JP2012084408A - Light source device and lighting system using light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mix light of two or more colors near the primary colors while maintaining heat dissipation.SOLUTION: The light source device includes a chassis 31 housing light sources, a diffusion part 33 arranged at an opening of the chassis with a total transmittance of 95% or less for diffusing light from the light sources, and a substrate 48 mounting at least two kinds or more of LEDs with different emission colors as the light sources and arranged at a bottom face of the chassis. The chassis is to have a distance of 20 mm or more and 30 mm or less from irradiation faces of the LEDs to the diffusion part 33, with its dimension in a light axis direction set at 40 mm or less.

Description

  Embodiments described herein relate generally to a light source device using a light emitting diode (LED) and a lighting device using the light source device.

  2. Description of the Related Art Conventionally, LEDs have been dramatically expanded in various fields such as liquid crystal displays, mobile phones, information terminal backlights, indoor / outdoor advertisements, and the like. Furthermore, due to its features such as long life, low power consumption, impact resistance, high-speed response, high purity display color, lightness, thinness, etc., it has attracted attention not only for industrial fields but also for general lighting. When an LED is used as a white light source of an illumination device, a plurality of LEDs are generally used in combination.

  Three typical methods for configuring a white light source with LEDs are as follows.

(1) A 3LED system using LEDs of R, G, B3 primary colors (2) A system in which a yellow phosphor is lit by a blue LED using a blue LED and a yellow phosphor (and a red phosphor) (3) An ultraviolet LED A method of emitting phosphors of each color by ultraviolet LEDs using phosphors of blue, green and red In particular, a light source device in which the light source is composed of a blue LED and a yellow phosphor as described in (2) above, Since the luminous efficiency is high and a large luminous flux can be obtained, it has become the mainstream of white light sources.

  As a light source device using an LED, there is an apparatus in which an LED chip is arranged in a package and the package is mounted on a substrate. For example, a surface mount device (SMD) in which an LED chip is disposed in a concave portion of a package and the concave portion is filled with a phosphor-containing resin is employed. There is also a light source device configured by mounting a LED chip directly on a substrate, so-called COB (Chip On Board) mounting. Also in this light source device, the periphery of the LED chip is covered with a resin-containing phosphor layer.

  By the way, the light source device using LED is used also for display illumination etc. of a store etc., for example. Such display illumination requires illumination light that takes into consideration not only the color rendering properties but also the color appearance of the product (gamut area ratio Ga). For this reason, there is a need for an LED unit configured by combining two or more types of LED chips in order to highlight the vividness in combination with the color of the irradiated object.

  Further, the LED light source device is expected to further increase the amount of light in the future, and to promote high-efficiency HID (High Intensity Discharge). In order to reduce the size and increase the amount of light, it is necessary to satisfy good reflection characteristics and heat dissipation, and in order to cope with the diversification of usage environments, metal substrates using metals, ceramic substrates, or a combination of both A substrate is used.

  However, when two or more types of LED chips are employed, it is difficult to sufficiently mix two or more types of light close to the primary color while maintaining heat dissipation simply by changing the substrate material.

  JP 2010-129448 A

  An object of the present invention is to provide a light source device capable of sufficiently mixing two or more types of light close to primary colors while maintaining heat dissipation, and an illumination device using the light source device.

  The light source device according to the embodiment includes a housing that stores a light source; a diffusion portion that is disposed in an opening of the housing and diffuses light from the light source and has a total transmittance of 95% or less; and emits light as the light source A board mounted with at least two kinds of LEDs having different colors and disposed on the bottom surface of the casing, wherein the casing has a distance from the emitting surface of the LED to the diffusion portion of 20 mm or more and 30 mm. The size of the housing is configured to be 40 mm or less.

  According to one aspect of the present invention, there is an effect that two or more types of light close to the primary color can be sufficiently mixed while maintaining heat dissipation.

Sectional drawing of the illuminating device which concerns on the 1st Embodiment of this invention, It is a perspective view of the decomposition | disassembly state of the socket apparatus and lamp device of an illuminating device. The top view for demonstrating the state of arrangement | positioning of the LED module board | substrate 48. FIG. The chart for explaining that reliable color mixing is possible by experiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  The light source device according to the embodiment includes a housing that stores a light source; a diffusion portion that is disposed in an opening of the housing and diffuses light from the light source and has a total transmittance of 95% or less; A board mounted with at least two kinds of LEDs having different colors and disposed on the bottom surface of the casing, wherein the casing has a distance from the emitting surface of the LED to the diffusion portion of 20 mm or more and 30 mm. The size of the housing is configured to be 40 mm or less.

  The diffusion unit may be formed of a diffusion plate or a microhole system.

  In addition, the light source has a function of improving at least one of color rendering properties and vividness of colors by being constituted by two or more kinds of LEDs.

  The illumination device according to this embodiment is characterized by using the light source device.

  1 and 2 show a first embodiment, in which FIG. 1 is a cross-sectional view of a lighting device, and FIG.

  The illuminating device 11 is, for example, a downlight, and includes a fixture main body 12, a socket device 13 attached to the fixture main body 12, and a lamp device 14 detachably attached to the socket device 13.

  The instrument main body 12 is made of metal and is integrally formed with a reflector, and includes a circular flat plate portion 17 and a reflective plate portion 18 that is bent downwardly from the peripheral portion of the flat plate portion 17. Yes. The diameter of the reflecting plate portion 18 is increased toward the lower side. The flat plate portion 17 is attached to a ceiling or the like (not shown).

  The socket device 13 attached to the flat plate portion 17 has a cylindrical socket device body 21 made of an insulating synthetic resin, and a fitting hole 22 is formed in the center of the socket device body 21 in the vertical direction. It is formed through.

  The lamp device 14 as a light source device has a lamp device main body 31 fitted in the fitting hole 22 of the socket device main body 21. The lamp device main body 31 has a two-stage columnar shape of a wide diameter portion 44 having a wide diameter on the opening end side and a base portion 35 having a narrow diameter on the bottom surface side. A narrow base 35 on the bottom side is configured to fit into the fitting hole 22 of the socket device body 21. An annular contact surface 43 between the base portion 35 and the wide diameter portion 44 of the lamp device main body 31 faces the lower surface of the socket device main body 21 in a state where the base portion 35 is fitted into the fitting hole 22. The base part 35 is, for example, a GX53 type.

  A pair of socket portions 24 are formed on the lower surface of the socket device body 21. These socket portions 24 are formed with connection holes 25, and a receiving metal (not shown) for supplying power to the inside of the connection holes 25 is arranged. The connection hole 25 is an arcuate groove portion that is rotationally symmetrical with respect to the center of the socket device main body 21, and an enlarged diameter portion 26 is formed at one end of the arcuate groove portion.

  On the other hand, a pair of conductive metal lamp pins 45 protrudes from the contact surface 43 of the lamp device main body 31 through an insulating material 46. A large-diameter portion 47 is formed at the tip of these lamp pins 45. And the large diameter part 47 of each lamp pin 45 is inserted from the enlarged diameter part 26 of each connection hole 25 of the socket apparatus 13, and when the lamp pin 45 moves to the connection hole 25 by rotation of the lamp apparatus 14, the lamp pin 45 is moved. The lamp device 14 is configured to be held in contact with the socket device 13 by being in electrical contact with the socket of the socket device 13 and having the large-diameter portion 47 hooked on the edge of the connection hole 25.

  A diffusing portion 33 is attached to the lamp device main body 31 so as to close the tip opening of the wide diameter portion 44. The diffusing portion 33 is attached to the lamp device main body 31 by engaging an engaging portion 33 a provided at the opening end portion with an engaging portion 49 provided at the tip of the wide diameter portion 44.

  The diffusion part 33 is formed of transparent or light diffusing glass or synthetic resin having translucency. In the present embodiment, a diffuser having a total transmittance of 95% or less is employed as the diffusing unit 33. From the viewpoint of mixed light, it is desirable that the total transmittance of the diffusion portion 33 is as low as possible. However, the lower the total transmittance, the darker the illumination. If the total transmittance is 95% or more, it is difficult to mix colors in the proposed SMD size.

  In the present embodiment, the LED module substrate 48 is attached to the bottom surface of the base portion 35 of the lamp device main body 31 in a close contact state so as to be able to conduct heat. A plurality of LEDs 32a and 32b (hereinafter, representatively referred to as LEDs 32) are mounted on the LED module substrate 48, and each LED 32 is connected to a wiring pattern (not shown) formed on the metal LED module substrate 48. ing. Each LED 32 includes a plurality of types of LEDs, and a plurality of types of color light emitted from each LED 32 is diffused by the diffusion unit 33.

  Note that, by attaching the lamp device 14 to the socket device 13, the base portion 35 of the lamp device 14 is configured to be in close contact with the instrument main body 12 so as to allow heat conduction. The lamp device main body 31 is entirely formed of a metal such as aluminum having excellent heat dissipation, and is made of, for example, aluminum die casting. The base portion 35 has a structure in which the entire plate-like portion constituting the bottom surface is in close contact with the flat plate portion 17 of the instrument body 12. Thereby, the heat generated in the LED module substrate 48 is efficiently conducted to the base portion 35 and the instrument body 12 and is radiated from the instrument body 12 very efficiently. Therefore, the temperature rise of LED32 can be suppressed and the luminous efficiency of LED32 can be maintained in a high state. For example, in the present embodiment, the difference between the substrate temperature of the LED module substrate 48 and the temperature at the bottom surface of the base portion 35 can be 20 ° C. or less.

  Further, in the present embodiment, since the LED module substrate 48 is attached to the bottom surface of the base portion 35, the distance h1 from the emission surface of each LED 32 to the diffusion portion 33 is set as the unit size in the optical axis direction of the illumination device 11. Compared to h2, it can be as large as possible. Thereby, in the comparatively thin illuminating device 11 using multiple types of LED, reliable color mixing is possible.

  In the present embodiment, the distance h1 is 20 mm or more and 30 mm or less, and the distance h2 is 40 mm or less. If the distance h2 is 40 mm or more, the unit weight increases, and holding and electrical connection become difficult. In addition, the slim shape unique to LEDs is also distorted.

  FIG. 3 is a plan view for explaining a state of arrangement of the LED module substrate 48 and shows the lamp device main body 31 as viewed from the diffusion portion 33 side.

  For example, SMD LEDs 32a and COB LEDs 32b are mounted on the LED module substrate 48 disposed on the bottom surface of the base 35. FIG. 3 shows an example in which an LED 32b is arranged at the center of the LED module substrate 48, and eight LEDs 32a are arranged around the LED 32b. In addition, as LED mounted in the LED module board | substrate 48, you may employ | adopt not only LED which is structurally different like FIG. 3, but LED of the same structure.

  In the present embodiment, LEDs that emit two or more types of light are mounted on the LED module substrate 48. For example, an LED that emits blue-green light in which a blue LED is covered with a green phosphor may be employed as the LED 32a, and an LED that emits red light may be employed as the LED 32b.

  In the present embodiment, it can be applied to all LED light source devices that mount LEDs that emit two or more kinds of light on the LED module substrate 48, the color emitted by each LED, the structure of each LED, The emission intensity of the LEDs, the number of LEDs for each type, the arrangement position of each LED, and the like are not particularly limited.

(Modified example of diffusion part)
In the example of FIG. 1, the example in which the diffusion portion 33 is configured by a diffusion plate made of glass or synthetic resin has been described. However, as the diffusion portion 33, the diffusion structure described in Japanese Patent No. 4461197 (hereinafter referred to as microhole method). Can be adopted.

  In the case where the diffusing unit 33 is configured by the microhole method of Japanese Patent No. 4461197, the diffusing unit 33 includes, for example, a first light guiding layer, a first reflecting layer, a second light guiding layer, a second reflecting layer, and a light diffusing layer. A five-layer structure of layers can be used. The first reflective layer is formed on the surface of the second light guide layer by a printing process, and the second reflective layer is formed on the surface of the light diffusion layer by a printing process.

  The first and second reflective layers are configured by circular holes having the same pitch and a light transmitting hole that transmits a part of the light, and a reflection region that reflects a part of the light. And the light transmission hole of the 1st and 2nd reflection layer is formed so that the hole diameter of the upper part of LED32 may be small compared with the part away from LED32. That is, the first and second reflective layers are formed such that the light transmission rate at the upper part of the LED 32 is smaller than that of the portion away from the LED 32 that is the light source.

  Thus, the first and second reflective layers are adjusted so as to strongly reflect the strong light on the upper part of the LED 32 and obtain uniform brightness as a whole.

  The first and second light guide layers have a configuration in which light scattering particles made of a material having a refractive index different from that of a base material are dispersed in a base material formed of a transparent resin. Most of the light emitted from the LED 32 and incident on the first light guide layer is appropriately reflected and scattered by the light scattering particles and propagates widely in the first light guide layer. Similarly, the second light guide The light is further propagated inside the layer, and is emitted to the front face through the light transmission holes of the first and second reflective layers while ensuring uniformity of luminance.

  According to the diffusing unit 33 configured in this manner, the light emitted from the LED 32 enters the first light guide layer by turning on the LED 32. The light is scattered and propagated in the first and second light guide layers, then emitted from the second reflective layer, further diffused by the light diffusion layer, and then irradiated.

  Next, it will be described with reference to FIG. 4 that reliable color mixing is possible in the illumination device 11.

  FIG. 4 is a chart for explaining that reliable color mixing is possible through experiments.

  FIG. 4 shows the evaluation results of the visual diffusion evaluation when the apparatus according to the present embodiment is used and the various conditions, that is, the type of LED, the type of the diffusing part, and the distance h1 from the emitting surface of the LED to the diffusing part are changed Is shown. Experiments 1 to 8 in FIG. 4 show eight kinds of experiments using the apparatus in the present embodiment. The circles in FIG. 4 indicate the conditions adopted in each experiment.

  In FIG. 4, the casing material is aluminum and the thickness is 1 mm. In addition, as described above, in the present embodiment, any of COB, SMD, and the like may be adopted as the LEDs 32a and 32b, and can be applied to a light source using two or more types of LEDs that generate various colored lights. FIG. 4 shows an example in which two or more types appropriately selected from a combination of a blue LED, a green LED, a red LED, and a blue LED and a phosphor are used. In addition, COB shows an example in which the light emitting part uses 30 mm square, and SMD uses two light emitting parts of 6 × 6 mm square and 3 × 5 mm square. The material of the bottom surface of the base part 35 is metal (aluminum) from the viewpoint of heat dissipation. However, in order to ensure insulation of a circuit such as a lighting circuit (not shown) disposed in the vicinity of the base part 35, it is provided under the circuit or on the side. An insulating sheet or insulating plate is used.

  In the visual diffusion evaluation of FIG. 4, × is poor, Δ is slightly bad, ○ is good, and ◎ is very good. According to the luminous diffusion evaluation in Experiments 1 to 8 in FIG. 4, it can be seen that sufficient light mixture is not obtained when the distance h1 is 10 mm or less. When the distance h1 is 15 mm or more, it can be seen that relatively good light mixing is obtained regardless of the type of LED and the diffusion method. In particular, it can be seen that when the distance h1 is 30 mm, a very good result can be obtained as a visual diffusion evaluation.

  Although not shown in FIG. 4, when only an LED having a sufficiently small area of the light emitting portion is employed, sufficient color mixing can be obtained even when the distance h1 from the emitting surface of the LED 32 to the diffusing portion 33 is relatively small. . However, when an LED having a light emitting portion area of 5 × 5 mm square or more is adopted, it is considered that a certain length or more is required as the distance h1.

  In the present embodiment, a distance h1 of 20 mm or more is adopted from the experimental results of FIG. In addition, since the base part 35 is disposed at one end of the lamp device body 31 in the optical axis direction and the diffusion part 33 is disposed at the other end, the LED module substrate 48 is disposed on the bottom surface of the base part 35. Even when the distance h1 is set to 20 mm or more, the distance h2 can be made sufficiently small. If the distance h1 is set to 30 mm or less, for example, the distance h2 can be set to 40 mm or less. As a result, a reduction in size and thickness can be achieved, and reliable light mixing (color mixing) is possible.

  In FIG. 4, only the LED with a maximum size of 30 mm square is used for the size of the light emitting unit, but even when the size of the light emitting unit is larger than this, the light emitting units are arranged sufficiently apart from each other. In some cases, similar results are obtained.

  As described above, in the present embodiment, the LED module substrate having different types of LEDs is arranged on the bottom surface of the base part, which is the GX53 type device protrusion (internal socket part), so that the substrate to the diffusion cover can be arranged. The distance increases and sufficient diffusion is possible even with a general diffusion cover. In this case, in the present embodiment, sufficient color mixing is possible, and a heat dissipation structure and a dimension in the optical axis direction that achieves a small size and a thin shape are defined. A light source device that obtains heat dissipation performance and good color mixing performance can be configured.

  The invention described in the above embodiment is not limited to the embodiment, and various modifications can be made without departing from the spirit of the invention in the implementation stage. Further, the embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiment, the problems described in the column of problems to be solved by the invention can be solved, and the effects described in the effects of the invention can be achieved. In the case of being obtained, a configuration from which this configuration requirement is deleted can be extracted as an invention.

11 ... lighting device,
12 ... Appliance body,
13 ... Socket device,
14 ... Lamp device,
31 ... Main body of the lamp device,
32 ... LED,
35 ... The base part,
48 ... LED module substrate.

Claims (4)

A housing for storing the light source;
A diffusing portion disposed in the opening of the housing and having a total transmittance of 95% or less for diffusing light from the light source;
A substrate on which at least two kinds of LEDs having different emission colors are mounted as the light source and disposed on the bottom surface of the housing;
Comprising
The case is configured so that a distance from the emitting surface of the LED to the diffusion portion is 20 mm or more and 30 mm or less, and a dimension in the optical axis direction of the case is 40 mm or less;
A light source device characterized by that.   The light source device according to claim 1, wherein the diffusion unit is configured by a diffusion plate or by a microhole system.   The light source device according to claim 1, wherein the light source has a function of improving at least one of color rendering properties and color vividness by being configured by two or more kinds of LEDs.   An illumination device using the light source device according to any one of claims 1 to 3.

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