JP2009122000A - Sensor having movable section and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To protect a movable section in a sensor having the movable section in a portion of a sensor element, and simplify its manufacturing process. <P>SOLUTION: The sensor is provided with the sensor element 10 having the movable section 18, an upper lid 20 bonded so as to cover an upper surface of the sensor element 10, and a lower lid 30 bonded so as to cover a lower surface of the sensor element. A first recessed movable region 22 is formed in a region corresponding to an operating range of the movable section 18 on the upper lid 20. A second recessed movable region 32 is formed in the region corresponding to the operating range of the movable section 18 on the lower lid 30. Since the upper and lower lids 20, 30 are previously formed with the movable regions 22, 32 and bonded to the sensor element 10, the manufacturing process can be simplified. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sensor and a manufacturing method thereof, and more particularly to a sensor having a movable part in a part of a sensor element and a manufacturing method thereof.

  Various sensors such as an angular velocity sensor for detecting the rotational angular velocity applied to the object and an acceleration sensor for detecting the acceleration applied to the object are used for camera shake detection, car navigation, attitude control systems for automobiles and robots, etc. It's being used. As a method for detecting angular velocity and acceleration, there are a detection method based on a change in resistance value of a piezoresistor, a detection method based on a change in capacitance between detection electrodes, and the like. In any case, it is necessary to form a movable part that operates by an external force in a part of the sensor element.

  In the state before the sensor element is packaged, the movable part of the sensor element is exposed to the outside, so that the operation performance and the manufacturing yield of the sensor are reduced due to the adhesion of foreign matter to the movable part and the damage to the movable part. There was a problem. In order to solve these problems, various methods for packaging sensor elements at the wafer level have been developed.

  FIG. 1 is a cross-sectional view showing a configuration of a sensor according to a conventional example. A sensor element 80 having a movable part is bonded to the upper surface of the glass substrate 82. A part of the lower surface of the sensor element 80 is etched to form a movable region 84 that is a region for operating the movable portion. The sensor element 80 bonded to the glass substrate 82 is mounted on the bottom surface of a package 86 having a cavity 85. The package 86 and the sensor element 80 are electrically connected by a wire 88. The upper part of the package 86 is sealed with a package lid 89. According to this configuration, since the movable part of the sensor element 80 is covered by the glass substrate 82, the movable part can be protected.

FIG. 2 is a cross-sectional view showing the configuration of the sensor described in Patent Document 1. A sensor element 90 having a movable part is sealed from above and below by glass substrates 92 and 94. A part of the upper surface of the sensor element 90 is formed one step lower than the other parts by etching, and a movable region 96 for operating the movable part is formed. On the lower surface of the upper glass substrate 92, a detection electrode 91 for detecting displacement of the movable part due to external force is provided. The detection wiring 93, the through electrode 98, and the external electrode 99 provided on the glass substrate 92 are for taking out a signal from the detection electrode 91 to the outside. The metal pad 95 provided on a part of the upper surface of the sensor element 90 is connected to the detection wiring 93 and the through electrode 98 and transmits the signal detected by the detection electrode 91 to the outside without being attenuated. A gasket 97 is provided near the opening of the through electrode 98.
JP 2006-46995 A

  In the conventional sensor shown in FIGS. 1 and 2, the movable region for operating the movable portion of the sensor element is formed by etching a part of the sensor elements 80 and 90. Further, in order to electrically connect the sensor element and the outside, the through electrode 98 is formed as shown in FIG. The formation of the movable region and the through electrode often requires a special manufacturing process and takes a long time for processing, so that mass production of sensors and cost reduction are difficult.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a sensor that protects a movable part during packaging and that has a simplified manufacturing process.

  The present invention includes a sensor element having a movable part, an upper lid joined so as to cover the upper surface of the sensor element, and having a concave first movable area formed in an area corresponding to the operating range of the movable part, and the sensor A sensor having a movable part, comprising: a lower lid joined so as to cover a lower surface of the element and having a concave second movable area formed in an area corresponding to an operation range of the movable part. . According to the present invention, the movable portion of the sensor element can be protected by the upper lid having the first movable area and the lower lid having the second movable area. In addition, the manufacturing process can be simplified because it is only necessary to join the upper lid and the lower lid, each of which has a concave movable region formed in advance, to the sensor element.

In the above configuration, the sensor element has an external connection electrode on the upper surface,
The upper cover may have a through hole formed through the upper cover above the external connection electrode. According to this configuration, the sensor element can be electrically connected to the outside through the through hole and the external connection electrode.

  In the above configuration, the upper lid may be configured such that a region between the peripheral edge portion on the upper surface and the through hole is formed lower than a region between the central portion on the upper surface and the through hole. . According to this configuration, it becomes easier to electrically connect the sensor element and the outside.

  The said structure WHEREIN: The said upper cover can be set as the structure which has the groove | channel formed in the direction which connects the center part of the said upper cover, and the said through-hole on an upper surface. According to this configuration, it becomes easy to fill the through hole with resin during molding.

  In the above configuration, with the lower lid on the lower side, the sensor element, the upper lid, the mounting portion on which the lower lid is mounted, the inside of the through hole, the external connection electrode and the mounting portion A wire to be connected and a sensor member, the upper lid, the lower lid, and a sealing member that seals the wire are formed on the upper surface of the mounting portion. According to this configuration, the sensor element can be more effectively protected by the sealing member. Further, since the sensor element and the mounting portion are connected by wire bonding, the manufacturing process can be simplified.

  In the above configuration, the sealing member includes a first insulating resin portion formed to cover at least a connection portion between the wire and the connection electrode, the sensor element, the upper lid, the lower lid, and the first And a second insulating resin portion having a higher elastic modulus than the first insulating resin portion, which is formed so as to cover the first insulating resin portion. According to this structure, the connection part of an external connection electrode and a wire can be protected more effectively.

  The said structure WHEREIN: The said 1st insulating resin part can be set as the structure currently formed so that the said sensor element, the said upper cover, and the said lower cover may be covered. According to this configuration, the first insulating resin portion can be easily formed.

  In the above configuration, when viewed from above, the area of the external connection electrode may be greater than or equal to the area of the through hole in the joint surface between the sensor element and the upper lid. According to this configuration, the connection reliability between the external connection electrode and the wire can be improved.

  In the above-described configuration, the sensor element, the upper lid, and the mounting portion on which the lower lid is mounted, the upper surface of the mounting portion, the sensor element, the upper lid, And a sealing member that seals the lower lid.

  The said structure WHEREIN: The said movable part can be set as the structure containing the gimbal part which vibrates to an up-down direction in order to detect an angular velocity.

  In the above configuration, the sensor element is formed between a lower semiconductor layer, an upper semiconductor layer, the lower semiconductor layer, and the upper semiconductor layer, and insulates the lower semiconductor layer from the upper semiconductor layer. And an insulating layer.

  In the above configuration, the sensor element is formed on a joint surface with the upper lid on the upper surface of the sensor element, and a second insulating layer that insulates the sensor element and the upper lid, and the lower surface of the sensor element, It can be set as the structure which is formed in a joint surface with a lower cover, and has the 3rd insulating layer which insulates the said sensor element and the said lower cover.

  The said structure WHEREIN: The perpendicular | vertical cross-sectional shape of the said 1st movable area | region and the said 2nd movable area | region can be set as the structure which is either a rectangle, trapezoid, or a semi-elliptical shape.

  The present invention includes a step of joining an upper lid in which a concave first movable region is formed in a region corresponding to an operation range of the movable part so as to cover an upper surface of the sensor element having the movable part, and a lower surface of the sensor element. And a step of joining a lower lid in which a concave second movable region is formed in a region corresponding to the operating range of the movable portion so as to cover the movable portion, and a method for manufacturing a sensor having a movable portion It is. According to the present invention, the movable portion of the sensor element can be protected by the upper lid having the first movable area and the lower lid having the second movable area. In addition, the manufacturing process can be simplified because it is only necessary to join the upper lid and the lower lid, each of which has a concave movable region formed in advance, to the sensor element.

  In the above-described configuration, the step of joining the upper lid includes joining the upper lid provided with a through hole to the sensor element having the external connection electrode on the upper surface so that the through hole is positioned above the external connection electrode. It can be set as the structure to do. According to this configuration, the sensor element can be electrically connected to the outside through the through hole and the external connection electrode.

  In the above configuration, the step of joining the upper lid includes joining the upper lid to the sensor element having the external connection electrode on the upper surface, and after the step of joining the upper lid, above the external connection electrode in the upper lid, It can be set as the structure which comprises the process of forming the through-hole which penetrates an upper cover. According to this configuration, the through hole can be formed in accordance with the position of the external connection electrode after the upper lid is joined.

  In the above configuration, after the step of joining the upper lid and the step of joining the lower lid, the step of mounting the sensor element, the upper lid, and the lower lid on the upper surface of the mounting portion with the lower lid on the lower side. A step of connecting the external connection electrode and the mounting portion with a wire passing through the inside of the through hole, and a first insulating resin portion so as to cover at least the connection portion between the wire and the connection electrode And forming a second insulating resin portion having a higher elastic modulus than the first insulating resin portion so as to cover the sensor element, the upper lid, the lower lid, the wire, and the first insulating resin. And a forming step. According to this configuration, the sensor element can be more effectively protected by the insulating resin. Further, since the sensor element and the mounting portion are connected by wire bonding, the manufacturing process can be simplified. Moreover, the connection part of an external connection electrode and a wire can be protected more effectively.

  In the above configuration, in the step of forming the first insulating resin portion, the gel-like first insulating resin is supplied to the central portion of the upper lid, and the central portion and the through hole are connected to the upper surface of the upper lid. It can be set as the structure including the process of supplying the said 1st insulating resin inside the said through-hole along the groove | channel formed in the direction. According to this configuration, the process of forming the first insulating resin can be simplified.

  According to the present invention, the movable portion of the sensor element can be protected by the upper lid having the first movable area and the lower lid having the second movable area. In addition, the manufacturing process can be simplified because it is only necessary to join the upper lid and the lower lid, each of which has a concave movable region formed in advance, to the sensor element.

  Embodiments according to the present invention will be described below with reference to the drawings.

  Initially, the manufacturing method of the sensor which concerns on Example 1 is demonstrated. FIG. 3A to FIG. 3D are schematic cross-sectional views illustrating the manufacturing process of the sensor 100 according to the first embodiment.

  FIG. 3A is a diagram showing a configuration of the sensor element 10 having a movable part. The sensor element 10 is formed between a lower semiconductor layer 12 that is a support layer, an upper semiconductor layer 14 that is formed above the lower semiconductor layer 12, and the lower semiconductor layer 12 and the upper semiconductor layer 14. And a first insulating layer 16 that insulates the upper semiconductor layer 14 from each other. The lower semiconductor layer 12 and the upper semiconductor layer 14 are made of, for example, silicon, and the sensor element 10 is a so-called SOI (Silicon On Insulator) type sensor element configured by stacking, for example, silicon and an insulator. The central portion of the sensor element is a region for forming the movable portion 18 in a process described later. As shown in FIGS. 5 and 6 to be described later, the sensor 100 according to the first embodiment originally includes two independent movable parts (a driving gimbal part 62 and a detection gimbal part 64) that vibrate in the vertical direction. However, in FIGS. 3A to 3D, the detailed configuration is omitted and the movable portion 18 is illustrated. Referring to FIG. 3A, drive electrodes, detection electrodes, wirings, and the like (shown in FIG. 6 described later) are formed in the upper semiconductor layer 14. Further, an external connection electrode 11 is formed on the upper surface of the upper semiconductor layer 14 for electrical connection with the outside. The external connection electrode 11 is formed as a pad-like electrode on the peripheral edge of the upper semiconductor layer 14, for example.

  With reference to FIG. 3B, an upper lid 20 made of, for example, a glass substrate is bonded to the sensor element 10 so as to cover the upper surface of the sensor element 10. A concave first movable region 22 is formed on the lower surface of the upper lid 20 in a region corresponding to the operating range of the movable portion 18 of the sensor element 10. The first movable region 22 is a region necessary for the movable unit 18 to operate. For example, as will be described later, when the sensor is an angular velocity sensor having a gimbal portion that vibrates in the vertical direction, a space is required so that the gimbal portion that is the movable portion 18 does not contact the upper lid 20. That is, the first movable region 22 is formed larger than the movable range of the movable portion 18. Further, the outer region 25 between the peripheral edge portion and the through hole 24 on the upper surface of the upper lid 20 is formed lower than the inner region 27 between the center portion and the through hole 24 (T1 <T2).

  A through hole 24 is formed in the upper lid 20 at a position corresponding to the external connection electrode 11. With reference to FIG. 3B, the upper lid 20 is joined to the sensor element 10 so that the through hole 24 is positioned above the external connection electrode 11.

  The bonding of the upper lid 20 to the sensor element 10 can be performed by, for example, room temperature bonding, anodic bonding, or direct bonding. It is also possible to perform bonding by supplying a metal to the bonding portion and performing eutectic bonding between silicon and metal. Further, the second insulating layer 17 (see FIG. 3C) is formed on the joint surface with the upper lid 20 of the sensor element 10. The sensor element 10 and the upper lid 20 are electrically insulated by the second insulating layer 17. The second insulating layer 17 is formed by changing the surface of the upper semiconductor layer 14 made of, for example, silicon to silicon oxide by being heated at the time of bonding. According to this method, the second insulating layer 17 can be formed simultaneously with the bonding of the upper lid 20.

  Referring to FIG. 3C, the lower semiconductor layer 12 and the first insulating layer 16 (region 34 in the drawing) are etched. Thereby, the movable part 18 (refer FIG.3 (d)) which consists of the lower semiconductor layer 12a, the upper semiconductor layer 14a, and the 1st insulating layer 16a in the center part of the sensor element 10 is formed. In FIG. 3C, the sensor element 10 is fixed upside down for processing. Further, the second insulating layer 17 formed by the bonding process is formed on the upper surface of the sensor element 10.

  Referring to FIG. 3D, a lower lid 30 made of, for example, a glass substrate is bonded to the sensor element 10 so as to cover the lower surface of the sensor element 10. On the upper surface of the lower lid 30, a concave second movable region 32 is formed in a region corresponding to the operation range of the movable portion 18. The second movable region 32 is a region necessary for the movable portion 18 to operate, and is formed larger than the movable range of the movable portion 18, similar to the first movable region 22.

  The bonding of the lower lid 30 to the sensor element 10 can be performed by, for example, room temperature bonding, anodic bonding, or direct bonding. It is also possible to perform bonding by supplying a metal to the bonding portion and performing eutectic bonding between silicon and metal. Further, the third insulating layer 19 (see FIG. 4A) is formed on the joint surface between the sensor element 10 and the lower lid 30 in the same manner as when the upper lid 20 is joined. The sensor element 10 and the lower lid 30 are electrically insulated by the third insulating layer 19. The sensor according to Example 1 is completed through the above steps.

  FIG. 4A is a schematic cross-sectional view illustrating the configuration of the sensor 100 according to the first embodiment. The sensor element 10 in the sensor 100 is an SOI type sensor element including a lower semiconductor layer 12, an upper semiconductor layer 14, and a first insulating layer 16. The sensor element 10 has a movable part 18 at the center. An upper lid having a concave first movable region 22 is joined to the upper surface of the sensor element 10. A lower lid having a concave second movable region 32 is joined to the lower surface of the sensor element 10. Both the first movable region 22 and the second movable region 32 are formed in regions corresponding to the operation range of the movable portion 18 of the sensor element 10, and the movable portion 18 operates without contacting the upper lid 20 and the lower lid 30. It is possible.

  An external connection electrode 11 is provided on the upper surface of the sensor element 10, and a through hole 24 is provided in the upper lid 20 at a position corresponding to the external connection electrode 11. The sensor element 10 can be electrically connected to the outside by the external connection electrode 11 and the through hole 24. Further, the outer region 25 between the peripheral edge portion and the through hole 24 on the upper surface of the upper lid 20 is formed lower than the inner region 27 between the center portion and the through hole 24 (T1 <T2). Here, the thickness (T3) of the sensor element 10 can be set to, for example, 300 μm, and the thicknesses (T2 and T4) of the upper lid 20 and the lower lid 30 can be set to 200 μm to 300 μm. Further, the thickness (T1) of the outer region 25 of the upper lid 20 can be set to 20 to 70 μm, which makes it possible to easily perform wire bonding.

  FIG. 4B is a top view of the through hole 24 and the external connection electrode 11 in FIG. The external connection electrode 11 passes through the upper lid 20 and is indicated by a broken line. As shown in the drawing, the area of the external connection electrode 11 is larger than the area of the through hole 24 in the bonding surface.

  FIGS. 5A and 5B are perspective views illustrating a specific configuration of the sensor 100 according to the first embodiment. FIG. 5A shows a configuration before joining, and FIG. 5B shows a configuration after joining. Members common to FIGS. 3A and 3B are denoted by the same reference numerals, and detailed description thereof is omitted. The sensor element 10 is an angular velocity sensor provided with a drive gimbal part 62 and a detection gimbal part 64 (detailed in FIG. 6) as the movable part 18 at the center part, and a plurality of external connection electrodes 11 are provided at the peripheral part. It has been. The central portion 27 of the upper lid 20 is formed higher than the peripheral edge portion 25. The opposite side of the central portion 27 is processed into a concave shape by etching to form a first movable region 22 shown in FIG. A through hole 24 is provided on the upper surface of the upper lid 20 at a position corresponding to the external connection electrode 11.

  FIG. 6 is a top view showing the configuration of the sensor element 10. However, the wiring pattern provided on the upper surface of the sensor element 10 is omitted. Each of the sensor elements 10 has a square frame portion 60, a drive gimbal portion 62, and a detection gimbal portion 64 (also corresponding to the movable portion 18 in FIG. 4A). The detection gimbal part 64 is mechanically connected to the drive gimbal part 62 by a first torsion bar 66 provided on a pair of opposing side surfaces. Moreover, the detection gimbal part 64 has a pair of first comb-tooth electrodes 68 provided on another pair of opposing side surfaces. One of the pair of first comb electrodes 68 is fixed to the detection gimbal portion 64 and the other is fixed to the drive gimbal portion 62.

  The drive gimbal part 62 is mechanically connected to the frame part 60 by a second torsion bar 70 provided on a pair of opposing side surfaces. In addition, the drive gimbal portion 62 has a pair of second comb electrodes 72 provided on another pair of opposing side surfaces. One of the pair of second comb electrodes 72 is fixed to the drive gimbal portion 62 and the other is fixed to the frame portion 60. The frame portion 60 is provided with a plurality of external connection electrodes 11.

  With reference to FIG. 6, the direction connecting the first torsion bars 66 is defined as the Y axis, and the direction connecting the second torsion bars 70 is defined as the X axis. Although not shown, a direction perpendicular to the Y axis and the X axis, that is, a direction perpendicular to the upper surface of the sensor element 10 is defined as a Z axis. Using the second comb electrode 72, the drive gimbal part 62 is vibrated around the X axis together with the detection gimbal part 64. In this state, when a rotational angular velocity is applied around the Z axis that is the detection axis, a Coriolis force is generated in a direction perpendicular to the X axis. For this reason, the drive gimbal portion 62 tries to vibrate around the Y axis orthogonal to the X axis, but the drive gimbal portion is fixed to the frame portion 60 by the second torsion bar 70, and therefore vibrates around the Y axis. Can not do it. For this reason, the detection gimbal part 64 vibrates around the Y axis, and the first comb electrode 68 detects the magnitude of the vibration of the detection gimbal part 64. As described above, the angular velocity around the detection axis (Z axis) can be detected based on the magnitude of vibration of the detection gimbal portion 64.

  Referring to FIG. 7, at the time of detecting the angular velocity, the movable portion 18 (the drive gimbal portion 62 and the detection gimbal portion 64 in FIG. 6) vibrates in the vertical direction (the direction of vibration about the X axis and the Y axis in FIG. 6). For this reason, the 1st movable area | region 22 and the 2nd movable area | region 32 for not contacting the upper cover 20 and the lower cover 30 are needed.

  According to the sensor 100 according to the first embodiment, the upper surface and the lower surface of the sensor element 10 are covered with the upper lid 20 and the lower lid 30. Thereby, adhesion of a foreign substance to the movable part 18 and damage to the movable part 18 due to an external force can be suppressed, and the movable part 18 of the sensor element 10 can be protected.

  Further, in the conventional sensor element shown in FIGS. 1 and 2, the movable region is formed by processing a part of the sensor element to be sealed in order to ensure the operation range of the movable part. It was. On the other hand, in the first embodiment, the first movable region 22 and the second movable region 32 are formed in advance on the upper lid 20 and the lower lid 30 on the side where the sensor element 10 is sealed. For this reason, it is not necessary to process the sensor element in order to provide the movable region as in the prior art. Forming the concave movable regions in the upper lid 20 and the lower lid 30 can be performed by etching or the like that has been conventionally known, so that machining is easier than in the case of machining the sensor element side. From the above, the sensor 100 according to the first embodiment can effectively protect the movable portion 18 of the sensor element 10 and can simplify the manufacturing process as compared with the conventional example.

The shapes of the first movable region 22 and the second movable region 32 differ depending on the formation method. FIGS. 8A to 8C are vertical sectional views of the upper lid 20 and the lower lid 30 and show the shapes of the first movable region 22 and the second movable region 32. Referring to FIG. 8A, when the movable region is formed by dry DRIE (Deep-trench Reactive-Ion Etching), the cross-sectional shape is rectangular. Referring to FIG. 8B, when the movable region is formed by wet anisotropic etching using, for example, KOH or TMAH (tetramethylammonium hydroxide aqueous solution), the cross-sectional shape becomes a trapezoid. Referring to FIG. 8C, for example, when wet isotropic etching is performed using a mixed solution of HF, HNO ₃ , and CH ₃ COOH (or H ₂ O), the cross-sectional shape is a semi-elliptical shape. It becomes a shape. As described above, the first movable region 22 and the second movable region 32 having arbitrary shapes can be formed by appropriately selecting an etching method.

  In addition, when the movable region 22 is formed in the upper lid 20 with reference to FIG. 4A, the thickness (T2) of the upper lid 20 in the vicinity of the movable region 22 is necessarily increased. Here, when the outer region 25 of the upper lid 20 is formed to have the same thickness as that of the inner region 27 (see FIG. 9), the contact with the external connection electrode 11 requires a long through hole in the vertical direction. However, since it takes a long time, it is difficult to shorten the manufacturing process. As shown in FIG. 4A, the upper lid 20 is formed such that the outer region 25 is lower than the inner region 27 (T1 <T2), so that the vertical length of the through hole 24 can be reduced. In addition, the external connection electrode 11 can be connected to the outside through a wire through the through hole 24, and the manufacturing process can be greatly shortened as compared with the case where the through electrode is formed. Note that the entire inner region 27 does not have to be formed lower than the outer region 25. It is sufficient for the outer region 25 that a wire forming region (for example, a straight region connecting the through hole 24 and the outer periphery of the upper lid 20) is formed lower than other portions when wire bonding is performed.

  FIG. 9 shows a case where the upper lid 20 is formed so that the outer region 25 and the inner region 27 have the same height. According to this configuration, it is possible to omit the step of processing the outer region to be low by etching or the like. However, the embodiment shown in FIG. 4A is preferable in order to facilitate electrical connection with the outside.

  Further, as shown in FIG. 4B, the external connection electrode 11 is preferably larger than the through hole 24. That is, when viewed from above, the area of the external connection electrode 11 is preferably equal to or larger than the area of the through hole 24 in the joint surface between the sensor element 10 and the upper lid 20. Thereby, when performing wire bonding to the external connection electrode 11 in a process described later, the external connection electrode 11 can be reliably connected to the wire.

  In the first embodiment, the upper lid 20 in which the through hole 24 is formed in advance is joined to the sensor element 10, but the through hole 24 may be formed after the upper lid 20 is joined. 10A and 10B are schematic cross-sectional views illustrating a method for manufacturing a sensor according to a modification of the first embodiment. With reference to FIG. 10A, the upper lid 20 a having no through hole is joined to the upper surface of the sensor element 10. The sensor element 10 is the same as that of the first embodiment (FIG. 3A). With reference to FIG. 10B, a through hole 24 a penetrating the upper lid 20 is formed above the external connection electrode 11 formed on the upper surface of the sensor element 10. The through holes 24a can be formed by dry DRIE or wet anisotropic etching. The area of the through hole 24a is preferably smaller than that of the external connection electrode 11 as in the first embodiment. The subsequent steps are the same as those in FIG. According to this method, the through hole 24a can be formed in accordance with the position and size of the external connection electrode 11 after the upper lid 20a is joined.

  In the first embodiment and the above-described modification, the through-hole 24 is provided in the upper lid 20. However, when the sensor element 10 is configured to be electrically connected to the outside by another method, it is not necessary to provide the through-hole 24. .

  When a multi-sided semiconductor substrate is used, a plurality of sensors 100 according to the first embodiment can be manufactured at a time. FIG. 11A and FIG. 11B are schematic cross-sectional views illustrating a method for manufacturing a sensor according to another modification of the first embodiment. Referring to FIG. 11A, a multi-chamfered SOI wafer 50 including a lower semiconductor layer 12, an upper semiconductor layer 14, and a first insulating layer 16 is divided into a plurality of regions 52a to 52d to be sensor elements 10 later. Has been. Each of the regions 52a to 52d is subjected to the same processing as in the first embodiment, and movable parts 18a to 18d are formed. On the upper surface of the SOI wafer 50, an upper lid 20 provided with a plurality of first movable regions 22a to 22d is joined to a region corresponding to each operation range of the plurality of movable portions 18a to 18d. On the lower surface of the SOI wafer 50, a lower lid 30 provided with a plurality of second movable regions 32a to 32d is joined to a region corresponding to each operation range of the plurality of movable portions 18a to 18d. FIG. 12 is a perspective view showing a part of the state in which the upper lid 20 and the lower lid 30 are joined to the multi-faceted SOI wafer 50, and corresponds to FIG. The dicing line 54 is indicated by a broken line.

  In the upper lid 20, a plurality of through holes 24 are formed at positions corresponding to the plurality of external connection electrodes 11 formed on the SOI wafer 50. In the periphery of the through hole 24 on the upper surface of the upper lid 20, a region 56 between the through hole 24 and the dicing line 54 is formed lower than the region 58 above the movable unit 18. Referring to FIGS. 11A and 12, the upper lid 20, the SOI wafer 50, and the lower lid 30 are cut along the dicing line 54. The cutting can be performed using, for example, a water jet or a diamond dicing blade.

  Referring to FIG. 11B, each of the SOI wafer 50, the upper lid 20, and the lower lid 30 cut along the dicing line 54 in FIG. 11A is the same as that shown in FIG. 4A. It becomes a plurality of sensors 100a-100d of structure. Through the above steps, a plurality of sensors can be manufactured at a time using a multi-sided semiconductor substrate. Thereby, the manufacturing time per sensor can be shortened.

  In the first embodiment, an angular velocity sensor having a gimbal portion that vibrates in the vertical direction has been described as an example of the sensor element 10. However, the sensor element 10 may have other forms as long as it has a movable portion 18. . For example, as another example, a tuning fork type vibration sensor or a sensor element using a piezoelectric element for the detection unit can be used. Further, the sensor element 10 may employ a configuration other than the SOI type.

  Example 2 is an example in which the sensor according to Example 1 (see FIG. 9) is further molded and packaged. 13A to 13D are schematic cross-sectional views illustrating a method for manufacturing the sensor according to the second embodiment. About the member common to FIG. 9 of Example 1, the code | symbol and description are abbreviate | omitted.

  Referring to FIG. 13A, the sensor 100 (illustrated in FIG. 4) according to the first embodiment is placed through the adhesive 41 in the cavity 49 of the package 40 which is the mounting portion with the lower lid 30 on the lower side. Implement. The package 40 is provided with a lead frame 42 for guiding an electrical signal to the outside.

  Referring to FIG. 13B, the connection electrode 11 provided on the upper surface of the sensor element 10 and the lead frame 42 are connected by wire bonding. The wire 44 is made of, for example, gold or aluminum, and is drawn out of the sensor 100 through the inside of the through hole 24 formed in the upper lid 20. At this time, since the outer region 25 of the upper lid 20 is formed low, wire bonding can be performed without bringing the wire 44 into contact with the upper lid 20. Moreover, since the area of the external connection electrode 11 is formed larger than the cross-sectional area of the through hole 24 as described in the first embodiment, the wire 44 and the external connection electrode 11 can be reliably bonded. For wire bonding, for example, a thermocompression bonding method, an ultrasonic thermocompression bonding method, or the like can be used.

  Referring to FIG. 13C, the first insulating resin portion 46 is formed by supplying and curing the first insulating resin 46 in and around the through hole 24. The first insulating resin portion 46 is formed so as to cover at least the connection portion between the wire 44 and the external connection electrode 11 in order to protect the connection portion between the wire 44 and the external connection electrode 11. The first insulating resin 46 is preferably a resin having a low elastic modulus. Thereby, it can suppress that the wire 44 and the external connection electrode 11 will separate by the stress added at the time of resin hardening. The first insulating resin 46 is preferably made of a material having high fluidity before curing. Thereby, the inside of the through hole 24 can be easily filled. For the first insulating resin 46, for example, a gel-like silicon-based resin having an elastic modulus at curing of 10 MPa or less and normal temperature can be used.

  The first insulating resin 46 may be supplied individually by dropping the resin from the upper part to the plurality of through-holes 24, but the first insulating resin 46 is supplied using the upper lid 20 b having a shape as shown in FIG. 14. Also good. Referring to FIG. 14, a groove 26 is formed on the upper surface of the upper lid 20 b in a direction connecting the central portion 28 and the through hole 24. The first insulating resin 46 having fluidity (for example, gel-like at normal temperature) is supplied to the resin supply recess provided in the central portion 28. The first insulating resin 46 supplied to the central portion 28 flows in the direction of the through hole 24 through the groove 26 and is supplied to the inside and the periphery of the through hole 24. According to this method, compared with the case where the first insulating resin 46 is individually supplied to each of the plurality of through holes 24, the number of times of resin supply can be reduced, so that the manufacturing process can be simplified. In FIG. 14, the groove 26 is formed in the direction connecting the central portion of the upper lid 20b and the through hole 24, but the configuration of the groove 26 is not limited to this. That is, a recess for supplying resin may be provided in addition to the central portion of the upper lid 20 b, and the grooves 26 may be formed toward the plurality of through holes 24. Referring to FIG. 14, the depth t1 of the groove is preferably 50% or less of the thickness t2 of the upper lid 20b.

  With reference to FIG. 13D, the second insulating resin portion 48 is formed so as to cover the sensor element 10, the upper lid 20, the lower lid 30, the wire 44, and the first insulating resin 46. The second insulating resin 48 is made of a material having a higher elastic modulus than the first insulating resin 46. For example, a thermosetting epoxy resin containing a filler having an elastic modulus of 120 MPa or more can be used. Through the above steps, molding of the sensor 100 is completed, and the sensor 102 according to the second embodiment is completed.

  The configuration of the sensor 102 will be described with reference to FIG. A sensor 100 including a sensor element 10, an upper lid 20, and a lower lid 30 is mounted on a package 40, which is a mounting portion, with the lower lid 30 on the lower side. The external connection electrode 11 provided in the sensor element 10 and the lead frame 42 of the package 40 are connected by a wire 44 that passes through the inside of the through hole 24 provided in the upper lid 20. A sealing member for sealing the sensor element 10, the upper lid 20, the lower lid 30, and the wire 44 is provided on the upper surface of the package 40. Here, the sealing member includes a first insulating resin portion 46 formed so as to cover the connection portion between the wire 44 and the external connection electrode 11, the sensor element 10, the upper lid 20, the lower lid 30, the wire 44, and the first And a second insulating resin portion 48 formed so as to cover the first insulating resin 46.

  According to the sensor 102 according to the second embodiment, the sensor 100 according to the first embodiment is mounted on the package 40 and sealed with the first insulating resin 46 and the second insulating resin 48. Thereby, the sensor 100 can be more effectively protected from an external impact or the like.

  The sensor element 10 and the package 40 are electrically connected by a wire 44 that passes through the through hole 24. As another method for electrically connecting the sensor element 10 to the outside, for example, there is a method of plating the inside of the through hole 24 to provide a through electrode, but wire bonding takes less time than the formation of the through electrode. Since it can be performed, the manufacturing process can be shortened.

  The sealing member that seals the sensor 100 includes a low-elasticity first insulating resin portion 46 and a high-elasticity second insulating resin portion 48. As described above, first, the bonding portion between the wire 44 and the external connection electrode 11 is covered with the low-elasticity first insulating resin portion 46, and the bonding portion between the wire 44 and the external connection electrode 11 is protected, and then the outside is covered. By covering with the highly elastic second insulating resin portion 48, the separation between the wire 44 and the external connection electrode 11 can be suppressed, and the connection reliability can be improved.

  In Example 2, the first insulating resin portion 46 was formed only around the through-hole 24 as shown in FIG. 13C. However, referring to FIG. You may form so that the sensor element 10, the upper cover 20, and the lower cover 30 may be covered. Thereafter, referring to FIG. 15B, the second insulating resin 48 may be formed so as to cover the first insulating resin 46. According to this method, as in the case of FIGS. 13C and 13D, the sensor 100 can be molded while protecting the joint portion between the wire 44 and the external connection electrode 11. Further, the manufacturing process can be simplified as compared with the case where the first insulating resin portion 46 is individually formed around the through hole 24.

  In the second embodiment, the example in which the sensor element 10 is electrically connected to the outside by the wire 44 has been described. However, the method of electrically connecting the sensor element 10 and the outside is not limited thereto. For example, the through electrode may be formed inside the through hole 24 by plating. Further, electrical connection to the outside may be performed without providing the through hole 24 and the wire 44.

  In Example 2, two types of insulating resins (the first insulating resin 46 and the second insulating resin 48) were used to mold the sensor 100. However, even if only one type of resin is used for molding. Good. Moreover, you may mold using insulating members other than resin.

  The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to such specific embodiments, and various modifications can be made within the scope of the gist of the present invention described in the claims.・ Change is possible.

FIG. 1 is a cross-sectional view showing a configuration of a sensor according to a conventional example. FIG. 2 is a cross-sectional view showing a configuration of a sensor according to another conventional example. FIG. 3A to FIG. 3D are schematic cross-sectional views illustrating the manufacturing process of the sensor according to the first embodiment. FIG. 4A is a schematic cross-sectional view illustrating the configuration of the sensor according to the first embodiment, and FIG. 4B is a top view in which a part of FIG. 4A is enlarged. FIG. 5A is a perspective view illustrating a configuration before bonding of the sensor according to the first embodiment, and FIG. 5B is a perspective view illustrating a configuration after bonding of the sensor according to the first embodiment. FIG. 6 is a top view illustrating the configuration of the movable portion of the sensor according to the first embodiment. FIG. 7 is a schematic cross-sectional view illustrating the operation of the sensor according to the first embodiment. 8A to 8C are vertical sectional views of the upper and lower lids of the sensor according to the first embodiment. FIG. 9 is a schematic cross-sectional view illustrating a configuration of a sensor according to a modification of the first embodiment. FIGS. 10A and 10B are schematic cross-sectional views illustrating a manufacturing process of a sensor according to another modification of the first embodiment. FIGS. 11A and 11B are schematic cross-sectional views illustrating a manufacturing process of a sensor according to another modification of the first embodiment. FIG. 12 is a perspective view illustrating a manufacturing process of a sensor according to another modification of the first embodiment. 13A to 13D are schematic cross-sectional views illustrating the manufacturing process of the sensor according to the second embodiment. FIG. 14 is a perspective view illustrating a configuration of an upper lid of a sensor according to a modification of the second embodiment. FIGS. 15A and 15B are schematic cross-sectional views illustrating a manufacturing process of a sensor according to another modification of the second embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sensor element 11 External connection electrode 12 Lower semiconductor layer 14 Upper semiconductor layer 16 1st insulating layer 17 2nd insulating layer 19 3rd insulating layer 20 Upper lid 22 1st movable area 24 Through-hole 26 Groove 30 Lower lid 32 2nd movable area 40 package 41 adhesive 42 lead frame 44 wire 46 first insulating resin 48 second insulating resin 50 SOI wafer 60 frame portion 62 driving gimbal portion 64 detection gimbal portion 66 first torsion bar 68 first comb tooth electrode 70 first Torsion bar 72 Second comb electrode 100 Sensor 102 Sensor (after mold package)

Claims (18)

A sensor element having a movable part;
An upper lid which is joined so as to cover the upper surface of the sensor element and in which a concave first movable region is formed in a region corresponding to the operation range of the movable part;
A lower lid which is joined so as to cover the lower surface of the sensor element, and a concave second movable region is formed in a region corresponding to the operation range of the movable part;
A sensor having a movable part. The sensor element has an external connection electrode on the upper surface,
The sensor having a movable part according to claim 1, wherein the upper lid has a through hole formed through the upper lid above the external connection electrode.   The upper lid is formed such that a region between a peripheral edge portion on the upper surface and the through hole is formed lower than a region between a central portion on the upper surface and the through hole. A sensor having a movable part.   The sensor having a movable part according to claim 2, wherein the upper lid has a groove formed on a top surface thereof in a direction connecting the central portion of the upper lid and the through hole. With the lower lid on the lower side, the sensor element, the upper lid, and a mounting portion on which the lower lid is mounted,
A wire that passes through the inside of the through hole and connects the external connection electrode and the mounting portion;
A sealing member that is formed on an upper surface of the mounting portion and seals the sensor element, the upper lid, the lower lid, and the wire;
5. The sensor having a movable part according to claim 2, wherein the sensor has a movable part. The sealing member is
A first insulating resin portion formed so as to cover at least a connection portion between the wire and the connection electrode;
A second insulating resin portion having a higher elastic modulus than the first insulating resin portion, formed to cover the sensor element, the upper lid, the lower lid, and the first insulating resin portion;
The sensor which has a movable part of Claim 5 characterized by the above-mentioned.   The sensor having a movable part according to claim 6, wherein the first insulating resin part is formed so as to cover the sensor element, the upper lid, and the lower lid.   The area of the external connection electrode when viewed from above is equal to or greater than the area of the through hole in the joint surface between the sensor element and the upper lid. The sensor which has a movable part as described in 4. With the lower lid on the lower side, the sensor element, the upper lid, and a mounting portion on which the lower lid is mounted,
A sealing member that is formed on an upper surface of the mounting portion and seals the sensor element, the upper lid, and the lower lid;
The sensor which has a movable part of any one of Claim 1 to 4 characterized by the above-mentioned.   The sensor having a movable part according to any one of claims 1 to 9, wherein the movable part includes a gimbal part that vibrates in the vertical direction in order to detect an angular velocity. The sensor element is
A lower semiconductor layer;
An upper semiconductor layer;
A first insulating layer formed between the lower semiconductor layer and the upper semiconductor layer and insulating the lower semiconductor layer and the upper semiconductor layer;
The sensor having a movable part according to claim 1, wherein the sensor has a movable part. The sensor element is
A second insulating layer that is formed on the upper surface of the sensor element at a joint surface with the upper lid and insulates the sensor element from the upper lid;
A third insulating layer formed on a joint surface of the lower surface of the sensor element with the lower lid and insulating the sensor element and the lower lid;
The sensor having a movable part according to claim 1, wherein the sensor has a movable part.   13. The sensor according to claim 1, wherein a vertical cross-sectional shape of the first movable region and the second movable region is any one of a rectangle, a trapezoid, and a semi-elliptical shape. . Bonding a top lid formed with a concave first movable region in a region corresponding to the operating range of the movable unit so as to cover the upper surface of the sensor element having the movable unit;
Joining a lower lid formed with a concave second movable region in a region corresponding to the operating range of the movable part so as to cover the lower surface of the sensor element;
A method for manufacturing a sensor having a movable part.   The step of joining the upper lid includes joining the upper lid provided with a through hole to the sensor element having the external connection electrode on the upper surface so that the through hole is located above the external connection electrode. The manufacturing method of the sensor which has a movable part of Claim 14. The step of bonding the upper lid includes bonding the upper lid to the sensor element having an external connection electrode on the upper surface,
15. The sensor having a movable part according to claim 14, further comprising a step of forming a through-hole penetrating the upper lid above the external connection electrode in the upper lid after the step of joining the upper lid. Manufacturing method. After the step of joining the upper lid and the step of joining the lower lid, the step of mounting the sensor element, the upper lid, and the lower lid on the upper surface of the mounting portion with the lower lid on the lower side,
Connecting the external connection electrode and the mounting portion with a wire passing through the inside of the through hole;
Forming a first insulating resin portion so as to cover at least the connection portion between the wire and the connection electrode;
Forming a second insulating resin portion having a higher elastic modulus than the first insulating resin portion so as to cover the sensor element, the upper lid, the lower lid, the wire, and the first insulating resin;
The method for manufacturing a sensor having a movable part according to claim 14, wherein the sensor has a movable part.   The step of forming the first insulating resin portion is formed in a direction in which the gel-like first insulating resin is supplied to the center portion of the upper lid and the center portion and the through hole are connected on the upper surface of the upper lid. The method of manufacturing a sensor having a movable part according to claim 17, further comprising a step of supplying the first insulating resin into the through hole along the groove.

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