JP4144082B2 - Circuit member mounting method - Google Patents
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- JP4144082B2 JP4144082B2 JP30292998A JP30292998A JP4144082B2 JP 4144082 B2 JP4144082 B2 JP 4144082B2 JP 30292998 A JP30292998 A JP 30292998A JP 30292998 A JP30292998 A JP 30292998A JP 4144082 B2 JP4144082 B2 JP 4144082B2
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75314—Auxiliary members on the pressing surface
- H01L2224/75315—Elastomer inlay
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Description
【０００１】
【発明の属する技術分野】
本発明は、例えばフリップチップ実装方式により半導体チップを基板と接着剤で接着固定すると共に両者の電極同士を電気的に接続する回路部材の実装方法に関する。
【０００２】
【従来の技術】
現在、回路基板同士またはＩＣや電子部品と回路基板の接続とを電気的に接続する際には、はんだが用いられている。はんだは、低融点金属で構成され、金属組成物の中では比較的融点が低く、電子部品の電極及び電子機器に使用されるプリント配線板（実装基板）の電極と結合することで接続強度も高く、また、はんだによる実装基板への電子部品の搭載は、ＩＲリフロー等を用い一括で行うことが可能であることから、電子機器に使用されるプリント配線板（実装基板）への電子部品の実装材料として用いられている。
しかし、現在主に用いられているはんだは、鉛を含んでいる。この鉛は、環境汚染、生命体への悪影響が危惧されている。そこで、鉛を含まないはんだ材料の開発が進められ、一部実用化されつつあるが、鉛を含むはんだに対して融点が高いという問題がある。
【０００３】
【発明が解決しようとする課題】
このはんだ接続が持つ問題点を解決するため、回路基板同士またはＩＣや電子部品と回路基板の接続とを電気的に接続する際に、接着剤または導電粒子を分散させた異方導電接着剤を用いる方法がある。
しかし、このような接着剤または異方導電接着剤を用いて接続を行う場合、これらの接着剤を電極間に配置して、加圧しながら接着剤を硬化させる必要がある。そのため、高さや大きさが異なるＩＣや電子部品を一つの回路基板の上に混載する際には、個々の部品を独立して加圧、接着剤を硬化させる必要があった。
本発明は、他の電子部品と同時に実装して、一括して加熱処理で熱硬化するとともに回路部材同士の電極の電気的導通を得る回路部材の実装方法を提供するものである。
【０００４】
【課題を解決するための手段】
本発明は、高さや大きさが異なる複数の回路基板またはＩＣや電子部品に一括して圧力を加えつつ接着剤または異方導電接着剤を硬化させ、実装基板またはＩＣや電子部品と実装基板の電気的な接続を得る回路部材の実装方法を提供するものである。
【０００５】
本発明の回路部材の実装方法は、回路部材を、前記回路部材の端子（ａ）に対応した端子（ｂ）が設けられた実装基板に前記端子（ａ）（ｂ）を対向し、易溶融性金属表面を持つ金属粒子を分散させた異方導電接着剤を介し搭載する工程、回路部材を搭載した前記実装基板全体を気密性の弾性シートで被覆する工程、前記気密性の弾性シート内部を０．３気圧以下に減圧し前記回路部材を均一に加圧する工程、前記加圧工程下で加熱により前記端子（ａ）（ｂ）を電気的に接続する工程を備えることを特徴とする。上記弾性シートはシリコーンゴム製の弾性シートであることが好ましい。
【０００６】
【発明の実施の形態】
金属粒子としては、Ａｕ、Ａｇ、Ｎｉ、Ｃｕ、はんだ等の金属粒子やカーボン等が使用できる。また、プラスチックに前記した導通層を被覆等により形成し最外層を貴金属類プラスチックを核とした場合や熱溶融金属粒子の場合、加熱加圧により変形性を有するので接続時に電極との接触面積が増加し信頼性が向上するので好ましい。また易溶融性金属表面を持つ金属粒子である、Ｓｎ，Ｂｉ，Ｉｎ，Ａｇ，Ｓｂ，Ｃｕ，Ｚｎ，Ｎｉ，Ａｕ，Ｍｇ，Ｇａ及びＡｌの群から選択された１種の金属または２種以上の金属を組み合わせてできる合金材であり、導電性微粒子の融点が２５０℃以下が好ましく、さらに好ましくは１００℃以上１９０℃以下である。金属粒子表面層が易溶融性金属であっても良い。
【０００７】
本発明に用いられる接着剤は、ＵＶ硬化系、加熱によって遊離ラジカルを発生する硬化剤系もしくは熱硬化系エポキシ樹脂またはこれらの混合系であり、ＵＶ硬化系の光開始剤としては、ベンゾインエチルエーテル、イソプロピルベンゾインエーテル等のベンゾインエーテル、ベンジル、ヒドロキシシクロヘキシルフェニルケトン等のベンジルケタール、ベンゾフェノン、アセトフェノン等のケトン類及びその誘導体、チオキサントン類、ビスイミダゾール類等があり、これらの光開始剤に必要に応じてアミン類、イオウ化合物、リン化合物等の増感剤を任意の比で添加しても良い。
【０００８】
加熱により遊離ラジカルを発生する硬化剤としては、過酸化化合物、アゾ系化合物などの加熱により分解して遊離ラジカルを発生するものであり、目的とする接続温度、接続時間、ポットライフ等により適宜選定される。配合量は０．０５〜１０重量％程度であり０．１〜５重量％がより好ましい。具体的には、ジアシルパーオキサイド、パーオキシジカーボネート、パーオキシエステル、パーオキシケタール、ジアルキルパーオキサイド、ハイドロパーオキサイド、シリルパーオキサイドなどから選定できる。また、回路部材の接続端子の腐食を抑えるために、硬化剤中に含有される塩素イオンや有機酸は５０００ｐｐｍ以下であることが好ましく、さらに、加熱分解後に発生する有機酸が少ないものがより好ましい。具体的には、パーオキシエステル、ジアルキルパーオキサイド、ハイドロパーオキサイド、シリルパーオキサイドから選定され、高反応性が得られるパーオキシエステルから選定されることがより好ましい。これらは、適宜混合して用いることができる。
また、これらの硬化剤をポリウレタン系、ポリエステル系の高分子物質等で被覆してマイクロカプセル化したものは、可使時間が延長されるために好ましい。
【０００９】
本発明で用いるラジカル重合性物質としては、ラジカルにより重合する官能基を有する物質であり、アクリレート、メタクリレート、マレイミド化合物等が挙げられる。ラジカル重合性物質はモノマー、オリゴマーいずれの状態で用いることが可能であり、モノマーとオリゴマーを併用することも可能である。
【００１０】
本発明で用いるエポキシ樹脂としては、エピクロルヒドリンとビスフェノールＡやＦ、ＡＤ等から誘導されるビスフェノール型エポキシ樹脂、エピクロルヒドリンとフェノールノボラックやクレゾールノボラックから誘導されるエポキシノボラック樹脂やナフタレン環を含んだ骨格を有するナフタレン系エポキシ樹脂、グリシジルアミン、グリシジルエーテル、ビフェニル、脂環式等の１分子内に２個以上のグリシジル基を有する各種のエポキシ化合物等を単独にあるいは２種以上を混合して用いることが可能である。これらのエポキシ樹脂は、不純物イオン（Ｎａ＋、Ｃｌ−等）や、加水分解性塩素等を３００ｐｐｍ以下に低減した高純度品を用いることがエレクトロンマイグレーション防止のために好ましい。
エポキシ樹脂は熱膨張係数の低下及びガラス転移温度の向上として、３官能以上の多官能エポキシ樹脂及び／又はナフタレン系エポキシ樹脂が好ましい。３官能以上の多官能エポキシ樹脂としては、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、トリスヒドロキシフェニルメタン型エポキシ樹脂、テトラフェニロールエタン型エポキシ樹脂、ジシクロペンタジエンフェノール型エポキシ樹脂等がある。また、ナフタレン系エポキシ樹脂は、１分子中に少なくとも１個以上のナフタレン環を含んだ骨格を有しており、ナフトール系、ナフタレンジオール系等がある。
【００１１】
また接着剤中にアクリルゴムなどのゴム成分を必要量添加しても良く、アクリルゴムとしては、アクリル酸、アクリル酸エステル、メタクリル酸エステルまたはアクリロニトリルのうち少なくともひとつをモノマー成分とした重合体または共重合体があげられ、中でもグリシジルエーテル基を含有するグリシジルアクリレートやグリシジルメタクリレートを含む共重合体系アクリルゴムが好適に用いられる。
また、接着剤にはフィルム形成性をより容易にするためにフェノキシ樹脂などの熱可塑性樹脂を配合することもできる。特に、フェノキシ樹脂は、エポキシ樹脂と構造が類似しているため、エポキシ樹脂との相溶性、接着性に優れるなどの特徴を有するので好ましい。
【００１２】
また、エポキシ樹脂の硬化剤としては、イミダゾール系、ヒドラジド系、三フッ化ホウ素−アミン錯体、芳香族スルホニウム塩、アミンイミド、ポリアミンの塩、ジシアンジアミド等の潜在性硬化剤が速硬化性の観点から有効であり、その他に酸無水物系硬化剤もイオン性不純物が少ないことから有効である。
本発明の言うところのリフロ処理は、赤外線、エア、ベーパーフェーズ（ＶＰＳ）、窒素などの全体加熱方式およびＹＡＧレーザ、半導体レーザ、キセノンランプ、ハロゲンランプ、パルスヒータ、ホットエアなどの部分加熱方式のことである。
【００１３】
本発明の金属粒子の配列技術としては、例えば特開平６―１６３５５０号公報や特開平６―３１０５１５号公報に記載されたものなどがあり、特開平６―１６３５５０号公報記載の技術では、両面で径の異なる多数の貫通孔を有し、径の大きい穴を有する面側にはんだボールを装着可能なガラス治具上に閉空間を形成して、はんだボールを圧縮空気により閉空間に送り込んで、ガラス治具の径の小さい穴から吸引することにより、はんだボールをガラス治具の径の大きい貫通孔に吸引して、配列させている。また、特開平６―３１０５１５号公報に記載の技術では、はんだボールを一定数整列に搭載できるプレート上にはんだボールをスクリューフィーダ等により供給して、真空ポンプとバイブレータにより振動を与えて、配列させている。また、搭載ヘッドに所望の間隔に吸着孔を設け、搭載ヘッドを上下動させて導電性ボールを真空吸着して配置すべきシート上に搭載ヘッドを移動した後、吸着を解放して配列させる方法やメッシュを用いる方法がある。これらの技術を用いても良い。
また接着フィルムを支持層と接着層の多層構成にしても良く、その場合には、接着剤層塗工→乾燥→支持層塗工→硬化→接着剤層塗工→乾燥の工程をとれば良い。導電性微粒子の散布については、静電気力を利用すると余剰な粒子を回収することが出来、効率的な散布が可能となる。
【００１４】
また本発明においてフィルム状に成形した場合、導電性微粒子の表面がフィルムの表裏の表面から露出していることが望ましく、フィルムの表面に粘着力が付与されていることが望ましい。また導電性微粒子については、粒径は基板の電極の最小の間隔よりも小さいことが必要であるため、必要に応じて所定の形状に変形させても良い。また、接着剤に分散される導電粒子量は、接着剤樹脂組成物１００体積部に対して０．１〜３０体積部であり、好ましくは０．２〜１５体積部である。
【００１５】
また本発明に用いられる回路部材接続用接着剤は、フィルム状接着剤ではなく、液状の接着剤を回路板の電極上にスクリーン印刷して用いても良い。
回路部材としては、半導体パッケージ（ＱＦＰ、ＢＧＡ、ＣＳＰ、ＳＯＰ、ＴＣＰ等）、コンデンサ、抵抗体、コイル等のチップ部品、コネクタ等が用いられる。
回路部材には端子が多数設けられており、回路部材はその端子に対応した多数の端子が設けられた実装基板に端子どうしを対向して接着剤を介し搭載され、端子同士を電気的に接続して実装される。
チップ部品を実装する基板として、半導体チップ端子に対応する電極（接続端子）が形成された有機質絶縁基板が使用される。
【００１６】
有機質絶縁基板としては、ポリイミド樹脂、ポリエステル樹脂等の合成樹脂フィルム、又はガラスクロス、ガラス不織布等のガラス基材にポリイミド樹脂、エポキシ樹脂、フェノ−ル樹脂等の樹脂を含浸し硬化させた積層板が使用される。回路部材端子と接続する電極、この電極が形成された表面絶縁層及び所定数層の絶縁層と前記各絶縁層を介して配置される所定数層の配線層と所定の前記電極・配線層間を電気的に接続する導体化された穴を有する多層配線板が使用できる。
このような多層配線板として、ガラスクロスを用いた絶縁層により構成された基材もしくは１層以上の導体回路を有する配線基板上に絶縁層と導体回路層とを交互に形成した、ビルドアップ多層基板が好ましい。
【００１７】
表面絶縁層は、樹脂フィルムを用いることができ、この樹脂フィルムはエポキシ樹脂、ポリイミド樹脂、ポリアミドイミド樹脂、変成ポリフェニレンエーテル樹脂、フェノキシ樹脂、アミドエポキシ樹脂、フェノール樹脂やこれらの混合物、共重合物等のフィルムが、またポリサルフォン、ポリエーテルサルフォン、ポリエーテルエーテルケトン、全芳香族液晶ポリエステル、フッ素系樹脂などの耐熱性熱可塑性エンジニヤリングプラスチックのフィルムが使用できる。樹脂フィルム中に有機もしくは無機のフィラーを含むものが使用できる。ガラス基材で補強された樹脂よりなる絶縁層としては、ガラスクロス、ガラス不織布等のガラス基材にエポキシ樹脂、フェノ−ル樹脂等の樹脂を含浸し硬化させたプリプレグが使用できる。
【００１８】
半導体チップや基板の電極パッド上には、めっきで形成されるバンプや金ワイヤの先端をトーチ等により溶融させ、金ボールを形成し、このボールを電極パッド上に圧着した後、ワイヤを切断して得られるワイヤバンプなどの突起電極を設け、接続端子として用いることができる。
【００１９】
図１は、本発明の実施例を示す真空排気によって搭載部品を実装基板に押し付ける工程の断面図である。図中、１は異方導電性接着剤（熱硬化性接着剤）、２は半導体パッケージ部品、３は表面実装部品、４は実装基板、５は基板電極、１０は吸引可能な樹脂製の袋、１１は真空排気口である。
【００２０】
【実施例】
実施例１
実装基板の電極上に異方導電性接着剤を配置した。次に、ＱＦＰパッケージ、抵抗、コンデンサ等の搭載用部品をそれぞれ所定の位置に位置合わせし仮固定した。続いて、部品を仮固定した基板を、予め真空排気できるような排気系を備えたシリコーンゴム製の袋に入れ、ロータリーポンプを用いシリコーンゴム製の袋を０．０５気圧まで排気した。この時、シリコーンゴムと各搭載部品は密着し、各搭載部品は実装基板面に押し付けられる。この状態のまま、１８０℃の加熱炉に６０秒間放置しし、異方導電性接着剤を硬化させた。その後、シリコーンゴム性の袋の中を大気圧に戻し、部品搭載が終了した実装基板を取り出す。以上の工程によって、それぞれの実装部品はすべて実装基板と電気的に接続される。
【００２１】
実施例２
実装基板の電極上に熱硬化性接着剤を塗布形成した。次に、ＱＦＰパッケージ、抵抗、コンデンサ等の搭載用部品をそれぞれ所定の位置に位置合わせし仮置きした。続いて、部品を仮固定した基板を、予め真空排気できるような排気系を備えたシリコーンゴム製の袋に入れ、ロータリーポンプを用いシリコーンゴム製の袋を０．０５気圧まで排気した。この時、シリコーンゴムと各搭載部品は密着し、各搭載部品は実装基板面に押し付けられる。この状態のまま、１５０℃のオーブンの中に３時間放置し、熱硬化性接着剤を硬化させた。その後、シリコーンゴム性の袋の中を大気圧に戻し、部品搭載が終了した実装基板を取り出す。以上の工程によって、それぞれの実装部品はすべて実装基板と電気的に接続される。
【００２２】
【発明の効果】
本発明により、高さや大きさが異なる複数の回路基板またはＩＣや電子部品に一括して圧力を加えつつ接着剤または異方導電接着剤を硬化させ、回路基板またはＩＣや電子部品と回路基板の電気的な接続を得ることができる。
【図面の簡単な説明】
【図１】真空排気によって搭載部品を実装基板に押し付ける工程の断面図である。
【符号の説明】
１ 異方導電性接着剤（熱硬化性接着剤）
２ 半導体パッケージ部品
３ 表面実装部品
４ 実装基板
５ 基板電極
１０ 吸引可能な樹脂製の袋
１１ 真空排気口[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit member mounting method in which a semiconductor chip is bonded and fixed to a substrate with an adhesive, for example, by a flip chip mounting method, and both electrodes are electrically connected.
[0002]
[Prior art]
Currently, solder is used to electrically connect circuit boards to each other or to connect an IC or electronic component to a circuit board. Solder is composed of a low melting point metal, has a relatively low melting point in the metal composition, and the connection strength is also achieved by combining with the electrodes of electronic components and printed wiring boards (mounting boards) used in electronic devices. In addition, mounting of electronic components on a mounting board with solder can be performed in a batch using IR reflow or the like, so that electronic components are mounted on a printed wiring board (mounting board) used in electronic equipment. Used as packaging material.
However, the solder mainly used at present contains lead. This lead is concerned about environmental pollution and adverse effects on living organisms. Therefore, development of solder materials not containing lead has been promoted and some of them are being put into practical use, but there is a problem that the melting point is higher than that of solder containing lead.
[0003]
[Problems to be solved by the invention]
In order to solve the problems of this solder connection, an anisotropic conductive adhesive in which an adhesive or conductive particles are dispersed is used when electrically connecting circuit boards to each other or between an IC or electronic component and a circuit board. There is a method to use.
However, when connecting using such an adhesive or an anisotropic conductive adhesive, it is necessary to dispose these adhesives between the electrodes and cure the adhesive while applying pressure. Therefore, when ICs and electronic components having different heights and sizes are mixedly mounted on one circuit board, it is necessary to pressurize each component independently and cure the adhesive.
The present invention provides a mounting method for a circuit member that is mounted simultaneously with other electronic components, is thermally cured by heat treatment, and obtains electrical conduction between electrodes of the circuit members.
[0004]
[Means for Solving the Problems]
The present invention cures an adhesive or an anisotropic conductive adhesive while collectively applying pressure to a plurality of circuit boards or ICs and electronic components having different heights and sizes, so that the mounting board or IC / electronic parts and the mounting board A circuit member mounting method for obtaining an electrical connection is provided.
[0005]
In the circuit member mounting method of the present invention, the circuit member is easily melted by facing the terminals (a) and (b) to the mounting substrate provided with the terminals (b) corresponding to the terminals (a) of the circuit members. step of mounting through an anisotropic conductive adhesive obtained by dispersing metal particles having a sexual metal surface, the step of coating said mounting entire board having circuit members in airtight elastic sheet, the elastic sheet inside the airtight step reduced pressure uniformly pressurized with the circuit member below 0.3 atm, characterized in that it comprises the step of more electrically connecting the terminals (a) (b) the heating under the pressing step. The elastic sheet is preferably an elastic sheet made of silicone rubber.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
As the metal particles, metal particles such as Au, Ag, Ni, Cu and solder, carbon and the like can be used. In addition, when the conductive layer is formed on the plastic by coating and the outermost layer is precious metal plastic or in the case of hot-melt metal particles, it has deformability by heating and pressurization, so the contact area with the electrode at the time of connection is This is preferable because it increases and reliability is improved. One or more metals selected from the group consisting of Sn, Bi, In, Ag, Sb, Cu, Zn, Ni, Au, Mg, Ga, and Al, which are metal particles having an easily meltable metal surface. The melting point of the conductive fine particles is preferably 250 ° C. or lower, more preferably 100 ° C. or higher and 190 ° C. or lower. The metal particle surface layer may be an easily meltable metal.
[0007]
The adhesive used in the present invention is a UV curing system, a curing agent system that generates free radicals upon heating, a thermosetting epoxy resin, or a mixed system thereof. As a UV curing photoinitiator, benzoin ethyl ether is used. Benzoin ethers such as isopropyl benzoin ether, benzyl ketals such as benzyl and hydroxycyclohexyl phenyl ketone, ketones such as benzophenone and acetophenone and derivatives thereof, thioxanthones, bisimidazoles, etc. Sensitizers such as amines, sulfur compounds, and phosphorus compounds may be added in any ratio.
[0008]
Curing agents that generate free radicals upon heating are those that decompose upon heating of peroxide compounds, azo compounds, etc. to generate free radicals, and are appropriately selected according to the desired connection temperature, connection time, pot life, etc. Is done. A compounding quantity is about 0.05 to 10 weight%, and 0.1 to 5 weight% is more preferable. Specifically, it can be selected from diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide, and the like. Further, in order to suppress corrosion of the connection terminals of the circuit member, the chlorine ions and organic acids contained in the curing agent are preferably 5000 ppm or less, and more preferably less organic acids generated after the thermal decomposition. . Specifically, it is more preferably selected from peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides, and peroxyesters that provide high reactivity. These can be mixed and used as appropriate.
In addition, those encapsulating these curing agents with polyurethane-based or polyester-based polymeric substances and the like and microencapsulated are preferable because the pot life is extended.
[0009]
The radical polymerizable substance used in the present invention is a substance having a functional group that is polymerized by radicals, and examples thereof include acrylates, methacrylates, maleimide compounds, and the like. The radical polymerizable substance can be used in either a monomer or oligomer state, and the monomer and oligomer can be used in combination.
[0010]
The epoxy resin used in the present invention has a skeleton containing a bisphenol type epoxy resin derived from epichlorohydrin and bisphenol A, F, AD, etc., an epoxy novolac resin derived from epichlorohydrin and phenol novolac or cresol novolac, and a naphthalene ring. It is possible to use various epoxy compounds having two or more glycidyl groups in one molecule such as naphthalene epoxy resin, glycidylamine, glycidyl ether, biphenyl, alicyclic, etc. alone or in combination of two or more. It is. For these epoxy resins, it is preferable to use a high-purity product in which impurity ions (Na +, Cl-, etc.), hydrolyzable chlorine, etc. are reduced to 300 ppm or less to prevent electron migration.
The epoxy resin is preferably a trifunctional or higher polyfunctional epoxy resin and / or a naphthalene-based epoxy resin in order to lower the thermal expansion coefficient and improve the glass transition temperature. Examples of the trifunctional or higher polyfunctional epoxy resin include phenol novolac type epoxy resin, cresol novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin, dicyclopentadiene phenol type epoxy resin and the like. Naphthalene-based epoxy resins have a skeleton containing at least one naphthalene ring in one molecule, and include naphthol-based and naphthalenediol-based resins.
[0011]
A necessary amount of a rubber component such as acrylic rubber may be added to the adhesive. As the acrylic rubber, a polymer or copolymer containing at least one of acrylic acid, acrylic ester, methacrylic ester or acrylonitrile as a monomer component is used. Among them, a copolymer type acrylic rubber containing glycidyl acrylate or glycidyl methacrylate containing a glycidyl ether group is preferably used.
In addition, a thermoplastic resin such as a phenoxy resin can be blended in the adhesive in order to make film forming easier. In particular, the phenoxy resin is preferable because it has a similar structure to the epoxy resin and has characteristics such as excellent compatibility with the epoxy resin and excellent adhesion.
[0012]
As epoxy resin curing agents, latent curing agents such as imidazole, hydrazide, boron trifluoride-amine complexes, aromatic sulfonium salts, amine imides, polyamine salts, and dicyandiamide are effective from the viewpoint of fast curing. In addition, an acid anhydride curing agent is also effective because it contains few ionic impurities.
The reflow treatment referred to in the present invention is a whole heating method such as infrared ray, air, vapor phase (VPS), nitrogen, and a partial heating method such as YAG laser, semiconductor laser, xenon lamp, halogen lamp, pulse heater, hot air. It is.
[0013]
Examples of the metal particle arrangement technique of the present invention include those described in JP-A-6-163550 and JP-A-6-310515, and the technique described in JP-A-6-163550 includes both sides. A closed space is formed on a glass jig on which a solder ball can be mounted on the surface side having a large diameter hole having a large number of through holes having different diameters, and the solder ball is sent into the closed space by compressed air. By sucking from the small holes of the glass jig, the solder balls are sucked into the large through holes of the glass jig and arranged. Further, in the technique described in Japanese Patent Laid-Open No. 6-310515, solder balls are supplied by a screw feeder or the like onto a plate on which a certain number of solder balls can be mounted in an alignment, and are arranged by being oscillated by a vacuum pump and a vibrator. ing. Also, a method is provided in which suction holes are provided at desired intervals in the mounting head, the mounting head is moved up and down, and the conductive balls are vacuum-sucked to move the mounting head onto the sheet to be disposed, and then the suction is released and arranged. And a method using a mesh. These techniques may be used.
In addition, the adhesive film may have a multilayer structure of a support layer and an adhesive layer. In that case, an adhesive layer coating → drying → support layer coating → curing → adhesive layer coating → drying step may be taken. . Regarding the dispersion of the conductive fine particles, if electrostatic force is used, excess particles can be recovered, and efficient dispersion can be achieved.
[0014]
Moreover, when shape | molded in the shape of a film in this invention, it is desirable that the surface of electroconductive fine particles is exposed from the surface of the front and back of a film, and it is desirable that the adhesive force is provided to the surface of the film. The conductive fine particles need to have a particle size smaller than the minimum distance between the electrodes of the substrate, and may be deformed into a predetermined shape as necessary. The amount of conductive particles dispersed in the adhesive is 0.1 to 30 parts by volume, preferably 0.2 to 15 parts by volume with respect to 100 parts by volume of the adhesive resin composition.
[0015]
The adhesive for connecting circuit members used in the present invention may be used by screen-printing a liquid adhesive on the electrodes of the circuit board instead of the film adhesive.
As the circuit member, semiconductor packages (QFP, BGA, CSP, SOP, TCP, etc.), chip parts such as capacitors, resistors, coils, connectors, and the like are used.
The circuit member is provided with a large number of terminals, and the circuit member is mounted on the mounting board provided with a number of terminals corresponding to the terminals with the terminals facing each other via an adhesive, and the terminals are electrically connected to each other. And implemented.
As a substrate on which chip components are mounted, an organic insulating substrate on which electrodes (connection terminals) corresponding to semiconductor chip terminals are formed is used.
[0016]
As an organic insulating substrate, a laminated board obtained by impregnating and curing a resin material such as a polyimide resin, an epoxy resin or a phenol resin on a glass substrate such as a polyimide resin or a polyester resin, or a glass cloth or a glass nonwoven fabric. Is used. An electrode connected to the circuit member terminal, a surface insulating layer on which the electrode is formed, a predetermined number of insulating layers, a predetermined number of wiring layers disposed via the insulating layers, and a predetermined number of the electrodes / wiring layers A multilayer wiring board having conductive holes for electrical connection can be used.
As such a multilayer wiring board, a build-up multilayer in which insulating layers and conductor circuit layers are alternately formed on a substrate composed of an insulating layer using glass cloth or a wiring substrate having one or more conductor circuits A substrate is preferred.
[0017]
A resin film can be used for the surface insulating layer, and this resin film is an epoxy resin, a polyimide resin, a polyamide-imide resin, a modified polyphenylene ether resin, a phenoxy resin, an amide epoxy resin, a phenol resin, a mixture thereof, a copolymer, or the like. A film of heat-resistant thermoplastic engineering plastic such as polysulfone, polyethersulfone, polyetheretherketone, wholly aromatic liquid crystal polyester, and fluorine resin can be used. A resin film containing an organic or inorganic filler can be used. As the insulating layer made of a resin reinforced with a glass substrate, a prepreg obtained by impregnating and curing a resin such as an epoxy resin or a phenol resin on a glass substrate such as glass cloth or glass nonwoven fabric can be used.
[0018]
On the electrode pad of the semiconductor chip or substrate, the bump formed by plating or the tip of the gold wire is melted with a torch or the like to form a gold ball, and after the ball is pressed onto the electrode pad, the wire is cut. Protruding electrodes such as wire bumps obtained in this way can be provided and used as connection terminals.
[0019]
FIG. 1 is a cross-sectional view of a process of pressing a mounting component against a mounting board by vacuum evacuation showing an embodiment of the present invention. In the figure, 1 is an anisotropic conductive adhesive (thermosetting adhesive), 2 is a semiconductor package component, 3 is a surface mount component, 4 is a mounting substrate, 5 is a substrate electrode, and 10 is a suckable resin bag. , 11 is a vacuum exhaust port.
[0020]
【Example】
Example 1
An anisotropic conductive adhesive was disposed on the electrodes of the mounting substrate. Next, mounting components such as a QFP package, a resistor, and a capacitor were respectively aligned at predetermined positions and temporarily fixed. Subsequently, the substrate on which the components were temporarily fixed was put in a silicone rubber bag equipped with an exhaust system that could be evacuated in advance, and the silicone rubber bag was evacuated to 0.05 atm using a rotary pump. At this time, the silicone rubber and each mounted component are in close contact with each other, and each mounted component is pressed against the mounting substrate surface. In this state, it was left in a heating furnace at 180 ° C. for 60 seconds to cure the anisotropic conductive adhesive. Thereafter, the inside of the silicone rubber bag is returned to atmospheric pressure, and the mounting board on which component mounting is completed is taken out. Through the above steps, all the mounted components are electrically connected to the mounting board.
[0021]
Example 2
A thermosetting adhesive was applied and formed on the electrodes of the mounting substrate. Next, mounting components such as a QFP package, a resistor, a capacitor, etc. were aligned at predetermined positions and temporarily placed. Subsequently, the substrate on which the components were temporarily fixed was put in a silicone rubber bag equipped with an exhaust system that could be evacuated in advance, and the silicone rubber bag was evacuated to 0.05 atm using a rotary pump. At this time, the silicone rubber and each mounted component are in close contact with each other, and each mounted component is pressed against the mounting substrate surface. In this state, it was left in an oven at 150 ° C. for 3 hours to cure the thermosetting adhesive. Thereafter, the pressure inside the silicone rubber bag is returned to atmospheric pressure, and the mounting substrate on which component mounting is completed is taken out. Through the above steps, all the mounted components are electrically connected to the mounting board.
[0022]
【The invention's effect】
According to the present invention, an adhesive or an anisotropic conductive adhesive is cured while collectively applying pressure to a plurality of circuit boards or ICs and electronic components having different heights and sizes, and the circuit board or the IC or electronic parts and the circuit board are cured. An electrical connection can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a process of pressing a mounted component against a mounting substrate by evacuation.
[Explanation of symbols]
1 Anisotropic conductive adhesive (thermosetting adhesive)
2 Semiconductor Package Component 3
Claims (2)
回路部材を搭載した前記実装基板全体を気密性の弾性シートで被覆する工程、前記気密性の弾性シート内部を０．３気圧以下に減圧し前記回路部材を均一に加圧する工程、
前記加圧工程下で加熱により前記端子（ａ）（ｂ）を電気的に接続する工程を備える回路部材の実装方法。The circuit member is arranged such that the terminals (a) and (b) are opposed to a mounting board provided with terminals (b) corresponding to the terminals (a) of the circuit members, and metal particles having an easily meltable metal surface are dispersed. Mounting through anisotropic conductive adhesive ,
A step of covering the entire mounting substrate on which the circuit member is mounted with an airtight elastic sheet, a step of reducing the inside of the airtight elastic sheet to 0.3 atm or less and pressurizing the circuit member uniformly,
Implementation of a circuit member comprising a step of electrically connecting the more the terminal (a) (b) the heating under the pressing step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30292998A JP4144082B2 (en) | 1998-10-23 | 1998-10-23 | Circuit member mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30292998A JP4144082B2 (en) | 1998-10-23 | 1998-10-23 | Circuit member mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000133771A JP2000133771A (en) | 2000-05-12 |
| JP4144082B2 true JP4144082B2 (en) | 2008-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30292998A Expired - Fee Related JP4144082B2 (en) | 1998-10-23 | 1998-10-23 | Circuit member mounting method |
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| Country | Link |
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| JP (1) | JP4144082B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9787013B2 (en) | 2015-04-28 | 2017-10-10 | Tyco Electronics Japan G.K. | Connector having a moving plate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1280196A1 (en) * | 2001-07-18 | 2003-01-29 | Abb Research Ltd. | Process for bonding electronic devices to substrates |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9787013B2 (en) | 2015-04-28 | 2017-10-10 | Tyco Electronics Japan G.K. | Connector having a moving plate |
Also Published As
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| JP2000133771A (en) | 2000-05-12 |
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