JP2012142447A - Wafer mounting mechanism, wafer mounting stage, and resist forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer mounting mechanism and a wafer mounting stage which can ensure excellent heat conduction between a wafer and a wafer mounting table while avoiding contamination and damage of the wafer mounting table by the wafer without requiring any modification of an existing facility, and to provide a resist forming device using such a wafer mounting table.SOLUTION: The wafer mounting stage 100a for supporting a wafer when the wafer is processed comprises a mounting stage body 111 for mounting the wafer, and a spacer member 112 for mounting the wafer provided removably on the mounting stage body so as to adhere the surface of the mounting stage body.

Description

  The present invention relates to a wafer placement mechanism, a wafer placement stage, and a resist forming apparatus, and more particularly to a structure of a stage on which a wafer is placed when processing a wafer.

  Conventionally, in semiconductor device manufacturing processes, when processing semiconductor wafers, a thin disk-shaped wafer is placed on a wafer mounting table, and various wafers are held on the wafer mounting table. It has been processed.

  For example, when a semiconductor film or an insulating film formed on the wafer surface is patterned by selective etching, a resist film having a predetermined plane pattern is formed as an etching mask. In this resist film forming process, resist coating is performed. Then, a series of processes such as drying by heating the applied resist, cooling of the dried resist, and exposure and development of the cooled resist film are performed.

  Here, in the processing such as heating for drying the resist or cooling the dried resist, the wafer is placed on a wafer mounting table such as a hot plate or a cooling plate to bring the temperature of the wafer to a desired temperature.

  In recent years, in addition to silicon wafers, sapphire substrates have been used in the manufacture of light-emitting diodes (LEDs) and the like, but this sapphire substrate has a larger heat capacity than silicon substrates.

  Therefore, in order to raise or lower the temperature of the wafer in a short time, a method for placing the wafer on the wafer placement table has been devised.

  FIG. 4 is a diagram for explaining a method of placing a wafer on a hot plate, for example.

  As a general method, there is a method in which a wafer Wf is directly placed on a hot plate 200 as shown in FIG.

  In this method, the heat conduction between the wafer and the hot plate is good, and the temperature of the wafer can be raised or lowered in a short time.

  However, in this method of directly placing the wafer on the hot plate, there is a problem that the surface of the hot plate in contact with the wafer is contaminated or damaged, and frequent replacement due to the damage of the hot plate is not possible. This will also increase the running cost.

  Therefore, as shown in FIG. 4B, a method is also conceivable in which the wafer Wf is placed on the pot plate 200 so that the wafer Wf is slightly lifted by the support protrusions 201 so that a gap of about 0.1 mm to 0.2 mm is formed. In this case, since the surface of the hot plate does not come into direct contact with the wafer, the surface of the hot plate is not contaminated or damaged by the wear, but a gap is formed between the wafer Wf and the pot plate 200. And the thermal conductivity between the hot plate and the hot plate deteriorates.

  Further, in Patent Document 1, as shown in FIG. 4C, the problems of realizing good heat conduction between the wafer and the hot plate and avoiding contamination and damage of the hot plate are solved. As described above, there has been proposed a method in which the wafer Wf is accommodated in the wafer placement tray 11 and placed on the hot plate 200.

  FIG. 5 is a view for explaining the substrate mounting tray disclosed in Patent Document 1, FIG. 5 (a) shows the structure of the surface, and FIG. 5 (b) is a cross-sectional view taken along the line AA ′ of FIG. The structure of is shown.

  The substrate mounting tray 10 shown in FIG. 5 has a pedestal 11 having a substantially disk-shaped outer shape. For this pedestal 11, for example, a material mainly composed of carbon, silicon, silicon carbide, aluminum, aluminum oxide or the like is used. These are excellent in terms of heat resistance, cutting workability, and heat conduction efficiency.

  On the upper surface of the pedestal 11, a substrate mounting recess 13 for accommodating a wafer (hereinafter also referred to as a substrate) Wf is formed, and a part of the side surface 12 of the recess 13 is located at the position of the substrate Wf. The alignment portion 14 is aligned with the alignment mark (that is, the orientation flat portion).

  Further, the bottom surface of the substrate mounting recess 13 is a flat mounting surface 15 on which the substrate is mounted, and the mounting surface 15 is further provided with a plurality of concave holes 16. Each of the recessed hole portions 16 is arranged so as to correspond to a functional element region which is a plurality of regions that should be non-contact with the wafer Wf.

  As disclosed in this Patent Document 1, the problem that the hot plate is damaged by the wafer can be solved by accommodating the wafer in the wafer mounting tray and placing it on the hot plate. The problem that a gap is formed between the hot plate and the wafer and the thermal conductivity is deteriorated can be solved by configuring the wafer mounting tray as described above with a material having excellent thermal conductivity.

JP 2004-342834 A

  As disclosed in Patent Document 1 described above, in the method in which the wafer Wf is accommodated in the wafer placement tray 11 and placed on a hot plate or the like, the wafer and the wafer placement tray are integrally formed on the wafer. Since the film is processed, the wafer temperature can be made uniform by maintaining a high degree of adhesion between the wafer and the wafer mounting tray. However, depending on the arrangement pattern of the element regions on the surface of the wafer, the tray Depending on the wafer size, replacement may be required.

  Further, in the wafer processing apparatus that has been processing by directly placing the wafer on the wafer mounting table, it is necessary to increase the size of the equipment in accordance with the tray size by using the wafer mounting tray as described above.

  The present invention has been made in order to solve the above-described problems, and avoids contamination and damage of the wafer mounting table by the wafer without remodeling from the existing equipment. It is an object of the present invention to obtain a wafer placement mechanism and a wafer placement stage that can ensure good heat conduction between them, and a resist forming apparatus using such a wafer placement stage.

  A wafer mounting mechanism according to the present invention is a wafer mounting mechanism having a wafer mounting table for mounting a wafer, and a spacer member disposed between the wafer and the wafer mounting table, The wafer mounting table has a structure in which an engaging protrusion for positioning the spacer member is formed on the surface thereof, the spacer member has an engaging hole for engaging with the engaging protrusion of the wafer mounting table, and The spacer member has a structure in close contact with the surface of the wafer mounting table, and the spacer member is detachably disposed on the wafer mounting table by engaging the engaging hole of the spacer member with the engaging protrusion of the wafer mounting table. Yes, and the above objective is achieved.

  In the wafer mounting mechanism, the present invention is arranged so as to pass through the component insertion hole formed in the wafer mounting table and the component insertion hole formed in the spacer member, and the wafer is moved up and down on the spacer member. It is preferable to have an elevating pin and an elevating drive mechanism for elevating the elevating pin.

  According to the present invention, in the wafer mounting mechanism, the spacer member allows air to escape from between the spacer member and the wafer when the wafer is mounted on the spacer member. It is preferable that an air discharge groove is formed on the surface of the spacer member.

  According to the present invention, in the wafer mounting mechanism, the air discharge groove formed in the spacer member intersects with the plurality of annular grooves formed concentrically with respect to the center of the spacer member, and the plurality of annular grooves. It is preferable to include a plurality of linear grooves passing through the center of the spacer member.

According to the present invention, in the wafer mounting mechanism, the constituent material of the spacer member is preferably SiC or Al ₂ O ₃ .

  A wafer mounting stage according to the present invention is a wafer mounting stage that supports the wafer when processing the wafer, and a stage main body for supporting the wafer, on the mounting stage main body, The mounting stage main body includes a spacer member that is detachably provided on the mounting stage main body so as to be in close contact with the surface of the mounting stage main body. .

  According to the present invention, in the wafer mounting stage, the stage main body preferably includes at least one of a wafer heating unit that heats the wafer and a wafer cooling unit that cools the wafer.

  According to the present invention, in the wafer mounting stage, the stage body preferably includes the wafer heating unit so as to function as a hot plate for heating the wafer.

  According to the present invention, in the wafer mounting stage, the stage body preferably includes the wafer cooling unit so as to function as a cooling plate for cooling the wafer.

  A resist forming apparatus according to the present invention is a resist forming apparatus for forming a resist film on a surface of a wafer, the resist applying apparatus for applying a resist material to the surface of the wafer, and the resist applied to the surface of the wafer A resist drying device for drying the material by heating; and a wafer cooling device for cooling the heated wafer. At least one of the resist drying device and the wafer cooling device removes the wafer when processing the wafer. As the wafer mounting stage to be supported, the above-described wafer mounting stage according to the present invention is provided, and thereby the above object is achieved.

  Next, the operation will be described.

  In the present invention, a stage main body for supporting the wafer, and the mounting stage main body is detachably provided on the mounting stage main body so as to be in close contact with the surface of the mounting stage main body. Since it has a spacer member for mounting, good heat conduction between the wafer and the wafer mounting table can be achieved while avoiding contamination and damage of the wafer mounting table by the wafer without modification from the existing equipment. Can be secured.

  In the present invention, the surface of the spacer member is arranged such that when the wafer is placed on the spacer member, air escapes from between the spacer member and the wafer to the outside of the spacer member. Since the air discharge groove is formed on the spacer member, when the wafer is placed on the spacer member, the air discharge groove formed on the surface of the spacer member is passed between the spacer member and the wafer. Air is discharged to the outside of the spacer member. For this reason, the wafer is placed at a predetermined position of the spacer member.

  As described above, according to the present invention, the stage main body for supporting the wafer and the mounting stage main body are detachably attached to the mounting stage main body so as to be in close contact with the surface of the mounting stage main body. Provided with a spacer member for mounting the wafer between the wafer and the wafer mounting table while avoiding contamination and damage of the wafer mounting table by the wafer without modification from the current equipment. It is possible to obtain a wafer mounting mechanism and a wafer mounting stage that can ensure good heat conduction, and a resist coating apparatus using such a wafer mounting stage.

FIG. 1 is a diagram for explaining a resist forming apparatus according to Embodiment 1 of the present invention, and conceptually shows the overall configuration of the resist forming apparatus together with a resist film exposure apparatus. FIG. 2 is a view for explaining a wafer mounting stage according to Embodiment 1 of the present invention, FIG. 2 (a) is a perspective view showing the configuration, and FIG. 2 (b) is the wafer mounting stage. FIG. 2C shows a cooling plate as an example of the main body of the wafer mounting stage, and FIG. 2D shows the structure of the spacer member. FIG. 3 is a view for explaining the operation (FIGS. 3A to 3D) of the wafer mounting stage according to the first embodiment of the present invention. FIG. 4 is a diagram for explaining a conventional method for placing a wafer on a hot plate, for example. FIG. 4 (a) shows a method for placing a wafer directly on a hot plate, and FIG. FIG. 4C shows a method of placing a wafer on a hot plate by placing the wafer in a wafer placement tray. FIG. 5 is a view for explaining the substrate mounting tray disclosed in Patent Document 1, FIG. 5 (a) shows the structure of the surface, and FIG. 5 (b) is a cross-sectional view taken along the line AA 'in FIG. The structure of is shown.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a schematic view for conceptually explaining a resist forming apparatus according to Embodiment 1 of the present invention.

  The resist forming apparatus 1 according to the first embodiment is a resist forming apparatus that forms a resist film on the surface of a wafer.

  That is, the resist forming apparatus 1 includes a resist coating apparatus 110 that applies a resist material to the surface of the wafer, a resist drying apparatus 120 that dries the resist material applied to the surface of the wafer by heating, and the heated And a wafer cooling device 130 for cooling the wafer.

  In the resist forming apparatus 1, the resist coating apparatus 110, the resist drying apparatus 120, and the wafer cooling apparatus 130 are arranged in this order, and a transfer system 150 for transferring the wafer is provided along this arrangement. Yes. The transfer system 150 includes a guide rail 151 arranged along the arrangement of the devices 110, 120, and 130, a slide block 152 that slides on the guide rail, and a wafer attached to the slide block. And a transfer arm 153 for transferring the. Here, the sliding block 152 holds the transport arm so that it can rotate and can be pushed out and retracted.

  An exposure device 140 is disposed at a position facing the wafer cooling device 130 of the resist forming apparatus 1.

  In the resist forming apparatus 1 according to the first embodiment, each of the resist drying device 120 and the wafer cooling device 130 includes a wafer mounting stage that supports the wafer when the wafer is processed.

  FIG. 2 is a view for explaining a wafer mounting stage according to Embodiment 1 of the present invention, FIG. 2 (a) is a perspective view showing the configuration, and FIG. 2 (b) is the wafer mounting stage. FIG. 2C shows a cooling plate as an example of the main body of the wafer mounting stage.

  The wafer mounting stage 100a of this embodiment includes a stage main body (hereinafter also referred to as a wafer mounting table) 111 for supporting the wafer, and a surface of the mounting stage main body 111 on the mounting stage main body 111. And a spacer member 112 for mounting the wafer (not shown), which is detachably provided on the mounting stage main body 111 so as to be in close contact with the mounting stage.

Here, the constituent material of the spacer member 112 is SiC or Al ₂ O ₃ . The wafer Wf is, for example, a sapphire wafer. However, the constituent material of the wafer and the constituent members of the spacer are not limited to those described above.

  The wafer mounting table 111 has a structure in which an engaging projection 111f for positioning the spacer member 112 is formed on the surface thereof. The spacer member 112 has an engagement hole 112b that engages with the engagement protrusion 111f of the wafer mounting table 111, and is in close contact with the surface of the wafer mounting table. The spacer member 112 is detachably disposed on the wafer mounting table 111 by engaging an engagement hole 112b of the spacer member 112 with an engaging protrusion 111f of the wafer mounting table 111.

  Further, a part insertion hole 112c is formed in the wafer mounting table 111 and the spacer member 112, and a lift pin 113a for raising and lowering the wafer on the spacer member 112 is slidably disposed in the part insertion hole 112c. Has been. The lift pins 113a are configured to be lifted and lowered by a lift drive mechanism 113 disposed on the lower surface side of the wafer mounting table 111.

  In addition, when the wafer Wf is placed on the spacer member 112 (see FIG. 3), the spacer member 112 allows air to escape to the outside of the spacer member 112 from between the spacer member 112 and the wafer Wf. As described above, an air discharge groove 112a is formed on the surface of the spacer member.

  Specifically, the air discharge groove 112a formed in the spacer member 112 intersects the plurality of annular grooves 112a1 concentrically formed with respect to the center of the spacer member, and the plurality of annular grooves, It comprises a plurality of linear grooves 112a2 passing through the center of the spacer member.

  Further, as shown in FIG. 3C, the spacer member 112 is configured such that the wafer mounting table (mounting spacer main body) 111 extends from the lower surface of the wafer Wf in a state where the elevating pins 111 a are lifted to lift the wafer Wf to the upper end position. The thickness a is less than the thickness (ab) obtained by subtracting the penetration margin b of the transfer arm from the distance a to the surface.

  In the resist drying apparatus 120, the mounting stage main body 111a constituting the wafer mounting stage has a wafer heating unit 111c so as to function as a hot plate for heating the wafer (FIG. 2B). ). Generally, an electric heater or the like is used for the heating unit 111c. The heater 111c controls the temperature of the stage main body (hot plate) 111b to be about 130 ° C., whereby the wafer placed on the stage main body is heated and the resist applied on the wafer surface is heated. The material will dry.

  In the wafer cooling apparatus 130, the mounting stage main body 111b constituting the wafer mounting stage includes a wafer cooling unit 111d so as to function as a cooling plate for cooling the wafer (FIG. 2C). The wafer cooling section 111d is supplied with constant temperature water whose temperature is adjusted via a pipe 111e connected to the wafer cooling section 111d, and the temperature of the stage main body section (cooling plate) 111b is, for example, room temperature (23 ° C. to 24 ° C.). The wafer placed on the stage main body is cooled by this.

  In the resist forming apparatus 1 according to the first embodiment, the wafer mounting stage 110a shown in FIG. 2A is used. However, at least one of the resist drying apparatus 120 and the wafer cooling apparatus 130 is used in FIG. By using the wafer mounting stage according to the present embodiment shown in FIG. 2), the apparatus can avoid contamination and damage of the wafer mounting table by the wafer without modifying the existing equipment, and between the wafer and the wafer mounting table. The effect that the favorable heat conduction in can be ensured is acquired.

  Next, the operation will be described.

  FIG. 3 is a view for explaining the operation (FIGS. 3A to 3D) of the wafer mounting stage according to the first embodiment of the present invention.

  First, the resist forming apparatus 1 according to the present embodiment forms a resist film having a predetermined plane pattern as an ion implantation mask for selective ion implantation on a wafer, or performs selective etching on a wafer. For example, a resist film having a predetermined plane pattern is used as an etching mask.

  For example, when a resist film for selectively etching the insulating layer formed on the wafer is formed, the wafer is carried into the resist coating apparatus 1 from a film forming apparatus (not shown) by the transfer arm 153 of the resist coating apparatus 1. Then, the wafer Wf is carried into the resist coating apparatus 110 by the transfer arm 153.

  Here, in the resist coating apparatus 110, a resist material is coated on the surface of the wafer, and the wafer coated with the resist material is carried into the wafer drying apparatus 120 by the transfer arm 153. In the wafer drying apparatus 120, the wafer placed on the wafer placement stage 100a is heated to about 130 ° C. by the placement stage main body 111a as a hot plate, and the resist material applied to the wafer is dried. The drying temperature is not limited to 130 ° C., and drying may be performed at a high temperature of about 250 ° C. depending on the application conditions of the resist material.

  When the drying is completed, the wafer is further transferred from the wafer drying device 120 to the wafer cooling device 130 by the transfer arm 153. In the wafer cooling device 130, the wafer placed on the wafer placement stage 100a is cooled by the placement stage main body 111b as a cooling plate. The wafer cooled to room temperature is further transferred by the transfer arm 153 to the exposure apparatus 140 disposed adjacent to the resist forming apparatus 1 and the resist film is exposed. The exposed resist film is developed by a developing device (not shown) to form an etching mask having a predetermined plane pattern.

  Hereinafter, in each of the apparatuses 110, 120, and 130, the operation in which the wafer loaded by the transfer arm is placed on the wafer placement stage 100a will be described with reference to FIGS. 2A and 3A to 3D. Will be described. The operation of placing the wafer on the placement stage is the same in any apparatus.

  First, on the mounting stage main body (wafer mounting table) 111, a spacer member 112 is disposed by engaging an engaging hole 112b of the spacer member with an engaging protrusion 111f of the wafer mounting table. The raising / lowering pins 113 a for raising and lowering the wafer are immersed in the component insertion holes 112 c formed in the wafer mounting table 111.

  In this state, as shown in FIG. 3D, when the wafer Wf is loaded onto the wafer mounting stage 100a by the transfer arm 153, the lifting drive mechanism 113 raises the lifting pins 113a, and FIG. As shown in (c), the wafer Wf on the transfer arm 153 is lifted further upward from the transfer arm 153. Thereafter, when the transfer arm 153 is retracted from the wafer mounting stage 100a, the lift drive mechanism 113 lowers the lift pins 113a, and the wafer Wf is placed on the spacer member 112 as shown in FIG. Place.

  At this time, air is discharged to the outside of the spacer member through the air discharge groove 112a formed on the surface of the spacer member 112 from between the spacer member and the wafer. For this reason, the wafer is placed at a predetermined position of the spacer member (FIG. 3B).

  When the wafer is thus placed on the wafer placement stage 100a, the wafer is heated by the placement stage main body 111 (here, the hot plate 111a), and the resist material applied on the insulating film of the wafer. Is dried.

  When the drying of the resist material is completed, the elevating drive mechanism 113 raises the elevating pins 113a to lift the wafer Wf, and in this state with a gap between the spacer member 112 and the wafer Wf, The transfer arm 153 is inserted into the gap (FIG. 3C).

Next, when the lift drive mechanism 113 lowers the lift pins 113a, when the wafer is placed on the transfer arm 153, the transfer arm 153 moves to the wafer cooling device 120 together with the movable block 152, and the device 120 is dried. A heated wafer is carried in.
Thereafter, when the wafer is placed on the wafer placement stage 100a by the movement of the lift pins and the transfer arm as described above, the wafer is cooled by the placement stage main body 111 (here, the cooling plate 111b). When the cooling is completed, the wafer is transferred to the exposure apparatus 140 adjacent to the resist forming apparatus 1 by the transfer arm 153.

  Next, the function and effect will be described.

  In this embodiment, since the easily replaceable spacer member 112 is arranged on the hot plate 111a and the cooling plate 111b, the wafer is efficiently heated and cooled by the hot plate and the cooling plate, respectively, and contamination and scratches are prevented. When entering the spacer member, it can be dealt with by replacing the spacer member.

  Further, since the hot plate 111a or the cooling plate 111b and the wafer are not in direct contact with each other, the plate is not easily damaged, and the wafer is in close contact with the plate through the spacer member. Heating and cooling are possible.

  As described above, in the first embodiment, in the wafer mounting stage 100a that supports the wafer when processing the wafer, the mounting stage main body (wafer mounting table) 111 for supporting the wafer, and the mounting Since it is provided on the stage main body so as to be detachably attached to the mounting stage main body so as to be in close contact with the surface of the mounting stage main body, and includes a spacer member 112 for mounting the wafer, Without modification, good heat conduction between the wafer and the wafer mounting table can be ensured while avoiding contamination and damage of the wafer mounting table by the wafer.

  The mounting stage main body preferably includes at least one of a wafer heating unit that heats the wafer and a wafer cooling unit that cools the wafer.

  As mentioned above, although this invention has been illustrated using preferable embodiment of this invention, this invention should not be limited and limited to this embodiment. It is understood that the scope of the present invention should be construed only by the claims. It is understood that those skilled in the art can implement an equivalent range based on the description of the present invention and the common general technical knowledge from the description of specific preferred embodiments of the present invention. Patents, patent applications, and documents cited herein should be incorporated by reference in their entirety, as if the contents themselves were specifically described herein. Understood.

  The present invention is an improved structure for placing a wafer when processing a wafer, particularly in the fields of a wafer placement mechanism, a wafer placement stage, and a resist forming apparatus, and is not modified from the existing equipment. Thus, a wafer mounting mechanism and a wafer mounting stage capable of ensuring good heat conduction between the wafer and the wafer mounting table while avoiding contamination and damage of the wafer mounting table by the wafer, and such It is possible to provide a resist forming apparatus using a simple wafer mounting stage.

DESCRIPTION OF SYMBOLS 1 Resist formation apparatus 100a Wafer mounting stage 110 Resist coating apparatus 111 Mounting stage main body (wafer mounting table)
111a Mounting stage body (hot plate)
111b Mounting stage body (cooling plate)
111c Wafer heating section 111d Wafer cooling section 111e Piping 111f Engagement projection 112 Spacer member 112a Air discharge groove 112a1 Annular groove 112a2 Linear groove 112b Engagement hole 112c Component insertion hole 113 Elevating drive mechanism 113a Elevating pin 120 Resist drying apparatus 130 Wafer cooling Apparatus 140 Exposure apparatus 150 Conveying system 151 Guide rail 152 Sliding block 153 Conveying arm

Claims (10)

A wafer mounting mechanism having a wafer mounting table for mounting a wafer, and a spacer member disposed between the wafer and the wafer mounting table,
The wafer mounting table has a structure in which an engaging protrusion for positioning the spacer member is formed on the surface thereof,
The spacer member has an engagement hole that engages with an engagement protrusion of the wafer mounting table, and is in close contact with the surface of the wafer mounting table.
A wafer mounting mechanism in which the spacer member is detachably disposed on the wafer mounting table, with the engaging protrusions of the wafer mounting table engaging with the engaging holes of the spacer member. The wafer mounting mechanism according to claim 1,
A component insertion hole formed in the wafer mounting table and a component insertion hole formed in the spacer member, and a lift pin for moving the wafer up and down on the spacer member;
A wafer mounting mechanism having a lifting drive mechanism for lifting and lowering the lifting pins. The wafer mounting mechanism according to claim 2,
The spacer member has an air discharge groove on the surface of the spacer member so that when the wafer is placed on the spacer member, air escapes from between the spacer member and the wafer to the outside of the spacer member. A wafer mounting mechanism that is formed. The wafer mounting mechanism according to claim 3, wherein
The air discharge groove formed in the spacer member is
A plurality of annular grooves formed concentrically with respect to the center of the spacer member;
A wafer mounting mechanism including a plurality of linear grooves passing through the center of the spacer member so as to intersect the plurality of annular grooves. In the wafer mounting mechanism according to any one of claims 1 to 4,
The wafer mounting mechanism, wherein the spacer member is made of SiC or Al ₂ O ₃ . A wafer mounting stage that supports the wafer when processing the wafer;
A stage body for supporting the wafer;
A wafer mounting stage provided on the mounting stage main body so as to be detachably provided on the mounting stage main body so as to be in close contact with the surface of the mounting stage main body, and a spacer member for mounting the wafer . The wafer mounting stage according to claim 6,
The mounting stage body includes at least one of a wafer heating unit that heats the wafer and a wafer cooling unit that cools the wafer. The wafer mounting stage according to claim 7,
The mounting stage body includes the wafer heating unit so as to function as a hot plate for heating the wafer. The wafer mounting stage according to claim 7,
The mounting stage body includes the wafer cooling unit so as to function as a cooling plate for cooling the wafer. A resist forming apparatus for forming a resist film on a surface of a wafer,
A resist coating apparatus for coating a resist material on the surface of the wafer;
A resist drying apparatus for drying the resist material applied to the surface of the wafer by heating;
A wafer cooling device for cooling the heated wafer,
At least one of the resist drying device or the wafer cooling device is:
A resist forming apparatus comprising the wafer mounting stage according to claim 6 as a wafer mounting stage for supporting the wafer when processing the wafer.

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