JP2012109508A - Heat dissipation member for electronic device, electronic device, and method for manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipation member for an electronic device, which is excellent in heat dissipation effect, and to provide an electronic device having the heat dissipation member.SOLUTION: The heat dissipation member for an electronic device is constituted of a thermally conductive resin composition containing both a filler made of an orthorhombic silicate mineral and a resin. The heat dissipation member for an electronic device is at least one selected from a group consisting of a filling member filled the inside of an electronic device and a heat sink provided on a surface of the electronic device.

Description

  The present invention relates to a heat radiating member for an electronic device, and more particularly to a heat radiating member for an electronic device that efficiently conducts and transmits heat generated inside the electronic device, an electronic device using the heat radiating member, and a method for manufacturing the same.

  2. Description of the Related Art There are known electroluminescent elements used for units and pixels of display devices that display characters and images, and electroluminescent elements as planar illumination. FIG. 3 is a schematic cross-sectional view of a conventional electroluminescent element. In the electroluminescent element 20, a transparent anode 22 is formed on the surface of a transparent glass substrate 21, and an electroluminescent layer 23 composed of an electron transport layer, a light emitting layer, and the like is further formed on the anode 22. Further thereon, a cathode 24 made of metal is formed by vacuum deposition or the like. The anode 22 and / or the cathode 24 are patterned into a predetermined shape as necessary, and a current flows through the electroluminescent layer 23 located between the two electrodes by a voltage supplied between the cathode 24 and the anode 22, so that the cathode 24 and Light is emitted according to the pattern shape of the anode 22 and passes through the transparent glass substrate 21.

  In addition, the electroluminescence layer 23 is significantly deteriorated by moisture. For example, when the electroluminescence layer 23 is exposed to moisture in the air, there is a problem that a chemical change occurs and the emission lifetime is shortened. For this reason, in the conventional electroluminescence element 20, the anode 22, the electroluminescence 23, and the cathode 24 laminated on the glass substrate 21 are made of glass, for example, a sealing body 26 made of glass with an adhesive 27 such as resin. The electroluminescence is produced by adhesively sealing the substrate 21 and filling the sealed internal space 28 with an inert gas or by forming a desiccant layer inside the glass sealing body 26, for example. Layer 23 prevented exposure to moisture and moisture from the outside.

  However, in the hollow sealing by the adhesive 27 and the sealing body 26 such as glass, the moisture and moisture are not completely blocked from the outside, and there are some differences depending on the thickness and width of the adhesive 27 to be applied. However, about several μg / year of moisture has penetrated into the internal space.

  For this reason, instead of using the hollow sealing method using the adhesive 27 and the sealing body 26 such as glass, as shown in FIG. 4, the anode 22 laminated on the glass substrate 21, the electroluminescence layer 23, it was considered that the cathode 24 was directly coated with a water-repellent protective film 29. However, even in this case, when the film thickness of the water-repellent protective film 29 is thin, the moisture and moisture from the outside are not completely blocked. Due to this, a load was applied to the anode 22, the electroluminescent layer 23, the cathode 24, and the like. Furthermore, there is a problem that the heat dissipation condition of the element is deteriorated, the electroluminescence layer 23 is oxidized or crystallized due to heat accumulated in the element 20 ′, and the characteristics of the element 20 ′ are deteriorated due to these factors. It was.

  In order to prevent thermal degradation of the electroluminescent element, a method is known in which the two electrodes formed on the glass substrate and the electroluminescent layer are sealed with a heat-dissipating resin to dissipate heat to the outside air ( For example, see Patent Document 1.) In this method, heat generated from the element can be radiated to the outside air via the resin. However, oxygen or water vapor entering through the resin cannot be inhibited, and as a result, deterioration of the element cannot be prevented.

  A method of radiating heat from an electroluminescent element using a glass sealing body by using a filler having heat radiating properties has also been proposed (for example, see Patent Document 2). Since the resin having the heat dissipation characteristic specifically presented by this method is mainly composed of silicone, the adhesion of the thin film and the seal constituting the device is deteriorated by the low molecular siloxane molecules released from the silicone resin, As a result, the thin film is easily peeled off, and there is a problem of shortening the life of the device as a product.

JP-A-10-2755681 Special table 2008-504653 gazette

As described above, in the conventional electroluminescent element, various problems have occurred with respect to heat radiation generated inside.
Therefore, an object of the present invention is to provide a heat radiating member having excellent heat radiating properties by suppressing the occurrence of such heat radiating problems in applications of electronic devices such as electroluminescent elements. Furthermore, it is an object to provide an electronic device having the heat dissipation member.

  The present inventor has intensively studied to solve the above problems. As a result, by combining a resin and an orthorhombic silicate mineral filler to form a heat radiating member, it is possible to suppress problems that cause deterioration of electronic devices and to form a heat radiating member having a high heat radiating effect. The present invention was completed.

  The electronic device heat dissipation member according to the first aspect of the present invention is, for example, the electronic device heat dissipation member 1 shown in FIG. 1 or the electronic device heat dissipation member 1 shown in FIG. An electronic device heat dissipating member 1 composed of a thermally conductive resin composition containing an acid salt mineral filler and a resin, and the electronic device heat dissipating member is a filling member filled in the electronic device 10 1a and at least one selected from the group consisting of heat sinks 1b provided on the surface of the electronic device 10 ′. The “silicate mineral” may be either natural or artificial, and includes aluminosilicate minerals and silicate compounds other than minerals.

  With this configuration, the heat radiating member includes an orthorhombic silicate mineral filler in the resin, and is excellent in thermal conductivity and heat transfer, and thus effectively dissipates heat generated in the electronic device. can do. Furthermore, by using these fillers, it is possible to suppress the generation of gas due to the decomposition of the filler and the deterioration of the element. In addition, since these fillers have an appropriate hardness, it is possible to suppress wear of the equipment during the manufacturing process of the heat dissipation member. Moreover, since the heat radiating member is comprised with resin, the shaping | molding according to a use can be easily performed using the processing machine for resins.

  The heat dissipation member for electronic devices according to the second aspect of the present invention is the heat dissipation member for electronic devices according to the first aspect of the present invention, wherein the orthorhombic silicate mineral is cordierite. ) Or mullite.

  Since these fillers are lightweight and excellent in thermal conductivity, chemically stable, have high affinity with resins, and are less harmful to the human body, a heat radiating member utilizing these characteristics can be obtained. Furthermore, these fillers are used as far-infrared ceramics, and can give the heat radiating member characteristics such as excellent far-infrared radiation.

  The electronic device heat dissipation member according to the third aspect of the present invention is the electronic device heat dissipation member according to the first or second aspect of the present invention, wherein the thermally conductive resin composition that becomes the filling member 1a is nitrided. It further includes at least one additional filler selected from the group consisting of boron, aluminum nitride, silicon carbide, alumina, magnesia, silica, rutile titanium oxide and zinc oxide.

  If comprised in this way, the thermal conductivity and heat transfer property of a thermal radiation member can be further improved with an additional filler. Moreover, since a heat radiating member can be colored white, even if it is a case where a filler is colored, a heat radiating member can be made white. Furthermore, when the electronic device is a light emitting element, the reflectance of light can be increased.

  The heat radiating member for electronic devices according to the fourth aspect of the present invention is the heat radiating member for electronic devices according to the first or second aspect of the present invention, wherein the heat conductive resin composition to be the heat radiating plate 1b is graphite. And at least one additional filler selected from the group consisting of low-order titanium oxide.

  If comprised in this way, the emissivity of the near infrared region of a heat radiating member will improve with an additional filler, and the heat dissipation effect can be improved more. Moreover, since a heat radiating member can be colored black, even if it is a case where a filler is colored, designability can be improved by making a heat radiating member black.

  The heat dissipation member for electronic devices according to a fifth aspect of the present invention is the heat dissipation member for electronic devices according to the third or fourth aspect of the present invention, wherein the resin contains 35 to 95 of the filler and the additional filler. The filler is contained in an amount of 1 to 70% by weight based on the filler, the filler is a powder, and the average particle size is 0.1 to 200 μm.

  If comprised in this way, the quantity of the filler contained in resin and the additional filler will become a suitable heat radiating member. Moreover, since the average particle diameter of a filler is appropriate, it becomes a heat radiating member which can be easily kneaded uniformly in a resin.

  The heat dissipation member for electronic devices according to the sixth aspect of the present invention is the heat dissipation member for electronic devices according to any one of the first to fifth aspects of the present invention, wherein the resin is polyolefin, polystyrene, polycarbonate and polyethylene. It is at least one resin selected from the group consisting of terephthalates.

  If comprised in this way, a heat radiating member will be comprised by chemically stable resin, and it will become a heat radiating member which suppressed that the gas which generate | occur | produces by decomposition | disassembly of resin deteriorates an electronic device.

  The electronic device heat dissipation member according to a seventh aspect of the present invention is the electronic device heat dissipation member according to the sixth aspect of the present invention, wherein the resin is at least one selected from the group consisting of polyethylene and polypropylene. Resin.

  If comprised in this way, it will become a heat radiating member using especially preferable polyethylene or polypropylene among polyolefin.

  The electronic device according to the eighth aspect of the present invention is, for example, the electronic device 10 shown in FIG. 1, and includes a substrate 11 serving as a base; a first electrode 12 formed on one surface of the substrate 11; An organic thin film layer 13 formed on the first electrode 12; a second electrode 14 formed on the organic thin film layer 13; a first electrode 12, the organic thin film layer 13 and the second electrode 14; A gas impermeable protective film 15 to be covered; a heat dissipating member 1 for an electronic device according to any one of the first to seventh aspects of the present invention placed on the gas impermeable protective film 15; And a sealing body 16 formed on the member 1 and fixed to the substrate 11. Note that “placement” means that a specific object is fixedly placed on a specific object.

  If comprised in this way, a thermal radiation member will be filled with the inside of an electronic device as a filling member. The heat generated inside the electronic device is efficiently conducted and transferred, and transferred to the sealing body 16 through the heat radiating member. As a result, deterioration of the electronic device due to heat can be suppressed.

  The electronic device according to the ninth aspect of the present invention is, for example, an electronic device 10 ′ shown in FIG. 2, and includes a substrate 11 serving as a base; a first electrode 12 formed on one surface of the substrate 11 The organic thin film layer 13 formed on the first electrode 12, the second electrode 14 formed on the organic thin film layer 13, the first electrode 12, the organic thin film layer 13, and the second electrode 14. A gas impermeable protective film 15 covering the gas; a sealing body 16 formed above the gas impermeable protective film 15 and fixed to the substrate 11; the first to first aspects of the present invention placed on the sealing body 16 The electronic device heat dissipating member 1 according to any one of 7 is provided.

  If comprised in this way, a thermal radiation member will be mounted as a heat sink on the sealing body surface of an electronic device. As a result, the heat generated inside the electronic device and transferred to the sealing body by heat conduction and heat transfer is efficiently released to the outside from the heat sink. As a result, deterioration of the electronic device due to heat can be suppressed.

  The electronic device manufacturing method according to the tenth aspect of the present invention is, for example, the manufacturing method of the electronic device 10 shown in FIG. 1, in which the first electrode 12 is formed on one surface of the substrate 11 serving as a base. A step of forming an organic thin film layer 13 on the first electrode 12; a step of forming a second electrode 14 on the organic thin film layer 13; and a gas non-permeable protection on the second electrode 14 A step of coating the film 15; a step of laminating the heat dissipating member 1 for electronic devices according to any one of the first to seventh aspects of the present invention on the gas impermeable protective film 15; and a heat dissipating member for electronic devices Forming a sealing body 16 on the substrate 1 and fixing it to the substrate 11.

  If comprised in this way, it will become the manufacturing method of the electronic device which fills a heat radiating member as a filling member inside an electronic device. In the manufactured electronic device, heat generated inside the electronic device is efficiently conducted and transferred, and transferred to the sealing body 16 through the heat dissipation member, thereby suppressing deterioration of the electronic device due to heat. it can.

  The electronic device manufacturing method according to the eleventh aspect of the present invention is, for example, a manufacturing method of the electronic device 10 ′ shown in FIG. 2, in which the first electrode 12 is formed on one surface of the substrate 11 serving as a base. A step of forming; an organic thin film layer 13 formed on the first electrode 12; a second electrode 14 formed on the organic thin film layer 13; a gas impermeable protection on the second electrode 14; A step of coating the film 15; a step of forming the sealing body 16 above the gas impermeable protective film 15 and fixing the sealing body 16 to the substrate 11; and the sealing body 16 according to any one of the first to seventh aspects of the present invention. And a step of covering with the electronic device heat dissipation member 1 according to the aspect.

  If comprised in this way, it will be the manufacturing method of the electronic device which mounts a heat radiating member as a heat sink on the sealing body surface of an electronic device. In the manufactured electronic device, heat generated inside the electronic device and transferred to the sealing body by heat conduction and heat transfer is efficiently released from the heat sink to the outside, thereby suppressing deterioration of the electronic device due to heat. Can do.

  The heat dissipating member of the present invention can be used for electronic devices such as electroluminescent elements, and is composed of a heat conductive resin composition containing a resin and an orthorhombic silicate mineral filler. The heat generated inside the electronic device can be effectively dissipated and deterioration of the electronic device can be suppressed. Furthermore, since the filler is not decomposed by heat or moisture, a gas such as ammonia that deteriorates the electroluminescent element is not generated. As a result, the lifetime of the electronic device can be extended.

It is a schematic sectional drawing of the electroluminescent element 10 which filled the inside with the thermal radiation member 1 as the filling member 1a. It is a schematic sectional drawing of electroluminescent element 10 'mounted so that the heat radiating member 1 might be provided in the surface of the sealing body 16 as the heat sink 1b. FIG. 6 is a schematic cross-sectional view of a conventional electroluminescence element 20. It is a schematic sectional drawing of other conventional electroluminescent elements 20 '.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same or similar reference numerals, and redundant description is omitted. Moreover, in the following embodiment, the electronic device heat dissipation member (hereinafter referred to as a heat dissipation member) of the present invention will be described as being used for an electroluminescent element as an example of an electronic device. However, the present invention is not limited to the following embodiments.

[Heat dissipation member 1 (filling member 1a)]
With reference to FIG. 1, the heat radiating member 1 which concerns on the 1st Embodiment of this invention is demonstrated. FIG. 1 is a schematic cross-sectional view of an electroluminescent element 10 filled with a heat radiating member 1. Thus, the heat radiating member 1 functions as a filling member 1 a filled in the electroluminescent element 10. That is, the heat radiating member 1 is filled so as to be in contact with the gas non-permeable protective film 15 and the sealing body 16, and the heat transmitted from the gas non-permeable protective film 15 is transmitted to the sealing body 16, thereby causing electroluminescence. Heat is removed from the sense element 10. In addition, the heat radiating member 1 is manufactured by mixing a filler having thermal conductivity with a resin.

The resin is preferably a non-silicone resin from the viewpoint of preventing deterioration of the electroluminescent element 10 due to generation of gas and obtaining high thermal conductivity. Furthermore, polyolefin, liquid crystal polymer (LCP), etc. are preferable at the point which expresses high degree of orientation. Since heat is transferred along the molecular chain via the phonon, the thermal conductivity can be increased by being highly oriented. That is, heat can be transferred more efficiently.
Furthermore, considering processability, polyolefin (PO), polystyrene (PS), polycarbonate (PC), polyethylene terephthalate (PET), and the like are preferable. Among these, polyolefins are more preferable because they have low water absorption, do not damage the device due to decomposition, and do not generate harmful gases even when incinerated. If the water absorption is low, it is possible to suppress the deterioration of the electroluminescent element 10 due to the mixing of moisture. Polyolefins are available in various grades and are also preferred in that they are easily available.
Further, among polyolefins, polyethylene and polypropylene are particularly preferable. Since polyethylene and polypropylene are widely used in general, they are easily available and inexpensive, and there are grades with various characteristics, and it is easy to adjust physical properties such as melt mass flow rate and softening point.
Examples of polypropylene include, in addition to a propylene homopolymer, a random or block copolymer of two or more with propylene as a main component and a monomer other than propylene, and a mixture of two or more of these. it can. Although it does not specifically limit as said monomer, C4-C12 alpha olefins, such as 1-butene, 1-pentene, 1-hexene, 1-octene, ethylene, etc. can be illustrated. These may be used alone or in combination of two or more.
Examples of the polyethylene include low density polyethylene (LDPE), linear low density polyethylene (LLDPE), linear very low density polyethylene (VLDPE), and high density polyethylene (HDPE). These may be used alone or in combination of two or more.

Examples of orthorhombic silicate mineral fillers include mullite, cordierite, enstatite, hemimorphite, zoisite, sillimanite, and syenite. In particular, cordierite and mullite are preferable because they have high thermal conductivity and are suitable for mixing with a resin. The orthorhombic silicate mineral may be either natural or artificial. In addition, mica, montmorillonite, graphite (including graphite), kaolin, bentonite, and the like may be included as minerals as long as the effects of the present invention are not significantly impaired.
Further, in addition to the orthorhombic silicate mineral filler, another filler having other thermal conductivity such as zinc oxide may be added.

  The additional filler may be a ceramic. Examples of the ceramic include alumina (aluminum oxide), silica, boron nitride, silicon nitride, aluminum nitride, silicon carbide and the like. In particular, silica, boron nitride, silicon nitride, and silicon carbide are preferable from the viewpoint of thermal conductivity. Boron nitride is more preferred because it has high thermal conductivity, good insulation, and is excellent in that it does not easily wear the processing machine. In addition, it is also preferable to use a mixture of the above minerals and ceramics from the viewpoint of easy physical property adjustment.

  The additional filler may be a metal. Examples of the metal include aluminum, silver, copper, tin, and alloys thereof. In particular, aluminum, silver, and copper are preferable from the viewpoint of workability and safety.

The shape of the filler and the additional filler is preferably powder, paste, wire or the like. In particular, since a uniform state can be obtained, it is preferable to mix the resin as a powder or paste. When the mineral, ceramics, or metal is a powder, the average particle diameter is preferably 0.1 to 200 μm, and particularly preferably 0.5 to 100 μm. Moreover, content in the heat conductive resin composition of a filler and an additional filler becomes like this. Preferably it is 35 to 95 weight%, More preferably, it is 35 to 80 weight%. The additional filler is preferably 0 to 70% by weight, more preferably 1 to 70% by weight, based on the filler.
When an additional nitride filler such as boron nitride or aluminum nitride is used for the filling member filled in the electronic device, it is necessary to suppress the generation of gas due to the thermal decomposition of the nitride as much as possible. Therefore, the content of the additional filler of nitride in the heat conductive resin composition is preferably 2% by weight or less, more preferably 1.6% by weight or less. Further, when a conductive additional filler such as graphite or zinc oxide is used for the filling member filled in the electronic device, it causes a short circuit or a leakage current inside the device. Therefore, the content of the conductive additional filler in the heat conductive resin composition is preferably 2% by weight or less, and more preferably 1.6% by weight or less.

  When the heat radiating member 1 is prepared by mixing a resin and an orthorhombic silicate mineral, ceramic, or metal, the proportion is a group consisting of an orthorhombic silicate mineral, ceramic, and metal. It is preferable that at least one filler selected from 35 to 95% by weight. In particular, 50 to 90% by weight is preferable from the viewpoint of heat conduction characteristics. If it is 35% by weight or more, the effect of improving heat conduction can be sufficiently obtained, and if it is 95% by weight or less, it is easily mixed with the resin.

  The heat dissipating member 1 is preferably provided in a sheet form in that the manufacturing process is simple. That is, when the heat radiating member 1 is used for an electroluminescence element, the sheet-like heat radiating member 1 is used as the filling member 1a and is directly adhered to the electroluminescent layer on which the gas impermeable protective film is formed, and then the sealing body is used. To form a filled layer. A gas impermeable protective film is laminated on the electroluminescence layer. Therefore, the lamination of the sheet-like heat radiating member 1 does not directly damage or damage the electroluminescence layer, and the filling layer can be easily formed in the laminating process.

  The manufacturing method of the sheet-like heat radiating member 1 uses a kneader to knead the resin and the filler or additional filler powder or pellets at a predetermined temperature while adjusting the rotational speed. After kneading, the mixture returned to room temperature and weighed is pressed with a press at a predetermined temperature and pressure to produce a sheet. When the heat radiating member 1 is used as the heat radiating plate 1b, the thickness of the sheet may be 50 to 2000 μm. Preferably, it is 100-1000 micrometers, More preferably, it is 300-400 micrometers. When used as the filling member 1a, it is preferable that the thickness is as small as possible in the range in which the unevenness of the joint surface inside the element can be filled, because the thermal resistance becomes low.

  As described above, the heat dissipation member 1 according to the first embodiment of the present invention can be easily manufactured. Furthermore, when used for an electronic device such as an electroluminescent element, an electronic device including the heat dissipation member 1 can be manufactured without damaging the electroluminescent layer in the manufacturing process of the electronic device.

[Heat dissipation member 1 (heat dissipation plate 1b)]
With reference to FIG. 2, the heat radiating member 1 which concerns on the 2nd Embodiment of this invention is demonstrated. FIG. 2 is a schematic cross-sectional view of the electroluminescent element 10 ′ on which the heat radiating member 1 is placed so as to be provided on the surface of the sealing body 16. Thus, the heat radiating member 1 functions as the heat radiating plate 1b mounted on the surface of the electroluminescent element 10 ′. That is, the heat radiating member 1 is placed on the surface of the sealing body 16 and releases heat transmitted from the sealing body 16 to the outside, thereby removing heat from the electroluminescent element 10 ′. In addition, the material and manufacturing method of the heat radiating member 1 are the same as that of the heat radiating member 1 used for the filling member 1a.
When the heat radiating member 1 is used as the heat radiating plate 1b, the thickness of the sheet is 50 to 2000 μm. Preferably, it is 100-1000 micrometers, More preferably, it is 300-400 micrometers. When used as the heat radiating plate 1b, a certain thickness is preferable because the heat radiating performance is enhanced.

A heat radiating member according to a third embodiment of the present invention will be described. The heat radiating member according to the third embodiment is the heat radiating member 1 containing an additional filler having thermal conductivity for further coloring. The additional filler for coloring is one selected from the group consisting of boron nitride, aluminum nitride, silicon carbide, alumina, magnesia, silica, rutile titanium oxide, zinc oxide, titanium-based black pigment, low-order titanium oxide and graphite. The above filler can be mentioned. Rutile titanium oxide refers to white titanium oxide represented by TiO ₂ . A titanium-based black pigment refers to a compound composed of titanium, oxygen, and nitrogen synthesized by reducing titanium dioxide with ammonia. Low-order titanium oxide refers to black titanium oxide such as Ti ₃ O ₅ , Ti ₂ O ₃ and TiO. The content of the additional filler for coloring may be contained in the range of 1 to 70% by weight, preferably 10 to 60% by weight, more preferably 10 to 50% by weight, based on the filler having thermal conductivity. %. The total amount of filler and additional filler for coloring is preferably 35 to 95% by weight, more preferably 50 to 90% by weight, based on the resin. Further, in the additional method, the resin, filler and coloring additional filler are kneaded from the beginning of the kneading. By adding an additional filler for coloring, the heat dissipating member is colored and the thermal conductivity can be further increased.

By adding at least one selected from the group consisting of boron nitride, alumina, magnesia, silica, rutile titanium oxide and zinc oxide as an additional filler for coloring, the heat dissipating member can be made white. By using white, when the heat radiating member is used as the filling member 1a in an electronic device such as an electroluminescent element, the emitted light can be reflected. In particular, it is effective because the heat dissipating member can be white when the filler is colored. Moreover, a heat radiating member can be made black by adding at least 1 sort (s) chosen from the group which consists of a titanium-type black pigment, low-order titanium oxide, and graphite. By making it black, the heat dissipation effect can be enhanced when the heat dissipation member is used as the heat dissipation plate 1b on the surface of the electronic device. When an additional filler for coloring is added only as a colorant regardless of thermal conductivity, the amount added can be reduced, and it is preferable in view of cost.
A part of the filler may be replaced with the additional filler for coloring and contained in the resin to constitute the heat dissipation member. Also in this case, it is preferable that the total amount of the additional filler for coloring is 35 to 95% by weight with respect to the resin.

  With reference to FIG. 1, an electroluminescent element 10 according to a fourth embodiment of the present invention will be described. As shown in FIG. 1, the electroluminescent element 10 includes an anode 12 as a first electrode, an electroluminescent layer 13 as an organic thin film layer, and a cathode as a second electrode on the surface of a substrate 11 serving as a base. 14 are sequentially stacked. Further, a gas impermeable protective film 15 is coated on the cathode 14, and the upper side thereof is sealed with a sealing body 16. The heat-radiating member 1 having thermal conductivity is filled between the cathode 14 and the sealing body 16, and heat generated in the element is transmitted to the sealing body 16, whereby the electroluminescent element 10 is removed. .

  The substrate 11 is preferably a transparent glass substrate. Or the board | substrate comprised from transparent resin may be sufficient. In addition, when the electroluminescent element 10 is not a bottom emission system but a top emission system, the board | substrate 11 does not need to be transparent.

  The anode 12 is formed by forming a transparent anode (for example, ITO electrode) on the surface of the glass substrate 11 in a predetermined pattern by vacuum deposition or the like. When the electroluminescence element 10 is not the bottom emission method but the top emission method, the anode 12 is opaque.

  The electroluminescent layer 13 is laminated on the anode 12 in a predetermined pattern. The electroluminescent layer 13 is an electron injection layer that receives electrons from the cathode 14, an electron transport layer that passes electrons in the electron injection layer to the light emitting layer, a hole injection layer that receives holes from the anode 12, and a hole in the hole injection layer that emits light. It consists of five layers: a hole transport layer that passes to the layer, and a light-emitting layer that actually emits light. The electroluminescent layer 13 may be composed of three layers of an electron transport layer / a light emitting layer / a hole transport layer. Furthermore, it may be composed of two layers of an electron transport layer / light emitting layer or two layers of a hole transport layer / light emitting layer. Moreover, you may be comprised with the single layer of only a light emitting layer.

  As the cathode 14, a cathode made of a metal having high electrical conductivity (for example, silver or aluminum) is stacked on the electroluminescent layer 13 by vacuum deposition or the like. Alternatively, conductive plastic may be used instead of metal. In addition, when the electroluminescent element 10 is not a bottom emission system but a top emission system, the anode 14 is transparent.

The gas impermeable protective film 15 is formed in close contact with the glass substrate 11 so as to cover the anode 12, the electroluminescent layer 13, and the cathode 14. The gas impermeable protective film 15 is preferably one that does not react with the heat radiating member 1 and is stable for a long time and does not generate corrosive gas, and is preferably a resin or metal oxide thin film. The gas impermeable protective film 15 may be an organic layer, an inorganic layer, or a combination thereof. For example, a SiOx film formed by vacuum deposition is preferable. As a component of the gas impermeable protective film 15, for example, SiNx, SiOx, SiOxCyHz, Al ₂ O ₃ , AlNx and the like are preferable, and they may be used in combination with other known organic polymer films. The gas impermeable protective film 15 may have a laminated structure, and may appropriately include an organic polymer film between the laminated layers. The thickness of the gas impermeable protective film 15 may be in the range of 10 nm to 100 μm, preferably 100 nm to 10 μm, as long as the effect is exhibited.

The sealing body 16 protects the electroluminescent element, and may be any sealing body of glass, resin, ceramics, or metal. The heat generated in the element is transmitted to the sealing body 16 through the heat radiating member 1 by heat conduction, heat radiation (far-infrared radiation) or the like, and finally released to the outside of the element.
When the sealing body 16 is a substance having relatively low thermal conductivity (˜1 W) such as glass or resin, it is preferable to select a material having higher thermal radiation for the heat radiating member 1. Examples of materials having high thermal radiation include resins, metals, ceramics, minerals, and the like, and mixtures thereof are particularly preferable. From the viewpoint of preventing deterioration of the element, the resin used for the heat dissipation member 1 of the present invention is preferably non-silicone, and polyolefin, PS, PC, PET, and the like are preferable in terms of workability. Polyolefin is particularly preferable from the viewpoint of characteristics.
When the sealing body 16 is a substance having relatively high thermal conductivity (1W to) such as metal and ceramics, it is preferable to select a material having higher thermal conductivity for the heat radiating member 1. Examples of the material having high thermal conductivity include resins such as liquid crystalline polymers and high-density polyethylene, metals, ceramics, orthorhombic silicate minerals, and the like, and mixtures thereof are particularly preferable. From the viewpoint of obtaining high thermal conductivity, the resin used in the filling layer of the present invention is desirably non-silicone, and polyolefin, LCP, and the like are particularly preferable in terms of expressing a high degree of orientation. Polyolefin is particularly preferred from the viewpoint of processability.

  The electroluminescent element in the present invention is configured as described above, and a predetermined voltage is applied between the anode 12 and the cathode 14 and a forward current is passed through the electroluminescent layer 13 located between the two electrodes, whereby the cathode 14 and Light is emitted through the transparent glass substrate 11 according to the pattern shape of the anode 12.

  Next, a method for manufacturing the electroluminescent element 10 according to the fifth embodiment of the invention will be described. First, the anode 12 is formed in a predetermined pattern on the surface of the transparent glass substrate 11. In most cases, a transparent electrode called Indium-Tin-Oxide (ITO) is used for the anode of the electroluminescent element 10. ITO is formed on a transparent glass substrate by sputtering vapor deposition or electron beam vapor deposition (EB), and is formed in a predetermined thickness and shape using various techniques such as a photolithography technique. Next, an electroluminescent layer 13 (light emitting layer, hole transport layer, etc.) composed of a plurality of organic layers is sequentially laminated on the formed anode 12 by vapor deposition or the like to form the electroluminescent layer 13. Next, a water-repellent protective film 15 as a gas non-permeable protective film is formed on the anode 12, the electroluminescent layer 13, and the cathode 14 formed on the glass substrate 11 using a coating agent having moisture resistance, The electroluminescent layer 13 is shielded from outside air and sealed by being in close contact with each of the above layers. Specifically, a SiOx thin film is formed on the anode 12, the electroluminescent layer 13, and the cathode 14 on the glass substrate 11 by vapor deposition using a vacuum vapor deposition machine or the like. Next, the sheet-like heat radiating member 1 and the sealing body 16 are overlapped on the laminate on the glass substrate 11, and the end of the sealing body 16 is closed using the adhesive 17, and then heated and brought into close contact.

  In the method for manufacturing the electroluminescent element 10 according to the fifth embodiment of the present invention, the electroluminescent element 10 can be formed stably and easily. In addition, on the glass substrate 11, the anode 12, the electroluminescent layer 13, the cathode 14, and the gas non-permeable protective film (water-repellent protective film) 15 are sealed with the heat radiating member 1 having high heat conductivity and heat transfer. Since it is formed in close contact with the stationary body 16, heat generated between the two poles of the element is quickly transmitted to the outside, and heat is not accumulated inside the element.

  The heat dissipating member 1 or other heat dissipating sheet or a metal plate may be attached as a heat dissipating plate 1b (heat sink) so as to cover the surface of the sealing body 16 as necessary. The heat transferred from the inside of the element to the sealing body 16 can be more efficiently released to the outside by the heat radiating member 1 or the like.

  Heat generated by an electronic device such as an electroluminescence element according to the present invention is transferred to the heat radiating member 1 having good thermal conductivity as the filling member 1 a through the gas impermeable protective film 15. It becomes possible to efficiently discharge to the outside through the sealing body 16, and the life and characteristics of the electronic device can be improved. Furthermore, the heat transmitted to the sealing body 16 can be more efficiently released to the outside by sticking the heat radiating member 1 to the surface of the sealing body 16 as the heat radiating plate 1b.

  As mentioned above, the case where the heat radiating member of this invention was used for the electroluminescent element was demonstrated. However, the heat radiating member of the present invention is not limited to this, and may be used for an element (organic electronic device) used in an organic transistor or an organic thin film solar cell. Further, in addition to these elements, an active element, a passive element, etc. You may use for this element (electronic device).

  Hereinafter, the present invention will be described in detail with reference to examples. However, the present invention is not limited to the contents described in the following examples.

The component material which comprises the heat radiating member used for the Example of this invention is as follows.
<Resin>
Low density polyethylene (LDPE): Petrocene (trade name) 176 (grade name) manufactured by Tosoh Corporation
High density polyethylene (HDPE): KEIYO polyethylene (trade name) F3001 (grade name) manufactured by Keiyo Polyethylene Co., Ltd.
Linear ultra-low density polyethylene (VLDPE): LumiTac (trade name) 54-1 (grade name) manufactured by Tosoh Corporation
Polypropylene (PP): Novatec PP (trade name) EA9 (grade name) manufactured by Nippon Polypro Co., Ltd.
Cyclic olefin copolymer (COC): TOPAS (trade name) 6017 (grade name) manufactured by Polyplastics Co., Ltd.
Polyphenylene sulfide (PPS): Fortron (trade name) 0220A9 (grade name) manufactured by Polyplastics Co., Ltd.
<Powder>
Synthetic cordierite: SS-1000 (small: average particle size 1.7 μm), SS-600 (medium: average particle size 2.6 μm), SS-200 (large: average particle size 7. 5μm)
Electromelting mullite: M70 (trade name) 325F manufactured by Taiheiyo Random Co., Ltd.
Aluminum oxide: Wako Pure Chemical Industries, Ltd.
Boron nitride: Denkaboron nitride (trade name) SGP manufactured by Denki Kagaku Kogyo Co., Ltd.
Aluminum nitride: High-purity aluminum nitride powder made by Tokuyama Corporation (trade name) H grade (grade name)
Zinc oxide: Panatetra (trade name) WZ-0511 manufactured by Amtec Corporation
Graphite: Scalar graphite powder (F # 2) made by Nippon Graphite
Titanium oxide (white): Titanium dioxide manufactured by Wako Pure Chemical Industries, Ltd. Low-order titanium oxide (black): Tirac D (trade name) manufactured by Ako Kasei Co., Ltd.
Talc: Hayashi Kasei Co., Ltd. micron white (trade name) 5000A (grade name)
Calcium carbonate: NCC # 1010 manufactured by Nitto Flour Industry Co., Ltd.

<Sample preparation>
By using a kneader (labor plast mill (trade name) manufactured by Toyo Seiki Seisakusho Co., Ltd.), kneading the resin and powder at 200 ° C and adjusting the rotation speed so that the torque is 20 N · m. A heat radiating member was produced. After kneading, the kneaded product of the resin and powder returned to room temperature is pressed with a small press (Mini Test Press (trade name) manufactured by Toyo Seiki Seisakusho Co., Ltd.) at a predetermined temperature and pressure, and a thickness of 100 to A 500 μm sheet was prepared and used as an evaluation sample.

<Evaluation> Evaluation of thermal conductivity and thermal diffusivity The sample was subjected to the following measurements using a sheet of about 300 μm.
The thermal conductivity was measured in advance by the specific heat of the heat radiating member (measured with a diamond DSC input compensation type differential scanning calorimeter manufactured by PerkinElmer Co., Ltd.) and specific gravity (MD-300s type electronic hydrometer manufactured by Alpha Mirage Co., Ltd.). It is automatically calculated by measuring the thermal diffusivity by inputting the value into a predetermined term of the thermal diffusivity / thermal conductivity measuring device (mobile phase 1u made by Eye Phase). (ISO22007-3).

<Preparation of heat dissipation member>
[Example 1]
In a polypropylene container, weigh high-density polyethylene (HDPE) pellets and synthetic cordierite powder with a particle size of 7.5 μm so that the weight ratio is 20% by weight: 80% by weight. Mixed. The mixed pellets and powder are introduced into a kneading machine (Laboplast Mill (trade name) manufactured by Toyo Seiki Seisakusho Co., Ltd.), and at 200 ° C. for 20 minutes while adjusting the rotation speed so that the torque is 20 N · m. Kneaded. After kneading, the sample was taken out and cooled to room temperature in the atmosphere. A mold with a thickness of 0.3 mm and an opening of 50 mm × 70 mm is set in a small press (Mini Test Press (trade name) manufactured by Toyo Seiki Seisakusho Co., Ltd.), the above sample is put, and a heating press (hereinafter referred to as heating) The press indicates that pressing is performed at 250 ° C. and 10 MPa for 5 minutes), and the sample of Example 1 (heat radiating member) was obtained.

[Example 2, Comparative Examples 1-3]
Except for the different types of powder, the resin and powder were kneaded in the same manner as in Example 1 and heated and pressed at 250 ° C. and 10 MPa for 5 minutes to obtain samples of Example 2 (heat radiation member) and Comparative Examples 1 to 3.

[Comparative Example 4]
Only the high density polyethylene (HDPE) pellets were hot-pressed at 220 ° C. and 10 MPa for 5 minutes to obtain a sample of Comparative Example 4.

Table 1 shows the types and amounts of filler (added powder) in Examples 1 and 2 and Comparative Examples 1 to 4.

About the produced sample of Examples 1, 2 and Comparative Examples 1-4, the thermal diffusivity was measured with the thermal diffusivity measuring apparatus. The measurement results are shown in Table 2.

  As shown in Table 2, it can be seen that the heat radiating member including cordierite and mullite has a higher thermal diffusivity than the heat radiating member including alumina, and exhibits a heat diffusivity that is trapped in non-oriented boron nitride. Thus, a heat radiating member having a thermal conductivity equivalent to that of alumina or boron nitride widely used in commercially available heat conductive resins is produced by kneading cordierite or mullite and a resin to obtain a heat radiating member. be able to. Boron nitride has problems such as generation of ammonia gas due to hydrolysis and poor adhesion between the resin and boron nitride powder, whereas cordierite and mullite do not have such problems. In addition, cordierite and mullite have a Mohs hardness of about 7, so they do not wear the processing machine as hard as alumina with a hardness of 9. Furthermore, since the heat radiating member containing cordierite and mullite is chemically stable and strong, it is less likely to deteriorate over time like a heat radiating member to which boron nitride is added.

[Examples 3 and 4]
Next, the thermal diffusivity was further improved by increasing the filling rate of cordierite contained in the heat radiating member. 44.4 g of 2.6 μm cordierite and 7.5 μm cordierite so that the number ratio of cordierite with an average particle diameter of 7.5 μm and cordierite with 2.6 μm is about 1: 1. 0.61 g of HDPE and 12.1 g of HDPE were measured, and the resin and cordierite powder were kneaded in the same manner as in Example 1. After heating and pressing, the sample of Example 3 (heat dissipation member) was obtained. In addition, a sample in which only 2.6 μm cordierite was kneaded with HDPE was prepared in the same manner as the sample of Example 4 (heat dissipation member).

表３に示したように、放熱部材に含まれるフィラーの大きさ（平均粒径）を調節し大きい粒子の隙間を小さい粒子で埋めるようにして、コーディエライトの充填率を高くすることにより、熱拡散率が高くなることが判る。 For the samples of Examples 1, 3, 4 and Comparative Example 4, the thermal diffusivity was measured with a thermal diffusivity measuring apparatus, and the specific gravity was measured with an Archimedes method using an electronic hydrometer. Table 3 shows the measurement results.

As shown in Table 3, by adjusting the size (average particle size) of the filler contained in the heat dissipation member and filling the gaps between large particles with small particles, the cordierite filling rate is increased, It can be seen that the thermal diffusivity increases.

[Examples 5 to 11]
Further, in order to adjust the color and thermal diffusivity, the amount of cordierite (filler) and the amount of additional filler added was changed to the weight% in Table 4 as in Example 3 except for Examples 5 to 11. A sample (heat radiating member) was produced.

Table 4 shows the types of additional fillers (powder) in Examples 3 and 5 to 11 and the ratio (% by weight) to cordierite.

About the produced Example 3, 5-11, the thermal diffusivity was measured with the thermal diffusivity measuring apparatus. Table 5 shows the measurement results.

<Production of electronic devices>
[Example 12]
An electroluminescent element was actually produced using the heat dissipating member of the present invention as a filling member, and its temperature change and life were evaluated. In the electroluminescent device, the light emitting functional layer is formed by the method described in Example 1 of the same publication as a layer made of BH1, BD1, and ETM2 described in Comparative Example 3 of Japanese Patent Application Laid-Open No. 2007-27587. The anode and cathode were also produced by the method described in Example 1 of the same publication. Here, the reason why the material of Comparative Example 3 (a layer made of BH1, BD1, and ETM2) of the same publication is selected is that the material of Comparative Example 3 has a relatively low luminous efficiency and a high driving current density. This is because the amount is large and the difference in heat conduction and heat dissipation material is likely to appear.
Specifically, a transparent support substrate was obtained by depositing ITO on a glass substrate to a thickness of 150 nm. This transparent support substrate is fixed to a substrate holder of a commercially available vapor deposition apparatus, and a molybdenum vapor deposition boat containing copper phthalocyanine (hereinafter referred to as the symbol CuPc), N, N′-di (1-naphthyl) -N, Molybdenum vapor deposition boat containing N′-diphenylbenzidine (hereinafter referred to as symbol NPD), the following compound (1) 9-phenyl-10- [6-([1,1 ′; 3,1 ″] Terphenyl-5′-yl) naphthalen-2-yl] anthracene (hereinafter referred to as symbol BH1), a molybdenum vapor deposition boat, and N, N, N which is a styrylamine derivative represented by the following compound (2) Molybdenum vapor deposition boat containing ', N'-tetra (4-biphenylyl) -4,4'-diaminostilbene (hereinafter referred to as symbol BD1), the following compound (7) 9,10-di (2') , 2 A molybdenum vapor deposition boat containing ″ -bipyridyl) anthracene (hereinafter referred to as symbol ETM2), a molybdenum vapor deposition boat containing lithium fluoride, and a tungsten vapor deposition boat containing aluminum were mounted.

The following layers were sequentially formed on the ITO film of the glass substrate. The vacuum chamber is depressurized to 1 × 10 ⁻³ Pa, and first, a vapor deposition boat containing CuPc is heated and deposited to a film thickness of 20 nm to form a hole injection layer, and then NPD The evaporation boat containing was heated and evaporated to a thickness of 30 nm to form a hole transport layer. Next, the vapor deposition boat containing BH1 and the vapor deposition boat containing BD1 were heated at the same time to form a light emitting layer by vapor deposition to a film thickness of 30 nm. The deposition rate was adjusted so that the weight ratio of BH1 to BD1 was 95: 5. Thereafter, the evaporation boat containing ETM2 was heated to a film thickness of 15 nm to form an electron transport layer. The deposition rate of each layer was 0.001 to 3.0 nm / sec.
Thereafter, the evaporation boat containing lithium fluoride is heated to deposit at a deposition rate of 0.003 to 0.01 nm / second so that the film thickness becomes 0.5 nm, and then the evaporation boat containing aluminum is heated. The cathode was formed by vapor deposition at a vapor deposition rate of 0.1 to 1 nm / second so that the film thickness was 100 nm, and an electroluminescent element was obtained.
On the produced electroluminescent element, the SiNx layer was produced using the RF magnetron sputtering apparatus (model number L350S-C) by Canon Anerva Co., Ltd. A commercially available silicon wafer was used for the target, and argon gas and nitrogen gas were used for the sputtering and reaction gas as described in JP-A-2008-240131 (flow rates were 50 sccm each (unit is standard cc). / Min).). The film formation time of SiNx was set to the time when the thickness indicated by the film thickness monitor using the crystal oscillator method became 50 nm.
A sealed body in which a sheet of heat radiating member having a thermal conductivity (thickness: 0.3 mm) prepared in Example 1 of the present invention was placed on the light emitting substrate thus manufactured, and an adhesive was applied to the joint. The adhesive was hardened in a hot air oven at 100 ° C. with care so as not to leave bubbles inside. A pasted thermocouple temperature sensor (ST-50 manufactured by Rika Kogyo Co., Ltd.) is pasted so that the tip contacts the center of the electroluminescent light emitting part of the glass substrate in the produced element, and the temperature Was recorded via a personal computer.

[Example 13]
A heat radiating member having the same composition as that of Example 9 was formed into a sheet having a size of 50 mm square and a thickness of 0.3 μm using a heating press heated to 250 ° C. A graphite sheet (PGS (trade name) graphite sheet manufactured by Panasonic Electronic Device Co., Ltd., 25 μm, 30 mm square) was sandwiched between the two formed sheets, and again formed into a thickness of 0.5 μm with a heating press. . The part (30 mm square) in which the graphite sheet of the obtained laminated board was included was carefully cut out, and it was set as the heat sink.
Another element identical to the element produced in Example 12 was produced, and the heat radiating plate cut into a size covering the sealing body was used as the heat conductive adhesive transfer tape No. Using 9885 (manufactured by Sumitomo 3M Limited), it was attached to the outer surface of the sealed body.

[Comparative Examples 5 and 6]
As Comparative Example 5, a light emitting substrate was formed in the same manner as in Example 12, and then an element was produced without using the heat dissipating member of the present invention as a filling member. Further, as Comparative Example 6, an element was manufactured without using the heat dissipating member of the present invention as the filling member in Example 13.

[Comparative Examples 7 and 8]
As Comparative Example 7, a light emitting substrate was formed in the same manner as in Example 12, and then an element in which an HDPE sheet (thickness of 0.3 mm) was enclosed instead of the heat radiating member of the present invention as a filling member was produced. Further, as Comparative Example 8, an HDPE sheet was enclosed instead of the heat dissipating member of the present invention as the filling member in Example 13 to produce an element.

About the produced Examples 12 and 13 and Comparative Examples 5-8, the temperature (degreeC) at the time of energization 2000 second and the initial 1000 Cd / m < ² > lifetime (hrs.) Of an electroluminescent element (EL element) were measured. Table 6 shows the measurement results.

  From these results, by using the heat dissipation member for electronic devices of the present invention, it is possible to lower the temperature of the electroluminescent element compared to the case where the heat dissipation member for electronic device is not used, and to extend the life of the element. I understand. Further, it can be seen that by using the heat sink of the present invention in combination, it is possible to further reduce the temperature and extend the life.

[Examples 14 to 16]
In the same manner as in Example 3, after preparing a filling member using LDPE, VLDPE, PP instead of resin HDPE, the thermal diffusivity was measured, and Examples 14 to 16 were obtained. Table 7 shows the measurement results.

  From Table 7, it was found that the thermal diffusivity was highest when HDPE was used as the resin. On the other hand, LDPE and VLDPE have a lower softening temperature than HDPE and have a high flexibility when formed into a sheet. Therefore, heating at 80 to 100 ° C. while applying pressure can improve adhesion to the heat generating part. It was. In particular, in an organic electronic device, since an organic compound to be used may be affected at a high temperature, it is preferable to use a resin having a low softening temperature. Moreover, PP has the highest strength. Therefore, it is desirable that the resin used for the heat radiating member of the present invention is appropriately selected from these resins in consideration of thermal diffusivity, adhesion to the heat generating portion, strength, and the like.

[Examples 17 to 21]
Since the filling member filled in the electronic device of the present invention needs to suppress the release of gas from the filling member as much as possible, in the thermally conductive resin composition of nitride such as boron nitride or aluminum nitride as an additional filler Polyolefin with a content of 1.6% by weight and less gas generation was also used as the base resin. Further, if the filler is conductive, it may cause a short circuit or leakage current inside the device. Therefore, the content of graphite or zinc oxide in the thermally conductive resin composition is set to 1.6% by weight.
However, since the heat sink attached to the outer surface of the electronic device has less influence than the case where the problem is used as a filling member filled in the electronic device, the amount of nitride used can be increased. For example, when it is possible to attach a heat dissipation plate having a larger area than that of the electronic device, heat can be radiated from a wider area by increasing the thermal conductivity in the surface direction. For example, such characteristics can be imparted by orienting boron nitride or graphite in the surface direction of the heat sink.

Pellets were produced by kneading the resin having the composition shown in Table 8 (resin composition for heat sink) in the same manner as in Example 3. In Comparative Example 3, the pellets were uniformly spread over the entire surface of the mold so that the plate-like boron nitride was difficult to be oriented and heated and pressed. In Examples 17 to 19, the pellets were stacked at the center of the mold, By performing the heat press, the plate-like particles could be oriented to some extent along the flow of the resin. Since the boron nitride particles are plate-shaped and easily transmit heat in the plane direction, by orienting, the heat can be diffused in the in-plane direction of the heat radiating plate to efficiently dissipate heat from a wider area. In addition, cordierite was used by mixing in advance so that the ratio of the number of two kinds of large and small particles was 1: 1 as in Example 3.
A sheet of the heat radiating member produced by heating press was cut into a 5 cm square, a device was produced in the same manner as in Example 13, and affixed to the outer surface of the sealed body so that the portion protruding from the device was 1 cm everywhere. In addition, the sheet | seat (thickness of 0.3 mm) of the heat radiating member which has the heat conductivity produced in Example 1 of this invention was used for the filling member. The thermal characteristics of the device were evaluated by recording the temperature at the center of the light emitting part as in Example 13.

  As can be seen from Table 9 (resin evaluation result table for heat sink), when an external heat sink having a larger area than the device can be used, the resin formed by increasing the proportion of filler having high thermal conductivity to the heat sink By using, further improvement of heat dissipation characteristics can be realized.

  According to the heat dissipating member for electronic devices of the present invention, it becomes difficult for heat to accumulate in the electroluminescent element in which electrodes and the like are formed, and the heat dissipating effect of the element is improved. Moreover, such an electroluminescent element can be formed stably and easily. As a result, an electroluminescent element with improved lifetime and characteristics can be obtained by the heat dissipation member for electronic devices of the present invention.

DESCRIPTION OF SYMBOLS 1 Heat dissipation member 1a Filling member 1b Heat sink 10, 10 'Electronic device, organic electronic device, electroluminescent element 11 Substrate 12 1st electrode, anode 13 Organic thin film layer, electroluminescent layer 14 2nd electrode, cathode 15 Gas impermeable protective film, water repellent protective film 16 Sealed body
17 Adhesives 20 and 20 ′ Electroluminescent element 21 Glass substrate 22 Anode 23 Electroluminescent layer 24 Cathode 25 Desiccant 26 Sealing body 27 Adhesive 28 Internal space 29 Water repellent protective film

Claims (11)

An electronic device radiating member composed of a thermally conductive resin composition containing an orthorhombic silicate mineral filler and a resin,
The electronic device heat dissipation member is at least one selected from the group consisting of a filling member filled in the electronic device and a heat dissipation plate provided on the surface of the electronic device.
Heat dissipation member for electronic devices. The orthorhombic silicate mineral is cordierite or mullite.
The heat radiating member for electronic devices according to claim 1. The thermally conductive resin composition serving as the filling member further includes at least one additional filler selected from the group consisting of boron nitride, aluminum nitride, silicon carbide, alumina, magnesia, silica, rutile titanium oxide, and zinc oxide. ,
The heat radiating member for electronic devices according to claim 1 or 2. The thermally conductive resin composition to be the heat radiating plate further includes at least one additional filler selected from the group consisting of graphite and low-order titanium oxide.
The heat radiating member for electronic devices according to claim 1 or 2. The resin contains 35 to 95% by weight of the filler and the additional filler,
The additional filler is 1 to 70% by weight based on the filler,
The filler is a powder and has an average particle size of 0.1 to 200 μm.
The heat radiating member for electronic devices according to claim 3 or 4. The resin is at least one resin selected from the group consisting of polyolefin, polystyrene, polycarbonate, and polyethylene terephthalate.
The heat radiating member for electronic devices of any one of Claims 1-5. The resin is at least one resin selected from the group consisting of polyethylene and polypropylene.
The heat radiating member for electronic devices according to claim 6. A base substrate;
A first electrode formed on one side of the substrate;
An organic thin film layer formed on the first electrode;
A second electrode formed on the organic thin film layer;
A gas impermeable protective film covering the first electrode, the organic thin film layer, and the second electrode;
The heat dissipating member for an electronic device according to any one of claims 1 to 7, which is placed on the gas impermeable protective film;
A sealing body formed on the heat dissipation member for the electronic device and fixed to the substrate;
Electronic devices. A base substrate;
A first electrode formed on one side of the substrate;
An organic thin film layer formed on the first electrode;
A second electrode formed on the organic thin film layer;
A gas impermeable protective film covering the first electrode, the organic thin film layer, and the second electrode;
A sealing body formed above the gas impermeable protective film and fixed to the substrate;
A heat dissipation member for an electronic device according to any one of claims 1 to 7 placed on the sealing body;
Electronic devices. Forming a first electrode on one surface of a base substrate;
Forming an organic thin film layer on the first electrode;
Forming a second electrode on the organic thin film layer;
Coating a gas impermeable protective film on the second electrode;
A step of laminating the heat dissipating member for an electronic device according to any one of claims 1 to 7 on the gas impermeable protective film;
Forming a sealing body on the heat dissipating member for the electronic device and fixing to the substrate;
Electronic device manufacturing method. Forming a first electrode on one surface of a base substrate;
Forming an organic thin film layer on the first electrode;
Forming a second electrode on the organic thin film layer;
Coating a gas impermeable protective film on the second electrode;
Forming a sealing body above the gas impermeable protective film and fixing it to the substrate;
A step of covering the sealing body with the heat dissipating member for an electronic device according to any one of claims 1 to 7;
Electronic device manufacturing method.

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