JP2012091319A - Method of manufacturing cutting body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a cutting body for providing the cutting body of a smooth surface being shallow in the processing-deterioration layer depth, when cutting a work by using a resin-coated saw wire of coating resin on a surface of a steel wire.SOLUTION: This cutting body manufacturing method is a method for cutting the work by pulling in an abrasive grain, in the cutting-in direction of the coated saw wire to the work, while restraining pulling-in of the abrasive grain to between a cutting surface and the resin-coated saw wire by the resin, by spraying the abrasive grain on the resin-coated saw wire of coating the steel wire with a hardness-adjusted resin, when cutting the work by the resin-coated saw wire.

Description

  The present invention relates to a method for manufacturing a cut body, and more particularly, a saw wire used when a workpiece such as silicon or ceramics is cut by a saw machine, and the workpiece is cut by a resin-coated saw wire in which a resin is coated on the surface of a steel wire. It is related with the manufacturing method of the cutting body obtained by this.

  A workpiece such as silicon or ceramic is cut by a saw machine to which a saw wire is attached. The saw wire travels in one direction or in both directions (reciprocating direction), and the workpiece can be sliced with an arbitrary width by bringing the workpiece into contact with the saw wire.

  At the time of cutting the workpiece, a method of cutting the workpiece while spraying slurry containing abrasive grains (hereinafter sometimes referred to as loose abrasive grains) on the saw wire (conventional method 1), and attaching and fixing the abrasive grains on the surface of the base wire A method (conventional method 2) for cutting a workpiece using the saw wire with fixed abrasive grains is known. In the former method, loose abrasive grains contained in the sprayed slurry are drawn between the workpiece and the saw wire, and the workpiece is accelerated by wear of the workpiece, whereby the workpiece is cut and the workpiece is cut. On the other hand, in the latter method, the abrasives fixed on the surface promote the wear of the saw wire and the workpiece, thereby promoting the grinding of the workpiece and cutting the workpiece.

  Patent Document 1 discloses a method of cutting a workpiece while embedding a solution containing free abrasive grains using a wire in which the outer peripheral surface of a steel wire such as high carbon steel is covered with an abrasive carrier resin film (conventional method 3). ) Is disclosed.

  By the way, the cut body which cut | disconnected silicon | silicone with the saw wire is used as a board | substrate of a solar cell, for example. However, a work-affected layer (sometimes called a damage layer) is formed on the cut surface of the cut body during cutting. It has been pointed out that the bonding quality with respect to the substrate is deteriorated if the work-affected layer remains, and the characteristics as a solar cell cannot be sufficiently obtained (Patent Document 2), and it is necessary to remove the work-affected layer. is there.

JP 2006-179677 A JP 2000-323736 A

  FIG. 1 shows a state in which a steel wire is used as a saw wire as in the conventional method 1, and free abrasive grains are sprayed on the steel wire and cut while drawing the abrasive grains. According to the study by the present inventors, in this method, the abrasive grains are drawn in the direction in which the steel wire is cut into the workpiece, and the abrasive grains are drawn between the steel wire and the cut surface (work wall surface) of the workpiece. Therefore, it was found that the cut surface of the workpiece was also ground and a work-affected layer was formed. Moreover, it turned out that the surface roughness of a cut surface also becomes coarse.

  FIG. 2 shows a state in which the workpiece is cut while fixing the fixed abrasive grains on the surface of the saw wire or embedding the abrasive grains as in the conventional methods 2 and 3 described above. According to the study by the present inventors, in these methods as well, as in the case of FIG. 1 described above, the cut surface of the workpiece (wall surface of the workpiece) is also ground, so that the work-affected layer is deeply formed.

  As shown in FIG. 1 and FIG. 2, in the conventional method, a work-affected layer is formed on the cut surface of the cut body. It is necessary to remove the work-affected layer. If this process-affected layer removal step can be omitted, the yield and productivity of the cut body can be improved.

  Further, the cut surface is roughened by forming irregularities by abrasive grains used at the time of cutting in addition to forming a work-affected layer. However, since the surface of the cut body is usually required to be smooth, etching is performed in a downstream process. If this etching step can be omitted, the productivity of the cut body can be improved.

  The present invention has been made in view of such a situation, and its purpose is that when a workpiece is cut using a resin-coated saw wire in which the surface of a steel wire is coated with a resin, the work-affected layer depth is low. An object of the present invention is to provide a method for producing a cut body that can obtain a cut body having a shallow and smooth surface.

  The method for producing a cut body according to the present invention that has been able to solve the above-mentioned problems, when cutting a workpiece with a resin-coated saw wire, sprays abrasive grains on a resin-coated saw wire coated with a steel wire with a resin whose hardness is adjusted, The gist is that the workpiece is cut by drawing the abrasive grains in the direction in which the coated saw wire cuts into the workpiece while suppressing the drawing of the abrasive grains between the cutting surface and the resin-coated saw wire by the resin. have.

  The workpiece is preferably cut so that the work-affected layer depth at the cut surface is, for example, 5 μm or less, or the surface roughness is, for example, 0.5 μm or less. It is preferable to cut the workpiece so that the cutting allowance is 1 to 1.05 times the wire diameter of the resin-coated saw wire. As said abrasive grain, it is preferable to spray and cut | disconnect a diamond abrasive grain, for example. As the resin, for example, a resin having a hardness at 120 ° C. of 0.07 GPa or more is preferably used. The cut body obtained by the above production method is also included in the scope of the present invention.

  According to the present invention, the surface of the saw wire is covered with the resin and the hardness thereof is adjusted. Therefore, the pulling of the abrasive grains between the cut surface and the resin-coated saw wire can be suppressed by the resin while pulling and cutting the abrasive grains. Therefore, formation of a work-affected layer on the surface of the cut body can be suppressed. Moreover, when a workpiece | work is cut | disconnected using this resin-coated saw wire, the cut body which has a smooth surface can be manufactured. Therefore, it is possible to remove the work-affected layer or to remove the etching process for smoothing the surface in the downstream process, and the productivity of the cut body can be improved.

  Furthermore, if the resin-coated saw wire is used, the pulling of abrasive grains between the cut surface and the resin-coated saw wire is suppressed, so that the cutting allowance can be reduced and the productivity of the cut body can be improved.

Drawing 1 is a mimetic diagram showing a situation when a work is cut with a steel wire. FIG. 2 is a schematic diagram showing a state when a workpiece is cut with a steel wire with fixed abrasive. FIG. 3 is a schematic view showing a state when a workpiece is cut with a resin-coated saw wire. FIG. 4 is a drawing-substituting photograph obtained by photographing the surface of the resin-coated saw wire (comparative example) after cutting the workpiece. FIG. 5 is a cross-sectional view for explaining the procedure for measuring the work-affected layer depth. FIG. 6 is a drawing-substituting photograph obtained by photographing the cut surface of the workpiece with an optical microscope. FIG. 7 is a drawing-substituting photograph obtained by photographing the cut surface of the workpiece with an optical microscope. FIG. 8 is a drawing-substituting photograph in which the cut surface of the workpiece is photographed with an optical microscope. FIG. 9 is a drawing-substituting photograph obtained by photographing the cut surface of the workpiece with an optical microscope. FIG. 10 is a drawing-substituting photograph in which the cut surface of the workpiece is photographed with an optical microscope. FIG. 11 is a drawing-substituting photograph in which the cut surface of the workpiece is photographed with an optical microscope. FIG. 12 is a graph showing the relationship between the hardness of the resin measured at 120 ° C. and the number of abrasive grains that have digged into the resin surface. FIG. 13 is a graph showing the relationship between the hardness of the resin measured at 120 ° C. and the depth of the work-affected layer formed on the cut surface.

  As shown in FIGS. 1 and 2, when a steel wire or a steel wire with fixed abrasive grains is used as a saw wire and the workpiece is cut while spraying abrasive grains on the saw wire, a work-affected layer is deeply formed on the cut surface of the workpiece. The surface roughness of the cut surface becomes rough.

  On the other hand, if a resin-coated saw wire is used, the work-affected layer can be made shallow and the surface can be made smooth. A state when a workpiece is cut using a resin-coated saw wire will be described with reference to FIG. As shown in FIG. 3, the resin-coated saw wire of the present invention has a resin formed on the surface, and when cutting the workpiece, the resin on the surface is in close contact with the cut surface, so that the abrasive is interposed between the saw wire and the workpiece cut surface. It is possible to prevent the grains from being drawn. Therefore, it is difficult to form a work-affected layer on the cut surface, and the surface of the cut surface is likely to be smooth.

  By the way, when the resin coated on the surface of the steel wire is soft, the abrasive grains bite into the resin as in the conventional method 3, and the abrasive grains are interposed between the resin-coated saw wire and the workpiece as shown in FIG. A work-affected layer is formed on the cut surface.

  Therefore, the present inventors prevent the abrasive grains from biting into the resin surface by appropriately adjusting the hardness of the resin coated on the surface of the steel wire, and when the workpiece is cut with the resin-coated saw wire, The present invention was completed by finding that the depth of the work-affected layer formed in 1 was small and the surface roughness of the cut surface could be reduced. Specifically, in the manufacturing method of the present invention, when cutting a workpiece with a resin-coated saw wire, abrasive grains are sprayed on a resin-coated saw wire coated with a steel wire with a resin whose hardness is adjusted, and the cut surface, the resin-coated saw wire, In the direction in which the coated saw wire cuts into the workpiece, the workpiece is cut by drawing the abrasive grains while suppressing the pulling of the abrasive grains into the gap with the resin.

  When using a resin-coated saw wire adjusted to an appropriate surface hardness and cutting the workpiece with the resin-coated saw wire while spraying abrasive grains on the saw wire, as shown in FIG. Abrasive grains are pulled in, but since the pulling of the abrasive grains between the cut surface and the resin-coated saw wire is suppressed by the resin, a work-affected layer is hardly formed on the cut surface of the workpiece, and the cut surface is smooth. It becomes.

  When the cut body cut with the resin-coated saw wire is used as a material for a solar cell, for example, among the surface properties, the work-affected layer depth is 5 μm or less (preferably 4 μm or less, more preferably 3 μm or less). It is recommended that the resin-coated saw wire be designed so that the surface roughness (arithmetic mean roughness Ra) is 0.5 μm or less (preferably 0.4 μm or less, more preferably 0.3 μm or less). .

  The depth of the work-affected layer may be determined by etching the cut surface and measuring the etch pit depth of the transition introduced when the workpiece is cut.

  As for the surface roughness, arithmetic mean roughness (Ra) may be measured by “CS-3200 (device name)” manufactured by Mitutoyo Corporation.

  Next, a resin-coated saw wire that can be suitably used in the present invention will be described.

  The resin-coated saw wire used in the present invention is obtained by coating the surface of a steel wire with a resin designed according to the above guidelines.

  As the steel wire, it is preferable to use a steel wire having a tensile strength of 3000 MPa or more. As a steel wire having a tensile strength of 3000 MPa or more, for example, a high carbon steel wire containing 0.5 to 1.2% of C can be used. As the high carbon steel wire, for example, a piano wire defined in JIS G3502 can be used.

  The diameter of the steel wire should be as small as possible within a range that can withstand the load applied at the time of cutting, and is, for example, 130 μm or less, preferably 110 μm or less, more preferably 100 μm or less. By reducing the diameter of the steel wire, the cutting allowance can be reduced and the productivity of the cut body can be improved.

  As the resin, a thermosetting resin or a thermoplastic resin can be used, and among these resins, phenol resin, amide resin, imide resin, polyamideimide, epoxy resin, polyurethane, formal, ABS resin, vinyl chloride. , Polyester, and the like can be suitably used. In particular, polyamideimide, polyurethane, or polyester can be preferably used.

  The resin can be formed by applying a commercially available varnish to the surface of the steel wire and heating it.

  As said varnish, the varnish for enameled wires marketed from Tohoku Paint Co., Ltd., the varnish for electric wires marketed from Kyocera Chemical Co., Ltd., etc. can be used.

As the varnish for enameled wire, for example, the following can be used.
(A) Polyurethane varnish (“TPU F1”, “TPU F2-NC”, “TPU F2-NCA”, “TPU 6200”, “TPU 5100”, “TPU 5200”, “TPU 5700”, “TPU K5 132” , “TPU 3000K”, “TPU 3000EA”, etc .; products made by Tohoku Paint Co., Ltd.)
(B) Polyester varnish (“LITON 2100S”, “LITON 2100P”, “LITON 3100F”, “LITON 3200BF”, “LITON 3300”, “LITON 3300KF”, “LITON 3500SLD”, “Neoheat 8200K2”, etc. Product made by corporation.)
(C) Polyamidoimide varnish (“Neoheat AI-00C” etc .; a product made by Tohoku Paint Co., Ltd.)
(D) Polyesterimide varnish (“Neoheat 8600A”, “Neoheat 8600AY”, “Neoheat 8600”, “Nearheat 8600H3”, “Neoheat 8625”, “Neoheat 8600E2”; products manufactured by Tohoku Paint Co., Ltd.)

  Examples of the varnish for electric wires include varnishes for heat-resistant urethane copper wires (such as “TVE5160-27”, epoxy-modified formal resins), varnishes for formal copper wires (such as “TVE5225A”, polyvinyl formal resins), and heat-resistant formal copper wires. Varnishes (“TVE5230-27” and other epoxy-modified formal resins), polyester copper wire varnishes (“TVE5350 series” and polyester resins) and the like (both are products manufactured by Kyocera Chemical Co., Ltd.) can be used.

  After applying the varnish to the surface of the steel wire, for example, the surface of the steel wire may be covered with a resin by thermosetting at 250 ° C. or higher (preferably 300 ° C. or higher). The hardness of the resin can be adjusted, for example, by changing the type of resin to be coated or changing the heating temperature when forming the resin.

  As said resin, it is preferable to use resin whose hardness when measured at 120 degreeC is 0.07 GPa or more. That is, when a workpiece is cut with a resin-coated saw wire, the wire is run at a linear speed of 500 m / min, for example, and the workpiece is cut while the wire and abrasive grains or the wire and the workpiece are in contact with each other. For this reason, the surface of the wire is considered to rise in temperature due to frictional heat and exceed 100 ° C. Therefore, if the hardness of the resin is adjusted based on the hardness measured at 100 ° C. or lower (for example, room temperature), the resin may be softened because it cannot withstand the frictional heat generated during actual workpiece cutting. . When the resin is softened, the abrasive grains easily bite into the resin, so that the depth of the work-affected layer is large and the surface may be roughened.

  Therefore, it is recommended that the hardness of the resin be adjusted based on the hardness when measured at a temperature exceeding 100 ° C. (for example, 120 ° C.) so that it does not soften even if frictional heat is generated when the workpiece is cut. The Specifically, as the resin, it is preferable to use a resin having a hardness when measured at 120 ° C. of 0.07 GPa or more, and more preferably a resin having a hardness of 0.1 GPa or more. By using a resin having a hardness of 0.07 GPa or more when measured at 120 ° C., the number of abrasive grains that bite into the resin surface can be suppressed to 20 / (50 μm × 200 μm) or less, and formed into a cut body. It is possible to reduce the depth of the work-affected layer, and to smooth the surface of the cut body.

  The hardness of the resin can be measured by, for example, a nanoindentation method.

  The film thickness of the resin may be 2 to 15 μm, for example. If the resin is too thin, it is difficult to form the resin uniformly on the surface of the steel wire. Further, if the resin is too thin, the resin is worn out at the initial stage of cutting, so that the wire (steel wire) is exposed, and the wire is worn and easily broken. Accordingly, the thickness of the resin is preferably 2 μm or more, more preferably 3 μm or more, and particularly preferably 4 μm or more. However, if the resin is too thick, the diameter of the resin-coated saw wire increases, so that the cutting allowance increases and the productivity deteriorates. Moreover, since the ratio of the resin to the whole resin-coated saw wire becomes too large, the strength of the entire resin-coated saw wire is lowered. Therefore, if the wire speed is increased in order to increase productivity, the wire tends to be easily disconnected. Therefore, the thickness of the resin is preferably 15 μm or less, more preferably 13 μm or less, and particularly preferably 10 μm or less.

  The diameter (wire diameter) of the resin-coated saw wire is not particularly limited, but is usually about 100 to 300 μm (preferably 100 to 150 μm).

  As the workpiece to be cut with the resin-coated saw wire, for example, silicon, ceramics, crystal, semiconductor member, magnetic material, or the like can be used.

  Next, conditions for manufacturing a cut body by cutting a workpiece using the resin-coated saw wire will be described.

  When cutting a workpiece with the above-described coated saw wire, the workpiece is cut after abrasive grains are sprayed onto the saw wire. As this abrasive grain, a silicon carbide abrasive grain (SiC abrasive grain), a diamond abrasive grain, etc. can be used, for example. In particular, it is preferable to use diamond abrasive grains to smooth the cut surface.

  As said diamond abrasive grain, "SCM fine diamond (brand name)" by Sumiishi Materials Co., Ltd. can be used, for example. As the diamond abrasive grains, a polycrystalline type or a single crystal type can be used, but it is preferable to use a single crystal type. This is because the single crystal type is not easily broken during cutting.

  The average particle diameter of the abrasive grains is not particularly limited, and may be, for example, 2 to 15 μm (preferably 4 to 10 μm, more preferably 4 to 7 μm).

  The average particle size of the abrasive grains can be measured by, for example, “Microtrack HRA (device name)” manufactured by Nikkiso Co., Ltd.

  The abrasive grains are usually sprayed with a slurry dispersed in a working fluid. As the processing liquid, a water-soluble processing liquid or an oil-based processing liquid can be used. As water-soluble processing fluid, ethylene glycol processing fluid “H4” manufactured by Yushiro Chemical Industry Co., Ltd., propylene glycol processing fluid “Histat TMD (trade name)” manufactured by Sanyo Chemical Industries, Ltd., etc. may be used. it can. As the oil-based processing fluid, Yushiro Chemical Industry Co., Ltd. “Yushiron Oil (trade name)” or the like can be used.

  The concentration of abrasive grains in the slurry can be, for example, 5 to 50% by mass (preferably 5 to 30% by mass, more preferably 5 to 10% by mass).

  The temperature of the said slurry should just be 10-30 degreeC (preferably 20-25 degreeC), for example.

  The conditions for cutting the workpiece with the resin-coated saw wire include, for example, a cutting speed of the workpiece of 0.1 to 0.35 mm / min, and a linear velocity of the resin-coated saw wire of 300 m / min or more (preferably 500 m / min or more, More preferably, it may be 800 m / min or more).

Moreover, it is preferable to set the tension (N) applied to the resin-coated saw wire so as to satisfy the range of the following formula (1) calculated based on the tensile strength of the wire (the steel wire before coating the resin). . In the following formula (1), the range of 50 to 70% with respect to the tensile strength of the steel wire is to prevent disconnection at the time of cutting, and “−5.0” is the resin at the time of cutting. This is because the sum of the cutting load applied to the coated saw wire and the pulling load applied when the resin coated saw wire is pulled out from the workpiece is approximately 5.0 N.
Tensile strength × 0.5-5.0 ≦ Tension ≦ Tension strength × 0.7-5.0 (1)

  In addition, although the tensile strength of a steel wire changes with the component composition and wire diameter of a steel wire, for example, when the piano wire (A type) prescribed | regulated to JISG3522 is used, the tensile strength of the steel wire with a wire diameter of 100 micrometers is The tensile strength of the steel wire with 24.3 N and wire diameter of 120 μm is 34.4 N, the tensile strength of the steel wire with wire diameter of 130 μm is 39.7 N, and when a piano wire (type B) is used, the steel wire with a wire diameter of 100 μm is used. The tensile strength of the steel wire having a wire diameter of 120 μm is 36.5 N, the tensile strength of the steel wire having a wire diameter of 130 μm is 45.7 N.

  When the workpiece is cut with the resin-coated saw wire, the workpiece cutting margin is approximately 1 to 1.05 times (preferably 1 to 1.04 times, more preferably 1) with respect to the wire diameter (diameter) of the resin-coated saw wire. ~ 1.03 times). Therefore, the productivity of the cut body can be improved.

  That is, according to the resin-coated saw wire, since the hardness of the resin is appropriately adjusted, even if abrasive grains are sprayed on the resin-coated saw wire, the abrasive particles are not drawn between the cut surface and the resin-coated saw wire. Since it is suppressed by the resin, the cutting allowance is reduced.

  On the other hand, as in the conventional method 1, the cutting allowance when a steel wire is used as the saw wire is a width obtained by adding the length of the steel wire to a length about three times the average diameter of the abrasive grains. Therefore, in order to improve productivity, it is necessary to reduce the diameter of the steel wire, but there is a limit to increasing the strength so that the steel wire does not break, so there is a limit to reducing the cutting allowance.

  Further, when abrasive grains are digged into the resin film as in the conventional method 3, the wire diameter (diameter) of the saw wire is increased, so that the workpiece cutting margin is increased.

  In addition, since the cutting allowance when the workpiece is cut using the steel wire with fixed abrasive as in the conventional method 2 is equal to the diameter of the steel wire with fixed abrasive, to reduce the cutting allowance, It is conceivable to reduce the diameter of the steel wire or reduce the diameter of the fixed abrasive. However, if the diameter of the steel wire is made too small, the strength becomes insufficient, the cutting load applied at the time of cutting cannot be withstood, and the wire may be broken. Further, when the diameter of the fixed abrasive is reduced, the workpiece is difficult to be ground, so that productivity is deteriorated.

  EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited by the following examples, but may be appropriately modified within a range that can meet the purpose described above and below. Of course, it is possible to implement them, and they are all included in the technical scope of the present invention.

  In Experimental Example 1 below, the cutting allowance (kerfloss) when a workpiece is cut by saw wire to produce a cut body is examined. In Experimental Example 2 below, the cut surface is obtained when the workpiece is cut by saw wire to produce a cut body. The depth and surface roughness of the work-affected layer formed on the surface were investigated.

[Experimental Example 1]
A workpiece (single crystal silicon) is attached to the work table, and a saw wire is placed over the work, and abrasives are sprayed on the saw wire. (Carfloss) was measured.

  As the saw wire, the types of saw wires shown in Table 1 below were used.

  No. in Table 1 below. 1, the wire corresponding to the piano wire (Class A, “SWRS 82A”) defined in JIS G3502 is used as the saw wire. Specifically, C: 0.82 mass%, Si: 0.19 mass%, Mn: 0 A steel wire having a diameter of 120 μm was used, which was .49% by mass, and the balance was made of iron and inevitable impurities.

  No. in Table 1 below. In No. 2, as the saw wire, the above No. 2 is used. A wire with fixed abrasive grains in which Ni plating was applied to the surface of a steel wire obtained by drawing the piano wire used in No. 1 to a diameter of 120 μm and diamond abrasive grains having a maximum diameter of 17.5 μm were fixed to the Ni plated layer was used. . The diameter of the wire with fixed abrasive is 155 μm.

  No. in Table 1 below. 3 to 5 are examples in which a resin-coated saw wire in which a resin is coated on the surface of a steel wire with a thickness shown in Table 1 below is used as a saw wire.

  As the steel wire, No. 1 in Table 1 below. In No. 3 above, No. 1 in Table 1 below was used, using a steel wire drawn to a diameter of 120 μm. In No. 4 above, No. 1 in the following Table 1 was used using a steel wire drawn to a diameter of 130 μm from the piano wire used in No. 1. In No. 5 above, A steel wire obtained by drawing the piano wire used in 1 to a diameter of 110 μm was used.

  The resin was formed by applying the following varnish to the surface of the steel wire and then curing it by heating. Specifically, prior to forming the resin, the steel wire is degreased, and then the number of coatings is divided into 4 to 10 times to coat the following varnish, which is heated and cured to form a steel wire. Resin was formed on the surface.

  No. shown in Table 1 below. 3-5, varnish for polyurethane wire “W143” defined by JIS C2351 (manufactured by Tohoku Paint Co., Ltd., varnish for enameled wire “TPU F1 (trade name)”, coating composition after baking is polyurethane) The heating temperature was 250 ° C.

  Table 1 below shows the diameter of the resin-coated saw wire.

  Next, the above No. Single-crystal silicon (60 mm × 20 mm × 50 mm) was cut (sliced) with a multi-wire saw (“D-500” manufactured by Yasunaga Co., Ltd.) using 1-5 saw wires. The slicing process was performed while spraying a slurry in which SiC abrasive grains or diamond abrasive grains having an average particle diameter shown in Table 1 below were suspended in the machining liquid.

  No. in Table 1 below. 1, SiC abrasive grains having an average particle size of 13 μm (“Shinano Random (trade name)” manufactured by Shinano Denki Co., Ltd.) as a processing fluid (“ethylene glycol aqueous solution” manufactured by Yushiro Chemical Industry Co., Ltd.) ) Was used.

  No. in Table 1 below. 3 to 5, diamond abrasive grains having an average particle size of 5.6 μm (manufactured by Sumiishi Materials Co., Ltd., “SCM Fine Diamond (trade name)”) as a processing liquid (manufactured by Yushiro Chemical Industry Co., Ltd.) A slurry suspended in an ethylene glycol aqueous solution ") was used.

  The SiC abrasive grain concentration in the slurry was 50% by mass, the diamond abrasive grain concentration was 5% by mass, the slurry temperature was 20-25 ° C., and the slurry supply rate was 100 L / min.

  The ascent speed (cutting speed) of the work table on which the workpiece is placed is 0.3 mm / min, the linear speed of the resin-coated saw wire is 500 m / min, the tension of the resin-coated saw wire is 25 N, the number of turns of the resin-coated saw wire is 41, and the resin coating The winding pitch of the saw wire was set to 1 mm.

  In addition, No. 1 in Table 1 below. In No. 2, slicing was performed while spraying an ethylene glycol-based aqueous solution containing no abrasive grains between the saw wire and the single crystal silicon.

  The cutting allowance when slicing was performed under the above conditions was measured, and the results are shown in Table 1 below.

  Further, the difference (width loss) between the cutting allowance and the wire diameter (diameter) of the saw wire was calculated, and the results are shown in Table 1 below.

  The following table 1 can be considered as follows. No. 1 is a comparative example in which a steel wire is used as a saw wire. When cutting a workpiece, loose abrasive grains are drawn between the steel wire and the workpiece, and the workpiece is excessively shaved, resulting in a workpiece cutting margin of 160 μm. became. Further, the width loss was as large as 40 μm. Therefore, productivity is getting worse. To narrow the cutting allowance, it is conceivable to reduce the diameter of the steel wire, but the steel wire itself is also cut when cutting the workpiece. Therefore, if the diameter of the steel wire is too small, the steel wire is likely to break. . No. As in 1, when the diameter of the steel wire is 120 μm, it is necessary to replace the steel wire before the diameter of the steel wire is reduced to 100 μm in order to prevent disconnection.

  No. 2 is a comparative example using a wire with fixed abrasive as a saw wire, and the workpiece is cut without spraying loose abrasive, so the cutting allowance of the workpiece is the wire diameter (diameter of the wire with fixed abrasive) ) And 155 μm.

  No. Nos. 3 to 5 are examples in which a workpiece is cut using a resin-coated saw wire in which the surface of a steel wire is coated with a resin, the cutting allowance of the workpiece is 125 to 147 μm, the width loss is as small as 3 to 4 μm, and the productivity It can be seen that can be improved. Further, when the surface of the resin-coated saw wire used for the slicing process was visually observed, the abrasive grains were hardly adhered.

  No. 1 to 3 are examples in which a steel wire obtained by drawing a piano wire to a diameter of 120 μm is used as an element wire, and therefore have the same tensile strength, and the risk of disconnection is considered to be the same. No. 1 to 3 are compared with each other. The cutting allowance of 3 (resin-coated saw wire) is the smallest, and the productivity is the best.

  Based on the results obtained in Experimental Example 1, considering the case where a wafer having a current mainstream thickness of 0.18 mm is cut out from single-crystal silicon having a length of 300 mm, the above-mentioned No. 1 is used as a saw wire. When the steel wire No. 1 is used, since the cutting allowance is 160 μm, the number of wafers acquired is 882. No. above. In the case of using the wire with fixed abrasive of No. 2, since the cutting allowance is 155 μm, the number of wafers acquired is 895, and the above No. 2 is obtained. When the resin-coated saw wire No. 3 is used, since the cutting allowance is 135 μm, the number of acquired wafers is 952.

  When a resin-coated saw wire is used, since the resin has an effect of improving the wear resistance of the steel wire, the steel wire itself is unlikely to decrease in diameter even if slicing is performed. Therefore, the diameter of the steel wire itself can be further reduced. For example, no. When the workpiece is cut using a resin-coated saw wire in which a polyurethane resin is coated with a thickness of 6 μm on the surface of a steel wire having a diameter of 110 μm as shown in FIG. 5, the cutting allowance is 125 μm. It becomes 983 sheets, and productivity can further be improved.

  On the other hand, in the case of a wire with fixed abrasive grains, the average grain size of the abrasive grains is required to be 15 μm or more from the viewpoint of ensuring cutability, and the pulling load from the wire of the wire with fixed abrasive grains is a free abrasive. Three to five times as much as when grains are used is required. Therefore, it is difficult to make the wire diameter of the wire with fixed abrasive grains 120 μm or less from the viewpoint of preventing disconnection. Therefore, no. As shown in FIG. 2, it is difficult to set the cutting allowance to 155 μm or less.

[Experiment 2]
When a workpiece (single crystal silicon) is mounted on the work table, a saw wire is placed above the work, and abrasive grains are sprayed on the saw wire. The cutting allowance, the depth of the work-affected layer formed on the cut surface, and the surface roughness of the cut surface were measured.

  As the saw wire, the types of saw wires shown in Table 2 below were used.

  No. in Table 2 below. 21 to 32 are examples in which a resin-coated saw wire obtained by coating a surface of a steel wire with a thickness shown in Table 2 is used as a saw wire.

  As the steel wire, No. in Table 2 below. In Nos. 21-32, No. A steel wire obtained by drawing the piano wire used in 1 to a diameter of 130 μm was used.

  The resin was formed by applying the following varnish to the surface of the steel wire and then curing it by heating. Specifically, prior to resin formation, after degreasing the steel wire, the number of times of coating is divided into 4 to 10 times and the following varnish is coated, and the resin is heated to a temperature of 150 to 300 ° C. This was heated and cured to form a resin on the surface of the steel wire. The heating temperature is shown in Table 2 below.

  No. shown in Table 2 below. 21, the varnish for polyester wire “W141” defined by JIS C2351 (manufactured by Tohoku Paint Co., Ltd., varnish for enameled wire “LITON 2100S (trade name)”, the coating composition after baking is terephthalic acid-based polyester) Using.

  No. shown in Table 2 below. 22 to 28 and 30 to 32, polyurethane wire varnish “W143” (manufactured by Tohoku Paint Co., Ltd., enameled wire varnish “TPU F1 (trade name)” defined in JIS C2351, the coating composition after baking is Polyurethane).

  No. shown in Table 2 below. In No. 29, a polyamide-imide wire varnish (manufactured by Tohoku Paint Co., Ltd., enameled wire varnish “Neoheat AI-00C (trade name)”, the coating composition after baking was polyamide-imide) was used.

  No. in Table 2 below. 33, No. 1 in Experimental Example 1 above. A steel wire obtained by drawing the piano wire used in 1 to a diameter of 120 μm was used.

  No. in Table 2 below. 34 and 35, No. 1 in Experimental Example 1 above. A steel wire obtained by drawing the piano wire used in 1 to a diameter of 160 μm was used.

  No. in Table 2 below. 36 and 37, No. 1 in Experimental Example 1 above. The wire with fixed abrasive grains (diameter 155 μm) used in 2 was used.

  Here, No. 2 in Table 2 below. With respect to the resin-coated saw wires shown in 25 to 32, the hardness of the resin was measured by the nanoindentation method. The hardness was measured at room temperature (23 ° C.) or 120 ° C. Specific measurement conditions are as follows.

<< Common measurement conditions at room temperature and 120 ℃ >>
Measuring device: “Nano Indenter XP / DCM” manufactured by Agilent Technologies
Analysis software: “Test Works 4” manufactured by Agilent Technologies
Tip: XP
Strain rate: 0.05 / sec Measurement point interval: 30 μm
Standard sample: Fused silica << Measurement conditions at room temperature >>
Measurement mode: CSM (continuous stiffness measurement method)
Excitation vibration frequency: 45 Hz
Excitation vibration amplitude: 2 nm
Indentation depth: Up to 500 nm Measurement point: 15 Measurement environment: Room temperature 23 ° C in air conditioner

  The hardness at room temperature was measured by a continuous stiffness measurement method, and the hardness was measured when the indentation depth from the outermost surface of the resin film was 400 to 450 nm. The hardness was measured at 15 points, and the hardness was calculated by averaging the measurement results. Of the measurement results, if there is an abnormal value (a value that is 3 or more times or 1/3 or less of the average value), remove this and add the newly measured result to obtain the total number of measurement points. Adjustment was made to be 15 points.

<< Measurement conditions at 120 ℃ >>
Measurement mode: Basic (load removal measurement method)
Indentation depth: Up to 450 nm Measurement point: 10 Measurement environment: Sample tray held at 120 ° C with resistance heater

  The hardness at 120 ° C. was measured by a load removal measurement method, and the hardness at a position where the indentation depth from the outermost surface of the resin film was 450 nm was measured. That is, when measuring the hardness while heating the sample, the continuous stiffness measurement method cannot be adopted as when measuring the hardness at room temperature. The load was adjusted so that the hardness was measured.

  The hardness measurement at 120 ° C. was performed while the resin-coated saw wire was attached to a metal nanoindentation sample tray with a ceramic adhesive, and the sample tray was heated with a resistance heater and held at 120 ° C. .

  The hardness measurement at 120 ° C. was performed at 10 points, and the hardness was calculated by averaging the measurement results. Of the measurement results, if there is an abnormal value (a value that is 3 or more times or 1/3 or less of the average value), remove this and add the newly measured result to obtain the total number of measurement points. Adjustment was made to 10 points.

  The hardness measured at room temperature or 120 ° C. is shown in Table 2 below.

  Next, using the saw wire, single-crystal silicon (60 mm × 20 mm × 50 mm) was cut (slicing) with a multi-wire saw (“D-500” manufactured by Yasunaga Co., Ltd.) to produce a cut body. Slicing processing was performed while spraying a slurry in which diamond abrasive grains or SiC abrasive grains having an average particle diameter shown in Table 2 below were suspended in an ethylene glycol-based aqueous solution between saw wire and single crystal silicon.

  No. in Table 2 below. In 21, 24 to 32, 34, and 35, diamond abrasive grains having an average particle diameter of 5.6 μm (manufactured by Sumiishi Materials Co., Ltd., “SCM Fine Diamond (trade name)”) are used as a processing fluid (Yushiro). A slurry suspended in an “ethylene glycol aqueous solution” manufactured by Chemical Industry Co., Ltd.) was used.

  No. in Table 2 below. In Nos. 22 and 23, SiC abrasive grains having an average particle diameter of 5.6 μm (Shinano Denki Smelting Co., Ltd., “Shinano Random (trade name)”) were used as processing grains (“Ethylene Chemicals” manufactured by Yushiro Chemical Industry Co., Ltd.). A slurry suspended in a glycol-based aqueous solution ”) was used.

  No. in Table 2 below. In No. 33, SiC abrasive grains (Shinano Denki Smelting Co., Ltd., “Shinano Random (trade name)”) having an average particle diameter of 13 μm are used as the processing grains (“ethylene glycol aqueous solution” manufactured by Yushiro Chemical Industry Co., Ltd.). ) Was used.

  The concentration of diamond abrasive grains is 5% by mass, and the concentration of SiC abrasive grains is No. 1. Nos. 22 and 23 are 5% by mass. 33 was 50 mass%, the temperature of the slurry was 20 to 25 ° C., and the supply amount of the slurry was 100 L / min. The ascending speed of the work table on which the workpiece is placed is 0.1 mm / min, 0.3 mm / min, or 1 mm / min, the linear velocity of the resin-coated saw wire is 500 m / min, the tension of the resin-coated saw wire is 25 N, The number of windings was 41, and the winding pitch of the resin-coated saw wire was set to 1 mm.

  In Table 2 below, No. In Nos. 36 and 37, slicing was performed while spraying an ethylene glycol-based aqueous solution containing no abrasive grains between the saw wire and the single crystal silicon.

  Next, the surface of the resin-coated saw wire used for slicing was visually observed. As a result, no. On the surface of the resin-coated saw wires used in 21 to 31, almost no abrasive grains were found. In contrast, no. The surface of the resin-coated saw wire used in No. 32 was found to have bite of abrasive grains. No. FIG. 4 shows a drawing-substituting photograph in which the surface of the resin-coated saw wire used in 32 is photographed.

  Here, no. For the resin-coated saw wires used in 25-32, the number of abrasive grains that had digged into the resin surface was measured by the following procedure. That is, the surface of the used resin-coated saw wire was photographed at a magnification of 400 with an optical microscope, and the number of abrasive grains observed in a 50 μm × 200 μm region near the center of the resin-coated saw wire was visually measured. The measurement region is indicated by the dotted line in FIG.

  Next, with respect to the cut body obtained by slicing, the depth of the work-affected layer formed on the cut surface and the surface roughness of the cut surface were measured.

<Processed layer depth>
As shown in FIG. 5 (a), the depth of the work-affected layer formed on the cut surface is embedded in the resin so as to have an inclination of 4 ° with respect to the horizontal direction. As shown, the cut body and the resin were polished so that the cut surface of the cut body was exposed. Next, the exposed surface was etched with an etching solution having the composition shown in Table 3 below, and the work-affected layer formed when the workpiece was cut (etched pits of transition introduced when the workpiece was cut) was observed with an optical microscope.

  The photograph which image | photographed the cut surface of the workpiece | work with the optical microscope is shown in FIGS. FIG. 25, FIG. 27, FIG. 32, FIG. 33, FIG. 35, FIG. 37 shows a drawing substitute photo.

  When observed with an optical microscope, the work-affected layer was shown in black, and this depth (thickness) was measured. The measurement results are shown in Table 2 below.

"Surface roughness"
As for the surface roughness of the cut surface, the arithmetic average roughness Ra was measured over 10 mm with respect to the cutting direction (depth direction of cutting) using “CS-3200 (device name)” manufactured by Mitutoyo Corporation. The measurement results are shown in Table 2 below.

  It can be considered as follows from Table 2 below. No. 21 to 31 are examples in which a cut body was manufactured using the resin-coated saw wire obtained through the steps specified in the present invention, and the depth of the work-affected layer formed on the cut surface was as shallow as 5 μm or less, and the cut surface The arithmetic average roughness Ra is substantially smooth at 0.5 μm or less.

  On the other hand, no. 32 to 37 are examples in which a cut body was produced using a saw wire obtained without going through the steps specified in the present invention. Of these, No. No. 32 is an example using a resin-coated saw wire in which the surface of a steel wire is coated with a resin. However, since the resin is too soft, a phenomenon occurs in which abrasive grains bite into the resin during slicing. The depth of the work-affected layer formed on the cut surface was deeper than 5 μm.

  No. In 33-35, since the steel wire was used as a saw wire, an abrasive grain wraps around between the steel wire and the workpiece, and the cutting allowance increased. Further, the depth of the work-affected layer formed on the cut surface was deep and the surface roughness was also roughened.

  No. Since 36 and 37 use wires with fixed abrasives as saw wires, the cutting allowance is large, the depth of the work-affected layer formed on the cut surface is deep, and the surface roughness is also rough.

  No. above. 21 to 31 have an arithmetic average roughness Ra of 0.5 μm or less on the cut surface. Therefore, when the cut body is used as a material for a solar cell, for example, a fine texture is etched on the surface as it is. can do. On the other hand, the above-mentioned No. In Nos. 33 to 37, since the arithmetic average roughness Ra of the cut surface exceeds 0.5 μm, etching for smoothing the cut surface is required before the fine texture is etched.

  Next, the hardness of the resin and the number of abrasive grains that dig into the resin surface were measured. When the results of 25 to 32 are compared, it can be considered as follows. No. In 25 to 32, the hardness of the resin measured at room temperature was about 0.27 GPa, and the results were almost equal, but the hardness of the resin measured at 120 ° C. was 0.04 to 0.28 GPa. I found that there was variation. The cause of the variation is considered to be the difference in the type of resin and the heating temperature.

  Here, FIG. 12 shows the relationship between the hardness of the resin measured at 120 ° C. and the number of abrasive grains that dig into the resin surface (the number in the observation visual field 50 μm × 200 μm region). From FIG. 12, it can be seen that the greater the hardness of the resin measured at 120 ° C., the smaller the number of abrasive grains that bite into the resin.

  FIG. 13 shows the relationship between the hardness of the resin measured at 120 ° C. and the depth of the work-affected layer formed on the cut surface. It can be seen from FIG. 13 that the depth of the work-affected layer decreases as the hardness of the resin measured at 120 ° C. increases. Moreover, it can be read that if the hardness of the resin measured at 120 ° C. is set to 0.07 GPa or more, the depth of the work-affected layer can be suppressed to 5 μm or less.

  From FIG. 12 and FIG. 13, it can be seen that the depth of the work-affected layer tends to decrease as the number of abrasive grains that bite into the resin surface decreases.

Claims (7)

  When cutting a workpiece with a resin-coated saw wire, abrasive grains are sprayed onto the resin-coated saw wire coated with a steel wire with a resin whose hardness is adjusted, and the drawing of the abrasive grains between the cut surface and the resin-coated saw wire is performed by the resin. A method for manufacturing a cut body, wherein the workpiece is cut by drawing abrasive grains in a direction in which the coated saw wire cuts into the workpiece while suppressing the workpiece.   The manufacturing method of Claim 1 cut | disconnected so that the process-affected layer depth in the cut surface of the said workpiece | work may be 5 micrometers or less.   The manufacturing method of Claim 1 cut | disconnected so that the surface roughness in the cut surface of the said workpiece | work may be 0.5 micrometer or less.   The manufacturing method in any one of Claims 1-3 cut | disconnected so that the cutting allowance of the said workpiece | work may be 1-1.05 times with respect to the wire diameter of a resin-coated saw wire.   The manufacturing method in any one of Claims 1-4 which spray and cut | disconnect a diamond abrasive grain as the said abrasive grain.   The manufacturing method according to claim 1, wherein the resin has a hardness at 120 ° C. of 0.07 GPa or more.   The cut body obtained by the manufacturing method in any one of Claims 1-6.