JP2012151005A - Electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device which restrains electric connection failure, and an unstable contact pressure.SOLUTION: An electronic device comprises: an electronic substrate in which an electrode is formed on the surface of the end; a housing on which an electronic substrate insertion groove for inserting the electronic substrate is formed; and a terminal fixed to the housing. A recess opened on an electrode formation surface is formed on the electronic substrate. The housing has: two opposed parts opposed to each other in a thickness direction of the electronic substrate to form the electronic substrate insertion groove; a connection part for connecting the two opposed parts; and a spring part for always applying a spring force on the two opposed parts so that the two opposed parts approach to each other. A terminal is fixed to the opposed part opposed to the electrode formation surface, and a projection part fitted with the recess and projecting in the electronic substrate insertion groove is formed at the opposed part fixed to the terminal. Length in the thickness direction is longer on the projection part than on a contact part, and the projection part is separated from the contact part in a removing direction.

Description

  The present invention relates to an electronic substrate in which a plurality of electrodes are formed on at least one of the front surface and the back surface thereof, a housing in which an electronic substrate insertion groove for inserting an end portion of the electronic substrate is formed, and a housing A card edge connector having a fixed terminal, and the end of the electronic board is inserted into the electronic board insertion groove, so that the electrode and the contact portion provided in the electronic board insertion groove in the terminal are in contact with each other The present invention relates to an electronic device.

  2. Description of the Related Art Conventionally, as shown in Patent Document 1, for example, a contacting connection device in which a part of a contact connector (hereinafter simply referred to as a connector) is accommodated in a contact connector housing device (hereinafter simply referred to as a storage device). Has been proposed. The connector includes a first contact holder (hereinafter simply referred to as a first holder) and a second contact holder (hereinafter simply referred to as a second holder) coupled to each other by a hinge. The holder is connected to the cross-section of the cross section by a hinge, and can be moved close to and away from each other with the hinge as a fulcrum. The receiving device has a U-shaped cross-section, and a contact support (printed circuit board) is arranged so that a site for forming a contact surface (land) is disposed in a space surrounded by a peripheral wall that forms a part of the U-shape. ) Is coupled to the containment device. A contact element that is electrically connected to the printed circuit board by contacting the land is provided at each of the opposing portions of the first holder and the second holder, and on the back side of the opposing portion, the inner surface of the peripheral wall of the storage device The spring element which acts by the contact and the force with which a 1st holder and a 2nd holder adjoin each other is provided.

  Each of the two holders is provided with an insertion guide element, and the receiving device is provided with a corresponding insertion guide element. The insertion guide element has a shape that protrudes so as to reduce the distance between the opposing portions of the two holders, and the corresponding insertion guide element is opposite to the insertion direction from the bottom surface facing the insertion direction of the connector in the storage device. A spherical wedge is formed at the tip thereof. The corresponding insertion guide elements are arranged side by side on both sides of the printed circuit board, and when the connector is accommodated in the accommodating device, the insertion guide element and the wedge of the corresponding insertion guide element come into contact with each other, The two holders are configured to be separated from each other while resisting the spring force of the spring element.

Special table 2009-520333

  By the way, as described above, in the contact connecting device shown in Patent Document 1, each holder is provided with an insertion guide element, and the accommodation device is provided with a corresponding insertion guide element. For this reason, if the arrangement position of the corresponding insertion guide element and the printed circuit board deviates from the initially set arrangement position, the contact element may rub against the printed circuit board. If the contact element rubs against the printed circuit board, the plating of the contact element may be peeled off or the printed circuit board components may adhere to the contact area with the land, resulting in poor electrical connection between the contact element and the land. is there. Further, the separation distance between the first holder and the printed circuit board and the separation distance between the second holder and the printed circuit board at the time of contact between the insertion guide element and the wedge of the corresponding insertion guide element are the originally planned separation distances. There is a risk of deviation from the distance. If the separation distance is deviated, the contact pressure between the land and the contact element may deviate from the initially set contact pressure and become unstable.

  In view of the above problems, an object of the present invention is to provide an electronic device in which electrical connection failure is prevented and contact pressure is prevented from becoming unstable.

  In order to achieve the above object, an invention according to claim 1 is provided to insert an electronic substrate having a plurality of electrodes formed on at least one of the front surface and the back surface of the end portion, and the end portion of the electronic substrate. A housing having an electronic board insertion groove formed therein, and a card edge connector having a terminal fixed to the housing, and by inserting an end of the electronic board into the electronic board insertion groove, the electrode and the terminal An electronic device in contact with a contact portion provided in an electronic substrate insertion groove, wherein the electronic substrate is formed with a recess that opens at least on a surface where the electrode is formed, and the recess is formed in the direction in which the electronic substrate is removed from the electrode The housing is opposed to each other at a predetermined interval in the thickness direction of the electronic substrate, so that the two opposing portions forming the electronic substrate insertion groove and the two opposing portions are separated and close to each other Do In addition, a connecting portion that connects the two facing portions, and a spring portion that constantly applies a spring force to the two facing portions so that the two facing portions are close to each other. The terminal is fixed to the opposing part, and the convex part protruding into the electronic board insertion groove is formed in the opposing part to which the terminal is fixed, and the length in the thickness direction is in contact with the concave part. The convex portion is longer than the convex portion, and the convex portion is separated from the contact portion in the removal direction.When the convex portion comes into contact with the electrode formation surface when the electronic substrate is inserted into the electronic substrate insertion groove, the spring The two opposing parts are separated from each other with the connecting part as a fulcrum while resisting the spring force of the part, so that the contact part is separated from the electronic substrate, the contact part and the electronic substrate are not in contact, and the convex part is the electrode. The edge of the electronic substrate is inserted into the electronic substrate insertion groove while rubbing against the forming surface of the electronic substrate, When the end portion is completely inserted into the electronic substrate insertion groove, the two opposing portions approach each other with the connecting portion as a fulcrum by the spring force of the spring portion, so that the convex portion falls into the concave portion, and the contact portion becomes the electronic substrate. The contact portion and the electrode come into contact with each other.

  Thus, in the electronic device according to the present invention, when the electronic substrate is inserted into the electronic substrate insertion groove, the convex portion formed in the opposing portion and the electronic substrate come into contact with each other so that the two opposing portions are spring portions. They resist each other while resisting the spring force. According to this, when the insertion guide element provided in the holder and the wedge of the corresponding insertion guide element provided in the storage device come into contact with each other, the first holder and the second holder are affected by the spring force of the spring element. Unlike the configuration in which they are separated from each other while resisting, the separation distance between one facing portion and the electronic substrate, and the separation distance between the other facing portion and the electronic substrate may deviate from the originally planned separation distance. It is suppressed. Therefore, it is suppressed that the contact pressure between the electrode and the contact portion deviates from the initially set contact pressure and becomes unstable. In addition, when the electronic substrate is inserted into the electronic substrate insertion groove, the end of the electronic substrate is inserted into the electronic substrate insertion groove while the contact portion and the electronic substrate are not in contact with each other, so that the plating of the contact portion is peeled off. As a result of the falling or the components of the electronic substrate adhering to the contact portion of the contact portion with the electrode, it is possible to suppress a poor electrical connection between the terminal and the contact portion (electrode).

  According to a second aspect of the present invention, a plurality of concave portions are formed on the electronic substrate, and a plurality of convex portions are formed on the housing, and the plurality of convex portions are formed along the electrode formation surface in the insertion direction of the electronic substrate. A configuration in which they are arranged in an orthogonal lateral direction is preferable.

  For example, when a warp that is convex in the thickness direction occurs in the electronic substrate, the distance between the electronic substrate (formation surface) and the contact portion in the thickness direction is locally close, and the electronic substrate insertion groove of the electronic substrate There is a possibility that the electronic substrate and the contact portion come into contact with each other during insertion into the device. On the other hand, as described in claim 2, in the case of a configuration in which a plurality of convex portions are formed in the opposing portion, the plurality of convex portions is smaller than a configuration in which a single convex portion is formed in the opposing portion. Since it is easy to contact according to the curvature of an electronic substrate, it is suppressed that the distance of an electronic substrate (formation surface) and a contact part in the thickness direction approaches. Thereby, the contact between the electronic substrate and the contact portion can be suppressed when the electronic substrate is inserted into the electronic substrate insertion groove.

  The inner wall surface that forms the electronic substrate insertion groove in the facing portion is formed on the inner wall surface and the electrode formation surface when the end portion of the electronic substrate is completely inserted into the electronic substrate insertion groove. A configuration in which a positioning portion that comes into contact with the electrode formation surface is formed so as to be parallel to each other is preferable. According to this, since the parallelism between the inner wall surface and the forming surface is ensured by the positioning portion when the electronic substrate is completely inserted into the electronic substrate insertion groove, the distance in the thickness direction between the contact portion and the electrode is ensured. Becomes constant, and variation in contact pressure between the contact portion and the electrode is suppressed.

  According to a fourth aspect of the present invention, a configuration in which a part of the positioning portion is formed in a part of the inner wall surface that is separated in the removal direction from the position where the convex portion is formed is preferable. According to this, unlike the configuration in which the positioning portion is formed only in a portion away from the formation position of the convex portion on the inner wall surface in the insertion direction, the inner wall surface is inserted when the electronic substrate is inserted into the electronic substrate insertion groove. Since the formation surface is parallel, the electronic substrate can be easily inserted into the electronic substrate insertion groove.

  As described in claim 5, the recess preferably has a configuration in which the front surface and the back surface of the electronic substrate communicate with each other. According to this, the length in the thickness direction of the convex portion can be determined without depending on the shape of the concave portion. Further, since the length in the thickness direction of the convex portion can be set to the maximum thickness of the electronic substrate, the separation distance between the two opposing portions when the electronic substrate is inserted into the electronic substrate insertion groove. Can be lengthened. Thereby, it is suppressed more effectively that a contact part contacts an electronic substrate.

  As described in claim 6, a configuration in which a convex portion is formed on each of the two facing portions is preferable. When the electronic substrate is warped, the distance between the electronic substrate (formation surface) and the contact portion in the thickness direction is locally close, so when inserting the electronic substrate into the electronic substrate insertion groove, There is a risk of contact with the contact portion. In addition, since it is not known whether the warpage of the electronic substrate is convex on one opposing part side or convex on the other opposing part side, in the case of a configuration in which convex parts are formed only on one opposing part side, When the electronic substrate is inserted into the electronic substrate insertion groove, the contact between the electronic substrate and the contact portion may not be suppressed. On the other hand, as described in claim 6, in the case where the convex portions are formed on each of the two opposing portions, each opposing portion is separated from the electronic substrate by about the length in the thickness direction of the convex portions. Therefore, even if a warp that is convex on one opposing portion side or the other opposing portion side occurs in the electronic substrate, the distance between the electronic substrate (formation surface) and the contact portion in the thickness direction becomes closer. Is suppressed. Thereby, it is suppressed that an electronic substrate and a contact part contact when inserting in an electronic substrate insertion groove | channel of an electronic substrate.

  As described in claim 7, the convex portions formed in each of the two opposing portions are arranged in a lateral direction perpendicular to the insertion direction of the electronic substrate along the electrode formation surface, and are mutually in the thickness direction. The structure which is not facing is preferable. According to this, it is possible to determine the length in the thickness direction of the convex portion formed in one opposing portion without depending on the length in the thickness direction of the convex portion formed in the other opposing portion. it can. In addition, since the length in the thickness direction of the convex portion can be set to the maximum thickness of the electronic substrate, the separation distance between the two opposing portions can be increased when the electronic substrate is inserted into the electronic substrate insertion groove. Can be long. Thereby, it is suppressed more effectively that a contact part contacts an opposing part.

  As described in claim 8, the convex portions formed on each of the two opposing portions are opposed to each other in the thickness direction, and the convex portions formed on each of the two opposing portions in the thickness direction are A configuration in which the sum of the lengths in the thickness direction is shorter than the interval between the two opposing portions when the end portion of the electronic substrate is completely inserted into the electronic substrate insertion groove is preferable.

  According to this, an increase in the physique of the electronic device is suppressed as compared with a configuration in which the convex portions formed in each of the two facing portions do not face each other in the thickness direction.

  Since the effect of the invention of Claims 9-12 is the same as the effect of the invention of any one of Claims 1-4, description is abbreviate | omitted.

  According to a thirteenth aspect of the present invention, the electronic substrate insertion groove is preferably partitioned into a plurality of regions by a partition wall, and one electronic substrate is inserted into each partitioned region. According to this, compared with the configuration in which the insertion guide element is provided in the holder and the corresponding insertion guide element is provided in the receiving device so as to be positioned on both sides of the printed board, the lateral length of the partition wall is reduced. can do. Accordingly, an increase in the size of the electronic device is suppressed.

  As described in claim 14, in each of the two facing portions, the facing interval between the opening ends located on the side opposite to the coupling end with the coupling portion is gradually increased toward the removal direction. A configuration in which the length in the thickness direction of the opening end of each of the two opposing portions is shortened is preferable. This facilitates the insertion of the electronic substrate into the electronic substrate insertion groove as compared with a configuration in which the length of the opening end in the thickness direction is the same.

It is an exploded sectional view showing a schematic structure of an electronic device concerning a 1st embodiment. It is sectional drawing which follows the II-II line | wire of FIG. It is sectional drawing which follows the III-III line of FIG. It is sectional drawing which shows the insertion middle of an electronic board | substrate. It is sectional drawing which shows the state in which the electronic substrate was inserted completely. It is sectional drawing which follows the VI-VI line of FIG. It is a figure which shows the modification of an electronic device, (a) is an exploded sectional view in which the convex part was formed in the 2nd opposing part, (b) is an exploded sectional view in which the convex part was formed in the 1st opposing part. . It is a top view for showing the modification of an electronic device. It is a top view for showing the modification of an electronic device. It is a top view for showing the modification of an electronic device. It is sectional drawing which shows the insertion process of an electronic board | substrate in case the curvature generate | occur | produced in the electronic board | substrate. It is a figure for demonstrating a positioning part, (a) is an exploded sectional view, (b) is an expanded sectional view of a 1st opposing part. It is a top view for demonstrating a positioning part. It is a figure which shows the insertion process of an electronic board | substrate, (a) is sectional drawing, (b) is sectional drawing which follows a XIVb-XIVb line. It is a figure which shows the state by which the electronic substrate was inserted completely, (a) is sectional drawing, (b) is sectional drawing which follows a XVb-XVb line. It is a top view for demonstrating the modification of an electronic device. It is sectional drawing of the electronic device shown in FIG. 16 in the state in the middle of insertion of an electronic board | substrate. It is a top view for demonstrating the modification of an electronic device. It is an exploded sectional view showing a schematic structure of an electronic device concerning a 2nd embodiment. It is sectional drawing which follows the XX-XX line of FIG. It is sectional drawing which follows the XXI-XXI line | wire of FIG. It is sectional drawing which shows the insertion middle of an electronic board | substrate. It is sectional drawing which shows the state in which the electronic substrate was inserted completely. It is a figure which shows the modification of an electronic device, (a) is an exploded sectional view in which the convex part was formed in the back surface of an electronic substrate, (b) is an exploded sectional view in which the convex part was formed in the surface of the electronic substrate. . It is an exploded sectional view showing a modification of an electronic device. It is sectional drawing which follows the XXVI-XXVI line | wire of FIG. FIG. 26 is a cross-sectional view illustrating a state where the electronic substrate is completely inserted in the electronic device illustrated in FIG. 25.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is an exploded cross-sectional view illustrating a schematic configuration of the electronic device according to the first embodiment. 2 is a cross-sectional view taken along line II-II in FIG. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a cross-sectional view showing the electronic substrate being inserted. FIG. 5 is a cross-sectional view showing a state where the electronic substrate is completely inserted. 6 is a cross-sectional view taken along the line VI-VI in FIG. 2, 3 and 6, a groove 29 described later is omitted.

  In the following, the direction in which the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 along the front surface 10a and the back surface 10b of the electronic substrate 10 is referred to as the insertion direction, and the reverse direction of the insertion direction is referred to as the removal direction. Moreover, the direction orthogonal to the front surface 10a and the back surface 10b of the electronic substrate 10 is referred to as a height direction, and the direction orthogonal to the insertion direction and the height direction is referred to as a horizontal direction. The height direction corresponds to the thickness direction described in the claims.

  As shown in FIGS. 1 and 2, the electronic device 100 includes an electronic substrate 10 in which a plurality of electrodes 12 are formed at an end portion 11, and an electronic substrate insertion groove 21 for inserting the end portion 11 of the electronic substrate 10. A housing 20 formed, a card edge connector 40 having a terminal 30 in contact with the electrode 12 formed at the end 11, a box 50 having an opening, and a case 50 for housing the electronic substrate 10; It has. As shown in FIGS. 5 and 6, when the end portion 11 of the electronic substrate 10 is completely inserted into the electronic substrate insertion groove 21, the electrode 12 and the terminal 30 are brought into contact with each other and are electrically connected to each other. A part of the housing 20 (card edge connector 40) including the board insertion groove 21 is accommodated in the case 50.

  The electronic substrate 10 includes an electronic element (not shown) and a wiring pattern (not shown) electrically connected to the electronic element. As shown in FIGS. 1 and 2, electrodes 12 corresponding to the terminal terminals of the wiring pattern described above are formed on the front surface 10a and the back surface 10b of the end portion 11 inserted into the electronic substrate insertion groove 21 in the electronic substrate 10. In the electronic substrate 10, a recess 13 is formed in a region closer to the center than the electrode 12.

  The electrode 12 has a front surface electrode 12a formed on the front surface 10a and a back surface electrode 12b formed on the back surface 10b. As shown in FIG. 2, the plurality of electrodes 12 a and 12 b have a planar rectangular shape and are arranged along the lateral direction with a predetermined interval. The front electrode 12a and the back electrode 12b are arranged at positions facing each other with the electronic substrate 10 in between. In other words, the projection position of the front electrode 12a on the back surface 10b matches the formation position of the back electrode 12b, and the projection position of the back electrode 12b on the surface 10a matches the formation position of the front electrode 12a. Electrodes 12a and 12b are arranged. The recess 13 is a feature of the electronic device 100 according to the present embodiment, and will be described in detail later. In the present embodiment, the front and back surfaces 10a and 10b correspond to the terminal forming surfaces described in the claims.

  The housing 20 is for electrically connecting the terminal 30 and the electrode 12 while holding the electronic substrate 10. The housing 20 is opposed to each other at a predetermined interval in the height direction, so that the two facing portions 22 and 23 forming the electronic board insertion groove 21 and the two facing portions 22 and 23 are separated and close to each other. As described above, the connecting portion 24 that connects the two facing portions 22 and 23 and the spring portion 25 that always applies a spring force to the two facing portions 22 and 23 so that the two facing portions 22 and 23 are close to each other. And a box portion 26 that surrounds the opposing portions 22 and 23 and is assembled with the case 50.

  Each of the facing portions 22 and 23 has a planar rectangular shape with the main surface facing the height direction, one end portions 22a and 23a are connected by a connecting portion 24, and the other end portions 22b and 23b are electronic substrates. An opening of the insertion groove 21 is configured. In this embodiment, the terminal 30 is fixed to each of the facing portions 22 and 23, and the contact portions 31 a and 31 b protrude into the electronic substrate insertion groove 21 from the facing surfaces 22 c and 23 c of the facing portions 22 and 23. And the length (thickness) of the height direction of each edge part 22b and 23b was shortened so that the opposing space | interval of the opposing parts 22 and 23 may become large gradually as it goes to the extraction direction. is doing. In the present embodiment, the opposing portions 22 and 23 are respectively fitted with the concave portion 13, the convex portion 27 protruding into the electronic substrate insertion groove 21, and the front and back both surfaces 10 a and 10 b of the electronic substrate 10. A positioning portion 28 that determines the position of the electronic substrate 10 is formed so that 22c and 23c are parallel to each other. As shown in FIG. 2, the positioning portion 28 according to the present embodiment has a planar rectangular shape whose length direction extends in the insertion direction (extraction direction), and extends from the convex portion 27 in the insertion direction. The facing interval between the positioning portions 28 formed in the facing portions 22 and 23 is smaller than the facing interval between the facing surfaces 22c and 23c, and the facing interval is about the thickness of the electronic substrate 10. . The convex portion 27 is a feature point of the electronic device 100 according to the present embodiment, and will be described in detail later. The end portions 22a and 23a described above correspond to connection ends described in the claims, and the end portions 22b and 23b correspond to opening ends described in the claims. Moreover, the opposing surfaces 22c and 23c are equivalent to the inner wall surface as described in a claim.

  As shown in FIG. 3, the spring portion 25 is a clamp spring formed by connecting a single metal wire bent in a zigzag manner in an annular shape. The spring portion 25 surrounds the periphery of the facing portions 22 and 23, and is provided in a groove 29 formed on the outer surface of each of the facing portions 22 and 23, as shown in FIG.

  The box portion 26 has a box shape that opens to the electronic substrate 10 side, and surrounds the facing portions 22 and 23, the connecting portion 24, and the spring portion 25. As the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the box portion 26 and the case 50 are fitted together.

  The terminal 30 is provided on the facing portions 22 and 23 so that one end (contact portion) protrudes into the electronic substrate insertion groove 21. The terminal 30 has the 1st terminal 30a which contacts the surface electrode 12a, and the 2nd terminal 30b which contacts the back surface electrode 12b. Each of the plurality of terminals 30a and 30b is arranged along the horizontal direction at a predetermined interval, and the contact portion 31a of the first terminal 30a and the contact portion 31b of the second terminal 30b face each other. Although not illustrated, the terminal 30 according to the present embodiment is a part of a male terminal fixed to the end of the harness, and a terminal insertion hole for inserting the terminal 30 is formed in each of the facing portions 22 and 23. Has been. When the terminal 30 and the electrode 12 are in contact with each other, the harness and the electronic substrate 10 are electrically connected.

  The case 50 is fitted with the housing 20 to close the storage space for the electronic substrate 10 and stores the electronic substrate 10 in an internal space formed by the case 50 and the housing 20. The case 50 has a box shape having an opening, and a groove (not shown) that guides the insertion of the electronic substrate 10 into the case 50 is formed on the inner surface of the side of the case 50. In addition to the groove portion, a support portion (not shown) for supporting the electronic substrate 10 is formed. The case 50 and the box portion 26 of the housing 20 are coupled by fitting, and the housing 50 is inserted into the case 50, whereby the case 50 and the housing 20 (card edge connector 40) are assembled.

  Next, features of the electronic device 100 according to the present embodiment will be described. As shown in FIG.1 and FIG.2, the recessed part 13 is formed in the electronic substrate 10 so that the surface 10a and the back surface 10b may be connected. The formation position of the recess 13 is determined in the lateral direction so as to be separated from the electrode 12 in the extraction direction and not aligned with the electrode 12 in the insertion direction (extraction direction). In the present embodiment, two recesses 13 are formed on the side of the electronic substrate 10 so as to sandwich the region where all the electrodes 12 are formed, and one recess 13 is formed on the first facing portion 22. The formed convex part 27 and the convex part 27 formed in the 2nd opposing part 23 become a structure each fitted (inserted) one each.

  As shown in FIG. 1, the convex portions 27 formed in the facing portions 22 and 23 are opposed to each other in the height direction, and the length of the convex portion 27 in the height direction is the contact portions 31 a and 31 b. Longer than. Further, as shown in FIGS. 5 and 6, the sum of the lengths in the height direction of the convex portions 27 formed in the facing portions 22 and 23 is determined so that the end portion 11 of the electronic substrate 10 extends to the electronic substrate insertion groove 21. It is shorter than the interval between the two opposing portions 22 and 23 at the time of complete insertion. As shown in FIG.1 and FIG.2, the formation position of the convex part 27 is separated in the extraction direction from the contact parts 31a and 31b, so that it does not line up with the contact parts 31a and 31b in the insertion direction (extraction direction). The lateral position has been determined. In the present embodiment, two convex portions 27 are formed in each of the facing portions 22 and 23, and these two convex portions 27 are arranged in the horizontal direction. The two convex portions 27 formed on the first facing portion 22 are formed on the side of the first facing portion 22 so as to sandwich the region where all the first contact portions 31a are formed, and the second facing portion The two convex portions 27 formed on the side 23 are formed on the side of the second facing portion 23 so as to sandwich the region where all the second contact portions 31b are formed. Moreover, the convex part 27 has comprised the shape which continues continuously with the slope of the edge parts 22b and 23b which comprise a taper shape.

  Next, the insertion of the electronic substrate 10 into the electronic substrate insertion groove 21 will be described with reference to FIGS. 1 and 4 to 6. As shown in FIG. 1, in a state before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the coupling angle between the facing portions 22 and 23 is zero, and the facing portions 22 and 23 and the coupling portion 24 are The cross-sectional shape formed by is U-shaped.

  When the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the end portion 11 of the electronic substrate 10 is tapered at the end portions 22 b and 23 b of the opposing portions 22 and 23 that form a tapered shape, or at the convex portion 27. Contact with a portion having a shape continuously connected to the slopes of the end portions 22b and 23b, so that the center in the height direction of the electronic substrate 10 coincides with the center between the facing portions 22 and 23 by the slope. The end portion 11 of the electronic substrate 10 is guided to the opening of the electronic substrate insertion groove 21. When the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 so that the convex portion 27 and the front and back surfaces 10a and 10b of the electronic substrate 10 are in contact with each other while resisting the spring force of the spring portion 25, the insertion In the process, as shown in FIG. 4, the facing portions 22 and 23 are separated from each other with the connecting portion 24 as a fulcrum, and the connecting angle of the facing portions 22 and 23 changes from zero to an acute angle. The cross-sectional shape formed by the connecting portion 24 changes from a U shape to a U shape. As a result, the contact portions 31 a and 31 b are separated from the electronic substrate 10. As described above, the length of the convex portion 27 in the height direction is longer than that of the contact portions 31a and 31b. Therefore, while the electronic substrate 10 is being inserted into the electronic substrate insertion groove 21, the convex portion 27 and the front and back surfaces 10a and 10b are in contact with each other and rubbed, but the contact portions 31a and 31b and the electronic substrate 10 are not in contact with each other. In the contact state, the end portion 11 of the electronic substrate 10 is inserted into the back of the electronic substrate insertion groove 21. When the end portion 11 of the electronic substrate 10 is completely inserted into the electronic substrate insertion groove 21 and the convex portion 27 is positioned immediately above the concave portion 13, as shown in FIGS. 5 and 6, due to the spring force of the spring portion 25, The two opposing portions 22 and 23 are close to each other with the connecting portion 24 as a fulcrum, the convex portion 27 falls into the concave portion 13, the contact portions 31a and 31b approach the electronic substrate 10, and the contact portions 31a and 31b and the electrodes 12a, 12b contacts. Further, the electronic substrate 10 is sandwiched by the positioning portions 28 formed in the facing portions 22 and 23, respectively, so that the front and back surfaces 10a and 10b and the facing surfaces 22c and 23c are parallel to each other. As a result, the distance between the facing surface 22c and the front surface 10a and the distance between the facing surface 23c and the back surface 10b in the height direction are constant.

  Next, functions and effects of the electronic device 100 according to the present embodiment will be described. As described above, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the convex portions 27 formed on the facing portions 22 and 23 and the front and back surfaces 10 a and 10 b of the electronic substrate 10 come into contact with each other. The two opposing portions 22 and 23 are separated from each other while resisting the spring force of the spring portion 25. According to this, when the insertion guide element provided in the holder and the wedge of the corresponding insertion guide element provided in the storage device come into contact with each other, the first holder and the second holder are affected by the spring force of the spring element. Unlike the configurations that are separated from each other while resisting, the separation distance between the first facing portion 22 and the electronic substrate 10 and the separation distance between the second facing portion 23 and the electronic substrate 10 are the initially planned separation distances. Displacement is suppressed. Therefore, it is suppressed that the contact pressure between the electrodes 12a and 12b and the contact portions 31a and 31b deviates from the initially set contact pressure and becomes unstable. Further, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 while the contact portions 31 a and 31 b and the electronic substrate 10 are not in contact with each other. Therefore, as a result of the plating of the contact portions 31a and 31b being peeled off or the components of the electronic substrate 10 being attached to the contact portions of the contact portions 31a and 31b with the electrodes 12a and 12b, the terminals 30 and 12 The occurrence of poor electrical connection is suppressed.

  When the end portion 11 of the electronic substrate 10 is completely inserted into the electronic substrate insertion groove 21, the electronic substrate 10 is sandwiched by the positioning portions 28 formed in the facing portions 22 and 23, and both the front and back surfaces 10a and 10b and the facing surface 22c are sandwiched. 23c are parallel to each other, and the distance between the facing surface 22c and the front surface 10a and the distance between the facing surface 23c and the back surface 10b in the height direction are constant. According to this, since the distance between the first contact part 31a and the front electrode 12a and the distance between the second contact part 31b and the back electrode 12b in the height direction are constant, the contact parts 31a, 31b and It is suppressed that the contact pressure with the electrodes 12a and 12b varies.

  The front surface 10 a and the back surface 10 b are communicated with each other by the recess 13. According to this, the length of the convex portion 27 in the height direction can be determined without depending on the shape of the concave portion 13.

  When the electronic substrate 10 has a warp that is convex in the height direction, the distance between the electronic substrate 10 and the contact portion 31a (31b) in the height direction is locally close. There is a possibility that the electronic substrate 10 and the contact portion 31a (31b) may come into contact with each other when inserted into the substrate insertion groove 21. On the other hand, in the present embodiment, two convex portions 27 are formed side by side in each of the facing portions 22 and 23. According to this, compared with the configuration in which the single convex portion 27 is formed on the facing portions 22 and 23, the two convex portions 27 are easy to contact according to the warp of the electronic substrate 10, so It is suppressed that the distance of the board | substrate 10 and contact part 31a, 31b approaches. Thereby, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the electronic substrate 10 and the contact portions 31a and 31b are prevented from coming into contact with each other.

  Note that it is not known whether the warpage of the electronic substrate 10 is convex toward the first opposing portion 22 side or convex toward the second opposing portion 23 side. Therefore, when the convex portion 27 is formed only in the first opposing portion 22 or the second opposing portion 23, the electronic substrate 10 and the first contact portion 31a or the electronic substrate 10 are inserted into the electronic substrate insertion groove 21 when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21. There is a possibility that the contact between the electronic substrate 10 and the second contact portion 31b cannot be suppressed. On the other hand, in this embodiment, the convex part 27 is formed in each of the two opposing parts 22 and 23. According to this, since each opposing part 22 and 23 is separated from the electronic board | substrate 10 about the length of the height direction of the convex part 27, it is convex on the 1st opposing part 22 side or the 2nd opposing part 23 side. Even if the resulting warpage occurs in the electronic substrate 10, the distance between the electronic substrate 10 and the contact portions 31a and 31b in the height direction is suppressed. Thereby, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the electronic substrate 10 and the contact portions 31a and 31b are prevented from coming into contact with each other.

  The convex portions 27 formed in each of the two facing portions 22 and 23 are opposed to each other in the height direction, and the sum of the lengths in the height direction of the convex portions 27 formed in the facing portions 22 and 23, respectively. Is shorter than the distance between the two facing portions 22 and 23 when the end portion 11 of the electronic substrate 10 is completely inserted into the electronic substrate insertion groove 21. According to this, the increase in the physique of the electronic device 100 is suppressed as compared with a configuration in which the convex portions 27 formed on the two facing portions 22 and 23 are not opposed to each other in the height direction.

  Each of the end portions 22b and 23b has a tapered shape in which the length (thickness) in the height direction is shortened so that the facing interval between the facing portions 22 and 23 gradually increases toward the removal direction. Yes. Moreover, the convex part 27 has comprised the shape which continues continuously with the inclined surface of the edge parts 22b and 23b which comprise a taper shape. According to this, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the height of the electronic substrate 10 and the center between the facing portions 22 and 23 coincide with each other in the height direction of the electronic substrate 10. Since the end portion 11 is guided to the opening of the electronic substrate insertion groove 21, the electronic substrate 10 can be easily inserted into the electronic substrate insertion groove 21.

  The formation position of the recess 13 is determined so as not to line up with the electrode 12 in the insertion direction (extraction direction). Moreover, the formation position of the horizontal direction is determined so that the convex part 27 may not line up with contact part 31a, 31b in an insertion direction (extraction direction). According to this, at the time of inserting the electronic substrate 10 into the electronic substrate insertion groove 21, the rubbing between the convex portion 27 and the electrode 12 is suppressed, and the plating of the electrode 12 is suppressed from peeling off.

  In the present embodiment, an example is shown in which the terminals 30 are fixed to the facing portions 22 and 23, the convex portions 27 are formed, and the electrodes 12 are formed on the front and back surfaces 10 a and 10 b of the electronic substrate 10. However, as shown in FIG. 7, the terminal 30 is fixed to one of the facing portions 22 and 23, and the convex portion 27 is formed on the facing portion 22 (23) to which the terminal 30 is fixed, so as to face the terminal 30. It is also possible to adopt a configuration in which the electrode 12 is formed only on the opposing surface (front surface 10a or back surface 10b) of the electronic substrate 10 to be performed. Although not shown, a convex portion 27 is formed on each of the facing portions 22 and 23, the terminal 30 is fixed to one of the facing portions 22 and 23, and the facing surface (surface 10a) of the electronic substrate 10 facing the terminal 30. Alternatively, a configuration in which the electrode 12 is formed only on the back surface 10b) can be adopted. 7A and 7B are diagrams illustrating a modification of the electronic device, in which FIG. 7A is an exploded cross-sectional view in which a convex portion is formed in the second facing portion, and FIG. 7B is an exploded view in which the convex portion is formed in the first facing portion. It is sectional drawing.

  In this embodiment, the example in which the two convex parts 27 were formed in the opposing parts 22 and 23 was shown. However, as shown to FIGS. 8-11, the number of the convex parts 27 formed in the opposing parts 22 and 23 is not limited to the said example, Any number may be sufficient. However, when the electronic substrate 10 has a warp that is convex in the height direction, as shown in FIG. 11, the vertex of the warp is located at the center in the lateral direction of the electronic substrate 10, so The structure formed in the site | part facing the center of the horizontal direction of the electronic substrate 10 in the parts 22 and 23 is preferable. In FIG. 8, one convex portion 27 is formed at a portion facing the lateral center of the electronic substrate 10 in the facing portions 22 and 23, and in FIG. 9, two convex portions 27 are formed in the facing portions 22 and 23. A convex portion 27 is formed in a region sandwiching a portion facing the lateral center of the electronic substrate 10, and in FIGS. 10 and 11, one convex portion 27 is formed in the facing portions 22 and 23 facing the lateral center of the electronic substrate 10. Two convex portions 27 are formed side by side on the side portions of the facing portions 22 and 23. 8 to 10 are top views for illustrating modifications of the electronic device. FIG. 11 is a cross-sectional view illustrating a state in which the electronic substrate is being inserted when the electronic substrate is warped.

  In the present embodiment, as shown in FIGS. 1 and 2, the example in which the positioning portion 28 is formed only at a position that is separated from the formation position of the convex portion 27 in the insertion direction is shown. However, as shown in FIG. 12, the positioning portion 28 is formed not only at a position away from the formation position of the protrusion 27 in the insertion direction but also at a position away from the formation position of the protrusion 27 in the removal direction. A configuration can also be adopted. As shown in FIG. 12, the end portion of the positioning portion 28 that is further away from the forming position of the convex portion 27 in the removal direction has a shape that is continuously connected to the slopes of the tapered end portions 22b and 23b. According to this, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the height of the electronic substrate 10 and the center between the facing portions 22 and 23 coincide with each other in the height direction of the electronic substrate 10. Since the end portion 11 is guided to the opening of the electronic substrate insertion groove 21, the electronic substrate 10 can be easily inserted into the electronic substrate insertion groove 21. In addition, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the electronic substrate 10 is temporarily sandwiched by the positioning portion 28 that is separated from the formation position of the convex portion 27 in the removal direction. The insertion position of the electronic substrate 10 is determined. This also facilitates insertion of the electronic substrate 10 into the electronic substrate insertion groove 21. FIGS. 12A and 12B are diagrams for explaining the positioning portion, in which FIG. 12A is an exploded sectional view, and FIG. 12B is an enlarged sectional view of the first facing portion.

  In the present embodiment, as shown in FIG. 2, the positioning portion 28 has a planar rectangular shape whose length direction extends in the insertion direction (extraction direction), and is aligned with the convex portion 27 in the insertion direction (extraction direction). showed that. However, as shown in FIG. 13, it is also possible to employ a configuration in which a positioning portion 28 having a planar rectangular shape whose length direction extends in the lateral direction is provided between the two convex portions 27. FIG. 13 is a top view for explaining the positioning portion.

  In the present embodiment, the convex portions 27 formed on each of the two facing portions 22 and 23 are opposed to each other in the height direction, and the length in the height direction of the convex portion 27 formed on each of the facing portions 22 and 23. In the example, the sum is shorter than the distance between the two facing portions 22 and 23 when the end portion 11 of the electronic substrate 10 is completely inserted into the electronic substrate insertion groove 21. However, as shown in FIGS. 14 and 15, the convex portions 27 formed on the two opposing portions 22 and 23 are arranged in the horizontal direction and do not oppose each other in the height direction. You can also. According to this, the length in the height direction of the convex portion 27 formed on the first facing portion 22 is not dependent on the length in the height direction of the convex portion 27 formed on the second facing portion 23. Can be determined. Conversely, the length in the height direction of the convex portion 27 formed on the second opposing portion 23 is determined without depending on the length in the height direction of the convex portion 27 formed on the first opposing portion 22. be able to. Further, the length of the convex portion 27 in the height direction can be set to about the thickness of the electronic substrate 10 at the maximum. Thereby, as shown in FIG. 14, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the separation distance between the two facing portions 22 and 23 can be increased. Therefore, the contact portions 31a and 31b are more effectively suppressed from contacting the facing portions 22 and 23. 14A and 14B are diagrams showing the electronic substrate being inserted, in which FIG. 14A is a cross-sectional view and FIG. 14B is a cross-sectional view taken along line XIVb-XIVb. 15A and 15B are views showing a state in which the electronic substrate is completely inserted, in which FIG. 15A is a cross-sectional view, and FIG. 15B is a cross-sectional view taken along line XVb-XVb.

  In the present embodiment, an example in which one electronic substrate 10 is provided in the case 50 is shown. However, as shown in FIGS. 16 and 17, a configuration in which a plurality (two) of electronic substrates 10 are provided in the case 50 may be employed. In this modified example, a plurality of electronic substrates 10, an electronic substrate insertion groove 21 configured by facing portions 22 and 23 corresponding to each electronic substrate 10, and a partition wall 51 for partitioning a storage space for the case 50, The case 50 is provided. According to this, compared with the structure in which the insertion guide element is provided in the holder and the corresponding insertion guide element is provided in the storage device so as to be located on both sides of the printed board, the lateral length of the partition wall 51 is increased. Can be thinned. Therefore, an increase in the size of the electronic device 100 is suppressed. In the case of this modification, in order to suppress the increase in the lateral physique of the electronic device 100, the shape of the spring portion 25 is not an annular shape, but is preferably a U-shape as shown in FIG. FIG. 16 is a top view for explaining a modification of the electronic device. 17 is a cross-sectional view of the electronic device shown in FIG. 16 in a state where the electronic substrate is being inserted.

  In this embodiment, as shown in FIG.1 and FIG.2, the recessed part 13 showed the example which is a through-hole. However, as shown in FIG. 18, the recess 13 is not limited to the through hole, and a shape in which a part of the electronic substrate 10 is cut out may be employed. Although not shown, the recess 13 does not need to communicate the front surface 10a and the back surface 10b of the electronic substrate 10. In this case, the convex part 27 formed in one of the opposing parts 22 and 23 is inserted into one concave part 13. FIG. 18 is a top view for explaining a modification of the electronic device.

(Second Embodiment)
Next, 2nd Embodiment of this invention is described based on FIGS. FIG. 19 is an exploded cross-sectional view illustrating a schematic configuration of the electronic device according to the second embodiment, and corresponds to FIG. 1 illustrated in the first embodiment. 20 is a cross-sectional view taken along the line XX-XX in FIG. 19 and corresponds to FIG. 2 shown in the first embodiment. FIG. 21 is a cross-sectional view taken along line XXI-XXI in FIG. 19 and corresponds to FIG. 3 shown in the first embodiment. FIG. 22 is a cross-sectional view showing the electronic substrate being inserted, and corresponds to FIG. 4 shown in the first embodiment. FIG. 23 is a cross-sectional view showing a state in which the electronic board is completely inserted, and corresponds to FIG. 5 shown in the first embodiment. 20 and 21, a groove 29 described later is omitted.

  Since the electronic device 100 according to the second embodiment is often in common with that according to the first embodiment, a detailed description of the common parts will be omitted below, and different parts will be mainly described. In addition, the same code | symbol shall be provided to the element same as the element shown in 1st Embodiment.

  In 1st Embodiment, the convex part 27 was formed in the opposing parts 22 and 23, and the example in which the recessed part 13 was formed in the electronic substrate 10 was shown. On the other hand, the present embodiment is characterized in that the convex portion 60 is provided on the electronic substrate 10 and the concave portion 61 is formed on the facing portions 22 and 23.

  As shown in FIGS. 19 and 20, convex portions 60 are provided on the front and back surfaces 10 a and 10 b of the electronic substrate 10, and a part of the convex portions 60 are separated from the electrodes 12 in the insertion direction. The convex portion 60 has a planar rectangular shape, and the length in the height direction is longer than that of the contact portions 31a and 31b. In addition, an inclination is formed at the end of the convex portion 60 in the insertion direction. The convex portion 60 is an electronic component such as a capacitor or a diode, and is fixed to the electronic substrate 10 by solder 62. In addition, as the convex part 60 which concerns on this embodiment, it is not limited to the said example. For example, the screw head can be used as the convex portion 60 by screwing to the electronic substrate 10 and providing screw heads on both the front and back surfaces 10 a and 10 b of the electronic substrate 10.

  19-21, the recessed part 61 is formed in each of the opposing parts 22 and 23 so that the opposing surfaces 22c and 23c may dent locally, and is located in a line with the contact parts 31a and 31b in the horizontal direction. . A slope is formed in a portion of the wall surface forming the recess 61 on the opening side of the electronic substrate insertion groove 21.

  Next, the insertion of the electronic substrate 10 into the electronic substrate insertion groove 21 will be described with reference to FIGS. As shown in FIG. 19, in a state before the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the coupling angle between the facing portions 22 and 23 is zero, and the facing portions 22 and 23 and the coupling portion 24 are The cross-sectional shape formed by is U-shaped.

  When the end portion 11 or the convex portion 60 of the electronic substrate 10 comes into contact with the end portions 22b and 23b of the opposing portions 22 and 23 having a tapered shape when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the inclined surface thereof. Thus, the end portion 11 of the electronic substrate 10 is guided to the opening of the electronic substrate insertion groove 21 so that the center of the electronic substrate 10 in the height direction and the center between the facing portions 22 and 23 coincide. When the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 so that the convex portion 60 and the opposing surfaces 22c, 23c of the opposing portions 22, 23 are in contact with each other while resisting the spring force of the spring portion 25, As shown in FIG. 22, the facing portions 22 and 23 are separated from each other with the connecting portion 24 as a fulcrum, so that the connecting angle of the facing portions 22 and 23 changes from zero to an acute angle. The cross-sectional shape formed by and changes from a U shape to a U shape. As a result, the contact portions 31 a and 31 b are separated from the electronic substrate 10. As described above, since the length in the height direction of the convex portion 60 is longer than that of the contact portions 31a and 31b, the contact is made while the electronic substrate 10 is being inserted into the electronic substrate insertion groove 21. In a state where the portions 31a and 31b and the electronic substrate 10 are not in contact with each other, the end portion 11 of the electronic substrate 10 is inserted into the back of the electronic substrate insertion groove 21 while the convex portion 60 rubs against the opposing surfaces 22c and 23c. When the end portion 11 of the electronic substrate 10 is completely inserted into the electronic substrate insertion groove 21 and the convex portion 60 is positioned immediately above the concave portion 61, the two opposing portions 22 and 23 are connected by the spring force of the spring portion 25. 24, the convex portion 60 falls into the concave portion 61, the contact portions 31a and 31b approach the electronic substrate 10, and the contact portions 31a and 31b and the electrodes 12a and 12b come into contact with each other.

  As described above, in the present embodiment, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the convex portions 60 formed on the electronic substrate 10 and the opposed surfaces 22 c and 23 c of the opposed portions 22 and 23. , The two facing portions 22 and 23 are separated from each other while resisting the spring force of the spring portion 25. According to this, when the insertion guide element provided in the holder and the wedge of the corresponding insertion guide element provided in the storage device come into contact with each other, the first holder and the second holder are affected by the spring force of the spring element. Unlike the configurations that are separated from each other while resisting, the separation distance between the first facing portion 22 and the electronic substrate 10 and the separation distance between the second facing portion 23 and the electronic substrate 10 are the initially planned separation distances. Displacement is suppressed. Therefore, as in the first embodiment, the contact pressure between the electrodes 12a, 12b and the contact portions 31a, 31b is prevented from becoming unstable due to deviation from the initially set contact pressure. Further, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the end portion 11 of the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 while the contact portions 31 a and 31 b and the electronic substrate 10 are not in contact with each other. Therefore, as a result of the plating of the contact portions 31a and 31b being peeled off or the components of the electronic substrate 10 being attached to the contact portions of the contact portions 31a and 31b with the electrodes 12a and 12b, the terminals 30 and 12 The occurrence of poor electrical connection is suppressed.

  The above is the main function and effect of the electronic device 100 according to the second embodiment. About the effect equivalent to the electronic device 100 which concerns on 1st Embodiment, in order to avoid that description overlaps, description is abbreviate | omitted.

  In the present embodiment, the terminal 30 is fixed to each of the facing portions 22 and 23, the concave portion 61 is formed, the electrodes 12 are formed on the front and back surfaces 10 a and 10 b of the electronic substrate 10, and the convex portion 60 is provided. Indicated. However, as shown in FIG. 24, the terminal 30 is fixed to one of the facing portions 22 and 23, and the recessed portion 61 is formed in the facing portion 22 (23) to which the terminal 30 is fixed to face the terminal 30. A configuration in which the electrode 12 is formed only on the opposing surface (the front surface 10a or the back surface 10b) of the electronic substrate 10 and the convex portion 60 is provided can also be adopted. Although not shown, a concave portion 61 is formed in each of the facing portions 22 and 23, the terminal 30 is fixed to one of the facing portions 22 and 23, and the facing surface (surface 10a or surface) of the electronic substrate 10 facing the terminal 30. It is also possible to adopt a configuration in which the electrode 12 is formed only on the back surface 10b) and the convex portions 60 are provided on the front and back surfaces 10a and 10b. FIG. 24 is a diagram illustrating a modification of the electronic device, where (a) is an exploded cross-sectional view in which a convex portion is formed on the back surface of the electronic substrate, and (b) is an exploded view in which the convex portion is formed on the surface of the electronic substrate. It is sectional drawing.

  As shown in the first embodiment, the configuration in which the positioning portion 28 is formed in the facing portions 22 and 23 can also be adopted in the second embodiment. In the configuration shown in FIGS. 25 to 27, the positioning portion 28 is formed at a position farther in the insertion direction than the position where the recess 61 is formed in the facing portions 22 and 23, and a position away in the removal direction. The end portion of the positioning portion 28 that is further away from the formation position of the recess 61 in the removal direction is formed so as to be continuously connected to the inclined surfaces of the end portions 22b and 23b having a tapered shape. According to this, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the height of the electronic substrate 10 and the center between the facing portions 22 and 23 coincide with each other in the height direction of the electronic substrate 10. Since the end portion 11 is guided to the opening of the electronic substrate insertion groove 21, the electronic substrate 10 can be easily inserted into the electronic substrate insertion groove 21. In addition, when the electronic substrate 10 is inserted into the electronic substrate insertion groove 21, the electronic substrate 10 is temporarily sandwiched by the positioning portion 28 that is separated from the formation position of the recess 61 in the removal direction. The insertion position of the electronic substrate 10 is determined. This also facilitates insertion of the electronic substrate 10 into the electronic substrate insertion groove 21. Furthermore, when the electronic substrate 10 is completely inserted into the electronic substrate insertion groove 21, the electronic substrate 10 is sandwiched by the positioning portions 28 formed in the facing portions 22 and 23, respectively, and the front and back surfaces 10a and 10b The opposing surfaces 22c and 23c are parallel to each other. As a result, the distance between the facing surface 22c and the front surface 10a and the distance between the facing surface 23c and the back surface 10b in the height direction are constant. As a result, the distance between the first contact portion 31a and the front surface electrode 12a and the distance between the second contact portion 31b and the back surface electrode 12b are constant, and the contact pressure between the contact portions 31a and 31b and the electrodes 12a and 12b is reduced. Variations are suppressed. FIG. 25 is an exploded cross-sectional view showing a modification of the electronic device. 26 is a cross-sectional view taken along line XXVI-XXVI in FIG. FIG. 27 is a cross-sectional view showing a state where the electronic substrate is completely inserted in the electronic device shown in FIG.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In each embodiment, the surface electrode 12a and the back surface electrode 12b showed the example arrange | positioned in the position which opposes via the electronic board | substrate 10. As shown in FIG. However, the front electrode 12a and the back electrode 12b do not have to face each other.

  In each embodiment, the example in which the terminal 30 is a part of the male terminal fixed to the end of the harness is shown. However, the terminal 30 is not limited to the above example, and may be, for example, a metal pin insert-molded on the facing portions 22 and 23. In this case, the female terminal fixed to the end of the harness is inserted into the terminal insertion hole formed in the facing portions 22 and 23, and the female terminal and the terminal 30 are in contact and electrically connected. It becomes. The harness and the electrode 12 (electronic substrate 10) are electrically connected via the female terminal and the terminal 30.

  In each embodiment, the example which the 1st contact part 31a and the 2nd contact part 31b oppose each other was shown. However, the first contact portion 31a and the second contact portion 31b do not have to face each other.

  In each embodiment, an example in which the electronic substrate 10 is inserted into the electronic substrate insertion groove 21 has been described. However, what is inserted into the electronic substrate insertion groove 21 is not limited to the electronic substrate 10 and may be appropriately adopted as long as the electrode 12 is formed on either one of the front and back surfaces of a rectangular member. be able to.

DESCRIPTION OF SYMBOLS 10 ... Electronic substrate 12 ... Electrode 13 ... Concave 20 ... Housing 22, 23 ... Opposing part 27 ... Convex part 30 ... Terminal 40 ... Card edge connector 50 ... Case 60 ... convex part 61 ... concave part 100 ... electronic device

Claims (14)

An electronic substrate having a plurality of electrodes formed on at least one of the front surface and the back surface thereof;
A housing in which an electronic board insertion groove for inserting an end of the electronic board is formed, and a card edge connector having a terminal fixed to the housing,
An electronic device in which an end of the electronic substrate is inserted into the electronic substrate insertion groove so that the electrode and a contact portion provided in the electronic substrate insertion groove in the terminal are in contact with each other,
The electronic substrate is formed with a recess that opens at least in the formation surface of the electrode,
The recess is away from the electrode in the direction of removing the electronic substrate,
The housing is
Two opposing parts forming the electronic substrate insertion groove by facing each other at a predetermined interval in the thickness direction of the electronic substrate;
A connecting portion that connects the two facing portions such that the two facing portions are separated and close to each other;
A spring part that constantly applies a spring force to the two opposing parts so that the two opposing parts are close to each other,
The terminal is fixed to a facing portion facing the electrode formation surface of the electronic substrate,
A protruding portion that fits into the recessed portion and protrudes into the electronic substrate insertion groove is formed in the facing portion to which the terminal is fixed,
The length in the thickness direction is longer in the convex portion than in the contact portion,
The convex portion is separated from the contact portion in the extraction direction,
At the time of inserting the electronic substrate into the electronic substrate insertion groove, when the convex portion comes into contact with the formation surface of the electrode, the two opposing portions support the connecting portion while resisting the spring force of the spring portion. As the distance from each other, the contact portion separates from the electronic substrate,
In a state where the contact portion and the electronic substrate are not in contact with each other, the end portion of the electronic substrate is inserted into the electronic substrate insertion groove while the convex portion rubs against the formation surface of the electrode.
When the end portion of the electronic substrate is completely inserted into the electronic substrate insertion groove, the two opposing portions come close to each other with the connecting portion as a fulcrum by the spring force of the spring portion. An electronic device, wherein the electronic device falls into the concave portion, the contact portion approaches the electronic substrate, and the contact portion and the electrode are in contact with each other. A plurality of the recesses are formed in the electronic substrate;
A plurality of the convex portions are formed on the housing,
2. The electronic device according to claim 1, wherein the plurality of convex portions are arranged in a lateral direction perpendicular to an insertion direction of the electronic substrate along the electrode formation surface.   The inner wall surface forming the electronic substrate insertion groove in the facing portion is parallel to the inner wall surface and the electrode formation surface when the end of the electronic substrate is completely inserted into the electronic substrate insertion groove. The electronic device according to claim 1, wherein a positioning portion that contacts the electrode forming surface is formed.   4. The electronic device according to claim 3, wherein a part of the positioning portion is formed in a portion of the inner wall surface that is separated from the formation position of the convex portion in the removal direction.   The electronic device according to claim 1, wherein the recess communicates the front surface and the back surface of the electronic substrate.   The electronic device according to claim 1, wherein the convex portion is formed on each of the two facing portions.   Convex portions formed on each of the two opposing portions are aligned in a lateral direction perpendicular to the insertion direction of the electronic substrate along the electrode formation surface and do not face each other in the thickness direction. The electronic device according to claim 6. The convex portions formed on each of the two facing portions are opposed to each other in the thickness direction,
The sum of the lengths in the thickness direction of the protrusions formed on each of the two opposing portions in the thickness direction is the time when the end of the electronic substrate is completely inserted into the electronic substrate insertion groove. The electronic device according to claim 6, wherein the electronic device is shorter than an interval between the two facing portions. An electronic substrate having a plurality of electrodes formed on at least one of the front surface and the back surface thereof;
A housing in which an electronic board insertion groove for inserting an end of the electronic board is formed, and a card edge connector having a terminal fixed to the housing,
An electronic device in which an end of the electronic substrate is inserted into the electronic substrate insertion groove so that the electrode and a contact portion provided in the electronic substrate insertion groove in the terminal are in contact with each other,
On both the front and back surfaces of the electronic substrate, convex portions that are locally thick are formed,
The convex portion is separated from the electrode in the insertion direction of the electronic substrate,
The length of the electronic substrate in the thickness direction is longer in the convex portion than in the contact portion,
The housing is
Two opposing portions forming the electronic substrate insertion groove by facing each other at a predetermined interval in the thickness direction;
A connecting portion that connects the two facing portions such that the two facing portions are separated and close to each other;
A spring part that constantly applies a spring force to the two opposing parts so that the two opposing parts are close to each other,
The terminal is fixed to a facing portion facing the electrode formation surface of the electronic substrate,
Each of the two facing portions is formed with a locally thinned concave portion that fits with the convex portion,
The recess is away from the contact portion in the insertion direction;
At the time of insertion of the electronic substrate into the electronic substrate insertion groove, when the convex portion comes into contact with the inner wall surface forming the electronic substrate insertion groove at the facing portion, The opposing parts are separated from each other with the connecting part as a fulcrum, so that the contact part is separated from the electronic substrate,
While the contact portion and the electronic substrate are not in contact with each other, the end portion of the electronic substrate is inserted into the electronic substrate insertion groove while the convex portion is rubbed against the inner wall surface.
When the end portion of the electronic substrate is completely inserted into the electronic substrate insertion groove, the two opposing portions come close to each other with the connecting portion as a fulcrum by the spring force of the spring portion. An electronic device, wherein the electronic device falls into the concave portion, the contact portion approaches the electronic substrate, and the contact portion and the electrode are in contact with each other. A plurality of the convex portions are formed on each of the front and back surfaces of the electronic substrate,
A plurality of the concave portions are formed in each of the two facing portions,
The electronic device according to claim 9, wherein the plurality of convex portions are arranged in a lateral direction perpendicular to an insertion direction of the electronic substrate along a formation surface of the electrodes.   On the inner wall surface, when the end of the electronic substrate is completely inserted into the electronic substrate insertion groove, the inner wall surface and the electrode forming surface are parallel to the electrode forming surface. The electronic device according to claim 9, wherein a positioning portion that comes into contact is formed.   12. The electronic device according to claim 11, wherein a part of the positioning portion is formed in a portion of the inner wall surface that is separated from the position where the concave portion is formed in the removal direction of the electronic substrate.   The electronic board insertion groove is divided into a plurality of areas by a partition wall, and one electronic board is inserted into each of the partitioned areas. The electronic device according to claim 1.   In each of the two facing parts, the facing distance of the opening end located on the opposite side of the connecting end with the connecting part in each of the two facing parts gradually becomes longer toward the extraction direction. 14. The electronic device according to claim 1, wherein the length of the opening end in the thickness direction is shortened.

Images