JP2012109470A - Surface-emitting laser module, optical scanning device, and image forming apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface-emitting laser module that is low in price and has a construction with high air permeability.SOLUTION: A surface-emitting laser module includes: a surface-emitting laser array element 50 where a surface-emitting laser is formed which emits light in a direction vertical to a substrate surface; a package 20 where a recess portion is provided to install the surface-emitting laser array element; and a transparent substrate 40 connected with the package on a light emission side of the surface-emitting laser element. First step portions 23 and 24 are respectively provided for two opposing sides of the recess portion and a second step portion 25 is provided for one of remaining two sides of the recess portion. The second step portion is provided at a position higher than the first step portions, the first step portions are provided at positions higher than the surface-emitting laser array element and wiring 22, a protrusion portion 27 is provided for a corner formed by one of the sides provided with the first step portions and a side not provided with the first and second step portions, and a notch portion 41 is provided for a portion of the transparent substrate corresponding to the protrusion portion.

Description

  The present invention relates to a surface emitting laser module, an optical scanning device, and an image forming apparatus.

  In recent years, higher-definition image quality is required in multicolor image forming apparatuses. For this reason, the speed is increasing year by year and it is being used for simple printing as an on-demand printing system. Specifically, by using a two-dimensional array element having a configuration in which surface-emitting lasers are two-dimensionally arranged, the sub-scanning interval on the photosensitive member can be reduced to 1 / n of the recording density, and the unit pixel is An n × m multiple dot matrix configuration can be formed. (For example, Patent Documents 1 and 2)

  Further, in an optical system generally including a semiconductor laser element including a surface emitting laser element, return light, that is, light that is reflected from a lens or a cover glass is emitted and enters the laser element. In such a case, the light quantity fluctuation of the laser element occurs. For this reason, the thing of the structure which inclined the cover glass in order to prevent light amount fluctuation | variation is disclosed. (For example, Patent Documents 3 and 4)

  Further, when a chip is installed inside the package, if the package is completely sealed, dew condensation occurs inside the package due to moisture or the like. For this reason, the thing of the structure which provided the clearance gap and the linear through-hole in the package is disclosed. (For example, Patent Documents 5 and 6)

  By the way, in the case of a surface-emitting laser element such as a surface-emitting laser array in which surface-emitting lasers are two-dimensionally arranged, the number of electrodes is large. When trying to insert, the shape of the housing becomes large. For this reason, as a housing for installing the surface emitting laser array chip, a structure in which a concave package and a cover glass are combined has been devised.

  The surface emitting laser array chip is installed in such a combination of a concave package and a cover glass by fixing the surface emitting laser array chip on which the surface emitting laser array is formed to the concave bottom of the package. This is done by connecting the electrodes provided on the surface emitting laser array chip and the electrodes provided on the concave bottom of the package by wire bonding. After this, the cover glass is placed on top of the concave package.

  By the way, in a surface emitting laser module having a structure in which a concave package and a cover glass are combined, it is desired to manufacture the surface emitting laser module in a short time and at a low cost in order to reduce the price. Further, in the case where a linear through hole is provided in a concave package or cover glass, dust or the like may enter from the through hole. Therefore, a structure in which dust or the like does not enter as much as possible is desired.

  The present invention has been made in view of the above, and in a surface-emitting laser module housed in a concave package, a surface-emitting laser having a structure that can be easily installed in a short time when a cover glass is installed. An object of the present invention is to provide a surface emitting laser module having a highly air-permeable structure that does not allow dust or the like to enter through a through-hole formed in a package as much as possible. Furthermore, an object of the present invention is to provide an optical scanning device and an image forming apparatus using these surface emitting laser modules.

  The present invention includes a surface emitting laser element having a surface emitting laser that emits light in a direction perpendicular to a substrate surface, a package provided with a recess for installing the surface emitting laser element, and the surface emitting element. A transparent substrate connected to the package on the light emission side of the laser element, and the transparent substrate is placed in contact with the first step portion and the second step portion, The surface-emitting laser element is connected to the package by wiring, the recess is formed in a square shape, a first step provided on each of two sides facing each other in the recess, and the other A second step portion provided on any one of the two sides, and the second step portion is provided at a position higher than the first step portion. The step of the surface emitting laser element and the wiring Is provided at a higher position, and a protrusion is provided at a corner formed by a side where the first step portion is provided and a side where the first and second step portions are not provided. In the transparent substrate, a portion corresponding to the protrusion is provided with a notch.

  Further, according to the present invention, the package and the transparent substrate are bonded by two types of adhesives having different viscosities, and a protrusion is provided on the side where the first step is provided. The sides that are bonded are bonded with a high viscosity adhesive among the adhesives, and the protrusions are the side where the second step portion is provided and the side where the first step portion is provided. The side where the part is not provided is bonded by an adhesive having a low viscosity among the adhesives.

  In the present invention, the protrusion has a sector shape centered on an angle formed by a side where the first stepped portion is provided and a side where the first and second stepped portions are not provided. It is characterized by being formed.

  In addition, the present invention is characterized in that the protrusion is formed by a cylindrical pin.

  According to another aspect of the present invention, there is provided a surface emitting laser element on which a surface emitting laser that emits light in a direction perpendicular to a substrate surface is formed, a package provided with a recess for installing the surface emitting laser element, A transparent substrate connected to the package on the light emitting side of the surface emitting laser element, and the transparent substrate is placed in contact with the first step portion and the second step portion. The surface-emitting laser element is connected to the package by wiring, the recess is formed in a square shape, and a first step provided on each of two opposite sides of the recess A second step portion provided on any one of the other two sides, the second step portion being provided at a position higher than the first step portion, The first step includes the surface-emitting laser element and the The package is provided with a ventilation path that connects the inside of the recess and the outside of the recess, and the ventilation path has a portion bent at a substantially right angle. It is characterized by having.

  Further, in the present invention, the package is formed by stacking a plurality of layers to be ceramics, and each of the layers to be ceramics is provided with an open air passage portion. The air passage is formed by connecting the air passage portions by overlapping the ceramic layers.

  In the invention, it is preferable that the periphery of the transparent substrate is bonded to the package with an adhesive.

  In the present invention, the first step portion is formed up to a predetermined position toward the side facing the second step portion, from the second step portion to the predetermined position. Is longer than the sum of the distance from the second step portion to the surface emitting laser element and the width of the surface emitting laser.

  The present invention is characterized in that a surface emitting laser array provided with a plurality of the surface emitting lasers is formed on the substrate.

  The present invention also provides an optical scanning device that scans a surface to be scanned with light, the light source having the surface-emitting laser module described above, a light deflection unit that deflects light from the light source, and the light deflection unit. And a scanning optical system for condensing the light deflected by the light onto the surface to be scanned.

  According to another aspect of the invention, there is provided an image carrier, and the above-described optical scanning device that scans the image carrier with light modulated in accordance with image information.

  Further, the present invention is characterized in that there are a plurality of the image carriers, and the image information is multicolor color information.

  According to the present invention, when a cover glass is installed, it can be easily installed in a short time, and a surface emitting laser module can be manufactured at low cost. In addition, a highly reliable surface emitting laser module can be provided because the structure has high air permeability and is difficult for dust to enter. Furthermore, an inexpensive and highly reliable optical scanning device and image forming apparatus can be provided.

Configuration diagram of surface emitting laser module Illustration of surface emitting laser module Illustration of other surface emitting laser module Explanatory drawing (1) of the surface emitting laser module in 1st Embodiment Explanatory drawing (2) of the surface emitting laser module in 1st Embodiment Explanatory drawing (3) of the surface emitting laser module in 1st Embodiment Structure diagram of surface emitting laser module according to the first embodiment Explanatory drawing (1) of the surface emitting laser module in 2nd Embodiment Explanatory drawing (2) of the surface emitting laser module in 2nd Embodiment Explanatory drawing (3) of the surface emitting laser module in 2nd Embodiment Structural diagram of surface emitting laser module according to second embodiment Explanatory drawing of the surface emitting laser module in 3rd Embodiment Structural diagram of surface emitting laser module according to the third embodiment Process drawing (1) of the manufacturing method of the package in 3rd Embodiment Process drawing (2) of the manufacturing method of the package in 3rd Embodiment Process drawing (3) of the manufacturing method of the package in 3rd Embodiment Process drawing (4) of the manufacturing method of the package in 3rd Embodiment Process drawing (5) of the manufacturing method of the package in 3rd Embodiment Process drawing (6) of the manufacturing method of the package in 3rd Embodiment Process drawing (1) of the manufacturing method of the package in 4th Embodiment Process drawing (2) of the manufacturing method of the package in 4th Embodiment Process drawing (3) of the manufacturing method of the package in 4th Embodiment Process drawing (4) of the manufacturing method of the package in 4th Embodiment Configuration of Multi-beam Light Source Device in Fifth Embodiment (1) Configuration of multi-beam light source device in fifth embodiment (2) Explanatory drawing of the multi-beam light source device in 5th Embodiment Configuration of Multi-beam Scanning Device in Sixth Embodiment (1) Configuration of multi-beam scanning device according to sixth embodiment (2) Configuration of an image forming apparatus according to a sixth embodiment

  Embodiments of the present invention will be described. In addition, about the same member etc., the same code | symbol is attached | subjected and description is abbreviate | omitted.

[First Embodiment]
The first embodiment is a surface emitting laser module having a surface emitting laser array which is a surface emitting laser element constituted by a plurality of surface emitting lasers.

  The above-described surface emitting laser module 910 will be described with reference to FIG. In the surface-emitting laser module 910, a surface-emitting laser array chip 950 in which surface-emitting lasers are two-dimensionally arranged is installed at a substantially central portion of the bottom surface of a package (flat package) 920 in which recesses are formed. The package 920 includes a main body 931 having a recess formed of ceramics or the like, and an electrode terminal 932 provided outside the main body 931. Radial lead terminals are formed on the bottom surface of the concave portion of the package 920, and these lead terminals are bonded to electrode electrodes (not shown) of the surface emitting laser array chip 950 installed on the bottom surface of the concave portion of the package 920. Connected by wires. The lead terminal is electrically connected to the electrode terminal 932 inside the main body 931 of the package 920, and is configured to receive power supply and control from the outside of the package 920 to the inside of the recess. . Further, a cover glass 940 that is a transparent substrate is placed on the upper side of the package 920 where the recess is formed, and the cover glass 940 is formed on the side where the recess of the package 920 is formed. The surface emitting laser array chip 950 installed on the bottom surface of the concave portion of the package 920 can be covered. Thus, since the cover glass 940 is placed on the light emitting surface side of the surface emitting laser array chip 950, the light emitted from the surface emitting laser array chip 950 is transmitted from the surface emitting laser module 910 via the cover glass 940. Emitted. In the present specification, the numbers of bonding wires and electrodes are selected and described for ease of explanation, and are different from the actual numbers.

  In the surface emitting laser module 910, if the cover glass 940 is placed in parallel with the surface of the surface emitting laser array chip 950, the amount of light in the surface emitting laser varies due to the influence of return light. For this reason, as shown in FIG. 2, the cover glass 940 is placed inclined with respect to a plane parallel to the surface of the surface emitting laser array chip 950. Specifically, the surface emitting laser array chip 950 is installed on the bottom surface 921 of the recess of the package 920, and the surface of the surface emitting laser array chip 950 and the bottom surface 921 of the recess of the package 920 are substantially parallel. The cover glass 940 is formed in a square shape or a rectangular shape, and step portions 924 and 926 are provided on two opposite sides of the square or rectangular concave portion of the package 920, and the bottom surface 921 of the concave portion of the package 920 is provided. It can be made to incline with respect to. 2A is a perspective view of the surface emitting laser module, and FIG. 2B is a cross-sectional view taken along the one-dot chain line 2A-2B in FIG. 2A. Further, in FIG. 2 and FIG. 3 described later, the electrode terminal 932 formed outside the package 920 is omitted.

  However, when the cover glass 940 is placed in this manner, there is a problem in that the surface emitting laser module 910 is increased in size if the inclination angle of the placed cover glass 940 is increased.

  For this reason, as shown in FIG. 3, a step 927 is provided only on one side of a concave portion formed in a square or rectangle of the package 920, one end of the cover glass 940 is brought into contact with the step 927, and the other A method of placing the cover glass 940 with the end brought into contact with the corner region 923 of the bottom surface 921 of the recess of the package 920 is conceivable. 3A is a top view of the surface emitting laser module, and FIG. 3B is a cross-sectional view taken along the one-dot chain line 3A-3B in FIG.

  In this method, the inclination angle of the cover glass 940 to be placed can be increased by the step between the corner region portion 923 and the step portion 927 which are the bottom side of the bottom surface 921 of the concave portion of the package 920. In such a surface emitting laser module 910, electrode terminals (not shown) in the surface emitting laser array chip 950 installed on the bottom surface 921 of the recess of the package 920 are connected to lead terminals 922 formed on the bottom surface 921 of the recess of the package 920. They are connected by a bonding wire 930. For this reason, when the cover glass 940 is placed, the cover glass 940 and the surface emitting laser array chip 950 come into contact with each other and the surface emitting laser array chip 950 is damaged, or the bonding wire 930 is cut. There is. In particular, in order to place the cover glass 940, if the cover glass 940 is entered at an angle close to perpendicular to the bottom surface 921 of the recess of the package 920, the surface emitting laser array chip 950 may be damaged, The bonding wire 930 may be cut. In such a case, the surface emitting laser module 910 to be manufactured becomes defective, so that the yield is lowered. Furthermore, the reliability of an optical scanning device or an image forming apparatus using the surface emitting laser module 910 may be reduced.

  Further, since the package 920 is formed of ceramics, a recess is formed slightly larger than the cover glass 940 for the convenience of manufacturing. For this reason, even when the cover glass 940 is placed at a predetermined position of the package 920, the gaps 928 and 929 are generated.

  The cover glass 940 placed on the package 920 is later fixed with an adhesive or the like. At this time, an adhesive having a high viscosity is used so that the adhesive does not enter too much from the gaps 928 and 929 and the like. In such an adhesive having a high viscosity, the adhesive is applied along the gaps 928 and 929. It is necessary to apply. Therefore, time is required for bonding, and the surface-emitting laser module 910 to be manufactured becomes expensive.

(Surface emitting laser module)
Next, the surface emitting laser module in the present embodiment will be described. As shown in FIGS. 4 and 5, the surface emitting laser module 10 in the present embodiment includes a package 20 having a recess formed of ceramics, a cover glass 40 that is a transparent substrate, and a surface emitting laser array chip 50. is doing. 4 shows a state where the cover glass 40 is placed in a predetermined region of the package 20 in the surface emitting laser module 10 according to the present embodiment, and FIG. 4A is a top view. 4 (b) is a cross-sectional view taken along the alternate long and short dash line 4A-4B in FIG. 4 (a), and FIG. 4 (c) is a cross-sectional view taken along the alternate long and short dash line 4C-4D in FIG. 4 (a). It is. 5A is a top view of the cover glass 40, and FIG. 5B is a top view of the package 20 in a state where the cover glass 40 is not placed. Note that electrode terminals connected to the surface emitting laser array chip 50 provided around the outside of the package 20 are omitted.

  The surface emitting laser array chip 50 is fixed to the bottom surface 21 of the concave portion of the package 20 with an adhesive (not shown) having high heat dissipation so that the surface on which the surface emitting laser is formed faces upward. In addition, electrode terminals (not shown) provided on the surface emitting laser array chip 50 and the wirings 22 formed radially on the bottom surface 21 of the recess of the package 20 are electrically connected by bonding wires 30. In the package 20, the concave portion is formed in a rectangular shape, and step portions 23 and 24 which are first step portions having the same height are provided on two opposing sides which are short sides among the four sides of the concave portion. On one long side, a step portion 25 serving as a second step portion higher than the step portions 23 and 24 is provided. In addition, the side which becomes another one side of the long side which opposes one side of the long side is the bottom side part 26, and the step part is not formed. Further, the height of the step portions 23 and 24 is formed at a position higher than the height from the bottom surface 21 of the recess of the package 20 to the bonding wire 30. Therefore, the height of the step portions 23 and 24 is higher than the height to the surface of the surface emitting laser array chip 50. In the above description, the concave portion is described as being formed in a rectangular shape, but may be formed in a square shape.

  Further, in the package 20, projections 27 are provided at corners (corners) formed by the side where the stepped portion 24 is provided and the side which becomes the bottom side portion 26. The projecting portion 27 is formed at substantially the same height as the step portions 23 and 24, and has a fan-shaped shape centered on the corner formed by the side where the step portion 24 is provided and the side which becomes the bottom side portion 26. Is formed.

  Further, the cover glass 40 has a notch 41 formed by cutting a part of a rectangular corner. The notch 41 is provided at a position corresponding to the protrusion 27 of the package 20, and as shown in FIG. 5A, the cover glass is formed along a straight line having an angle θ with respect to the direction in which the short side extends. It is formed by removing a part of 40 corners.

  When such a cover glass 40 is placed on the top of the package 20, a gap 28 is formed between the cover glass 40 and the package 20 on the side where the step portion 24 of the package 20 is formed.

  Next, a method for placing the cover glass 40 on the package 20 will be described with reference to FIG. First, as shown in FIG. 6A, the cover glass 40 is held by vacuum tweezers (not shown), and the long side of the cover glass 40 where the notch 41 is formed is the stepped portion of the package 20. After making it contact with 23 and 24, the holding | maintenance of the cover glass 40 is removed from a vacuum tweezers, and the cover glass 40 is moved to the direction shown by the arrow A. FIG.

  Next, as shown in FIG. 6B, the cover glass 40 is further moved in the direction indicated by the arrow A. Thereby, the notch part 41 provided in the cover glass 40 and the projection part 27 provided in the package 20 contact.

  Next, as shown in FIG. 6C, the cover glass 40 is further moved in the direction indicated by the arrow A so that the notch 41 and the protrusion 27 are in contact with each other. The cover glass 40 moves in the direction of the arrow B orthogonal to the arrow A. As a result, the cover glass 40 is in contact with the package 20 at the side where the step portion 23 is provided so that there is no substantial gap, and the package 20 and the cover glass 40 are at the side where the step portion 24 is provided. A gap 28 is formed between the two. The cover glass 40 is formed so as to be in contact with the package 20 also on the side where the step portion 25 is provided and the side which becomes the bottom side portion 26.

  Then, as shown in FIG. 7, it fixes by apply | coating the adhesives 60 and 61 etc. to the predetermined position of the package 20 in which the cover glass 40 is mounted. Thereby, the cover glass 40 and the package 20 are adhered, and the surface emitting laser module 10 in the present embodiment is manufactured. 7 shows the manufactured surface emitting laser module according to the present embodiment, FIG. 7 (a) is a top view, and FIG. 7 (b) is one point in FIG. 7 (a). FIG. 7C is a cross-sectional view taken along the chain line 7A-7B, and FIG. 7C is a cross-sectional view taken along the alternate long and short dash line 7C-7D in FIG.

  When producing the surface emitting laser module 10 in the present embodiment, two types of adhesive 60 and adhesive 61 are used. The adhesive 60 is an adhesive having a high viscosity, and is applied to a portion where the gap 28 is formed. Since the adhesive 60 has a high viscosity and does not spread so much, the application of the adhesive 60 along the gap 28 can close the gap 28. The adhesive 61 is an adhesive having a low viscosity, and is used for bonding the side where the step 23 is provided and the side where the step 25 is provided. Specifically, by dropping the adhesive 61 onto the application positions 61a and 61b, the adhesive 61 enters between the package 20 and the cover glass 40 by capillary action. In this way, the package 20 and the cover glass 40 can be bonded. In the present embodiment, the adhesive 60 is not applied to the side that becomes the bottom side portion 26, and the adhesive 61 is not dropped. The package 20 is formed of ceramics, and the unevenness of the surface is about several μm to several tens of μm. Therefore, the side that becomes the bottom side portion 26 is in contact with the cover glass 40, but since the gap between the package 20 and the cover glass 40 in this portion is narrow, air permeability can be ensured without allowing dust or the like to enter. .

  According to the present embodiment, the portion to which the high-viscosity adhesive 60 is applied is only one side of the cover glass 40, and the other two sides are formed by dropping the low-viscosity adhesive in a dot shape. can do. Therefore, a surface emitting laser module with high air permeability can be manufactured in a short time at a low price.

[Second Embodiment]
Next, a surface emitting laser module according to the second embodiment will be described. As shown in FIGS. 8 and 9, the surface emitting laser module 110 according to the present embodiment includes a package 120 having a recess formed of ceramics, a cover glass 140 which is a transparent substrate, and a surface emitting laser array chip 150. is doing. FIG. 8 shows a state in which the cover glass 140 is placed in a predetermined region of the package 120 in the surface emitting laser module 110 according to the present embodiment, and FIG. 8A is a top view. 8B is a cross-sectional view taken along the alternate long and short dash line 8A-8B in FIG. 8A, and FIG. 8C is a cross-sectional view taken along the alternate long and short dash line 8C-8D in FIG. It is. 9A is a top view of the cover glass 140, and FIG. 9B is a top view of the package 120 in a state where the cover glass 140 is not placed. Note that electrode terminals connected to the surface emitting laser array chip 150 provided around the outside of the package 120 are omitted.

  The surface emitting laser array chip 150 is fixed to the bottom surface 121 of the concave portion of the package 120 with an adhesive (not shown) having high heat dissipation so that the surface on which the surface emitting laser is formed faces upward. Further, electrode terminals (not shown) provided on the surface emitting laser array chip 150 and the radially formed wirings 122 provided on the bottom surface 121 of the recess of the package 120 are electrically connected by bonding wires 130. In the package 120, the concave portion is formed in a rectangular shape, and step portions 123 and 124 which are first step portions having the same height are provided on two opposing sides which are short sides among the four sides of the concave portion. On one long side, a step portion 125 serving as a second step portion higher than the step portions 123 and 124 is provided. In addition, the side which becomes another one side of the long side which opposes one side of the long side is the bottom side part 126, and the step part is not formed. Further, the height of the stepped portions 123 and 124 is formed at a position higher than the height from the bottom surface 121 of the recess of the package 120 to the bonding wire 130. Accordingly, the heights of the step portions 123 and 124 are higher than the height to the surface of the surface emitting laser array chip 150. In the above description, the concave portion is described as being formed in a rectangular shape, but may be formed in a square shape.

Further, in the package 120, pins 127 are provided at corners (corners) formed by the side where the stepped portion 124 is provided and the side which becomes the bottom side portion 126. The pin 127 is formed in a cylindrical shape from a metal material or a ceramic material, and the surface is polished. The pin 127 is installed by being inserted into an opening provided in the bottom surface 121 of the recess of the package 120. The pin 127 is formed at substantially the same height as the step portions 123 and 124 or higher than these.

  Further, as shown in FIG. 9A, the cover glass 140 has a notch 141 formed by cutting a part of a rectangular corner. The notch portion 141 is provided at a position corresponding to the protrusion portion 127 of the package 120, and by removing a part of the corner of the cover glass 140 along a straight line having an angle θ with respect to the extending direction of the short side. Is formed.

  When such a cover glass 140 is placed on top of the package 120, a gap 128 is formed between the cover glass 140 and the package 120 on the side where the step portion 124 of the package 120 is formed.

  Next, a method for placing the cover glass 140 on the package 120 will be described with reference to FIG. First, as shown in FIG. 10A, the cover glass 140 is held by vacuum tweezers (not shown), and the long side of the cover glass 140 where the notch 141 is formed is the stepped portion of the package 120. After making it contact with 123 and 124, holding | maintenance of the cover glass 140 is removed from a vacuum tweezers, and the cover glass 140 is moved to the direction shown by the arrow C. FIG.

  Next, as shown in FIG. 10B, the cover glass 140 is further moved in the direction indicated by the arrow C. Thereby, the notch part 141 provided in the cover glass 140 and the pin 127 provided in the package 120 contact.

  Next, as shown in FIG. 10C, the cover glass 140 is further moved in the direction indicated by the arrow C so that the notch 141 and the pin 127 are in contact with each other. The cover glass 140 moves in the direction of the arrow D perpendicular to the arrow C. As a result, the cover glass 140 is in contact with the package 120 so that a gap is not substantially formed on the side where the step portion 123 is provided, and the package 120 and the cover glass 140 are provided on the side where the step portion 124 is provided. A gap 128 is formed between the two. Note that the cover glass 140 is formed so as to be in contact with the package 120 also on the side where the step portion 125 is provided and the side which becomes the bottom side portion 126.

  Then, as shown in FIG. 11, it fixes by applying the adhesives 160 and 161 to the predetermined position of the package 120 in which the cover glass 140 is mounted. Thereby, the cover glass 140 and the package 120 are bonded together, and the surface emitting laser module 110 according to the present embodiment is manufactured. 11 shows the manufactured surface emitting laser module according to the present embodiment, FIG. 11 (a) is a top view, and FIG. 11 (b) is a point in FIG. 11 (a). FIG. 11C is a cross-sectional view taken along the chain line 11A-11B, and FIG. 11C is a cross-sectional view taken along the alternate long and short dash line 11C-11D in FIG.

  When producing the surface emitting laser module 110 in the present embodiment, two types of adhesive 160 and adhesive 161 are used. The adhesive 160 is an adhesive having a high viscosity, and is applied to a portion where the gap 128 is formed. Since the adhesive 160 has a high viscosity and does not spread so much wet, the gap 128 can be closed by applying the adhesive 160 along the gap 128. The adhesive 161 is a low-viscosity adhesive and is used to bond the side where the step 123 is provided and the side where the step 125 is provided. Specifically, by dropping the adhesive 161 onto the application positions 161a and 161b, the adhesive 161 enters between the package 120 and the cover glass 140 by capillary action. In this way, the package 120 and the cover glass 140 can be bonded. In this embodiment, the adhesive 160 is not applied to the side that becomes the bottom side portion 126, and the adhesive 161 is not dropped. The package 120 is made of ceramics, and the unevenness of the surface is about several μm to several tens of μm. Therefore, the side that becomes the bottom portion 126 is in contact with the cover glass 140, but since the gap between the package 120 and the cover glass 140 in this portion is narrow, air permeability can be ensured without entering dust or the like. .

  According to the present embodiment, the portion to which the high-viscosity adhesive 160 is applied is only one side of the cover glass 140, and the other two sides are formed by dropping the low-viscosity adhesive into dots. can do. Therefore, a surface emitting laser module with high air permeability can be manufactured in a short time at a low price.

  Further, in the present embodiment, since the side surface of the pin 127 is polished, the friction when contacting the notch 141 provided in the cover glass 140 is small. Therefore, the cover glass 140 can be installed at a predetermined position more smoothly. The contents other than the above are the same as in the first embodiment.

[Third Embodiment]
Next, a third embodiment will be described. The present embodiment is a surface emitting laser module having a structure having a package in which an opening is formed. The surface emitting laser module according to the present embodiment will be described with reference to FIGS. As shown in FIG. 12, the surface emitting laser module 210 in the present embodiment includes a package 220 having a recess formed of ceramics, a cover glass 240 that is a transparent substrate, and a surface emitting laser array chip 250. . FIG. 12 is a top view showing a state where the cover glass 240 is placed in a predetermined region of the package 220 in the surface emitting laser module 210 according to the present embodiment.

  The surface emitting laser array chip 250 is fixed to the bottom surface 221 of the concave portion of the package 220 with an adhesive (not shown) having high heat dissipation so that the surface on which the surface emitting laser is formed faces upward. Further, electrode terminals (not shown) provided on the surface emitting laser array chip 250 and the wirings 222 formed radially on the bottom surface 221 of the recess of the package 220 are electrically connected by bonding wires 230. In the package 220, the concave portion is formed in a rectangular shape, and step portions 223 and 224 which are first step portions having the same height are provided on two opposing sides which are short sides among the four sides of the concave portion. On one long side, a step portion 225 serving as a second step portion higher than the step portions 223 and 224 is provided. In addition, the side which becomes another one side of the long side which opposes one side of the long side is the bottom side part 226, and the step part is not formed. Further, the heights of the step portions 223 and 224 are formed at positions higher than the height from the bottom surface 221 of the concave portion of the package 220 to the bonding wire 230. Therefore, the heights of the step portions 223 and 224 are higher than the height to the surface of the surface emitting laser array chip 250. In the above description, the concave portion is described as being formed in a rectangular shape, but may be formed in a square shape.

  Further, in the package 220, projections 227 are provided at corners (corners) formed by the side where the step 224 is provided and the side which becomes the bottom side 226. The projecting portion 227 is formed at substantially the same height as the step portions 223 and 224, and has a fan-shaped shape centered on the corner formed by the side where the step portion 224 is provided and the side that becomes the bottom side portion 226. Is formed.

  The package 220 is provided with an opening 270. The opening 270 is not shown in the space surrounded by the package 220 and the cover glass 240, that is, in the space where the surface emitting laser array chip 250 is installed. It is connected by an air passage.

  Further, the cover glass 240 has a notch 241 formed by cutting a part of a rectangular corner. The notch 241 is provided at a position corresponding to the protrusion 227 of the package 220, and by removing a part of the corner of the cover glass 240 along a straight line having an angle θ with respect to the direction in which the short side extends. Is formed.

  When such a cover glass 240 is placed on top of the package 220, a gap 228 is formed between the cover glass 240 and the package 220 on the side where the step portion 224 of the package 220 is formed.

  After the cover glass 240 is placed on the package 220 in this way, adhesives 260 and 261 are applied to predetermined positions of the package 220 on which the cover glass 240 is placed as shown in FIG. Fix it. Thereby, the cover glass 240 and the package 220 are bonded together, and the surface emitting laser module 210 in the present embodiment can be manufactured. FIG. 13 shows the surface-emitting laser module manufactured in the present embodiment, FIG. 13 (a) is a top view, and FIG. 13 (b) is one point in FIG. 13 (a). It is sectional drawing cut | disconnected in the dashed line 13A-13B.

  When manufacturing the surface emitting laser module 210 in the present embodiment, two types of adhesive 260 and adhesive 261 are used. The adhesive 260 is an adhesive having a high viscosity, and is applied to a portion where the gap 228 is formed. Since the adhesive 260 has a high viscosity and does not spread so much, the adhesive 260 can be closed by being applied along the gap 228. The adhesive 261 is an adhesive having a low viscosity, and is used to bond the side where the step 223 is provided, the side where the step 225 is provided, and the side which becomes the bottom side 226. Specifically, by dropping the adhesive 261 onto the application positions 261a, 261b, and 261c, the adhesive 261 enters between the package 220 and the cover glass 240 by a capillary phenomenon. In this way, the package 220 and the cover glass 240 can be bonded without a gap.

  According to the present embodiment, the opening 270 is provided, and the space between the opening 270 and the space surrounded by the package 220 and the cover glass 240 is not linear but is substantially perpendicular, as will be described later. Since they are connected by the air passage having a plurality of bent portions, dust or the like does not enter the space surrounded by the package 220 and the cover glass 240 from the opening 270.

  Further, the portion to which the high-viscosity adhesive 260 is applied is only one side of the cover glass 240, and the other three sides can be formed by dropping the low-viscosity adhesive in a dot shape. Therefore, a surface emitting laser module with high air permeability can be manufactured in a short time at a low price.

(Package manufacturing method)
Next, a method for manufacturing the package 220 having the opening 270 used in the present embodiment will be described. The package 220 is formed by laminating a plurality of layers serving as ceramics.

  First, as shown in FIG. 14, a second layer 282 is formed on the first layer 281. A wiring 222 is formed on the surface of the first layer 281, and step portions 223 and 224 and a protrusion 227 are formed by the second layer 282 formed on the first layer 281. Further, an air passage portion 271 serving as an air passage for connection to an opening 270 described later is formed. 14A is a top view showing this state, and FIG. 14B is a cross-sectional view taken along the alternate long and short dash line 14A-14B in FIG. 14A.

  Next, as shown in FIG. 15, a third layer 283 is formed on the second layer 282. The third layer 283 formed on the second layer 282 forms the air passage portion 272 connected to the air passage portion 271. 15A is a top view showing this state, and FIG. 15B is a cross-sectional view taken along the alternate long and short dash line 15A-15B in FIG. 15A.

  Next, as illustrated in FIG. 16, a fourth layer 284 is formed over the third layer 283. The fourth layer 284 formed on the third layer 283 forms the air passage portion 273 connected to the air passage portion 272. 16A is a top view showing this state, and FIG. 16B is a cross-sectional view taken along the alternate long and short dash line 16A-16B in FIG.

  Next, as illustrated in FIG. 17, a fifth layer 285 is formed over the fourth layer 284. The fifth layer 285 formed on the fourth layer 284 forms the air passage portion 274 connected to the air passage portion 273. FIG. 17A is a top view showing this state, and FIG. 17B is a cross-sectional view taken along the alternate long and short dash line 17A-17B in FIG.

  Next, as illustrated in FIG. 18, a sixth layer 286 is formed over the fifth layer 285. The sixth layer 286 formed on the fifth layer 285 forms an air passage portion 275 connected to the step portion 225 and the air passage portion 274. 18A is a top view showing this state, and FIG. 18B is a cross-sectional view taken along the alternate long and short dash line 18A-18B in FIG. 18A.

  Next, as illustrated in FIG. 19, a seventh layer 287 is formed over the sixth layer 286. The seventh layer 287 formed on the sixth layer 286 forms the air passage portion 276 connected to the air passage portion 275. FIG. 19A is a top view showing this state, and FIG. 19B is a cross-sectional view taken along the alternate long and short dash line 19A-19B in FIG. 19A. Note that the opening portion of the ventilation path portion 276 becomes the opening portion 270.

  As described above, an air passage that connects the space surrounded by the package 220 and the cover glass 240 and the opening 270 can be formed. The air passage is formed by air passage portions 271, 272, 273, 274, 275, and 276 and has a plurality of portions that bend substantially at a right angle. Therefore, it has a structure in which dust or the like is less likely to enter from the opening 270 through the ventilation path.

  As described above, the surface emitting laser module according to the present embodiment can be manufactured. The contents other than the above are the same as in the first embodiment.

[Fourth Embodiment]
Next, a fourth embodiment will be described. The present embodiment is a method for manufacturing a package for forming the surface emitting laser module in the third embodiment, and is different from the third embodiment.

  First, as shown in FIG. 20, a second layer 292 is formed on the first layer 291. A wiring 220 is formed on the surface of the first layer 291, and step portions 223 and 224 and a protrusion 227 are formed by the second layer 292 formed on the first layer 291. In addition, an air passage 301 is formed as an air passage for connection to an opening 270 described later. 20A is a top view showing this state, and FIG. 20B is a cross-sectional view taken along the alternate long and short dash line 20A-20B in FIG.

  Next, as shown in FIG. 21, a third layer 293 is formed on the second layer 292. By the third layer 293 formed on the second layer 292, the air passage portion 302 connected to the air passage portion 301 is formed. FIG. 21A is a top view showing this state, and FIG. 21B is a cross-sectional view taken along the alternate long and short dash line 21A-21B in FIG.

  Next, as shown in FIG. 22, a fourth layer 294 is formed on the third layer 293. The fourth layer 294 formed on the third layer 293 forms the air passage portion 303 connected to the step portion 225 and the air passage portion 302. 22A is a top view showing this state, and FIG. 22B is a cross-sectional view taken along the alternate long and short dash line 22A-22B in FIG. 22A.

  Next, as illustrated in FIG. 23, a fifth layer 295 is formed over the fourth layer 294. By the fifth layer 295 formed on the fourth layer 294, the air passage portion 304 connected to the air passage portion 303 is formed. FIG. 23A is a top view showing this state, and FIG. 23B is a cross-sectional view taken along the alternate long and short dash line 23A-23B in FIG. The opening portion of the ventilation path portion 304 becomes the opening portion 270.

  As described above, an air passage that connects the space surrounded by the package 220 and the cover glass 240 and the opening 270 can be formed. This air passage is formed by the air passage portions 301, 302, 303, and 304, and has a plurality of portions that bend substantially at a right angle. Therefore, it has a structure in which dust or the like is less likely to enter from the opening 270 through the ventilation path.

  As described above, the surface emitting laser module according to the present embodiment can be manufactured. The contents other than those described above are the same as those in the first embodiment and the third embodiment.

[Fifth Embodiment]
Next, a fifth embodiment will be described. The present embodiment is a multi-beam light source device using the surface emitting laser modules in the first to fourth embodiments.

  The multi-beam light source device in the present embodiment will be described based on FIGS. 24, 25 and 26. FIG. In the multi-beam light source device in the present embodiment, a plurality of light beams from the surface-emitting laser array constituting the surface-emitting laser module 601 in the first to fourth embodiments are coupled to the X, Y, and Z of the coupling lens 602. By adjusting the arrangement of the directions, the light sources are arranged symmetrically with respect to the optical axis in a plane orthogonal to the optical axis of the coupling lens 602 (YZ plane), and the beams from the light sources are parallel beams. It is adjusted so that

  The aperture mirror 603 is formed in a plate shape, and the surface on the light source side is formed as a reflection surface, and is inclined at a predetermined angle of 45 ° from the surface orthogonal to the optical axis in the main scanning direction. An opening having a diameter smaller than the light beam diameter is provided in the central portion, and the light beam that has passed through the opening is directed to a polygon mirror (not shown) via a coupling lens and a light beam splitting prism 708. The ambient light reflected without passing through the aperture is guided to the light detection sensor 610 through the converging lens 604, and the time from the start of scanning on each surface of the polygon mirror (not shown) to the image area is obtained. The light is sequentially turned on to detect each beam intensity, and the injection current is set so that the output of each light source becomes a predetermined value compared with the reference value. The set injection current is held until the next detection, and the beam intensity is kept constant. The light beam splitting prism 708 includes a half mirror surface 641 and a mirror surface 642.

  The light detection sensor 610 is mounted on a control board 606 on which the surface emitting laser module 601 is mounted so that the detection signal is not affected by external noise or the like. The control board 606 is formed with a power control circuit that keeps the light emission output of the light emission source constant and a drive circuit that modulates each light emission source in accordance with image information. A light source device is configured.

  In addition, the multi-beam light source device in the present embodiment has a base member that holds a control board 606 on which the holder member 608 that holds the coupling lens 602 and the surface-emitting laser module 601 in the first to fourth embodiments are mounted. The member 607 is joined by a reference plane orthogonal to the optical axis of the coupling lens 602, and is integrated by screw fastening.

  In this embodiment, the base member 607 and the holder member 608 are both formed by aluminum die casting, but may be made of different materials as long as they have substantially the same thermal expansion coefficient. The base member 607 is irradiated with a beam to an aperture mirror 603 for detecting the beam intensity from the surface emitting laser array in the surface emitting laser module 601 described above, a converging lens 604, and a light detection sensor 610 mounted on the control substrate 606. A mirror 605 for folding is provided.

  Further, the multi-beam light source device according to the present embodiment is pressed from the back side of the control board 606 by the leaf spring part 620 of the urging member 609 formed of sheet metal, and the three anchor parts (folded parts) 618 are controlled by the control board. The surface-emitting laser array in the surface-emitting laser module 601 is positioned with respect to the base member 607 by fitting the control board 606 to a reference surface (not shown) by fitting in the hole 619 of 606.

  Three studs 616 are formed in the base member 607, and the control board 606 is supported by passing through through holes 617 formed in the control board 606 and fastening the biasing member 609 to the studs 616 with screws. . Since the control board 606 is pressed from the back side by the urging member 609 and the control board 606 is not directly fastened to the base member 607 or the like, the base member 607 is reliably surface-emitting without applying a load to the control board 606. The surface emitting laser array constituting the laser module 601 can be positioned and supported. The urging member 609 may be formed of a resin or the like as long as it has elasticity, and an elastic member such as rubber may be sandwiched instead of the leaf spring portion.

  Further, as shown in FIG. 26, the coupling lens 602 is fixed to the cylindrical surface 630 formed on the holder member 608 by filling the gap between the coupling lens 602 with an adhesive and fixing the optical axis of the coupling lens 602. The contact surface 648 (the contact surface 648 is orthogonal to the optical axis 651 of the coupling lens 602) in order to match the parallelism between the surface 650 orthogonal to the surface 651 and the arrangement surface of the surface emitting laser array in the surface emitting laser module 601. The surface side of the surface emitting laser array in the surface emitting laser module 601 is abutted and mounted on the surface emitting laser module 601). In this way, the position in the optical axis direction is determined, and the light beam emission direction can be orthogonal to the contact surface 648.

  Reference numeral 611 denotes a bracket member, 614 and 615 are slopes, 624 is a positioning pin, 625 is an arm portion, 626 is an adjustment screw, 627 is a spring, 631 is a positioning hole, 632 is a screw, and 633 is a reinforcing member.

  In the multi-beam light source device according to the present embodiment, the cylindrical portion of the holder member 608 is inserted into the fitting hole 634 provided in the bracket member 611, and the locking claw 629 of the leaf spring 612 is engaged with the cylindrical portion groove. Then, it is rotatably supported in a plane orthogonal to the optical axis 651, and is fixed to a housing (not shown) on which a polygon mirror and an fθ lens described later are supported.

  In the multi-beam light source device according to the present embodiment, since the surface emitting laser modules according to the first to fourth embodiments are used, it is possible to obtain multi-beam light with low cost and high reliability.

[Sixth Embodiment]
Next, a sixth embodiment will be described. The present embodiment is a multi-beam scanning device and an image forming apparatus using the multi-beam light source device in the fifth embodiment.

  The multi-beam scanning device in the present embodiment will be described based on FIG. This multi-beam scanning device is an optical scanning device that scans four stations. A plurality of light beams corresponding to four stations from the multi-beam light source device are scanned by a single polygon mirror and deflected in opposite directions. The structure of an optical scanning unit integrated so as to scan each photosensitive drum by scanning is shown.

  The four photosensitive drums 701, 702, 703, and 704 are arranged at equal intervals along the moving direction 705 of the transfer body, and sequentially transfer and superimpose different color toner images to form a color image. As shown in the drawing, the optical scanning device that scans each photosensitive drum is integrally formed, and each optical beam is scanned by a polygon mirror 706 that is configured in two stages.

  Two multi-beam light source devices 707 and 709 are provided for each of two stations that scan in the same direction, and light beam splitting prisms 708 and 710 are used to emit light beams in two upper and lower stages corresponding to the upper and lower surfaces of the polygon mirror 706. The image is branched and images corresponding to the stations are alternately formed on the photosensitive drums.

  The multi-beam light source devices 707 and 709 and the fθ lens and the toroidal lens constituting the imaging optical system are arranged symmetrically with respect to a symmetry plane including the rotation axis of the polygon mirror 706 and parallel to the photosensitive drum axis. Thus, the light beam from each multi-beam light source device is deflected in opposite directions and guided to each photosensitive drum.

  Therefore, the scanning direction at each station is the opposite direction between the opposing photosensitive drums, and the width of the recording area, in other words, the magnification in the main scanning direction is matched, and one scanning start end coincides with the other scanning end. The electrostatic image is written as if.

  In the liquid crystal deflecting elements 717 and 718, only the polarization component that matches the liquid crystal alignment direction is deflected, so that the polarization direction of the light source is aligned in one direction.

  As shown in FIG. 24, the beam splitting prism 708 has a half mirror surface 641 and a mirror surface 642 parallel to the half mirror surface, and a plurality of beams 771 from the multi-beam light source device 707 are respectively half mirror surfaces. ½ of the light amount is reflected, and the remaining ½ is transmitted and branched into two vertically, and the light is emitted with a predetermined interval in the sub-scanning direction with the directions aligned.

  The liquid crystal deflecting elements 717 are respectively provided above and below the exit surface of the light beam splitting prism 708. When a voltage is applied, a potential distribution is generated in the sub-scanning direction, the orientation of the liquid crystal is changed, and a refractive index distribution is generated to generate a light beam. The direction can be tilted, and the scanning position on the photosensitive drum surface can be varied according to the applied voltage.

  The cylinder lenses 713 and 714 are provided in two stages corresponding to each branched light beam, and one of them is attached so as to be rotatable around the optical axis, and adjusted so that the respective focal lines are parallel to each other. The light enters the polygon mirror 706 formed in two stages at intervals of 6 mm in the sub-scanning direction.

  The cylinder lenses 713 and 714 have a positive curvature at least in the sub-scanning direction, and once converge the beam on the polygon mirror surface, the deflection point and the surface of the photosensitive member are moved in the sub-scanning direction by a toroidal lens described later. A surface tilt correction optical system having a conjugate relationship is formed.

  The polygon mirror 706 has four surfaces, and deflects and scans a plurality of beams from each light emitting point array at the same time using the same deflection surface. The phases of the upper and lower polygon mirrors are shifted by 45 °, and the scanning of the light beam is alternately performed in the upper and lower stages.

  The imaging optical system includes an fθ lens and a toroidal lens, both of which are formed by plastic molding. In the main scanning direction, the fθ lens 720 moves the beam at a constant speed on the surface of the photosensitive member as the polygon mirror 706 rotates. Thus, the non-circular arc surface shape with power is formed, and the two layers are stacked and integrated.

  The scanning beams that have passed through the toroidal lens are respectively incident on the light detection sensors 738 and 740 disposed on the scanning start side and the light detection sensors 739 and 741 disposed on the scanning end side, and detection signals of the light detection sensors 738 and 740 are detected. Based on the above, a synchronization detection signal is generated for each light emitting source, and the writing start timing is taken.

  On the other hand, the detection signals of the light detection sensors 739 and 741 arranged on the scanning end side measure the detection time difference of the light beams from the light detection sensors 738 and 740 arranged on the scanning start side, respectively. By changing the pixel clock that modulates each light source as compared with the value, the magnification deviation in the main scanning direction is corrected as will be described later.

  Further, the path of the light beam in the sub-scan section will be described with reference to FIG.

  The plurality of light sources are arranged symmetrically with respect to the optical axis of the coupling lens, and each light beam converted into a parallel light beam by the coupling lens is emitted from the multi-beam light source device 707, and then the rear focal point of the coupling lens. Once converged in the vicinity, the light beam is widened in the main scanning direction and incident on the fθ lens 720. In the sub scanning direction, the light is converged again near the polygon mirror deflection surface by the cylinder lenses 713 and 714 to the fθ lens 720. Incident.

  Further, as described above, the plurality of light beams from the multi-beam light source device 707 are bifurcated up and down in the sub-scanning direction by the light beam splitting prism 708 and guided to the photosensitive drum corresponding to each station.

  Beams 771 from a plurality of light sources emitted from the lower stage of the beam splitting prism 708 are deflected and scanned at the lower stage of the polygon mirror 706 via the cylinder lens 713, pass through the lower stage of the fθ lens 720, and then returned to the toroidal lens by the return mirror 729. Then, the light is incident on the photosensitive drum 701 via the folding mirror 730, and forms a latent image corresponding to yellow image information as a first image forming station.

  Beams 772 from a plurality of light emitting sources emitted from the upper stage of the beam splitting prism 708 are deflected and scanned by the upper stage of the polygon mirror 706 via the cylinder lens 714, pass through the upper stage of the fθ lens 720, and then the toroidal lens 724 by the return mirror 727. Is incident on the photosensitive drum 702 via the folding mirror 728, and a latent image corresponding to magenta image information is formed as a second image forming station.

  Similarly, in the opposite stations, a plurality of light beams from the multi-beam light source device 709 are bifurcated up and down by a light beam splitting prism 710 and guided to a photosensitive drum corresponding to each station via a liquid crystal deflecting element 718. .

  Beams 773 from a plurality of light sources emitted from the lower stage of the beam splitting prism 710 are deflected and scanned at the lower stage of the polygon mirror 706 via the cylinder lens 715, pass through the lower stage of the fθ lens 721, and then returned to the toroidal lens by the mirror 732. 726, and forms a spot image on the photosensitive drum 704 via the folding mirror 733. As a fourth image forming station, a latent image corresponding to black image information is formed. Beams 774 from a plurality of light sources emitted from the upper stage are deflected and scanned at the upper stage of the polygon mirror 706 via the cylinder lens 716, pass through the upper stage of the fθ lens 721, and enter the toroidal lens 725 by the folding mirror 735, Spot on the photosensitive drum 703 via the folding mirror 736 Then, a latent image corresponding to cyan image information is formed as a third image forming station.

  In the present embodiment, a toner image detection pattern detection unit is provided. The toner image detection pattern detection means comprises an LED element 754 for illumination, a photosensor 755 for receiving reflected light, and a pair of condensing lenses 756, and forms a line pattern inclined by about 45 ° with respect to the main scanning line. Then, the detection time difference is read according to the movement of the transfer belt. In the present embodiment, in this embodiment, by arranging at three locations, the center portion and the left and right end portions, the inclination is determined by the difference between the left and right end portions, each magnification from the center to the left and right end portions is detected, and the reference and Correct to fit the station. In other words, it is preferable that the beam spot position is stably held for a long time.

  In the present embodiment, since the first to sixth surface emitting laser modules are used, the imaging position can be adjusted with high accuracy on the surface of the photosensitive member with high reliability, and a highly accurate and reliable latent image can be obtained. Can do.

  Next, the image forming apparatus in the present embodiment will be described with reference to FIG.

  In the image forming apparatus according to the present embodiment, around the photosensitive drum 801, a charging charger 802 that charges the photosensitive member to a high voltage, and a toner charged to an electrostatic latent image recorded by the optical scanning device 800 according to the present embodiment. A developing roller 803 that visualizes the toner by attaching the toner, a toner cartridge 804 that supplies toner to the developing roller, and a cleaning case 805 that scrapes and stores the toner remaining on the drum are disposed. As described above, a plurality of lines, that is, four lines in the embodiment, are simultaneously recorded on the photosensitive drum by scanning each surface of the polygon mirror.

  The above-described image forming stations are arranged in parallel in the moving direction of the transfer belt 806, and yellow, magenta, cyan, and black toner images are sequentially transferred onto the transfer belt at the same timing, and are superimposed to form a color image.

  Each image forming station has basically the same configuration except that the toner color is different.

  On the other hand, the recording paper is supplied from the paper supply tray 807 by the paper supply roller 808, and is sent out by the registration roller pair 809 in accordance with the recording start timing in the sub-scanning direction. The color image is transferred from the transfer belt, and the fixing roller The image is fixed at 810 and discharged to a paper discharge tray 811 by a paper discharge roller 812.

  Since the image forming apparatus according to the present embodiment uses any one of the first to sixth surface emitting laser modules, the image forming position can be accurately adjusted on the surface of the photosensitive member, and a highly accurate and reliable image can be obtained. Can be obtained.

  As mentioned above, although the form which concerns on implementation of this invention was demonstrated, the said content does not limit the content of invention.

DESCRIPTION OF SYMBOLS 10 Surface emitting laser module 20 Package 21 Bottom face 23 Step part (1st step part)
24 steps (first step)
25 steps (second step)
26 Base 27 27 Projection 30 Bonding Wire 40 Cover Glass 41 Cutout 50 Surface Emitting Laser Array Chip 60 High Viscosity Adhesive 61 Low Viscosity Adhesive

Japanese Patent Laid-Open No. 2004-6592 JP 2007-79295 A Japanese Utility Model Publication No. 61-59368 Japanese Utility Model Publication No. 62-580066 Patent No. 4,381,274 Japanese Patent No. 4378868

Claims (12)

A surface-emitting laser element on which a surface-emitting laser that emits light in a direction perpendicular to the substrate surface is formed;
A package provided with a recess for installing the surface emitting laser element;
A transparent substrate connected to the package on the light emitting side of the surface emitting laser element;
Have
The transparent substrate is placed in contact with the first step portion and the second step portion,
The surface emitting laser element is connected to the package by wiring,
The recess is formed in a square shape, and a first step provided on each of two sides facing each other in the recess and a second step provided on any one of the other two sides. And
The second step portion is provided at a position higher than the first step portion, and the first step portion is provided at a position higher than the surface emitting laser element and the wiring,
A protrusion is provided at a corner formed by a side where the first step is provided and a side where the first and second steps are not provided.
A surface emitting laser module, wherein a cutout portion is provided in a portion corresponding to the protruding portion of the transparent substrate. The package and the transparent substrate are bonded by two types of adhesives having different viscosities,
Of the sides where the first step portion is provided, the sides where the protrusions are provided are bonded by a high viscosity adhesive among the adhesives,
The side where the second step portion is provided and the side where the projection portion is not provided among the sides where the first step portion is provided are bonded with an adhesive having a low viscosity among the adhesives. The surface-emitting laser module according to claim 1, wherein   The protrusion is formed in a sector shape centering on an angle formed by a side where the first step is provided and a side where the first and second steps are not provided. The surface emitting laser module according to claim 1, wherein the surface emitting laser module is provided.   The surface emitting laser module according to claim 1, wherein the protrusion is formed by a cylindrical pin. A surface-emitting laser element on which a surface-emitting laser that emits light in a direction perpendicular to the substrate surface is formed;
A package provided with a recess for installing the surface emitting laser element;
A transparent substrate connected to the package on the light emitting side of the surface emitting laser element;
Have
The transparent substrate is placed in contact with the first step portion and the second step portion,
The surface emitting laser element is connected to the package by wiring,
The recess is formed in a square shape, and a first step provided on each of two sides facing each other in the recess and a second step provided on any one of the other two sides. And
The second step portion is provided at a position higher than the first step portion, and the first step portion is provided at a position higher than the surface emitting laser element and the wiring,
The package is provided with a ventilation path that connects the inside of the recess and the outside of the recess,
The surface emitting laser module according to claim 1, wherein the air passage has a portion bent at a substantially right angle. The package is formed by stacking a plurality of ceramic layers,
Each of the ceramic layers is provided with an open air passage portion,
The surface emitting laser module according to claim 5, wherein the air passage is formed by connecting the air passage portions by overlapping the ceramic layers.   The surface emitting laser module according to claim 5 or 6, wherein the entire periphery of the transparent substrate is bonded to the package with an adhesive.   The first step portion is formed to a predetermined position toward the side facing the second step portion, and the length from the second step portion to the predetermined position is The surface emitting laser module according to claim 1, wherein the surface emitting laser module is longer than a sum of an interval from the second step portion to the surface emitting laser element and a width of the surface emitting laser.   9. The surface emitting laser module according to claim 1, wherein a surface emitting laser array provided with a plurality of the surface emitting lasers is formed on the substrate. An optical scanning device that scans a surface to be scanned with light,
A light source comprising the surface emitting laser module according to claim 1;
A light deflector for deflecting light from the light source;
A scanning optical system for condensing the light deflected by the light deflection unit on the surface to be scanned;
An optical scanning device comprising: An image carrier;
The optical scanning device according to claim 10, wherein the image carrier is scanned with light modulated according to image information.
An image forming apparatus comprising:   12. The image forming apparatus according to claim 11, wherein there are a plurality of image carriers, and the image information is multicolor color information.

Images