JP2012124316A - Light emitting device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a side view type light emitting device which suppresses the decrease of luminous energy and the deterioration of strength, and to provide a manufacturing method of the light emitting device.SOLUTION: In a light emitting device 100, a first lead 40 has a first terminal part 42 exposed from a compact 30 in a border of a bottom surface 20A, a rear surface 20D, and a first side surface 20E, and a second lead 50 has a second terminal part 52 exposed from the compact 30 in a border of a bottom surface 20A, a rear surface 20D, and a second side surface 20E. The first lead 40 has a first terminal recessed part 42S, and the second lead 50 has a second terminal recessed part 52S. The first lead 40 is disposed on an embedded surface 42C and has a first embedded insulation sheet 61 embedded in the compact 30.

Description

  The present invention relates to a side-view type light emitting device and a method for manufacturing the same.

  Conventionally, a light emitting device including a light emitting element (for example, a light emitting diode or a laser diode) has been widely used as a light source for a backlight for a liquid crystal television, a lighting fixture, or an optical communication device. Such a light emitting device is mounted on the mounting surface of the mounting substrate.

  Generally, a light emitting device is classified into a top view type and a side view type according to a direction in which light emitted from a light emitting element (hereinafter referred to as “emitted light”) is extracted. In the top-view type light emitting device, outgoing light is extracted in a direction perpendicular to the mounting surface, and in the side-view type light emitting device, outgoing light is extracted in a direction parallel to the mounting surface.

Here, in a top-view type light emitting device, a method of fixing four corners on the mounting substrate side of the light emitting device to the mounting substrate has been proposed (see Patent Document 1).
Specifically, the light emitting device of Patent Document 1 is formed in a rectangular parallelepiped shape, and includes a bottom surface that is in contact with the mounting surface, a top surface that is a light emitting surface facing the bottom surface, and four side surfaces that are continuous with the bottom surface and the top surface. And four terminals arranged at four corners formed by four side surfaces and a bottom surface. Such a top-view light-emitting device is firmly fixed to the mounting substrate by soldering four terminals to the mounting surface.

JP 2010-62272 A

  However, when the method of Patent Document 1 is applied to a side-view type light emitting device, the light amount of the light emitting device may be reduced. Specifically, in the side-view type light emitting device, one of the four side surfaces (hereinafter referred to as “front surface”) is a light emission surface, and light is emitted from a front opening formed on the front surface. For this reason, when two terminals are arranged on the front surface, the area of the front opening is reduced, so that if the compact size is maintained, the light amount of the light emitting device is reduced.

  Further, in the method of Patent Document 1, when the molded body that forms the outer shape of the light emitting device is made of resin, the flux is infiltrated into the resin when the four terminals are soldered to the mounting surface. The strength of the body may be reduced. Such a decrease in the strength of the molded body may greatly affect the strength around the front surface where the front opening is formed.

  The present invention has been made in view of the above-described situation, and an object thereof is to provide a side-view type light-emitting device capable of suppressing a decrease in light amount and a decrease in intensity, and a manufacturing method thereof.

  A light emitting device according to the present invention includes a substantially rectangular parallelepiped package and a light emitting element mounted on the package. The package includes a molded body made of a resin material, and first and second leads embedded in the molded body and made of a metal material. The package includes a bottom surface, a top surface facing the bottom surface, a front surface that is a light emitting surface continuous to the bottom surface and the top surface, a back surface facing the front surface, and a first side surface and a second side surface respectively connected to the front surface and the back surface. .

  The first lead is formed on the first connection portion electrically connected to the light emitting element, the first terminal portion exposed from the molded body at the boundary between the bottom surface, the back surface, and the first side surface, and the first terminal portion. A first terminal recess that opens to the back surface and the first side surface, and a first embedded insulation that is disposed on the first embedded surface provided on the front surface side of the first terminal portion and embedded in the molded body. And a sheet.

  The second lead is formed on the second terminal portion that is electrically connected to the light emitting element, the second terminal portion that is exposed from the molded body at the boundary between the bottom surface, the back surface, and the second side surface, and the bottom surface. And a second terminal recess that opens to the back surface and the second side surface.

  ADVANTAGE OF THE INVENTION According to this invention, the side view type light-emitting device which can suppress the reduction | decrease in light quantity and the fall of intensity | strength, and its manufacturing method can be provided.

It is the perspective view which looked at the light-emitting device 100 which concerns on embodiment from the front. It is the perspective view which looked at the light-emitting device 100 which concerns on embodiment from back. FIG. 2 is a perspective view of FIG. 1. FIG. 3 is a perspective view of FIG. 2. It is the perspective view which looked at the 1st terminal crevice 42S concerning an embodiment from the lower part. It is the perspective view which looked at the base recessed part 43S which concerns on embodiment from the downward direction. It is the perspective view which looked at the 2nd terminal crevice 52S concerning an embodiment from the lower part. It is a perspective view of the mounting surface of the mounting substrate 200 which concerns on embodiment. It is a perspective view of the mounting surface of the circuit board 300 which concerns on embodiment. It is a top view of the metal plate 70 which concerns on embodiment. It is sectional drawing in the AA of FIG. 3 is a plan view of a first lead frame 71 according to the embodiment. FIG. It is sectional drawing in the BB line of FIG. FIG. 6 is a plan view of a second lead frame 72 according to the embodiment. It is sectional drawing in CC line of FIG. It is a top view of the 3rd lead frame 73 concerning an embodiment. It is sectional drawing in the DD line | wire of FIG. 7 is a plan view of a fourth lead frame 74 according to the embodiment. FIG. It is sectional drawing in the EE line | wire of FIG. 7 is a cross-sectional view showing a state in which a fourth lead frame 74 according to the embodiment is fixed in a mold 90. FIG. It is the top view which looked at the package array 80 which concerns on embodiment from the 1st surface 70A side. It is the top view which looked at the light-emitting device array 90 which concerns on embodiment from the 2nd surface 70B side. It is a top view which shows the cutting line in the light-emitting device array 90 which concerns on embodiment. It is sectional drawing in the FF line of FIG.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

(Schematic configuration of light emitting device)
The configuration of the light emitting device according to the embodiment will be described with reference to the drawings. FIG. 1 is a perspective view of a light emitting device 100 according to an embodiment as viewed from the front. FIG. 2 is a perspective view of the light emitting device 100 according to the embodiment as viewed from the rear.

  The light emitting device 100 includes a light emitting element 10 and a package 20. The light emitting device 100 according to the present embodiment is a so-called side view type light emitting device, and light emitted from the light emitting element 10 is extracted in a direction parallel to a mounting surface 200A (see FIG. 8) of a mounting substrate 200 described later. It is.

  In the present embodiment, the outer shape of the light emitting device 100 is a substantially rectangular parallelepiped shape extending along the first direction. In the present embodiment, the size of the light emitting device 100 is about 3 mm in the first direction, about 1 mm in the direction orthogonal to the first direction and parallel to the mounting surface 200A (hereinafter referred to as “second direction”). It is about 1 mm in a direction orthogonal to the first direction and the second direction (that is, a direction orthogonal to the mounting surface 200A, hereinafter referred to as “third direction”). The size of the light emitting device 100 is not limited to this.

  Note that in the side-view type light-emitting device such as the light-emitting device 100, the ratio of the height in the third direction to the depth in the second direction tends to be larger than that in the top-view type light-emitting device. That is, the side-view type light-emitting device is likely to fall forward or backward as compared to the top-view type light-emitting device.

<Light emitting element 10>
The light emitting element 10 is placed on the package 20. The light emitting element 10 is electrically connected to the package 20 via the first wire 11 and the second wire 12.

The light emitting element 10 is formed in a plate shape and is disposed perpendicular to the second direction. Light emitted from the light emitting element 10 is extracted in the second direction from a front opening 20F described later.
The light emitting element 10 is, for example, a semiconductor light emitting element called a so-called light emitting diode. As the light-emitting element 10, an element having a semiconductor such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, or AlInGaN on a substrate is preferably used. It is not limited.

  The light emitting element 10 can employ a face-up structure or a face-down structure. The size of the light emitting element 10 is not particularly limited, but may be about 350 μm square, 500 μm square, and 1 mm square.

<Package 20>
The package 20 has a substantially rectangular parallelepiped shape extending along the first direction. Package 20 includes a bottom surface 20A, a top surface 20B, and the front 20C, and a rear 20D, the first side surface 20E _1, and a second side face 20E _2.

When the light emitting device 100 is mounted, the bottom surface 20A is in contact with the mounting surface 200A (see FIG. 8). The upper surface 20B is provided to face the bottom surface 20A. The front surface 20C is a light emitting surface that is continuous with the bottom surface 20A and the top surface 20B. The front surface 20 </ b> C has a front surface opening 20 </ b> F for guiding light emitted from the light emitting element 10 to the outside of the package 20. The light emitting element 10 is placed on the first connection surface 41A (see FIG. 3) exposed inside the front opening 20F. The back surface 20D is connected to the bottom surface 20A and the top surface 20B, and is provided to face the front surface 20C. First side 20E ₁ is continuous with the rear 20D and the front 20C, is perpendicular to the first direction. The second side surface 20E ₂ is provided opposite to the first side 20E _1, it is perpendicular to the first direction.

  The package 20 includes a molded body 30, a first lead 40, a second lead 50, and a sealing resin 60. Hereinafter, each part which comprises the package 20 is demonstrated.

(1) Molded body 30
The molded body 30 forms the outer shape of the package 20. The molded body 30 is made of an insulating material that hardly transmits light emitted from the light-emitting element 10 or external light, and has heat resistance and appropriate strength. As such an insulating material, a triazine derivative epoxy resin which is a thermosetting resin is suitable. Such a thermosetting resin may contain an acid anhydride, an antioxidant, a release material, a light reflecting member, an inorganic filler, a curing catalyst, a light stabilizer, and a lubricant. As the light reflecting member, titanium dioxide filled with 0 to 90 wt%, preferably 10 to 60 wt% can be used. However, the material which comprises the molded object 30 is not restricted to this, For example, it selects from an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, and a urethane resin among thermosetting resins. At least one resin can be used. In particular, an epoxy resin, a modified epoxy resin, a silicone resin, and a modified silicone resin are suitable as the material of the molded body 30. Further, as a material constituting the molded body 30, a thermoplastic resin such as a liquid crystal polymer, a polyphthalamide resin, or polybutylene terephthalate (PBT) can be used.

(2) First lead 40 and second lead 50
The first lead 40 and the second lead 50 are preferably made of a material having a relatively large thermal conductivity (for example, about 200 W / (m · K) or more). Thereby, the heat generated from the light emitting element 10 can be efficiently transmitted. As such a material, for example, a single layer or a plurality of metals such as Ni, Au, Cu, Ag, Mo, W, aluminum, gold, iron, or an alloy such as iron-nickel alloy, phosphor bronze, iron-containing copper, etc. Layers can be used. The surfaces of the first lead 40 and the second lead 50 may be plated.

  Most of the first lead 40 and the second lead 50 are embedded in the molded body 30, and only a part of the first lead 40 and the second lead 50 is exposed from the molded body 30. In the present embodiment, the first lead 40 and the second lead 50 are a pair of external electrodes (a first terminal portion 42 and a second terminal portion 52 to be described later, FIG. 3 and FIG. 4).

(3) Sealing resin 60
The sealing resin 60 is filled in the front opening 20F and seals the light emitting element 10. As such a sealing resin 60, a resin having translucency, for example, polyolefin resin, polycarbonate resin, polystyrene resin, epoxy resin, acrylic resin, acrylate resin, methacrylic resin (PMMA, etc.), urethane resin, polyimide resin. At least one resin selected from polynorbornene resin, fluororesin, silicone resin, modified silicone resin, modified epoxy resin, and the like can be used. In addition, such a material may contain, for example, a phosphor or a pigment, a filler, a diffusing material, or the like described in WO2006 / 038502 and JP2006-229055.

(Lead structure)
Next, the configuration of the lead according to the embodiment will be described with reference to the drawings. FIG. 3 is a perspective view of FIG. FIG. 4 is a perspective view of FIG. 3 and 4, the contour of the molded body 30 is shown.

<Configuration of first lead 40>
The first lead 40 includes a first connection part 41, a first terminal part 42, a base part 43, and a first extension part 44. In the present embodiment, the first terminal portion 42, the base portion 43, and the first extension portion 44 are integrally connected to the first connection portion 41.

(1) 1st connection part 41
The 1st connection part 41 is formed in plate shape, and is arrange | positioned along the back surface 20D. The first connection portion 41 has a first connection surface 41A (an example of a “mounting surface”). The first connection surface 41A is the surface of the first connection portion 41 on the front surface 20C side. The light emitting element 10 is mounted on the first connection surface 41A, and the first wire 11 is connected thereto. A part of the first connection surface 41A is exposed from the molded body 30 inside the front opening 20F and is sealed by the sealing resin 60 (see FIG. 1).

(2) First terminal portion 42
The first terminal portion 42 is coupled to the lower end of the first connection portion 41 on the first side surface 20E ₁ side. The first terminal portion 42, the bottom surface 20A, is exposed from the molded body 30 in the rear 20D and the first boundary of the side 20E _1, functions as an external electrode of the light emitting device 100. The first terminal portion 42 includes a first exposed surface 42A, a second exposed surface 42B, an embedded surface 42C (an example of a “first embedded surface”), a first terminal recess 42S, a first notch 42D, Have

The first exposed surface 42A is exposed from the molded body 30 on the back surface 20D of the package 20. The first exposed surface 42A forms part of the back surface 20D. The second exposed surface 42 </ b> B is exposed from the molded body 30 on the first side surface 20 </ b> E ₁ of the package 20. The second end face 42B forms a first part of the side surface 20E _1. The embedded surface 42 </ b> C is a surface of the first terminal portion 42 on the front surface 20 </ b> C side. The embedded surface 42 </ b> C is embedded in the molded body 30. The embedded surface 42C is substantially parallel to the front surface 20C and the back surface 20D. The embedded surface 42 </ b> C is continuous with the first connection surface 41 </ b> A of the first connection portion 41.

Here, as shown in FIG. 3, the first embedded insulating sheet 61 (an example of “first embedded insulating sheet”) is disposed on the embedded surface 42 </ b> C. The first embedded insulating sheet 61 is embedded in the molded body 30. The end surface of the first buried insulating sheet 61 is exposed to the bottom surface 20A and the first side 20E _1. The first embedded insulating sheet 61 is made of a sheet-like insulating material. As such an insulating material, a polyimide resin having high adhesiveness with the resin material constituting the molded body 30 and the metal material constituting the first lead 40 is suitable, but is not limited thereto. .

The first terminal recess 42S is a notch formed in the bottom surface 20A, the rear 20D and the first boundary of the side 20E _1. The first terminal recess 42S is a bottom 20A, and is opened continuous to each of the three sides of the back 20D and first side 20E _1. When the light emitting device 100 is mounted, solder (a part of the first solder fillet 311, see FIG. 9) is accommodated in the first terminal recess 42S.

  Here, FIG. 5 is a perspective view of the first terminal recess 42S as viewed from below. As shown in FIG. 5, the first terminal recess 42 </ b> S includes a first inner wall 421 (an example of a “first shear surface”), a second inner wall 422 (an example of a “first shear surface”), 3 inner walls 423 (an example of “first parallel surface”).

Each of the first inner wall 421 and the second inner wall 422 is a “shear surface” formed by shearing at the tip of the punch when the metal plate 70 is pressed (the first annular wall thickness shown in FIG. 17). Referring to the inner peripheral surface _{T 1} of the section 113a). However, the first inner wall 421 and the second inner wall 422 may include a so-called “sag” or “fracture surface”. In the present embodiment, the first inner wall 421 is parallel to the first side 20E _1, second inner wall 422 is parallel to the bottom surface 20A.

The third interior wall 423, a metal plate 70 upon pressing a surface formed by being pressed by the tip of the punch (see upper surface U ₁ of the first ring in the thin portion 113b shown in FIG. 17) . The third inner wall 423 is parallel to the back surface 20D. A first exposed insulating sheet 64 is disposed on the third inner wall 423. The first exposed insulating sheet 64 is exposed in the first terminal recess 42S. The first exposed insulating sheet 64 is made of a sheet-like insulating material. As such an insulating material, a polyimide resin with low solder wettability is suitable, but is not limited thereto.

First notch 42D includes a third interior wall 423 (an example of "first parallel face"), a first side face 20E _1, is formed so as to be continuous to the bottom surface 20A,. In the present embodiment, the first notch 42D is also connected to the embedded surface 42C. That is, the first notch 42D is formed so as to penetrate the first terminal portion 42 along the second direction.

  Further, the first notch 42 </ b> D is formed on the back surface 20 </ b> D side of the first embedded insulating sheet 61 and on the front surface 20 </ b> C side of the first exposed insulating sheet 64. That is, the first notch 42D is sandwiched between the first embedded insulating sheet 61 and the first exposed insulating sheet 64 in the second direction.

(3) Base part 43
The base portion 43 is connected to the bottom surface 20 </ b> A side of the first connection portion 41, that is, the lower end portion of the first connection portion 41. Accordingly, the base portion 43 is a base of the light emitting device 100 and functions as a “weight” for stabilizing the light emitting device 100 that easily falls forward or backward.

  Moreover, the base part 43 has the 1st exposed surface 43A exposed from the molded object 30 in back 20D. Thereby, the base part 43 functions as a heat sink that releases heat generated from the light emitting element 10.

  In the present embodiment, the base portion 43 has an embedded surface 43C, a base concave portion 43S, and a third cutout 43D. The embedded surface 43 </ b> C is a surface of the base portion 43 on the front surface 20 </ b> C side. The embedded surface 43 </ b> C is embedded in the molded body 30. The embedded surface 43 </ b> A is continuous with the first connection surface 41 </ b> A of the first connection portion 41.

  Here, as shown in FIG. 3, the third embedded insulating sheet 63 is disposed on the embedded surface 43 </ b> C. The third embedded insulating sheet 63 is embedded in the molded body 30. The end surface of the third embedded insulating sheet 63 is exposed on the bottom surface 20A. The third embedded insulating sheet 63 is made of an insulating material processed into a sheet shape. As such an insulating material, a polyimide resin is suitable similarly to the first embedded insulating sheet 61, but is not limited thereto.

  The base recess 43S is a notch formed at a part of the boundary between the bottom surface 20A and the back surface 20D. The foundation recess 43S is continuous with the bottom surface 20A and the back surface 20D and opens. When the light emitting device 100 is mounted, solder (a pair of third solder fillets 313a, 313b, see FIG. 9) is accommodated in the base recess 43S.

  Here, FIG. 6 is a perspective view of the base recess 43S as viewed from below. As shown in FIG. 6, a first inner wall 431, a second inner wall 432, a third inner wall 433, and a fourth inner wall 434 are provided inside the base recess 43 </ b> S.

Each of the first to third inner walls 431 to 433 is a “shear surface” formed by being sheared at the tip of the punch when the metal plate 70 is pressed (the second annular wall thickness shown in FIG. 17). Referring to the inner peripheral surface _{T 2} of the section 114a). However, the first to third inner walls 431 to 433 may include a so-called “sole” or “fracture surface”. In the present embodiment, the first interior wall 431 and the second inner wall 432 is parallel to the first side 20E _1, third inner wall 433 is parallel to the bottom surface 20A.

The fourth interior wall 434, a metal plate 70 upon pressing a surface formed by being pressed by the tip of the punch (see top U ₂ of the second ring in the thin portion 114b shown in FIG. 17) . In the present embodiment, the fourth inner wall 434 is parallel to the back surface 20D. In the present embodiment, the third exposed insulating sheet 66 is disposed on the fourth inner wall 434. The third exposed insulating sheet 66 is exposed in the base recess 43S. The third exposed insulating sheet 66 is made of an insulating material processed into a sheet shape. As such an insulating material, a polyimide resin is suitable similarly to the first exposed insulating sheet 64, but is not limited thereto.

  The third cutout 43D is formed on the bottom surface 20A. The third cutout 43D is formed along the second direction. In the present embodiment, the third cutout 43D is formed on the back surface 20D side of the third embedded insulating sheet 63 and on the front surface 20C side of the third exposed insulating sheet 66. That is, the third cutout 43D is sandwiched between the third embedded insulating sheet 63 and the third exposed insulating sheet 66 in the second direction.

(4) First extension 44
The first extension portion 44 is disposed on the first connection portion 41 and is connected to the first terminal portion 42. The first extension portion 101 extends from the surface on the back surface 20D side of the first connection portion 41 toward the back surface 20D, and is exposed from the molded body 30 on the back surface 20D. The first extending portion 44 has a first extending surface 44A that forms a part of the back surface 20D.

<Configuration of Second Lead 50>
The second lead 50 includes a second connection part 51, a second terminal part 52, and a second extension part 53. In the present embodiment, the second terminal portion 52 and the second extension portion 53 are integrally connected to the second connection portion 51.

(1) Second connection part 51
The 2nd connection part 51 is formed in plate shape, and is arrange | positioned along the back surface 20D. The second connection portion 51 has a second connection surface 51A. The second connection surface 51 </ b> A is a surface of the second connection portion 51 on the front surface 20 </ b> C side. The second wire 12 is connected to the second connection surface 51A. A part of the second connection surface 51A is exposed from the molded body 30 inside the front opening 20F and is sealed by the sealing resin 60 (see FIG. 1).

(2) Second terminal portion 52
The second terminal portion 52 is coupled to the lower end of the second connecting portion 51 on the second side surface 20E ₂ side. The second terminal portion 52, the bottom surface 20A, is exposed from the molded body 30 in the rear 20D and the second boundary side 20E _2, functions as an external electrode of the light emitting device 100. The second terminal portion 52 includes a first exposed surface 52A, a second exposed surface 52B, an embedded surface 52C (an example of a “second embedded surface”), a second terminal recess 52S, a second notch 52D, Have

The first exposed surface 52A is exposed from the molded body 30 on the back surface 20D of the package 20. The first exposed surface 52A forms part of the back surface 20D. The second exposed surface 52B is exposed from the molded body 30 at the second side face 20E ₂ of the package 20. The second end face 52B forms a second part of the side surface 20E _2. The embedded surface 52 </ b> C is a surface of the second terminal portion 52 on the front surface 20 </ b> C side. The embedded surface 52C is embedded in the molded body 30. The embedded surface 52 </ b> C is continuous with the second connection surface 51 </ b> A of the second connection portion 51.

Here, as shown in FIG. 3, the second embedded insulating sheet 62 (an example of “second embedded insulating sheet”) is disposed on the embedded surface 52 </ b> C. The second embedded insulating sheet 62 is embedded in the molded body 30. The end surface of the second buried insulating sheet 62 is exposed to the bottom surface 20A and the second side surface 20E _2. The second embedded insulating sheet 62 is made of an insulating material processed into a sheet shape. As such an insulating material, a polyimide resin is suitable similarly to the first embedded insulating sheet 61, but is not limited thereto.

The second terminal recess 52S is a notch formed in the bottom surface 20A, the rear 20D and the second boundary side 20E _2. The second terminal recess 52S is open continuous with three sides each of the bottom 20A, the back 20D and the second side surface 20E _2. When the light emitting device 100 is mounted, solder (a part of the second solder fillet 312; see FIG. 9) is accommodated in the second terminal recess 52S.

  Here, FIG. 7 is a perspective view of the second terminal recess 52S as viewed from below. As shown in FIG. 7, the second terminal recess 52 </ b> S includes a first inner wall 521 (an example of a “second shear surface”), a second inner wall 522 (an example of a “second shear surface”), 3 inner walls 523 (an example of “second parallel surface”).

Each of the first inner wall 521 and the second inner wall 522 is a “shear surface” formed by being sheared at the tip of the punch when the metal plate 70 is pressed (the first annular wall thickness shown in FIG. 17). Referring to the inner peripheral surface _{T 1} of the section 113a). However, the first inner wall 521 and the second inner wall 522 may include a so-called “sag” or “fracture surface”. In the present embodiment, the first inner wall 521 is parallel to the second side face 20E _2, the second inner wall 522 is parallel to the bottom surface 20A.

The third interior wall 523, a metal plate 70 upon pressing a surface formed by being pressed by the tip of the punch (see upper surface U ₁ of the first ring in the thin portion 113b shown in FIG. 17) . The third inner wall 523 is parallel to the back surface 20D. A second exposed insulating sheet 65 is disposed on the third inner wall 523. The second exposed insulating sheet 65 is exposed in the second terminal recess 52S. The second exposed insulating sheet 65 is made of an insulating material processed into a sheet shape. As such an insulating material, a polyimide resin is suitable similarly to the first exposed insulating sheet 64, but is not limited thereto.

The second notch 52D includes a third interior wall 523 (an example of "second parallel surface"), and the second side surface 20E _2, is formed so as to be continuous to the bottom surface 20A,. In the present embodiment, the second cutout 52D is also connected to the embedded surface 52C. That is, the second cutout 52D is formed so as to penetrate the second terminal portion 52 along the second direction.

  The second cutout 52D is formed on the back surface 20D side of the second embedded insulating sheet 62 and on the front surface 20C side of the second exposed insulating sheet 65. That is, the second notch 52D is sandwiched between the second embedded insulating sheet 62 and the second exposed insulating sheet 65 in the second direction.

(3) Second extending portion 53
The second extending portion 53 is disposed on the second connecting portion 51 and is connected to the second terminal portion 52. The second extending portion 53 extends from the surface on the back surface 20D side of the second connecting portion 51 toward the back surface 20D, and is exposed from the molded body 30 on the back surface 20D. The second extending portion 53 has a second extending surface 53A that forms a part of the back surface 20D.

(Configuration of mounting board)
Next, the configuration of the mounting substrate according to the embodiment will be described with reference to the drawings. FIG. 8 is a perspective view of the mounting surface of the mounting substrate 200 according to the embodiment. In FIG. 8, a region where the light emitting device 100 is mounted is shown as a mounting region 100R.

As illustrated in FIG. 8, the mounting substrate 200 includes a mounting surface 200 </ b> A, a first land 201, a second land 202, and an electric circuit 203.
The light emitting device 100 is mounted on the mounting surface 200A. The first land 201 is a metal member for connecting the first terminal portion 42 and the base portion 43. The second land 202 is a metal member (for example, copper foil) for connecting the second terminal portion 52.

  The electric circuit 203 is connected to each of the first land 201 and the second land 202. Thereby, the first land 201 functions as an external terminal corresponding to the first terminal portion 42 and the base portion 43, and the second land 202 functions as an external terminal corresponding to the second terminal portion 52.

(Configuration of circuit board)
Next, the configuration of the circuit board according to the embodiment will be described with reference to the drawings. FIG. 9 is a perspective view of the mounting surface of the circuit board 300 according to the embodiment.

  As shown in FIG. 9, the circuit board 300 includes a light emitting device 100, a mounting board 200, and solder fillets 310 (a first solder fillet 311, a second solder fillet 312 and a pair of third solder fillets 313a and 313b). ). The solder fillet 310 is formed by reflow soldering using a solder material containing flux.

First solder fillet 311 is connected to the mounting surface 200A back 20D and first side 20E ₁ and to straddle it. A part of the first solder fillet 311 is accommodated in the first terminal recess 42S. As a result, the first terminal portion 42 and the first land 201 are electrically and mechanically connected. The first solder fillet 311 contacts the first exposed insulating sheet 64 in the first terminal recess 42S.

The second solder fillet 312 is connected to the mounting surface 200A back 20D and the second side surface 20E ₂ and the across it. A part of the second solder fillet 312 is accommodated in the second terminal recess 52S. Thereby, the second terminal portion 52 and the second land 202 are electrically and mechanically connected. The second solder fillet 312 contacts the second exposed insulating sheet 65 in the second terminal recess 52S.

  The pair of third solder fillets 313a and 313b are disposed inside the base recess 43S. Specifically, the third solder fillet 313a is connected across the mounting surface 200A and the first inner wall 431, and the third solder fillet 313b is connected across the mounting surface 200A and the second inner wall 432. The base portion 43 and the first land 201 are electrically and mechanically connected by the pair of third solder fillets 313a and 313b.

(Method for manufacturing light emitting device)
Next, a method for collectively manufacturing a plurality of light emitting devices 100 according to the embodiment will be described with reference to FIGS.

<Punching process>
FIG. 10 is a plan view of the metal plate 70 according to the present embodiment. 11 is a cross-sectional view taken along line AA in FIG. FIG. 12 is a plan view of the first lead frame 71 according to the present embodiment. 13 is a cross-sectional view taken along line BB in FIG.

First, as shown in FIGS. 10 and 11, a metal plate 70 having a first main surface 70A and a second main surface 70B provided opposite to the first main surface 70A is prepared. The metal plate 70 has a first thickness t ₁ (for example, about 0.5 mm).

  Next, as shown in FIG. 12 and FIG. 13, the first lead frame 71 is manufactured by punching the metal plate 70 with a predetermined mold to form punch holes P in the metal plate 70. . The first lead frame 71 includes a first frame part 110, a second frame part 120, and a third frame part 130. The first frame part 110 and the second frame part 120 are adjacent to each other in a predetermined direction. The third frame portion 130 is adjacent to the first frame portion 110 and the second frame portion 120 in the orthogonal direction, and is connected to both. The first lead frame 71 is configured by connecting a plurality of frame sets in a matrix with the first frame unit 110, the second frame unit 120, and the third frame unit 130 as one frame set. In FIG. 12, only a part of a plurality of frame sets connected in a matrix is shown.

Hereinafter, a detailed configuration of the first lead frame 71 will be described.
The first frame part 110 includes a first part 111, a second part 112, a third part 113, and a fourth part 114. The first portion 111 corresponds to the first connecting portion 41, the base portion 43, and the first extending portion 44 of the light emitting device 100, and has a substantially rectangular shape (for example, about 2.5 mm × 0.8 mm) extending along a predetermined direction. ). The second portion 112 corresponds to the second connecting portion 51 and the second extending portion 53 of the light emitting device 100 and is formed in a rectangular shape (for example, about 0.9 mm × 0.7 mm). The second portion 112 is separated from the first portion 111 in a predetermined direction. The third portion 113 corresponds to the first terminal portion 42 and the second terminal portion 52 of the light emitting device 100 and is formed in a rectangular shape (for example, about 0.8 mm × 0.6 mm). The third portion 113 is disposed between the first portion 111 and the second portion 112 in a predetermined direction. The third portion 113 is connected across the end portions of the first portion 111 and the second portion 112 in the orthogonal direction orthogonal to the predetermined direction. That is, the first part 111 and the second part 112 are connected via the third part 113. The 4th part 114 respond | corresponds to the base recessed part 43S of the light-emitting device 100, and is formed in the rectangular shape (for example, about 1.0 mm x 0.6 mm). The fourth portion 114 is separated from the third portion 113 in the predetermined direction, and is connected to the end portion of the first portion 111 in the orthogonal direction.

  The second frame unit 120 has the same configuration as the first frame unit 110. The third frame part 130 has only the first part 111 and the second part 112 in the configuration of the first frame part 110. The first portion 111 and the second portion 112 of the third frame portion 130 are based on the center point Q of the third portion 113 of the first frame portion 110. And are arranged symmetrically. In addition, the first portion 111 and the second portion 112 of the third frame portion 130 are based on the center point R of the fourth portion 114 of the second frame portion 120 as a reference. It is arranged point-symmetrically with the portion 112. The first portion 111 of the third frame portion 130 is connected to the third portion 113 of the first frame portion 110 and the fourth portion 114 of the second frame portion 120, and the second portion 112 of the third frame portion 130. Is connected to the third portion 113 of the first frame part 110.

<Recess formation process>
FIG. 14 is a plan view of the second lead frame 72 according to the present embodiment. 15 is a cross-sectional view taken along the line CC of FIG. Since one light emitting device 100 is formed based on a pair of the first frame part 110 and the second frame part 120, the configuration of the first frame part 110 and the second frame part 120 will be mainly described below. Explained.

  First, as shown in FIGS. 14 and 15, the first surface 70 </ b> A of the first lead frame 71 is recessed to form first through holes 113 </ b> S (“recesses”) in the first frame part 110 and the second frame part 120. Example) and the second through-hole 114S, the second lead frame 72 is produced. For the dent processing, a mold or a drill having a punch with a predetermined shape can be used.

  As shown in FIG. 14, the first through hole 113 </ b> S is formed at the center of the third portion 113 of each of the first frame part 110 and the second frame part 120. The second through hole 114S is formed at the center of the fourth portion 114 of each of the first frame part 110 and the second frame part 120. As shown in FIG. 15, the first through hole 113 </ b> S and the second through hole 114 </ b> S communicate from the first surface 70 </ b> A to the second surface 70 </ b> B of the second lead frame 72.

<Pressing process>
FIG. 16 is a plan view of the third lead frame 73 according to the present embodiment. 17 is a cross-sectional view taken along the line DD in FIG.

  As shown in FIGS. 16 and 17, the first surface 70 </ b> A of the second lead frame 72 is pressed to form a thick part and a thin part, thereby producing a third lead frame 73. A metal mold provided with a punch having a predetermined shape can be used for the press working. Below, the detailed structure of a thick part and a thin part is demonstrated.

  In the third lead frame 73, each of the first frame part 110 and the second frame part 120 includes a first thick part 111a, a first thin part 111b, a second thick part 112a, a second thin part 112b, and a first annular part. It has a thick portion 113a, a first annular thin portion 113b, a second annular thick portion 114a, and a second annular thin portion 114b.

The first thick part 111 a is formed on the second part 112 side of the first part 111. The first thick part 111a is formed in a rectangular shape in plan view. The first thickness portion 111a has a first thickness _{t 1.} The first thick part 111a corresponds to the first extension part 44 (including a part of the first connection part 41).

The first thin portion 111b is formed so as to surround the first thick portion 111a and the first annular thick portion 113a, and is integrally connected to both. The first thin portion 111b has a second thickness _{t 2.} The first thin portion 111 b corresponds to the outer edge portion and the center portion of the first connection portion 41.

The second thick part 112 a is formed at the center of the second part 112. The second thick part 112a is separated from the first thick part 111a in a predetermined direction. The second thick portion 112a is formed in a rectangular shape in plan view. The second thick portion 112a has a first thickness _{t 1.} The second thick part 112a corresponds to the second extension part 53 (including a part of the second connection part 51).

The second thin portion 112b is formed so as to surround the second thick portion 112a, and is integrally connected to the second thick portion 112a. The second thin portion 112b has a second thickness _{t 2.} The second thin portion 112 b corresponds to the outer edge portion of the second connection portion 51.

The first annular thick portion 113 a is formed in an annular shape along the outer edge of the third portion 113. The first annular thick part 113a is connected to the first thin part 111b and the second thick part 112a. First annular thick portion 113a has a first thickness _{t 1.} As shown in FIG. 17, the inner circumferential surface T ₁ of the first annular thick portion 113a is a "shear plane" is formed by being sheared by the leading end of the mold punch. The inner peripheral surface _{T 1} of the first annular thick portion 113a includes a first inner wall 421 and the second inner wall 422 of the first terminal recess 42S, a first inner wall 521 and the second inner wall 522 of the second terminal recess 52S, the Correspond.

The first inner thin portion 113b is formed inside the first annular thick portion 113a in plan view. The first ring in thin section 113b has a second thickness _{t 2.} The first inner thin portion 113b corresponds to the first terminal recess 42S and the second terminal recess 52S. As shown in FIG. 17, the upper surface U ₁ of the first ring in the thin portion 113b is a surface formed by being pressed by the tip of the mold punch. Upper surface _{U 1} of the first ring in the thin portion 113b includes a third interior wall 423 of the first terminal recess 42S, a third interior wall 523 of the second terminal recess 52S, corresponding to the.

The second annular thick portion 114 a is formed in an annular shape across the first portion 111 and the fourth portion 114. The second annular thick part 114a is separated from the first annular thick part 113a in a predetermined direction. The second annular thick portion 114a has a first thickness _{t 1.} The second annular thick part 114a corresponds to the base part 43 (including a part of the first connection part 41). As shown in FIG. 17, the inner circumferential surface T ₂ of the second annular thick portion 114a is a "shear plane" is formed by being sheared by the leading end of the mold punch. The inner peripheral surface _{T 2} of the second annular thick portion 114a corresponds to the first to third inner wall 431 to 433 of the base recess 43S.

The second annular thin portion 114b is formed inside the second annular thick portion 114a in plan view. The second ring in thin section 114b has a second thickness _{t 2.} The second thin inner ring portion 114b corresponds to the base recess 43S. As shown in FIG. 17, the upper surface U ₂ of the second ring in the thin portion 114b is a surface formed by being pressed by the tip of the die punch. Upper surface _{U 2} of the second ring in the thin portion 114b corresponds to the fourth interior wall 434 of the base recess 43S.

  Here, as shown in FIG. 17, in the third lead frame 73 of the present embodiment, the first through hole 113S and the second through hole 114S remain even after the pressing process, but the metal material is formed in each through hole. By being pushed in (ie, “escape”), the diameter of each through-hole is reduced (see FIGS. 15 and 17).

<Through hole closing process>
FIG. 18 is a plan view of the fourth lead frame 74 according to the present embodiment. 19 is a cross-sectional view taken along line EE in FIG.

  As shown in FIGS. 18 and 19, the fourth lead frame 74 is manufactured by closing the first through hole 113 </ b> S and the second through hole 114 </ b> S with the second insulating sheet 150 and the first insulating sheet 160, respectively.

  Specifically, the opening on the first surface 70A side of each of the first through hole 113S and the second through hole 114S is closed by the second insulating sheet 150, and the second of each of the first through hole 113S and the second through hole 114S. The opening on the surface 70 </ b> B side is closed by the first insulating sheet 160.

  The second insulating sheet 150 corresponds to the first to third exposed insulating sheets 64-66. The second insulating sheet 150 is made of a sheet-like insulating material. As such an insulating material, a polyimide resin having good adhesion to the resin material constituting the molded body 30 and the metal material constituting the metal plate 70 is suitable, but is not limited thereto.

  The first insulating sheet 160 corresponds to the first to third embedded insulating sheets 61 to 63. The first insulating sheet 160 is made of a sheet-like insulating material. As such an insulating material, a polyimide resin with low solder wettability is suitable, but is not limited thereto.

<Transfer mold process>
FIG. 20 is a cross-sectional view showing a state in which the fourth lead frame 74 according to the present embodiment is fixed in the mold 90. FIG. 21 is a plan view of the package array 80 according to the present embodiment as viewed from the first surface 70A side.

First, the fourth lead frame 74 is fixed in the mold 400 with the first surface 70 </ b> A in contact with the inner surface of the mold 400.
Next, a resin material is injected from the injection port 400 </ b> A of the mold 400. At this time, since the resin material is blocked by the first insulating sheet 160, the resin material does not flow into the first through hole 113S and the second through hole 114S. Therefore, the resin material does not flow into the first annular thick portion 113a and the second annular thick portion 114a. The first insulating sheet 160 is embedded in a resin material.

  Next, the resin material is heated and cured at a predetermined temperature. As a result, as shown in FIGS. 20 and 21, a package array 80 in which the molding plate 170 and the fourth lead frame 74 are integrally molded is completed.

  When viewed from the first surface 70A side, a front opening 20F is formed in the package array 80, and the second portion 112 of the first frame portion 110 and the first portion 111 of the second frame portion 120 are front surfaces. It is exposed to the opening 20F (see FIG. 22).

<Light emitting element connection process>
FIG. 22 is a plan view of the light emitting device array 90 according to the present embodiment as viewed from the second surface 70B side.

  As shown in FIG. 22, the light emitting device array 90 is manufactured by connecting the light emitting elements 10 to the package array 80. Specifically, first, the light emitting element 10 is mounted on the first portion 111 of the second frame portion 120 exposed in the front opening 20F. Subsequently, the light emitting element 10 and the first part 111 of the second frame part 120 are connected by the first wire 11, and the light emitting element 10 and the second part 112 of the first frame part 110 are connected by the second wire 12. To do.

<Dicing process>
FIG. 23 is a plan view showing a cutting line in the light emitting device array 90 according to the present embodiment. 24 is a cross-sectional view taken along line FF in FIG.

As shown in FIGS. 23 and 24, the light emitting device 100 is cut out from the light emitting device array 90 by cutting the light emitting device array 90 along a predetermined cutting line.
Specifically, first, the light emitting device array 90 is cut along the orthogonal direction so as to pass through the first inner thin portion 113 b of the first frame portion 110. At this time, as shown in FIG. 24, the light emitting device array 90 is cut so as to pass through the first through hole 113S by moving the dicing saw along the cutting line H1 passing through the first through hole 113S.

  Next, the light emitting device array 90 is cut along the orthogonal direction so as to pass through the first in-ring thin portion 113 b of the second frame portion 120. At this time, as shown in FIG. 24, the light emitting device array 90 is cut so as to pass through the first through hole 113S by moving the dicing saw along the cutting line H2 passing through the first through hole 113S.

  Next, as shown in FIG. 23, the light emitting device array along a predetermined direction so as to pass through the first inner thin portion 113b and the second inner thin portion 114b of the first frame portion 110 and the second frame portion 120, respectively. 90 is cut. At this time, the dicing saw is moved along the cutting line J1 passing through the first through-hole 113S and the second through-hole 114S, so that the light emitting device array 90 is passed through the first through-hole 113S and the second through-hole 114S. Disconnect.

  Thus, the light emitting device 100 is cut out from the light emitting device array 90. Thereafter, as shown in FIG. 23, the light emitting device array 90 is cut along the cutting lines J <b> 2 and J <b> 3 to cut out the plurality of light emitting devices 100 from the light emitting device array 90.

(Function and effect)
(1) In the light emitting device 100 according to the embodiment, the first lead 40, the bottom surface 20A, has a first terminal portion 42 exposed from the molded body 30 in the rear 20D and the first boundary of the side 20E _1, the 2 lead 50 has a second terminal portion 52 exposed from the molded body 30 in the bottom surface 20A, the rear 20D and the second boundary side 20E _2. Therefore, since the first terminal portion 42 and the second terminal portion 52 are not exposed to the front surface 20C that is the light emitting surface, the front opening 20F can be formed large and flux infiltration around the front surface 20C can be suppressed. .

  The first lead 40 has a first terminal recess 42S, and the second lead 50 has a second terminal recess 52S. Therefore, since the solder (a part of the first fillet 301 and the second solder fillet 302) can be accommodated in the first terminal recess 42S and the second terminal recess 52S, the first terminal portion 42, the second terminal portion 52, and the solder The contact area can be increased.

  The first lead 40 includes a first embedded insulating sheet 61 that is disposed on the embedded surface 42 </ b> C (an example of “first embedded surface”) and embedded in the molded body 30. Therefore, the adhesiveness between the molded body 30 and the first lead 40 can be improved by configuring the first embedded insulating sheet 61 with an insulating material having good adhesiveness with both the resin and the metal.

(2) In the light emitting device 100 according to the embodiment, the first terminal portion 42 is formed on the back side of the first embedded insulating sheet 61, and the first inner wall 423 (an example of “first parallel surface”) and the first It has a side face 20E _1, a bottom surface 20A, a first notch 42D connected to.

  Thus, since the 1st notch 42D is formed in the 3rd inner wall 423, the area of the 3rd inner wall 423 can be made small. Therefore, since the contact area between the third inner wall 423 and the first solder fillet 301 can be reduced, the force with which the first solder fillet 301 pulls the third inner wall 423 can be reduced. As a result, the standing stability of the light emitting device 100 can be further improved.

  (3) In the light emitting device 100 according to the embodiment, the first lead 40 is the first exposed insulating sheet 64 disposed on the third inner wall 423 (an example of “first parallel surface”) in the first terminal recess 42S. Have

  Therefore, the adhesion between the third inner wall 423 and the first solder fillet 301 can be reduced by forming the first exposed insulating sheet 64 with a material having low solder wettability. Therefore, since the force with which the first solder fillet 301 pulls the third inner wall 423 can be reduced, the standing stability of the light emitting device 100 can be improved.

  (4) In the light emitting device 100 according to the embodiment, the second lead 50 is disposed on the embedded surface 52C (an example of “second embedded surface”), and the second embedded insulating sheet 62 embedded in the molded body 30 is provided. Have.

  Therefore, the adhesiveness between the molded body 30 and the second lead 50 can be improved by configuring the second embedded insulating sheet 62 with an insulating material having good adhesiveness with both the resin and the metal.

(5) In the light emitting device 100 according to the embodiment, the second terminal portion 52 is formed on the back side of the second embedded insulating sheet 62, and includes the third inner wall 523 (an example of “second parallel surface”), the second It has a side face 20E _2, and the bottom surface 20A, a second cutout 52D connected to.

  Thus, since the 2nd notch 52D is formed in the 3rd inner wall 523, the area of the 3rd inner wall 523 can be made small. Therefore, since the contact area between the third inner wall 523 and the second solder fillet 302 can be reduced, the force with which the second solder fillet 302 pulls the third inner wall 523 can be reduced. As a result, the standing stability of the light emitting device 100 can be further improved.

  (6) In the light emitting device 100 according to the embodiment, the second lead 50 is the second exposed insulating sheet 65 disposed on the third inner wall 523 (an example of “second parallel surface”) in the second terminal recess 52S. Have

  Therefore, the adhesiveness between the third inner wall 523 and the second solder fillet 302 can be reduced by forming the second exposed insulating sheet 65 with a material having low solder wettability. Therefore, since the force with which the second solder fillet 302 pulls the third inner wall 523 can be reduced, the standing stability of the light emitting device 100 can be further improved.

  (7) In the method for manufacturing the light emitting device 100 according to the embodiment, the first inner thin portion 113b (that is, a fine concave portion) is formed in the third portion 113 of the first frame portion 110 by pressing.

  In general, the processing limit dimension by press working is finer than the processing limit dimension by etching processing. Therefore, by using press processing, the first inner thinned portion in a plan view is smaller than when etching processing is used. The area of 113b can be reduced. Accordingly, the size of the third portion 113 in the first lead portion can be reduced.

  In addition, after the first through hole 113S (an example of “a concave portion”) is formed in the third portion 113 of the first frame portion 110 in the concave portion forming step, the periphery of the first through hole 113S is pressed in the pressing step. Therefore, in the pressing process, the metal material can be released into the first through hole 113S, so that it is possible to reduce the necessity of providing a recess for releasing the metal material in the mold. Therefore, even when the dimensions of the light emitting device 100 are changed, it is not necessary to change the mold, so that the degree of freedom in designing the mold can be improved.

  (8) In the method for manufacturing the light emitting device 100 according to the embodiment, the first inner thin portion 113b (that is, a fine concave portion) is formed in the third portion 113 of the second frame portion 120 by pressing. Therefore, since the dimension of the third portion 113 in the second lead portion 120 can be reduced, the integration rate of each lead portion in the lead frame can be improved.

  In addition, after the first through hole 113S (an example of “a concave portion”) is formed in the third portion 113 of the second frame portion 120 in the concave portion forming step, the periphery of the first through hole 113S is pressed in the pressing step. Accordingly, in the pressing process, the metal material can escape into the first through hole 113S, so that the degree of freedom in designing the mold can be further improved.

(9) In the method for manufacturing the light emitting device 100 according to the embodiment, the first through hole 113S is formed as a “recess” in the recess formation step.
Therefore, more metal material can escape into the recesses compared to the case where the recesses are formed as the recesses. Therefore, it is possible to further reduce the necessity of providing a recess for releasing the metal material in the mold. Therefore, the design freedom of the mold can be further improved.

  (10) The method for manufacturing the light emitting device 100 according to the embodiment includes the step of closing the opening on the second surface 70B side of the first through hole 113S with the first insulating sheet 160 (an example of “first insulating sheet”) after the pressing step. Is provided.

  Accordingly, since the resin material can be prevented from flowing into the first annular thick portion 113a in the transfer molding process, it is possible to prevent a part of the molded body 30 from entering the first terminal recess 42S.

(11) The manufacturing method of the light emitting device 100 according to the embodiment includes a step of closing the opening on the first surface 70A side of the first through hole 113S with the second insulating sheet 150 after the pressing step.
Accordingly, since the resin material can be prevented from flowing into the first annular thick portion 113a in the transfer molding process, it is possible to prevent a part of the molded body 30 from entering the first terminal recess 42S.

(12) In the method for manufacturing the light emitting device 100 according to the embodiment, in the dicing process, the light emitting device array 90 is cut so as to pass through the first through hole 113S.
Therefore, it is possible to cut the light emitting device array 90 more quickly than when the light emitting device array 90 is cut at a position not passing through the first through hole 113S.

(Other embodiments)
Although the present invention has been described according to the above-described embodiments, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  (A) In the above embodiment, as shown in FIG. 12, the first lead frame 71 includes a plurality of frame sets, with the first frame unit 110, the second frame unit 120, and the third frame unit 130 as one frame set. Are connected in a matrix, but the present invention is not limited to this. The first lead frame 71 may have the first frame part 110 and the second frame part 120.

  (B) In the above embodiment, the first through hole 113S is formed in the first lead frame 71 as the “recessed portion” formed in the metal plate 70, but is not limited thereto. Instead of the first through hole 113S, a recess formed in the first surface 70A may be arranged. That is, the “concave portion” formed in the metal plate 70 may not penetrate the metal plate 70. Further, the planar shape of the “concave portion” is not limited to a circle, and may be a rectangle or the like.

  (C) In the above embodiment, the second through hole 114S is formed in the first lead frame 71. However, the present invention is not limited to this. Instead of the second through hole 114S, a recess formed in the first surface 70A may be arranged. The planar shape of the second through hole 114S is not limited to a circle, and may be a rectangle or the like.

  (D) In the said embodiment, although the punching process and the recessed part formation process were demonstrated as a separate process, the punching process and the recessed part formation process may be merged into 1 process. That is, the punch hole P, the first through hole 113S (an example of a “concave part”), and the second through hole 114S can be formed simultaneously.

  (E) Although the first lead 40 has the base portion 43 and the first extension portion 44 in the above embodiment, the present invention is not limited to this. The first lead 40 may not include the base portion 43 and the first extension portion 44.

  (F) In the above embodiment, the second lead 40 has the second extending portion 53, but the present invention is not limited to this. The second lead 40 may not have the second extending portion 53.

  (G) Although the light emitting device 100 includes only one light emitting element 10 in the above embodiment, the present invention is not limited to this. The light emitting device 100 may include a plurality of light emitting elements 10. In this case, the plurality of light emitting elements 10 may all be the same type, or may be a combination of different types of light emitting elements that exhibit different emission colors.

(H) In the above embodiment, a dicing saw is used in the dicing step, but a laser dicing apparatus may be used.
(I) Although the light emitting element 10 is electrically connected to the package 20 via the first wire 11 and the second wire 12 in the above embodiment, the present invention is not limited to this. The light emitting element 10 may be directly electrically connected to the package 20 without using a wire.

  (J) In the embodiment described above, the first lead 40 has the base portion 43 and the first extending portion 44 that are separated from each other, but is not limited thereto. The base part 43 and the first extension part 44 of the first lead 40 may be directly connected.

  (K) In the above-described embodiment, the first terminal portion 42 has the first notch 42D. However, the present invention is not limited to this. The first terminal portion 42 may not have the first notch 42D, and may have “a through hole along the second direction” instead of the first notch 42D.

  Moreover, although the 2nd terminal part 52 decided to have 2nd notch 52D, it is not restricted to this. The second terminal portion 52 may not have the second cutout 52D, and may have a “through hole along the second direction” instead of the second cutout 52D.

  Moreover, although the base part 43 decided to have the 3rd notch 43D, it is not restricted to this. The base portion 43 may not have the third cutout 43D, and may have “a through hole along the second direction” instead of the third cutout 43D.

  As described above, whether the notch or the through-hole is formed or whether the notch or the through-hole is formed is determined by the recess formed in the second lead frame 72 (first through-hole). It is determined by the position and size of the hole 113 and the second through hole 114S (see FIG. 14).

  (L) In the above embodiment, the first notch 42D is connected to the third inner wall 423 (an example of the “first parallel surface”) and the embedded surface 42C, but is not connected to the embedded surface 42C. Also good. Even in this case, since the area of the third inner wall 423 can be reduced, the standing stability of the light emitting device 100 can be further improved.

  Similarly, the second notch 52D is connected to the third inner wall 523 (an example of “second parallel surface”) and the embedded surface 52C, but may not be connected to the embedded surface 52C. Even in this case, since the area of the third inner wall 523 can be reduced, the standing stability of the light emitting device 100 can be further improved.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

10 ... light emitting element, 11 ... first wire, 12: second wire, 20 ... package, 20A ... bottom, 20B ... top, 20C ... front, 20D ... back, 20E 1 _... first aspect, 20E 2 _... second side surface , 20F ... front opening, 30 ... molded body, 40 ... first lead, 41 ... first connection part, 42 ... first terminal part, 42S ... first terminal recess, 421, 422, 423 ... inner wall, 43 ... base part , 43S ... base recess, 44 ... first extension, 50 ... second lead, 51 ... second connection, 52 ... second terminal, 52S ... second terminal recess, 521, 522, 523 ... inner wall, 53 ... 2nd extension part, 60 ... Sealing resin, 61 ... 1st embedded insulating sheet, 62 ... 2nd embedded insulating sheet, 63 ... 3rd embedded insulating sheet, 64 ... 1st exposure insulating sheet, 65 ... 2nd exposure Insulating sheet, 66 ... third exposed insulating sheet, 70 ... metal plate, 71 ... 1st lead frame, 72 ... 2nd lead frame, 80 ... Package array, 90 ... Light emitting device array, 100 ... Light emitting device, 110 ... 1st frame part, 120 ... 2nd frame part, 130 ... 3rd frame part , 111 ... first part, 112 ... second part, 113 ... third part, 114 ... fourth part, 113S ... first through hole, 114S ... second through hole, 111a ... first thick part, 111b ... first 1 thin part, 112a ... second thick part, 112b ... second thin part, 113a ... first annular thick part, 113b ... first annular thin part, 114a ... second annular thick part, 114b ... second Inner ring thin part, 150 ... second insulating sheet, 160 ... first insulating sheet, 170 ... molded plate, 200 ... mounting substrate, 200A ... mounting surface, 201 ... first land, 202 ... second land, 203 ... third Land, 204 ... Electric Circuit, 300 ... circuit board, 311 ... first solder fillet, 312 ... second solder fillet, 313a, 313b ... third solder fillet, 400 ... die

Claims (19)

A molded body composed of a resin material; and a first lead and a second lead each embedded in the molded body and composed of a metal material; a bottom surface; and an upper surface facing the bottom surface; A substantially rectangular parallelepiped package having a front surface that is a light emitting surface continuous to the bottom surface and the top surface, a back surface facing the front surface, and a first side surface and a second side surface respectively connected to the front surface and the back surface;
A light emitting device mounted on the package;
With
The first lead includes a first connection portion that is electrically connected to the light emitting element, a first terminal portion that is exposed from the molded body and is connected to the bottom surface, the back surface, and the first side surface, and the first lead. A first terminal recess formed on the bottom surface, the back surface and the first side surface, and disposed on a first embedded surface provided on the front surface side of the first terminal portion; A first embedded insulating sheet embedded in the molded body,
The second lead includes a second connection portion electrically connected to the light emitting element, a second terminal portion exposed from the molded body at a boundary between the bottom surface, the back surface, and the second side surface, and the second lead A second terminal recess formed in the terminal portion and opened to the bottom surface, the back surface, and the second side surface;
Light emitting device. The first terminal portion is formed on the back side of the first embedded insulating sheet, and is cut in a first terminal recess parallel to the first parallel surface, the first side surface, and the bottom surface provided in parallel to the back surface. Having a chip,
The light emitting device according to claim 1. The first terminal portion has a through hole formed on the back side of the first embedded insulating sheet.
The light emitting device according to claim 1. The first lead includes a first exposed insulating sheet disposed on a first parallel surface provided in parallel with the back surface in the first terminal recess.
The light emitting device according to claim 1. The second lead is disposed on a second embedded surface provided on the front side of the second terminal portion, and has a second embedded insulating sheet embedded in the molded body.
The light emitting device according to claim 1. The second terminal portion is formed on the back side of the second embedded insulating sheet, and is cut in a second terminal recess parallel to the second parallel surface, the second side surface, and the bottom surface provided in parallel to the back surface. Having a chip,
The light emitting device according to claim 5. The second terminal portion has a through hole formed on the back side of the second embedded insulating sheet.
The light emitting device according to claim 5. The second lead has a second exposed insulating sheet disposed on a second parallel surface provided in parallel to the back surface in the second terminal recess.
The light emitting device according to claim 1. A molded body composed of a resin material; and a first lead and a second lead each embedded in the molded body and composed of a metal material; a bottom surface; and an upper surface facing the bottom surface; A substantially rectangular parallelepiped package having a front surface that is a light emitting surface continuous to the bottom surface and the top surface, a back surface facing the front surface, and a first side surface and a second side surface respectively connected to the front surface and the back surface;
A light emitting device mounted on the package;
With
The first lead includes a first connection portion that is electrically connected to the light emitting element, a first terminal portion that is exposed from the molded body and is connected to the bottom surface, the back surface, and the first side surface, and the first lead. A first terminal recess formed in the terminal portion and open to the bottom surface, the back surface, and the first side surface, and a first parallel surface provided in parallel to the back surface in the first terminal recess. A first exposed insulating sheet;
The second lead includes a second connection portion electrically connected to the light emitting element, a second terminal portion exposed from the molded body at a boundary between the bottom surface, the back surface, and the second side surface, and the second lead A second terminal recess formed in the terminal portion and opened to the bottom surface, the back surface, and the second side surface;
Light emitting device. A metal plate having a first thickness having a first surface and a second surface opposite to the first surface, a first portion, a second portion spaced from the first portion in a predetermined direction, and the predetermined direction A first frame portion and a second frame portion that are adjacent to each other in the predetermined direction. A recess forming step of forming a recess in the third portion of the first frame portion by recessing the first surface of the lead frame.
By pressing the periphery of the concave portion, an annular thick portion having the first thickness and a second thickness smaller than the first thickness are formed inside the annular thick portion. Forming a thin portion on the third portion of the first frame portion; and
A package in which the first frame portion, the second frame portion, and the resin molding plate are integrally formed by injecting resin into the die in a state where the first surface is in contact with the inner surface of the die. A transfer molding process to form an array;
A light emitting element connecting step of forming a light emitting device array by mounting the light emitting elements on the package array;
Cutting the light emitting device array along the orthogonal direction so as to pass through the thin inner ring portion of the first frame portion, and passing along the orthogonal direction so as to pass through the third portion of the second frame portion; By cutting the light emitting device array and cutting the light emitting device array along the predetermined direction so as to pass through the thin inner ring portion of the first frame portion and the third portion of the second frame portion. A dicing step of cutting out the light emitting device from the light emitting device array;
A method for manufacturing a light emitting device. In the recess forming step, a recess is formed in the third portion of the second frame portion by recessing the first surface of the lead frame,
In the dicing step, the light emitting device array is cut along the orthogonal direction so as to pass through the thin inner ring portion of the second frame portion, and passes through the thin inner ring portion of the second frame portion. Cutting the light emitting device array along the predetermined direction;
The manufacturing method of the light-emitting device of Claim 10. In the recess forming step, a through hole is formed as the recess.
The manufacturing method of the light-emitting device of Claim 10 or 11. Between the pressing step and the transfer molding step, comprising a step of closing the opening on the second surface side of the through hole remaining after the pressing step with a first insulating sheet.
The manufacturing method of the light-emitting device of Claim 12. Between the pressing step and the transfer molding step, comprising a step of closing the opening on the first surface side of the through hole remaining after the pressing step with a second insulating sheet.
A method for manufacturing a light emitting device according to claim 12 or 13. In the pressing step, the metal plate is pressed so as to close the through hole.
The manufacturing method of the light-emitting device of Claim 12. In the dicing step, the light emitting device array is cut so as to pass through the through holes.
The method for manufacturing a light emitting device according to claim 12. A metal plate having a first thickness having a first surface and a second surface opposite to the first surface, a first portion, a second portion spaced from the first portion in a predetermined direction, and the predetermined direction A first frame portion and a second frame portion that are adjacent to each other in the predetermined direction. Lead frame,
A resin molded plate coated so as to expose a part of the lead frame;
With
The lead frame has a first annular thick portion formed in the third portion of the first frame portion with the first thickness, and a second thickness smaller than the first thickness. A first inner ring thin portion that is formed on the inner side of the first annular thick portion and exposed from the resin molding plate, and is disposed on the second surface of the first inner ring thin portion, and is disposed on the resin molding plate. A first buried insulating sheet buried;
Package array for light emitting devices. The lead frame has a first annular thickness portion formed on the third portion of the second frame portion with the first thickness, and a second thickness smaller than the first thickness. A second annular thin portion formed inside the second annular thick portion and exposed from the resin molded plate, and disposed on the second surface of the second annular thin portion, the resin molded plate A second buried insulating sheet buried;
The package array for light-emitting devices of Claim 17. The first frame portion is formed by exposing a part of the second surface of the second portion from the resin molded plate, and has a mounting surface on which a light emitting element can be mounted.
The package array for light-emitting devices of Claim 17 or 18.

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