JP2012109485A - Bare chip mounting surface light-emitting body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bare chip mounting surface light-emitting body which can achieve a desired luminous color without relying upon electronic control for the light-emitting diode.SOLUTION: The surface light-emitting body L1 comprises: a resin board (printed circuit board) 1; a metal foil 2 which is pasted on the resin board 1, pressed to form a pinhole 10 as an anchor on the board 1 and etched into a predetermined wiring pattern 20, a blue bare chip 3B and a yellow bare chip 3Y to which electrodes 30 and 31 are connected via auxiliary plating 4 and gold plating 5 as a plating layer P applied on the wiring pattern 20, a print layer 7 which is formed excepting at least a region connected with the electrodes 30 and 31 and a region to be punched or cut, and a coating layer 8 applied flatly and entirely on the resin board 1.

Description

  The present invention relates to a surface light emitter that directly mounts a bare chip on a substrate, and more particularly to a bare chip mount surface light emitter that can realize a desired light emission color without electronic control of a light emitting diode.

The light emitting diodes emitting red, green and blue light have the three primary colors of light, and the desired light emitting color can be realized only by electronic control over the light emitting diodes.
At present, it has become clear that not all three colors can be reproduced with these three primary colors, and attempts have been made to expand the range of colors that can be reproduced by using more than three primary colors.

However, there is a problem of compatibility due to the difference in materials and structures constituting the light-emitting diodes, and in order to obtain a desired color, complicated control is required to drive light emission to each light-emitting diode (patent) Reference 1).
Further, a conventional surface light emitter includes a plurality of mounting-type LED units in which a bare chip is sealed for each resin base, or a plurality of bullet-type LED units (hereinafter, these are sealed with a bullet-shaped resin cover for each bare chip. Are collectively referred to as a bullet-type LED unit in this application) and a diffuser plate is fixed to the base member. However, the technical limitation that color mixing is difficult because the straight-line light of the bullet-type LED unit is strong. was there.

JP 2006-344913 A

  Accordingly, an object of the present invention is to provide a bare chip mounting surface light emitter capable of realizing a desired light emission color without using electronic control over the light emitting diode.

  In order to solve the above problems, a substrate on which a wiring pattern is formed, a bare chip of at least a group of light emitting diodes (LEDs) connected to the wiring pattern and having the same emission color, and connected to the wiring pattern. In addition, the bare chip mounting includes a bare chip of a light emitting diode that is mixed in the bare chip group and has a different light emission color hue, and a coating layer that coats the entire substrate. A surface light emitter (invention of claim 1) was obtained.

The light emission of the bare chip group of the light emitting diode is different from the light emission and hue, and the light emission of the bare chip of the light emitting diode mixed in the bare chip group is diffused by the coating layer, emitted from the coating layer, and visually By mixing the colors, it is possible to provide a surface light emitter that uses the light emitted from these light emitting diodes as a light source color.
That is, in the present invention, the light emission of the bare chip group of the light emitting diode and the light emission of the bare chip of the light emitting diode mixed in the bare chip group are diffused by the coating layer, so that color mixing can be facilitated. In the cannonball type LED unit, since the light straightness is strong, the technical limit that color mixing is difficult is eliminated.

In order to solve the above problems, a substrate on which a wiring pattern is formed, a group of light emitting diode bare chips connected on the wiring pattern and having a hue of light emission color having a color relative ratio relationship, and coating the entire substrate A bare chip mounting surface light emitter (invention of claim 2) characterized in that it is provided with a coating layer.
Light emitted from the bare chip of the group of light emitting diodes whose hues have a color relative ratio relationship is diffused by the coating layer and emitted from the coating layer. Therefore, surface light emission is realized for each group, and thus a surface light emitter that easily exhibits the effect of the color relative ratio can be provided.
In other words, the conventional bullet-type LED unit has a limitation in that surface emission is difficult due to strong straightness of light. However, in the present invention, surface emission is achieved by diffusing light emitted from the bare chip of the light emitting diode by the coating layer. Can be realized to facilitate the relative color ratio.

The light emission color of the bare chip group and the light emission color of the bare chip are in a complementary color relationship, and the light emission color of the bare chip groups in a color relative ratio relationship is also in a complementary color relationship ( Invention of Claim 3 or 4).
In the present application, the color relative ratio means that when a background color and a color placed thereon are compared at the same time, the color appears to have a different hue due to the background color. When the hue is complementary, the color is most strongly affected by the background color.

  According to the above invention, it is possible to provide a surface light emitter of a light source color obtained by combining a bare chip of two types of light emitting diodes having different hues of light emission colors and a coating layer. For example, display devices, various industries, lighting devices used in daily life, and lighting devices used in the agricultural field can be assumed.

The perspective view of the illuminating device using the bare chip mounting surface light emitter, 1 is a longitudinal sectional view of FIG. FIG. Manufacturing process explanatory diagram of bare chip mounting surface light emitter, The top view of the illuminating device using the bare chip mounting surface light emitter, Manufacturing process explanatory drawing of another example bare chip mounting surface light emitter, Plan view of another example bare chip mounting surface light emitter, An enlarged plan view of a convex coating layer constituting the same surface light emitter, Schematic cross-sectional view of the same surface light emitter, Schematic cross-sectional view of the same surface light emitter, Vertical schematic cross-sectional view of the same surface light emitter, Vertical schematic cross-sectional view of the same surface light emitter, Process explanatory drawing of the same surface light emitter, Plan view of another example bare chip mounting surface light emitter, An enlarged plan view of a convex coating layer constituting the same surface light emitter, FIG. 16 is a main part cross-sectional view taken along the line AA illustrated in FIG. 15.

  The bare chip mounting surface light emitter L (hereinafter abbreviated as “surface light emitter L”) of the present invention shown in FIG. 1 can be applied to an illumination device arranged indoors, for example, an illumination device arranged in a plant growing factory. It is assumed that bare chips 3B of blue light emitting diodes (hereinafter referred to as blue bare chips 3B) are arranged in a matrix on the wiring pattern of the resin substrate 1, and yellow light emitting diodes are included in the group of blue bare chips 3B. Bare chips 3Y (hereinafter referred to as yellow bare chips 3Y) are arranged in a scattered manner, and the blue bare chip 3B and the yellow bare chip 3Y are covered with the coating layer 8.

  According to such a surface light emitter L, the light emission of the blue bare chip 3B and the light emission of the yellow bare chip 3Y having different hues are diffused and mixed by the coating layer 8, and emitted from the coating layer 8, respectively. The light source color obtained by light emission of the light emitting diode can be provided in the form of a surface light emitter without intervention.

A configuration example of the surface light emitter L will be described.
As shown in FIGS. 2 and 3, the surface light emitter L is attached to the resin substrate 1 (printed substrate) 1 and the resin substrate 1 and is pressed to provide an anchor portion on the substrate 1. In addition, a metal foil 2 etched into a predetermined wiring pattern 20, and electrodes 30, 31 through auxiliary plating 4 and gold plating 5 as a plating layer P applied on the wiring pattern 20 are formed. The bare blue chip 3B and the yellow bare chip 3Y connected to each other, the printed layer 7 formed at least excluding the region to which the electrodes 30 and 31 are connected and the region to be punched or cut, and the entire resin substrate 1 in a flat shape A coating layer 8 to be coated is provided.

  As the resin substrate 1, it is desirable to use a heat-resistant organic resin substrate having excellent heat dissipation performance, and specifically, a phenol resin-based substrate containing a thermally conductive filler is used. An epoxy resin substrate, a glass woven epoxy resin substrate, a glass nonwoven fabric epoxy resin substrate, or the like may be used.

The metal foil 2 forms the wiring pattern 20. For example, a material having excellent conductivity such as copper, silver, gold, or platinum is used, and an inexpensive copper foil is preferably used. A large number of protrusions 21 are formed in advance on the back surfaces of these metal foils.
The wiring pattern 20 is formed in the horizontal or vertical direction of the resin substrate (printed substrate) 1 through a through hole or the like so as to connect the blue bare chip 3B and the yellow bare chip 3Y in series.

The blue bare chip 3B uses, for example, an InGaN compound semiconductor having a peak wavelength of 465 nm.
The yellow bare chip 3Y uses, for example, an InGaN-based compound semiconductor having a peak wavelength of 590 nm.

The ratio of mixing the yellow bare chip 3Y with the blue bare chip 3B may be about 1 to 20 percent. Preferably, the mixing ratio of the yellow bare chips 3Y to the blue bare chips 3B is about 1 to 10 percent, and more preferably around 5 percent. However, the mixing ratio varies depending on the product, the required light, the installation location of the surface light emitter L, and the like.
In addition, regarding light emitting diodes that are capable of emitting monochromatic light at present, the following combinations are given as examples of light emission colors suitable for color mixing.
A combination of a green light emitting diode bare chip and a red light emitting diode bare chip, a combination of an orange light emitting diode bare chip and a green light emitting diode bare chip, and a combination of an orange light emitting diode bare chip and a blue light emitting diode bare chip are assumed.
Here again, it is preferable that light emission of other light emission colors is performed at a rate of about 1 to 10% with respect to light emission diodes of light emission diodes having a large ratio among the light emitting diodes mixed (referred to as main light emission color). Diodes may be mixed, and light emitting diodes of other light emission colors are mixed preferably at a rate of about 5 percent.
In the future, if a light emitting diode capable of emitting green, blue, green, yellow green, and purple red is developed, a combination of a purple light emitting diode bare chip and a yellow green light emitting diode bare chip, a green blue light emitting diode And a combination of a bare chip of a blue light emitting diode and a bare chip of a red light emitting diode are assumed.

The auxiliary plating 4 is preferably nickel plating on which a hard film is formed. The auxiliary plating 4 is formed by electroless plating, as shown in FIGS. 2 and 3 and the like, as shown in FIG. 2 and FIG. 3 and the like, to connect each electrode 30 of each blue bare chip 3B and each yellow bare chip 3Y and gold wire 6 connecting each electrode 31. It is applied to the wire bonding point pattern part.
The plated layer P is constituted by the auxiliary plating 4 and / or the gold plating 5 in this embodiment, but is not limited to these materials.

  The gold plating 5 applied on the auxiliary plating 4 is formed by electroless plating and is suitable for high-density mounting.

  The gold wire 6 is required to have good ohmic properties, mechanical connectivity, electrical conductivity and thermal conductivity with the electrodes 30 and 31 of the blue bare chip 3B and the yellow bare chip 3Y. Specifically, gold, Examples thereof include conductive wires using metals such as copper, platinum, and aluminum, and alloys thereof.

The printed layer 7 is for concealing the wiring pattern 20 and adjusting the reflectance of the light emitter, and forms a printed layer having a color suitable for the light source color.
The printing method of the printing layer 7 is not specifically limited, For example, printing methods, such as silk printing, gravure printing, and offset printing, can be used, Usually, silk printing is performed.

  The coating layer 8 forms the surface of the resin substrate 1 in a flat shape, and the flattening prevents the light emitted from the coating layer 8 from being emitted irregularly.

  The coating layer 8 is transparent and uses, for example, rapid-curing epoxy acrylic. Other acrylic resins or epoxy resins may be used.

Next, a method for manufacturing the surface light emitter L configured as described above will be described with reference to FIGS.
(A) A metal foil 2 having a large number of protrusions 21 is attached on the resin substrate 1 by biting the protrusions 21 into the resin substrate 1 (FIG. 4A).
That is, an adhesive is applied in advance to the attachment surface of the metal foil 2, and pressure bonding is performed so that the protrusions 21 bite into the resin substrate 1.

(B) The metal foil 2 is formed on a predetermined wiring pattern 20 (FIG. 4B).
That is, the metal foil 2 is etched to form a predetermined wiring pattern 20.
The formation method of the wiring pattern 20 can be performed using a conventionally known technique such as an etched foil method. The pinhole 10 formed by the biting of the protrusion 21 remains on the surface of the resin substrate 1 from which the metal foil has been removed by this etching.

(C) The auxiliary plating 4 and the electroless gold plating 5 are formed on the predetermined wiring pattern 20 so as to overlap (FIG. 4C).
On the wiring pattern 20 to which the blue bare chip 3B is fixed and the wiring pattern 20 adjacent thereto, the mounting density can be increased by electroless plating, and nickel having a strong film is plated. Next, a gold plating 5 is applied on the auxiliary plating 4 by electroless plating.
Similarly, the auxiliary plating 4 and the electroless gold plating 5 are stacked on the wiring pattern 20 to which the yellow bare chip 3Y is fixed and on the wiring pattern 20 adjacent thereto.

(D) A printing layer 7 is formed in a region excluding at least a region where the gold plating 5, the blue bare chip 3B, and the yellow bare chip 3Y are disposed (FIG. 4D).
These printing layers 7 are formed by silk printing.
At this time, in the present invention, when the surface light emitter L is divided by secondary processing such as punching or cutting with respect to the surface light emitter L by adjusting the range of the printed layer 7, The printed layer 7 is not formed in the region to be formed.

(E) The blue bare chip 3B and the yellow bare chip 3Y are bonded and fixed on the wiring pattern 20 and bonded to the gold plating 5 using the gold wire 6 (FIG. 4E).
Further, the yellow bare chip 3Y is bonded and fixed to the blue bare chip 3B on the wiring pattern 20 and bonded to the gold plating 5 by using the gold wire 6 (FIG. 4E). ))
That is, for example, one electrode (for example, the N-side electrode) 30 of the blue bare chip 3B is directly connected to the wiring pattern 20, and the other electrode (for example, the P-side electrode) 31 is connected to the adjacent wiring pattern 20 by the gold wire 6. It is connected to the gold plating 5 above. The electrodes and wiring of each blue bare chip 3B and yellow bare chip 3Y can be easily connected by wire bonding equipment. In this case, as described above, the auxiliary plating 4 depends on the welding machine applied to the bonding point. The resin substrate 1 is protected from deformation by heat welding and pressure welding, and the reliability of bonding is improved.

(F) The first coating layer 8 is formed in a flat shape (FIG. 4 (F)).

  In the above process, the pinhole 10 of the anchor portion is formed by adhering the metal foil 2 on the resin substrate 1 and pressurizing it, but the anchor portion is previously formed on the substrate such as aluminum by sandblasting etc. A body may be formed, and a wiring pattern may be formed by plating or the like. Alternatively, an anchor may be mechanically formed after an insulator is formed on a substrate such as aluminum and a wiring pattern is formed by plating or the like.

The effects of the surface light emitter L configured as described above are as follows.
(1) The light emission of the bare chip group of the blue bare chip 3B having a different hue and the light emission of the yellow bare chip 3Y mixed in the bare chip group are diffused by the coating layer 8, emitted from the coating layer 8, and mixed color visually. Is done.
That is, it is possible to provide a bare chip mounting surface light emitter having a desired light emission color without performing electronic control on the light emitting diode.
(2) In the conventional surface light emitter, the straightness of light of the bullet-type LED unit is strong, which may give a sense of incongruity. It is easy to be done and can suppress a sense of incongruity.
(3) Since the coating layer 8 is in the pinhole 10 left on the resin substrate 1, the adhesion to the resin substrate 1 is extremely high. For this reason, by using the region where the coating layer 8 has digged into the pinhole 10 and performing secondary processing such as punching or cutting with a press, without causing separation between the resin substrate 1 and the coating layer 8, A surface light emitter L having a desired shape can be obtained.
(4) The surface light emitter of the present invention can provide a thin, light, excellent waterproof and inexpensive surface light emitter due to the fact that a diffusion plate is unnecessary and the following elements.
That is, the auxiliary plating 4 protects the resin substrate 1 from being deformed by heat welding and pressure welding by a welding machine applied to the bonding point, and improves bonding reliability. Therefore, by interposing the auxiliary plating 4 under the gold plating 5, the blue bare chip 3B and the like can be mounted on a thin resin substrate (for example, a thickness of 0.3 mm).
Further, by this action, the surface light emitter L having a thickness of 1.3 mm ± 0.1 including the coating layer 8 applied to the surface of the resin substrate 1 can be manufactured.
(5) Also, the anchor effect of the pinhole 10 formed on the substrate 1 enhances the adhesion and adhesion of the coating layer 8 to the substrate 1, and is excellent in impact resistance, vibration resistance, and waterproof resistance. It is a surface light emitter that can be used as it is.
(6) There is no need to build a bullet-type LED unit in a separate process, and the bare chip mounting surface light emitter L can be produced in a single process from mountain mounting to coating on the resin substrate 1. That is, in the past, the shell type LED unit was made by the package manufacturer, purchased by the lighting equipment manufacturer, and mounted on the board. However, in the present invention, the predetermined emission color can be efficiently performed with a small number of steps at a time. The surface light emitter L can be produced.

  In addition, an epoxy resin can be used as a coating material, and the curing agent used for this is not particularly limited as long as it exhibits a curing reaction with an epoxy resin, and a known curing agent is used. For example, a phenol resin Or an acid anhydride is preferable. In particular, when an acid anhydride curing agent is used, it is more preferable to use an acid anhydride because the optical properties of the cured product are remarkably improved.

  In addition, conventionally known additives such as antioxidants, colorants, coupling agents, modifiers, light (ultraviolet rays, visible rays, infrared rays) absorbers, fillers, and the like are added to the above resin compositions as necessary. Can be blended.

Next, a configuration example of the bare chip mounting surface light emitter L1 (hereinafter, simply referred to as a surface light emitter L1) of the present invention will be described.
The surface light emitter L1 includes a group of light-emitting diode bare chips and a group of light-emitting diode bare chips having a color relative ratio to the bare chips of the light-emitting diodes on the wiring pattern of the resin substrate 1. They are arranged adjacent to each other, and these bare chips are covered with a coating layer.
For example, as shown in FIG. 5, a group of red light emitting diode bare chips 3R (hereinafter referred to as red bare chips 3R) is arranged along the outline of letters “A, B, C”, while blue light emitting diodes are used as the background color. A group of bare chips 3B (hereinafter referred to as blue bare chips 3B) is arranged, and the blue bare chips 3B and red bare chips 3R are covered with a coating layer 8.

  More specifically, the surface light emitter L1 is attached to the resin substrate 1 and the resin substrate 1 and pressed to form the pinhole 10 as an anchor portion on the resin substrate 1, Electrodes 30 and 31 are connected via a metal foil 2 etched to a predetermined wiring pattern 20, an auxiliary plating 4 and a gold plating 5 as a plating layer P applied on the wiring pattern 20, and A and B And a group of red bare chips 3R arranged so as to fill in the character outlines of C and C, and the electrodes 30, 31 are connected via the plating layer P, and are filled outside the character outlines of A, B and C. A group of blue bare chips 3B to be arranged, a printed layer 7 formed at least excluding a region to which the electrodes 30 and 31 are connected and a region to be punched or cut, and a flat shape on the entire resin substrate 1 And a coating layer 8 to be Kotikungu.

The red bare chip 3R uses, for example, a GaP compound semiconductor having a peak wavelength of 700 nm.
Each other configuration is the same as each configuration of the surface light emitter L, and detailed description thereof is omitted.

The manufacturing method of the surface light emitter L1 is substantially the same as the manufacturing method of the surface light emitter L, and the different procedure is that the red bare chip 3R is formed on the wiring pattern 20 in the step (E). , B, and C are arranged so as to fill the inside of the character outline, and A, B, and C are arranged so as to fill the outside of the character outline.
It is desirable to provide a barrier along the character outline of A, B, C, etc. to avoid color mixing of the luminescent colors in the boundary region of the character or the like with a silk dam described later.

According to the surface light emitter L1 as described above, in addition to the effects (1) to (6) above, (7) light emission of the group of red bare chips 3R is enhanced by light emission of the group of blue bare chips 3B. As a result, a complementary color effect is exhibited.
Other configurations and effects are the same as those of the surface light emitter L.

Next, a manufacturing method and a configuration example of the bare chip mounting surface light emitter L2 (hereinafter simply referred to as a surface light emitter L2) of the present invention will be described with reference to FIG. Detailed description of the same configuration as that of each of the surface light emitters is omitted.
The step in which the surface light emitter L2 is different from each of the surface light emitters is as follows: (F ′) the resin substrate 1 is heated and the coating material C dropped on the resin substrate 1 is heated after the step (E). Then, the heated coating material C is branched into several strips corresponding to the width of the resin substrate and dropped, and as the step (G), the coating material C is cured and then printed on the surface thereof. It is that a process can be added.

That is, as shown in FIG. 6 (F ′), the resin substrate 1 is heated using a heating means H composed of a heater or the like, and the heated coating material C is heated using an injection means PO. Corresponding to the width of the resin substrate 1, it is branched into several strips and dropped. The temperature at the time of heating is preferably about 50 ° C to 70 ° C. At this time, in order to prevent “sag” of the coating material C, a fence means may be provided on the outer periphery of the resin substrate 1.
Thereafter, as shown in FIG. 6G, after the hardening of the coating layer 8 is confirmed, the printing layer 81 may be formed on the surface thereof.

  Through the steps as described above, the anchor portion 10 is formed on the substrate 1 and the substrate 1 is etched by being applied to the predetermined wiring pattern 20 by being applied to the resin substrate 1 and pressed. Metal foil 2, bare chip 3 of a light emitting diode to which electrodes 30 and 31 are connected via plating layer P applied on wiring pattern 20, a region where bare chip 3 is disposed, and a region to be punched or cut It is possible to obtain a bare chip mounting surface light-emitting body L2 including a printed layer 7 formed by removing at least the substrate, a smooth coating layer 8, and a printed layer 81 formed by printing directly thereon. .

The effects of the surface light emitter L2 as described above are as follows in addition to the effects (1) to (7).
(8) The coating material C itself is heated to lower the viscosity, and the heating is the resin substrate 1
The resin substrate 1 itself is also heated so as not to be affected by this, and since the coating material C is branched and dropped in several strips, the wavelength of the undulation of the coating material C can be reduced and the dropping time can be reduced. The smoothness of the coating layer 8 can be increased.
That is, factors relating to the smoothing of the liquid coating material include the viscosity and surface tension of the coating material, the thickness of the coating film, and the undulation (wavelength) of the peaks and valleys formed by the dropped coating material. And smoothing is accelerated | stimulated, so that a viscosity is low, surface tension is high, the thickness of a coating film is thick, and the wavelength of a wave | undulation is small.
Further, since the viscosity of the coating material increases with time, it is desirable to reduce the dripping time of the coating material with respect to the coating material application area in order to increase the smoothing accuracy.
Therefore, in the present invention, focusing on the viscosity of the coating material and the waviness of the coating material among these elements, the coating process is improved and the smoothing accuracy can be increased.
(9) Since the smoothness of the coating layer 8 can be increased, it is possible to continuously serialize from mounting the bare chip to the substrate to printing on the surface light emitter.
(10) Since the coating layer 8 is printed directly, the printed layer 81 can be projected vividly by reaching the printed layer 81 without the light intensity of the bare chip 3 being attenuated.
(11) Since the light emitting surface is smoothed, the angle of view (viewing angle) of light irradiated from the light emitting surface can be expanded.
Other effects are the same as those of the surface light emitter L.

Next, a configuration example of the bare chip mounting surface light emitter L3 (hereinafter, simply referred to as a surface light emitter L3) of the present invention will be described with reference to FIGS. Detailed description of the same configuration as that of each of the surface light emitters is omitted.
The surface light emitter L3 is different from the surface light emitters in that the convex coating layer 8A is uniformly formed on the bare chip 3B and the like, and the coating layer 80 (the same as the coating layer 8) is further formed thereon. It is a structure).

The convex coating layer 8A is dripped from above the blue bare chip 3B and hardened, and is formed on a convex lens as shown in FIG.
Although the convex coating layer 8A is formed in a lens shape, it may be a curved surface having a curved surface or a curved surface partially having a flat surface.
Further, in this embodiment, the convex coating layer 8A is formed only on the main body of the blue bare chip 3B or the like, but the convex coating is included so as to include the wiring pattern portion to which the gold wire 6 is connected as shown in FIG. The layer 8A may be formed.

Next, a method for manufacturing the surface light emitter L3 configured as described above will be described with reference to FIG.
In the process diagram of FIG. 13, steps common to the process diagram of FIG. 6 are denoted by the same drawing number, and the process shown in FIG. 13E ′ is different from the process of FIG.
That is, as the step (E ′), the coating material C is dropped onto the blue bare chip 3B or the like and cured to form the convex coating layer 8A (FIG. 13E ′).

In the surface luminous body L3 comprised as mentioned above, in addition to the effect to said (1)-(11), there exist the following effects.
(12) The light rays emitted from the lens-like convex coating layer 8A are diffused and emitted in a wide range, and these light rays are emitted from the coating layer 80, and therefore, combined with the coating layer 80 whose smoothness is increased. A uniform surface light emitter can be obtained.
Other configurations and effects are the same as those of the above embodiment.

Next, a configuration example of the bare chip mounting surface light emitter L4 (hereinafter, simply referred to as a surface light emitter L4) according to the present invention will be described with reference to FIGS.
The surface light emitter L4 is different from each of the surface light emitters in that a circular silk dam 71 is provided around the position where the blue bare chip 3B and the like on the substrate 1 are arranged, and the convex coating layer is provided. 8A is formed uniformly and adjacent to each other at equal intervals or substantially equal intervals. Other configurations are the same as those of each of the surface light emitters. Detailed description is omitted.

The silk dam 71 exhibits the following functions.
Firstly, the shape of each convex coating layer 8A can be formed uniformly, and secondly, the arrangement of each convex coating layer 8A with respect to the substrate is equally spaced as evenly as possible. And so on.
That is, it does not prevent the fluid coating material forming the convex coating layer 8A from flowing out to an unintended region, as in a normal silk dam.
In this embodiment, the silk dam 71 has a diameter of about 5 mm, a width of about 0.3 mm, and a thickness of about 0.2 mm.
Instead of the silk dam 71, a ring-shaped pattern may be formed using a resist coated on the substrate surface, and this may be used as a bank portion.

The manufacturing method of the surface light emitter L4 configured as described above is as follows. In the manufacturing process (D) of each surface light emitter, (D ′) along the outer periphery of the circular region 70 where the gold plating 5 and the bare chip 3B are disposed. Then, the silk dam 71 is formed, and the printing layer 7 is formed in a region excluding at least the silk dam 71.
The printed layer 7 and the silk dam 71 are formed by silk printing.

In the surface light emitter L4 configured as described above, in addition to the effects (1) to (12) described above, the following operational effects are achieved.
(13) Since the shape of each convex coating layer 8A is uniformly formed, and the arrangement of each convex coating layer 8A with respect to the substrate is positioned as evenly and as evenly as possible, a uniform surface It can be set as a light emitter.
Other effects are the same as those of each of the surface light emitters.

L L1 L2 L3 L4 Bare chip mounting surface light emitter 1 Resin substrate 10 Pinhole (anchor part)
2 Metal foil 20 Wiring pattern 21 Protrusion 3B 3Y 3R Bare chip 30 31 Electrode P Plating layer 4 Auxiliary plating 5 Gold plating 6 Gold wire 7 Printing layer 8 Coating layer 80 Coating layer 81 Printing layer

Claims (4)

  A substrate on which a wiring pattern is formed, a bare chip of at least one group of light emitting diodes that are connected on the wiring pattern and have the same emission color, and are connected to the wiring pattern and mixed in the bare chip group In addition, the bare chip mounting surface light emitter includes a bare chip of a light emitting diode whose emission color is different from that of the bare chip, and a coating layer that coats the entire substrate.   A substrate on which a wiring pattern is formed, a group of light emitting diode bare chips connected to the wiring pattern and having a hue of light emission color in a color relative ratio, and a coating layer for coating the entire substrate. Bare chip mounting surface light emitter characterized by the above.   The bare chip mounting surface light emitter according to claim 1, wherein a light emission color of the bare chip group and a light emission color of the bare chip are in a complementary color relationship.   3. The bare chip mounting surface light emitting device according to claim 2, wherein the bare chip group has a complementary color relationship with a light emission color between the bare chip groups, which has a color relative ratio relationship.

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