JP2012109454A - Electronic component connecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain voids in thermosetting resin.SOLUTION: An electrode 18 of an electronic component 16 is arranged on an electrode 12 of a substrate 10 via solder-containing thermosetting adhesive 14 containing at least a solder 20, thermosetting resin 22 with a thermosetting temperature lower than a melting point of the solder 20, and an activator for improving wettability of the molten solder 20. First, the solder 20 is molten at a temperature higher than the melting point under an atmospheric pressure atmosphere, to bond the electrode 18 of the electronic component 16 and the electrode 12 of the substrate 10. Then, moisture and a volatile component in the thermosetting resin 22 are volatilized at a temperature lower than the thermosetting temperature under a reduced pressure atmosphere. Then, internal air bubbles are reduced or eliminated while thermosetting the thermosetting resin 22 at a temperature higher than the thermosetting temperature and lower than the melting point under a pressure atmosphere higher than the reduced pressure atmosphere.

Description

  The present invention relates to an electronic component connection method for connecting an electrode of an electronic component and an electrode of a substrate with solder.

  Conventionally, a mounting method of an electronic component is known in which a thermosetting adhesive containing solder, which is a thermosetting resin containing solder, is used to join an electrode of an electronic component and an electrode of a substrate ( Patent Document 1). When the electrode of the electronic component and the electrode of the substrate are joined using such a soldered thermosetting adhesive, the solder joins the electrode of the electronic component and the electrode of the substrate, and the thermosetting resin covers the solder. Protect and fix electronic components to the board. Thereby, it is possible to perform the electrical connection of the electronic component and the reinforcement with the resin at the same time in one reflow process.

  However, when a soldered thermosetting adhesive is used, bubbles (voids) may exist inside the thermosetting resin after thermosetting. Voids may cause cracks in later processes, for example, the pressing process. Further, in the subsequent reheating step, molten solder may flow into the void, which may cause a short circuit.

  In order to suppress the generation of such voids, for example, referring to the method described in Patent Document 2, an electronic component is pressed against a portion of a substrate coated with a soldered thermosetting adhesive under a reduced-pressure atmosphere. It is conceivable to melt the solder while maintaining the pressed state.

JP 2010-140924 A Japanese Patent Laid-Open No. 11-163048

  However, when soldering is performed by the method described in Patent Document 2 (under a reduced pressure atmosphere), there may be a case where good electrical connection between the electrode of the electronic component and the electrode of the substrate cannot be realized.

  Therefore, the present invention provides a thermosetting property while realizing a good electrical connection between the electrodes of the solder when the electrodes of the electronic component and the electrodes of the substrate are connected using the thermosetting adhesive containing solder. It aims at suppressing generation | occurrence | production of the void in resin.

In order to solve the above-mentioned problem, according to the first aspect of the present invention,
Electrons on the electrodes of the substrate through a soldered thermosetting adhesive containing at least a solder, a thermosetting resin having a thermosetting temperature lower than the melting point of the solder, and an activator for improving the wettability of the molten solder An electronic component placement process for placing the electrode of the component;
A first heat treatment step of soldering the solder of the electrode of the electronic component and the electrode of the substrate under an atmospheric pressure atmosphere and a temperature higher than the melting point,
A second heat treatment step of heating the electronic component and the substrate temporarily bonded by the first heat treatment step under a reduced pressure atmosphere and a temperature lower than the thermosetting temperature;
After the second heat treatment step, a third heat curing resin is thermoset under an atmosphere at a pressure higher than the pressure of the second heat treatment step and higher than the thermosetting temperature and lower than the melting point. Heat treatment step,
A method for connecting electronic components is provided.

According to a second aspect of the invention,
In the same sealed chamber, the second and third heat treatment steps are continuously performed.
An electronic component connection method according to a first aspect is provided.

According to a third aspect of the invention,
The thermosetting resin is not cured until the second heat treatment step is completed.
An electronic component connection method according to the first or second aspect is provided.

According to a fourth aspect of the invention,
The temperature condition and execution time of the first heat treatment step are set so that the thermosetting of the thermosetting resin in the first heat treatment step can be suppressed,
An electronic component connection method according to the first or second aspect is provided.

  According to the present invention, in the first heat treatment step, the solder is melted under an atmospheric pressure atmosphere to electrically connect the electrode of the electronic component and the electrode of the substrate in an excellent manner. Next, in the second heat treatment step, air is extracted from the softened thermosetting resin and the moisture and volatile components are volatilized under a reduced-pressure atmosphere and a temperature lower than the thermosetting temperature of the thermosetting resin. . Then, in the third heat treatment step, while thermosetting the thermosetting resin in an atmosphere at a pressure higher than the pressure of the second heat treatment step, higher than the thermosetting temperature and lower than the melting point of the solder, , Reduce or eliminate bubbles remaining inside. Thereby, generation | occurrence | production of the void in a thermosetting resin is suppressed.

The block diagram of the board | substrate mounting line which can perform the soldering method of the electronic component which concerns on embodiment of this invention The flowchart which shows the order of the several process relevant to the soldering method of an electronic component corresponding to the board | substrate mounting line shown in FIG. The figure for demonstrating each process shown in FIG. 2 in detail The figure for demonstrating in detail the process following the process shown in FIG.

  First, as a premise, the present invention uses a soldered thermosetting adhesive containing at least a solder, a thermosetting resin, and an activator for improving the wettability of molten solder.

  The soldered thermosetting adhesive is a liquid or paste that contains (disperses), for example, particulate or powdered solder in a thermosetting resin, and can be applied onto a substrate by a screen printing apparatus to be described later, for example. It is a shape.

  The “thermosetting resin” referred to in the present invention is one in which the thermosetting reaction is completely completed by continuously heating at a temperature equal to or higher than the thermosetting temperature for a predetermined time (for example, 2 hours). What consists of a hardening | curing agent which hardens this resin base material is also contained. Furthermore, the “thermosetting resin” referred to in the present invention is one that is thermoset at a thermosetting temperature lower than the melting point of the solder described later.

  As the thermosetting resin, an epoxy resin is preferably used. Examples of the epoxy resin used include bisphenol A type, bisphenol F type, polyfunctional type, alicyclic type, and biphenyl type. In addition to the epoxy resin, an acrylic resin, an oxetane resin, a polyimide resin, an isocyanate resin, or the like may be used as the thermosetting resin.

  As the curing agent, a type corresponding to the resin substrate to be used is selected. In the case of an epoxy resin, imidazoles, acid anhydrides, amines, hydrazides, microcapsule type curing agents, etc. are selected. The

  For example, SnBi58 (melting point: 139 ° C.), SnAg3Cu0.5 (melting point: 217-220 ° C.), SnSb5 (melting point: 245 ° C.), SnAg3.5 (melting point: 221 ° C.), etc. are processed into particles having an average particle size of 1-50 μm. It is a thing.

  Moreover, the activator which improves the wettability of molten solder is added to the thermosetting adhesive containing a solder. The activator for improving the wettability of the molten solder is, for example, an organic acid (carboxylic acid) that can remove an oxide film on the electrode surface of the electronic component or the substrate.

  Further, a thixotropic agent, a silane coupling agent, an organic solvent, a flexible material, a pigment, a catalyst, and the like are added to the soldered thermosetting adhesive as necessary. The thixotropic agent is for adjusting the thixotropy of the soldered thermosetting adhesive, and contributes to the printability of the screen printing apparatus for printing the soldered thermosetting adhesive on the substrate. A silane coupling agent is blended for the purpose of improving adhesion, and an organic solvent is used to adjust the viscosity. The flexible material has an effect of reducing the thermal stress during the heat cycle by reducing the elasticity of the resin bonded portion after the thermosetting resin is cured. The pigment is used when it is necessary to color the soldered thermosetting adhesive. Furthermore, the catalyst is used to adjust the time until the thermosetting is completed, in other words, when it is desired to promote the thermosetting reaction.

  From here, the soldering method of an electronic component which uses the soldered thermosetting adhesive mentioned above based on embodiment of this invention is demonstrated, referring drawings.

  FIG. 1 schematically shows a board mounting line in which the electronic component soldering method according to the present invention can be implemented. FIG. 2 shows a flow of a plurality of steps related to the electronic component soldering method according to the present invention corresponding to the board mounting line shown in FIG. Further, FIG. 3 is a diagram for explaining in detail the contents of each step shown in FIG.

  As shown in FIG. 1, a board mounting line 100 includes a board supply device 102 for feeding a board into the line 100, a screen printing apparatus 104 for applying a soldered thermosetting adhesive onto the board, and an electronic component on the board. The electronic component mounting apparatus 106 to be mounted, the reflow apparatus 108 for melting the solder in the soldered thermosetting adhesive on the substrate, and the substrate recovery apparatus 110 for recovering the electronic component mounted substrate from the reflow apparatus 108 are provided. The substrate mounting line 100 includes a batch processing type vacuum heating device 112 that collectively heat-treats a plurality of electronic component mounted substrates collected by the substrate collecting device 110. The substrate supply device 102, the screen printing device 104, the electronic component mounting device 106, the reflow device 108, and the substrate recovery device 110 are connected by a substrate transfer conveyor built in each device, and the substrate loaded from the substrate supply device 102 Is transported to each apparatus by a transport conveyor and recovered by the substrate recovery apparatus 110 located on the most downstream side. A plurality of substrates recovered by the substrate recovery device 110 are collectively transported to the vacuum heating device 112 by the operator. In FIG. 1, arrows indicate the flow of the substrate.

  The substrate supply apparatus 102 stocks the substrate 10 shown in FIG. 3A, specifically, the substrate 10 on which the electrode 12 to which the electrode of the electronic component is bonded is formed, and the substrate 10 is placed on the substrate mounting line 100. throw into. In addition to the electrodes 12, a wiring pattern (not shown) is formed on the substrate 10.

  The screen printing apparatus 104 is an apparatus that performs the thermosetting adhesive supply step S1 shown in FIG. 2, and as shown in FIG. 3B, soldered thermosetting on the electrode 12 formed on the substrate 10. Adhesive 14 is applied.

  The electronic component mounting device 106 is a device that executes the electronic component mounting step S2 shown in FIG. 2, and as shown in FIG. 3C, the terminals 18 (electrodes) of the electronic component 16 are soldered thermosetting adhesive. The electronic component 16 is placed on the substrate 10 so as to be positioned on the electrode 12 of the substrate 10 through the agent 14.

  The reflow device 108 is a device that performs the reflow process S3 shown in FIG. 2, melts the solder 20 in the soldered thermosetting adhesive 14, and as shown in FIG. 3D, the terminal 18 of the electronic component 16 is melted. And the electrode 12 of the substrate 10 are joined by the solder 20. Note that the reflow device 108 melts the solder 20 under an atmospheric pressure atmosphere.

  The reflow device 108 conveys the substrate 10 on which the electronic component 16 is placed as shown in FIG. 3C from the electronic component mounting device 106 side to the substrate recovery device 110 by a substrate conveyance conveyor (not shown). However, heat treatment is performed (corresponding to “first heat treatment step” described in claims). The inside of the reflow device 108 is divided into a plurality of heating zones and cooling zones. By adjusting the heating conditions of each zone and the setting of the substrate transfer speed of the substrate transfer conveyor, a substrate to be transferred inside the reflow device is desired. It can heat so that it may become the following heating profile (temperature change).

  Specifically, the reflow device 108 first has the electronic component 16 at a temperature lower than the melting point of the solder 20 in the upstream heating zone (for example, 200 ° C. in the case of SnAg3Cu0.5 solder having a melting point of 217 to 220 ° C.). Is heated for a predetermined time (for example, 3 to 4 minutes). Thereby, the board | substrate 10 is fully warmed evenly.

  Thereafter, when the sufficiently warmed substrate 10 is transported to a conveyor (not shown) and reaches the downstream heating zone, the reflow device 108 has a temperature higher than the melting point of the solder in the downstream heating zone (for example, 240 Degree) for a predetermined time (for example, 30 seconds) to melt the solder 20 in the soldered thermosetting adhesive 14. The solder 20 melts and aggregates, and the molten solder 20 comes into contact with the electrodes 12 of the substrate 10 and the terminals 18 of the electronic component 16.

  On the other hand, the thermosetting resin 22 is softened and spreads so as to cover the molten solder 20 and to enter between the electronic component 16 and the substrate 10.

  The thermosetting resin 22 is heated by the reflow device 108 at a temperature equal to or higher than the thermosetting temperature, but is not completely cured because the heating time is short (the thermosetting reaction does not proceed). In other words, the heating temperature and heating time by the reflow device 108, that is, the temperature profile of the reflow device 108 are set so that the thermosetting reaction of the thermosetting resin in the soldered thermosetting adhesive 14 does not proceed.

  Also, instead of setting the temperature profile of the reflow device 108 appropriately so that the thermosetting reaction of the thermosetting resin in the soldered thermosetting adhesive 14 does not proceed by the reflow device 108, and / or In addition, the progression rate of the thermosetting reaction of the thermosetting resin may be adjusted by preparing additives such as a curing agent and a catalyst contained in the soldered thermosetting adhesive 14.

  When the solder 20 melts and comes into contact with the electrode 12 of the substrate 10 and the terminal 18 of the electronic component 16 (after heating for a predetermined time at a temperature higher than the melting point), the reflow device 108 cools the substrate 10 in the most downstream cooling zone. Then, the molten solder 20 is cured. Thereby, as shown in FIG. 3D, the electrode 12 of the substrate 10 and the terminal 18 of the electronic component 16 are joined by the solder 20. As described above, the thermosetting resin 22 after the reflow process is liquid or B-staged.

  As described above, by performing solder joining under the atmospheric pressure atmosphere by the reflow device 108, it is possible to realize good electrical connection between the electrode 12 of the substrate 10 and the terminal 18 of the electronic component 16 by the solder 20.

  In connection with this, the inventor has found out why a good electrical connection between the electrode of the electronic component and the electrode of the substrate by solder may not be realized when soldered in a reduced pressure atmosphere. . The reason will be described.

  As described above, the soldered thermosetting adhesive contains an activator that improves the wettability of the molten solder by removing the oxide film present on the surface of the electrode. In many cases, the boiling point of the materials used in such activators is close to the melting point of the solder.

  When a soldered thermosetting adhesive containing such an activator is heated to melt the solder under a reduced pressure atmosphere, most of the activator volatilizes before exhibiting the oxide film removing function. This is because the boiling point of the activator decreases under a reduced-pressure atmosphere (the activator is premised on being used under atmospheric pressure, and exhibits an oxide film removing function under atmospheric pressure). .

  When most of the activator volatilizes without removing the oxide film, the oxide film on the electrode surface is naturally not sufficiently removed, and the solder cannot spread over the entire electrode surface. As a result, good electrical connection between the electrodes via the solder is not realized.

  Therefore, in view of the above-mentioned reason that the present inventors have found out, the present invention allows the bonding of the electrode 12 of the substrate 10 and the terminal 18 of the electronic component 16 by the solder 20 of the soldered thermosetting adhesive to the atmospheric pressure. Running below.

  The substrate collection device 110 collects the substrate 10 in which the terminals 18 and the electrodes 12 of the electronic component 16 are joined by the solder 20 by the reflow device 108 from the reflow device 108. Specifically, the substrates are stored and collected in a magazine having a plurality of vertical racks for storing the substrates 10 one by one.

  The vacuum heating device 112 is for heat-treating the substrate 10 recovered by the substrate recovery device 110, that is, the substrate 10 in which the terminals 18 and the electrodes 12 of the electronic component 16 are joined by the solder 20.

  Specifically, the vacuum heating device 112 includes a sealed chamber 114 that can accommodate a plurality of substrates 10, a pump (not shown) that exhausts the air in the sealed chamber 114 to the outside, and the temperature in the sealed chamber 114. It has a heating source (not shown) to be adjusted, and is configured so that the temperature and pressure in the sealed chamber 114 can be adjusted. The sealed chamber 114 is configured to be able to seal the internal space in order to prevent the outside air from entering the internal space in which the substrate 10 is accommodated. The sealed chamber 114 preferably has a structure that can accommodate the magazine in which the substrate 10 is stored.

  The vacuum heating device 112 performs the vacuum heating step S4 and the resin curing step S5 shown in FIG. 2 on the substrate 10 accommodated in the sealed chamber 114.

  First, as the vacuum heating step S4 (corresponding to the “second heat treatment step” recited in the claims), the vacuum heating device 112 is, for example, at atmospheric pressure (101, 325 Pa) as shown in FIG. The terminal 18 and the electrode 12 of the electronic component 16 are joined by the solder 20 at a temperature lower than the thermosetting temperature of the thermosetting resin 22 in the sealed chamber 114 having a further reduced pressure (for example, a pressure of 10,000 Pa or less). The processed substrate 10 is heat-treated.

  The purpose of this vacuum heating step S4 is to suppress the generation of voids in the thermosetting resin 22. Therefore, before performing resin hardening process S5 mentioned later, in addition to the air contained in the thermosetting resin 22, the water | moisture content and volatile component contained in the thermosetting resin 22 are vaporized and removed. In order to promote the vaporization and to make it easy for air or gas generated by vaporization (gas derived from moisture or volatile components) to escape from the thermosetting resin 22, the thermosetting resin 22 is softened by heating. At the same time, the inside of the sealed chamber 114 is depressurized.

  However, the heating condition should not cure the thermosetting resin 22. The heating condition applied in the vacuum heating step S4 is premised on that the heating temperature is lower than the thermosetting temperature of the thermosetting resin 22, and the pressure is set in the sealed chamber 114 in a reduced pressure atmosphere. The pressure is such that the moisture and volatile components contained in 22 are volatilized. For example, when the thermosetting resin 22 is an epoxy resin and the activator is acetic anhydride, the temperature is set to 130 degrees and the pressure is set to 10,000 Pa.

  By such a vacuum heating step S4, the air contained in the thermosetting resin 22 escapes to the outside, and moisture and volatile components contained in the thermosetting resin 22 are volatilized and discharged to the outside. Note that the thermosetting resin 22 after the vacuum heating step S4 is also in a liquid or B-stage shape and is not completely cured. The activator can also volatilize as a volatile component, but the activator has already played the role of removing the oxide film and improving the wettability of the molten solder in the reflow step S3 of the previous step, so the activator volatilizes. There is no problem with that. By evaporating the activator, a by-product effect that the reliability of the thermosetting resin 22 is improved can be expected.

  After the vacuum heating step S4, the vacuum heating device 112 performs an atmospheric pressure or higher than the pressure in the vacuum heating step S4 as the resin curing step S5 (corresponding to the “third heat treatment step” recited in the claims). In a sealed chamber 114 having a pressure of (for example, 500,000 Pa or more), a temperature higher than the thermosetting temperature of the thermosetting resin 22 and lower than the melting point of the solder 20 (for example, when the thermosetting resin 22 is an epoxy resin, The substrate 10 on which the terminals 18 and the electrodes 12 of the electronic component 16 are joined by the solder 20 is heat-treated for a predetermined time (for example, 2 hours) at about 180 degrees, which varies depending on the amount and type of the curing agent.

  By such resin curing step S5, as shown in FIG. 3F, the thermosetting resin 22 can be completely cured without melting the solder 20. At the same time, bubbles slightly remaining in the thermosetting resin 22 after the vacuum heating step S4 are compressed or disappeared by a pressure higher than the pressure in the vacuum heating step S4.

  A substrate 10 (hereinafter referred to as “subassembly substrate SA”) in the state shown in FIG. 3F completed through the respective steps shown in FIG. 2 is used as, for example, a component of a multilayer wiring board.

  The multilayer wiring board is manufactured through the process shown in detail in FIG. 4 using the subassembly board SA.

  Specifically, first, the subassembly substrate SA is roughened with an alkaline solvent. In addition, since the solder 20 of the subassembly substrate SA is protected by the thermosetting resin 22, it is maintained without being eroded by the alkaline solvent.

  Next, as shown in FIG. 4G, the prepreg 24 is disposed on the roughened subassembly substrate SA, and the substrate 26 on which the wiring pattern is formed is disposed on the prepreg 24. The prepreg 24 is obtained by impregnating glass fiber, carbon fiber, or the like with a thermosetting resin.

  Subsequently, as shown in FIG. 4G, the subassembly substrate SA, the prepreg 24, and the substrate 26 are pressed by a press device (not shown) in the stacking direction, and the thermosetting resin of the prepreg 24 is made. Heated at thermosetting temperature.

  When the thermosetting resin of the prepreg 24 is thermally cured, a multilayer wiring board in which the electronic component 16 is protected by the prepreg 24 is completed as shown in FIG. Thereafter, for example, in order to electrically connect the wiring pattern on the substrate 10 and the wiring pattern on the substrate 26, a through hole penetrating the substrate 10, the prepreg 24, and the substrate 26 is formed. A conductive plating layer is formed on the inner peripheral surface.

  According to the present embodiment, in the reflow step S3, the solder 20 is melted under an atmospheric pressure atmosphere, and the terminals 18 of the electronic component 16 and the electrodes 12 of the substrate 10 are electrically connected in a favorable manner. Next, the vacuum heating step S4 evacuates air from the softened thermosetting resin 22 and volatilizes moisture and volatile components under a reduced-pressure atmosphere and a temperature lower than the thermosetting temperature of the thermosetting resin 22. Let Then, in the resin curing step S5, the thermosetting resin 22 is thermoset under the conditions of an atmosphere higher than the pressure in the vacuum heating step S4, higher than the thermosetting temperature and lower than the melting point of the solder 20. , Reduce or eliminate bubbles remaining inside. Thereby, generation | occurrence | production of the void in the thermosetting resin 22 is suppressed.

  Although the present invention has been described above, the present invention is not limited to the above description.

  For example, in the case of the above-described embodiment, the vacuum heating step S4 and the resin curing step S5 shown in FIG. 2 are continuously executed in the sealed chamber 114 of the same vacuum heating device 112. Not limited to this. For example, the vacuum heating step S4 may be performed by the vacuum heating device 112, and the resin curing step S5 may be performed by a resin curing device that thermally cures the thermosetting resin under atmospheric pressure conditions.

  However, in this case, the substrate transport from the vacuum heating device 112 to the resin curing device and the resin curing step S5 should preferably be executed in a state where the soft thermosetting resin on the substrate does not touch the atmosphere. Thereby, it can suppress that the thermosetting resin of a softened state absorbs the water | moisture content in air | atmosphere, and it is suppressed that the thermosetting resin after thermosetting corrodes and deteriorates by the internal water | moisture content. Therefore, as in the above-described embodiment, the vacuum heating step S4 and the resin curing step S5 are continuously performed in the sealed chamber 114 of the vacuum heating device 112 that is the same sealed space isolated from the atmosphere. preferable.

  Moreover, in the case of the above-mentioned embodiment, although reflow process S3 is performed on the conditions of atmospheric pressure atmosphere, this invention is not restricted to this. The pressure during the reflow step S3 may be a pressure at which the activator for improving the wettability of the molten solder does not volatilize under the condition of the temperature equal to or higher than the melting point of the solder.

  Furthermore, the electronic component soldering method according to the present invention can be performed by a device other than the plurality of devices shown in FIG.

  For example, the soldered thermosetting adhesive may not be liquid or paste at room temperature, but may be solid, for example, a sheet. In that case, an apparatus that disposes a sheet-like thermosetting adhesive on the electrode of the substrate is used instead of the screen printing apparatus.

  Further, instead of the reflow apparatus, it is also possible to use a heating device (heating furnace) that includes a sealed chamber that can accommodate the substrate and can adjust the temperature in the sealed chamber.

  That is, the present invention melts the solder in the soldered thermosetting adhesive and then heat-treats it under a reduced pressure atmosphere at a temperature lower than the thermosetting temperature of the thermosetting resin to wet the molten solder. Any device (or a plurality of devices) that volatilizes the activator for improving the heat resistance and can be heat-treated under the conditions of a temperature higher than the thermosetting temperature of the thermosetting resin and lower than the melting point of the solder is possible. .

  The present invention is not limited to electronic components and substrates, but includes solder, a thermosetting resin containing at least a solder, a thermosetting resin having a thermosetting temperature lower than the melting point of the solder, and an activator for improving the wettability of the molten solder. Any adhesive can be used.

DESCRIPTION OF SYMBOLS 10 Board | substrate 12 Electrode 14 Soldered thermosetting adhesive 16 Electronic component 18 Electrode (terminal)
20 Solder 22 Thermosetting resin

Claims (4)

Electrons on the electrodes of the substrate through a soldered thermosetting adhesive containing at least a solder, a thermosetting resin having a thermosetting temperature lower than the melting point of the solder, and an activator for improving the wettability of the molten solder An electronic component placement process for placing the electrode of the component;
A first heat treatment step of soldering the solder of the electrode of the electronic component and the electrode of the substrate under an atmospheric pressure atmosphere and a temperature higher than the melting point,
A second heat treatment step of heating the electronic component and the substrate temporarily bonded by the first heat treatment step under a reduced pressure atmosphere and a temperature lower than the thermosetting temperature;
After the second heat treatment step, a third heat curing resin is thermoset under an atmosphere at a pressure higher than the pressure of the second heat treatment step and higher than the thermosetting temperature and lower than the melting point. An electronic component connection method including a heat treatment step.   The method for connecting electronic components according to claim 1, wherein the second and third heat treatment steps are continuously performed in the same sealed chamber.   The method for connecting electronic components according to claim 1 or 2, wherein the thermosetting resin is not cured until the second heat treatment step is completed.   The method for connecting electronic components according to claim 1 or 2, wherein the temperature condition and execution time of the first heat treatment step are set so as to suppress thermosetting of the thermosetting resin in the first heat treatment step.

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