JP2012124435A - Substrate processing device, substrate processing method, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device which suppresses the occurence of defective devices.SOLUTION: A substrate processing device includes: a first transfer mechanism transferring a belt-like substrate from a first supply part to a first recovery part; a first device attaching a cover member to at least a part of a rear surface of the substrate transferred from the first supply part; a surface treatment device performing treatment on a surface of the substrate transferred from the first device with the cover member attached to the rear surface; and a second device which is disposed between the surface treatment device and the first recovery part and removes the cover member from the substrate transferred from the surface treatment device.

Description

  The present invention relates to a substrate processing apparatus, a substrate processing method, and a device manufacturing method.

  As a substrate processing apparatus used in a manufacturing process of a display device, an electronic device, etc., for example, a roll-to-roll type substrate processing apparatus as disclosed in the following patent document has been devised.

US Patent Publication No. 2008/0213621

  In the substrate processing apparatus, for example, when an unnecessary part of the substrate is processed or a foreign object adheres to the substrate, a defective device may occur.

  An object of an aspect of the present invention is to provide a substrate processing apparatus, a substrate processing method, and a device manufacturing method that can suppress the occurrence of defective devices.

  According to the first aspect of the present invention, the first feeding mechanism for feeding the belt-like substrate from the first supply unit to the first recovery unit, and the cover on at least a part of the back surface of the substrate sent from the first supply unit A first apparatus for wearing a member, a surface treatment apparatus for treating the surface of a substrate sent from the first apparatus with a cover member attached to the back surface, and a surface treatment apparatus disposed between the surface treatment apparatus and the first recovery unit And a second apparatus for separating the cover member from the substrate sent from the surface processing apparatus.

  According to a second aspect of the present invention, there is provided a device manufacturing method including processing a substrate using the substrate processing apparatus according to the first aspect and processing the processed substrate.

  According to the third aspect of the present invention, at least a part of the wound belt-like substrate is sent out from the first supply unit, and a cover member is applied to at least a part of the back surface of the substrate sent from the first supply unit. The first surface of the substrate that has been removed from the cover member, the substrate surface being processed with the cover member attached to the back surface, the cover member being separated from the substrate that has been subjected to the surface treatment; And a substrate processing method including collecting and winding from the section.

  According to a fourth aspect of the present invention, there is provided a device manufacturing method including processing a substrate using the substrate processing method according to the third aspect and processing the processed substrate.

  According to the aspect of the present invention, it is possible to suppress the occurrence of defective devices.

It is a figure which shows an example of the substrate processing apparatus which concerns on 1st Embodiment. It is a figure showing an example of the 1st device concerning a 1st embodiment. It is a figure which shows an example of the surface treatment apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the 2nd apparatus which concerns on 1st Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 2nd Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 3rd Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 4th Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 5th Embodiment. It is a figure which shows an example of the surface treatment apparatus which concerns on 5th Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 6th Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 7th Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 8th Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 9th Embodiment. It is a figure which shows an example of the substrate processing apparatus which concerns on 10th Embodiment. It is a figure which shows an example of the 1st apparatus which concerns on 11th Embodiment. It is a figure which shows an example of the 2nd apparatus which concerns on 12th Embodiment. It is a schematic diagram for demonstrating an example of the device manufacturing method which concerns on 13th Embodiment. It is a schematic diagram for demonstrating an example of the device manufacturing method which concerns on 13th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

<First Embodiment>
A first embodiment will be described. FIG. 1 is a diagram illustrating an example of a substrate processing apparatus RT1 according to the first embodiment. The substrate processing apparatus RT1 according to the present embodiment is a so-called roll-to-roller that feeds and processes at least a part of a belt-shaped substrate P wound in a roll shape, and then winds the processed substrate P in a roll shape. This is a roll-type substrate processing apparatus.

  In FIG. 1, a substrate processing apparatus RT1 includes a first supply unit 1 on which a strip-shaped substrate P wound in a roll shape is disposed, and a surface for processing the surface pa of the substrate P sent from the first supply unit 1. A processing apparatus 2, a first recovery unit 3 that recovers a substrate P that has been processed by the surface processing apparatus 2, and a first feeding mechanism that sends a strip-shaped substrate P from the first supply unit 1 to the first recovery unit 3. 4 and a control device 5 for controlling the overall operation of the substrate processing apparatus RT1.

  In the present embodiment, the substrate P is a belt-shaped substrate that is long in the first direction. The substrate P has a predetermined dimension (width) in a second direction that intersects the first direction. The dimension of the substrate P in the first direction is sufficiently larger than the dimension of the substrate P in the second direction. The substrate P is flexible and can be bent. The substrate P has a strength that does not break even when a predetermined force of its own weight is applied. The substrate P has a front surface pa and a back surface pb facing the opposite direction of the front surface pa. The surface processing apparatus 2 processes at least a part of the surface pa of the substrate P.

  In the present embodiment, the substrate processing apparatus RT1 includes a first device 6 that attaches the cover member C to at least a part of the back surface pb of the substrate P, and a second device 7 that separates the cover member C from the substrate P. Yes.

  In the present embodiment, the first device 6, the surface treatment device 2, and the second device 7 are disposed between the first supply unit 1 and the first recovery unit 3. The first device 6 is disposed between the first supply unit 1 and the surface treatment device 2. The second device 7 is disposed between the surface treatment device 2 and the first recovery unit 3.

  The first feeding mechanism 4 sends the substrate P from the first supply unit 1 to the first device 6. The first feed mechanism 4 sends the substrate P from the first device 6 to the surface treatment device 2. The first feed mechanism 4 sends the substrate P from the surface treatment apparatus 2 to the second apparatus 7. The first feeding mechanism 4 sends the substrate P from the second device 7 to the first collection unit 3. That is, in the present embodiment, the control device 5 sends out the substrate P of the first supply unit 1 from the first supply unit 1, passes through the first device 6, the surface treatment device 2, and the second device 7, The first feeding mechanism 4 is controlled so as to be sent to the one recovery unit 3.

  In the present embodiment, the first device 6 attaches the cover member C to at least a part of the back surface pb of the substrate P sent from the first supply unit 1. The substrate P is sent to the surface treatment apparatus 2 with the cover member C attached to the back surface pb in the first apparatus 6. The surface processing apparatus 2 processes the surface pa of the substrate P sent from the first apparatus 6 with the cover member C attached to the back surface pb. The substrate P processed in the surface processing apparatus 2 is sent to the second apparatus 7. The second device 7 separates the cover member C from the substrate P sent from the surface treatment device 2. The second device 7 separates the cover member C from the back surface pb of the substrate P before being sent to the first recovery unit 3.

  The first supply unit 1 includes a supply roller 1 </ b> R that supports the roll-shaped substrate P. The supply roller 1R can rotate around the shaft 1A. In the present embodiment, the supply roller 1R is rotatable in the θY direction. The roll-shaped substrate P is disposed around the supply roller 1R. In the present embodiment, the first supply unit 1 has a supply chamber 1C that forms a space in which the supply roller 1R is disposed. At least a part of the substrate P supported by the supply roller 1R is sent out from a supply port (opening) 1K formed in a part of the supply chamber 1C.

  The first recovery unit 3 includes a recovery roller 3R that winds the recovered substrate P in a roll shape. The collection roller 3R can rotate around the shaft 3A. In the present embodiment, the collection roller 3R is rotatable in the θY direction. The first collection unit 3 rotates the collection roller 3R and winds the substrate P from the first feed mechanism 4 by the collection roller 3R. The rolled substrate P that has been wound is disposed around the collection roller 3R. In the present embodiment, the first collection unit 3 has a collection chamber 3C that forms a space in which the collection roller 3R is disposed. The substrate P from the first feeding mechanism 4 is recovered from a recovery port (opening) 3K formed in a part of the recovery chamber 1C.

  In the present embodiment, the first supply unit 1 includes the supply chamber 1C, but the supply chamber 1C may be omitted. In the present embodiment, the first recovery unit 3 includes the recovery chamber 3C, but the recovery chamber 3C may be omitted.

  In the present embodiment, the substrate processing apparatus RT1 includes the first supply unit 1, but the first supply unit 1 is an external device with respect to the substrate processing apparatus RT1 (an apparatus different from the substrate processing apparatus RT1). ) In the present embodiment, the substrate processing apparatus RT1 includes the first recovery unit 3, but the first recovery unit 3 is an external device (an apparatus different from the substrate processing apparatus RT1) with respect to the substrate processing apparatus RT1. )

  The first feed mechanism 4 is disposed between the first supply unit 1 and the surface treatment apparatus 2, and is provided between the conveyance roller 8 that can rotate around the shaft 8 </ b> A, and between the surface treatment apparatus 2 and the first recovery unit 3. And a conveying roller 9 that is rotatable about a shaft 9A. In the present embodiment, each of the transport roller 8 and the transport roller 9 can rotate in the θY direction. The transport roller 8 is disposed at a position where the substrate P from the first supply unit 1 can come into contact, and sends the substrate P from the first supply unit 1 to the surface processing apparatus 2 while contacting at least a part of the substrate P. Rotate like so. The transport roller 9 is disposed at a position where the substrate P from the surface treatment apparatus 2 can come into contact with the substrate, and sends the substrate P from the surface treatment apparatus 2 to the first recovery unit 3 while contacting at least a part of the substrate P. Rotate to.

  In the present embodiment, the transport roller 8 is disposed at a position where the surface pa of the substrate P can be opposed. Further, the transport roller 9 is disposed at a position where the surface pa of the substrate P can be opposed. In the present embodiment, the transport roller 8 rotates so as to send the substrate P to the surface processing apparatus 2 while contacting at least part of the surface pa of the substrate P. The transport roller 9 rotates to send the substrate P to the first collection unit 3 while contacting at least a part of the surface pa of the substrate P.

  In the present embodiment, the transport roller 8 may be a suction roller (suction roller) having a function of sucking the substrate P (suction function). That is, the transport roller 8 may rotate while adsorbing the substrate P. The conveyance roller 8 may not have a suction function. Further, in the present embodiment, the transport roller 9 may or may not have a suction function.

  The surface treatment apparatus 2 is disposed between the transport roller 8 and the transport roller 9. In the present embodiment, the shaft 8A of the transport roller 8 and the shaft 9A of the transport roller 9 are arranged at the same position (height) in the Z-axis direction. In the present embodiment, the diameter (size) of the transport roller 8 and the diameter (size) of the transport roller 9 are equal. In the present embodiment, the first feed mechanism 4 feeds the substrate P in the + X direction between the transport roller 8 and the transport roller 9. Further, the first feed mechanism 4 uses the transport roller 8 and the transport roller 9 so that the front surface pa (back surface pb) of the substrate P and the XY plane are substantially parallel between the transport roller 8 and the transport roller 9. While supporting P, the substrate P is sent in the + X direction. In the surface treatment apparatus 2, the front surface pa (back surface pb) of the substrate P is substantially parallel to the XY plane. The surface processing apparatus 2 processes at least a part of the surface pa of the substrate P supported by the first feeding mechanism 4 so that the front surface pa (back surface pb) is substantially parallel to the XY plane.

  That is, in the present embodiment, the first feed mechanism 4 transports the substrate P while supporting the substrate P so that the substrate P does not loosen between the transport roller 8 and the transport roller 9. The surface processing apparatus 2 processes at least a part of the surface pa of the substrate P that is supported by the first feeding mechanism 4 so as not to be loosened.

  In the present embodiment, the diameter (dimension) of the conveyance roller 8 and the diameter (dimension) of the conveyance roller 9 may be different. In the surface treatment apparatus 2, the front surface pa (back surface pb) of the substrate P may be inclined with respect to the XY plane. In the surface treatment apparatus 2, the substrate P may be loose.

  In the present embodiment, the substrate processing apparatus RT1 includes a second feeding mechanism 10 that feeds the cover member C. In the present embodiment, the second feeding mechanism 10 feeds the cover member C in synchronization with the substrate P in at least a part between the first supply unit 1 and the first recovery unit 3.

  In the present embodiment, the cover member C is a band-shaped member. In this embodiment, the cover member C is a belt-shaped substrate that is long in the first direction. The cover member C has a predetermined dimension (width) in a second direction intersecting the first direction. The dimension of the cover member C in the first direction is sufficiently larger than the dimension of the cover member C in the second direction. The cover member C is flexible and can be bent. Note that the cover member C has a strength that does not break even when a predetermined force of its own weight is applied. The cover member C has a front surface ca and a back surface cb facing the opposite direction of the front surface ca.

  In the present embodiment, the substrate processing apparatus RT1 includes a second supply unit 11 in which a strip-shaped cover member C wound in a roll shape is disposed, and a second recovery unit that recovers the cover member C from the second supply unit 11. 12. The second feed mechanism 10 sends the cover member C from the second supply unit 11 to the second collection unit 12.

  In the present embodiment, the first device 6, the surface treatment device 2, and the second device 7 are disposed between the second supply unit 11 and the second recovery unit 12. The first device 6 is disposed between the second supply unit 11 and the surface treatment device 2. The second device 7 is disposed between the surface treatment device 2 and the second recovery unit 12.

  The second feed mechanism 10 sends the cover member C from the second supply unit 11 to the first device 6. The second feed mechanism 10 sends the cover member C from the first device 6 to the surface treatment device 2. The second feed mechanism 10 sends the cover member C from the surface treatment device 2 to the second device 7. In addition, the second feed mechanism 10 sends the cover member C from the second device 7 to the second collection unit 12. That is, in the present embodiment, the control device 5 is configured such that the cover member C of the second supply unit 11 is sent from the second supply unit 11 and passes through the first device 6, the surface treatment device 2, and the second device 7. The second feed mechanism 10 is controlled so as to be sent to the second recovery unit 12.

  In the present embodiment, the first device 6 puts the cover member C sent from the second supply unit 11 on at least a part of the back surface pb of the substrate P sent from the first supply unit 1. The second feed mechanism 10 sends the cover member C in synchronization with the substrate P sent by the first feed mechanism 4 at least between the first device 6 and the second device 7.

  That is, after the cover member C is attached to the back surface pb of the substrate P in the first device 6, the second feed mechanism 10 cooperates with the first feed mechanism 4 to the substrate P and the back surface pb of the substrate P. The attached cover member C is sent from the first device 6 to the surface treatment device 2. Further, the second feeding mechanism 10 cooperates with the first feeding mechanism 4 to send the substrate P and the cover member C attached to the back surface pb of the substrate P from the surface treatment apparatus 2 to the second apparatus 7. The second device 7 separates the cover member C from the substrate P sent from the surface treatment device 2. The second feed mechanism 10 sends the cover member C from the second device 7 to the second collection unit 12.

  The second supply unit 11 includes a supply roller 11R that supports the roll-shaped cover member C. The supply roller 11R can rotate around the shaft 11A. In the present embodiment, the supply roller 11R is rotatable in the θY direction. The roll-shaped cover member C is disposed around the supply roller 11R. In the present embodiment, the second supply unit 11 includes a supply chamber 11C that forms a space in which the supply roller 11R is disposed. At least a part of the cover member C supported by the supply roller 11R is sent out from a supply port (opening) 11K formed in a part of the supply chamber 11C.

  The second recovery unit 12 includes a recovery roller 12R that winds the recovered cover member C in a roll shape. The collection roller 12R can rotate around the shaft 12A. In the present embodiment, the collection roller 12R is rotatable in the θY direction. The second collection unit 12 rotates the collection roller 12R and winds the cover member C from the second feed mechanism 10 by the collection roller 12R. The roll-shaped cover member C wound up is disposed around the collection roller 12R. In the present embodiment, the second collection unit 12 has a collection chamber 12C that forms a space in which the collection roller 12R is disposed. The cover member C from the second feed mechanism 10 is recovered from a recovery port (opening) 12K formed in a part of the recovery chamber 12C.

  In the present embodiment, the second supply unit 11 includes the supply chamber 11C, but the supply chamber 11C may be omitted. In the present embodiment, the second recovery unit 12 includes the recovery chamber 12C, but the recovery chamber 12C may not be provided.

  In the present embodiment, the substrate processing apparatus RT1 includes the second supply unit 11, but the second supply unit 11 is an external device (an apparatus different from the substrate processing apparatus RT1) with respect to the substrate processing apparatus RT1. ) In the present embodiment, the substrate processing apparatus RT1 includes the second recovery unit 12. However, the second recovery unit 12 is an external device (an apparatus different from the substrate processing apparatus RT1) with respect to the substrate processing apparatus RT1. )

  The second feed mechanism 10 is disposed between the second supply unit 11 and the surface treatment apparatus 2, and is provided between the conveyance roller 13 that can rotate around the shaft 13 </ b> A, and between the surface treatment apparatus 2 and the second recovery unit 12. And a conveyance roller 14 that is rotatable about a shaft 14A. In the present embodiment, each of the transport roller 13 and the transport roller 14 is rotatable in the θY direction. The transport roller 13 is disposed at a position where the cover member C from the second supply unit 11 can come into contact with the surface, and the cover member C from the second supply unit 11 is surface-treated while contacting at least part of the cover member C. Rotate to send to 2. The transport roller 14 is disposed at a position where the cover member C from the surface treatment apparatus 2 can come into contact with the cover roller C, and the second collection unit 12 removes the cover member C from the surface treatment apparatus 2 while contacting at least part of the cover member C. Rotate to send to.

  In the present embodiment, the transport roller 13 is disposed at a position where the surface ca of the cover member C can be opposed. Further, the transport roller 14 is disposed at a position where the surface ca of the cover member C can be opposed. In the present embodiment, the conveyance roller 13 rotates to send the cover member C to the surface treatment apparatus 2 while contacting at least part of the surface ca of the cover member C. The conveyance roller 14 rotates to send the cover member C to the second collection unit 12 while contacting at least a part of the surface ca of the cover member C.

  In the present embodiment, the conveyance roller 13 may be a suction roller (suction roller) having a function of sucking the cover member C (suction function). That is, the conveyance roller 13 may rotate while adsorbing the cover member C. The conveyance roller 13 may not have a suction function. In the present embodiment, the transport roller 14 may or may not have a suction function.

  The surface treatment apparatus 2 is disposed between the conveyance roller 13 and the conveyance roller 14. In the present embodiment, the shaft 13A of the transport roller 13 and the shaft 14A of the transport roller 14 are arranged at the same position (height) in the Z-axis direction. In the present embodiment, the diameter (size) of the transport roller 13 and the diameter (size) of the transport roller 14 are equal. In the present embodiment, the second feed mechanism 10 feeds the cover member C in the + X direction between the transport roller 13 and the transport roller 14. Further, the second feed mechanism 10 includes the transport roller 13 and the transport roller 14 so that the front surface ca (back surface cb) of the cover member C and the XY plane are substantially parallel between the transport roller 13 and the transport roller 14. While supporting the cover member C, the cover member C is sent in the + X direction. In the surface treatment apparatus 2, the front surface ca (back surface cb) of the cover member C is substantially parallel to the XY plane.

  That is, in the present embodiment, the second feeding mechanism 10 conveys the cover member C while supporting the cover member C so that the cover member C does not loosen between the conveyance roller 13 and the conveyance roller 14.

  In the present embodiment, the diameter (dimension) of the conveyance roller 13 and the diameter (dimension) of the conveyance roller 14 may be different.

  FIG. 2 is a diagram illustrating an example of the first device 6 according to the present embodiment. In the present embodiment, the first device 6 includes the substrate P and the cover member C between the transport roller 8 of the first feed mechanism 4 disposed at a position where the surface pa of the substrate P can be opposed, and the transport roller 8. And a transport roller 13 of the second feed mechanism 10 that sandwiches the. The first device 6 puts the cover member C on at least a part of the back surface pb of the substrate P by sandwiching the substrate P and the cover member C between the transport roller 8 and the transport roller 13. That is, in this embodiment, one of the transport roller 8 and the transport roller 13 functions as a nip roller that sandwiches the substrate P and the cover member C between the other.

  In the present embodiment, the first device 6 attaches the cover member C to the substrate P so that the back surface pb of the substrate P and the back surface cb of the cover member C face each other. In other words, the first device 6 attaches the cover member C to the substrate P so that the back surface pb of the substrate P and the back surface cb of the cover member C are in contact with each other. In a state where the back surface pb of the substrate P and the back surface cb of the cover member C are opposed to each other, the transport roller 8 disposed at a position where the surface pa of the substrate P is opposed to the surface ca of the cover member C is disposed at a position opposed to each other. By sandwiching the substrate P and the cover member C by the transport roller 13, the back surface pb of the substrate P and the back surface cb of the cover member C are brought into close contact with each other.

  In the present embodiment, the transport roller 13 of the second feed mechanism 10 is disposed at a position where the substrate P and the cover member C can be sandwiched between the transport roller 8 of the first feed mechanism 4. In other words, the transport roller 8 of the first feed mechanism 4 and the transport roller 13 of the second feed mechanism 10 face each other without the substrate P and the cover member C between the transport roller 8 and the transport roller 13. Are arranged as follows.

  In the present embodiment, the transport roller 8 and the transport roller 13 are arranged in the Z-axis direction. That is, the transport roller 8 and the transport roller 13 are in a direction (Z-axis direction) intersecting the direction (X-axis direction) in which the substrate P and the cover member C are sent between the first device 6 and the second device 7. Has been placed.

  In the present embodiment, the diameter (dimension) of the conveyance roller 8 and the diameter (dimension) of the conveyance roller 13 are substantially equal. Further, the shaft 8 </ b> A of the transport roller 8 and the shaft 13 </ b> A of the transport roller 13 are disposed at the same position with respect to the X-axis direction.

  In addition, the diameter (dimension) of the conveyance roller 8 and the diameter (dimension) of the conveyance roller 13 may be different. For example, the diameter (dimension) of the conveyance roller 8 may be larger or smaller than the diameter (dimension) of the conveyance roller 13. Further, the shaft 8A of the transport roller 8 and the shaft 13A of the transport roller 13 may be arranged at different positions in the X-axis direction. For example, the shaft 8A of the transport roller 8 may be disposed on the + X side with respect to the shaft 13A of the transport roller 13 or may be disposed on the −X side.

  In the present embodiment, the first device 6 puts the cover member C on the substrate P while the substrate P is being sent. Further, the first device 6 attaches the cover member C to the substrate P in a state where the substrate P and the cover member C are sent in synchronization. That is, in the present embodiment, the cover member C is attached to the substrate P in a state where the substrate P and the cover member C are sent in synchronization.

  In the present embodiment, the substrate P includes polyethylene terephthalate. In the present embodiment, the substrate P is made of polyethylene terephthalate. The substrate P may include both polyethylene terephthalate and other materials. The other material includes at least one of a synthetic resin, an additive, and a dispersant different from polyethylene terephthalate. In the present embodiment, the back surface cb of the cover member C that contacts the back surface pb of the substrate P includes at least polyurethane. As a result, the back surface pb of the substrate P and the back surface cb of the cover member C are brought into close contact with each other by pressing the cover member C against the substrate P with the substrate P and the cover member C interposed therebetween.

  When the substrate P includes polyethylene terephthalate, the back surface cb of the cover member C may include silicon rubber. Further, the back surface cb of the cover member C may include both polyurethane and silicon rubber. Also in this case, the back surface pb of the substrate P and the back surface cb of the cover member C can be brought into close contact with each other.

  The substrate P may contain polyimide. In this case, the back surface cb of the cover member C includes either one or both of polyurethane and silicon rubber, so that the back surface pb of the substrate P and the back surface cb of the cover member C can be brought into close contact with each other.

  Further, the substrate P may include polyethylene naphthalate. In this case, the back surface cb of the cover member C includes either one or both of polyurethane and silicon rubber, so that the back surface pb of the substrate P and the back surface cb of the cover member C can be brought into close contact with each other.

  FIG. 3 is a diagram illustrating an example of the surface treatment apparatus 2 according to the present embodiment. The surface processing apparatus 2 processes the surface pa of the substrate P in which the cover member C is in close contact with the back surface pb. In the present embodiment, in the surface treatment apparatus 2, the entire back surface pb of the substrate P is covered with the cover member C. In the surface treatment apparatus 2, a part of the back surface pb of the substrate P may not be covered with the cover member C.

  In the present embodiment, in the surface treatment apparatus 2, the surface pa of the substrate P is not covered with the cover member C. In other words, the surface pa of the substrate P is exposed to a space (processing space) where processing by the surface processing apparatus 2 is performed.

  In the present embodiment, the process of the surface pa of the substrate P in the surface treatment apparatus 2 includes a process of supplying a liquid to the surface pa of the substrate P. In the present embodiment, as shown in FIG. 3, the surface treatment apparatus 2 includes an inkjet head 2J that supplies liquid droplets (droplets) LD. The surface treatment apparatus 2 supplies the droplet LD from the ink jet head 2J to the surface pa of the substrate P with the cover member C attached to the back surface pb. Thereby, a pattern (device pattern) is formed on the surface pa of the substrate P with the droplets LD supplied from the inkjet head 2J.

  In the present embodiment, the control device 5 supplies the droplet LD from the inkjet head 2J to the substrate P while moving the substrate P and the cover member C. When the surface treatment device 2 is provided with a drive mechanism that moves the inkjet head 2J, the control device 5 moves both the inkjet head 2J and the substrate P to the substrate P from the inkjet head 2J. A droplet LD may be supplied. For example, the control device 5 may supply the droplets LD from the inkjet head 2J to the substrate P while moving the inkjet head 2J in the Y-axis direction while feeding the substrate P in the + X direction. A plurality of inkjet heads 2J may be arranged in the Y-axis direction.

  The control device 5 may supply the droplets LD from the inkjet head 2J to the substrate P in a state where the movement of the substrate P is stopped.

  FIG. 4 is a diagram illustrating an example of the second device 7 according to the present embodiment. In the present embodiment, the second device 7 feeds the cover member C in a direction different from the feeding direction of the substrate P by the first feeding mechanism 4. In the present embodiment, the second feeding mechanism 10 feeds the cover member C in a direction different from the feeding direction of the substrate P by the first feeding mechanism 4. That is, in the present embodiment, the second device 7 includes at least a part of the second feeding mechanism 10.

  In the present embodiment, the second device 7 has a transport roller 9 of the first feed mechanism 4 disposed at a position where the surface pa of the substrate P can be opposed, and a direction different from the feed direction of the substrate P by the first feed mechanism 4. And a transport roller 14 of the second feed mechanism 10 that feeds the cover member C to the head.

  In the present embodiment, the first feeding mechanism 4 feeds the substrate P in the + Z direction while feeding the substrate P in the + X direction by the transport roller 9. On the other hand, the second feed mechanism 10 feeds the cover member C in the −Z direction while feeding the cover member C in the + X direction in the transport roller 14. The substrate P is guided by the transport roller 9 and moves in the + Z direction while moving in the + X direction. On the other hand, the cover member C is guided by the transport roller 14 and moves in the −Z direction while moving in the + X direction.

  In the present embodiment, the transport roller 9 of the first feed mechanism 4 and the transport roller 14 of the second feed mechanism 10 face each other without the substrate P and the cover member C between the transport roller 9 and the transport roller 14. To be arranged. In the present embodiment, the transport roller 9 and the transport roller 14 are arranged in the Z-axis direction. In the present embodiment, the substrate P and the cover member C move from the surface treatment apparatus 2 to between the transport roller 9 and the transport roller 14. The substrate P and the cover member C are sent in different directions after passing between the transport roller 9 and the transport roller 14. As a result, the cover member C is separated from the substrate P.

  In the present embodiment, the diameter (dimension) of the conveyance roller 9 and the diameter (dimension) of the conveyance roller 14 are substantially equal. Further, the shaft 9 </ b> A of the transport roller 9 and the shaft 14 </ b> A of the transport roller 14 are disposed at the same position with respect to the X-axis direction.

  The diameter (size) of the transport roller 9 and the diameter (size) of the transport roller 14 may be different. For example, the diameter (dimension) of the conveyance roller 9 may be larger or smaller than the diameter (dimension) of the conveyance roller 14. Further, the shaft 9A of the transport roller 9 and the shaft 14A of the transport roller 14 may be arranged at different positions with respect to the X-axis direction. For example, the shaft 9A of the transport roller 9 may be disposed on the + X side with respect to the shaft 14A of the transport roller 14, or may be disposed on the −X side.

  In the present embodiment, the second device 7 separates the cover member C from the substrate P while the substrate P is being sent. Further, the second device 7 separates the cover member C from the substrate P in a state where the substrate P and the cover member C are being sent in synchronization. That is, in the present embodiment, the cover member C is separated from the substrate P in a state where the substrate P and the cover member C are sent in synchronization.

  Next, an example of the operation of the substrate processing apparatus RT1 having the above configuration will be described. At least a part of the substrate P arranged in the first supply unit 1 in a wound state is sent out from the first supply unit 1. Further, at least a part of the cover member C arranged in the second supply unit 11 in a wound state is sent out from the second supply unit 11.

  In the first device 6 including the transport roller 8 and the transport roller 13, the cover member C sent from the second supply unit 11 is attached to at least a part of the back surface pb of the substrate P sent from the first supply unit 1. . The first feed mechanism 4 and the second feed mechanism 10 move the substrate P and the cover member C in synchronization.

  The substrate P is sent to the surface treatment apparatus 2 with the cover member C attached to the back surface pb. In the surface treatment apparatus 2, the surface pa of the substrate P is processed with the cover member C attached to the back surface pb. As described above, in the present embodiment, the liquid (droplet LD) from the inject head 2J is supplied to the surface pa of the substrate P. In the present embodiment, the cover member C is brought into close contact with the back surface pb of the substrate P by the first device 6 so that the liquid does not contact the back surface pb of the substrate P. This suppresses the liquid from adhering to the back surface pb of the substrate P.

  In the second device 7 including the transport roller 9 and the transport roller 14, the cover member C is separated from the substrate P on which the surface pa has been processed. The control device 5 separates the cover member C from the substrate P while feeding the substrate P and the cover member C.

  The substrate P separated from the cover member C in the second device 7 is collected by the first collection unit 3. The substrate P is wound around the collection roller 3R in the first collection unit 3.

  The cover member C separated from the substrate P in the second device 7 is collected by the second collection unit 12. The cover member C is wound around the collection roller 12R in the second collection unit 12.

  As described above, according to the present embodiment, since the first device 6 for attaching the cover member C to the back surface pb of the substrate P is provided, the surface pa of the substrate P with the cover member C attached to the back surface pb. Can be processed. Therefore, for example, in the surface treatment apparatus 2, the liquid is suppressed from adhering to the back surface pb of the substrate P. In other words, the back surface pb of the substrate P is prevented from being processed (liquid is supplied to the back surface pb). Moreover, according to this embodiment, it is suppressed that a foreign material adheres to the back surface pb of the board | substrate P. FIG.

  For example, when a flat panel display is manufactured by supplying a liquid to the surface pa of the substrate P and forming a pattern on the surface pa of the substrate P, the liquid is attached to the back surface pb of the substrate P. Flat panel displays may be defective. According to this embodiment, it is suppressed that the unnecessary site | part (back surface pb in this embodiment) of the board | substrate P is processed in the surface treatment apparatus 2, and it is suppressed that a foreign material adheres to the back surface pb of the board | substrate P. Therefore, the occurrence of defective devices can be suppressed.

Second Embodiment
Next, a second embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 5 is a diagram illustrating an example of the substrate processing apparatus RT2 according to the second embodiment. The second embodiment is a modification of the first embodiment. The substrate processing apparatus RT2 according to the second embodiment is different from the substrate processing apparatus RT1 according to the first embodiment in that the transport rollers 13 and 14 are omitted.

  In FIG. 5, the substrate P sent out from the first supply unit 1 is attached to a roll-shaped cover member C supported by the supply roller 11R. That is, in the substrate processing apparatus RT2 according to the second embodiment, the first apparatus 6 includes a transport roller 8 disposed at a position where the surface pa of the substrate P can be opposed, and a supply roller that supports the roll-shaped cover member C. 11R, and the substrate P and the cover member C are sandwiched between the transport roller 8 and the supply roller 11R. Thereby, the cover member C is attached to the back surface pb of the substrate P.

  Further, the substrate P and the cover member C from the surface treatment apparatus 2 move between the transport roller 9 and the roll-shaped cover member C supported by the collection roller 12R from the surface treatment apparatus 2. The board | substrate P and the cover member C are sent to a different direction, after passing between the conveyance roller 9 and the roll-shaped cover member C (collection roller 12R). As a result, the cover member C is separated from the substrate P. That is, in the substrate processing apparatus RT2 according to the second embodiment, the second apparatus 7 includes a transport roller 9 disposed at a position where the surface pa of the substrate P can be opposed, and a collection roller that supports the roll-shaped cover member C. 12R, the substrate P is guided by the transport roller 9, and the cover member C is guided in a direction different from the feeding direction of the substrate P by the recovery roller 12R.

  That is, in the present embodiment, at least a part of the second supply unit 11 functions as the first device 6. In the present embodiment, at least a part of the second collection unit 12 functions as the second device 7.

  Also in this embodiment, the occurrence of defective devices is suppressed.

<Third Embodiment>
Next, a third embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 6 is a diagram illustrating an example of the substrate processing apparatus RT3 according to the third embodiment. The third embodiment is a modification of the first embodiment. In the substrate processing apparatus RT3 according to the third embodiment, the second feeding mechanism 10 sends the cover member C from the second apparatus 7 to the first apparatus 6 in a portion different from the substrate processing apparatus RT1 according to the first embodiment. In the point.

  In FIG. 6, the substrate processing apparatus RT3 includes a second feeding mechanism 10 that feeds the cover member C. The second feed mechanism 10 feeds the cover member C in synchronization with the substrate P in at least a part between the second supply unit 11 including the supply roller 11Rb and the second recovery unit 12 including the recovery roller 12Rb. The cover member C is a band-shaped member.

  In the present embodiment, the second feed mechanism 10 includes a transport roller 13 and a transport roller 14. In the present embodiment, the first device 6 includes a transport roller 8 of the first feed mechanism 4 and a transport roller 13 of the second feed mechanism 10. In the present embodiment, the second device 7 includes a transport roller 9 of the first feed mechanism 4 and a transport roller 14 of the second feed mechanism 10.

  In the present embodiment, the second feeding mechanism 10 sends the cover member C separated from the substrate P in the second device 7 to the first device 6. In the present embodiment, the cover member C from the second device 7 is sent to the first device 6 via the recovery roller 12Rb and the supply roller 11Rb.

  In the present embodiment, the cover member C is an annular (looped, endless) member. A plurality of rollers are arranged inside the cover member C. In the present embodiment, the supply roller 11Rb, the transport roller 13, the transport roller 14, and the collection roller 12Rb are disposed inside the cover member C. The cover member C is simultaneously supported by each of the supply roller 11Rb, the transport roller 13, the transport roller 14, and the collection roller 12Rb. The surface ca of the cover member C is in contact with the surface of the supply roller 11Rb, the surface of the transport roller 13, the surface of the transport roller 14, and the surface of the collection roller 12Rb.

  The second feed mechanism 10 moves the cover member C so that the annular (looped, endless) cover member C circulates through the first device 6, the surface treatment device 2, and the second device 7.

  Also in this embodiment, the occurrence of defective devices is suppressed.

<Fourth embodiment>
Next, a fourth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 7 is a diagram illustrating an example of a substrate processing apparatus RT4 according to the fourth embodiment. The fourth embodiment is a modification of the third embodiment. The substrate processing apparatus RT4 according to the fourth embodiment is different from the substrate processing apparatus RT3 according to the third embodiment in that the transport rollers 13 and 14 are omitted.

  In FIG. 7, the substrate processing apparatus RT4 includes a second feeding mechanism 10 that feeds the cover member C. The second feed mechanism 10 feeds the cover member C in synchronization with the substrate P in at least a part between the second supply unit 11 including the supply roller 11Rb and the second recovery unit 12 including the recovery roller 12Rb. The cover member C is a band-shaped member.

  In the present embodiment, at least a part of the second supply unit 11 functions as the first device 6. In the present embodiment, the first device 6 includes a transport roller 8 of the first feed mechanism 4 and a supply roller 11Rb. The cover member C is attached to the back surface pb of the substrate P by sandwiching the substrate P and the cover member C between the transport roller 8 and the supply roller 11Rb.

  In the present embodiment, at least a part of the second collection unit 12 functions as the second device 7. In the present embodiment, the second device 7 includes a transport roller 9 of the first feed mechanism 4 and a collection roller 12Rb. The cover member C is separated from the substrate P by being sent in a direction different from the feeding direction of the substrate P by the collection roller 12Rb. The cover member C separated from the substrate P in the second device 7 is sent to the first device 6.

  In the present embodiment, the cover member C is an annular (looped, endless) member. Inside the cover member C, the supply roller 11Rb and the collection roller 12Rb are arranged.

  Also in this embodiment, the occurrence of defective devices is suppressed.

<Fifth Embodiment>
Next, a fifth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 8 is a diagram illustrating an example of a substrate processing apparatus RT5 according to the fifth embodiment. In FIG. 8, the substrate processing apparatus RT5 is sent from the first apparatus 6 in which the cover member C is attached to at least a part of the back surface pb of the substrate P, and the first apparatus 6 in a state where the cover member C is attached to the back surface pb. The surface processing apparatus 20 for processing the surface pa of the substrate P and the second apparatus 7 for separating the cover member C from the substrate P sent from the surface processing apparatus 20 are provided.

  In the present embodiment, the first device 6 includes a transport roller 8 and a supply roller 11Rb, and the second device 7 includes a transport roller 9 and a collection roller 12Rb. Further, in the present embodiment, the substrate processing apparatus RT5 is disposed between the first apparatus 6 and the surface processing apparatus 20, and sends the substrate P and the cover member C from the first apparatus 6 to the surface processing apparatus 20. A conveying roller 15 that rotates, and a conveying roller 16 that is disposed between the surface treatment device 20 and the second device 7 and rotates so as to send the substrate P and the cover member C from the surface treatment device 20 to the second device 7. It has. In the present embodiment, each of the transport roller 15 and the transport roller 16 is disposed at a position where the cover member C can contact.

  In the present embodiment, the surface treatment apparatus 20 includes a container 21 for storing the liquid LM. In the present embodiment, the substrate processing apparatus RT5 includes a transport roller 17 and a transport roller 18 that are at least partially disposed in the container 21 and support at least one of the substrate P and the cover member C. The conveyance roller 17 and the conveyance roller 18 are disposed between the conveyance roller 15 and the conveyance roller 16. In the present embodiment, the transport roller 17 and the transport roller 18 are disposed at positions where the substrate P can come into contact.

  In the present embodiment, the second feeding mechanism 10 sends the cover member C from the second device 7 to the first device 6. In the present embodiment, the cover member C is an annular (looped, endless) member. Inside the cover member C, a supply roller 11Rb, a conveyance roller 15, a conveyance roller 16, and a collection roller 12Rb are arranged.

  FIG. 9 is a diagram illustrating an example of the surface treatment apparatus 20 according to the present embodiment. As shown in FIG. 9, the surface treatment apparatus 20 processes the surface pa of the substrate P sent from the first apparatus 6 with the cover member C attached to the back surface pb. In the surface treatment apparatus 20, the substrate P sent from the first apparatus 6 is immersed in the liquid LM in the container 21 with the cover member C attached to the back surface pb. That is, in the present embodiment, the processing of the front surface pa of the substrate P in the surface processing apparatus 20 includes the processing of immersing the substrate P in the liquid LM in the container 21 with the cover member C attached to the back surface pb. The liquid LM is a liquid for treating at least a part of the surface pa of the substrate P. By the treatment, a component of the liquid LM (a substance contained in the liquid LM) adheres to at least a part of the surface pa of the substrate P.

  The container 21 has an opening 21K at the upper end. The substrate P and the cover member C from the first device 6 (conveying roller 8) are sent into the container 21 through the opening 21K. The surface pa of the substrate P is in contact with the liquid LM in the container 21. On the other hand, the back surface pb of the substrate P is covered with the cover member C and does not come into contact with the liquid LM in the container 21.

  In the container 21, the substrate P is supported by transport rollers 17 and 18 disposed in the container 21. Thereby, the surface pa of the substrate P can be in good contact with the liquid LM in the container 21. In the present embodiment, the transport rollers 17 and 18 support the substrate P so that the surface pa of the substrate P and the XY plane are parallel to each other. Further, the transport rollers 17 and 18 support the substrate P so that the substrate P does not loosen.

  The substrate P in contact with the liquid LM in the container 21 is sent out of the container 21 through the opening 21K. The substrate P sent out of the container 21 leaves the cover member C in the second device 7.

  In the present embodiment, the treatment of the surface pa of the substrate P in the surface treatment apparatus 20 includes a plating treatment. In the present embodiment, the surface treatment apparatus 20 performs a treatment (plating treatment) on the surface pa of the substrate P based on an electroless plating method. In the present embodiment, the liquid LM in the container 21 is a solution containing metal ions (so-called plating solution). As shown in FIGS. 8 and 9, a film M of a substance contained in the liquid LM is formed on at least a part of the surface pa of the substrate P in contact with the liquid LM in the container 21. In the following description, the film M based on the liquid LM formed on the surface pa of the substrate P by coming into contact with the liquid LM is appropriately referred to as a plating layer M. Note that the film M is not limited to a film (plating layer) formed by plating, and may be a film based on a substance contained in the liquid LM.

  As described above, according to the present embodiment, after the cover member C is brought into close contact with the back surface pb of the substrate P so that the liquid (plating solution) does not contact the back surface pb of the substrate P, the cover member C is Since the adhered substrate P is immersed in the liquid in the container 21, the surface treatment apparatus 20 suppresses the liquid from adhering to the back surface pb of the substrate P. In other words, the back surface pb of the substrate P is prevented from being processed (the back surface pb is subjected to the plating process). Moreover, according to this embodiment, it is suppressed that a foreign material adheres to the back surface pb of the board | substrate P. FIG.

<Sixth Embodiment>
Next, a sixth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 10 is a diagram illustrating an example of a substrate processing apparatus RT6 according to the sixth embodiment. The sixth embodiment is a modification of the fifth embodiment. The substrate processing apparatus RT6 according to the sixth embodiment is different from the substrate processing apparatus RT5 according to the fifth embodiment in that a cleaning device 30 for cleaning the cover member C is provided.

  In FIG. 10, the substrate processing apparatus RT6 is sent from the first apparatus 6 with the cover member C attached to at least a part of the back surface pb of the substrate P and the first apparatus 6 with the cover member C attached to the back surface pb. The surface treatment apparatus 20 for treating the surface pa of the substrate P, the second apparatus 7 for separating the cover member C from the substrate P sent from the surface treatment apparatus 20, and the cover member C from the second apparatus 7. And a cleaning device 30. The cleaning device 30 cleans the cover member C separated from the substrate P in the second device 7.

  In the present embodiment, the second feeding mechanism 10 sends the cover member C from the second device 7 to the first device 6. In the present embodiment, the cover member C is an annular (looped, endless) member.

  In the present embodiment, the second feed mechanism 10 is disposed between the cleaning device 30 and the collection roller 12Rb, and is rotated so as to feed the cover member C from the second device 7 and the collection roller 12Rb to the cleaning device 30. It has a roller 40 and a conveying roller 41 that is arranged between the cleaning device 30 and the supply roller 11Rb and rotates so as to send the cover member C from the cleaning device 30 to the supply roller 11Rb and the first device 6. In the present embodiment, each of the transport roller 40 and the transport roller 41 is disposed at a position where the back surface cb of the cover member C can contact.

  In the present embodiment, the cleaning device 30 cleans at least a part of the cover member C using the cleaning liquid LC. In the present embodiment, the cleaning device 30 includes a container 31 that holds the liquid LC. In the present embodiment, the substrate processing apparatus RT6 includes a transport roller 42 and a transport roller 43 that are at least partially disposed in the container 31 and support the cover member C. The conveyance roller 42 and the conveyance roller 43 are disposed between the conveyance roller 40 and the conveyance roller 41.

  In the present embodiment, the supply roller 11Rb, the transport roller 15, the transport roller 16, the collection roller 12Rb, the transport roller 42, and the transport roller 43 are disposed inside the cover member C.

  The container 31 has an opening 31K at the upper end. The cover member C from the second device 7 is sent into the container 31 through the opening 31K. The front surface ca and the back surface cb of the cover member C are in contact with the liquid LC in the container 31. Thereby, the cover member C is washed with the liquid LC.

  A liquid supply mechanism capable of supplying the liquid LC into the container 31 and a liquid recovery mechanism capable of recovering the liquid LC in the container 31 are provided, and the clean liquid LC is continuously supplied into the container 31 from the liquid supply mechanism. Simultaneously with the supply of the liquid LC, the liquid LC in the container 31 may be recovered from the liquid recovery mechanism, and the clean liquid LC in the container 31 may be continuously supplied to the cover member C.

  In the present embodiment, the cover member C (the surface ca of the cover member C) is in contact with the liquid LM in the surface treatment apparatus 20. There is a possibility that the liquid LM remains on at least a part of the surface ca of the cover member C carried out from the surface treatment apparatus 20. The cleaning device 30 can remove the liquid LM remaining in the cover member C. The cleaning device 30 can remove the liquid LM remaining in the cover member C from the cover member C by supplying the liquid LC to the cover member C. Further, the film M may be formed (deposited) on at least a part of the surface ca of the cover member C carried out from the surface treatment apparatus 20. The cleaning device 30 can remove the film M formed (deposited) on the cover member C from the cover member C by supplying the liquid LC to the cover member C. Further, the cleaning device 30 can remove not only the film M but also the foreign matter attached to the cover member C from the cover member C by supplying the liquid LC to the cover member C.

  In the present embodiment, the liquid LC is a liquid that can remove the film M from the cover member C. For example, when the film M contains nickel (Ni), a liquid containing nitric acid may be used as the liquid LC. Further, when the film M contains gold (Au), a liquid containing iodine may be used as the liquid LC.

  Further, in the present embodiment, the cleaning device 30 includes a cleaning roller 33 disposed at a position where it can contact the cover member C. In the present embodiment, the cleaning roller 33 is disposed in the container 31. In the present embodiment, the cleaning roller 33 is disposed between the transport roller 42 and the transport roller 43. In the present embodiment, the cleaning device 30 has a plurality of cleaning rollers 33 (four in the example shown in FIG. 10). A plurality of cleaning rollers 33 are arranged in the feed direction of the cover member C by the second feed mechanism 10. In the present embodiment, the cover member C is sent along the X-axis direction in the cleaning device 30 (container 31). In the present embodiment, the plurality of cleaning rollers 33 are arranged in the X-axis direction.

  In the present embodiment, the cleaning roller 33 is disposed at a position where the surface ca of the cover member C can be opposed. The cleaning roller 33 contacts the surface ca of the cover member C and cleans the surface ca of the cover member C. In the present embodiment, the cleaning device 30 rubs the surface ca of the cover member C with the cleaning roller 33 so that the foreign matter adhering to the surface ca of the cover member C (the liquid LM remaining on the surface ca, And the film M formed on the surface ca) can be removed.

  In the present embodiment, the substrate processing apparatus RT6 includes a removing device 50 that removes the liquid LC from the cover member C carried out from the cleaning device 30. In the present embodiment, at least a part of the removing device 50 is disposed between the transport roller 41 and the supply roller 11Rb. The removing device 50 performs a process for removing the liquid LC from the cover member C carried out of the container 31 of the cleaning device 30. In the present embodiment, the removing device 50 performs a process for removing the liquid LC from the cover member C before the cover member C is sent to the first device 6 (before being attached to the substrate P). In the present embodiment, the removing device 50 is supplied from the cover member C to the liquid LC before being sent from the second device 7 through the cleaning device 30 (container 31) to the supply roller 11Rb (before contacting the supply roller 11Rb). The process for removing is performed. The removal device 50 may perform a process for removing the liquid LC from the cover member C before being attached to the substrate P after being sent to the supply roller 11Rb (after contacting the supply roller 11Rb). .

  In the present embodiment, the removal device 50 includes a first removal mechanism 51 having an air supply port 51S capable of supplying gas. The air supply port 51S supplies gas to the cover member C and removes the liquid LC adhering to the cover member C from the cover member C. In FIG. 10, the supply port 51 is disposed at a position where the back surface cb of the cover member C can be opposed, but may be disposed at a position where the front surface ca can be opposed, or the front surface ca and the back surface cb. Both of them may be arranged at positions where they can face each other.

  Next, an example of operation | movement of the washing | cleaning apparatus 30 which concerns on this embodiment is demonstrated. The cover member C that comes into contact with the liquid LM in the surface treatment apparatus 20 and is separated from the substrate P in the second apparatus 7 is sent to the cleaning apparatus 30.

  In the container 31, the cover member C is supported by transport rollers 42 and 43 disposed in the container 31. Thereby, the surface ca of the cover member C can be in good contact with the liquid LC in the container 31, and the cleaning roller 33 can smoothly rub the surface ca of the cover member C. In the present embodiment, the transport rollers 42 and 43 support the cover member C so that the surface ca of the cover member C and the XY plane are parallel to each other. Further, the transport rollers 42 and 43 support the cover member C so that the cover member C is not loosened.

  In the present embodiment, the cleaning device 30 rubs at least part of the surface ca of the cover member C with the cleaning roller 33 while supplying the liquid LC between the cleaning roller 33 and the cover member C. Thereby, the cover member C is cleaned in the cleaning device 30.

  The cleaning device 30 may clean the cover member C with the cleaning roller 33 without supplying the liquid LC to the cover member C. The cleaning device 30 may not have the cleaning roller 33.

  The cover member C cleaned in the cleaning device 30 (inside the container 31) is sent out of the container 31 through the opening 31K. The control device 5 supplies gas to the cover member C carried out of the container 31 from the air supply port 51S of the removing device 50 disposed between the transport roller 41 and the supply roller 11Rb. Thereby, the liquid LC adhering to the cover member C is blown off and removed from the cover member C. Note that dry gas or high-temperature gas may be supplied from the air supply port 51S to promote vaporization of the liquid LC adhering to the cover member C (may be dried).

  The cover member C cleaned by the cleaning device 30 is attached to the back surface pb of the substrate P by the first device 6. Thereafter, the cover member C is sent to the surface treatment apparatus 20 together with the substrate P.

  As described above, according to the present embodiment, since the cleaning device 30 for cleaning the cover member C is provided, the cover member C can be cleaned. Therefore, the surface pa of the substrate P is processed with the cleaned cover member C attached to the back surface pb. Therefore, generation | occurrence | production of a defective device can be suppressed.

<Seventh embodiment>
Next, a seventh embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 11 is a diagram illustrating an example of a substrate processing apparatus RT7 according to the seventh embodiment. The seventh embodiment is a modification of the sixth embodiment. In the substrate processing apparatus RT7 according to the seventh embodiment, a portion different from the substrate processing apparatus RT6 according to the sixth embodiment is that the removing device 50 that removes the cleaning liquid LC from the cover member C is for removal (for rinsing). The second removal mechanism 52 is used to remove the liquid LC using the liquid LQ.

  In FIG. 11, the substrate processing apparatus RT7 includes a cleaning device 30 that cleans the cover member C using a cleaning liquid LC, and a removal device 50 that performs a process of removing the liquid LC from the cover member C.

  In the present embodiment, the second feeding mechanism 10 sends the cover member C from the second device 7 to the first device 6. In the present embodiment, the cover member C is an annular (looped, endless) member.

  In the present embodiment, the cleaning device 30 includes a container 31 for storing the cleaning liquid LC and a cleaning roller 33 disposed in the container 31. In the container 31, conveying rollers 42 and 43 are arranged. In the present embodiment, the cleaning roller 33 is disposed between the transport roller 40 and the transport roller 42. In the present embodiment, a plurality of cleaning rollers 33 are arranged. Some of the cleaning rollers 33 are disposed at positions where the front surface ca of the cover member C can be opposed, and some of the cleaning rollers 33 are disposed at positions where the back surface cb of the cover member C can be opposed. In the present embodiment, the cleaning device 30 can simultaneously rub the front surface ca and the back surface cb of the cover member C with the cleaning roller 33.

  In the present embodiment, the removal device 50 includes a first removal mechanism 51 having an air supply port 51S that supplies gas to the cover member C, and a second removal mechanism 52 that removes the liquid LC from the cover member C using the liquid LQ. And have.

  In the present embodiment, the liquid LQ is a liquid for removal (for rinsing) that can remove the liquid LC adhering (residual) to the cover member C from the cover member C. In the present embodiment, water is used as the liquid LQ.

  The 2nd removal mechanism 52 has the container 53 into which the liquid LQ is put. The second removal mechanism 52 removes the liquid LC from the cover member C by bringing the cover member C sent from the cleaning device 30 into contact with the liquid LQ in the container 53.

  The container 53 has an opening 53K at the upper end. The cover member C from the cleaning device 30 is sent into the container 53 through the opening 53K. The front surface ca and the back surface cb of the cover member C are in contact with the liquid LQ in the container 53. Thereby, the liquid LC adhering (residual) to the cover member C is removed from the cover member C.

  A liquid supply mechanism capable of supplying the liquid LQ into the container 53 and a liquid recovery mechanism capable of recovering the liquid LQ in the container 53 are provided, and the clean liquid LQ is continuously supplied into the container 53 from the liquid supply mechanism. In parallel with the supply of the liquid LQ, the liquid LQ in the container 53 may be recovered from the liquid recovery mechanism, and the clean liquid LQ in the container 53 may be continuously supplied to the cover member C.

  In the present embodiment, the second feed mechanism 10 is disposed between the cleaning device 30 and the second removal mechanism 52 (container 53), and removes the cover member C from the cleaning device 30 (conveying roller 41) to the second removal mechanism. 52 is arranged between the conveying roller 44 that rotates so as to be sent to 52, the second removing mechanism 52, and the first removing mechanism 51, and covers the cover member C from the second removing mechanism 52 (container 53) with the supply roller 11Rb and the second 1 having a conveying roller 45 that rotates so as to be sent to the apparatus 6.

  In the present embodiment, the substrate processing apparatus RT7 includes a transport roller 46 and a transport roller 47 that are disposed at least partially in the container 53 and support the cover member C. The conveyance roller 46 and the conveyance roller 47 are disposed between the conveyance roller 44 and the conveyance roller 45.

  In the present embodiment, the supply roller 11Rb, the transport roller 15, the transport roller 16, the collection roller 12Rb, the transport roller 42, the transport roller 43, the transport roller 46, and the transport roller 47 are disposed inside the cover member C.

  In the present embodiment, the first removal mechanism 51 supplies gas to the cover member C from the air supply port 51S between the transport roller 45 and the supply roller 11Rb. In the present embodiment, the removal device 50 performs the process of removing the liquid LC from the cover member C sent from the cleaning device 30 by the second removal mechanism 52, and then the second removal mechanism 51 by the first removal mechanism 51. A process of removing the liquid LQ from the cover member C sent from the mechanism 52 is performed. The first removal mechanism 51 may remove the liquid LC that could not be removed from the cover member C by the second removal mechanism 52.

  Next, an example of the operation of the substrate processing apparatus RT7 according to this embodiment will be described. The cover member C that comes into contact with the liquid LM in the surface treatment apparatus 20 and is separated from the substrate P in the second apparatus 7 is sent to the cleaning apparatus 30. The cover member C is sent into the container 31 through the opening 31K and comes into contact with the liquid LC. The cover member C cleaned in the cleaning device 30 (inside the container 31) is sent out of the container 31 through the opening 31K.

  The cover member C from the cleaning device 30 is sent to the second removal mechanism 52. The cover member C is sent into the container 53 through the opening 53K and comes into contact with the liquid LQ. Thereby, the liquid LC adhering (residual) to the cover member C is removed from the cover member C by the liquid LQ. The cover member C from which the liquid LC has been removed in the second removal mechanism 52 (inside the container 53) is sent out of the container 53 via the opening 53K.

  The cover member C from the second removal mechanism 52 is sent to the first removal mechanism 51. The first removal mechanism 51 supplies gas from the air supply port 51 to the cover member C carried out of the container 53. Thereby, the liquid LQ adhering to the cover member C is blown off and removed from the cover member C. Note that dry gas or high-temperature gas may be supplied from the air supply port 51 to promote vaporization of the liquid LQ attached to the cover member C (may be dried).

  The cover member C from the first removal mechanism 51 is attached to the back surface pb of the substrate P by the first device 6. Thereafter, the cover member C is sent to the surface treatment apparatus 20 together with the substrate P.

  As described above, according to this embodiment, since the removing device 50 for removing the liquid LC from the cover member C is provided, the front surface pa of the substrate P with the cleaned cover member C attached to the back surface pb. Is performed. Therefore, generation | occurrence | production of a defective device can be suppressed.

<Eighth Embodiment>
Next, an eighth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 12 is a diagram illustrating an example of a substrate processing apparatus RT8 according to the eighth embodiment. In the present embodiment, the substrate processing apparatus RT8 includes a plurality of surface processing apparatuses for processing the surface pa of the substrate P between the first supply unit 1 and the first recovery unit 3.

  In FIG. 12, the substrate processing apparatus 8 includes a first device 6 that attaches a cover member C to the back surface pb of the substrate P sent from the first supply unit 1, and a first device with the cover member C attached to the back surface pb. A plurality of surface treatment apparatuses 201 to 205 that process the surface pa of the substrate P sent from the apparatus 6, and a second apparatus 7 that separates the cover member C from the substrate P sent from the surface treatment apparatuses 201 to 205. ing. The substrate P separated from the cover member C in the second device 7 is sent to the first recovery unit 3.

  In the present embodiment, the substrate processing apparatus RT8 includes five surface processing apparatuses. In the following description, the five surface treatment apparatuses are appropriately referred to as a first treatment apparatus 201, a second treatment apparatus 202, a third treatment apparatus 203, a fourth treatment apparatus 204, and a fifth treatment apparatus 205, respectively.

  The first processing apparatus 201 performs processing of the surface pa of the substrate P sent from the first apparatus 6 and sent from the first apparatus 6 with the cover member C attached to the back surface pb in the first apparatus 6. . The second processing apparatus 202 processes the surface pa of the substrate P sent from the first processing apparatus 201 with the cover member C attached to the back surface pb. The third processing apparatus 203 processes the surface pa of the substrate P sent from the second processing apparatus 202 in a state where the cover member C is attached to the back surface pb. The fourth processing apparatus 204 processes the surface pa of the substrate P sent from the third processing apparatus 203 with the cover member C attached to the back surface pb. The fifth processing apparatus 205 processes the surface pa of the substrate P sent from the fourth processing apparatus 204 with the cover member C attached to the back surface pb.

  That is, in the present embodiment, the first feeding mechanism 4 allows the substrate P to pass through the first processing apparatus 201, the second processing apparatus 202, the third processing apparatus 203, the fourth processing apparatus 204, and the fifth processing apparatus 205 in this order. Then, the substrate P is sent from the first supply unit 1 to the first recovery unit 3.

  In the present embodiment, the cover member C is an annular (looped, endless) member. Inside the cover member C, the supply roller 11Rb and the collection roller 12Rb are arranged. The first to fifth processing devices 201 to 205 are disposed between the supply roller 11Rb and the collection roller 12Rb. After the cover member C is attached to the substrate P in the first device 6, the first processing device 201, the second processing device 202, the third processing device 203, the fourth processing device 204, without leaving the substrate P, And after passing through the fifth processing apparatus 205, the second apparatus 7 leaves the substrate P.

  That is, in the present embodiment, the second feeding mechanism 10 includes the first processing apparatus 201, the second processing apparatus 202, the third processing apparatus 203, the fourth processing apparatus 204, and the cover member C in close contact with the substrate P. The cover member C is sent from the first device 6 to the seventh device 7 so as to pass through the fifth processing device 205 in this order. The second feed mechanism 10 sends the cover member C from the second device 7 to the first device 6.

  In the present embodiment, the first device 6 includes a transport roller 8 of the first feed mechanism 4 and a supply roller 11Rb. The second device 7 includes a transport roller 9 and a collection roller 12Rb of the first feed mechanism 4.

  In the present embodiment, each of the first to fifth processing apparatuses 201 to 205 includes containers 201R to 205R that contain the liquids LM1 to LM5. In the present embodiment, the substrate processing apparatus RT8 performs the plating process (electroless plating process) of the substrate P using the first to fifth processing apparatuses 201 to 205. The first processing apparatus 201 performs a first pretreatment using the liquid LM1. The second processing apparatus 202 performs the first cleaning process using the liquid LM2. The third processing device 203 performs the second pretreatment using the liquid LM3. The fourth processing apparatus 204 performs the second cleaning process using the liquid LM4. The fifth processing apparatus 205 performs an electroless plating process using the liquid LM5.

  In the present embodiment, the first pretreatment includes, for example, a treatment of adsorbing catalyst metal ions on the surface of the substrate P. In the present embodiment, the catalyst metal contains palladium, for example, and the liquid LM1 used for the first pretreatment is a liquid containing palladium ions. When the substrate P is immersed in the liquid LM1 in the container 201R with the cover member C attached to the back surface pb, palladium ions are adsorbed on the surface pa of the substrate P.

In the present embodiment, the first cleaning process includes a process of cleaning the substrate P using water. That is, in the present embodiment, the liquid LM2 used for the first cleaning process is water. The substrate P is the liquid LM in the container 202R with the cover member C attached to the back surface pb.
2, the substrate P is cleaned.

  In the present embodiment, the second pretreatment includes a process of generating a metal containing palladium on the surface pa of the substrate P by an oxidation-reduction reaction. In the present embodiment, hypophosphorous acid is used in the oxidation-reduction reaction, and the liquid LM3 used for the second pretreatment is a liquid containing hypophosphorous acid. When the substrate P is immersed in the liquid LM3 in the container 203R with the cover member C attached to the back surface pb, a metal containing palladium is generated on the surface pa of the substrate P.

In the present embodiment, the second cleaning process includes a process of cleaning the substrate P using water. That is, in the present embodiment, the liquid LM4 used for the second cleaning process is water. The substrate P is the liquid LM in the container 204R with the cover member C attached to the back surface pb.
4, the substrate P is cleaned.

  After the second cleaning process is performed, an electroless plating process (electroless nickel plating process) is performed. In the present embodiment, the liquid LM5 used for the electroless plating process is a liquid (plating solution) containing nickel. When the substrate P is immersed in the liquid LM5 in the container 205R with the cover member C attached to the back surface pb, a film containing nickel is generated on the surface pa of the substrate P.

  In the present embodiment, the substrate processing apparatus RT8 includes a plurality of transport rollers 60A to 60J disposed outside the containers 201R to 205R and a plurality of transport rollers 61A to 61J disposed within the containers 201R to 205R. . The substrate P and the cover member C are sent from the first device 6 to the second device 7 while being supported by the transport rollers 60A to 60J and 61A to 61J.

  As described above, also in this embodiment, processing of the back surface pb of the substrate P and adhesion of foreign matter to the back surface pb of the substrate P can be suppressed, and generation of defective devices can be suppressed.

  In the present embodiment, the substrate P is continuously processed by the first to fifth processing apparatuses 201 to 205 with the cover member C attached to the back surface pb. Thereby, high device productivity is obtained.

<Ninth Embodiment>
Next, a ninth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 13 is a diagram illustrating an example of a substrate processing apparatus RT9 according to the ninth embodiment. The ninth embodiment is a modification of the eighth embodiment. In the above-described eighth embodiment, the substrate processing apparatus RT8 has one first device 6 and one second device 7, and the substrate P is in a state where the cover member C is attached to the back surface pb in the first device 6. Thus, the first apparatus is sequentially transported to the first to fifth processing apparatuses 201 to 205, and then the second apparatus 7 is separated from the cover member C. The substrate processing apparatus RT9 according to the ninth embodiment is different from the substrate processing apparatus RT8 according to the eighth embodiment in that the substrate processing apparatus RT9 is disposed between the first supply unit 1 and the first recovery unit 3. Corresponding to the plurality of surface treatment apparatuses (first to fifth treatment apparatuses) 201 to 205, the plurality of first apparatuses 6A to 6E and the plurality of second apparatuses 7A to 7E are provided. Further, in the substrate processing apparatus RT9 according to the ninth embodiment, portions different from the substrate processing apparatus RT8 according to the eighth embodiment correspond to the plurality of surface processing apparatuses (first to fifth processing apparatuses) 201 to 205. The plurality of cover members C1 to C5 are provided.

  In FIG. 13, the substrate processing apparatus RT9 includes a first device 6A that attaches a cover member C1 to the back surface pb of the substrate P sent from the first supply unit 1, and a first device with the cover member C1 attached to the back surface pb. From the first processing apparatus 201 for processing the surface pa of the substrate P sent from the apparatus 6A, the second apparatus 7A for separating the cover member C1 from the substrate P sent from the first processing apparatus 201, and the second apparatus 7A A first device 6B that attaches the cover member C2 to the back surface pb of the sent substrate P, and a first device that processes the surface pa of the substrate P sent from the first device 6B with the cover member C2 attached to the back surface pb. 2 processing apparatus 202, 2nd apparatus 7B which separates cover member C2 from the board | substrate P sent from the 2nd processing apparatus 202, and 1st which attaches cover member C3 to the back surface pb of the board | substrate P sent from 2nd apparatus 7B. With device 6C A third processing apparatus 203 for processing the front surface pa of the substrate P sent from the first apparatus 6C with the cover member C3 attached to the back surface pb, and a cover member from the substrate P sent from the third processing apparatus 203 A second device 7C for releasing C3; a first device 6D for attaching a cover member C4 to the back surface pb of the substrate P sent from the second device 7C; and a first device 6D with the cover member C4 attached to the back surface pb. A fourth processing apparatus 204 for processing the surface pa of the substrate P sent from the second apparatus, a second apparatus 7D for separating the cover member C4 from the substrate P sent from the fourth processing apparatus 204, and a second apparatus 7D. A first device 6E for attaching the cover member C5 to the back surface pb of the substrate P, and a fifth process for processing the surface pa of the substrate P sent from the first device 6E with the cover member C5 attached to the back surface pb. Device 205 and fifth And it includes a second device 7E separating the cover member C5, from the substrate P sent from the management device 205. The substrate P separated from the cover member C in the second device 7E is sent to the first recovery unit 3.

  In the present embodiment, each of the cover members C1 to C5 is an annular (looped, endless) member. In the present embodiment, the supply roller 111Rb and the collection roller 121Rb are disposed inside the cover member C1. The first processing device 201 is disposed between the supply roller 111Rb and the collection roller 121Rb. In the present embodiment, the supply roller 112Rb and the collection roller 122Rb are disposed inside the cover member C2. The second processing device 202 is disposed between the supply roller 112Rb and the collection roller 122Rb. In the present embodiment, the supply roller 113Rb and the collection roller 123Rb are disposed inside the cover member C3. The third processing device 203 is disposed between the supply roller 113Rb and the collection roller 123Rb. In the present embodiment, the supply roller 114Rb and the collection roller 124Rb are disposed inside the cover member C4. The fourth processing device 204 is disposed between the supply roller 114Rb and the collection roller 124Rb. In the present embodiment, the supply roller 115Rb and the recovery roller 125Rb are disposed inside the cover member C5. The fifth processing device 205 is disposed between the supply roller 115Rb and the collection roller 125Rb.

  In the present embodiment, the first device 6A includes the transport roller 8A of the first feed mechanism 4 and the supply roller 111Rb. The second device 7A includes a conveyance roller 9A of the first feed mechanism 4 and a collection roller 121Rb. The first device 6B includes a transport roller 8B of the first feed mechanism 4 and a supply roller 112Rb. The second device 7B includes a transport roller 9B of the first feed mechanism 4 and a collection roller 122Rb. The first device 6C includes a conveyance roller 8C of the first feeding mechanism 4 and a supply roller 113Rb. The second device 7C includes a conveyance roller 9C of the first feeding mechanism 4 and a recovery roller 123Rb. The first device 6D includes a transport roller 8D of the first feed mechanism 4 and a supply roller 114Rb. The second device 7D includes a conveyance roller 9D of the first feed mechanism 4 and a collection roller 124Rb. The first device 6E includes a transport roller 8E of the first feed mechanism 4 and a supply roller 115Rb. The second device 7E includes a transport roller 9E of the first feed mechanism 4 and a collection roller 125Rb.

  In the present embodiment, the substrate processing apparatus RT9 includes a plurality of transport rollers 60A to 60J disposed outside the containers 201R to 205R and a plurality of transport rollers 61A to 61J disposed in the containers 201R to 205R. . The substrate P and the cover members C1 to C5 are fed while being supported by the transport rollers 60A to 60J and 61A to 61J. Further, the substrate processing apparatus RT9 includes transport rollers 62A to 62D disposed between the first to fifth processing apparatuses 201 to 205, respectively. In a state where the cover member C is not attached, the substrate P is fed while being supported by the transport rollers 62A to 62D.

  As described above, also in this embodiment, processing of the back surface pb of the substrate P and adhesion of foreign matter to the back surface pb of the substrate P can be suppressed, and generation of defective devices can be suppressed.

  In the present embodiment, for example, according to the liquids LM1 to LM5, the types (materials) of the cover members C1 to C5 that are in contact with the liquids LM1 to LM5 may be selected. For example, the cover member C1 may be formed of a material resistant to the liquid LM1.

<Tenth Embodiment>
Next, a tenth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 14 is a diagram illustrating an example of a substrate processing apparatus RT10 according to the tenth embodiment. The tenth embodiment is a modification of the seventh embodiment.

  In FIG. 14, the substrate processing apparatus RT <b> 10 includes a cleaning apparatus 30 that cleans the cover member C from the second apparatus 7 and a removal apparatus 50 that performs a process of removing the liquid LC from the cover member C from the cleaning apparatus 30. ing.

  In the present embodiment, the second feeding mechanism 10 sends the cover member C from the second device 7 to the first device 6. In the present embodiment, the cover member C is an annular (looped, endless) member.

  In the present embodiment, the removal device 50 includes a second removal mechanism 52 that removes the liquid LC from the cover member C using the liquid LQ, and a third removal mechanism that includes rollers 71 and 72 that remove the liquid LQ from the cover member C. 54. The third removal mechanism 54 can remove the liquid LC that could not be removed from the cover member C by the second removal mechanism 52.

  The roller 71 of the third removal mechanism 54 is disposed at a position where the surface ca of the cover member C can be opposed. The roller 72 is disposed at a position where the back surface pb of the cover member C can be opposed. The third removal mechanism 54 sandwiches the cover member C between the roller 71 and the roller 72, brings the roller 71 into contact with the front surface ca of the cover member C, and brings the roller 72 into contact with the back surface cb. The liquid LQ (LC) adhering (residual) to the front surface ca and the back surface cb is removed.

<Eleventh embodiment>
Next, an eleventh embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 15 is a diagram illustrating an example of the substrate processing apparatus RT11 according to the eleventh embodiment. In FIG. 15, the substrate processing apparatus RT11 includes a first apparatus 600 that attaches a cover member Cs to at least a part of the back surface pb of the substrate P. In the present embodiment, the cover member Cs is, for example, a quadrangle (rectangle or square).

  As described above, the substrate P is a belt-shaped substrate that is long in the first direction. With respect to the first direction, the dimension of the cover member Cs is sufficiently smaller than the dimension of the substrate P. Regarding the second direction intersecting the first direction, the dimension of the cover member Cs is substantially equal to the dimension (width) of the substrate P. Note that the dimension of the cover member Cs may be larger or smaller than the dimension (width) of the substrate P with respect to the second direction.

  In the present embodiment, the first device 600 includes a first member 601 disposed at a position where the surface pa of the substrate P can be opposed to the first member 601 and a second member that sandwiches the substrate P and the cover member Cs. Member 602. In the present embodiment, the surface of the first member 601 facing the surface pa of the substrate P is substantially flat. In the present embodiment, the surface of the second member 602 opposed to the surface ca of the cover member Cs is substantially flat.

  The first device 600 can put the cover member Cs on the back surface pb of the substrate P by sandwiching the substrate P and the cover member Cs between the first member 601 and the second member 602. The control device 5 may attach the cover member Cs to the substrate P using the first device 600 while the substrate P is being sent by the first feeding mechanism 4. Further, the control device 5 may attach the cover member Cs to the substrate P using the first device 600 in a state where the substrate P and the cover member Cs are sent in synchronization. Further, the control device 5 may put the cover member Cs on the substrate P using the first device 600 in a state where the movement of the substrate P is stopped.

<Twelfth embodiment>
Next, a twelfth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  FIG. 16 is a diagram illustrating an example of the substrate processing apparatus RT12 according to the twelfth embodiment. In FIG. 16, the substrate processing apparatus RT12 includes a second device 700 that separates the cover member C from the substrate P. The cover member C may be a band-shaped member, or may be a cover member Cs having a dimension sufficiently smaller than the dimension of the substrate P in the first direction as shown in FIG.

  In the present embodiment, the second device 700 includes a plate member 701 that can be inserted between the substrate P and the cover member C. The second device 700 can separate the cover member C (Cs) from the substrate P by inserting the plate member 701 between the substrate P and the cover member C (Cs).

<13th Embodiment>
Next, a thirteenth embodiment will be described. In the following description, the same or equivalent components as those of the above-described embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.

  17 and 18 are diagrams schematically illustrating an example of a device manufacturing method according to the present embodiment. As shown in FIGS. 17 and 18, the device manufacturing method according to the present embodiment includes process A to process E.

  Step A includes a photolithography step. In step A, the wound belt-like substrate P is sent out (SA1), and a process (SA2) for applying a resist (photosensitive material) to the substrate P and a process for heating the substrate P (SA3) are performed. Thereafter, a process of exposing the substrate P (SA4), a process of heating (SA5), a process of developing (SA6), and a process of cleaning (SA7) are performed. Thereafter, an etching process (SA8), a process for cleaning the substrate P (SA9), and an exposure process (SA10) are performed. Thereafter, a process of removing the resist from the substrate P (SA11), a process of cleaning the substrate P (SA12), and a process of drying the substrate P using hot air (SA13) are performed, and the process A is completed. In the present embodiment, in the cleaning process (SA7, SA9, SA12), cleaning using water is performed. The substrate P may be washed with water while applying ultrasonic waves to the water.

  In the process B, a process of applying a UV curable resin to the substrate P (SB1), a process of exposing the substrate P (SB2), a process of heating (SB3), and an atmospheric pressure plasma process (SB4) for the substrate P are performed. The

  In step C, a process (SC1) for applying a material to be a base film for plating to the substrate P (SC1), a process for exposing the substrate P (SC2), a process for heating (SC3), a process for developing (SC4), and A heating process (SC5) is performed.

  In the process D, a photolithography process and an electroless plating process of performing an electroless plating process on the substrate P in a state where the cover member C is attached to the back surface pb are performed according to the above-described embodiment. In the photolithography process, a process of applying a resist to the substrate P (SD1), a process of heating the substrate P (SD2), a process of exposing the substrate P (SD3), and a process of heating the substrate P (SD4) ), A developing process (SD5), and a cleaning process (SD6).

  In the electroless plating step, for example, the first pretreatment (SD7), the first cleaning treatment (SD8), and the second pretreatment (SD9) as described in the eighth and ninth embodiments described above. Then, the second cleaning process (SD10) and the electroless plating process (SD11) are performed.

  Further, in the process D, after the electroless plating process, the process of cleaning the substrate P (SD12), the process of exposing (SD13), the process of removing the resist from the substrate P (SD14), and the process of cleaning the substrate P (SD15) ), Au displacement plating process (SD16), process for cleaning the substrate P (SD17), reduction process (SD18), process for cleaning the substrate P (SD19), and process for drying the substrate P using hot air (SD20) ) Is executed.

  In step E, a process of applying a semiconductor material (SE1), a process of drying (SE2), a process of coating (SE3), and a process of curing (SE4) are performed in a space filled with an inert gas. Thereafter, the substrate P is wound up (SE5). In addition, predetermined processing such as dicing is performed on the substrate P.

  Note that the requirements of the above-described embodiments can be combined as appropriate. Some components may not be used. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above embodiments and modifications are incorporated herein by reference.

  DESCRIPTION OF SYMBOLS 1 ... 1st supply unit, 2 ... Surface treatment apparatus, 3 ... 1st collection | recovery unit, 4 ... 1st feed mechanism, 5 ... Control apparatus, 6 ... 1st apparatus, 7 ... 2nd apparatus, 8 ... Conveyance roller, 9 DESCRIPTION OF SYMBOLS ... Conveyance roller, 10 ... 2nd feed mechanism, 11 ... 2nd supply unit, 12 ... 2nd collection | recovery unit, 13 ... Conveyance roller, 14 ... Conveyance roller, 20 ... Surface treatment apparatus, 21 ... Container, 30 ... Cleaning apparatus, C ... cover member, ca ... front surface, cb ... back surface, P ... substrate, pa ... front surface, pb ... back surface, RT1-RT12 ... substrate processing apparatus

Claims (27)

A first feeding mechanism for feeding a belt-like substrate from the first supply unit to the first recovery unit;
A first device for attaching a cover member to at least a part of the back surface of the substrate sent from the first supply unit;
A surface treatment apparatus for treating the surface of the substrate sent from the first apparatus in a state where the cover member is attached to the back surface;
A substrate processing apparatus comprising: a second apparatus that is disposed between the surface processing apparatus and the first recovery unit and separates the cover member from the substrate sent from the surface processing apparatus.   The substrate processing apparatus according to claim 1, wherein the first apparatus attaches the cover member to the substrate while the substrate is being sent.   3. The substrate processing apparatus according to claim 1, wherein the first apparatus includes a second member that sandwiches the substrate and the cover member with a first member disposed at a position where the surface of the substrate can be opposed. .   The substrate processing apparatus according to claim 1, wherein the second apparatus separates the cover member from the substrate while the substrate is being sent.   The substrate processing apparatus according to claim 1, wherein the second apparatus feeds the cover member in a direction different from a feeding direction of the substrate by the first feeding mechanism.   The substrate according to any one of claims 1 to 5, further comprising a second feeding mechanism that feeds the cover member in synchronization with the substrate at least at a part between the first supply unit and the first recovery unit. Processing equipment.   The substrate processing apparatus according to claim 6, wherein the first apparatus attaches the cover member to the substrate in a state where the substrate and the cover member are sent in synchronization.   The first apparatus includes the second roller that sandwiches the substrate and the cover member between the first roller of the first feeding mechanism and the first roller that are arranged at positions where the surface of the substrate can face each other. The substrate processing apparatus according to claim 6, further comprising a second roller of the feeding mechanism.   The substrate processing apparatus according to claim 6, wherein the second apparatus separates the cover member from the substrate in a state where the substrate and the cover member are sent in synchronization.   The second device feeds the cover member in a direction different from the direction of feeding the substrate by the first feeding mechanism, and a third roller of the first feeding mechanism arranged at a position where the surface of the substrate can be opposed. The substrate processing apparatus according to claim 6, further comprising a fourth roller of the second feeding mechanism. The cover member is a band-shaped member,
The said 2nd feeding mechanism sends the said cover member from a 2nd supply part to the said 1st apparatus, and sends the said cover member from the said 2nd apparatus to a 2nd collection | recovery part. The substrate processing apparatus as described. The cover member is a band-shaped member,
The substrate processing apparatus according to claim 6, wherein the second feeding mechanism sends the cover member from the second apparatus to the first apparatus.   The substrate processing apparatus according to claim 1, comprising a plurality of the surface processing apparatuses between the first supply unit and the first recovery unit.   The substrate processing apparatus according to claim 1, wherein the surface treatment includes a process of supplying a liquid to the surface of the substrate. The surface treatment apparatus has a container for storing a liquid,
The substrate processing apparatus according to claim 1, wherein the processing of the front surface includes a processing of immersing the substrate in a liquid in the container with the cover member attached to the back surface.   The substrate processing apparatus according to claim 15, wherein the first feeding mechanism includes a transport roller that is at least partially disposed in the container and supports at least one of the substrate and the cover member.   The substrate processing apparatus as described in any one of Claims 1-16 provided with the washing | cleaning apparatus which wash | cleans the said cover member from a said 2nd apparatus. The substrate includes at least one of polyethylene terephthalate, polyimide, and polyethylene naphthalate,
The substrate processing apparatus according to claim 1, wherein a surface of the cover member includes at least one of polyurethane and silicon rubber. Processing a substrate using the substrate processing apparatus according to claim 1;
Processing the processed substrate. A device manufacturing method. Sending out at least a part of the wound belt-like substrate from the first supply unit;
Attaching a cover member to at least a part of the back surface of the substrate sent from the first supply unit;
Processing the surface of the substrate with the cover member attached to the back surface;
Separating the cover member from the substrate subjected to the surface treatment;
A substrate processing method comprising: recovering the substrate separated from the cover member from the first recovery unit and winding the substrate.   21. The substrate processing method according to claim 20, further comprising feeding the cover member in synchronization with the substrate at least in a portion between the first supply unit and the first recovery unit.   The substrate processing method according to claim 21, wherein the cover member is attached to the substrate in a state where the substrate and the cover member are sent synchronously.   23. The substrate processing method according to claim 20, wherein the cover member is separated from the substrate while feeding the substrate and the cover member. Treating the surface includes supplying a liquid to the surface of the substrate;
The substrate processing method according to any one of claims 20 to 23, wherein the cover member is in close contact with the back surface of the substrate so that the liquid does not contact the back surface of the substrate. The substrate includes at least one of polyethylene terephthalate, polyimide, and polyethylene naphthalate,
25. The substrate processing method according to claim 20, wherein the surface of the cover member includes at least one of polyurethane and silicon rubber.   26. The substrate processing method according to any one of claims 20 to 25, comprising cleaning the cover member separated from the substrate. Processing a substrate using the substrate processing method according to any one of claims 20 to 26;
Processing the processed substrate. A device manufacturing method.

Images