JP2012121961A - Epoxy resin composition, prepreg, and cured product of the same - Google Patents
Epoxy resin composition, prepreg, and cured product of the same Download PDFInfo
- Publication number
- JP2012121961A JP2012121961A JP2010272559A JP2010272559A JP2012121961A JP 2012121961 A JP2012121961 A JP 2012121961A JP 2010272559 A JP2010272559 A JP 2010272559A JP 2010272559 A JP2010272559 A JP 2010272559A JP 2012121961 A JP2012121961 A JP 2012121961A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- formula
- group
- resin composition
- branched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 152
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 152
- 239000000203 mixture Substances 0.000 title claims description 54
- 238000006243 chemical reaction Methods 0.000 claims abstract description 36
- 239000005011 phenolic resin Substances 0.000 claims abstract description 35
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 17
- 125000003118 aryl group Chemical group 0.000 claims abstract description 16
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 15
- 150000002367 halogens Chemical class 0.000 claims abstract description 15
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 15
- 125000004122 cyclic group Chemical group 0.000 claims abstract description 13
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 12
- 125000006165 cyclic alkyl group Chemical group 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 11
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 26
- 239000003795 chemical substances by application Substances 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 21
- 239000002904 solvent Substances 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 claims description 17
- 239000011256 inorganic filler Substances 0.000 claims description 17
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 9
- 150000002576 ketones Chemical class 0.000 claims description 7
- 239000002585 base Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical class OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000047 product Substances 0.000 description 33
- -1 laminates Substances 0.000 description 29
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Natural products OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 17
- 150000002989 phenols Chemical class 0.000 description 16
- 238000000034 method Methods 0.000 description 15
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 14
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 11
- 239000013078 crystal Substances 0.000 description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000003786 synthesis reaction Methods 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 7
- 235000010290 biphenyl Nutrition 0.000 description 7
- 239000000460 chlorine Substances 0.000 description 7
- 229910052801 chlorine Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000010992 reflux Methods 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical class OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- 238000006735 epoxidation reaction Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000010926 purge Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 3
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical class CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005882 aldol condensation reaction Methods 0.000 description 3
- 239000012295 chemical reaction liquid Substances 0.000 description 3
- 229940125904 compound 1 Drugs 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 125000002243 cyclohexanonyl group Chemical group *C1(*)C(=O)C(*)(*)C(*)(*)C(*)(*)C1(*)* 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- MODAACUAXYPNJH-UHFFFAOYSA-N 1-(methoxymethyl)-4-[4-(methoxymethyl)phenyl]benzene Chemical group C1=CC(COC)=CC=C1C1=CC=C(COC)C=C1 MODAACUAXYPNJH-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical class C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 2
- JECYUBVRTQDVAT-UHFFFAOYSA-N 2-acetylphenol Chemical compound CC(=O)C1=CC=CC=C1O JECYUBVRTQDVAT-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- POSWICCRDBKBMH-UHFFFAOYSA-N 3,3,5-trimethylcyclohexan-1-one Chemical compound CC1CC(=O)CC(C)(C)C1 POSWICCRDBKBMH-UHFFFAOYSA-N 0.000 description 2
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 description 2
- UJBOOUHRTQVGRU-UHFFFAOYSA-N 3-methylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1 UJBOOUHRTQVGRU-UHFFFAOYSA-N 0.000 description 2
- TXFPEBPIARQUIG-UHFFFAOYSA-N 4'-hydroxyacetophenone Chemical compound CC(=O)C1=CC=C(O)C=C1 TXFPEBPIARQUIG-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical class C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000001340 alkali metals Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical group OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 2
- 150000004074 biphenyls Chemical class 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- CGZZMOTZOONQIA-UHFFFAOYSA-N cycloheptanone Chemical group O=C1CCCCCC1 CGZZMOTZOONQIA-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 2
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 2
- 150000004780 naphthols Chemical class 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- 125000000027 (C1-C10) alkoxy group Chemical group 0.000 description 1
- KJPRLNWUNMBNBZ-QPJJXVBHSA-N (E)-cinnamaldehyde Chemical class O=C\C=C\C1=CC=CC=C1 KJPRLNWUNMBNBZ-QPJJXVBHSA-N 0.000 description 1
- FMGGHNGKHRCJLL-UHFFFAOYSA-N 1,2-bis(chloromethyl)benzene Chemical group ClCC1=CC=CC=C1CCl FMGGHNGKHRCJLL-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ZZHIDJWUJRKHGX-UHFFFAOYSA-N 1,4-bis(chloromethyl)benzene Chemical compound ClCC1=CC=C(CCl)C=C1 ZZHIDJWUJRKHGX-UHFFFAOYSA-N 0.000 description 1
- DAJPMKAQEUGECW-UHFFFAOYSA-N 1,4-bis(methoxymethyl)benzene Chemical compound COCC1=CC=C(COC)C=C1 DAJPMKAQEUGECW-UHFFFAOYSA-N 0.000 description 1
- VKRKCBWIVLSRBJ-UHFFFAOYSA-N 1,4-dioxaspiro[4.5]decan-8-one Chemical compound C1CC(=O)CCC21OCCO2 VKRKCBWIVLSRBJ-UHFFFAOYSA-N 0.000 description 1
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 1
- IYSVFZBXZVPIFA-UHFFFAOYSA-N 1-ethenyl-4-(4-ethenylphenyl)benzene Chemical group C1=CC(C=C)=CC=C1C1=CC=C(C=C)C=C1 IYSVFZBXZVPIFA-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Chemical class COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910001961 silver nitrate Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- HTSABYAWKQAHBT-UHFFFAOYSA-N trans 3-methylcyclohexanol Natural products CC1CCCC(O)C1 HTSABYAWKQAHBT-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical class CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Abstract
Description
本発明は、新規なエポキシ樹脂、エポキシ樹脂組成物並びに、前記エポキシ樹脂組成物を使用して得られるプリプレグに関する。また、本発明は、前記エポキシ樹脂組成物またはプリプレグを硬化してなる硬化物に関する。 The present invention relates to a novel epoxy resin, an epoxy resin composition, and a prepreg obtained by using the epoxy resin composition. Moreover, this invention relates to the hardened | cured material formed by hardening | curing the said epoxy resin composition or prepreg.
エポキシ樹脂組成物は、一般的に機械的性質、耐水性、耐薬品性、耐熱性、電気的性質などに優れた硬化物となり、接着剤、塗料、積層板、成形材料、注型材料などの幅広い分野に利用されている。近年、これらの分野に用いられるエポキシ樹脂の硬化物には、高純度化を始め、難燃性、耐熱性、耐湿性、強靭性、低線膨張率、低誘電率特性など諸特性の一層の向上が求められている。 Epoxy resin compositions are generally cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc., such as adhesives, paints, laminates, molding materials, casting materials, etc. It is used in a wide range of fields. In recent years, cured products of epoxy resins used in these fields have begun to be highly purified and have various properties such as flame retardancy, heat resistance, moisture resistance, toughness, low linear expansion coefficient, and low dielectric constant characteristics. There is a need for improvement.
特に、エポキシ樹脂組成物の代表的な用途である電気・電子産業分野においては、多機能化、高性能化、コンパクト化を目的とした半導体の高密度実装やプリント配線板の高密度配線化が進んでいる。しかしながら、高密度実装化や高密度配線化は、半導体素子やプリント配線板の内部から発生する熱を増加させ、機器類の誤作動を引き起こす原因となりうる。そのため、発生した熱をいかにして効率よく外部に放出させるかということが、エネルギー効率や機器設計の上からも重要な課題となっている。
これら熱対策としては、メタルコア基板を使用したり、設計の段階で放熱しやすい構造を組んだり、使用する高分子材料（エポキシ樹脂）に高熱伝導フィラーを細密充填したりするなど、様々な工夫がなされている。しかしながら、高熱伝導部位を繋げるバインダー役の高分子材料の熱伝導率が低いため、高分子材料の熱伝導スピードが律速となり、効率的な放熱ができていないのが現状である。
In particular, in the electrical and electronic industry, which is a typical application of epoxy resin compositions, high-density mounting of semiconductors and high-density wiring of printed wiring boards have been promoted for the purpose of multi-function, high performance, and compactness. Progressing. However, high-density mounting and high-density wiring increase the heat generated from the inside of the semiconductor element and the printed wiring board, and may cause malfunction of the devices. Therefore, how to efficiently release generated heat to the outside is an important issue from the standpoint of energy efficiency and device design.
These heat countermeasures include various measures such as using a metal core substrate, constructing a structure that easily dissipates heat at the design stage, and densely filling high thermal conductive filler in the polymer material (epoxy resin) to be used. Has been made. However, since the thermal conductivity of the polymer material acting as a binder that connects the high thermal conductivity sites is low, the thermal conduction speed of the polymer material becomes the rate-determining, and efficient heat dissipation is not possible at present.
エポキシ樹脂の高熱伝導化を実現する手段として、特許文献１では、メソゲン基をエポキシ樹脂構造中に導入する手法が報告されている。同文献にはメソゲン基を有するエポキシ樹脂として、ビフェニル骨格を有するエポキシ樹脂などが記載されている。またビフェニル骨格以外のエポキシ樹脂としてはフェニルベンゾエート型のエポキシ樹脂が記載されているが、該エポキシ樹脂は酸化によるエポキシ化反応によって製造する必要があることから、安全性やコストに難があり実用的とは言えない。
また、特許文献２〜４には、ビフェニル骨格を有するエポキシ樹脂を用いた例が記載されており、中でも特許文献３には高熱伝導率を有する無機充填材を併用する手法が記載されている。しかしながら、これら文献に記載の手法により得られる硬化物の熱伝導性は市場の要望を満足するレベルでは無く、比較的安価に入手可能なエポキシ樹脂を用いた、より高い熱伝導率を有する硬化物を与えるエポキシ樹脂組成物が求められている。
As a means for realizing high thermal conductivity of an epoxy resin, Patent Document 1 reports a method of introducing a mesogenic group into an epoxy resin structure. This document describes an epoxy resin having a biphenyl skeleton as an epoxy resin having a mesogenic group. In addition, as an epoxy resin other than the biphenyl skeleton, a phenyl benzoate type epoxy resin is described. However, since the epoxy resin needs to be produced by an epoxidation reaction by oxidation, there are difficulties in safety and cost, and it is practical. It can not be said.
Patent Documents 2 to 4 describe examples using an epoxy resin having a biphenyl skeleton, and Patent Document 3 describes a technique in which an inorganic filler having high thermal conductivity is used in combination. However, the thermal conductivity of the cured product obtained by the methods described in these documents is not at a level that satisfies the market demand, and a cured product having higher thermal conductivity using an epoxy resin that is available at a relatively low cost. There is a need for an epoxy resin composition that provides.
また、エポキシ樹脂同様、エポキシ樹脂組成物に含有される硬化剤も高熱伝導化を実現する重要な要素と言える。従来、その硬化物が高い熱伝導率を有すると謳ったエポキシ樹脂組成物に含まれる硬化剤としては、特許文献１には４，４’−ジアミノジフェニルベンゾエート、４，４’−ジアミノジフェニルメタン、特許文献２および３には１，５−ジアミノナフタレンなど、アミン系の硬化剤を使用した例が報告されている。しかしながら、これらのアミン系の硬化剤は硬化促進作用があるため、硬化物を作成するときのライフタイムを確保するのが困難であり、好ましいとは言えない。一方、特許文献４では、フェノール化合物を硬化剤として使用している。特許文献４では具体的にカテコールノボラックが使用されているが、同文献に記載の手法により得られる硬化物の熱伝導性もまた市場の要望を満足するレベルでは無く、より高い熱伝導率を有する硬化物を与えるエポキシ樹脂組成物の開発が望まれている。 Further, like the epoxy resin, the curing agent contained in the epoxy resin composition can be said to be an important factor for realizing high thermal conductivity. Conventionally, as a curing agent contained in an epoxy resin composition that the cured product has a high thermal conductivity, Patent Document 1 discloses 4,4′-diaminodiphenylbenzoate, 4,4′-diaminodiphenylmethane, References 2 and 3 report examples using amine-based curing agents such as 1,5-diaminonaphthalene. However, since these amine-based curing agents have a curing accelerating action, it is difficult to ensure a lifetime when preparing a cured product, and it is not preferable. On the other hand, in Patent Document 4, a phenol compound is used as a curing agent. In Patent Document 4, catechol novolak is specifically used, but the thermal conductivity of the cured product obtained by the method described in the same document is not at a level that satisfies the market demand, and has a higher thermal conductivity. Development of an epoxy resin composition that gives a cured product is desired.
また、特許文献５、６に本願と同様の骨格を有するエポキシ樹脂が記載されているが、当該エポキシ樹脂は塩素量が非常に多いため、電気電子機器に使用するには電気信頼性に問題があり、さらに従来公知のエポキシ樹脂だと十分に高い熱伝導性を得られないとの問題も生じており、ハロゲン量が低く、高い熱伝導性を有するエポキシ樹脂及びエポキシ樹脂組成物の開発が強く望まれていた。 Moreover, although the epoxy resin which has the frame | skeleton similar to this application is described in patent document 5, 6, since the said epoxy resin has very much chlorine amount, there exists a problem in electrical reliability when using it for an electrical and electronic device. Furthermore, there is a problem that a sufficiently high thermal conductivity cannot be obtained with a conventionally known epoxy resin, and the development of an epoxy resin and an epoxy resin composition having a low halogen content and high thermal conductivity is strong. It was desired.
本発明はこのような問題を解決すべく検討の結果なされたものであり、全ハロゲン量が低く、その硬化物が特に高い熱伝導性を有する、エポキシ樹脂を提供するものである。 The present invention has been made as a result of studies to solve such problems, and provides an epoxy resin having a low total halogen content and a cured product having particularly high thermal conductivity.
本発明者らは前記課題を解決するために鋭意研究した結果、本発明を完成させるに到った。
すなわち本発明は、
（１）
下記式（１）
（式（１）中、Ｒ１はそれぞれ独立して存在し、水素原子、炭素数１〜１０の直鎖、分岐あるいは環状のアルキル基、炭素数１〜１０のアリール基、水酸基、又は、炭素数１〜１０の直鎖、分岐あるいは環状のアルコキシ基のいずれかを表す。ｎは炭素数を表し、０、１、２のいずれかの整数を表す。ｍはＲ１の数を表し、１≦ｍ≦ｎ＋２の関係を満たす。）
で表される化合物とヒドロキシベンズアルデヒド類との反応によって得られるフェノール樹脂とエピハロヒドリンを反応させて得られるエポキシ樹脂であって、全ハロゲン量が、１６００ｐｐｍ以下である下記式（２）で表されるエポキシ樹脂。
（２）
前項（１）に記載のエポキシ樹脂において、前記式（２）のエポキシ樹脂が、下記式（３）であるエポキシ樹脂、
（３）
前記（１）または(２)のいずれか一項に記載のエポキシ樹脂、硬化剤、無機充填剤を含有してなるエポキシ樹脂組成物、
（４）
前項（１）〜（３）のいずれか一項に記載のエポキシ樹脂組成物及びシート状の繊維基材からなるプリプレグ、
（５）
前項（１）〜（３）のいずれか一項に記載のエポキシ樹脂組成物、
（６）
前項（５）に記載のエポキシ樹脂組成物を硬化してなる硬化物、
（７）
下記工程（イ）〜（ロ）を経ることにより得られる前記式（２）で表されるエポキシ樹脂、
工程（イ）：式（１）で表される化合物とヒドロキシベンズアルデヒド類との反応によって得られるフェノール樹脂にアルコール類またはケトン類の溶媒の存在下、エピハロヒドリンを反応させてエポキシ樹脂を得る工程。
工程（ロ）：工程（イ）で得られたエポキシ樹脂を溶剤で溶解し、アルカリ金属水酸化物を加えて反応を行う工程。
（８）
工程（イ）においてアルコール類の溶媒を使用する前項（７）に記載のエポキシ樹脂、
（９）
工程（ロ）においてアルカリ金属水酸化物として固形のアルカリ金属水酸化物を使用する前項（７）または（８）のいずれか一項に記載のエポキシ樹脂、
に関する。
As a result of intensive studies to solve the above problems, the present inventors have completed the present invention.
That is, the present invention
(1)
Following formula (1)
(In Formula (1), each R 1 is independently present and is a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 1 to 10 carbon atoms, a hydroxyl group, or carbon. Represents any of linear, branched or cyclic alkoxy groups of 1 to 10. n represents the number of carbon atoms and represents an integer of 0, 1 or 2. m represents the number of R 1 ; ≦ m ≦ n + 2 is satisfied.)
An epoxy resin obtained by reacting a phenol resin obtained by the reaction of a compound represented by formula (II) with hydroxybenzaldehyde and an epihalohydrin, wherein the total halogen content is 1600 ppm or less and is represented by the following formula (2) resin.
(2)
In the epoxy resin according to the preceding item (1), the epoxy resin of the formula (2) is an epoxy resin represented by the following formula (3):
(3)
An epoxy resin composition comprising the epoxy resin according to any one of (1) and (2), a curing agent, and an inorganic filler;
(4)
A prepreg comprising the epoxy resin composition according to any one of (1) to (3) and a sheet-like fiber base material,
(5)
The epoxy resin composition according to any one of (1) to (3) above,
(6)
Hardened | cured material formed by hardening | curing the epoxy resin composition of previous clause (5),
(7)
An epoxy resin represented by the formula (2) obtained by the following steps (a) to (b):
Step (a): A step of obtaining an epoxy resin by reacting an epihalohydrin with a phenol resin obtained by the reaction of a compound represented by the formula (1) and a hydroxybenzaldehyde in the presence of an alcohol or a ketone solvent.
Step (b): A step of dissolving the epoxy resin obtained in step (a) with a solvent and adding an alkali metal hydroxide to react.
(8)
The epoxy resin as described in (7) above, wherein an alcohol solvent is used in step (a),
(9)
The epoxy resin according to any one of (7) or (8) above, wherein a solid alkali metal hydroxide is used as the alkali metal hydroxide in the step (b).
About.
ここで、前記式（１)において、アルキル基としては、メチル基、エチル基、プロピル基等の炭素数１〜１０のアルキル基が挙げられ、これらアルキル基は直鎖状であっても分岐鎖状であってもよい。
アリール基としては、フェニル基、トリル基、キシリル基、ナフチル基等の炭素数６〜１０のアリール基が挙げられ、これらアリール基は前記アルキル基等の置換基を有していてもよい。
アルコキシ基としては、メトキシ基、エトキシ基、プロポキシ基、ケタール基等の炭素数１〜１０のアルコシキ基が挙げられ、直鎖状であっても分岐鎖状であってもよい。
に関する。
Here, in the formula (1), examples of the alkyl group include alkyl groups having 1 to 10 carbon atoms such as a methyl group, an ethyl group, and a propyl group, and these alkyl groups may be linear or branched. It may be a shape.
Examples of the aryl group include aryl groups having 6 to 10 carbon atoms such as a phenyl group, a tolyl group, a xylyl group, and a naphthyl group, and these aryl groups may have a substituent such as the alkyl group.
Examples of the alkoxy group include C1-C10 alkoxy groups such as a methoxy group, an ethoxy group, a propoxy group, and a ketal group, and may be linear or branched.
About.
本発明のエポキシ樹脂は、ハロゲン量が少なく、その硬化物が熱伝導に優れているため、半導体封止材料、プリプレグを始めとする各種複合材料、接着剤、塗料等に使用する場合に有用である。 The epoxy resin of the present invention has a low halogen content and its cured product is excellent in heat conduction. Therefore, it is useful when used in various composite materials such as semiconductor encapsulating materials and prepregs, adhesives, and paints. is there.
本発明のエポキシ樹脂は、前記式（１）で表される化合物とヒドロキシベンズアルデヒド類との反応によって得られるフェノール樹脂（以下、メソゲン基を有するフェノール樹脂と称す。）に、さらにエピハロヒドリンを反応させて得られるエポキシ樹脂である。 The epoxy resin according to the present invention is obtained by further reacting an epihalohydrin with a phenol resin (hereinafter referred to as a phenol resin having a mesogenic group) obtained by reacting the compound represented by the formula (1) with hydroxybenzaldehydes. The resulting epoxy resin.
先ず、本発明に用いるメソゲン基を有するフェノール樹脂について説明する。
メソゲン基を有するフェノール樹脂を得るために、ヒドロキシベンズアルデヒド類との反応に用いられる式（１）で表される化合物の例としては、
（イ）シクロペンタノン、３−フェニルシクロペンタノン、１，３−シクロペンタンジオン等のシクロペンタノン骨格を有する化合物、
（ロ）シクロヘキサノン、３−メチルシクロヘキサノン、４−メチルシクロヘキサノン、４−エチルシクロヘキサノン、４−ｔｅｒｔ−ブチルシクロヘキサノン、４−ペンチルシクロヘキサノン、３−フェニルシクロヘキサノン、４−フェニルシクロヘキサノン、３，３−ジメチルシクロヘキサノン、３，４−ジメチルシクロヘキサノン、３，５−ジメチルシクロヘキサノン、４，４−ジメチルシクロヘキサノン、３，３，５−トリメチルシクロヘキサノン、４−シクロヘキサノンカルボン酸エチル等のフェニル基、アルキル基またはエステル結合を有するシクロヘキサノン骨格を有する化合物、
（ハ）１，４−シクロヘキサンジオンモノエチレンケタール、ビシクロヘキサン−４，４’ −ジオンモノエチレンケタール、１，４−シクロヘキサンジオンモノ−２，２−ジメチルトリメチレンケタール等のケタール構造及びシクロヘキサノン骨格を有する化合物、
（ニ）１，３−シクロヘキサンジオン、１，４−シクロヘキサンジオン、５−メチル−１，３−シクロヘキサンジオン、ジメドン、１，４−シクロヘキサンジオン−２，５−ジカルボン酸ジメチル等のシクロヘキサンジオン構造を有する化合物、
（ホ）４，４’ −ビシクロヘキサノン、２，２−ビス（４−オキソシクロヘキシル）プロパン等の２つのシクロヘキサノン骨格を有する化合物、
（ヘ）シクロヘプタノン等のシクロヘプタノン骨格を有する化合物、
などが挙げられる。
この場合において、硬化物に高い熱伝導率を付与する観点から、前記式（１）においてＲ１が水素原子または炭素数１〜２のアルキル基であることが好ましく、水素原子であることが特に好ましい。
First, the phenol resin having a mesogenic group used in the present invention will be described.
In order to obtain a phenol resin having a mesogenic group, examples of the compound represented by the formula (1) used for the reaction with hydroxybenzaldehydes include:
(A) a compound having a cyclopentanone skeleton such as cyclopentanone, 3-phenylcyclopentanone, 1,3-cyclopentanedione,
(B) Cyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, 4-ethylcyclohexanone, 4-tert-butylcyclohexanone, 4-pentylcyclohexanone, 3-phenylcyclohexanone, 4-phenylcyclohexanone, 3,3-dimethylcyclohexanone, 3 1,4-dimethylcyclohexanone, 3,5-dimethylcyclohexanone, 4,4-dimethylcyclohexanone, 3,3,5-trimethylcyclohexanone, cyclohexanone skeleton having phenyl group, alkyl group or ester bond such as ethyl 4-cyclohexanone carboxylate A compound having,
(C) a ketal structure such as 1,4-cyclohexanedione monoethylene ketal, bicyclohexane-4,4′-dione monoethylene ketal, 1,4-cyclohexanedione mono-2,2-dimethyltrimethylene ketal and a cyclohexanone skeleton; A compound having,
(D) cyclohexanedione structures such as 1,3-cyclohexanedione, 1,4-cyclohexanedione, 5-methyl-1,3-cyclohexanedione, dimedone, dimethyl 1,4-cyclohexanedione-2,5-dicarboxylate, etc. A compound having,
(E) a compound having two cyclohexanone skeletons such as 4,4′-bicyclohexanone and 2,2-bis (4-oxocyclohexyl) propane;
(F) a compound having a cycloheptanone skeleton such as cycloheptanone,
Etc.
In this case, from the viewpoint of imparting high thermal conductivity to the cured product, R 1 in the formula (1) is preferably a hydrogen atom or an alkyl group having 1 to 2 carbon atoms, and particularly preferably a hydrogen atom. preferable.
メソゲン基を有するフェノール樹脂を得るために、式（１）で表される化合物の一種以上との反応に用いられるヒドロキシベンズアルデヒド類としては、例えばｏ−、ｍ−およびｐ−ヒドロキシベンズアルデヒドなどが挙げられる。これらは１種のみを使用しても、２種類以上を併用してもよい。これらのうち、エポキシ樹脂組成物の硬化物が特に高い熱伝導性を示すことから、ｐ−ヒドロキシベンズアルデヒドを単独で使用するのが好ましい。 In order to obtain a phenol resin having a mesogenic group, examples of the hydroxybenzaldehyde used in the reaction with one or more compounds represented by the formula (1) include o-, m-, and p-hydroxybenzaldehyde. . These may use only 1 type or may use 2 or more types together. Of these, it is preferable to use p-hydroxybenzaldehyde alone because the cured product of the epoxy resin composition exhibits particularly high thermal conductivity.
メソゲン基を有するフェノール樹脂は、酸性条件下もしくは塩基性条件下、式（１）で表される化合物の一種以上とヒドロキシベンズアルデヒド類とのアルドール縮合反応によって得られる。
ヒドロキシベンズアルデヒド類は、式（１）で表される化合物１モルに対して２．０〜３．１５モルを使用することがそれぞれ好ましい。
The phenol resin having a mesogenic group is obtained by an aldol condensation reaction between one or more compounds represented by the formula (1) and hydroxybenzaldehyde under acidic conditions or basic conditions.
The hydroxybenzaldehyde is preferably used in an amount of 2.0 to 3.15 mol per 1 mol of the compound represented by the formula (1).
酸性条件下でアルドール縮合反応を行う場合、用い得る酸性触媒としては、塩酸、硫酸、硝酸のような無機酸、トルエンスルホン酸、キシレンスルホン酸、シュウ酸等の有機酸が挙げられる。これらは単独で使用してもよく、複数の種類を併用してもよい。酸性触媒の使用量は、ヒドロキシベンズアルデヒド類１モルに対して０．０１〜１．０モル、好ましくは０．２〜０．５モルである。 When the aldol condensation reaction is performed under acidic conditions, examples of the acidic catalyst that can be used include inorganic acids such as hydrochloric acid, sulfuric acid, and nitric acid, and organic acids such as toluenesulfonic acid, xylenesulfonic acid, and oxalic acid. These may be used alone or in combination of a plurality of types. The usage-amount of an acidic catalyst is 0.01-1.0 mol with respect to 1 mol of hydroxy benzaldehydes, Preferably it is 0.2-0.5 mol.
一方、塩基性条件下でアルドール縮合反応を行う場合、用い得る塩基性触媒としては、水酸化ナトリウム及び水酸化カリウム等の金属水酸化物、炭酸カリウム及び炭酸ナトリウム等の炭酸アルカリ金属塩、ジエチルアミン、トリエチルアミン、トリブチルアミン、ジイソブチルアミン、ピリジン及びピペリジン等のアミン誘導体、並びにジメチルアミノエチルアルコール及びジエチルアミノエチルアルコール等のアミノアルコール誘導体が挙げられる。塩基性条件の場合も、先に挙げた塩基性触媒を単独で使用してもよく、複数の種類を併用してもよい。塩基性触媒の使用量は、ヒドロキシベンズアルデヒド類１モルに対して０．１〜２．５モル、好ましくは０．２〜２．０モルである。 On the other hand, when the aldol condensation reaction is performed under basic conditions, usable basic catalysts include metal hydroxides such as sodium hydroxide and potassium hydroxide, alkali metal carbonates such as potassium carbonate and sodium carbonate, diethylamine, Examples include amine derivatives such as triethylamine, tributylamine, diisobutylamine, pyridine and piperidine, and amino alcohol derivatives such as dimethylaminoethyl alcohol and diethylaminoethyl alcohol. Also in the case of basic conditions, the basic catalysts listed above may be used alone, or a plurality of types may be used in combination. The usage-amount of a basic catalyst is 0.1-2.5 mol with respect to 1 mol of hydroxy benzaldehydes, Preferably it is 0.2-2.0 mol.
メソゲン基を有するフェノール樹脂を得る反応では、必要に応じて溶剤を使用してもよい。用い得る溶剤としては、例えばケトン類のようにヒドロキシベンズアルデヒド類との反応性を有するものでなければ特に制限はないが、原料のヒドロキシベンズアルデヒド類を容易に溶解させる点ではアルコール類を溶剤として用いるのが好ましい。 In the reaction for obtaining a phenol resin having a mesogenic group, a solvent may be used as necessary. The solvent that can be used is not particularly limited as long as it does not have reactivity with hydroxybenzaldehydes such as ketones, but alcohols are used as solvents in terms of easily dissolving the raw hydroxybenzaldehydes. Is preferred.
反応温度は通常１０〜９０℃であり、好ましくは３５〜７０℃である。反応時間は通常０．５〜１３時間であるが、原料化合物の種類によって反応性に差があるため、この限りではない。反応終了後、樹脂として取り出す場合には、反応物を水洗後または水洗無しに、加熱減圧下で反応液から未反応物や溶媒等を除去する。結晶で取り出す場合、反応液に水を添加していくか、もしくは大量の水中に反応液を滴下することにより結晶を析出させる。塩基性条件で反応を行った場合は生成したメソゲン基を有するフェノール樹脂が水中に溶け込むこともありうるので、塩酸を加えるなどして中性〜酸性条件にして結晶として析出させる。 The reaction temperature is usually 10 to 90 ° C, preferably 35 to 70 ° C. Although reaction time is 0.5 to 13 hours normally, since there is a difference in reactivity by the kind of raw material compound, it is not this limitation. When taking out as a resin after completion | finish of reaction, an unreacted substance, a solvent, etc. are removed from a reaction liquid under heating and pressure reduction, after washing | cleaning a reaction substance without water washing. When taking out with a crystal | crystallization, water is added to a reaction liquid, or a reaction liquid is dripped in a lot of water, and a crystal | crystallization is deposited. When the reaction is carried out under basic conditions, the generated phenol resin having a mesogenic group may dissolve in water, so that it is precipitated as crystals under neutral to acidic conditions by adding hydrochloric acid or the like.
不純物を除去するため、得られた結晶を水洗し、その後乾燥させてメソゲン基を有するフェノール樹脂を得る工程を介入させることが好ましく、当該工程により、より不純物の少ない当該フェノール樹脂を得ることができる。 In order to remove impurities, it is preferable to intervene a step of washing the obtained crystal with water and then drying to obtain a phenol resin having a mesogenic group, and this step allows obtaining the phenol resin with less impurities. .
こうして得られるメソゲン基を有するフェノール樹脂は、下記式（４）
で表せられる。
この場合において、エピハロヒドリンと反応させて得るエポキシ樹脂の熱伝導性の観点から上記式（４）の化合物の中でも、下記式（５）の化合物が好ましい。
It can be expressed as
In this case, the compound of the following formula (5) is preferable among the compounds of the above formula (4) from the viewpoint of thermal conductivity of the epoxy resin obtained by reacting with epihalohydrin.
次に、本発明のエポキシ樹脂について説明する。
本発明のエポキシ樹脂は、上記手法によって得られたメソゲン基を有するフェノール樹脂とエピハロヒドリンとを反応させ、エポキシ化することにより得られる。また、メソゲン基を有するフェノール樹脂に、当該フェノール樹脂以外のフェノール化合物を併用しても良い。
併用し得るフェノール化合物としては、エポキシ樹脂の原料として通常用いられるフェノール化合物であれば特に制限なく用いることができるが、硬化物が高い熱伝導率を有するという本発明の効果が損なわれる恐れがあるので、併用し得るフェノール化合物の使用量は極力少ないことが好ましく、上記のメソゲン基を有するフェノール樹脂のみを用いることが特に好ましい。
本発明のエポキシ樹脂としては、特に高い熱伝導率を有する硬化物が得られることから、ヒドロキシベンズアルデヒド類と式（１）で表される化合物との反応により得られたメソゲン基を有するフェノール樹脂を用いて得ることができる。
Next, the epoxy resin of this invention is demonstrated.
The epoxy resin of this invention is obtained by making the phenol resin which has the mesogenic group obtained by the said method, and an epihalohydrin react, and epoxidizing. Moreover, you may use together phenol compounds other than the said phenol resin with the phenol resin which has a mesogenic group.
The phenol compound that can be used in combination can be used without particular limitation as long as it is a phenol compound that is usually used as a raw material of an epoxy resin, but the effect of the present invention that the cured product has high thermal conductivity may be impaired. Therefore, the amount of the phenol compound that can be used in combination is preferably as small as possible, and it is particularly preferable to use only the phenol resin having the mesogenic group.
As the epoxy resin of the present invention, since a cured product having a particularly high thermal conductivity is obtained, a phenol resin having a mesogenic group obtained by a reaction between a hydroxybenzaldehyde and a compound represented by the formula (1) is used. Can be obtained.
本発明のエポキシ樹脂を得る反応において、エピハロヒドリンとしてはエピクロルヒドリン、α−メチルエピクロルヒドリン、β−メチルエピクロルヒドリン、エピブロモヒドリン等が使用できるが、工業的に入手が容易なエピクロルヒドリンが好ましい。エピハロヒドリンの使用量は、メソゲン基を有するフェノール樹脂の水酸基１モルに対し通常１〜２０モル、好ましくは１．５〜１２モルである。 In the reaction for obtaining the epoxy resin of the present invention, epichlorohydrin, α-methylepichlorohydrin, β-methylepichlorohydrin, epibromohydrin and the like can be used as the epihalohydrin, and epichlorohydrin which is easily available industrially is preferable. The usage-amount of epihalohydrin is 1-20 mol normally with respect to 1 mol of hydroxyl groups of the phenol resin which has a mesogenic group, Preferably it is 1.5-12 mol.
エポキシ化反応に使用できるアルカリ金属水酸化物としては、水酸化ナトリウム、水酸化カリウム等が挙げられ、これらは固形物をそのまま使用しても、あるいはその水溶液を使用してもよい。水溶液を使用する場合は、該アルカリ金属水酸化物の水溶液を連続的に反応系内に添加すると共に、減圧下または常圧下で連続的に留出させた水及びエピハロヒドリンの混合液から分液により水を除去し、エピハロヒドリンのみを反応系内に連続的に戻す方法でもよい。アルカリ金属水酸化物の使用量は、メソゲン基を有するフェノール樹脂の水酸基１モルに対して通常０．９〜３．０モル、好ましくは１．０〜２．５モル、より好ましくは１．０〜１．１モルである。アルカリ金属水酸化物を水溶液で用いることはハロゲンの残存量の低減が困難となることから好ましくない。
ここで、固形物のアルカリ金属の添加の方法としては、数回に分割して添加することが反応温度の急激な上昇および、不純物である１，３−ハロヒドリン体やハロメチレン体の生成を防ぐ観点から好ましい。
Examples of the alkali metal hydroxide that can be used for the epoxidation reaction include sodium hydroxide, potassium hydroxide, and the like, and these may be used as they are, or an aqueous solution thereof may be used. When using an aqueous solution, the aqueous solution of the alkali metal hydroxide is continuously added to the reaction system and separated from a mixture of water and epihalohydrin distilled continuously under reduced pressure or normal pressure. Alternatively, water may be removed and only the epihalohydrin is continuously returned to the reaction system. The amount of the alkali metal hydroxide used is usually 0.9 to 3.0 mol, preferably 1.0 to 2.5 mol, more preferably 1.0 to 1 mol of the hydroxyl group of the phenol resin having a mesogenic group. -1.1 mol. Use of an alkali metal hydroxide in an aqueous solution is not preferable because it is difficult to reduce the residual amount of halogen.
Here, as a method for adding the alkali metal as a solid, it is possible to divide it into several times to prevent a sudden increase in reaction temperature and the formation of impurities such as 1,3-halohydrin and halomethylene. To preferred.
エポキシ化反応を促進するために、テトラメチルアンモニウムクロライド、テトラメチルアンモニウムブロマイド、トリメチルベンジルアンモニウムクロライド等の４級アンモニウム塩を触媒として添加することが好ましい。４級アンモニウム塩の使用量としては、メソゲン基を有するフェノール樹脂の水酸基１モルに対し通常０．１〜１５ｇであり、好ましくは０．２〜１０ｇである。 In order to accelerate the epoxidation reaction, it is preferable to add a quaternary ammonium salt such as tetramethylammonium chloride, tetramethylammonium bromide, trimethylbenzylammonium chloride as a catalyst. The amount of the quaternary ammonium salt used is usually 0.1 to 15 g, preferably 0.2 to 10 g, per 1 mol of the hydroxyl group of the phenol resin having a mesogenic group.
また、エポキシ化の際に、メタノール、エタノール、イソプロピルアルコールなどのアルコール類、ジメチルスルホン、ジメチルスルホキシド、テトラヒドロフラン、ジオキサン等の非プロトン性極性溶媒などを添加して反応を行うことが反応進行上好ましい。ここで、ハロゲン量低減の観点からジメチルスルホキシドを使用することが好ましい。
一方、本発明のエポキシ樹脂を高い収率である観点からはメタノール、エタノール、イソプロピルアルコール等のアルコール類が好ましく、メタノールが特に好ましい。
In addition, during the epoxidation, it is preferable for the reaction to proceed by adding an aprotic polar solvent such as alcohols such as methanol, ethanol and isopropyl alcohol, dimethyl sulfone, dimethyl sulfoxide, tetrahydrofuran and dioxane. Here, it is preferable to use dimethyl sulfoxide from the viewpoint of reducing the halogen content.
On the other hand, alcohols such as methanol, ethanol and isopropyl alcohol are preferred, and methanol is particularly preferred from the viewpoint of high yield of the epoxy resin of the present invention.
上記アルコール類を使用する場合、その使用量はエピハロヒドリンの使用量に対し通常２〜５０質量％、好ましくは４〜２０質量％である。また非プロトン性極性溶媒を用いる場合はエピハロヒドリンの使用量に対し通常５〜１００質量％、好ましくは１０〜８０質量％である。 When using the said alcohol, the usage-amount is 2-50 mass% normally with respect to the usage-amount of an epihalohydrin, Preferably it is 4-20 mass%. Moreover, when using an aprotic polar solvent, it is 5-100 mass% normally with respect to the usage-amount of epihalohydrin, Preferably it is 10-80 mass%.
反応温度は通常３０〜９０℃であり、好ましくは３５〜８０℃である。反応時間は通常０．５〜１０時間であり、好ましくは１〜８時間、さらに好ましくは１〜２時間である。
反応終了後、反応物を水洗後、または水洗無しに加熱減圧下で反応液からエピハロヒドリンや溶媒等を除去する。また得られたエポキシ樹脂中に含まれるハロゲン量をさらに低減させるために、回収したエポキシ樹脂をトルエン、メチルイソブチルケトン、メチルエチルケトンなどの溶剤に溶解し、水酸化ナトリウム、水酸化カリウムなどのアルカリ金属水酸化物の水溶液を加えて反応を行なう。ここで、エポキシ樹脂を溶解させやすいことからメチルエチルケトンが好ましく使用できる。かかる操作を行なうことで閉環を確実なものにすることができる。この場合、アルカリ金属水酸化物の使用量は、メソゲン基を有するフェノール樹脂の水酸基１モルに対して通常０．０１〜０．３モル、好ましくは０．０５〜０．２モルである。反応温度は通常５０〜１２０℃、反応時間は通常０．５〜２時間である。
かかる操作により、より効果的にハロゲン量の低減を実現することができる。
The reaction temperature is usually 30 to 90 ° C, preferably 35 to 80 ° C. The reaction time is usually 0.5 to 10 hours, preferably 1 to 8 hours, more preferably 1 to 2 hours.
After completion of the reaction, the reaction product is washed with water or without washing with water, and the epihalohydrin, the solvent and the like are removed from the reaction solution under heating and reduced pressure. In order to further reduce the amount of halogen contained in the obtained epoxy resin, the recovered epoxy resin is dissolved in a solvent such as toluene, methyl isobutyl ketone, methyl ethyl ketone, and alkali metal water such as sodium hydroxide and potassium hydroxide. The reaction is carried out by adding an aqueous oxide solution. Here, methyl ethyl ketone can be preferably used because it easily dissolves the epoxy resin. By performing such an operation, the ring closure can be ensured. In this case, the usage-amount of an alkali metal hydroxide is 0.01-0.3 mol normally with respect to 1 mol of hydroxyl groups of the phenol resin which has a mesogenic group, Preferably it is 0.05-0.2 mol. The reaction temperature is usually 50 to 120 ° C., and the reaction time is usually 0.5 to 2 hours.
By such an operation, the amount of halogen can be more effectively reduced.
反応終了後、生成した塩を水洗により除去し、更にエバポレーターなどを使用して、減圧条件下高温で溶剤を留去し樹脂状にするか、または、冷却もしくはアルコールなどの貧溶剤を添加することにより本発明のエポキシ樹脂を結晶として析出させることで本発明のエポキシ樹脂を得る。
こうして得られる本発明のエポキシ樹脂の全ハロゲン量は１８００ｐｐｍ以下が通常であり、１６００ｐｐｍ以下であることが好ましい。全ハロゲン量が多すぎるものは硬化物の電気信頼性に悪影響を及ぼすことに加えて、未架橋の末端として残ることから、硬化時の融解状態時の分子同士の配向が進まずに熱伝導性の低下につながる。
After completion of the reaction, the generated salt is removed by washing with water, and further using an evaporator or the like, distilling off the solvent at high temperature under reduced pressure to form a resin, or adding a poor solvent such as cooling or alcohol. Thus, the epoxy resin of the present invention is obtained by precipitating the epoxy resin of the present invention as crystals.
The total halogen content of the epoxy resin of the present invention thus obtained is usually 1800 ppm or less, and preferably 1600 ppm or less. If the total halogen content is too large, the electrical reliability of the cured product will be adversely affected, and it will remain as an uncrosslinked end, so the orientation of the molecules in the molten state during curing will not proceed and the thermal conductivity Leading to a decline.
上記の方法により得られる本発明のエポキシ樹脂は、下記式（２）
で表せられるエポキシ樹脂であり、全ハロゲン量は１８００ｐｐｍ以下が通常であり、１６００ｐｐｍ以下であることが好ましい。
また、本発明のエポキシ樹脂においては、より高い熱伝導性硬化物を得る観点から、上記エポキシ樹脂において上記式（２）が、下記式（３）
で表せられるエポキシ樹脂であり、全ハロゲン量は１８００ｐｐｍ以下が通常であり、１６００ｐｐｍ以下であることが好ましい。
さらに、上記（３）式においてｎ＝１であり、Ｒ１が全て水素原子のものが特に好ましい。
得られるエポキシ樹脂の軟化点が通常５０〜１２０℃であり、好ましくは５０〜８０℃である。
The epoxy resin of the present invention obtained by the above method has the following formula (2)
In general, the total halogen content is 1800 ppm or less, and preferably 1600 ppm or less.
In the epoxy resin of the present invention, from the viewpoint of obtaining a higher thermal conductive cured product, the above formula (2) in the above epoxy resin is represented by the following formula (3).
In general, the total halogen content is 1800 ppm or less, and preferably 1600 ppm or less.
Furthermore, it is particularly preferable that n = 1 in the above formula (3) and R 1 is all hydrogen atoms.
The softening point of the obtained epoxy resin is usually 50 to 120 ° C, preferably 50 to 80 ° C.
以下、本発明のエポキシ樹脂組成物について記載する。
本発明のエポキシ樹脂組成物は、本発明のエポキシ樹脂とともに他のエポキシ樹脂、硬化剤、無機充填剤を含むことができる。
Hereinafter, the epoxy resin composition of the present invention will be described.
The epoxy resin composition of this invention can contain another epoxy resin, a hardening | curing agent, and an inorganic filler with the epoxy resin of this invention.
本発明のエポキシ樹脂組成物において、本発明のエポキシ樹脂は単独でまたは他のエポキシ樹脂と併用して使用することが出来る。 In the epoxy resin composition of the present invention, the epoxy resin of the present invention can be used alone or in combination with other epoxy resins.
使用できる他のエポキシ樹脂の具体例としては、ビスフェノール類（ビスフェノールＡ、ビスフェノールＦ、ビスフェノールＳ、ビフェノール、ビスフェノールＡＤ及びビスフェノールＩ等）やフェノール類（フェノール、アルキル置換フェノール、芳香族置換フェノール、ナフトール、アルキル置換ナフトール、ジヒドロキシベンゼン、アルキル置換ジヒドロキシベンゼン及びジヒドロキシナフタレン等）と各種アルデヒド（ホルムアルデヒド、アセトアルデヒド、アルキルアルデヒド、ベンズアルデヒド、アルキル置換ベンズアルデヒド、ヒドロキシベンズアルデヒド、ナフトアルデヒド、グルタルアルデヒド、フタルアルデヒド、クロトンアルデヒド及びシンナムアルデヒド等）との重縮合物、キシレン等の芳香族化合物とホルムアルデヒドの重縮合物とフェノール類との重縮合物、フェノール類と各種ジエン化合物（ジシクロペンタジエン、テルペン類、ビニルシクロヘキセン、ノルボルナジエン、ビニルノルボルネン、テトラヒドロインデン、ジビニルベンゼン、ジビニルビフェニル、ジイソプロペニルビフェニル、ブタジエン及びイソプレン等）との重縮合物、フェノール類とケトン類（アセトン、メチルエチルケトン、メチルイソブチルケトン、アセトフェノン及びベンゾフェノン等）との重縮合物、フェノール類と芳香族ジメタノール類（ベンゼンジメタノール及びビフェニルジメタノール等）との重縮合物、フェノール類と芳香族ジクロロメチル類（α，α’−ジクロロキシレン及びビスクロロメチルビフェニル等）との重縮合物、フェノール類と芳香族ビスアルコキシメチル類（ビスメトキシメチルベンゼン、ビスメトキシメチルビフェニル及びビスフェノキシメチルビフェニル等）との重縮合物、ビスフェノール類と各種アルデヒドの重縮合物、並びにアルコール類等をグリシジル化したグリシジルエーテル系エポキシ樹脂、脂環式エポキシ樹脂、グリシジルアミン系エポキシ樹脂、グリシジルエステル系エポキシ樹脂等が挙げられるが、通常用いられるエポキシ樹脂であればこれらに限定されるものではない。これらは、１種類のみ使用しても、２種以上を併用してもよい。
前記エポキシ樹脂を併用する場合、本発明のエポキシ樹脂組成物中の全エポキシ樹脂成分に占める本発明のエポキシ樹脂の割合は３０質量％以上が好ましく、４０質量％以上がより好ましく、７０質量％以上が更に好ましく、特に好ましくは１００質量％である。ただし、本発明のエポキシ樹脂をエポキシ樹脂組成物の改質剤として使用する場合は、全エポキシ樹脂中で１〜３０質量％となる割合で添加する。
Specific examples of other epoxy resins that can be used include bisphenols (bisphenol A, bisphenol F, bisphenol S, biphenol, bisphenol AD, bisphenol I, etc.) and phenols (phenol, alkyl-substituted phenol, aromatic-substituted phenol, naphthol, Alkyl-substituted naphthol, dihydroxybenzene, alkyl-substituted dihydroxybenzene and dihydroxynaphthalene) and various aldehydes (formaldehyde, acetaldehyde, alkylaldehyde, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzaldehyde, naphthaldehyde, glutaraldehyde, phthalaldehyde, crotonaldehyde and cinnamaldehyde Etc.), aromatic compounds such as xylene and formal Polycondensates of hydrides and phenols, phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornadiene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, Polycondensates with butadiene and isoprene), polycondensates with phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.), phenols and aromatic dimethanols (benzene dimethanol and biphenyl) Polycondensates with dimethanol, etc., polycondensates with phenols and aromatic dichloromethyls (α, α'-dichloroxylene, bischloromethylbiphenyl, etc.), phenols and aromatic bisarco Glycidyl ether epoxy resins, glycidylated polycondensates with xymethyls (such as bismethoxymethylbenzene, bismethoxymethylbiphenyl and bisphenoxymethylbiphenyl), bisphenols and various aldehydes, and alcohols A cyclic epoxy resin, a glycidylamine epoxy resin, a glycidyl ester epoxy resin, and the like can be mentioned, but the epoxy resin is not limited to these as long as it is a commonly used epoxy resin. These may be used alone or in combination of two or more.
When the epoxy resin is used in combination, the proportion of the epoxy resin of the present invention in the total epoxy resin component in the epoxy resin composition of the present invention is preferably 30% by mass or more, more preferably 40% by mass or more, and 70% by mass or more. Is more preferable, and particularly preferably 100% by mass. However, when using the epoxy resin of this invention as a modifier of an epoxy resin composition, it adds in the ratio used as 1-30 mass% in all the epoxy resins.
本発明のエポキシ樹脂組成物において、硬化剤であるフェノール樹脂は単独でまたは他の硬化剤と併用して使用することができる。
本発明のエポキシ樹脂組成物が含有する他の硬化剤としては、例えばアミン系化合物、酸無水物系化合物、アミド系化合物及びフェノール系化合物等が挙げられる。これら具体例を下記（ａ）〜（ｅ）に示す。
（ａ）アミン系化合物
ジアミノジフェニルメタン、ジエチレントリアミン、トリエチレンテトラミン、ジアミノジフェニルスルホン、イソホロンジアミン及びナフタレンジアミン等
（ｂ）酸無水物系化合物
無水フタル酸、無水トリメリット酸、無水ピロメリット酸、無水マレイン酸、テトラヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、無水メチルナジック酸、ヘキサヒドロ無水フタル酸及びメチルヘキサヒドロ無水フタル酸等
（ｃ）アミド系化合物
ジシアンジアミド、若しくはリノレン酸の２量体とエチレンジアミンより合成されるポリアミド樹脂等、
In the epoxy resin composition of the present invention, the phenol resin that is a curing agent can be used alone or in combination with other curing agents.
Examples of other curing agents contained in the epoxy resin composition of the present invention include amine compounds, acid anhydride compounds, amide compounds, and phenol compounds. Specific examples thereof are shown in the following (a) to (e).
(A) Amine-based compounds diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, naphthalenediamine, etc. (b) acid anhydride-based compounds phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride , Tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, etc. (c) Amide compounds Dicyandiamide or linolenic acid dimer and ethylenediamine Polyamide resin, etc.
（ｄ）フェノール系化合物
多価フェノール類（ビスフェノールＡ、ビスフェノールＦ、ビスフェノールＳ、フルオレンビスフェノール、テルペンジフェノール、４，４’−ジヒドロキシビフェニル、２，２’−ジヒドロキシビフェニル、３，３’，５，５’−テトラメチル−（１，１’−ビフェニル）−４，４’−ジオール、ハイドロキノン、レゾルシン、ナフタレンジオール、トリス−（４−ヒドロキシフェニル）メタン及び１，１，２，２−テトラキス（４−ヒドロキシフェニル）エタン等）；フェノール類（例えば、フェノール、アルキル置換フェノール、ナフトール、アルキル置換ナフトール、ジヒドロキシベンゼン及びジヒドロキシナフタレン等）と、アルデヒド類（ホルムアルデヒド、アセトアルデヒド、ベンズアルデヒド、ｐ−ヒドロキシベンズアルデヒド、ｏ−ヒドロキシベンズアルデヒド及びフルフラール等）、ケトン類（ｐ−ヒドロキシアセトフェノン及びｏ−ヒドロキシアセトフェノン等）、若しくはジエン類（ジシクロペンタジエン及びトリシクロペンタジエン等）との縮合により得られるフェノール樹脂；前記フェノール類と、置換ビフェニル類（４，４’−ビス（クロルメチル）−１，１’−ビフェニル及び４，４’−ビス（メトキシメチル）−１，１’−ビフェニル等）、若しくは置換フェニル類（１，４−ビス(クロロメチル)ベンゼン、１，４−ビス（メトキシメチル）ベンゼン及び１，４−ビス（ヒドロキシメチル）ベンゼン等）等との重縮合により得られるフェノール樹脂；前記フェノール類及び／又は前記フェノール樹脂の変性物；テトラブロモビスフェノールＡ及び臭素化フェノール樹脂等のハロゲン化フェノール類
（ｅ）その他イミダゾール類、ＢＦ３−アミン錯体、グアニジン誘導体
(D) Phenol compounds Polyphenols (bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, terpene diphenol, 4,4′-dihydroxybiphenyl, 2,2′-dihydroxybiphenyl, 3,3 ′, 5, 5'-tetramethyl- (1,1'-biphenyl) -4,4'-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane and 1,1,2,2-tetrakis (4 -Hydroxyphenyl) ethane and the like; phenols (eg, phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene and dihydroxynaphthalene) and aldehydes (formaldehyde, acetaldehyde, benzaldehyde, p-hydro) Phenolic resins obtained by condensation with xybenzaldehyde, o-hydroxybenzaldehyde, furfural, etc.), ketones (p-hydroxyacetophenone, o-hydroxyacetophenone, etc.), or dienes (dicyclopentadiene, tricyclopentadiene, etc.); Phenols and substituted biphenyls (such as 4,4′-bis (chloromethyl) -1,1′-biphenyl and 4,4′-bis (methoxymethyl) -1,1′-biphenyl), or substituted phenyls ( Phenol resins obtained by polycondensation with 1,4-bis (chloromethyl) benzene, 1,4-bis (methoxymethyl) benzene, 1,4-bis (hydroxymethyl) benzene and the like; Or a modified product of the phenol resin; Lumpur A and halogenated phenols such as brominated phenol resin (e) Other imidazoles, BF 3 - amine complex, guanidine derivatives
これらの中ではジアミノジフェニルメタン、ジアミノジフェニルスルホン及びナフタレンジアミンなどのアミン系化合物、並びにカテコールとアルデヒド類、ケトン類、ジエン類、置換ビフェニル類又は置換フェニル類との縮合物などが好ましい。これらの成分は活性水素基が隣接している構造を有すためであり、これによりエポキシ樹脂が良好に配列される。これらは単独で用いてもよく、複数を併用してもよい。
上記他の硬化剤を併用する場合、本発明のエポキシ樹脂組成物中の全硬化剤成分に占めるフェノール樹脂の割合は２０質量％以上が好ましく、３０質量％以上がより好ましく、７０質量％以上が更に好ましく、特に好ましくは１００質量％である。
本発明のエポキシ樹脂組成物において、フェノール樹脂を含む全硬化剤の使用量は、全エポキシ樹脂のエポキシ基１当量に対して０．５〜２．０当量が好ましく、０．６〜１．５当量が特に好ましい。
本発明のエポキシ樹脂組成物としては、エポキシ樹脂として本発明のエポキシ樹脂を１００質量％使用し、硬化剤としてフェノール樹脂を１００質量％使用する場合が最も好ましい。
Among these, amine compounds such as diaminodiphenylmethane, diaminodiphenylsulfone and naphthalenediamine, and condensates of catechol and aldehydes, ketones, dienes, substituted biphenyls or substituted phenyls are preferable. This is because these components have a structure in which active hydrogen groups are adjacent to each other, whereby the epoxy resin is well arranged. These may be used alone or in combination.
When the other curing agent is used in combination, the proportion of the phenol resin in the total curing agent component in the epoxy resin composition of the present invention is preferably 20% by mass or more, more preferably 30% by mass or more, and 70% by mass or more. More preferably, it is 100 mass% especially preferably.
In the epoxy resin composition of the present invention, the use amount of the total curing agent including the phenol resin is preferably 0.5 to 2.0 equivalents based on 1 equivalent of the epoxy groups of all epoxy resins, and 0.6 to 1.5. Equivalent weight is particularly preferred.
As the epoxy resin composition of the present invention, it is most preferable to use 100% by mass of the epoxy resin of the present invention as an epoxy resin and 100% by mass of a phenol resin as a curing agent.
本発明のエポキシ樹脂組成物に使用できる無機充填材は特に限定はないが、エポキシ樹脂組成物の硬化物に、より高い熱伝導率を付与する目的で加えられるもので、無機充填材自体の熱伝導率が低すぎる場合には、エポキシ樹脂と硬化剤の組み合わせにより得られた高熱伝導率が損なわれる恐れがある。従って、無機充填材としては、熱伝導率が高いものほど好ましく、通常２０Ｗ／ｍ・Ｋ以上、好ましくは３０Ｗ／ｍ・Ｋ以上、より好ましくは５０Ｗ／ｍ・Ｋ以上の熱伝導率を有するものであれば何ら制限はない。尚、ここでいう熱伝導率とは、ＡＳＴＭ Ｅ１５３０に準拠した方法で測定した値である。この様な特性を有する無機充填材の具体例としては、窒化ホウ素、窒化アルミニウム、窒化ケイ素、炭化ケイ素、窒化チタン、酸化亜鉛、炭化タングステン、アルミナ、酸化マグネシウム等の無機粉末充填材、合成繊維、セラミックス繊維等の繊維質充填材、着色剤等が挙げられる。これら無機充填材の形状は、粉末（塊状、球状）、単繊維、長繊維等いずれであってもよいが、特に、平板状のものであれば、無機充填材自身の積層効果によって硬化物の熱伝導性がより高くなり、硬化物の放熱性が更に向上するので好ましい。
本発明のエポキシ樹脂組成物における無機充填材の使用量は、エポキシ樹脂組成物中の樹脂成分１００質量部に対して通常２〜１０００質量部、好ましくは４００〜１０００質量部であるが、熱伝導率を出来るだけ高める為には、本発明のエポキシ樹脂組成物の具体的な用途における取り扱い等に支障をきたさない範囲で、可能な限り無機充填材の使用量を増やすことが好ましい。これら無機充填材は１種のみを使用しても、２種類以上を併用してもよい。
The inorganic filler that can be used in the epoxy resin composition of the present invention is not particularly limited, but is added for the purpose of imparting higher thermal conductivity to the cured product of the epoxy resin composition. If the conductivity is too low, the high thermal conductivity obtained by the combination of the epoxy resin and the curing agent may be impaired. Accordingly, the inorganic filler preferably has a higher thermal conductivity, and usually has a thermal conductivity of 20 W / m · K or higher, preferably 30 W / m · K or higher, more preferably 50 W / m · K or higher. If there is no limit. In addition, heat conductivity here is the value measured by the method based on ASTM E1530. Specific examples of inorganic fillers having such characteristics include inorganic powder fillers such as boron nitride, aluminum nitride, silicon nitride, silicon carbide, titanium nitride, zinc oxide, tungsten carbide, alumina, magnesium oxide, synthetic fibers, Examples thereof include fibrous fillers such as ceramic fibers, and coloring agents. The shape of these inorganic fillers may be any of powder (bulk shape, spherical shape), single fiber, long fiber, etc. However, in particular, if it is a flat plate, the cured product is cured by the lamination effect of the inorganic filler itself. This is preferable because the thermal conductivity becomes higher and the heat dissipation of the cured product is further improved.
Although the usage-amount of the inorganic filler in the epoxy resin composition of this invention is 2-1000 mass parts normally with respect to 100 mass parts of resin components in an epoxy resin composition, Preferably it is 400-1000 mass parts, but is heat conduction. In order to increase the rate as much as possible, it is preferable to increase the amount of the inorganic filler as much as possible within a range that does not hinder the handling of the epoxy resin composition of the present invention in a specific application. These inorganic fillers may be used alone or in combination of two or more.
また、充填材全体としての熱伝導率を２０Ｗ／ｍ・Ｋ以上に維持できる範囲にするには、熱伝導率が２０Ｗ／ｍ・Ｋ以上の無機充填材に熱伝導率が２０Ｗ／ｍ・Ｋ以下の充填材を併用しても構わないが、出来るだけ熱伝導率の高い硬化物を得るという本発明の目的からして、熱伝導率が２０Ｗ／ｍ・Ｋ以下の充填材の使用は最小限に留めることが好ましい。併用し得る充填材の種類や形状に特に制限はない。 Further, in order to keep the thermal conductivity of the filler as a whole at 20 W / m · K or higher, the thermal conductivity of the inorganic filler with 20 W / m · K or higher is 20 W / m · K. The following fillers may be used in combination, but for the purpose of the present invention to obtain a cured product having as high a thermal conductivity as possible, the use of a filler having a thermal conductivity of 20 W / m · K or less is minimal. It is preferable to keep the limit. There is no particular limitation on the type and shape of the filler that can be used in combination.
本発明のエポキシ樹脂組成物を半導体封止用途に用いる場合、硬化物の耐熱性、耐湿性、力学的性質などの点から、エポキシ樹脂組成物中において８０〜９３質量％を占める割合で熱伝導率が２０Ｗ／ｍ・Ｋ以上の無機充填材使用するのが好ましい。この場合、残部はエポキシ樹脂成分、硬化剤成分及びその他必要に応じて添加される添加剤であり、添加剤としては併用しうる他の無機充填材や後述する硬化促進剤等である。 When the epoxy resin composition of the present invention is used for semiconductor encapsulation, heat conduction is performed at a ratio of 80 to 93% by mass in the epoxy resin composition from the viewpoint of heat resistance, moisture resistance, mechanical properties, etc. of the cured product. It is preferable to use an inorganic filler having a rate of 20 W / m · K or more. In this case, the balance is an epoxy resin component, a curing agent component, and other additives that are added as necessary. Examples of the additive include other inorganic fillers that can be used in combination and a curing accelerator that will be described later.
本発明のエポキシ樹脂組成物は、エポキシ樹脂としての本発明のエポキシ樹脂を必須成分として含有していればよく、本発明のエポキシ樹脂組成物は特に優れた熱伝導性を有する。 The epoxy resin composition of this invention should just contain the epoxy resin of this invention as an epoxy resin as an essential component, and the epoxy resin composition of this invention has the outstanding heat conductivity.
本発明のエポキシ樹脂組成物には硬化促進剤を含有させることもできる。使用できる硬化促進剤としては、例えば、２−メチルイミダゾール、２−エチルイミダゾール、２−フェニルイミダゾール及び２−エチル−４−メチルイミダゾール等のイミダゾール類、２−（ジメチルアミノメチル）フェノール、トリエチレンジアミン、トリエタノールアミン及び１，８−ジアザビシクロ（５，４，０）ウンデセン−７等の第３級アミン類、トリフェニルホスフィン、ジフェニルホスフィン及びトリブチルホスフィン等の有機ホスフィン類、オクチル酸スズなどの金属化合物、テトラフェニルホスホニウム・テトラフェニルボレート及びテトラフェニルホスホニウム・エチルトリフェニルボレート等のテトラ置換ホスホニウム・テトラ置換ボレート、２−エチル−４−メチルイミダゾール・テトラフェニルボレート及びＮ−メチルモルホリン・テトラフェニルボレート等のテトラフェニルボロン塩などが挙げられる。硬化促進剤は、エポキシ樹脂１００質量部に対して０．０１〜１５質量部が必要に応じ用いられる。 The epoxy resin composition of the present invention may contain a curing accelerator. Examples of the curing accelerator that can be used include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole and 2-ethyl-4-methylimidazole, 2- (dimethylaminomethyl) phenol, triethylenediamine, Tertiary amines such as triethanolamine and 1,8-diazabicyclo (5,4,0) undecene-7, organic phosphines such as triphenylphosphine, diphenylphosphine and tributylphosphine, metal compounds such as tin octylate, Tetrasubstituted phosphonium tetrasubstituted borates such as tetraphenylphosphonium tetraphenylborate and tetraphenylphosphonium ethyltriphenylborate, 2-ethyl-4-methylimidazole tetraphenylborate and N Such as tetraphenyl boron salts such methylmorpholine tetraphenylborate and the like. 0.01-15 mass parts is used for a hardening accelerator as needed with respect to 100 mass parts of epoxy resins.
本発明のエポキシ樹脂組成物には、必要に応じてシランカップリング剤、離型剤及び顔料等種々の配合剤、各種熱硬化性樹脂並びに各種熱可塑性樹脂等を添加することができる。熱硬化性樹脂及び熱可塑性樹脂の具体例としては、ビニルエステル樹脂、不飽和ポリエステル樹脂、マレイミド樹脂、シアナート樹脂、イソシアナート化合物、ベンゾオキサジン化合物、ビニルベンジルエーテル化合物、ポリブタジエンおよびこの変性物、アクリロニトリル共重合体の変性物、インデン樹脂、フッ素樹脂、シリコーン樹脂、ポリエーテルイミド、ポリエーテルスルホン、ポリフェニレンエーテル、ポリアセタール、ポリスチレン、ポリエチレン、ジシクロペンタジエン樹脂等が挙げられる。熱硬化性樹脂、または熱可塑性樹脂は本発明のエポキシ樹脂組成物中において６０質量％以下を占める量が用いられる。 If necessary, various compounding agents such as a silane coupling agent, a release agent and a pigment, various thermosetting resins, various thermoplastic resins, and the like can be added to the epoxy resin composition of the present invention. Specific examples of thermosetting resins and thermoplastic resins include vinyl ester resins, unsaturated polyester resins, maleimide resins, cyanate resins, isocyanate compounds, benzoxazine compounds, vinyl benzyl ether compounds, polybutadiene and its modified products, and acrylonitrile. Examples include modified polymers, indene resins, fluororesins, silicone resins, polyetherimides, polyethersulfones, polyphenylene ethers, polyacetals, polystyrenes, polyethylenes, and dicyclopentadiene resins. The thermosetting resin or thermoplastic resin is used in an amount occupying 60% by mass or less in the epoxy resin composition of the present invention.
本発明のエポキシ樹脂組成物は、上記各成分を均一に混合することにより得られ、その好ましい用途としては半導体封止材やプリント配線板等が挙げられる。
本発明のエポキシ樹脂組成物は従来知られているのと同様の方法で容易にその硬化物とすることが出来る。本発明の硬化物の形成は、例えば、エポキシ樹脂、硬化剤及び熱伝導率が２０Ｗ／ｍ・Ｋ以上の無機充填材、並びに必要により硬化促進剤、配合剤、各種熱硬化性樹脂や各種熱可塑性樹脂等を、押出機、ニーダ又はロール等を用いて均一になるまで充分に混合してエポキシ樹脂組成物を得た後、該エポキシ樹脂組成物を溶融注型法、トランスファー成型法、インジェクション成型法あるいは圧縮成型法などによって成型し、次いでその融点以上で２〜１０時間加熱することにより行なうことができる。本発明のエポキシ樹脂組成物を半導体封止用途に用いる場合には、上記の方法でリードフレーム等に搭載された半導体素子を封止すればよい。
The epoxy resin composition of the present invention can be obtained by uniformly mixing the above-mentioned components, and preferred applications thereof include semiconductor encapsulants and printed wiring boards.
The epoxy resin composition of the present invention can be easily made into a cured product by the same method as conventionally known. Formation of the cured product of the present invention includes, for example, an epoxy resin, a curing agent, an inorganic filler having a thermal conductivity of 20 W / m · K or more, and if necessary, a curing accelerator, a compounding agent, various thermosetting resins, and various heat After thoroughly mixing a plastic resin or the like with an extruder, kneader, or roll until it becomes uniform to obtain an epoxy resin composition, the epoxy resin composition is melt-cast, transfer molding, injection molding It can be carried out by molding by the method or compression molding method and then heating for 2 to 10 hours above its melting point. When the epoxy resin composition of the present invention is used for semiconductor sealing applications, the semiconductor element mounted on a lead frame or the like may be sealed by the above method.
また、本発明のエポキシ樹脂組成物は溶剤を含むワニスとすることもできる。該ワニスは、例えば、エポキシ樹脂、硬化剤及び熱伝導率が２０Ｗ／ｍ・Ｋ以上の無機充填材、並びに必要に応じてその他の成分を含む混合物を、トルエン、キシレン、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン、シクロペンタノン、Ｎ，Ｎ’−ジメチルホルムアミド、Ｎ，Ｎ’−ジメチルアセトアミド、ジメチルスルホキシド、Ｎ−メチルピロリドン、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、ジプロピレングリコールジメチルエーテル、ジプロピレングリコールジエチルエーテル、トリエチレングリコールジメチルエーテル、トリエチレングリコールジエチルエーテル等のグリコールエーテル類、酢酸エチル、酢酸ブチル、メチルセロソルブアセテート、エチルセロソルブアセテート、ブチルセロソルブアセテート、カルビトールアセテート、プロピレングリコールモノメチルエーテルアセテート、グルタル酸ジアルキル、コハク酸ジアルキル、アジピン酸ジアルキル等のエステル類、γ−ブチロラクトン等の環状エステル類、石油エーテル、石油ナフサ、水添石油ナフサ及びソルベントナフサ等の石油系溶剤等の有機溶剤と混合することにより得ることが出来る。溶剤の量はワニス全体に対し通常１０〜９５質量％、好ましくは１５〜８５質量％である。
上記のようにして得られるワニスをガラス繊維、カーボン繊維、ポリエステル繊維、ポリアミド繊維、アルミナ繊維及び紙などのシート状の繊維基材に含浸させた後に加熱によって溶剤を除去すると共に、該ワニスを半硬化状態とすることにより、本発明のプリプレグを得ることが出来る。尚、ここで言う「半硬化状態」とは、反応性の官能基であるエポキシ基が一部未反応で残っている状態を意味する。該プリプレグを熱プレス成型して硬化物を得ることが出来る。
Moreover, the epoxy resin composition of this invention can also be made into the varnish containing a solvent. The varnish includes, for example, a mixture containing an epoxy resin, a curing agent, an inorganic filler having a thermal conductivity of 20 W / m · K or more, and other components as necessary, toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl. Ketone, cyclohexanone, cyclopentanone, N, N′-dimethylformamide, N, N′-dimethylacetamide, dimethyl sulfoxide, N-methylpyrrolidone, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl Glycol ethers such as ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, ethyl acetate, butyl acetate, methyl cellosolve acetate, ethyl cello Rub acetate, butyl cellosolve acetate, carbitol acetate, propylene glycol monomethyl ether acetate, esters such as dialkyl glutarate, dialkyl succinate, dialkyl adipate, cyclic esters such as γ-butyrolactone, petroleum ether, petroleum naphtha, hydrogenated petroleum It can be obtained by mixing with an organic solvent such as a petroleum solvent such as naphtha and solvent naphtha. The amount of the solvent is usually 10 to 95% by mass, preferably 15 to 85% by mass with respect to the whole varnish.
The varnish obtained as described above is impregnated into a sheet-like fiber base material such as glass fiber, carbon fiber, polyester fiber, polyamide fiber, alumina fiber and paper, and then the solvent is removed by heating, and the varnish is half-finished. By setting it to a cured state, the prepreg of the present invention can be obtained. Here, the “semi-cured state” means a state in which an epoxy group which is a reactive functional group partially remains unreacted. The prepreg can be hot press molded to obtain a cured product.
以下、本発明を実施例で更に詳細に説明するが、本発明はこれら実施例に限定されるものではない。合成例、実施例、比較例において部は質量部を意味する。なお、エポキシ当量、融点、熱伝導率は以下の条件で測定した。
・融点
Ｓｅｉｋｏ Ｉｎｓｔｒｕｍｅｎｔｓ
Ｉｎｃ．製 ＥＸＳＴＡＲ６０００
測定試料 ２ｍｇ〜５ｍｇ 昇温速度 １０℃／ｍｉｎ．
・溶融粘度
１５０℃におけるコーンプレート法における溶融粘度
測定機器：コーンプレート（ＩＣＩ）高温粘度計
・軟化点
ＪＩＳ Ｋ−７２３４に記載された方法で測定し、単位は℃である。
・全塩素量
試料のブチルカルビトール溶液に１Ｎ−ＫＯＨプロピレングリコール溶液を添加し、１０分間還流することにより遊離する塩素量（モル）を硝酸銀滴定法により測定し、試料の重量で除した値。
・エポキシ当量
ＪＩＳ Ｋ−７２３６に記載された方法で測定し、単位はｇ／ｅｑ．である。
・熱伝導率
ＡＳＴＭ Ｅ１５３０に準拠した方法で測定
EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples. In the synthesis examples, examples, and comparative examples, “part” means “part by mass”. The epoxy equivalent, melting point, and thermal conductivity were measured under the following conditions.
・ Melting point Seiko Instruments
Inc. EXSTAR6000 made
Measurement sample 2 mg to 5 mg Temperature rising rate 10 ° C./min.
Melt viscosity Melt viscosity in cone plate method at 150 ° C. Measuring instrument: cone plate (ICI) high temperature viscometer Softening point Measured by the method described in JIS K-7234, the unit is ° C.
-Total chlorine amount A value obtained by measuring the amount (mol) of chlorine liberated by adding a 1N-KOH propylene glycol solution to a butyl carbitol solution of a sample and refluxing for 10 minutes by a silver nitrate titration method and dividing by the weight of the sample.
-Epoxy equivalent Measured by the method described in JIS K-7236, the unit is g / eq. It is.
・ Thermal conductivity Measured in accordance with ASTM E1530
合成実施例１
撹拌機、還流冷却管、撹拌装置を備えたフラスコに、シクロヘキサノン４９部、ｐ−ヒドロキシベンズアルデヒド１２４部およびエタノール２５０部を仕込み、溶解した。これに３７％塩酸２５部を添加後６０℃まで昇温し、この温度で１０時間反応後、反応液を水１０００部に注入し、晶析させた。結晶を濾別後、水８００部で２回水洗し、その後真空乾燥し、黄色結晶のフェノール化合物１を２１０部得た。得られた結晶の融点はＤＳＣ測定により２８９℃であった。
Synthesis Example 1
A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 49 parts of cyclohexanone, 124 parts of p-hydroxybenzaldehyde and 250 parts of ethanol and dissolved. After adding 25 parts of 37% hydrochloric acid to this, the temperature was raised to 60 ° C., and after reacting at this temperature for 10 hours, the reaction solution was poured into 1000 parts of water for crystallization. The crystals were separated by filtration, washed twice with 800 parts of water, and then vacuum-dried to obtain 210 parts of phenol compound 1 as yellow crystals. The melting point of the obtained crystal was 289 ° C. by DSC measurement.
合成実施例２
撹拌機、還流冷却管、撹拌装置を備えたフラスコに窒素パージを施しながら、合成例１で得られたフェノール化合物１を１５３部、エピクロルヒドリン９２５部、ジメチルスルホキシド１３９部、水９部を加え、撹拌下、４５℃にまで昇温し、溶解し、フレーク状の水酸化ナトリウム４２部を９０分間かけて分割添加した後、４５℃のまま２時間、その後７０℃に昇温し３０分間反応を行なった。反応終了後、ロータリーエバポレーターを用いて１６０℃で減圧下、過剰のエピクロルヒドリン等の溶剤を留去した。留去後、メチルエチルケトンに再度溶解させ、水洗を行なうことでフラスコ内の塩や残留ジメチルスルホキシドを取り除いた。その後７５℃の溶液に３０％水酸化ナトリウム水溶液１３部を添加し、７５℃のまま８０分間反応を行なった。反応終了後、水層が中性になるまで十分水洗を行なった後に、１８０℃で真空乾燥することで本発明のエポキシ樹脂１を１９５部得た。得られたエポキシ樹脂の軟化点は６８℃、溶融粘度は０．０７Ｐａ・ｓ、全塩素量は９００ｐｐｍ、エポキシ当量は２２５ｇ／ｅｑ．であった。
Synthesis Example 2
While purging a flask equipped with a stirrer, a reflux condenser, and a stirrer with nitrogen purge, add 153 parts of the phenol compound 1 obtained in Synthesis Example 1, 925 parts of epichlorohydrin, 139 parts of dimethyl sulfoxide, and 9 parts of water, and stir. Then, the temperature was raised to 45 ° C., dissolved, and 42 parts of flaky sodium hydroxide were added in portions over 90 minutes, and then the temperature was raised at 45 ° C. for 2 hours, and then heated to 70 ° C. and reacted for 30 minutes. It was. After completion of the reaction, excess solvent such as epichlorohydrin was distilled off under reduced pressure at 160 ° C. using a rotary evaporator. After distilling off, it was dissolved again in methyl ethyl ketone and washed with water to remove salts and residual dimethyl sulfoxide in the flask. Thereafter, 13 parts of a 30% aqueous sodium hydroxide solution was added to the 75 ° C. solution, and the reaction was carried out at 75 ° C. for 80 minutes. After completion of the reaction, the water layer was sufficiently washed until neutral, and then vacuum dried at 180 ° C. to obtain 195 parts of epoxy resin 1 of the present invention. The resulting epoxy resin had a softening point of 68 ° C., a melt viscosity of 0.07 Pa · s, a total chlorine content of 900 ppm, and an epoxy equivalent of 225 g / eq. Met.
合成実施例３
撹拌機、還流冷却管、撹拌装置を備えたフラスコに窒素パージを施しながら、合成例１で得られたフェノール化合物１を１５３部、エピクロルヒドリン９２５部、メタノール１３９部を加え、撹拌下７０℃にまで昇温し、フレーク状の水酸化ナトリウム４３部を９０分間かけて分割添加した後、７０℃のまま９０分間反応を行なった。反応終了後、水洗を行ない、生成した塩などを取り除いた後に、ロータリーエバポレーターを用いて１６０℃で減圧下、過剰のエピクロルヒドリン等の溶剤を留去した。留去後、メチルエチルケトンに７５℃で再度溶解させ、３０％水酸化ナトリウム水溶液１３部を添加し、７５℃のまま８０分間反応を行なった。反応終了後、水層が中性になるまで十分水洗を行なった後に、１８０℃で真空乾燥することで本発明のエポキシ樹脂２を１９９部得た。得られたエポキシ樹脂の軟化点は６８℃、溶融粘度は０．０６Ｐａ・ｓ（１５０℃）、全塩素量は１５００ｐｐｍ、エポキシ当量は２１９ｇ／ｅｑ．であった。
Synthesis Example 3
While purging a flask equipped with a stirrer, a reflux condenser, and a stirrer with nitrogen purge, add 153 parts of the phenol compound 1 obtained in Synthesis Example 1, 925 parts of epichlorohydrin, and 139 parts of methanol and stir to 70 ° C. with stirring. The temperature was raised, 43 parts of flaky sodium hydroxide was added in portions over 90 minutes, and the reaction was carried out for 90 minutes at 70 ° C. After completion of the reaction, washing with water was performed to remove the generated salt and the like, and then excess solvent such as epichlorohydrin was distilled off under reduced pressure at 160 ° C. using a rotary evaporator. After the distillation, it was dissolved again in methyl ethyl ketone at 75 ° C., 13 parts of 30% aqueous sodium hydroxide solution was added, and the reaction was carried out for 80 minutes while maintaining at 75 ° C. After completion of the reaction, the water layer was sufficiently washed until it became neutral, and then vacuum dried at 180 ° C. to obtain 199 parts of epoxy resin 2 of the present invention. The resulting epoxy resin had a softening point of 68 ° C., a melt viscosity of 0.06 Pa · s (150 ° C.), a total chlorine content of 1500 ppm, and an epoxy equivalent of 219 g / eq. Met.
合成比較例１
撹拌機、還流冷却管、撹拌装置を備えたフラスコにｐ−ヒドロキシベンズアルデヒド１２２．１部、シクロヘキサノン４９．１部およびエタノール４００部を仕込み、溶解した。３６％塩酸５０．８部を添加後、８０℃まで昇温し６時間反応した。反応により析出した結晶を濾別後、水１０００ｇで４回水洗し、その後８０℃にて５時間真空乾燥し、茶色結晶の比較用のフェノール樹脂２を１３２．０部得た。
Synthesis Comparative Example 1
A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 122.1 parts of p-hydroxybenzaldehyde, 49.1 parts of cyclohexanone, and 400 parts of ethanol and dissolved. After adding 50.8 parts of 36% hydrochloric acid, the temperature was raised to 80 ° C. and reacted for 6 hours. After the crystals precipitated by the reaction were separated by filtration, they were washed with 1000 g of water four times and then dried in vacuo at 80 ° C. for 5 hours to obtain 132.0 parts of phenol resin 2 for comparison with brown crystals.
合成比較例２
撹拌機、還流冷却管、撹拌装置を備えたフラスコに合成比較例１で得られたフェノール樹脂２を１２０部仕込み、エピクロルヒドリン５０７．３部、ジメチルスルホキシド２５３．７部に溶解した。反応系内を４３ｔｏｒｒに保ちながら、温度４８℃で、４８．３％水酸化ナトリウム水溶液６４．８８部を５時間で連続的に滴下した。この間、温度は４８℃に保ちながら、共沸するエピクロルヒドリンと水を冷却液化し、有機層を反応系内に戻しながら反応させた。反応終了後に、未反応エピクロルヒドリンを減圧濃縮により除去し、副生塩とジメチルスルホキシドを水洗により除去した。その後１７０℃、１０ｔｏｒｒにてメチルイソブチルケトンを減圧留去し比較用のエポキシ樹脂３を１９８部得た。このものの軟化点は７２℃、溶融粘度は０．０７Ｐａ・ｓ（１５０℃）、全塩素量は５１００ｐｐｍ、エポキシ当量は２４３ｇ／ｅｑであった。
Synthesis Comparative Example 2
A flask equipped with a stirrer, a reflux condenser, and a stirrer was charged with 120 parts of the phenol resin 2 obtained in Synthesis Comparative Example 1, and dissolved in 507.3 parts of epichlorohydrin and 253.7 parts of dimethyl sulfoxide. While maintaining the inside of the reaction system at 43 torr, 64.88 parts of a 48.3% aqueous sodium hydroxide solution was continuously added dropwise at a temperature of 48 ° C. over 5 hours. During this time, while maintaining the temperature at 48 ° C., the azeotropic epichlorohydrin and water were cooled and liquefied, and the organic layer was allowed to react while returning to the reaction system. After completion of the reaction, unreacted epichlorohydrin was removed by concentration under reduced pressure, and by-product salt and dimethyl sulfoxide were removed by washing with water. Thereafter, methyl isobutyl ketone was distilled off under reduced pressure at 170 ° C. and 10 torr to obtain 198 parts of comparative epoxy resin 3. The softening point of this product was 72 ° C., the melt viscosity was 0.07 Pa · s (150 ° C.), the total chlorine content was 5100 ppm, and the epoxy equivalent was 243 g / eq.
実施例１〜２および比較例１〜２
各種成分を表１の割合（部）で配合し、ミキシングロールによる混練とそれに続くタブレット化の後、トランスファー成形で樹脂成型体を調製した。次いで、該樹脂成型体を１６０℃で２時間、更に１８０℃で８時間加熱することにより、本発明のエポキシ樹脂組成物及び比較用樹脂組成物の硬化物を得た。これら硬化物の熱伝導率を測定した結果を表１に示した。
Examples 1-2 and Comparative Examples 1-2
Various components were blended in the proportions (parts) shown in Table 1, and after kneading with a mixing roll and subsequent tableting, a resin molded body was prepared by transfer molding. Next, the resin molded body was heated at 160 ° C. for 2 hours and further at 180 ° C. for 8 hours to obtain a cured product of the epoxy resin composition of the present invention and the comparative resin composition. The results of measuring the thermal conductivity of these cured products are shown in Table 1.
エポキシ樹脂４：下記式（６）及び（７）で表されるエポキシ樹脂を等モル含有するビフェニル型エポキシ樹脂（商品名：ＹＬ−６１２１Ｈ ジャパンエポキシレジン製 エポキシ当量１７５ｇ／ｅｑ．） Epoxy resin 4: Biphenyl type epoxy resin containing an equimolar amount of the epoxy resin represented by the following formulas (6) and (7) (trade name: YL-6121H made by Japan Epoxy Resin, epoxy equivalent of 175 g / eq.)
硬化剤１：１，５−ナフタレンジアミン（東京化成工業製、アミン当量４０ｇ／ｅｑ．） Curing agent 1: 1,5-naphthalenediamine (manufactured by Tokyo Chemical Industry, amine equivalent 40 g / eq.)
以上の結果より、本発明のエポキシ樹脂及び当該エポキシ樹脂を含有するエポキシ樹脂組成物の硬化物は、特に優れた熱伝導性を有することが確認できた。したがって本発明のエポキシ樹脂組成物の硬化物は、電気・電子部品用絶縁材料及び積層板（プリント配線板など）等に使用する場合に極めて有用である。
From the above results, it was confirmed that the epoxy resin of the present invention and the cured product of the epoxy resin composition containing the epoxy resin have particularly excellent thermal conductivity. Therefore, the cured product of the epoxy resin composition of the present invention is extremely useful when used for insulating materials for electric / electronic parts, laminated boards (printed wiring boards, etc.) and the like.
本発明のエポキシ樹脂組成物の硬化物は、従来のエポキシ樹脂の硬化物と比較して優れた熱伝導性、信頼性を有する。さらに、本発明のエポキシ樹脂が低い塩素量を有する。従って、封止材、プリプレグ等として電気・電子材料、成型材料、注型材料、積層材料、塗料、接着剤、レジスト、光学材料などの広範囲の用途に極めて有用である。 The cured product of the epoxy resin composition of the present invention has excellent thermal conductivity and reliability as compared with a cured product of a conventional epoxy resin. Furthermore, the epoxy resin of the present invention has a low chlorine content. Therefore, it is extremely useful for a wide range of applications such as an electric / electronic material, a molding material, a casting material, a laminated material, a paint, an adhesive, a resist, and an optical material as a sealing material and a prepreg.
Claims (9)
（式（１）中、Ｒ１はそれぞれ独立して存在し、水素原子、炭素数１〜１０の直鎖、分岐あるいは環状のアルキル基、炭素数１〜１０のアリール基、水酸基、又は、炭素数１〜１０の直鎖、分岐あるいは環状のアルコキシ基のいずれかを表す。ｎは炭素数を表し、０、１、２のいずれかの整数を表す。ｍはＲ１の数を表し、１≦ｍ≦ｎ＋２の関係を満たす。）
で表される化合物とヒドロキシベンズアルデヒド類との反応によって得られるフェノール樹脂とエピハロヒドリンを反応させて得られるエポキシ樹脂であって、全ハロゲン量が、１６００ｐｐｍ以下である下記式（２）で表されるエポキシ樹脂。
(In Formula (1), each R 1 is independently present and is a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 1 to 10 carbon atoms, a hydroxyl group, or carbon. Represents any of linear, branched or cyclic alkoxy groups of 1 to 10. n represents the number of carbon atoms and represents an integer of 0, 1 or 2. m represents the number of R 1 ; ≦ m ≦ n + 2 is satisfied.)
An epoxy resin obtained by reacting a phenol resin obtained by the reaction of a compound represented by formula (II) with hydroxybenzaldehyde and an epihalohydrin, wherein the total halogen content is 1600 ppm or less and is represented by the following formula (2) resin.
工程（イ）：式（１）で表される化合物とヒドロキシベンズアルデヒド類との反応によって得られるフェノール樹脂にアルコール類またはケトン類の溶媒の存在下、エピハロヒドリンを反応させてエポキシ樹脂を得る工程。
工程（ロ）：工程（イ）で得られたエポキシ樹脂を溶剤で溶解し、アルカリ金属水酸化物を加えて反応を行う工程。 An epoxy resin represented by the formula (2) obtained by the following steps (a) to (b):
Step (a): A step of obtaining an epoxy resin by reacting an epihalohydrin with a phenol resin obtained by the reaction of a compound represented by the formula (1) and a hydroxybenzaldehyde in the presence of an alcohol or a ketone solvent.
Step (b): A step of dissolving the epoxy resin obtained in step (a) with a solvent and adding an alkali metal hydroxide to react.
The epoxy resin according to any one of claims 7 and 8, wherein a solid alkali metal hydroxide is used as the alkali metal hydroxide in the step (b).
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012121962A (en) * | 2010-12-07 | 2012-06-28 | Nippon Kayaku Co Ltd | Epoxy resin composition, prepreg, and cured product of the same |
| JP2013028666A (en) * | 2011-07-27 | 2013-02-07 | Nippon Kayaku Co Ltd | Epoxy resin mixture, epoxy resin composition, prepreg, and cured material thereof |
| WO2022104222A1 (en) * | 2020-11-16 | 2022-05-19 | Swimc Llc | Aromatic diol compounds, diepoxide compounds, polymers prepared from such compounds, and methods for making the same |
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| JP2007238963A (en) * | 2007-06-25 | 2007-09-20 | Nippon Kayaku Co Ltd | Method for producing epoxy resin |
| JP2008056944A (en) * | 2007-11-19 | 2008-03-13 | Nippon Kayaku Co Ltd | Epoxy resin composition |
| JP2008184570A (en) * | 2007-01-31 | 2008-08-14 | Dic Corp | Purification method of epoxy resin |
| JP2012121962A (en) * | 2010-12-07 | 2012-06-28 | Nippon Kayaku Co Ltd | Epoxy resin composition, prepreg, and cured product of the same |
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| US3937685A (en) * | 1972-11-21 | 1976-02-10 | Hoechst Aktiengesellschaft | New polyglycidyl ethers |
| JP2008184570A (en) * | 2007-01-31 | 2008-08-14 | Dic Corp | Purification method of epoxy resin |
| JP2007238963A (en) * | 2007-06-25 | 2007-09-20 | Nippon Kayaku Co Ltd | Method for producing epoxy resin |
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| JP2012121962A (en) * | 2010-12-07 | 2012-06-28 | Nippon Kayaku Co Ltd | Epoxy resin composition, prepreg, and cured product of the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012121962A (en) * | 2010-12-07 | 2012-06-28 | Nippon Kayaku Co Ltd | Epoxy resin composition, prepreg, and cured product of the same |
| JP2013028666A (en) * | 2011-07-27 | 2013-02-07 | Nippon Kayaku Co Ltd | Epoxy resin mixture, epoxy resin composition, prepreg, and cured material thereof |
| WO2022104222A1 (en) * | 2020-11-16 | 2022-05-19 | Swimc Llc | Aromatic diol compounds, diepoxide compounds, polymers prepared from such compounds, and methods for making the same |
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