JP2012079976A5 - - Google Patents
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- Publication number
- JP2012079976A5 JP2012079976A5 JP2010225044A JP2010225044A JP2012079976A5 JP 2012079976 A5 JP2012079976 A5 JP 2012079976A5 JP 2010225044 A JP2010225044 A JP 2010225044A JP 2010225044 A JP2010225044 A JP 2010225044A JP 2012079976 A5 JP2012079976 A5 JP 2012079976A5
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- thermistor
- ceramic substrate
- electrode film
- thermistor according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims 12
- 239000010408 film Substances 0.000 claims 6
- 239000000919 ceramic Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910000510 noble metal Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010225044A JP2012079976A (ja) | 2010-10-04 | 2010-10-04 | 薄膜サーミスタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010225044A JP2012079976A (ja) | 2010-10-04 | 2010-10-04 | 薄膜サーミスタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012079976A JP2012079976A (ja) | 2012-04-19 |
| JP2012079976A5 true JP2012079976A5 (cg-RX-API-DMAC10.html) | 2013-11-07 |
Family
ID=46239864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010225044A Pending JP2012079976A (ja) | 2010-10-04 | 2010-10-04 | 薄膜サーミスタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012079976A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6543888B2 (ja) * | 2013-05-13 | 2019-07-17 | 株式会社村田製作所 | 電子部品 |
| US11215514B2 (en) * | 2016-10-07 | 2022-01-04 | Semitec Corporation | Electronic component for welding, mounted board and temperature sensor |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3819081B2 (ja) * | 1996-09-18 | 2006-09-06 | 石塚電子株式会社 | 温度センサ |
| JPH10172806A (ja) * | 1996-12-11 | 1998-06-26 | Murata Mfg Co Ltd | 温度センサ及びその製造方法 |
| JP2003247897A (ja) * | 2002-02-26 | 2003-09-05 | Ishizuka Electronics Corp | 温度センサ |
| JP2007115938A (ja) * | 2005-10-21 | 2007-05-10 | Ishizuka Electronics Corp | 薄膜サーミスタ |
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2010
- 2010-10-04 JP JP2010225044A patent/JP2012079976A/ja active Pending