set within a range of 0.7 to 1.5% of the focal length FL. By setting the distance D within the above numerical range, it is possible to reliably remove the conductive fibers (form voids) in the insulating portion and form an insulating pattern having high electrical reliability, and a transparent insulating substrate It is possible to reliably prevent machining traces resulting from the 11 damage.

When forming the first insulating part B ₁ , the second insulating part B ₂ and the third insulating part B ₃ , when using a laser having a pulse width of 1 to 100 nsec (YAG laser or YVO ₄ laser), The energy density of the laser light L applied to the transparent conductive layer a is preferably 1 × 10 ¹¹ to 1 × 10 ¹³ W / m ² , and the irradiation energy per unit area is preferably 1 × 10 ⁴ to 1 × 10 ⁶ J / m ^2. . The irradiation energy per unit area is more preferably 1 × 10 ^{5 to} 3 × 10 ⁵ J / m ² .
When the energy density / irradiation energy is set to a value smaller than the above numerical range, the insulation of the first insulating part B ₁ , the second insulating part B ₂ and the third insulating part B ₃ may be insufficient. There is. Moreover, when it is set to a value larger than the above numerical range, the processing trace becomes conspicuous.

Above the circuit board 1 has been described, since the first insulating portion B ₁ is formed by the electrical flow to the transparent conductive layer 12 is inhibited, despite the transparent conductive layer 12 includes a conductive fiber, to some extent High surface resistance can be easily secured. In particular, the first part of the insulating portion B _1, because it is formed parallel to the collecting electrode 20 are perpendicular to the flow of electricity. Thereby, since it becomes easier to inhibit the flow of electricity, it is easy to make surface resistance higher.
The first insulating portion B ₁ in which the conductive fibers have been removed, the surrounding, the transparent conductive layer 12 and appearance comprising conductive fibers are identical. Accordingly, the first insulating portion B ₁ represents an invisible, transparent conductive layer 12 has no visible pattern. Therefore, the wiring board 1 is suitable for a touch panel.

<Input device>
The input device of this embodiment is a resistive film type touch panel, includes the wiring board 1, and applies a voltage to the collecting electrode 20. Specifically, as shown in FIGS. 7 and 8, a pair of wiring boards 1, 1 are arranged so that the transparent conductive layers 12, 12 face each other, a constant current power supply 60 is used, and external lead-out is performed. A voltage is applied to the current collecting electrode 20 via the wiring part 30. A spacer S is provided between the pair of wiring boards 1 and 1 so as to have a gap. Further, the current collecting electrode 20 of one wiring board 1 and the current collecting electrode 20 of the other wiring board 1 are arranged to be perpendicular to each other.
In the above input device, one wiring board 1 is used to detect the X coordinate position, and the other wiring board 1 is used to detect the Y coordinate position. At the time of detection, a voltage is applied to the current collecting electrode 20, and the voltage between the current collecting electrodes 20, 20 of each wiring board 1 when a finger or the like comes into contact with the input device 100 is detected using the differential amplifier 70. Measure and obtain the X or Y coordinate based on the voltage.

“Second Embodiment”
<Wiring board for input device>
A second embodiment of the input device wiring board (hereinafter abbreviated as “wiring board”) of the present invention will be described.
The wiring board of this embodiment is a wiring board used for a surface capacitive touch panel, and has a transparent conductive layer 12 provided on one side of a transparent insulating substrate 11 as shown in FIGS. The rectangular conductive substrate 10 provided with the rectangular input region α, the current collecting electrode 20 provided on the surface of the transparent conductive layer 12 in the input region α, and the current collecting electrode 20 electrically The external lead wiring part 30 connected and the insulating layer 50 which covers the transparent conductive layer 12 in the input region α are provided. Note that the size of the input area α in the present embodiment corresponds to the size of the image of the image display device used in combination with the surface capacitive touch panel.
The conductive substrate 10 in this embodiment is the same as that in the first embodiment. As in the first embodiment, the transparent conductive layer 12, lattice-shaped insulating pattern is provided comprising a plurality of first insulating portion B _1.

In the present embodiment, the collecting electrodes 20 are provided on the transparent conductive layers 12 at the four corners of the input region α. Also in the present embodiment, as in the first embodiment, the external lead-out wiring portion 30 is provided outside the input area α up to a position where external wiring can be connected. The materials and forming methods of the current collecting electrode 20 and the external lead wiring portion 30 are the same as those in the first embodiment.
Also in this embodiment, the second insulating portion B ₂ is formed comprising the outline of the input area alpha. Furthermore, between the adjacent outer extracted wiring portion 30, 30, the third insulating portion B ₃ is formed insulated is applied. The second insulating portion B ₂ and the third insulating portion B ₃ is also the same as in the first embodiment.

The insulating layer 50 is a layer formed of a transparent insulating material on the transparent conductive layer 12 in the input region α, and is a layer that protects the transparent conductive layer 12. As the transparent insulating material, a resin constituting the transparent conductive layer 12 can be used.
The thickness of the insulating layer 50 is preferably 5 to 700 μm. If the thickness of the insulating layer 50 is equal to or greater than the lower limit value, the transparent conductive layer 12 can be sufficiently protected. If the thickness is equal to or smaller than the upper limit value, the insulating layer is used when the wiring board 2 is used for a surface-type capacitive touch panel. The finger on 50 can be detected reliably.

Or even in the wiring board 2 described, since the first insulating portion B ₁ is formed by the electrical flow to the transparent conductive layer 12 is inhibited, despite the transparent conductive layer 12 includes a conductive fiber, A somewhat high surface resistance can be easily secured. The first insulating portion B ₁ in which the conductive fibers have been removed are not visible. Therefore, the wiring board 2 is also suitable for a touch panel.

<Input device>
The input device of the present embodiment is a surface-type capacitive touch panel, includes the wiring board 2, and applies a voltage to each collecting electrode 20. Specifically, as shown in FIG. 11, an AC power supply 80 is connected to each of the four collecting electrodes 20 of the wiring board 2 via the external lead-out wiring portion 30 to apply a voltage. Further, a current detection means 90 is provided in the wiring between the AC power supply 80 and the external lead wiring portion 30.
In the input device 200, the position of the X coordinate and the Y coordinate is detected using the wiring board 2. At the time of detection, voltages are applied to the four current collecting electrodes 20, and the current of each current collecting electrode 20 when a finger or the like contacts the input device 200 is detected by each current detecting means 90, and the current is detected. Based on this, the X coordinate or Y coordinate is obtained by obtaining the distance from each collecting electrode 20 to the contact position of the finger.

"Other embodiments"
In addition, this invention is not limited to the said embodiment.
For example, as the insulating pattern formed by the first insulating portion, as shown in FIG. 12, which first insulating portion B ₁ straight are arranged in series at equal intervals are arranged in a plurality of parallel patterns It may be. Further, as shown in FIG. 13, the pattern may be a substantially square shape with an opening near the center of each side b ₁ and the first insulating portions B ₁ having diagonal lines b ₂ arranged at equal intervals.
In the method for forming an insulating portion in the above embodiment, laser light is scanned using a galvanometer mirror. Alternatively, the laser light may be scanned by moving the stage in the XY direction.
Further, the transparent conductive layer 12 may be provided on both surfaces of the transparent insulating substrate 11.
The conductive film may include a wire grid.
In the above embodiment, the insulating substrate is transparent. However, the capacitive touch sensor may be opaque.

DESCRIPTION OF SYMBOLS 1, 2 Wiring board 10 Conductive substrate 11 Transparent insulating substrate 12 Transparent conductive layer 12b Conductive fiber 12c Transparent insulating material 12d Space | gap 20 Current collection electrode 30 External lead-out wiring part 40 Laser beam irradiation apparatus 41 Laser beam generating means 43 Stage 50 Insulation Layer 60 Constant current power supply 70 Differential amplifier 80 AC power supply 90 Current detection means 100, 200 Input device a Transparent conductive layer B ₁ 1st insulation part B ₂ 2nd insulation part B ₃ 3rd insulation part

Claims (10)

A conductive substrate having a transparent conductive layer provided on at least one surface of the insulating substrate and provided with a rectangular input region; a current collecting electrode provided on a surface of the transparent conductive layer in the input region; A wiring board for an input device comprising an external lead wiring portion connected to a current collecting electrode,
The transparent conductive layer is a layer including a transparent insulating material and conductive fibers arranged in a two-dimensional network in the transparent insulating material, and the transparent conductive layer includes a conductive fiber in the transparent insulating material. A wiring board for an input device, wherein a plurality of first insulating portions from which at least a part is removed and a void portion is formed are independently formed.   The input device wiring board according to claim 1, wherein an insulating pattern is formed by combining the plurality of first insulating portions.   The input device wiring board according to claim 2, wherein the current collecting electrodes are a pair of rod-shaped electrodes parallel to each other.   The input device wiring board according to claim 3, wherein at least a part of the first insulating portion is parallel to the current collecting electrode.   The input device wiring board according to claim 2, wherein the current collecting electrodes are arranged at four corners of the input region.   6. The input device wiring board according to claim 1, wherein a second insulating portion that becomes a part of an outline of an input region is formed in the transparent conductive layer.   The input device wiring board according to claim 1, wherein the transparent conductive layer in the input region is covered with an insulating layer.   The input device wiring board according to claim 1, wherein the insulating substrate is transparent.   The input device wiring board according to claim 1, wherein the first insulating portion is formed by irradiation with a pulsed laser.   An input device comprising the wiring board for an input device according to any one of claims 1 to 9, wherein a voltage is applied to the current collecting electrode.