JP2012129120A - Method for manufacturing magnet wire and apparatus for manufacturing magnet wire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently form an electrodeposition coating of a magnet wire, while preventing the elution of copper ions and the like and the generation of oxygen gas.SOLUTION: An electrodeposition coating 8 is gradually thickly formed on a bare copper wire 7, while arranging a plurality of electrodeposition baths 2, 3, and 4 in which an electrode 5 is soaked in electrodeposition varnish 6, applying gradually high voltages to these electrodeposition baths 2, 3, and 4, and causing the bare copper wire (conductor) 7 to pass through the first low voltage electrodeposition bath 2 to the third high voltage electrodeposition bath 4 in sequence.

Description

  The present invention relates to a magnet wire manufacturing method and a magnet wire manufacturing apparatus.

  2. Description of the Related Art Conventionally, a magnet wire (winding) used by being wound in a coil shape is known. As a manufacturing method of this magnet wire, for example, as disclosed in Patent Document 1, a wire-dispersed electrodeposition paint in which a small amount of a water-soluble additive or a water-dispersible additive is added to a water-dispersed electrodeposition paint is used. It is known to manufacture electrodeposited enameled wires that are electrodeposited and then baked after treatment with an organic solvent or organic solvent vapor.

JP 58-97217 A

  However, in the conventional electrodeposition method magnet wire manufacturing apparatus 101 as shown in FIG. 3, for example, an electrodeposition tank filled with an electrodeposition varnish 106 (a solution obtained by dissolving a resinous material including an electrodeposition material in a solvent). When the bare copper wire 107 is passed through the electrode 102, the electrode 105 is charged with a voltage and is electrodeposited. However, since the electrodeposited film 108 is formed and becomes gradually thicker, it becomes insulative, so that it is difficult for electricity to flow. Therefore, the electrodeposition coating 108 is hardly formed. It is possible to make the electrodeposition film 108 thicker by increasing the voltage to be charged, but when the bare copper wire 107 enters the electrodeposition tank 102, there is no electrodeposition film 108, and electricity flows most easily. When the portion is charged with a high voltage, the electrodeposition reaction and the water electrolysis reaction become intense, and elution of copper ions from the bare conductive wire 107 and generation of oxygen gas increase, which adversely affects the electrodeposition coating 108. Therefore, in such an electrodeposition method, it can be said that only a certain film thickness can be formed according to the coulomb efficiency (the thickness of the electrodeposition film generated per coulomb) of the electrodeposition varnish 106. There was a problem.

  This invention is made | formed in view of this point, The place made into the objective is to form efficiently the electrodeposition coating of a magnet wire, preventing elution of copper ion etc. and generation | occurrence | production of oxygen gas.

  In order to achieve the above object, in the present invention, a plurality of electrodeposition tanks are arranged, and different voltages are applied to the electrodeposition tanks to perform electrodeposition in multiple stages.

Specifically, in the first invention, on the premise of a magnet wire manufacturing method for forming an electrodeposition coating on a conductor,
A plurality of electrodeposition baths in which the electrodes are immersed in the electrodeposition varnish are arranged,
Gradually charge a high voltage to the plurality of electrodeposition baths,
The electrodeposition coating is formed so as to gradually increase in thickness while passing the conductor sequentially from a low voltage electrodeposition tank to a high voltage electrodeposition tank.

  That is, when the electrodeposition film becomes a complete insulator by drying and baking, it cannot be further electrodeposited, but can be further electrodeposited if the solvent before drying remains. . In the vicinity of the entrance of the first electrodeposition tank, it is easy to perform electrodeposition because it is in a conductor state, so a low voltage is charged to form a thin electrodeposition film, and then a certain electrodeposition film is formed. The copper wire is passed through the electrodeposition tank charged with the next higher voltage before the electrodeposition film is completely dried, that is, without heat treatment, and the electrodeposition film is further applied from above the thin electrodeposition film. Form. In the second and subsequent electrodeposition tanks, the conductor is already covered to some extent by the electrodeposition coating, so that it is difficult for copper ions to elute or oxygen gas to be generated even when a high voltage is applied. In this way, by passing the copper wire sequentially through the electrodeposition tank charged with a high voltage, it is thick without charging a higher voltage than necessary to elute copper ions or the like or generating oxygen gas. An electrodeposition coating is formed. As the conductor, a highly conductive metal such as copper, aluminum, copper alloy, copper clad aluminum, or nickel plated copper may be used.

In the second invention, in the first invention,
The concentration of the electrodeposition varnish is gradually increased according to the charged voltage.

  According to the above configuration, since the electrodeposition film gradually becomes thicker from the second electrodeposition tank, it becomes difficult to form the electrodeposition film gradually, but by increasing the concentration of the electrodeposition varnish accordingly, as much as possible A thick electrodeposition film is efficiently formed while preventing elution of copper ions and the generation of oxygen gas without increasing the charging voltage.

The third invention is directed to a magnet wire manufacturing apparatus for forming an electrodeposited coating on a conductor,
The manufacturing apparatus is
A plurality of electrodeposition tanks containing electrodeposition varnishes;
Electrodes immersed in the electrodeposition varnishes of the plurality of electrodeposition tanks, and charged from a low voltage to a high voltage for each electrodeposition tank;
And a conductor feeding device for sequentially passing a conductor from an electrodeposition tank having an electrode charged with a low voltage to an electrodeposition tank having an electrode charged with a high voltage.

  That is, when the electrodeposition film becomes a complete insulator by drying and baking, it cannot be further electrodeposited, but can be further electrodeposited if the solvent before drying remains. . In the vicinity of the entrance of the first electrodeposition tank, it is easy to perform electrodeposition because it is in a conductor state, so a low voltage is charged to form a thin electrodeposition film, and then a certain electrodeposition film is formed. The copper wire is passed through the electrodeposition tank charged with the next higher voltage by the conductor feeding device before the electrodeposition coating is completely dried, that is, without performing a heat treatment, etc., and from above the thin electrodeposition coating. Furthermore, an electrodeposition film is formed. In the second and subsequent electrodeposition tanks, since the conductor is already covered with the electrodeposition film, it is difficult for copper ions or the like to elute or to generate oxygen gas even when a high voltage is applied. In this way, by passing the copper wire through the electrodeposition tank charged sequentially with a high voltage by the conductor feeding device, the voltage is charged higher than necessary to elute copper ions and generate oxygen gas. Without forming a thick electrodeposition film.

  As described above, according to the present invention, a plurality of electrodeposition tanks are gradually charged with a high voltage, and a conductor is sequentially passed from a low voltage electrodeposition tank to a high voltage electrodeposition tank. In addition, since the electrodeposition film of the magnet wire can be efficiently formed while preventing elution of copper ions and the like and generation of oxygen gas, a magnet wire with high quality and low manufacturing cost can be obtained.

It is explanatory drawing which shows an example of the manufacturing method of the magnet wire of this invention. It is a flowchart which shows an example of the manufacturing method of the magnet wire of this invention. It is explanatory drawing which shows an example of the manufacturing method of the conventional magnet wire.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a manufacturing apparatus 1 for performing a method of manufacturing a magnet wire according to an embodiment of the present invention. This manufacturing apparatus 1 has a plurality of electrodeposition tanks 2, 3, 4. 3 and 4 are provided with an electrode 5, which is immersed in an electrodeposition varnish 6. Each electrode 5 is connected to anodes of power supplies 10, 11, and 12, and a bare copper wire 7 as a conductor is connected to cathodes of power supplies 10, 11, and 12. In FIG. 1, the number of electrodeposition tanks is three, but any number of electrodeposition tanks may be used as long as it is two or more. As the conductor, a highly conductive metal such as aluminum, copper alloy, copper clad aluminum, or nickel-plated copper can be used.

  The electrodeposition varnish 6 is not particularly limited as long as the electrodeposition coating 8 is easily attached when the bare copper wire 7 is charged, and becomes insulating when the electrodeposition coating 8 is formed. A resin containing a resin such as a polyester, a polyester, a urethane, or a polyimide is used. Polyimide resins have the advantages of high heat resistance, good electrical insulation, and high mechanical strength. Acrylic resins and epoxy resins have low heat resistance but high mechanical strength. Urethane resins and polyester resins have low heat resistance, but are easy to peel off because they are easily decomposed by heat.

  The length in the direction in which the bare copper wire 7 travels in each electrodeposition tank 2, 3, 4 is, for example, a relatively short length of about 20 cm.

  For example, by adjusting the power supplies 10, 11, and 12 to 10V, 20V, and 30V, the first electrodeposition tank 2 is 10V, the second electrodeposition tank 3 is 20V, and the third electrodeposition tank 4 is charged. Set to 30V. The degree to which the voltage is increased should be moderate as the number of electrodeposition tanks 2, 3, and 4 increases. The concentration of the electrodeposition varnish 6 may be gradually increased from the first electrodeposition tank 2 to the third electrodeposition tank 4 as the voltage increases.

  The bare copper wire 7 has an outer diameter of, for example, 0.1 to 2.0 mm, and is drawn out at a speed of, for example, 5 to 10 m / min by a conductor feeding device 9 around which the bare copper wire 7 is wound. The magnet wire on which the electrodeposited film 8 is formed is completely dried by a drying device or a printing device (not shown), and after being baked, it is wound on a winding device. What is necessary is just to set the distance between each electrodeposition tank 2,3,4 so that the solvent in the electrodeposition varnish 6 may not dry completely at normal temperature. The thickness of the electrodeposition coating 8 is, for example, 5 to 30 μm.

-Manufacturing method of magnet wire-
Next, the manufacturing method of the magnet wire concerning this embodiment is demonstrated.

  First, as shown in FIG. 2, in step S01, a plurality of electrodeposition tanks 2, 3, and 4 in which the electrode 5 is first immersed in the electrodeposition varnish 6 and a conductor feeding device 9 that feeds the bare copper wire 7 are provided. prepare.

  For example, the three electrodeposition tanks 2, 3 and 4 are gradually charged with a high voltage (10V, 20V, 30V). That is, the negative side of the power supplies 10, 11 and 12 for generating voltages 10V, 20V and 30V, respectively, is connected to the bare copper wire 7, and the positive side is connected to the electrodes 5 of the electrodeposition tanks 2, 3 and 4.

  Next, in steps 02 to 04, the bare copper wire 7 is fed out at a speed of, for example, 5 to 10 m / min, and sequentially passed from the first electrodeposition tank 2 having a low voltage to the third electrodeposition tank 4 having a high voltage.

  First, in the first electrodeposition process of step S02, the bare copper wire 7 entering the first electrodeposition tank 2 is gradually formed with an electrodeposition film 8 due to a potential difference with the electrode 5 charged with a voltage of 10V, The thickness of this electrodeposition coating 8 is the thickest in the vicinity of the outlet of the first electrodeposition tank 2. In the vicinity of the entrance of the first electrodeposition tank 2, the bare copper wire 7 is not coated with an insulator, so that an excessive electrodeposition reaction and an electrolysis reaction of water are likely to occur, but the voltage of the electrode 5 is set to 10V. Therefore, the generation of copper ions and oxygen gas can be suppressed.

  Next, in the second electrodeposition step of step S03, the film of the electrodeposition coating 8 formed on the bare copper wire 7 is quickly coated on the second electrodeposition bath 3 at room temperature without drying, that is, without heating. The bare copper wire 7 is passed through. That is, when the electrodeposition coating 8 becomes a complete insulator by drying and baking, it cannot be further electrodeposited, but can be further electrodeposited if the solvent before drying remains. it can. At this time, since the electrodeposition coating 8 having a certain thickness is already formed on the bare copper wire 7, the electrodeposition reaction is slightly less likely to occur. For this reason, in the second electrodeposition tank 3, even when the electrode 5 is charged with a voltage of 20 V, which is higher than that of the first electrodeposition tank 2, an excessive electrodeposition reaction and an electrolysis reaction of water occur. In addition, the electrodeposition film 8 is further formed.

  Next, in the third electrodeposition step of step S04, the bare copper wire 7 coated before the solvent of the electrodeposition coating 8 formed thicker on the bare copper wire 7 is completely dried is quickly applied to the third electrodeposition tank 4. To pass through. Again, the solvent will not dry out unless heated at room temperature. Since this bare copper wire 7 has a thicker electrodeposition coating 8, an electrodeposition reaction is less likely to occur. In the third electrodeposition tank 4, the electrode 5 is charged with a voltage of 30V, which is higher than that of the second electrodeposition tank 3, but since the electrodeposition film 8 is already formed at this time, it is excessive. Further, the electrodeposition coating 8 is formed without causing any electrodeposition reaction and water electrolysis reaction.

  Next, in a cleaning process in step S05, the organic solvent is passed through a solvent tank (not shown). As the organic solvent, a solvent which swells or dissolves the electrodeposition coating 8 before being dried or baked or before reaching the state is used. This washing step is not essential.

  Next, in the drying process of step S06, the magnet wire after cleaning is introduced into a drying device (not shown). Thereby, the magnet wire after washing is heated, and the organic solvent and water in the electrodeposition coating 8 are removed by evaporation. Although the temperature of a drying apparatus can be suitably selected according to the kind of organic solvent, generally it is about 60-300 degreeC, Preferably it is about 100-250 degreeC. In order to simultaneously promote the evaporation of the liquid or the semi-curing or complete curing of the electrodeposition coating 8 in the drying step or in the previous stage, for example, a high temperature treatment of about 200 to 500 ° C. may be applied.

  Next, in the baking step of step S07, the electrodeposition coating 8 is cured by a baking furnace (not shown) to complete the electrodeposition coating 8. The baking temperature is usually 100 to 700 ° C, preferably 150 to 600 ° C, more preferably 170 to 300 ° C. Moreover, you may perform a drying process and a baking process through a series of heating apparatuses.

  In this way, a magnet wire having a thick electrodeposition coating 8 formed on the bare copper wire 7 is obtained, and the obtained magnet wire is wound up by a winder (not shown).

  Thus, the electrodeposition tank is divided into three, and the length in the direction in which the bare copper wire 7 of each electrodeposition tank 2, 3, 4 travels is kept as short as about 20 cm. It helps to prevent the generation of ions and oxygen gas. That is, as the length of each electrodeposition tank 2, 3, 4 increases, the difference in thickness of the electrodeposition coating 8 increases, and the difference in current flowing depending on the location increases. The electrodeposition reaction and water electrolysis reaction become intense near the entrance of the steel, and there is a problem that a large amount of copper ions and oxygen gas is generated. This problem shortens the length of each electrodeposition tank 2, 3, 4 Has been avoided.

  By increasing the number of electrodeposition tanks 2, 3, and 4, the length of each electrodeposition tank 2, 3, 4 is reduced, so that the electrodeposition of the same thickness as before can be performed without increasing the voltage more than necessary. A coating 8 is obtained.

  In addition, since the difference in current flowing through the bare copper wire 7 in each electrodeposition tank 2, 3, 4 is kept small, it is possible to apply a high voltage while suppressing the generation of copper ions and oxygen gas. A thick electrodeposition coating 8 can be formed.

  Further, when the concentration of the electrodeposition varnish 6 is gradually increased in accordance with the voltage to be charged, the electrodeposition coating 8 is gradually thickened from the second electrodeposition tank 3, so that the electrodeposition coating 8 is gradually formed. Although it becomes difficult, by increasing the concentration of the electrodeposition varnish 6 accordingly, a thick electrodeposition coating 8 can be efficiently formed while preventing the elution of copper ions and the generation of oxygen gas by preventing the charging voltage from being increased as much as possible. Can be formed.

  Therefore, according to the method for manufacturing a magnet wire according to the present embodiment, a plurality of electrodeposition tanks 2, 3 and 4 are gradually charged with a high voltage, and the length of the bare copper wire 7 in the traveling direction is kept short. Since the low-voltage first electrodeposition tank 2 is sequentially passed through the high-voltage third electrodeposition tank 4, the electrodeposition coating 8 of the magnet wire is efficiently prevented while preventing elution of copper ions and generation of oxygen gas. Can be formed. For this reason, since the adverse effect on the electrodeposition coating 8 is minimized, a magnet wire with high quality and low manufacturing cost can be obtained.

  In addition, the above embodiment is an essentially preferable illustration, Comprising: It does not intend restrict | limiting the range of this invention, its application thing, or a use.

  As described above, the present invention is useful for a magnet wire manufacturing method and a magnet wire manufacturing apparatus.

DESCRIPTION OF SYMBOLS 1 Manufacturing apparatus 2 1st electrodeposition tank 3 2nd electrodeposition tank 4 3rd electrodeposition tank 5 Electrode 6 Electrodeposition varnish 7 Bare copper wire 8 Electrodeposition coating 9 Conductor feeding apparatus

Claims (3)

In the method of manufacturing a magnet wire for forming an electrodeposition film on a conductor,
A plurality of electrodeposition baths in which the electrodes are immersed in the electrodeposition varnish are arranged,
Gradually charge a high voltage to the plurality of electrodeposition baths,
A method for producing a magnet wire, characterized in that the electrodeposition coating is formed gradually thick while the conductor is sequentially passed from a low voltage electrodeposition tank to a high voltage electrodeposition tank. In the manufacturing method of the magnet wire of Claim 1,
A method for producing a magnet wire, characterized in that the concentration of the electrodeposition varnish is gradually increased in accordance with the charged voltage. In a magnet wire manufacturing apparatus that forms an electrodeposition coating on a conductor,
A plurality of electrodeposition tanks containing electrodeposition varnishes;
Electrodes immersed in the electrodeposition varnishes of the plurality of electrodeposition tanks, and charged from a low voltage to a high voltage for each electrodeposition tank;
An apparatus for producing a magnet wire, comprising: a conductor feeding device for sequentially passing a conductor from an electrodeposition tank having an electrode charged with a low voltage to an electrodeposition tank having an electrode charged with a high voltage.

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