JP2012164947A - Lamination type heat sink and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small lamination type heat sink capable of easily being produced and attached to a motor and the like, and a method for manufacturing the same.SOLUTION: In a heat sink, a plurality of flow path plates having through holes serving as coolant passages are stacked, sealing plates serving as sealing surfaces of the passages are arranged on both sides, and inlet/outlet ports for coolant are provided on the sealing plates or the flow path plates. On each of the flow path plates, the through holes are arranged in positions of rotational symmetry, and a part of the through holes is arranged so as to overlap with the through hole of the adjacent flow path plate by rotating predetermined number of flow path plates by a symmetric rotation angle.

Description

  The present invention relates to a heat sink used for a cooling device such as a computer CPU periphery, various laser devices, LED devices, various motors, solenoids, and the like, and a method of manufacturing the same.

  In electrical and electronic equipment such as a computer CPU, various laser devices, and various motors, cooling is indispensable because heat generation reduces the performance of the equipment. Cooling methods include cooling the metal material by providing fins etc. to increase the surface area, cooling by forcibly blowing air with a fan, etc., cooling the heat by circulating the refrigerant Various methods are known, such as a method of cooling using a Peltier element.

  For example, Patent Document 1 discloses a process of punching an aluminum brazing sheet to produce a flow path plate in which a part of the refrigerant flow path and a part of the refrigerant inlet / outlet are formed. Forming a refrigerant flow path and the refrigerant inlet / outlet; inserting and fitting a pipe joint into the refrigerant inlet / outlet; and brazing the plurality of laminated flow path plates and the pipe joint together. A heat sink manufacturing method is disclosed.

  In the method of the above document, an aluminum brazing sheet having a brazing material clad on the side to be joined is punched by a turret punch press to create a refrigerant flow path and a refrigerant inlet / outlet, and a plurality of the flow path plates are laminated. Then, the upper plate and the lower plate to be the lid are stacked. In this state, the pipe joint is inserted and the temperature is raised and brazing is performed. Therefore, it is necessary to perform a process of inserting the pipe joint while maintaining the positions of the plurality of flow path plates before joining, and there is a problem that the position of the flow path plates is likely to be shifted. In addition, means for holding the flow path plate, the upper plate, and the lower plate together is also required. Furthermore, since the refrigerant inlet / outlet port is located on the side surface of the flow path plate, the pipe joint connection processing cannot be performed unless the heat sink is laminated and assembled.

  Although it is easily conceivable to manufacture the thin flow path plate as described above by a casting mold, there is a problem that the material is likely to be distorted during shrinkage due to cooling after casting.

In addition, it is possible to manufacture the thin flow path plate as described above by a cutting method, but there is a problem that if the flow path becomes longer, processing takes time and costs increase.

JP 11-87584 A

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a small stacked heat sink that can be easily manufactured and easily attached to a motor, a solenoid, and the like, and a method for manufacturing the same.

  In order to solve the above-described problems, the heat sink according to the present invention includes a plurality of flow path plates having through holes that serve as refrigerant flow paths, and sealing plates that serve as sealing surfaces of the flow paths are disposed on both sides. In the heat sink in which the stop plate or the flow path plate is provided with the refrigerant inlet / outlet, each of the flow path plates has the through hole formed in a rotationally symmetric position, and is laminated by rotating a predetermined number of times by a symmetric rotational angle. Thus, a part of the through hole is arranged so as to overlap with a through hole of an adjacent flow path plate.

  A plurality of through holes are formed in the flow path plate, the length of each of the through holes is formed longer than the rotational symmetry angle, and the distance between the through holes is separated from the rotational symmetry angle. It is desirable.

  Further, each of the flow path plate and the sealing plate is formed with a plurality of embossed portions having a concave portion on one side and a convex portion on the opposite side, and each of the sealing plate and the plurality of flow path plates Are preferably fitted and connected at these embossed portions.

  Further, a low melting point metal layer is provided on a contact surface between each sealing plate and each flow path plate, and each sealing plate and each flow path plate are joined by melting of the low melting point metal layer. It is desirable. Further, it is particularly preferable that the material of each sealing plate and each flow path plate is copper, and the low melting point metal layer is silver or an alloy thereof.

  Moreover, it is also preferable that the center part of each said sealing plate and each said flow-path board is formed hollow.

  In the method of manufacturing a heat sink according to the present invention, a step of forming a set of sealing plates serving as a sealing surface of a refrigerant flow path including an outer shape and a plurality of embossed portions, a through hole serving as a refrigerant flow path, and one side Forming a flow path plate having a predetermined shape including an embossed portion having a concave surface and a convex surface on the opposite side; and the flow path on at least one surface of the flow path plate and / or the sealing plate A step of forming a low melting point metal layer having a melting point lower than that of the plate and the sealing plate, a step of rotating a predetermined number of the flow path plates by a predetermined angle, and a step of fitting the embossed portions to each other. It comprises a step of joining a pair of sealing plates and the plurality of flow path plates, and a step of thermally melting the low melting point metal layer and joining the sealing plate and the metal thin plate. And

  According to the present invention, by forming the through holes of the flow path plate in a rotationally symmetrical manner, a predetermined number of flow path plates can be rotated and rotated at a rotationally symmetrical angle so that a continuous refrigerant flow path can be easily formed. Further, the cross-sectional area of the flow path can be freely changed by changing the number of laminated flow path plates having the same through-hole arrangement. In addition, embossed parts are provided on each of the sealing plate and the flow path plate, and these embossed parts can be easily and reliably positioned together by laminating and holding them together during lamination. It becomes. Thereby, when joining the sealing plate and each flow path plate, it is only necessary to raise the temperature and melt the low melting point metal layer without the need for pressurization. Therefore, it is possible to provide a laminated heat sink that is easy to manufacture and highly reliable, and a method for manufacturing the same. Moreover, since the embossed part is formed so that one side is a concave part and the opposite side is a convex part, it can be formed by simple press working. Furthermore, since the center portion of the heat sink is formed to be hollow, it can be arranged so as to cover the periphery of the heating element, and therefore, it can be applied to a wide range of uses.

  Hereinafter, preferred embodiments of a heat sink according to the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a flow path plate used in the first embodiment of the heat sink according to the present invention. 2 A of flow-path plates are formed in the square, and the hollow part 3 is provided in the center part. A through hole 5 serving as a flow path is formed in an arc shape in the upper portion of the hollow portion 3. This through hole 5 is formed so as to be 90-degree rotationally symmetric, but in order to ensure a continuous flow path between adjacent flow path plates, the length is set to exceed 90 degrees in angle. Has been.

  Further, a total of 12 embossed portions are provided in the vicinity of the peripheral edge portion and around the hollow portion 3 on the flow path plate 2A. The embossed part is configured such that one side is a concave part and the opposite side is a convex part. Further, attachment holes 7 for fixing the heat sink to the device are provided at the four corners of the flow path plate 2A.

  FIG. 2 is a plan view of the flow path plate 2B, which basically has the same configuration as the flow path plate 2A. However, the arrangement is rotated 90 degrees clockwise, and the flow path portion 5 is disposed at the upper portion of the flow path plate 2A, but is on the right side in the flow path plate 2B.

  FIG. 3 shows a plan view of the sealing plate 1A. The configuration of the sealing plate 1A is substantially the same as that of the flow channel plate 2A, but a circular inflow port 4A is formed in part in order to seal the refrigerant flow channel and secure the entrance / exit. The position of the inlet 4A coincides with the end of the flow path portion 5 of the flow path plate 2A.

  FIG. 4 is a cross-sectional view illustrating a configuration when a flow path plate and a sealing plate, which are elements of the heat sink, are assembled. FIG. 3 is a cross-sectional view taken along plane A-A ′ in FIG. 2. In order from the top, the sealing plate 1A, the flow path plates 2A, 2B, 2C, 2D, and the lowermost portion are the sealing plate 1B. An inlet 4A is formed in the sealing plate 1A and is connected to the flow path portion 5 of the flow path plate 2A. The flow path portion 5 of the flow path plate 2A is arranged on the back side of the cross section in this figure. Since the flow path plate 2B is laminated by rotating the same thing as the flow path plate 2A by 90 degrees clockwise, the flow path portion 5 is partially exposed on the right side of this figure, It is connected to the flow path portion 5 of the plate 2A. Similarly, the flow path plates 2C and 2D are also rotated and rotated 90 degrees clockwise and stacked, and the sealing plate 1B having the same configuration as the sealing plate 1A and having the outlet 4B is disposed at the bottom. As a result, the flow path of the refrigerant continues from the inlet 4A of the sealing plate 1A in a spiral manner just 360 degrees and communicates with the outlet 4B of the sealing plate 1B. Thus, a continuous refrigerant flow path can be secured by stacking the rotationally symmetric flow path plates.

り、各材料の位置決めと結合が同時になされている。尚、各材料の間には、低融点金属層１１が形成されている。FIG. 5 shows a state of emboss coupling between the sealing plates and the flow path plates. For convenience, a partial cross section of the heat sink configuration is shown. Each embossed portion (embossed portion 6 in FIGS. 1 to 3) formed on each sealing plate and each flow path plate has a concave portion 6A on one side and a convex portion 6B on the opposite side.

Thus, each material is positioned and bonded simultaneously. A low melting point metal layer 11 is formed between the materials.

  The low melting point metal layer 11 preferably has a lower melting point than both the flow path plate and the sealing plate. The material of the flow path plate and the sealing plate is copper, and the low melting point metal layer is silver or The alloy is particularly suitable. The purpose of the heat sink is to efficiently absorb heat from the heating element and to conduct heat to the refrigerant in the refrigerant flow path of the heat sink. Therefore, the material of the flow path plate and the sealing plate is made of copper material with good thermal conductivity. In many cases, a material having good thermal conductivity is required as a material for joining the laminated plates. In this case, a solder alloy or a silver material is generally used as the material having a lower melting point and better thermal conductivity than the joining material. is there. However, since an internal pressure for circulating the refrigerant liquid is generated in the refrigerant flow path, a silver material that is stronger than the solder alloy in strength is used, and this is good from the viewpoint of thermal conductivity. Usually, pure copper has a melting point of 1080 degrees and silver has a melting point of 960 degrees. When the melting temperature for bonding is around 1000 degrees, it is close to the melting temperature of the flow path plate and is likely to cause shape deformation and the like. I can't. In order to solve these problems, when the flow path plate 2 is made of a copper material, the low melting point metal layer 11 can be prevented by interposing silver plating or silver foil. The reason is that the laminated surfaces of the flow path plate 2 and the sealing plates 1A and 1B made of a copper material are in close contact with each other by fitting the embossed portion with the low melting point metal layer 11 interposed therebetween. When the temperature is gradually increased, the intermetallic diffusion phenomenon on the contact surface starts, causing eutectic formation of the silver alloy, and the alloyed state is realized at a relatively low temperature. The melting temperature of the silver alloy is determined by the contents of copper and silver, and from the existing alloy phase diagram, even if the content is half and half, it melts at around 800 degrees. (In the existing copper-silver alloy phase diagram, the melting temperature is 780 ° C for 40% silver and 60% copper) Deformation of the laminated member occurs because the bonding temperature can be lowered by lowering the bonding temperature relative to the melting temperature of the copper material Good bonding conditions can be set.

  Next, the manufacturing method of the Example of the said heat sink is demonstrated. First, the sealing plates 1A and 1B are formed by press punching or the like. At this time, in the above embodiment, the mounting hole 7 is formed as a through hole in each sealing plate / channel plate. At this time, if screws are formed in these through holes, it becomes easy to connect the joint later.

  Next, since all the four flow path plates have the same configuration, they can be mass-produced by a press punching lamp. About the embossing part of each sealing board and each flow path board, a recessed part and a convex part can be simultaneously formed by protrusion etc. of a dowel. A low melting point metal layer can be provided in advance on at least one surface of each sealing plate and each flow path plate.

  Subsequently, assembling, first, the sealing plate 1B is fixed at a predetermined position, and the flow path plate 2D is disposed thereon so that the end of the flow path portion overlaps the outlet 4B. In the following, the flow path plates 2C, 2B, and 2A are arranged in order of 90 degrees each so that the ends of the flow path portions communicate with each other. Finally, the sealing plate 1A is stacked and pressurized, and the embossed portions are fitted and joined to be integrated. The steps up to here can be performed continuously by using a progressive die, for example.

  The integrated heat sink assembly is put in a high temperature bath of, for example, about 830 ° C., and the low melting point metal layer is melted and then cooled. In this example, silver is used as the low-melting point metal layer, but other materials such as other silver alloys or solders can be selected according to the type of the sealing plate or flow path plate.

  FIG. 6 is a plan view showing a flow path plate used in the second embodiment of the heat sink according to the present invention. The flow path plate 2 is formed in a circular shape, and a hollow portion 3 is provided at the center. A through hole 5 serving as a flow path is formed in an arc shape in the upper right portion of the hollow portion 3. The through-hole 5 is formed to be rotationally symmetric by 45 degrees, but the length is more than 45 degrees in order to ensure a continuous flow path between adjacent flow path plates. Has been. Further, embossed portions 6 are provided at eight locations on the flow path plate 2 around the hollow portion 3, and one side is formed as a recess and the opposite side is formed as a protrusion. It is designed so that it can be fitted and connected to the stop plate.

  FIG. 8 shows a side view of a heat sink produced by laminating the above flow path plates. In this embodiment, the four flow path plates 2 are laminated so that the through holes 5 overlap at the same position, and the next four flow path plates 2 are laminated in the same manner. Rotate 45 degrees clockwise and overlap. Further, another four flow path plates 2 are further rotated 45 degrees clockwise and overlapped. A total of twelve flow path plates 2 are laminated, and sealing plates 1A and 1B for sealing the flow paths are laminated on both sides of these laminated plates 2. In this embodiment, the inflow ports 4A are provided for the left four flow path plates 2 in FIG. 8, and the outflow ports 4B are provided for the right four flow path plates 2. A front view of this embodiment is shown in FIG. Since the through holes 5 of the flow path plates 2 stacked four by four are formed slightly wider than 45 degrees, some of the through holes 5 overlap when the flow path plates 2 are rotated 45 degrees and stacked. Thus, the channel overlapping portion 40 is formed. Thereby, the through holes 5 provided in the first four flow path plates 2 and the through holes 5 provided in the next four flow path plates 2 are connected at the flow path overlapping portion 40. become.

  FIG. 9 shows the flow path connection state. FIG. 9 is a cross-sectional view of the heat sink of this embodiment cut along the A-A ′ arc line in FIG. 7. In FIG. 9 (A), the flow path plates 2 that are stacked four by four are rotated 45 degrees and overlapped, so that each through hole 5 is connected at the flow path overlapping portion 40. FIG. 9B shows an example in which the number of stacked first and last flow path plates 2 is two, and the number of stacked central flow path plates 2 is eight. In this way, by changing the number of stacked flow path plates 2, the flow path cross-sectional area can be freely changed, so that it is possible to provide heat sinks having different flow path cross-sectional areas depending on the heat generation situation. Become.

  FIG. 10 is a plan view showing a flow path plate used in the third embodiment of the heat sink according to the present invention. The flow path plate 2 is formed in a circular shape, and a hollow portion 3 is provided at the center. A through hole 5A serving as a flow path is formed in the upper right portion of the hollow portion 3, and a through hole 5B is formed in an arc shape on the left side. These through-holes 5A and 5B are formed so as to be rotationally symmetric by 45 degrees, but in order to ensure a continuous flow path between adjacent flow path plates, the length exceeds 45 degrees in angle. It is supposed to be. However, if the lengths of the through holes 5A and 5B are too long, there is a possibility that when the flow path plate 2 is rotated by the symmetric rotation angle, it may be connected to the adjacent through hole. That should be avoided. Further, embossed portions 6 are provided at eight locations on the flow path plate 2 around the hollow portion 3, and one side is formed as a recess and the opposite side is formed as a protrusion. It is designed so that it can be fitted and connected to the stop plate.

  FIG. 11 shows a front view of a heat sink manufactured using the flow path plate 2 described above. As in the second embodiment shown in FIG. 7, the flow path (through hole) 5 connected to the inflow hole 4 </ b> A is connected to the outflow port 4 </ b> B by the rotational lamination of the flow path plate 2. On the other hand, a flow path (through hole) 5 connected to another inflow port 4 </ b> C is connected to the outflow port 4 </ b> D by rotation lamination of the flow path plate 2. Thus, according to the present invention, a plurality of independent flow paths can be formed simultaneously. FIG. 12 shows a cross-sectional view when the heat sink of this embodiment is cut along a B-B ′ arc line similar to that shown in FIG. 9. It can be seen that the channel 5A and the channel 5B are formed independently. In this example, two channels are used, but it is also possible to form a larger number of channels if they are designed so that they do not contact each other due to the rotation of the symmetric rotation angle.

  FIG. 13 shows a plan view of the flow path connection plate 50 used in the fourth embodiment of the heat sink according to the present invention. The channel connection plate 50 is formed in a circular shape like the channel plate 2, and the hollow portion 3 is provided at the center. A through hole 51 serving as a connection flow path is formed in an arc shape on the right side of the hollow portion 3. The through hole 51 is formed longer than the through holes 5A and 5B formed in the flow path plate 2 of the third embodiment. The flow path connection plate 50 is disposed between the lowermost flow path plate 2 and the sealing plate 1B shown in FIG. A front view of the heat sink according to this embodiment is shown in FIG. For explanation of the flow path, FIG. 15 shows a cross-sectional view when the heat sink of this embodiment is cut along the C-C ′ arc line in FIG. 14. Two independent flow paths are connected by arranging the flow path connection plate 50 having the long through-holes 51 in the lowermost stage. Therefore, when the refrigerant is sent out from the inlet 4A provided in one flow path, the refrigerant that has passed through the flow path 5A on this side moves to the flow path 5B via the connection flow path 51, and is provided on the flow path 5B side. The outlet 4B can be reached.

  FIG. 16 is a sectional view of a heat sink according to a fifth embodiment of the present invention. In this embodiment, the outer shape is formed in a square shape as in the first embodiment, and the hollow portion 3 at the center is also formed in a square shape. With these designs, the through hole 5 is formed in an L shape. The heat sink of this embodiment was devised so that it can be cooled by directly covering a motor, solenoid, etc., and the feature is that a notch 8 is formed in a part of the flow path plate 2. It is. By forming the notch 8, the motor or the like is directly exposed to this portion, which is effective when taking out the wiring or the like, for example. In the heat sink according to the present invention, since the thin channel plates are laminated, the thickness of the notch portion 8 can be freely changed by providing the notch portions 8 only in some of the channel plates. FIG. 17 shows a side cross-sectional view when the heat sink of this embodiment is installed in a motor.

  As described above, according to the present invention, a small stacked heat sink that can be easily manufactured and can be easily attached to a motor or the like and a method for manufacturing the same can be provided. Therefore, the present invention greatly contributes to the field of cooling electrical and electronic equipment. It can be done.

It is a top view which shows the structure of the flow-path board of Example 1 of heat sink by this invention. It is a top view which shows the structure of another flow-path board of the heat sink Example 1 by this invention. It is a top view which shows the structure of the sealing plate of Example 1 of heat sink by this invention. It is explanatory drawing which shows the state at the time of assembling the heat sink Example 1 by this invention using the flow-path board and sealing plate shown to FIGS. It is a figure which shows the coupling | bonding state of the principal part of the heat sink Example 1 by this invention shown in FIG. It is a top view which shows the flow-path board structure of the heat sink Example 2 by this invention. It is a front view of the heat sink using the flow-path board shown in FIG. FIG. 8 is a side view of the heat sink shown in FIG. 7. It is sectional drawing for demonstrating the flow-path connection of the heat sink Example 2 shown to FIG. It is a top view which shows the flow-path board used for the heat sink Example 3 by this invention. It is a front view of the heat sink shown in FIG. It is sectional drawing for demonstrating the flow-path connection of the heat sink Example 2 shown in FIG. It is a top view which shows the flow-path connection board used for the heat sink Example 4 by this invention. It is a front view of Example 4 using the flow-path connection board shown in FIG. It is sectional drawing for demonstrating the flow-path connection of the heat sink Example 2 shown in FIG. It is sectional drawing of the heat sink Example 5 by this invention. It is side surface sectional drawing of Example 5 shown in FIG.

1A, 1B Sealing plate 2, 2A, 2B, 2C, 2D Channel plate 3 Hollow part 4A, 4C Inlet 4B, 4D Outlet 5, 5A, 5B Channel part 6 Embossed part 6A Concave part 6B Convex part 7 Mounting hole 8 Notch part 11 Low melting point metal layer 21 Joint part 31 Motor 32 Motor wiring 33 Motor stay 34 Fixing screw 40 Channel overlap part 50 Channel connection plate 51 Connection channel

Claims (7)

A plurality of flow path plates having through holes that serve as refrigerant flow paths are laminated, sealing plates that serve as sealing surfaces of the flow paths are disposed on both sides, and a refrigerant inflow / outlet is provided on the sealing plate or the flow path plate. In the heat sink provided, each of the flow path plates has the through hole formed in a rotationally symmetric position, and a predetermined number of the through holes are stacked by rotating by a symmetric rotation angle by a predetermined number, whereby a part of the through hole is adjacent to the flow plate. A laminated heat sink, wherein the laminated heat sink is arranged so as to overlap with a through hole of a road plate. A plurality of through holes are formed in the flow path plate, the length of each of the through holes is formed longer than the rotational symmetry angle, and the distance between the through holes is separated from the rotational symmetry angle. The laminated heat sink according to claim 1. Each of the flow path plate and the sealing plate is formed with a plurality of embossed portions having a concave portion on one side and a convex portion on the opposite surface side. The laminated heat sink according to claim 1 or 2, wherein the embossed portion is fitted and connected. A low melting point metal layer is provided on a contact surface between each sealing plate and each flow path plate, and each sealing plate and each flow path plate are joined by melting of the low melting point metal layer. The multilayer heat sink according to any one of claims 1 to 3. The laminated heat sink according to claim 4, wherein the material of each sealing plate and each flow path plate is copper, and the low melting point metal layer is silver or an alloy thereof. The laminated heat sink according to any one of claims 1 to 5, wherein a central portion of each sealing plate and each flow path plate is formed to be hollow. A step of forming a pair of sealing plates that form the sealing surface of the refrigerant flow path including the outer shape and a plurality of embossed portions, and the through holes and one side surface of the refrigerant flow path are concave and the opposite surface is convex. Forming a flow path plate having a predetermined shape including an embossed portion and a lower melting point than the flow path plate and the sealing plate on at least one surface of the flow path plate and / or the sealing plate A step of forming a low melting point metal layer, a step of laminating a predetermined number of the flow path plates by a predetermined angle, and a step of fitting the embossed portions together to form the set of sealing plates and the plurality of A method of manufacturing a laminated heat sink, comprising: a step of joining flow path plates to each other; and a step of thermally melting the low melting point metal layer to join the sealing plate and the metal thin plate.

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