JP2012163739A - Photoelectric conversion module and manufacturing method of the photoelectric conversion module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a photoelectric conversion module which is excellent in heat-dissipating property and is suitable for mass production, and a manufacturing method of the photoelectric conversion module.SOLUTION: A photoelectric conversion module (26) includes a substrate (32) having an underclad layer (49) on one surface thereof, a core (50), an overclad layer (52), a mirror (42) provided on the wall surface of a groove crossing the core (50), a photoelectric conversion element (36) mounted on a mounting surface of the substrate (32), an IC chip (35) electrically connected with the photoelectric conversion element (36) through a part of a conductor pattern (33), a metal foil (44) provided in a region facing the photoelectric conversion element (36) and the IC chip (35) on the surface of the overclad layer (52), and a non-metal reinforcement member (46) laminated, with a part of the metal foil (44) exposed, in a region facing the photoelectric conversion element (36) and the IC chip (35) on the surface of the metal foil (44).

Description

  The present invention relates to a photoelectric conversion module and a method for manufacturing a photoelectric conversion module.

  For example, in a connection between a server and a switch in a data center or a connection between digital AV (audio / visual) devices, an optical fiber is used as a transmission medium in addition to a metal wire. In addition, the use of an optical fiber as a transmission medium is also being examined inside information processing devices such as mobile phones and personal computers (optical interconnect).

When an optical fiber is used, a photoelectric conversion module that converts an electrical signal into an optical signal or an optical signal into an electrical signal is required. As a photoelectric conversion module, in the photoelectric wiring member disclosed in Patent Document 1, an electronic component is mounted together with a photoelectric conversion element on one surface of a flexible substrate, and an optical wiring member is formed on the other surface of the substrate. The A metal plate is laminated on the optoelectric wiring member.
The metal plate dissipates heat generated in the photoelectric conversion element and the electronic component, thereby suppressing a temperature rise of the photoelectric conversion element and the electronic component and stabilizing the operation.

JP 2008-151993 A

  When manufacturing the opto-electric wiring member disclosed in Patent Document 1, it is necessary to laminate the metal plates after cutting the substrate and the optical wiring member with a dicing apparatus. This is because it is difficult to cut the metal plate simultaneously with the substrate and the optical wiring member by the dicing apparatus.

  As described above, it is complicated to stack one metal plate on each of the cut optical wiring members. In addition, when the optical wiring member is small, it is not easy to align the metal plate with the optical wiring member. For this reason, there is a problem that it is difficult to mass-produce the optoelectric wiring member having excellent heat dissipation efficiency efficiently and at low cost.

  This invention is made | formed in view of the situation mentioned above, The place made into the objective is providing the manufacturing method of the photoelectric conversion module excellent in heat dissipation and suitable for mass production, and a photoelectric conversion module.

  In order to achieve the above object, according to one aspect of the present invention, a substrate having an undercladding layer on at least one surface, having flexibility and translucency, and a core extending along the undercladding layer, An over clad layer surrounding the core in cooperation with the under clad layer, a mirror provided on a wall surface of a groove crossing the core, a conductor pattern provided on the substrate, and an opposite side of the core A photoelectric conversion element mounted on the mounting surface of the substrate and optically coupled to the core via the mirror, and mounted on the mounting surface and electrically connected to the photoelectric conversion element via a part of the conductor pattern. On the surface of the over-cladding layer opposite to the under-cladding layer, and the photoelectric conversion element and the IC chip facing each other A non-metallic reinforcing member laminated in a state where a part of the metal foil is exposed in a region facing the photoelectric conversion element and the IC chip on the surface of the metal foil provided A photoelectric conversion module is provided.

  According to one embodiment of the present invention, a material substrate having an undercladding layer on at least one surface and having flexibility and translucency and divided into a plurality of substrates, corresponding to each of the substrates. Providing a material sheet including a core provided and extending along the under-cladding layer; and an over-cladding layer surrounding the core in cooperation with the under-cladding layer; and forming a conductor pattern on the material substrate A step of forming a groove across the core in the material sheet and then forming a mirror on the wall surface of the groove; and a mounting surface of the material substrate on the opposite side of the core via the mirror Mounting a plurality of photoelectric conversion elements optically coupled to the core; and a plurality of I electrically connected to the photoelectric conversion elements on the mounting surface through a part of the conductor pattern. A step of mounting the chip, and a metal foil across the boundary between the substrates in a region facing the photoelectric conversion element and the IC chip on the surface of the over clad layer opposite to the under clad layer A non-metallic reinforcing member straddling the boundary between the substrates in a state where a part of the metal foil is exposed in a region facing the photoelectric conversion element and the IC chip on the metal foil There is provided a method for manufacturing a photoelectric conversion module, comprising: a step of bonding the material foil; and a step of cutting the material sheet together with the metal foil and the reinforcing member and dividing the material substrate into the substrate.

  ADVANTAGE OF THE INVENTION According to this invention, it is excellent in heat dissipation and the photoelectric conversion module suitable for mass production, and the manufacturing method of a photoelectric conversion module are provided.

It is a perspective view which shows the schematic external appearance of an optical active cable provided with the photoelectric conversion module of 1st Embodiment. FIG. 2 is a schematic perspective view showing an enlarged vicinity of an optical transceiver of the optical active cable of FIG. 1. FIG. 3 is a schematic perspective view showing the optical transceiver of FIG. 2 in an exploded manner. It is a perspective view which shows roughly the external appearance of the photoelectric conversion module of 1st Embodiment in FIG. It is a perspective view which shows roughly the external appearance which looked at the photoelectric conversion module of FIG. 4 from the other direction. It is a schematic perspective view which decomposes | disassembles and shows the photoelectric conversion module of FIG. It is a schematic sectional drawing of the photoelectric conversion module of FIG. 4 in the state attached to the connector. It is a schematic diagram for demonstrating the manufacturing method of the photoelectric conversion module of FIG. It is a perspective view which shows roughly the external appearance of the photoelectric conversion module of 2nd Embodiment. FIG. 10 is a schematic cross-sectional view of the photoelectric conversion module of FIG. 9 attached to a connector. It is a schematic sectional drawing of the photoelectric conversion module of 3rd Embodiment of the state attached to the connector.

[First Embodiment]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view schematically showing the configuration of the optical active cable 10. The optical active cable 10 includes one optical cable 12 and two optical transceivers 14 attached to both ends of the optical cable 12. The optical active cable 10 is applied to, for example, a connection between digital AV devices.

FIG. 2 is an enlarged perspective view showing the optical transceiver 14 together with a part of the optical cable 12.
The optical transceiver 14 has a housing 16 made of metal, for example, and the housing 16 has a box shape, for example. The optical cable 12 extends from one end of the housing 16 via a seal member 18, while an opening is formed in the other end of the housing 16.
In the opening of the housing 16, for example, the end of one circuit board 20 is located. The end of the circuit board 20 can be inserted into a slot provided in the digital AV device.

FIG. 3 is an exploded perspective view schematically showing the optical transceiver 14, and the housing 16 includes, for example, a first case 16a and a second case 16b that are separable from each other.
The circuit board 20 is a rigid board made of glass epoxy, for example, and is fixed to the second case 16b. A predetermined conductor pattern made of a metal such as copper is formed on the circuit board 20, and the conductor pattern includes a plurality of electrode terminals 22 arranged at the end of the circuit board 20. The electrode terminal 22 is electrically connected to an electrode terminal provided in the digital AV device.

A connector 24 electrically connected to the electrode terminal 22 is attached to the circuit board 20, and one end of the photoelectric conversion module 26 of the first embodiment is connected to the connector 24.
On the other hand, the optical cable 12 includes at least one optical fiber 28, and includes one optical fiber 28 in the present embodiment. The optical fiber 28 extends to the inside of the housing 16 through the seal member 18. The tip of the optical fiber 28 located inside the housing 16 is fixed to the other end of the photoelectric conversion module 26.
A glass support member 29 is disposed between the other end of the photoelectric conversion module 26 and the circuit board 20. The support member 29 is fixed to the photoelectric conversion module 26 using an adhesive.

[Photoelectric conversion module]
The photoelectric conversion module 26 converts the optical signal received from the optical fiber 28 into an electrical signal and transmits it to the digital AV device through the electrode terminal 22 or converts the electrical signal received from the digital AV device into an optical signal to convert the optical signal into an optical fiber. 28.
FIG. 4 is a perspective view showing the second case 16 b side of the photoelectric conversion module 26. The photoelectric conversion module 26 includes an FPC board (flexible printed circuit board) 30. The FPC board 30 is, for example, a polyimide-made film 32 having flexibility and translucency, and copper provided on the film 32, for example. And a conductor pattern 33 made of a metal.

The conductor pattern 33 of the FPC board 30 includes a plurality of electrode terminals 34 formed at one end of the film 32, and the electrode terminals 34 are connected to the connector 24.
The conductor pattern 33 can be produced, for example, by etching a metal film formed on the film 32.

  On one surface of the FPC board 30, an IC (integrated circuit) chip 35 and a photoelectric conversion element 36 are flip-chip mounted at predetermined positions, for example, and the IC chip 35 and the photoelectric conversion element 36 are electrically connected to the conductor pattern 33. Has been. Therefore, the IC chip 35 is electrically connected to the circuit board 20 through the conductor pattern 33 and the connector 24.

  The photoelectric conversion element 36 is arranged along the vicinity of one side of the IC chip 35, and the IC chip 35 and the photoelectric conversion element 36 are covered with a resin potting member 37 indicated by a one-dot chain line in the drawing. . In one photoelectric conversion module 26 of the two optical transceivers 14, the photoelectric conversion element 36 is a light emitting element such as an LD (laser diode), and the IC chip 35 constitutes a drive circuit for the light emitting element. Yes. That is, one optical transceiver 14 is a transmitter.

In the photoelectric conversion module 26 of the other optical transceiver 14, the photoelectric conversion element 36 is a light receiving element such as a PD (photodiode), and the IC chip 35 constitutes an amplifier circuit that amplifies the electrical signal output from the light receiving element. is doing. That is, the other optical transceiver 14 is a receiver.
The photoelectric conversion element 36 is a surface light emitting type or a surface light receiving type, and is arranged so that its light emission surface or light incident surface faces the surface of the FPC board 30.

FIG. 5 is a perspective view schematically showing the external appearance of the photoelectric conversion module 26 on the opposite side to FIG. 4, and FIG. 6 is a perspective view schematically showing the photoelectric conversion module 26 in an exploded manner.
5 and 6, a sheet-like polymer optical waveguide member 40 is integrally laminated on the other surface of the FPC board 30 over the entire area. One holding groove is formed at the end of the polymer optical waveguide member 40 corresponding to the number of optical fibers 28, and the tip of the optical fiber 28 is disposed in the holding groove.

  The polymer optical waveguide member 40 is formed with a V-groove that opens on the surface opposite to the FPC substrate 30, and a metal film, for example, is formed on the wall surface of the V-groove by vapor deposition. The metal film forms a mirror 42, and the photoelectric conversion element 36 and the optical fiber 28 are optically coupled via the mirror 42.

A metal foil 44 is laminated on the surface of the polymer optical waveguide member 40 opposite to the FPC board 30. The metal foil 44 is laminated at least in the region of the FPC board 30 that faces the IC chip 35 and the photoelectric conversion element 36.
That is, the metal foil 44 is photoelectrically converted from the end of the photoelectric conversion element 36 opposite to the IC chip 35 in at least the longitudinal direction of the FPC board 30, that is, the arrangement direction of the IC chip 35 and the photoelectric conversion element 36. It extends to the end of the IC chip 35 opposite to the element 36, and extends over the entire width of the IC chip 35 and the photoelectric conversion element 36 in the width direction orthogonal to the longitudinal direction.

  In the present embodiment, the metal foil 44 extends beyond the V-groove from the end of the FPC substrate 30 opposite to the holding groove in the longitudinal direction, and the polymer optical waveguide member 40 and the FPC substrate 30 in the width direction. It extends over the entire width.

  The metal foil 44 has a thickness that can be cut by a dicing apparatus, and preferably has a thickness of 8 μm or more and 50 μm or less. Moreover, although the metal foil 44 consists of a single metal or an alloy, Preferably it consists of copper.

A plate-like reinforcing member 46 is laminated on the surface of the metal foil 44 opposite to the polymer optical waveguide member 40.
The reinforcing member 46 is laminated at least in the region of the metal foil 44 that faces the IC chip 35 and the photoelectric conversion element 36.

That is, the reinforcing member 46 is photoelectrically converted from the end of the photoelectric conversion element 36 on the side opposite to the IC chip 35 in at least the longitudinal direction of the FPC board 30, that is, the arrangement direction of the IC chip 35 and the photoelectric conversion element 36. It extends to the end of the IC chip 35 opposite to the element 36, and extends over the entire width of the IC chip 35 and the photoelectric conversion element 36 in the width direction orthogonal to the longitudinal direction.
In the present embodiment, the reinforcing member 46 extends beyond the V-groove from the front by a predetermined distance at the end of the FPC board 30 opposite to the holding groove in the longitudinal direction, and the polymer optical waveguide member 40 in the width direction. And extends across the entire width of the FPC board 30.

  The reinforcing member 46 should have sufficient strength to prevent a connection failure between the IC chip 35 and the photoelectric conversion element 36 due to deformation of the FPC board 30 and can be cut by a dicing apparatus. That's fine. The reinforcing member 46 is made of non-metal, and is made of, for example, glass and ceramics. The reinforcing member 46 is preferably made of a glass plate having a thickness of 200 μm to 1500 μm.

  A part (extension part) of the metal foil 44 is extended from the end of the reinforcing member 46. For this reason, the reinforcing member 46 is smaller than the metal foil 44. In the present embodiment, as a preferable aspect, the extending portion of the metal foil 44 extends from the end of the reinforcing member 46 on the electrode terminal 34 side.

  Double-sided tape or an adhesive can be used for fixing the metal foil 44 to the FPC board 30 and fixing the reinforcing member 46 to the metal foil 44. As the adhesive, any of thermosetting resins can be used. However, if the reinforcing member 46 is transparent, a UV curable resin can be used for fixing the reinforcing member 46 to the metal foil 44.

  In the present embodiment, a plate-like fixing member 48 is attached to the FPC board 30 so as to cover the holding groove. The fixing member 48 can also be fixed using an adhesive.

FIG. 7 is a schematic cross-sectional view of the photoelectric conversion module 26 connected to the connector 24.
The polymer optical waveguide member 40 includes an under cladding layer 49, a core 50, and an over cladding layer 52. The undercladding layer 49 is laminated on the film 32 of the FPC board 30, and a core 50 having a quadrangular cross section extends on the undercladding layer 49.

The number of cores 50 is one corresponding to the number of optical fibers 28, and is positioned coaxially with the tip of the optical fiber 28. The over clad layer 52 is laminated on the under clad layer 49 and the core 50 so as to surround the core 50 in cooperation with the under clad layer 49.
The material of the under cladding layer 49, the core 50, and the over cladding layer 52 is not particularly limited, and for example, an acrylic resin, an epoxy resin, a polyimide resin, or the like can be used.
The optical fiber 28 includes a core 53 and a clad 54 surrounding the core 53, and the core 50 of the polymer optical waveguide member 40 and the core 53 of the optical fiber 28 are coaxially arranged and optically coupled to each other.

  The plurality of electrode terminals 55 included in the connector 24 are connected to the conductor pattern of the circuit board 20 by, for example, solder. In a state where the photoelectric conversion module 26 is connected to the connector 24, a part of the electrode terminals 55 of the connector 24 is brought into contact with the electrode terminals 34 of the photoelectric conversion module 26. On the other hand, the extending portion of the metal foil 44 is also brought into contact with a part of the electrode terminals 55 of the connector 24.

  The IC chip 35 and the photoelectric conversion element 36 are connected to the conductor pattern 33 of the FPC board 30 by bumps made of, for example, Au. A gap between the photoelectric conversion element 36 and the FPC board 30 is filled with a light-transmitting filler (underfill). The filler prevents the material of the potting member 37 from flowing between the photoelectric conversion element 36 and the FPC board 30 and secures an optical path for the photoelectric conversion element 36.

  On the other hand, as shown in FIG. 7, adhesive layers 60 and 62 made of an adhesive exist between the polymer optical waveguide member 40 and the metal foil 44 and between the metal foil 44 and the reinforcing member 46, respectively. An adhesive layer 64 also exists between the fixing member 48 and the polymer optical waveguide member 40. Note that the thickness of the adhesive layers 60, 62, and 64 is preferably as thin as possible. In FIG. 7, the thickness of the adhesive layers 60, 62, and 64 is exaggerated for the sake of explanation.

Hereinafter, with reference to FIG. 8, the preferable manufacturing method of the photoelectric conversion module 26 mentioned above is demonstrated.
First, as shown in FIG. 8A, a material sheet 70 is prepared. The material sheet 70 is divided into a plurality of FPC boards 30 and polymer optical waveguide members 40 by cutting. That is, the material sheet 70 includes an aggregate of a plurality of FPC substrates 30 and the polymer optical waveguide member 40, and is produced by stacking the aggregate of the polymer optical waveguide members 40 on the aggregate of the FPC substrates 30.

  The aggregate of the FPC board 30 is an aggregate of the film 32 and the conductor pattern 33. The aggregate of the conductor pattern 33 is before the polymer optical waveguide member 40 is laminated on the aggregate of the film 32. It may be formed later or later.

  Then, a holding groove is formed on the prepared material sheet 70, a V groove is formed, and a metal film is deposited on the V groove to produce a mirror 42 (processing step). After the processing step, although not shown, a plurality of IC chips 35 and photoelectric conversion elements 36 are flip-chip mounted on one surface (mounting surface) of the material sheet 70 (mounting step).

  After the mounting process, as shown in FIG. 8B, a large material foil 72, which is the material of the metal foil 44, is stuck to the material sheet 70 using an adhesive (metal foil laminating process). Then, as shown in FIG. 8C, a large material reinforcing member 74, which is the material of the reinforcing member 46, is pasted on the material foil 72 using an adhesive (reinforcing member lamination step). The material foil 72 and the material reinforcing member 74 are stacked on the material sheet 70 across the boundary between the FPC boards 30 in the material sheet 70.

After the reinforcing member laminating step, the material sheet 70 is cut by a dicing device along the alternate long and short dash line in FIG. 8D (dicing step), whereby the photoelectric conversion modules 26 shown in FIG. Several are obtained.
Note that the dicing apparatus simultaneously cuts the material sheet 70 together with the material foil 72 and the material reinforcing member 74 by the rotation of the disk-shaped dicing blade.

  In the photoelectric conversion module 26 of the first embodiment described above, the reinforcing member 46 is laminated on the region (mounting region) of the FPC board 30 facing the IC chip 35 and the photoelectric conversion element 36 via the metal foil 44. . Since the reinforcing member 46 prevents the mounting area of the FPC board 30 from being deformed, the connection between the IC chip 35 and the photoelectric conversion element 36 and the FPC board 30 is prevented from being broken.

  On the other hand, in the photoelectric conversion module 26 of the first embodiment described above, the heat generated in the IC chip 35 and the photoelectric conversion element 36 flows into the metal foil 44 through the FPC board 30. The heat flow is transmitted from the metal foil 44 to the circuit board 20 through the connector 24. Therefore, the heat generated in the IC chip 35 and the photoelectric conversion element 36 is efficiently transported from the IC chip 35 and the photoelectric conversion element 36 to the surroundings, and the temperature rise of the IC chip 35 and the photoelectric conversion element 36 is prevented. As a result, the photoelectric conversion module 26 operates stably.

  In the manufacturing method of the photoelectric conversion module 26 according to the first embodiment described above, the material foil 72 that is the material of the metal foil 44 and the material reinforcing member 74 that is the material of the reinforcing member 46 are cut together with the material sheet 70 by the dicing apparatus. The According to this manufacturing method, the photoelectric conversion module 26 is easily mass-produced.

Moreover, in the manufacturing method of the photoelectric conversion module 26 of 1st Embodiment mentioned above, the material foil 72 and the material reinforcement member 74 are easily laminated | stacked on the material sheet 70 using an adhesive agent or a double-sided tape. Also in this respect, the photoelectric conversion module 26 is easily mass-produced.
In addition, in the method for manufacturing the photoelectric conversion module 26 of the first embodiment described above, the reinforcing member 46 is made of a glass plate. Therefore, if a UV curable resin is used as an adhesive between the material foil 72 and the material reinforcing member 74, Further, productivity is improved.

  Furthermore, in the manufacturing method of the photoelectric conversion module 26 according to the first embodiment described above, the material foil 72 and the material reinforcing member 74 are cut together with the material sheet 70, so that both side edges of the metal foil 44 and the reinforcing member 46 are FPC. It corresponds to both side edges of the substrate 30 and the polymer optical waveguide member 40. For this reason, in the photoelectric conversion module 26, the dispersion | variation in an external shape is suppressed. Further, even if the photoelectric conversion module 26 is small, the metal foil 44 and the reinforcing member 46 can be easily stacked on the FPC board 30, and the photoelectric conversion module 26 is suitable for downsizing.

[Second Embodiment]
Hereinafter, a second embodiment will be described. In addition, about the structure same or similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.
FIG. 9 is a perspective view schematically showing the external appearance of the photoelectric conversion module 80 of the second embodiment. The metal foil 82 of the photoelectric conversion module 80 is longer than the metal foil 44 of the photoelectric conversion module 26 and extends from the reinforcing member 46 also on the optical fiber 28 side.

  FIG. 10 shows a schematic cross section of the photoelectric conversion module 80 connected to the connector 24, and a sheet-like heat transfer member 84 is laminated on the extending portion of the metal foil 82 on the optical fiber 28 side. ing. The heat transfer member 84 is made of, for example, a heat conductive resin, and is in close contact with the surface of the extending portion of the metal foil 82 and is also in close contact with the inner surface of the first case 16a.

A sheet-like heat transfer member 86 is also disposed between the extending portion of the metal foil 82 on the connector 24 side and the first case 16a. The heat transfer member 86 is also made of, for example, a heat conductive resin, and is in close contact with the surface of the extending portion of the metal foil 82 and in close contact with the inner surface of the first case 16a.
The photoelectric conversion module 80 can be manufactured by the same manufacturing method as the photoelectric conversion module 26 except that a material foil larger than the material foil 72 is used.

  In the photoelectric conversion module 80 of the second embodiment, the heat generated in the IC chip 35 and the photoelectric conversion element 36 flows into the metal foil 82 through the FPC board 30. The heat flow is transmitted from the metal foil 82 to the circuit board 20 through the connector 24 and also to the first case 16a through the heat transfer members 84 and 86.

  Therefore, the heat generated in the IC chip 35 and the photoelectric conversion element 36 is more efficiently transported from the IC chip 35 and the photoelectric conversion element 36 to the surroundings, and the temperature rise of the IC chip 35 and the photoelectric conversion element 36 is prevented. The As a result, the photoelectric conversion module 80 operates stably.

[Third Embodiment]
Hereinafter, the third embodiment will be described. In addition, about the structure same or similar to 1st Embodiment and 2nd Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.
FIG. 11 shows a schematic cross section of the photoelectric conversion module 90 of the third embodiment in a state where it is connected to the connector 24. In the photoelectric conversion modules 26 and 80 of the first and second embodiments, the FPC substrate 30 includes the film 32. However, in the photoelectric conversion module 90 of the third embodiment, the under cladding layer of the polymer optical waveguide member 92 is used. A conductor pattern 33 is formed directly on 94. That is, the film 32 and the under clad layer 49 of the FPC board 30 may be made of the same material.

  Therefore, in the present specification, when the under clad layer 49 is provided on the film 32 as in the first embodiment and the second embodiment, the film 32 and the under clad layer 49 are collectively referred to as a “substrate”. When the under cladding layer 94 also serves as a film as in the third embodiment, the under cladding layer 94 is referred to as a “substrate”. That is, the “substrate” only needs to have an under cladding layer on at least one surface.

The present invention is not limited to the first to third embodiments described above, and includes forms obtained by appropriately combining the first to third embodiments and forms obtained by changing these forms.
For example, in the photoelectric conversion modules 26 and 90 of the first embodiment and the third embodiment, the heat dissipation member 86 of the second embodiment may be laminated on the extending portion of the metal foil 44 on the connector 24 side.

Moreover, in the photoelectric conversion module 80 of 2nd Embodiment, although the metal foil 82 had the extension part in the connector 24 side, you may have an extension part only in the optical fiber 28 side.
That is, the metal foil may have an extending portion on one or both of the connector 24 side and the optical fiber 28 side.

  In the photoelectric conversion modules 26, 80, and 90 of the first to third embodiments described above, one photoelectric conversion element 36 is mounted, but a plurality of photoelectric conversion elements 36 may be mounted. Further, as the photoelectric conversion element 36, an array element having a plurality of photoelectric conversion elements may be mounted. In these cases, the number of cores 50 and optical fibers 28 in the polymer optical waveguide members 40 and 92 is adjusted according to the number of photoelectric conversion elements 36 or photoelectric conversion elements.

  The optical cable 12 may be a photoelectric composite cable including a metal wire in addition to the optical fiber 28. In this case, both ends of the metal wire are fixed to the circuit board 20.

  Finally, the photoelectric conversion module of the present invention can be applied to network devices other than digital AV devices, information processing devices, and home appliances. More specifically, the photoelectric conversion module can be applied to a personal computer, a switching hub, an HDMI (registered trademark: high resolution multimedia interface) cable, and the like.

20 Circuit board 26 Photoelectric conversion module 28 Optical fiber 30 FPC board 32 Film (board)
33 Conductor pattern 35 IC chip 36 Photoelectric conversion element 40 Polymer optical waveguide member 42 Mirror 44 Metal foil 46 Reinforcing member 49 Under clad layer (substrate)
50 Core 52 Over clad layer 60, 62, 64 Adhesive layer 84 Heat transfer member

Claims (7)

A substrate having an underclad layer on at least one surface, and having flexibility and translucency;
A core extending along the undercladding layer;
An overclad layer surrounding the core in cooperation with the underclad layer;
A mirror provided on the wall surface of the groove crossing the core;
A conductor pattern provided on the substrate;
A photoelectric conversion element mounted on the mounting surface of the substrate opposite to the core and optically coupled to the core via the mirror;
An IC chip mounted on the mounting surface and electrically connected to the photoelectric conversion element through a part of the conductor pattern;
A metal foil provided in a region facing the photoelectric conversion element and the IC chip on the surface of the over cladding layer opposite to the under cladding layer;
A photoelectric conversion module comprising: a non-metallic reinforcing member stacked in a state where a part of the metal foil is exposed in a region facing the photoelectric conversion element and the IC chip on the surface of the metal foil. The thickness of the metal foil is 8 μm or more and 50 μm or less.
The photoelectric conversion module according to claim 1. The reinforcing member is made of glass.
The photoelectric conversion module according to claim 1 or 2. The reinforcing member is made of a glass plate having a thickness of 200 μm or more and 1500 μm or less.
The photoelectric conversion module according to claim 3. The metal foil is laminated to the over clad layer via an adhesive or double-sided tape,
The photoelectric conversion module as described in any one of Claims 1 thru | or 4. The photoelectric conversion module according to any one of claims 1 to 5, wherein the substrate is made of only a material constituting the under cladding layer. A material substrate having an undercladding layer on at least one surface and having flexibility and translucency and divided into a plurality of substrates, provided corresponding to each of the substrates and extending along the undercladding layer Providing a material sheet comprising a core and an overclad layer surrounding the core in cooperation with the underclad layer;
Forming a conductor pattern on the material substrate;
Forming a mirror on the wall surface of the groove after forming a groove across the core in the material sheet;
Mounting a plurality of photoelectric conversion elements optically coupled to the core via the mirror on a mounting surface of the material substrate opposite to the core;
Mounting a plurality of IC chips electrically connected to the photoelectric conversion element via a part of the conductor pattern on the mounting surface;
Adhering a metal foil across the boundary between the substrates to a region facing the photoelectric conversion element and the IC chip on the surface of the over clad layer opposite to the under clad layer;
Bonding a non-metallic reinforcing member across a boundary between the substrates in a state where a part of the metal foil is exposed in a region facing the photoelectric conversion element and the IC chip on the metal foil; ,
Cutting the material sheet together with the metal foil and the reinforcing member, and dividing the material substrate into the substrate.

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