JP2012168154A - Angular velocity sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an angular velocity sensor device in which stress application to adhesive that bonds a case and lid is prevented when reflow mounting is performed.SOLUTION: A communication hole 23a for communicating inside and outside is formed in a package 20. According to this configuration, since the communication hole 23a for communicating inside and outside is formed in the package 20, rise of pressure inside the package 20 is prevented when the package is reflow mounted on a board such as a print board so that stress application to the adhesive 28 is suppressed.

Description

  The present invention relates to an angular velocity sensor device in which a sensor unit for detecting angular velocity is mounted on a package via a bonding member having elasticity.

  Conventionally, for example, Patent Document 1 discloses an angular velocity sensor device in which a sensor unit for detecting an angular velocity is mounted on a case via a joining member. Specifically, in such an angular velocity sensor device, the case is configured using a bottomed cylindrical member having a hollow portion and a bottom portion, and the sensor portion is mounted on the bottom portion via a joining member. As the bonding member, one having elasticity and capable of suppressing a decrease in detection accuracy against an external impact is used by functioning as a vibration isolation member. Further, a through hole into which a jig is inserted when the sensor unit is mounted is formed at the bottom, and the sensor unit is mounted at a position corresponding to the through hole.

  In the case, an opening on the side opposite to the bottom is provided with an upper lid via an adhesive, and on the side opposite to the opening, a lower lid for covering the through hole is provided via an adhesive. Thereby, the sensor part is accommodated in a package constituted by a case, an upper lid, and a lower lid, and the inside of the package is hermetically sealed. In addition, the space comprised between the bottom part and the lower lid and the hollow part (the space comprised between the bottom part and the upper lid) are communicated with each other through a through hole.

JP 2010-181392 A

  However, in such an angular velocity sensor device, since the inside of the package is hermetically sealed, the pressure in the package rises when reflow mounting is performed on a printed circuit board or the like, and an adhesive and a case for bonding the case and the upper lid There is a problem that stress is applied to the adhesive that bonds the cover and the lower lid.

  In the above description, the angular velocity sensor device in which the sensor portion is housed in a package having a case in which a through-hole into which a jig is inserted is formed in the bottom portion, an upper lid, and a lower lid has been described as an example. There are similar problems also in the angular velocity sensor device in which the sensor portion is accommodated in a case in which a through-hole is not formed in the bottom and a package having only an upper lid provided in the opening of the case.

  In view of the above points, an object of the present invention is to provide an angular velocity sensor device capable of suppressing stress from being applied to an adhesive that bonds a case and a lid during reflow mounting.

  In order to achieve the above object, in the invention described in claim 1, the package (20) is formed with a communication hole (23a) for communicating the hollow portion constituting the internal space of the package (20) with the outside. It is characterized by being.

  In such an angular velocity sensor device, the package (20) is formed with a communication hole (23a) that communicates the inside (hollow portion constituting the internal space) and the outside, and thus is reflow-mounted on a substrate such as a printed circuit board. The pressure in the package (20) can be prevented from rising during the process, and the stress applied to the adhesive (28) that bonds the case (21) and the upper lid (22) can be suppressed. Can do.

  As in the invention described in claim 2, a through hole (24c) penetrating toward the sensor part (10) is formed in the bottom part (24) of the case (21), and the package (20) is attached to the case (21 ) Has a lower lid (23) provided in a state of covering the through hole (24c) via an adhesive (28) on the bottom (24) side, and the bottom (24) and the lower lid (23) The space comprised between and the hollow portion can be communicated with each other through the through hole (24c).

  According to this, even in an angular velocity sensor device that requires a jig for fixing the sensor unit (10) when mounting the sensor unit (10), the sensor unit (10) is cured through the through hole (24c). It can be fixed with tools.

  In this case, as in the invention described in claim 3, the joining member (25) can have elasticity.

  Moreover, like the invention of Claim 4, a communicating hole (23a) can be formed in a lower cover (23). In such an angular velocity sensor device, since the lower lid (23) is reflow-mounted with the substrate facing a printed circuit board or the like, a communication hole (23a) is formed in the case (21) or the upper lid (22). Compared with the case, it can suppress that a foreign material is introduce | transduced into the inside of a package (20) through a communicating hole (23a).

  In this case, as in the invention described in claim 5, the communication hole (23a) can be formed in a portion facing the bottom (24). According to this, compared with the case where the communication hole (23a) is formed in a part different from the part facing the bottom part (24), that is, the communication hole (23a) is a through-hole ( Compared with the case where it is formed in the part facing 24c), it is possible to suppress the foreign matter introduced from the communication hole (23a) from being introduced into the hollow portion and adhering to the joining member (25), It can suppress that the elastic function of a joining member (25) is inhibited.

  Further, as in the invention described in claim 6, the space formed between the bottom (24) and the lower lid (23) is provided in one of the bottom (24) and the lower lid (23). And wall portions (23b, 24e) spaced from the other one of the bottom portion (24) and the lower lid (23). The communication hole (23a) and the through hole (24c) are communicated with each other through a gap between the wall (23b, 24e) and the other where the wall (23b, 24e) is not provided. it can.

  According to this, even if foreign matter is introduced into the space formed between the bottom portion (24) and the lower lid (23) through the communication hole (23a), the foreign matter is prevented by the wall portions (23b, 24e). Reaching the through hole (24c) can be suppressed. For this reason, it can suppress that a foreign material is further introduce | transduced into a hollow part, and can suppress that a foreign material adheres to a joining member (25).

  In this case, as in the invention described in claim 7, the communication hole (23a) and the through hole (24c) include the wall (23b, 24e) and the other not provided with the wall (23b, 24e). It can be assumed that it communicates only through the gap between the two.

  Further, as in the invention described in claim 8, a concave portion is formed in a portion of the bottom portion (24) that constitutes a space formed between the bottom portion (24) and the lower lid (23) together with the lower lid (23). (24f) can be formed.

  According to this, even if foreign matter is introduced into the space formed between the bottom (24) and the lower lid (23) through the communication hole (23a), the foreign matter is accumulated by the recess (24f). It is possible to prevent foreign matter from reaching the through hole (24c). In particular, when a viscous liquid is introduced as a foreign substance through the communication hole (23a), the space is more than passing through the space formed between the bottom (24) and the lower lid (23). It is possible to prevent foreign matter from easily flowing into the recess (24f), which is a larger space, and to prevent the foreign matter from reaching the through hole (24c). For this reason, it can suppress that a foreign material adheres to a joining member (25) further.

  Further, as in the ninth aspect of the present invention, among the portions constituting the space formed between the bottom (24) and the lower lid (23) together with the lower lid (23) in the bottom (24), the wall A recessed part (24f) can also be formed on the side of the communicating hole (23a) opposite to the through hole (24c) side across the part (23b, 24e).

  According to this, compared with the case where a recessed part (24f) is formed in the through-hole (24c) side, it is comprised between a bottom part (24) and a lower cover (23) via a communicating hole (23a). It is easy to accumulate foreign substances introduced into the space, and further, it is possible to suppress the foreign substances from reaching the through hole (24c).

  And like invention of Claim 10, an adsorbent (40) can be arrange | positioned in the space comprised between a bottom part (24) and a lower cover (23). According to this, the foreign material introduced through the communication hole (23a) can be adsorbed by the adsorbent (40), and the foreign material can be prevented from reaching the through hole (24c).

  Further, as in the invention described in claim 11, the minimum thickness that the joining member (25) can take is the length of the longest portion of the length of the line segment connecting the opposing wall surfaces of the communication hole (23a). It can be made smaller.

  According to this, even if a solid foreign substance is introduced into the package (20), the introduced foreign substance is smaller than the minimum thickness of the joining member (25). It can suppress that it is pinched | interposed between bottom parts (24), and can suppress that the elastic function of a joining member (25) is inhibited. The length of the longest portion of the lengths of the line segments connecting the opposing wall surfaces is, for example, the diameter when the communication hole (23a) is circular, and when it is rectangular. It is a diagonal line.

  Further, as in the invention described in claim 12, the package (20) can be provided with a porous body (50) covering the communication hole (23a). According to this, since the communication hole (23a) is covered with the porous body (50), it is possible to prevent foreign matter from being introduced into the package (20) through the communication hole (23a). it can.

  Further, as in the invention described in claim 13, a cover (60) that covers the communication hole (23 a) and hermetically seals the inside of the package (20) is provided in a portion exposed to the outside of the package (20). The adhesive force between the cover (60) and the lower lid (23) can be made smaller than the adhesive force between the case (21) and the upper lid (22) and the adhesive force between the case (21) and the lower lid (23). .

  According to this, since the inside of the package (20) is hermetically sealed by the cover (60), it is possible to prevent foreign matters from being introduced into the package (20) during transportation or the like. Moreover, since the cover (60) peels from the case (21) when the pressure in the package (20) rises, it is possible to suppress stress from being applied to the adhesive (28).

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a fragmentary sectional view of the angular velocity sensor device in a 1st embodiment of the present invention. It is sectional drawing of the sensor part shown in FIG. It is a top view of the case shown in FIG. It is a reverse view of the angular velocity sensor apparatus shown in FIG. It is an enlarged view of the angular velocity sensor apparatus in 2nd Embodiment of this invention. It is a reverse view of the angular velocity sensor apparatus shown in FIG. It is an enlarged view of the angular velocity sensor apparatus in 3rd Embodiment of this invention. It is a reverse view of the angular velocity sensor apparatus shown in FIG. It is an enlarged view of the angular velocity sensor apparatus in 4th Embodiment of this invention. It is a reverse view of the angular velocity sensor apparatus shown in FIG. It is a fragmentary sectional view of an angular velocity sensor device in a 5th embodiment of the present invention. It is a fragmentary sectional view of an angular velocity sensor device in a 6th embodiment of the present invention. It is an enlarged view of the angular velocity sensor apparatus in other embodiment of this invention. It is a reverse view of the angular velocity sensor apparatus shown in FIG.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a partial cross-sectional view of an angular velocity sensor device according to the present embodiment, in which a package and the like are described as a cross-sectional view.

  As shown in FIG. 1, the angular velocity sensor device of the present embodiment includes a sensor unit 10, a package 20 that houses the sensor unit 10, and leads 30 that are electrically connected to the sensor unit 10. Has been.

  First, the configuration of the sensor unit 10 will be described. FIG. 2 is a cross-sectional view of the sensor unit 10. As shown in FIG. 2, the sensor unit 10 includes a sensor chip 11 and a signal processing chip 12, a casing 13 that houses the sensor chip 11 and the signal processing chip 12, and a lid 14 that closes the casing 13. It is configured.

  The sensor chip 11 is a general semiconductor chip in which, for example, a beam structure having a comb-tooth structure is formed on a silicon substrate or the like, and the capacitance between the movable electrode and the fixed electrode changes according to the applied angular velocity. Is used.

  The signal processing chip 12 processes a change in capacitance detected by the sensor chip 11 as an electrical signal, or adjusts a voltage applied to the sensor chip 11. For example, a silicon substrate or a ceramic substrate is used. It is configured using.

  The sensor chip 11 and the signal processing chip 12 are accommodated in the casing 13. Specifically, the casing 13 has a box shape having a bottom surface and an opening, the signal processing chip 12 is joined to the bottom surface of the casing 13 via an adhesive 15, and the sensor chip 11 is attached to the signal processing chip 12. They are joined via an adhesive 16. That is, the signal processing chip 12 and the sensor chip 11 are sequentially stacked and mounted on the casing 13. The opening of the casing 13 is closed with a lid 14.

  As the adhesives 15 and 16 for joining the casing 13 and the signal processing chip 12 and the signal processing chip 12 and the sensor chip 11, for example, a silicone-based adhesive which is an elastic adhesive capable of relieving thermal stress. Agents etc. are applied. The casing 13 is made of, for example, ceramics or resin, and the lid 14 is made of, for example, Kovar, which is a magnetic material.

  The sensor chip 11 and the signal processing chip 12 are electrically connected via a bonding wire (not shown). In the present embodiment, an example in which the sensor chip 11 and the signal processing chip 12 are formed on separate substrates will be described. However, the sensor chip 11 and the signal processing chip 12 are integrally formed on the same substrate. Also good.

  The sensor unit 10 includes a plurality of pads (not shown) on the outer side of the casing 13 and on the side opposite to the opening side where the lid 14 is disposed. In other words, the sensor unit 10 has a plurality of pads on one surface of the casing 13 opposite to the one surface (bottom surface) on which the signal processing chip 12 and the like are mounted. The plurality of pads are electrically connected to the signal processing chip 12 via conductors embedded in the casing 13, respectively. The conductor in the casing 13 and the signal processing chip 12 are electrically connected via a bonding wire 17.

  The sensor unit 10 described above is accommodated in a package 20 as shown in FIG. The package 20 includes a bottomed cylindrical case 21 having a hollow portion and a bottom portion 24, an upper lid 22 provided in an opening portion of the case 21 opposite to the bottom portion 24, and a case 21 provided on the opposite side of the opening portion. The lower lid 23 is configured to be configured.

  FIG. 3 is a plan view of the case 21, and the case 21 shown in FIG. 1 corresponds to the AA cross section in FIG. Although the lead 30 will be described later, in FIG. 3, the portion of the lead 30 that protrudes from the case 21 is omitted.

  As shown in FIGS. 1 and 3, the case 21 has a bottomed cylindrical shape having a hollow portion and a bottom portion 24 in the present embodiment. The bottom 24 has one surface 24a and another surface 24b whose outer shape is rectangular, and is formed so that a substantially cross-shaped through hole 24c penetrates in the thickness direction. Such a case 21 is manufactured by, for example, integrally molding a resin such as a liquid crystal polymer.

  The sensor unit 10 is mounted on the surface 24a of the bottom 24 at a position corresponding to the through hole 24c. Specifically, on one surface 24a of the bottom portion 24, four concave portions 24d that are slightly depressed in the thickness direction are formed so as to be spaced apart from each other. Then, a bonding member 25 such as silicone rubber having elasticity is applied to each of the recesses 24d, and the lid 14 is bonded through the bonding member 25 so as to face the one surface 24a.

  The concave portion 24d functions to suppress the outflow of the joining member 25 in the plane direction of the bottom portion 24. The through hole 24c is a portion into which a jig is inserted when the sensor unit 10 is mounted on the bottom 24, as will be described later.

  The case 21 is provided with a plurality of leads 30 integrally formed. One end of the lead 30 is exposed in the hollow portion and the other end projects from the case 21. One end portion of the lead 30 exposed in the hollow portion is electrically connected to the pad of the sensor unit 10 via the bonding wire 31. In addition, the connection portion between the lead 30 and the bonding wire 31 and the connection portion between the pad and the bonding wire 31 are covered with gels 32 and 33.

  As shown in FIG. 1, the case 21 is provided with an upper lid 22 in an opening opposite to the bottom 24, and a lower lid 23 covering the through hole 24 c is opposite to the opening. Is provided.

  Specifically, the case 21 is provided with an annular groove 26 at the end on the opening side opposite to the bottom 24 side, and an annular groove similar to the groove 26 at the end opposite to the opening. A groove portion 27 is provided. The groove portion 26 is filled with the adhesive 28 and the end portion of the upper lid 22 is curved and inserted into the groove portion 26 to join the case 21 and the upper lid 22, and the groove portion 27 is filled with the adhesive 28. The end of the lower lid 23 is curved and inserted, and the case 21 and the lower lid 23 are joined. As a result, the case 21, the upper lid 22, and the lower lid 23 are integrated to form the package 20.

  In addition, since the joining member 25 is spaced apart from each other, the space configured between the bottom portion 24 and the lower lid 23 and the hollow portion (the space configured between the bottom portion 24 and the upper lid 22) It communicates through the through hole 24c. In addition, a minimal gap is formed between the lower lid 23 and the bottom 24. Furthermore, although the upper lid 22 and the lower lid 23 are configured using a metal such as stainless steel in the present embodiment, for example, the upper lid 22 and the lower lid 23 may be configured using a resin or the like.

  In addition, the lower lid 23 is formed with a communication hole 23 a that allows the inside and the outside of the package 20 to communicate with each other. FIG. 4 is a rear view of the angular velocity sensor device, and the lower lid 23 shown in FIG. 1 corresponds to a BB cross section in FIG. In FIG. 4, a portion of the lead 30 protruding from the case 21 is omitted.

  As shown in FIG. 4, in the present embodiment, the communication hole 23 a has a circular shape, and is formed in a portion of the lower lid 23 that faces the other surface 24 b of the bottom 24. In other words, the communication hole 23a is formed in a portion of the lower lid 23 that is different from the portion facing the through hole 24c.

  Specifically, in the present embodiment, the communication holes 23a are formed at four locations symmetrically with respect to the point O with the center of the portion of the lower lid 23 facing the through hole 24c as a point O. Note that the communication hole 23a is preferably formed in a portion of the lower lid 23 away from the portion facing the through hole 24c because foreign matter such as a drip-proof material described later may pass through. That is, in the present embodiment, since the outer shape of the bottom portion 24 is rectangular, the communication hole 23a is formed in the vicinity of each corner portion of the portion of the lower lid 23 that faces the other surface 24b of the bottom portion 24. preferable.

  In addition, the communication hole 23 a has a length of the longest portion of the lengths of the opposing wall surfaces that is smaller than a minimum thickness that the joining member 25 can take. In the present embodiment, since the communication hole 23a is circular, the length of the longest portion of the lengths of the opposing wall surfaces is a diameter, and the diameter is smaller than the minimum thickness that the joining member 25 can take. Has been. Here, the minimum thickness that can be taken by the joining member 25 is that the joining member 25 is made of an elastic material, and the thickness changes due to an applied external force. Therefore, the joining member 25 is compressed to the maximum. The thickness of the sensor portion 10, in other words, the distance between the sensor portion 10 and the one surface 24 a of the bottom portion 24 when the joining member 25 is compressed to the maximum. The above is the structure of the angular velocity sensor device in the present embodiment.

  Next, an example of a method for manufacturing the angular velocity sensor device will be described. First, the case 21 having the above-described structure in which the lead 30 is insert-molded and the sensor portion 10 having the above-described structure are prepared, and the bonding member 25 is applied to each concave portion 24d of the one surface 24a of the bottom portion 24. At this time, the bonding member 25 is prevented from flowing out in the planar direction of the bottom 24 by the recess 24d. Thereafter, a jig is inserted from the side opposite to the side where the sensor unit 10 is mounted, that is, from the other surface 24b side of the bottom 24 to the one surface 24a side through the through hole 24c, and the sensor unit 10 is used as a jig. In a fixed state, the sensor unit 10 is mounted on the one surface 24 a of the bottom 24 via the bonding member 25. That is, the through hole 24 c formed in the bottom portion 24 is a portion for inserting a jig for fixing the sensor unit 10. For example, as a method of fixing the sensor unit 10 to the jig, in the present embodiment, the lid 14 is made of a magnetic material as described above. There is a method of generating and fixing a magnetic force between the tools.

  Thereafter, the sensor unit 10 and the lead 30 are electrically connected by wire bonding while the sensor unit 10 is fixed by a jig. If the wire bonding is not performed in a state where the sensor unit 10 is fixed to the jig, the sensor unit 10 is wobbled because the sensor unit 10 is mounted on the one surface 24a of the bottom 24 via the bonding member 25 having elasticity. This is because wire bonding between the sensor unit 10 and the lead 30 becomes difficult. Next, the connection part between the bonding wire 31 and the lead 30 and the connection part between the bonding wire 31 and the pad are covered with gels 32, 33 and the like.

  Subsequently, the groove portion 26 of the case 21 is filled with the adhesive 28 and the end portion of the upper lid 22 is inserted into the groove portion 27 to join the case 21 and the upper lid 22, and the groove portion 27 of the case 21 is filled with the adhesive 28 and The angular velocity sensor device is joined by inserting the end portion of the lid 23 into the groove 27 and joining the case 21 and the lower lid 23 together.

  As described above, in the angular velocity sensor device of this embodiment, the lower lid 23 is formed with the communication hole 23a that allows the inside and the outside of the package 20 to communicate with each other. For this reason, when the angular velocity sensor device is reflow-mounted on a substrate such as a printed circuit board, the pressure in the package 20 can be suppressed from increasing, and the stress applied to the adhesive 28 can be suppressed. Can do.

  In addition, the angular velocity sensor device is configured such that after the other end side of the lead 30 is reflow-mounted on the substrate with the lower lid 23 facing the substrate such as a printed circuit board, the lead 30 and the print are mounted from the mounting side of the angular velocity sensor device on the substrate. A drip-proof material that suppresses corrosion of the connection portion with the substrate is applied to the entire surface and used. In the present embodiment, since the communication hole 23 a is formed in the lower lid 23, the drip-proof material is introduced into the package 20 as compared with the case where the communication hole 23 a is formed in the case 21 and the upper lid 22. Can be suppressed.

  Furthermore, in the present embodiment, the communication hole 23 a formed in the lower lid 23 is formed in a portion facing the other surface 24 b of the bottom portion 24. For this reason, compared with the case where the communication hole 23a is formed in a part different from the part facing the other surface 24b of the bottom 24, that is, the communication hole 23a is formed in a part of the lower lid 23 facing the through hole 24c. Compared with the case where it is done, it can suppress that a foreign material adheres to the joining member 25, and an elastic function is inhibited.

  That is, since the communication hole 23 a formed in the lower lid 23 is formed in a portion facing the other surface 24 b of the bottom portion 24, the foreign matter introduced from the communication hole 23 a is separated from the other surface 24 b of the bottom portion 24 and the lower lid 23. Is introduced into a space where the sensor unit 10 is mounted, that is, a hollow portion (a space formed between the bottom portion 24 and the upper lid 22). For this reason, the communication hole 23a is formed in a part different from the part facing the other surface 24b of the bottom 24, and the foreign matter introduced from the communication hole 23a is directly in the space where the sensor unit 10 is mounted via the through hole 24c. Compared with the case where it reaches, it can suppress that a foreign material adheres to the joining member 25. In addition, when the foreign matter is a liquid such as a drip-proof material, the foreign matter enters the space between the other surface 24b of the bottom 24 and the lower lid 23 due to capillary action, but the sensor portion in the package 20 Since the space between the other surface 24b of the bottom 24 and the lower lid 23 is extremely narrow compared to the space of the portion where the sensor 10 is mounted, the foreign matter is prevented from flowing out of the space into the space where the sensor unit 10 is mounted. can do. Accordingly, it is possible to suppress the foreign function from adhering to the bonding member 25 and hindering the elastic function.

  Further, the communication hole 23 a has a diameter smaller than the minimum thickness that the joining member 25 can take. For this reason, even if a solid foreign substance enters the inside of the package 20, the foreign substance can be prevented from being sandwiched between the sensor part 10 and the one surface 24 a of the bottom part 24, and the elastic function of the joining member 25 is obstructed. It can be suppressed.

(Second Embodiment)
A second embodiment of the present invention will be described. The angular velocity sensor device of the present embodiment is provided with a wall portion at the bottom 24, and the other parts are the same as those in the first embodiment, and thus the description thereof is omitted here. FIG. 5 is an enlarged view of the angular velocity sensor device in the present embodiment, and FIG. 6 is a back view of the angular velocity sensor device. 5 corresponds to the CC cross section in FIG. 6. In FIG. 6, the portion of the lead 30 protruding from the case 21 is omitted.

  As shown in FIGS. 5 and 6, in the present embodiment, a wall portion 24 e is provided in a space formed between the other surface 24 b of the bottom portion 24 and the lower lid 23. Specifically, the wall portion 24 e is provided on the other surface 24 b of the bottom portion 24 so that the tip portion is separated from the lower lid 23. And the wall part 24e is provided with four places so that the part which opposes each communicating hole 23a among the other surfaces 24b of the bottom part 24 with the inner wall surface 21a of the case 21 may each be enclosed. That is, each communication hole 23a and the through hole 24c are communicated only through a gap formed between the front end portion of the wall portion 24e and the lower lid 23.

  Such a wall part 24e is provided in the bottom part 24 by being integrally molded with the bottom part 24 (case 21).

  In the said angular velocity sensor apparatus, it can suppress that foreign materials, such as a drip-proof material, adhere to the joining member 25 rather than the said 1st Embodiment, and also suppress that the elastic function of the joining member 25 is inhibited. Can do.

  That is, as described above, the angular velocity sensor device is used after the drip-proof material is applied, but specifically, is used after the drip-proof material is applied and the inspection process is performed. In this case, since the manufacturing process is prolonged if the inspection process is performed after the drying process is performed until the drip-proof material is completely dried (solidified), the drying process and the inspection process are usually performed at the same time. In the inspection process, a characteristic inspection is performed to inspect whether the battery can be used in a high temperature environment and a low temperature environment. At this time, if an inspection process in a low temperature environment is performed before the drip-proof material is completely dried, the inside of the package 20 is more likely to cool than the outside of the package 20, so that the pressure inside the package 20 is the pressure outside the package 20. Lower. At this time, the drip-proof material that is not completely dried due to the pressure difference between the inside and outside of the package 20 may be introduced into the space formed between the other surface 24b of the bottom 24 and the lower lid 23 through the communication hole 23a. is there.

  For this reason, in the angular velocity sensor device of the present embodiment, the wall 24e is provided in the bottom 24, and the communication hole 23a and the through hole 24c are communicated only through the gap between the wall 24e and the lower lid 23. . Therefore, the drip-proof material introduced into the space formed between the other surface 24b of the bottom 24 and the lower lid 23 through the communication hole 23a is suppressed from reaching the through hole 24c by the wall 24e. That is, it is possible to prevent foreign matter from being introduced into the space in which the sensor unit 10 is mounted from the space formed between the other surface 24 b of the bottom 24 and the lower lid 23, and the joint member 25 is drip-proof. It can suppress that material adheres. For this reason, it can further suppress that the elastic function of the joining member 25 is inhibited. Here, the drip-proof material has been described as an example, but the foreign matter other than the drip-proof material is also prevented from reaching the through hole 24c by the wall 24e, and the same effect can be obtained.

  The wall portion 24e is provided with a tip portion spaced apart from the lower lid 23, and the communication hole 23a and the through hole 24c are communicated with each other through a gap between the tip portion of the wall portion 24e and the lower lid 23. Therefore, similarly to the first embodiment, it is possible to suppress an increase in the pressure in the package 20.

  Furthermore, since the wall portion 24e and the lower lid 23 are separated from each other, the vibration isolating function of the joining member 25 (bottom portion 24) is not hindered.

(Third embodiment)
A third embodiment of the present invention will be described. The angular velocity sensor device of the present embodiment is provided with a recess in the bottom 24, and the other parts are the same as those of the second embodiment, and thus the description thereof is omitted here. FIG. 7 is an enlarged view of the angular velocity sensor device in the present embodiment, and FIG. 8 is a rear view of the angular velocity sensor device. 7 corresponds to the DD cross section in FIG. 8. In FIG. 8, the portion of the lead 30 protruding from the case 21 is omitted.

  As shown in FIGS. 7 and 8, in the present embodiment, a recess 24f is formed in a portion of the bottom 24 that forms a space with the lower lid 23, that is, the other surface 24b. Specifically, the recess 24f is formed on the side of the communication hole 23a opposite to the through hole 24c side of the other surface 24b of the bottom 24 across the wall 24e. In other words, the recessed portion 24f is formed in the region surrounded by the wall portion 24e together with the inner wall surface 21a of the case 21 in the other surface 24b of the bottom portion 24.

  In such an angular velocity sensor device, even if foreign matter is introduced into the space formed between the other surface 24b of the bottom 24 and the lower lid 23 through the communication hole 23a, the foreign matter can be accumulated by the recess 24f. It is possible to suppress foreign matters from reaching the through hole 24c. In particular, when a drip-proof material having viscosity as a foreign substance is introduced through the communication hole 23a, the space is more than passing through the space formed between the other surface 24b of the bottom 24 and the lower lid 23. It becomes easier for foreign matter to flow into the recess 24f, which is a larger space, and foreign matter can be prevented from reaching the through hole 24c. For this reason, it can suppress that a foreign material adheres to the joining member 25 further.

(Fourth embodiment)
A fourth embodiment of the present invention will be described. The angular velocity sensor device of the present embodiment is provided with an adsorbent on the bottom 24, and the other parts are the same as those of the second embodiment, and thus the description thereof is omitted here. FIG. 9 is an enlarged view of the angular velocity sensor device in the present embodiment, and FIG. 10 is a rear view of the angular velocity sensor device. 9 corresponds to the EE cross section in FIG. 10, and in FIG. 10, a portion of the lead 30 protruding from the case 21 is omitted.

  As shown in FIGS. 9 and 10, an adsorbent 40 is provided in the space formed between the other surface 24 b of the bottom 24 and the lower lid 23. Specifically, the adsorbent 40 is provided on the side of the communication hole 23a opposite to the through hole 24c side of the other surface 24b of the bottom 24 across the wall 24e. In other words, each of the other surfaces 24b of the bottom portion 24 is provided in a region surrounded by the wall portion 24e together with the inner wall surface 21a of the case 21. Such an adsorbent 40 is configured using, for example, a sponge-like porous material capable of adsorbing a liquid such as a drip-proof material.

  In the angular velocity sensor device, even if foreign matter is introduced into the space formed between the other surface 24b of the bottom 24 and the lower lid 23 through the communication hole 23a, the foreign matter can be adsorbed by the adsorbent 40. The foreign matter can be prevented from reaching the through hole 24c. For this reason, it can suppress that a foreign material adheres to the joining member 25 further.

  As described above, when the adsorbent 40 configured using a porous material is used, it is possible to suppress the drip-proof material as a foreign matter from adhering to the elastic member 25, but in the use environment. It is of course possible to change the adsorbent 40 accordingly. For example, when there is a high possibility that solids such as resin waste and dust in addition to the drip-proof material are introduced as foreign matter from the communication hole 23a, the adsorbent 40 further provided with an adhesive material can be provided. In this case, for example, by providing an adhesive on the surface of the adsorbent 40 on the side of the lower lid 23, solid foreign substances can be adsorbed by the adhesive disposed on the surface of the adsorbent 40. A liquid foreign substance such as a drip-proof material can be adsorbed by the porous body exposed at the side surface. Moreover, the adsorbent 40 can also be comprised only with an adhesive material.

(Fifth embodiment)
A fifth embodiment of the present invention will be described. The angular velocity sensor device of the present embodiment is provided with a porous body in the communication hole 23a, and the others are the same as those in the first embodiment, and thus the description thereof is omitted here. FIG. 11 is a partial cross-sectional view of the angular velocity sensor device in the present embodiment.

  As shown in FIG. 11, in the present embodiment, the communication hole 23 a is formed on one surface of the lower lid 23 opposite to the one surface facing the other surface 24 b of the bottom 24, that is, one surface of the lower lid 23 exposed to the outside. Is disposed. As the porous body 50, for example, Gore-Tex (registered trademark), a ventilation seal or the like is used.

  In such an angular velocity sensor device, since the communication hole 23a is covered with the porous body 50, foreign matter is introduced into the package 20 through the communication hole 23a as compared with the first embodiment. Can be suppressed.

  In addition, since the inside and the outside of the package 20 are communicated with each other through the porous body 50, an increase in the pressure in the package 20 is suppressed when the angular velocity sensor device is reflow-mounted. Further, in the present embodiment, the example in which the porous body 50 is arranged on one surface exposed to the outside of the lower lid 23 has been described, but the communication hole 23a is formed on one surface of the lower lid 23 facing the other surface 24b of the bottom 24. It is also possible to arrange a porous body 50 covering the.

(Sixth embodiment)
A third embodiment of the present invention will be described. The angular velocity sensor device of the present embodiment is provided with a cover in the communication hole 23a, and the other parts are the same as those of the first embodiment, and thus the description thereof is omitted here. FIG. 12 is a partial cross-sectional view of the angular velocity sensor device in the present embodiment.

  As shown in FIG. 12, in this embodiment, a cover 60 that covers the communication hole 23 a is disposed on one surface of the lower lid 23 that is exposed to the outside. Specifically, the cover 60 is fixed to the lower lid 23 by welding so that the inside of the package 20 is hermetically sealed. The adhesive force between the cover 60 and the lower lid 23 is weaker than the adhesive force between the case 21, the upper lid 22, and the lower lid 23. Although not particularly limited, the cover 60 is made of, for example, stainless steel (SUS). Further, the cover 60 may be fixed to the lower lid 23 by, for example, plating.

  In such an angular velocity sensor device, since the inside of the package 20 is hermetically sealed by the cover 60, it is possible to prevent foreign matter from being introduced into the package 20 during transport or the like. Further, the adhesive force between the cover 60 and the lower lid 23 is weaker than the adhesive force between the case 21, the upper lid 22 and the lower lid 23, and the cover 60 is peeled off from the case 21 when the pressure in the package 20 rises. Application of stress to the adhesive 28 can be suppressed.

(Other embodiments)
In the first, fifth, and sixth embodiments, the example in which the communication hole 23a is formed in the lower lid 23 of the package 20 has been described, but the communication hole 23a may be formed in the case 21, for example. However, it may be formed on the upper lid 22. Also in such an angular velocity sensor device, it is possible to suppress an increase in pressure in the package 20 during reflow mounting, and it is possible to suppress stress from being applied to the adhesive 28. Further, even when the communication hole 23a is formed in the case 21 or the upper lid 22, the porous body 50 covering the communication hole 23a can be arranged as in the fifth embodiment, and as in the sixth embodiment. A cover 60 that covers the communication hole 23a can be disposed.

  In each of the above embodiments, the example in which the through hole 24c formed in the bottom portion 24 has a substantially cross shape has been described. However, the present invention is not limited to this. For example, the through hole 24c may be circular. . Similarly, the communication hole 23a does not have to be circular, but may be rectangular, for example. Even in the case where the communication hole 23a is rectangular, the length of the longest portion of the lengths of the opposing wall surfaces is smaller than the minimum thickness that the joining member 25 can take, as in the first embodiment. In the case where the communication hole 23a has a rectangular shape, the length of the longest portion of the lengths of the opposing wall surfaces is a diagonal line.

  In the first, fifth, and sixth embodiments, the communication hole 23a is described as being formed in the portion of the lower lid 23 that faces the other surface 24b of the bottom 24. However, the communication hole 23a The lid 23 may be formed in a portion different from the portion facing the other surface 24 b of the bottom 24. Even in such an angular velocity sensor device, it is possible to suppress an increase in pressure in the package 20 during reflow mounting, and it is possible to suppress stress from being applied to the adhesive 28.

  Further, in each of the above embodiments, the example in which the four communication holes 23a are formed has been described. However, for example, the communication hole 23a may be one or more. That is, by forming at least one communication hole 23 a that allows the inside and the outside to communicate with each other in the package 20, it is possible to suppress an increase in the pressure in the package 20 during reflow mounting. Application of stress can be suppressed.

  Furthermore, in the first, fifth, and sixth embodiments, the sensor unit 10 is housed in the package 20 having the case 21 having the through hole 24c formed in the bottom 24, the upper lid 22, and the lower lid 23. Although the angular velocity sensor device is described, the following angular velocity sensor device may be used. That is, when a member having no elasticity is used as the joining member 25, the case 21 in which the through hole 24c is not formed in the bottom 24 can be used. This is because when the bonding member 25 does not have elasticity, the sensor unit 10 does not wobble when performing wire bonding or the like, and thus the sensor unit 10 does not need to be fixed with a jig. That is, an angular velocity sensor device can be provided in which the sensor unit 10 is accommodated in a package 20 having a case 21 in which the through hole 24 c is not formed in the bottom 24 and an upper lid 22 provided in the opening of the case 21. . In this case, for example, the effect of the present invention can be obtained by forming the communication hole 23 a in the case 21 or the upper lid 22.

  Moreover, although the said 2nd Embodiment demonstrated the example in which the wall part 24e was provided in the other surface 24b of the bottom part 24, it can also be performed as follows. 13 is an enlarged view of an angular velocity sensor device according to another embodiment, and FIG. 14 is a back view of the angular velocity sensor device shown in FIG. 13 corresponds to a cross section taken along line FF in FIG. 14. In FIG. 14, a portion of the lead 30 protruding from the case 21 is omitted.

  As shown in FIG. 13, one surface of the lower lid 23 facing the other surface 24 b of the bottom portion 24 surrounds each communication hole 23 a together with the inner wall surface 21 a of the case 21, and is separated from the other surface 24 b of the bottom portion 24. Four wall portions 23b may be provided. Such a wall part 23b is formed by pressing the metal which comprises the lower cover 23, etc.

  Thus, even if the lower lid 23 is provided with the wall portion 23b, it is configured between the other surface 24b of the bottom portion 24 and the lower lid 23 via the communication hole 23a, as in the second embodiment. The foreign matter introduced into the space is prevented from reaching the through hole 24c by the wall 23b. Therefore, it can suppress that a foreign material adheres to the joining member 25, and can suppress that the elastic function of the joining member 25 is inhibited.

  Moreover, in the said 2nd Embodiment, what was equipped as the wall part 24e so that it might each surround the part facing the communicating hole 23a among the other surfaces 24b of the bottom part 24 with the inner wall surface 21a of the case 21 was demonstrated. However, it can also be done as follows. That is, the wall part 24e may be provided so that the part which opposes the communicating hole 23a among the other surfaces 24b of the bottom part 24 is enclosed only by the wall part 24e.

  Furthermore, the wall portion 24e may not be formed so as to surround a portion of the other surface 24b of the bottom portion 24 facing the communication hole 23a together with the inner wall surface 21a of the case 21. That is, a gap may exist between the wall portion 24e and the inner wall surface 21a of the case 21. Even in the case of such an angular velocity sensor device, the foreign matter introduced into the space formed between the other surface 24b of the bottom 24 and the lower lid 23 penetrates compared to the case where the wall 24e is not provided. Reaching the hole 24c can be suppressed by the wall 24e.

  And in the said 3rd Embodiment, although the recessed part 24f demonstrated the example formed in the communicating hole 23a side on the opposite side to the through-hole 24c side across the wall part 24e among the other surfaces 24b of the bottom part 24, it penetrates. It can also be formed on the hole 24c side. According to this, the foreign matter that has passed through the wall 24e can be accumulated in the recess 24f, and the foreign matter can be prevented from reaching the through hole 24c.

  Furthermore, in the fourth embodiment, the example in which the adsorbent 40 is provided on the other surface 24b of the bottom 24 has been described. However, the adsorbent 40 is provided on one surface of the lower lid 23 that faces the other surface 24b of the bottom 24. It may be done.

  In the third and fourth embodiments, the example in which the wall 24e is provided on the other surface 24b of the bottom 24 has been described. However, the wall 24e may not be provided on the other surface 24b of the bottom 24.

  Further, in the fifth embodiment, the case where the porous body 50 is disposed in each communication hole 23a is described, and in the sixth embodiment, the case where the cover 60 is disposed in each communication hole 23a is described. . However, the porous body 50 and the cover 60 may not be disposed in each communication hole 23a, and the porous body 50 and the cover 60 may be disposed only in the specific communication hole 23a. Also in such an angular velocity sensor device, it is possible to prevent foreign matter from being introduced from the communication hole 23a in which the porous body 50 and the cover 60 are disposed.

  And it can also be set as the angular velocity sensor apparatus which combined said each embodiment. For example, the adsorbent 40 can be disposed on the other surface 24b of the bottom 24 by combining the third embodiment and the fourth embodiment. Of course, as described above, the adsorbent 40 may be provided on one surface of the lower lid 23 facing the other surface 24b of the bottom 24.

  Moreover, the porous body 50 can be provided in the communication hole 23a by combining the second to fourth embodiments with the fifth embodiment. Further, the cover 60 may be provided in the communication hole 23a by combining the second to fourth embodiments with the sixth embodiment.

DESCRIPTION OF SYMBOLS 10 Sensor part 20 Package 21 Case 22 Upper cover 23 Lower cover 23a Communication hole 24 Bottom part 24c Through-hole 30 Lead

Claims (13)

A sensor unit (10) for outputting an electrical signal corresponding to the angular velocity;
A bottomed cylindrical member having a hollow portion and a bottom portion (24), wherein the sensor portion (10) is inserted through a joining member (25) in a state where the sensor portion (10) is located in the hollow portion. A case (21) mounted on the bottom (24), and an opening on the opposite side of the case (21) to the bottom (24) side are provided in a state of covering the opening via an adhesive (28). A package (20) having an upper lid (22);
The package (20) is formed with a communication hole (23a) for communicating the hollow portion constituting the internal space of the package (20) with the outside. The bottom (24) of the case (21) is formed with a through hole (24c) that penetrates in the thickness direction toward the sensor (10).
The package (20) has a lower lid (23) provided in a state of covering the through hole (24c) via an adhesive (28) on the bottom (24) side of the case (21). And
The space formed between the bottom part (24) and the lower lid (23) and the hollow part are communicated with each other through a through hole (24c). Angular velocity sensor device.   The angular velocity sensor device according to claim 2, wherein the joining member (25) has elasticity.   The angular velocity sensor device according to claim 2 or 3, wherein the communication hole (23a) is formed in the lower lid (23).   The angular velocity sensor device according to claim 4, wherein the communication hole (23a) is formed in a portion of the lower lid (23) facing the bottom portion (24). The space formed between the bottom portion (24) and the lower lid (23) is provided in one of the bottom portion (24) and the lower lid (23) and the bottom portion (24) and Wall portions (23b, 24e) spaced apart from the other of the lower lids (23) are provided,
The angular velocity sensor device according to claim 5, wherein the communication hole (23a) and the through hole (24c) communicate with each other through a gap between the wall portion (23b, 24e) and the other.   The angular velocity sensor device according to claim 6, wherein the communication hole (23a) and the through hole (24c) communicate with each other only through a gap between the wall portion (23b, 24e) and the other. .   A recess (24f) is formed in a portion of the bottom (24) that constitutes the space formed between the bottom (24) and the lower lid (23) together with the lower lid (23). The angular velocity sensor device according to claim 4, wherein the angular velocity sensor device is provided.   Of the portions constituting the space formed between the bottom portion (24) and the lower lid (23) together with the lower lid (23) in the bottom portion (24), the wall portions (23b, 24e) are formed. The angular velocity sensor device according to claim 6 or 7, wherein a recess (24f) is formed on the side of the communication hole (23a) opposite to the side of the through hole (24c).   The adsorbent (40) is disposed in the space formed between the bottom (24) and the lower lid (23), according to any one of claims 2 to 9. The angular velocity sensor device described.   The communication hole (23a) is characterized in that the length of the longest portion of the lengths of the opposing wall surfaces is made smaller than the minimum thickness that can be taken by the joining member (25). An angular velocity sensor device according to any one of the above.   The angular velocity sensor device according to any one of claims 1 to 11, wherein the package (20) includes a porous body (50) covering the communication hole (23a). A portion of the package (20) exposed to the outside is provided with a cover (60) that covers the communication hole (23a) and hermetically seals the inside of the package (20).
The adhesive force between the cover (60) and the package (20) is based on the adhesive force between the case (21) and the upper lid (22) and the adhesive force between the case (21) and the lower lid (23). The angular velocity sensor device according to any one of claims 1 to 11, wherein the angular velocity sensor device is small.

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