JP2012146533A - Connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector which enables excellent soldering not only in terminals inserted into outer side through holes but also in terminals inserted into inner side through holes.SOLUTION: A connector 1 is mounted on a substrate having multiple through holes arranged in multiple lines which extend in parallel to each other and includes first to third terminals 3 to 5 and a housing 2 holding the terminals 3 to 5. In an upstanding wall 2b of the housing 2, an opening 9, which has a form allowing hot wind generated during reflow soldering to be led into the housing after passing an insertion portion 3a of the first terminal 3 which is located closest to the upstanding wall 2b, is formed.

Description

  The present invention relates to a connector mounted on a substrate having a through hole.

  2. Description of the Related Art Conventionally, many connectors for connecting in-vehicle parts have been used inside the body of an automobile. As a method of soldering the connector terminal to the wiring plating part inside the through hole of the board, so-called flow soldering, in which the back surface of the board is brought into contact with the molten solder in the solder bath, has been known. As a new soldering method, in recent years, reflow soldering has been carried out in that it can be automatically performed in a short time, and is excellent in mass productivity and economy.

  As described in Patent Document 1, reflow soldering is a method of performing soldering by applying cream solder on a substrate and then heating with hot air or the like. Specifically, cream solder is partially applied to the substrate surface and a predetermined position inside the through hole by a screen printing technique, and after inserting the connector terminal into the through hole, the solder paste is attached to the tip of the terminal, In a reflow furnace, hot air is blown from both sides of the substrate to heat the terminals. By melting the cream solder inside the through hole using the heat received by the terminal at this time, the terminal and the through hole can be electrically connected.

JP 2009-182141 A

  Recently, the number of connectors has been increasing, and the number of through-holes in the board has been increased accordingly. In such a case, the through holes are arranged in a plurality of rows arranged in a direction transverse to the connector housing. However, if the through holes are arranged in multiple rows, hot air is hard to hit in the rows closer to the housing, that is, the inner through holes, compared to the rows far from the housing, that is, the outer through holes, and soldering is performed. Has been found to be insufficient.

  The present invention has been made in view of the circumstances as described above, and performs good soldering not only on a terminal inserted into an outer through hole but also on a terminal inserted into an inner through hole. An object of the present invention is to provide a connector that can be used.

  In solving the above-mentioned problems, the present inventor made extensive studies and elucidated the cause of the problems as follows. That is, when hot air is blown from both the front and back sides of the substrate in a reflow furnace, the row far from the housing, that is, the terminals inserted into the outer through-holes are easily hit by hot air, but the row closer to the housing, The terminal inserted into the inner through-hole not only obstructs the flow of hot air due to the terminal inserted into the outer through-hole, but also causes the hot air to flow inside due to the vertical wall of the housing. It has been found that it becomes difficult to pass around the terminals inserted into the through holes.

  In order to solve the above problems, the present invention makes it difficult for hot air generated during reflow soldering to pass around the terminals inserted in the inner through-holes due to the presence of the vertical wall of the housing. Focusing on this, by eliminating this, a passage of hot air is secured.

  In other words, the connector according to claim 1 of the present invention is a connector mounted on a substrate having a plurality of through holes arranged in parallel with each other along the first row and the second row, and the first of the through holes. A plurality of first terminals inserted into the row, a plurality of second terminals inserted into the second row of the through holes, a bottom wall mounted on the substrate, and rising from the bottom wall A vertical wall that holds the first terminal and the second terminal, and a housing disposed on the substrate opposite to the second row of the through holes with respect to the first row of the through holes. The first terminal passes through the vertical wall and has one end portion constituting a connector connecting portion, the other end portion of the through portion extending toward the substrate, and the vertical terminal. On the wall An insertion portion that is inserted into the first row of the through holes close to each other, and the second terminal passes through the vertical wall and one end portion forms a connector connection portion, An insertion portion that extends from the other end of the through portion toward the substrate and is inserted into the second row of the through holes farther from the first row of the through holes with respect to the vertical wall. The vertical wall has an opening having a shape that allows hot air generated during reflow soldering to be introduced into the housing after passing through the insertion portion of the first terminal. Features.

  According to this configuration, the vertical wall of the housing is formed with an opening having a shape that allows hot air generated during reflow soldering to be introduced into the housing after passing through the insertion portion of the first terminal. The passage of hot air during reflow soldering can be secured inside the housing. Therefore, since it becomes possible for the hot air at the time of reflow soldering to hit the insertion portion of the first terminal close to the vertical wall of the housing satisfactorily, not only the second terminal inserted into the outer through-row of the second row, Good soldering can also be performed at the first terminal inserted into the through hole in the first row inside.

  The opening is a partial region of the vertical wall of the housing in the longitudinal direction of the housing, and the range in which the first terminals are arranged overlaps the range in which the second terminals are arranged. Preferably, it is formed in the region.

  According to such a configuration, the opening is partially formed in the region where the first terminal is hard to be hit by hot air by overlapping the range where the first terminals are arranged and the range where the second terminals are arranged. Therefore, it is possible to suppress a decrease in strength of the housing while securing a passage of hot air passing through the first terminal.

  Further, the vertical wall of the housing has an area where only the first terminal or the second terminal is provided, and the opening is only one of the first terminal or the second terminal. It is preferable to be formed in a region other than the region where is provided.

  According to such a configuration, in the region where only either the first terminal or the second terminal is provided, the second terminal does not hinder the flow of hot air toward the first terminal. In order not to form it, the opening is partially formed in a region other than that region. As a result, a decrease in the strength of the housing can be further suppressed.

  Further, the opening extends in the longitudinal direction of the housing, and the housing has a reinforcing plate that connects the upright wall and the bottom wall inside the opening, and the reinforcing plate is It is preferable that the thickness direction has a shape matching the longitudinal direction of the housing.

  When the area where the first terminal is arranged and the area where the second terminal is arranged is wide, the opening is formed to extend in the longitudinal direction in order to ensure a wide hot air passage. It is necessary to Even in such a case, according to the above configuration, since the reinforcing plate that connects between the vertical wall and the bottom wall is provided in the opening, while ensuring a passage of hot air passing through the first terminal, The strength of the housing can be maintained. Further, since the reinforcing plate has a shape whose thickness direction matches the longitudinal direction of the housing, it is possible to suppress a decrease in the opening area.

  The opening is preferably formed in the upright wall and the bottom wall. According to such a configuration, since the opening is formed to extend not only to the vertical wall but also to the bottom wall, a passage of hot air during reflow soldering inside the housing can be secured sufficiently, and the vertical wall of the housing It becomes possible for the hot air at the time of reflow soldering to hit the insertion part of the 1st terminal near to more satisfactorily. Therefore, the temperature difference between the terminals is further reduced, the solder paste is completely melted, and the occurrence of solder failure can be effectively avoided.

  According to a sixth aspect of the present invention, there is provided a connector mounted on a substrate having a plurality of through holes arranged along a first row and a second row extending in parallel with each other, wherein the first of the through holes is a first connector. A plurality of first terminals inserted into the row, a plurality of second terminals inserted into the second row of the through holes, a bottom wall mounted on the substrate, and rising from the bottom wall A vertical wall that holds the first terminal and the second terminal, and a housing disposed on the substrate opposite to the second row of the through holes with respect to the first row of the through holes. The first terminal passes through the vertical wall and has one end portion constituting a connector connecting portion, the other end portion of the through portion extending toward the substrate, and the vertical terminal. Closest to the wall An insertion portion that is inserted into the first row of the through holes, and the second terminal penetrates the vertical wall and has one end portion constituting a connector connection portion, and the penetration portion. An insertion portion that extends from the other end of the portion toward the substrate and is inserted into the second row of the through holes farther than the first row of the through holes with respect to the vertical wall. And the housing is spaced apart from each other in the longitudinal direction of the housing, protrudes from the lower surface of the bottom wall, and the hot air generated during reflow soldering passes through the insertion portion of the first terminal. And a plurality of protrusions having a shape capable of securing a gap between the substrate and the bottom wall by contacting the substrate so as to allow passage between the substrate and the bottom wall. Features that To.

  According to such a configuration, the housing includes a plurality of protrusions protruding from the lower surface of the bottom wall. These protrusions are spaced apart from each other in the longitudinal direction of the housing, and allow hot air generated during reflow soldering to pass between the board and the bottom wall after passing through the insertion portion of the first terminal. In this way, it has a shape that can contact the substrate and secure a gap between the substrate and the bottom wall. As a result, when the connector is attached to the board, the protrusion abuts against the board and separates the housing from the board surface, thereby providing a hot air passage between the bottom wall of the housing and the board during reflow soldering. Can be secured. As a result, hot air during reflow soldering can be satisfactorily applied to the insertion portion of the first terminal close to the vertical wall of the housing, and not only the second terminals inserted into the through holes in the outer second row, Good soldering can also be performed at the first terminal inserted into the through hole in the first row inside.

  Further, the insertion portion of the first terminal is positioned between the insertion portions of the second terminals adjacent to each other when viewed from the direction in which the row in which the first terminals are arranged and the row in which the second terminals are arranged. As such, it is preferably arranged.

  According to this configuration, the insertion portion of the first terminal and the insertion portion of the second terminal do not overlap each other when viewed from the direction in which the row in which the first terminals are arranged and the row in which the second terminals are arranged. Are arranged as follows. Therefore, when the hot air generated during reflow soldering flows along the substrate surface, the second terminal in the row far from the vertical wall of the housing does not hinder the flow of hot air to the first terminal in the near row, and the housing It becomes possible for the hot air during reflow soldering to hit the inserted portion of the first terminal close to the vertical wall of the first terminal more satisfactorily. As a result, the temperature difference between the terminals is further reduced, and the solder paste is completely melted, so that it is possible to more reliably avoid the occurrence of solder failure.

  As described above, according to the connector of the present invention, not only the second terminal inserted into the outer second row of through holes, but also the first terminal inserted into the inner first row of through holes. Good soldering can be performed.

It is the perspective view which looked at the connector which concerns on 1st Embodiment of the connector of this invention from diagonally downward. It is the perspective view which looked at the state by which the connector of FIG. 1 was reflow mounted on the board | substrate from diagonally upward. It is a perspective view which shows arrangement | positioning of the opening and a reinforcement board in the state by which the connector of FIG. 1 was reflow mounted on the board | substrate. It is a cross-sectional perspective view which shows arrangement | positioning of the opening in the state by which the connector of FIG. 1 was reflow mounted on the board | substrate. It is a longitudinal cross-sectional view which shows arrangement | positioning of the opening in the state by which the connector of FIG. 1 was reflow mounted on the board | substrate. It is a longitudinal cross-sectional view of the structure where the protrusion part was provided in the lower part of the housing in the state by which the connector which concerns on 2nd Embodiment of the connector of this invention was reflow mounted in the board | substrate. FIG. 9 is a plan view of a connector in which an opening is formed only in a region where a terminal row, which is a modification of the present invention, is formed alternately with a first terminal and a second terminal along the longitudinal direction of a housing. It is a front view of the connector of FIG.

    Next, the connector of the present invention will be described in more detail with reference to the drawings.

(First embodiment)
As shown in FIGS. 1 to 4, the connector 1 according to the first embodiment of the present invention is a printed wiring board having a plurality of through holes 33 to 35 formed in three rows so as to be parallel to each other. The connector is mounted on the substrate 31 by reflow soldering. The connector 1 and the substrate 31 constitute one electronic device 30.

  The connector 1 includes a plurality of terminals, that is, a first terminal 3, a second terminal 4 and a third terminal 5, and a housing 2 that holds these terminals 3 to 5. These terminals 3 to 5 are inserted into a plurality of through holes 33 to 35 arranged in three rows and reflow soldered. Each component of the connector 1 is specifically configured as follows.

  As shown in FIGS. 2 to 5, the plurality of first terminals 3 are terminals respectively inserted into the through holes 33 arranged in the first row closest to the housing 2 on the substrate 31. The first terminal 3 has an insertion portion 3a and a through portion 3b. The penetrating portion 3 b penetrates the upright wall 2 b, and one end portion (the right end portion in FIGS. 4 to 5) serves as a connector connecting portion inside the housing 2. The insertion portion 3a extends from the other end portion (left end portion in FIGS. 4 to 5) of the through portion 3b toward the substrate 31 and is inserted into the first row of through holes 33 closest to the vertical wall 2b. . The insertion part 3a and the penetration part 3b are orthogonal to each other. In addition, the insertion portion 3 a of the first terminal 3 has a shape that can be inserted into the first row of through holes 33 of the substrate 31. Specifically, the outer diameter is slightly smaller than the inner diameter of the through holes 33. And each tip is pointed, and is arranged corresponding to the position of the first row of through holes 33 perpendicular to the surface of the substrate 31.

  The plurality of second terminals 4 are terminals inserted into the through holes 34 arranged in the second row when viewed from the housing 2. The second terminal 4 has an insertion portion 4a and a through portion 4b. The penetrating portion 4 b penetrates the upright wall 2 b, and one end thereof (the right end portion in FIGS. 4 to 5) serves as a connector connecting portion inside the housing 2. The insertion portion 4a extends from the other end (the left end in FIGS. 4 to 5) of the penetrating portion 4b toward the substrate 31, and is farther from the upright wall 2b than the first row of through holes 33. Inserted into two rows of through holes 34. The insertion portion 4a and the through portion 4b are orthogonal to each other. The insertion portion 4 a of the second terminal 4 has a shape that can be inserted into the second row of through holes 34 of the substrate 31. Specifically, the outer diameter is slightly smaller than the inner diameter of the through holes 34. And each tip is pointed, and is arranged corresponding to the position of the second row of through holes 34 perpendicular to the surface of the substrate 31.

  The plurality of third terminals 5 are terminals inserted into the through holes 35 arranged in the third row farthest from the housing 2. The third terminal 5 has an insertion portion 5a and a through portion 5b. The penetrating portion 5 b penetrates the upright wall 2 b, and one end thereof (the right end portion in FIGS. 4 to 5) serves as a connector connecting portion inside the housing 2. The insertion portion 5a extends toward the substrate 31 from the other end (the left end in FIGS. 4 to 5) of the penetrating portion 5b, and the first through second rows of through holes 33 to the vertical wall 2b. It is inserted into the through hole 35 in the third row farther than 34. The insertion part 5a and the penetration part 5b are orthogonal to each other. The insertion portion 5 a of the third terminal 5 has a shape that can be inserted into the third row of through holes 35 of the substrate 31. Specifically, the outer diameter is slightly smaller than the inner diameter of the through holes 35. And each tip is pointed, and is arranged corresponding to the position of the third row of through holes 35 perpendicular to the surface of the substrate 31.

  In the present embodiment, the third terminals 5 arranged on the outermost side are arranged on both sides of the space portion 11 near the intermediate position in the longitudinal direction L of the housing 2. Therefore, it is easy for hot air to hit the second terminal 4 through the space 11.

  The housing 2 is made of a synthetic resin or the like, and is a hollow box body whose rear side is opened so that plugs such as in-vehicle components can be connected. It is arranged on the opposite side to the through hole 35. The housing 2 includes a bottom wall 2a attached on the substrate 31 and a vertical wall 2b that rises from the bottom wall 2a and holds the first to third terminals 3 to 5.

  The bottom wall 2a of the housing 2 has a flat shape so as to face the substrate 31, and is disposed so as to extend parallel to the surface of the substrate 31 when the connector 1 is reflow soldered. In the connector 1 of the present embodiment, the upright wall 2b and the bottom wall 2a are in a perpendicular positional relationship.

  As shown in FIG. 4, the vertical wall 2 b has projecting attachment portions 6, 7, and 8. The horizontally extending through portions 3b, 4b and 5b in the first to third terminals 3 to 5 are connected to the mounting portions 6, 7 and 8, respectively. Through holes 6 a, 7 a, and 8 a are formed in the attachment portions 6, 7, and 8 so as to pass through the attachment portions 6 to 8 along the direction A in which the first to third terminals 3 to 5 are arranged. Yes. The through portions 3b, 4b, and 5b of the first to third terminals 3 to 5 are held in the mounting portions 6, 7, and 8 by being inserted into the through holes 6a, 7a, and 8a.

  As shown in FIGS. 1 and 3 to 5, hot air H <b> 3 (see FIG. 5) generated during reflow soldering is introduced into the vertical wall 2 b after passing through the insertion portion 3 a of the first terminal 3. An opening 9 having a shape that allows this to be performed is formed.

  Specifically, the opening 9 has an elongated shape extending in the longitudinal direction L of the housing 2, and is formed from the vertical wall 2b to the bottom wall 2a. That is, the opening 9 has a front opening portion 9a and a bottom opening portion 9b. The front opening portion 9a passes through the vertical wall 2b and communicates with the space 2e inside the housing 2. The bottom opening 9b passes through the bottom wall 2a and communicates with the space 2e. The front opening portion 9a and the bottom opening portion 9b communicate with each other to form an opening 9 serving as a passage for the hot air H3.

  As shown in FIG. 1, the opening 9 is a partial region of the vertical wall 2 b of the housing 2 in the longitudinal direction of the housing 2, and the range in which the first terminals 3 are arranged and the second terminals 4 are arranged It is formed in a region R1 that overlaps the range that has been formed. In the present embodiment, the range in which the first terminals 3 are arranged is a range that is slightly narrower than the overall length of the housing 2 in the longitudinal direction L of the housing. Further, the range in which the second terminals 4 are arranged is also a range having substantially the same length as the range in which the first terminals 3 are arranged. Further, the range in which the third terminals 5 are arranged is a range on both sides of the space portion 11 near the middle in the range in which the first and second terminals 3 to 4 are arranged.

  In the first embodiment, in order to reinforce a portion around the opening 9 having a shape extending in the longitudinal direction L of the housing 2, the housing 2 is disposed between the vertical wall 2 b and the bottom wall 2 a inside the opening 9. Are provided with a plurality of reinforcing plates 10. The reinforcing plate 10 has a shape whose thickness direction matches the longitudinal direction L of the housing 2. Specifically, the reinforcing plate 10 is made of a thin plate-like member integrally formed with the bottom wall 2 a and the upright wall 2 b of the housing 2, and the thickness direction of the opening 9 matches the longitudinal direction L of the housing 2. Are arranged. Also. Adjacent reinforcing plates 10 are separated from each other along the longitudinal direction L of the housing, and a passage for hot air is secured.

  4-5, the rear surface 2c of the housing 2 is formed with an opening 2d into which a plug such as a vehicle-mounted component can be inserted. Since the through portions 3b to 5b of the first to third terminals 3 to 5 protrude in the space 2e inside the housing 2, the plug inserted into the housing 2 and the first to third terminals 3 to 5 It is possible to electrically connect the through portions 3b to 5b.

  Further, as shown in FIG. 2, projecting portions 2 f for fastening the housing 2 to the substrate 31 with screws S are formed at the left and right side end portions separated in the longitudinal direction of the housing 2. A through hole 2g penetrating vertically is formed in the protrusion 2f, and a screw S can be inserted into the through hole 2g. By inserting the screw S into the through hole 2g and screwing it into the screw hole (not shown) of the substrate 31, the protruding portion 2f can be fastened to a predetermined position of the substrate 31.

  As shown in FIGS. 2 and 5, a plurality of through holes 33 to 35 formed in three rows so as to be parallel to each other are formed on the board 31 on which the connector 1 is mounted. Wiring plating portions 36, 37, and 38 are formed from the inner surfaces 33 to 35 to both the front and back surfaces (or either the front surface or the back surface) of the substrate 31.

  When reflow soldering the connector 1 to the board 31, as shown in FIG. 5, after applying cream solder inside the through holes 33 to 35, the insertion portions of the first to third terminals 3 to 5 of the connector 1 are inserted. 3 a to 3 b are inserted into the through holes 33 to 35 of the substrate 31, and hot air H <b> 1 and H <b> 2 are blown from both the front and back surfaces of the substrate 31 in this state. Thereby, since the insertion parts 3a-3b of the 1st-3rd terminals 3-5 are heated, a cream solder is fuse | melted with the heat transmitted through these terminals 3-5. The melted solder becomes solder portions 41, 42, and 43 in FIG. 5 and electrically connects the insertion portions 3a to 3c and the wiring plating portions 36 to 38.

  When reflow soldering is performed as described above, in the connector 1 of this embodiment, the opening 9 is formed in the vertical wall 2b of the housing 2, so that the hot air H3 flowing along the substrate 31 generated during reflow soldering is generated. After passing through the insertion portion 3 a of the first terminal 3, it can be introduced into the housing 2 through the opening 9. Therefore, the hot air H3 at the time of reflow soldering hits the insertion part 3a of the first terminal close to the upright wall 2b of the housing 2, and the reflow soldering of the insertion part 3a can be performed well.

(Characteristics of the first embodiment)
(1)
As described above, in the connector 1 of the first embodiment, as shown in FIG. 1 and FIGS. 3 to 5, hot air H3 (see FIG. 5) generated during reflow soldering is first applied to the vertical wall 2b. Since the opening 9 having a shape that allows it to be introduced into the housing 2 after passing through the insertion portion 3a of the terminal 3 is formed, a passage for the hot air H3 during reflow soldering is ensured inside the housing 2. Can do. Therefore, the hot air during reflow soldering can be satisfactorily applied to the insertion portion 3a of the first terminal close to the upright wall 2b of the housing 2, so that it is inserted into the second through third rows of through holes 34 to 35. Good soldering can be performed not only at the second to third terminals 4 and 5 but also at the first terminal 3 inserted into the through hole 33 in the innermost first row. Therefore, the temperature difference between the terminals is reduced, and the solder paste is completely melted, so that it is possible to avoid the occurrence of defective solder. As a result, the degree of freedom in the setting range of the temperature profile during reflow soldering (for example, setting of parameters such as hot air temperature, air volume, and time) is improved.

(2)
Moreover, in the connector 1 of 1st Embodiment, as FIG. 1 shows, the opening 9 is a partial area | region of the longitudinal direction of the housing 2 in the vertical wall 2b of the housing 2, Comprising: The 1st terminal 3 is arranged It is formed in a region R1 where the range where the second terminal 4 is arranged overlaps the range where the second terminal 4 is arranged. That is, in the present embodiment, a region including a range in which the first terminal 3 where the hot air H3 is difficult to hit exists due to the overlap of the range in which the first terminals 3 are arranged and the range in which the second terminals 4 are arranged. Since the opening 9 is partially formed in R1, a decrease in strength of the housing 2 can be suppressed while securing a passage for the hot air H3 passing through the first terminal 3.

(3)
Further, in the connector 1 of the first embodiment, as shown in FIG. 1, the region R1 in which the range in which the first terminals 3 are arranged and the range in which the second terminals 4 are arranged overlaps with each other. In order to ensure a wide passage for H3, the opening 9 is formed to extend in the longitudinal direction. In order to reinforce the periphery of the opening 9 extending in the longitudinal direction, a reinforcing plate 10 is provided in the opening 9 to connect the upright wall 2b and the bottom wall 2a. The strength of the housing 2 can be maintained while securing a passage of hot air that passes therethrough. Further, since the reinforcing plate 10 has a shape whose thickness direction matches the longitudinal direction L of the housing 2, it is possible to suppress a reduction in the area of the opening 9.

  In addition, when the vertical wall 2b of the housing 2 has a region where only the first terminal 3, the second terminal 4, or the third terminal 5 is provided, the opening 9 is formed in the first terminal 3. It is preferable that the second terminal 4 or the third terminal 5 be formed in a region other than the region where only the second terminal 4 or the third terminal 5 is provided (for example, they are arranged in two rows shown in FIG. 8 described later) It is preferable to form the opening 56 only in the region R2 where the first terminal 53 and the second terminal 54 overlap except for the region where only the first terminal 53 close to the upright wall 52b is provided like the connector 51). With such a configuration, in the region where only one of the first terminal 3, the second terminal 4, and the third terminal 5 is provided, the second terminal 4 and the third terminal 5 go to the first terminal 3. Since the flow of hot air is not hindered, the opening 9 is partially formed in a region other than that region so that the opening 9 is not formed in such a region. Thereby, the fall of the intensity | strength of the housing 2 can further be suppressed.

(4)
Furthermore, in the connector 1 of 1st Embodiment, as FIG. 1 and FIG. 5 show, the opening 9 is formed in the vertical wall 2b and the bottom wall 2a, and specifically, the opening 9 is the vertical wall 2b. The front opening 9a formed on the bottom wall 2a and the bottom opening 9b formed on the bottom wall 2a communicate with each other. According to such a configuration, since the opening 9 is formed to extend not only to the vertical wall 2b but also to the bottom wall 2a, the passage of the hot air H3 during reflow soldering inside the housing 2 can be secured sufficiently wide. The hot air H3 at the time of reflow soldering can be more effectively applied to the insertion portion 3a of the first terminal 3 near the vertical wall 2b of the housing 2. Therefore, the temperature difference between the terminals is further reduced, the solder paste is completely melted, and the occurrence of solder failure can be effectively avoided.

(Second Embodiment)
In the connector 1 of the first embodiment, the opening 9 is formed in the vertical wall 2b of the housing 2 so that the hot air at the time of reflow soldering strikes the insertion portion 3a of the first terminal close to the vertical wall 2b of the housing 2 well. The passage of hot air H3 during reflow soldering is secured inside the housing 2, but as another means for securing the passage of hot air, a gap is provided between the bottom wall of the connector and the board. Also good.

  That is, as a connector according to the second embodiment of the present invention, in the connector 21 shown in FIG. 6, a plurality of housings 2 project from the lower surface of the bottom wall 2a instead of providing the opening 9 shown in FIGS. The protrusion 12 is provided. Other configurations are the same as those of the connector 1 shown in FIGS.

  The plurality of protrusions 12 shown in FIG. 6 are arranged apart from each other in the longitudinal direction of the housing 2 (in the direction perpendicular to the plane of FIG. 6), and hot air H4 generated during reflow soldering is inserted into the first terminal 3. A shape capable of abutting against the substrate 31 so as to allow passage between the substrate 31 and the bottom wall 2a after passing through the portion 3a and securing a gap 13 between the substrate 31 and the bottom wall 2a. Have Specifically, like the reinforcing plate 10 in FIG. 1, a plurality of thin plate-like protrusions 12 protrude from the lower surface of the bottom wall 2 a and are separated from each other along the longitudinal direction of the housing 2 (perpendicular to the plane of FIG. 6). Are arranged.

  As described above, the connector 21 has a configuration in which the plurality of protruding portions 12 protrude from the bottom wall 2 a, so that the protruding portion 12 is brought into contact with the substrate 31, whereby the bottom wall 2 a of the housing 2 is fixed to the surface of the substrate 31. A gap 13 having a height can be separated, and a passage for hot air H4 during reflow soldering can be secured between the bottom wall 2a of the housing 2 and the substrate 31. Therefore, it becomes possible for the hot air at the time of reflow soldering to strike the insertion portion 3a of the first terminal 3 close to the vertical wall 2b of the housing 2 satisfactorily, and inserted into the outer second through third rows of through holes 34 to 35. Good soldering can be performed not only at the second to third terminals 4 and 5 but also at the first terminal 3 inserted into the through hole 33 in the innermost first row. Therefore, the temperature difference between the terminals is reduced, and the solder paste is completely melted, so that it is possible to avoid the occurrence of defective solder. As a result, the degree of freedom in the setting range of the temperature profile during reflow soldering (for example, setting of parameters such as hot air temperature, air volume, and time) is improved.

(Modification)
In the connectors 1 and 21 described in the first and second embodiments, the plurality of terminals 3 to 5 are arranged side by side at the overlapping position along the direction A in which the row in which the first to third terminals 3 to 5 are arranged. However, in order to allow the hot air to strike the first terminal 3 close to the housing 2 better, the arrangement of the terminals is shifted along the direction A in which the rows in which the first to third terminals 3 to 5 are arranged are arranged. It may be arranged.

  Specifically, as a modification of the present invention, like the connector 51 in which the plurality of terminals 53 to 54 shown in FIGS. 7 to 8 are arranged in two rows, the insertion portion 53a of the first terminal 53 is: The first and second terminals 53 to 54 are arranged so as to be positioned between the insertion portions 54a of the adjacent second terminals 54 when viewed in the direction A in which the row in which the first and second terminals 53 to 54 are arranged. In this configuration, the insertion portion 53a of the first terminal 53 and the insertion portion 54a of the second terminal 54 do not overlap each other when viewed from the direction A in which the row in which the first and second terminals 53 to 54 are arranged. Is arranged. Therefore, when hot air generated during reflow soldering flows along the surface of the substrate 31, the second terminals 54 in the row far from the upright wall 52 b of the housing 52 obstruct the flow of hot air to the first terminals 53 in the near row. Therefore, the hot air during reflow soldering can be applied to the insertion portion 53a of the first terminal 53 close to the upright wall 52b of the housing 52 even better. As a result, the temperature difference between the terminals is further reduced, and the solder paste is completely melted, so that it is possible to more reliably avoid the occurrence of solder failure.

  Further, in the connector 51 shown in FIGS. 7 to 8, the second terminal 54 is not formed near the intermediate position in the longitudinal direction L of the housing 52, and only the first terminal 53 is formed. There are 55. The first terminal 53 in this region 55 can receive hot air well without being disturbed by the second terminal 54 during reflow soldering. Therefore, in the range 55, an opening for securing a passage of hot air is not formed in the vertical wall 52b of the housing 52, and the first region other than the region 55 provided only with the first terminal 53 close to the vertical wall 52b is provided. Opening 56 is formed only in region R2 where terminal 53 and second terminal 54 overlap. Thereby, a decrease in strength of the housing 52 can be suppressed.

1, 21 Connector 2, 52 Housing 2a Bottom wall 2b, 52b Vertical wall 2f Projection part 3, 53 First terminal 4, 54 Second terminal 5 Third terminal 3a, 4a, 5a, 53a, 54a Insertion part 3b, 4b 5b Through portion 9, 56 Opening 10 Reinforcement plate 31 Printed wiring board 33, 34, 35 Through hole

Claims (7)

A connector mounted on a substrate having a plurality of through holes arranged along a first row and a second row extending in parallel to each other,
A plurality of first terminals inserted into a first row of the through holes;
A plurality of second terminals inserted into the second row of through holes;
A bottom wall mounted on the substrate, and a vertical wall rising from the bottom wall and holding the first terminal and the second terminal, and the through hole on the substrate with respect to the first row of the through holes. A housing arranged opposite to the second row of holes,
The first terminal penetrates the vertical wall and has one end portion constituting a connector connection portion, the other end portion of the through portion extending toward the substrate, and the Having an insertion portion inserted into the first row of the near through holes,
The second terminal passes through the vertical wall, one end of which forms a connector connecting portion, and extends from the other end of the through portion toward the substrate, and on the vertical wall And having an insertion portion inserted into the second row of the through holes farther than the first row of the through holes,
The vertical wall has an opening having a shape that allows hot air generated during reflow soldering to be introduced into the housing after passing through the insertion portion of the first terminal.
A connector characterized by that. The opening is a partial region in the longitudinal direction of the housing on the vertical wall of the housing, and the range in which the first terminals are arranged overlaps the range in which the second terminals are arranged. Formed in the region,
The connector according to claim 1. The vertical wall of the housing has a region where only the first terminal or the second terminal is provided,
The opening is formed in a region other than the region where only the first terminal or the second terminal is provided.
The connector according to claim 2. The opening extends in a longitudinal direction of the housing;
The housing has a reinforcing plate that connects between the vertical wall and the bottom wall inside the opening,
The reinforcing plate has a shape whose thickness direction matches the longitudinal direction of the housing.
The connector according to claim 2 or 3. The opening is formed in the upright wall and the bottom wall,
The connector according to claim 1. A connector mounted on a substrate having a plurality of through holes arranged along a first row and a second row extending in parallel to each other,
A plurality of first terminals inserted into a first row of the through holes;
A plurality of second terminals inserted into the second row of through holes;
A bottom wall mounted on the substrate, and a vertical wall rising from the bottom wall and holding the first terminal and the second terminal, and the through hole on the substrate with respect to the first row of the through holes. A housing arranged opposite to the second row of holes,
The first terminal penetrates the vertical wall and has one end portion constituting a connector connection portion, the other end portion of the through portion extending toward the substrate, and the Having an insertion portion inserted into the first row of the near through holes,
The second terminal passes through the vertical wall, one end of which forms a connector connecting portion, and extends from the other end of the through portion toward the substrate, and on the vertical wall And having an insertion portion inserted into the second row of the through holes farther than the first row of the through holes,
The housing is spaced apart from each other in the longitudinal direction of the housing, protrudes from the bottom surface of the bottom wall, and hot air generated during reflow soldering passes through the insertion portion of the first terminal and the substrate. A plurality of protrusions having a shape capable of securing a gap between the substrate and the bottom wall by contacting the substrate so as to allow passage between the bottom wall and the substrate;
A connector characterized by that. The insertion portion of the first terminal is located between the insertion portions of the second terminals adjacent to each other when viewed from the direction in which the row in which the first terminals are arranged and the row in which the second terminals are arranged. Arranged,
The connector according to claim 1.