JP2012079469A - Organic el element and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL element that can be securely sealed and can utilize a substrate space effectively, and a manufacturing method therefor.SOLUTION: An upper surface side of a control substrate 2 is provided with a cathode 3, a light-emitting part 5 on the cathode 3, and an anode 7 on the light-emitting part 5. A lower surface side of the control substrate 2 is provided with a control element 8 for controlling the light emission of the light-emitting part 5, a secondary coil 9 for receiving power from the outside of an organic EL element 1, a rectifying circuit 20 for rectifying the current from the secondary coil 9, a land 10 connected to the cathode 3 by a through-hole 11, a land 14 connected to an anode terminal 15 via a through-hole 16, a wire 12 for connecting the control element 8 and each land 10, a wire 13 for connecting the control element 8 and the secondary coil 9, and the like. Thus, an element main body 30 is formed. The element main body 30 is completely sealed by a first seal layer 17 and a second seal layer 18.

Description

  The present invention relates to an organic electroluminescence element (hereinafter referred to as an organic EL element) and a method for producing the same.

  Conventionally, it is known to seal the entire element for the purpose of extending the life of the organic EL element (for example, see Patent Document 1). In the flexible organic EL element described in Patent Document 1, after the first sealing is performed by bonding the transparent substrate on which the anode layer, the organic light emitting medium layer, and the cathode layer are formed, and the sealing plate with an adhesive, Second sealing is performed by melting the outer periphery of the sealing plate.

JP 2006-286242 A

  However, as described in Patent Document 1, when the organic EL formed on the substrate is sealed with a sealing plate, an adhesive layer that closes the gap between the substrate and the sealing plate is around the organic EL element. It is formed in a frame shape. The seal width of the adhesive layer (in other words, the adhesive margin of the adhesive) should be at least 2 mm in order to sufficiently prevent moisture and oxygen from entering and to increase the adhesive strength between the substrate and the sealing plate. desirable. In this case, a non-light-emitting portion having a width of 2 mm or more by the adhesive layer is formed as a space for sealing the organic EL around the entire periphery of the organic EL element in plan view.

  In addition, in the organic EL element described in Patent Document 1, only the organic EL element is sealed, and an electrode for connecting to an external drive circuit or power supply circuit is a gap between the substrate and the sealing plate. It was exposed to the outside from the adhesive layer that plugs. Therefore, the sealing of the organic EL element is insufficient, which causes air and moisture to enter the inside.

  An object of the present invention is to solve the above-described problems, and provides an organic EL element capable of reliably sealing and effectively utilizing a substrate space, and a method for manufacturing the same. is there.

  The organic EL device according to the first aspect of the present invention includes an insulating substrate, a plurality of first electrodes provided on the first surface side of the substrate, and an organic compound provided on the first electrode. Between the formed light emitting part, a second electrode provided on the light emitting part opposite to the first electrode, and having a polarity different from that of the first electrode, and between the first electrode and the second electrode A control element that controls the voltage applied to control light emission of the light emitting unit, a coil that supplies power to the control element, a rectifier circuit that rectifies current from the coil and supplies the current to the control element, In the second electrode, a first sealing layer provided on the side opposite to the light emitting part side and having at least an insulating property, and provided on a second surface side opposite to the first surface of the substrate, and provided with at least an insulating property. A second sealing layer having an outer peripheral portion of the first sealing layer and the first sealing layer The outer peripheral portion of the sealing layer is sealed, and the substrate, the first electrode, the second electrode, the control element, the coil, and the rectifier circuit are sealed therein, and the second electrode and the first sealing layer Or at least one of the combination of the first electrode, the substrate, and the second sealing layer has translucency.

  According to the first aspect, the main body of the organic EL element is completely sealed by the first sealing layer and the second sealing layer and has no portion exposed to the outside. Electric power is supplied from the outside of the organic EL element by a method such as electromagnetic induction by a coil. Therefore, the organic EL element can be reliably sealed, and deterioration due to the ingress of air or moisture can be prevented.

  The organic EL element according to the second aspect of the present invention includes an insulating substrate, a plurality of first through holes and second through holes that are provided on the substrate and have conductivity through the thickness direction of the substrate, A first electrode provided on the first surface side of the substrate and electrically connected to the first through hole; a light emitting portion formed of an organic compound provided on the first electrode; and the light emission A second electrode that is provided on the opposite side of the first electrode, has a polarity different from that of the first electrode, has translucency, and is electrically connected to the second through hole; In the second electrode, provided on the side opposite to the light emitting part side, provided with a first sealing layer having insulation and translucency, and provided on the second surface side opposite to the first surface of the substrate. A third electrode electrically connected to the first through hole and a second of the substrate A fourth electrode provided on the surface side and electrically connected to the second through hole; and a wiring provided on the second surface side of the substrate and connected to the third electrode and the fourth electrode, respectively. A control element that is provided on the second surface side of the substrate and is connected to the wiring and controls light emission of the light emitting unit, a coil that supplies power to the control element, and a current from the coil is rectified A rectifier circuit that supplies the control element to the control element, and a second sealing layer that is provided to cover the wiring, the control element, the coil, and the rectifier circuit and has at least an insulating property. The outer periphery of the stop layer and the outer periphery of the second sealing layer are sealed, and the substrate, the first electrode, the second electrode, the wiring, the third electrode, the fourth electrode, and the control are contained therein The element, the coil, and the rectifier circuit are enclosed. To.

  In the second aspect, the main body of the organic EL element is completely sealed by the first sealing layer and the second sealing layer and has no portion exposed to the outside. Electric power is supplied from the outside of the organic EL element by a method such as electromagnetic induction by a coil. Therefore, the organic EL element can be reliably sealed, and deterioration due to the ingress of air or moisture can be prevented. Furthermore, by providing a control element, a coil, a rectifier circuit, and the like on the surface opposite to the surface on which the light emitting portion is provided, the display portion can be widened.

  An organic EL element according to a third aspect of the present invention includes an insulating first substrate, a plurality of first through holes provided on the first substrate and having conductivity through the thickness direction of the first substrate, and A second through hole, a conductive land provided on the first surface side of the first substrate and electrically connected to the first through hole, and abutting and electrically connecting to the land A first electrode, a light emitting part formed on the first electrode in contact with the organic compound, provided on the light emitting part on the opposite side of the first electrode, and having a different polarity from the first electrode; A second electrode having translucency and electrically connected to the second through hole; and an insulating and translucent second electrode in which the second electrode is formed on the first surface. Insulation provided on the substrate and the second surface opposite to the first surface in the second substrate And a first sealing layer having translucency, and a third electrode provided on the second surface side opposite to the first surface of the first substrate and electrically connected to the first through hole A fourth electrode provided on the second surface side opposite to the first surface of the first substrate and electrically connected to the second through hole; and a second surface of the first substrate Provided on the second side, connected to the third electrode and the fourth electrode, respectively, and provided on the second surface side of the first substrate, connected to the wiring, and controls light emission of the light emitting unit. A control element, a coil that supplies power to the control element, a rectifier circuit that rectifies current from the coil and supplies it to the control element, and covers the wiring, the control element, the coil, and the rectifier circuit A second sealing layer having at least an insulating property, and provided outside the first sealing layer And the outer periphery of the second sealing layer are sealed, and the first substrate, the second substrate, the first electrode, the second electrode, the wiring, the third electrode, and the fourth electrode are contained therein The control element, the coil, and the rectifier circuit are enclosed.

  In the third aspect, the main body of the organic EL element is completely sealed by the first sealing layer and the second sealing layer and has no portion exposed to the outside. Electric power is supplied from the outside of the organic EL element by a method such as electromagnetic induction by a coil. Therefore, the organic EL element can be reliably sealed, and deterioration due to the ingress of air or moisture can be prevented. Furthermore, the substrate is divided for each function into a first substrate provided with a rectifier circuit, wiring, a control element and a coil, and a second substrate provided with a light emitting part. Since the EL element is formed, the substrate structure is simplified, the assembling work is facilitated, and the assembling work efficiency is improved.

  A charge injection blocking unit that is provided between a part on the first electrode and the light emitting unit and blocks injection of charges for the light emitting unit to emit light may be provided. In this case, it is possible to prevent the light emission of the portion by providing the charge injection blocking portion in the portion where it is not desired to emit light.

  The first electrode may be a cathode, and the second electrode may be an anode. In this case, in the organic EL element in which the anode is disposed on the light emitting surface side and the cathode is disposed on the non-light emitting surface side, the organic EL element can be reliably sealed, and deterioration due to the ingress of air or moisture can be prevented.

  The first electrode may be an anode, and the second electrode may be a cathode. In this case, in the organic EL element in which the cathode is disposed on the light emitting surface side and the anode is disposed on the non-light emitting surface side, the organic EL element can be reliably sealed, and deterioration due to the ingress of air or moisture can be prevented.

  The manufacturing method of the organic EL element which concerns on the 4th aspect of this invention is a manufacturing method which manufactures an organic EL element provided with the light emission part formed with the organic compound, Comprising: Plural which penetrates an insulating board | substrate in the thickness direction Forming a first through hole and a second through hole, and forming a first electrode electrically connected to the first through hole on the first surface side of the substrate; A second electrode side opposite to the first surface of the first electrode, a third electrode electrically connected to the first through hole, a wiring connected to the third electrode and a coil that receives power from the outside, and An electrode forming step for forming a fourth electrode electrically connected to the second through hole, a plating step for plating the walls of the first and second through holes to provide conductivity, and a first step of the substrate. The first through hole on one side A first electrode forming step for forming the first electrode to be electrically connected; and a light emitting portion forming step for forming the light emitting portion formed of an organic compound on the first electrode formed in the first electrode forming step. And forming a second electrode on the light emitting portion, the second electrode having a polarity different from that of the first electrode and having translucency and electrically connected to the second through hole. A rectifier circuit forming step for forming a rectifier circuit for rectifying a current flowing from the coil on the substrate; a control element mounting step for mounting a control element for controlling light emission of the light emitting unit on the substrate; In the second electrode, a first sealing layer having insulation and translucency is provided on the side opposite to the light emitting part side, and at least insulation is provided on the second surface side opposite to the first surface of the substrate. A second sealing layer is provided to seal the entire organic EL element Characterized in that a stop step.

  According to the 4th aspect, a 1st electrode, a light emission part, a 2nd electrode, and a sealing layer are piled up in order on the 1st surface side of a board | substrate. Further, the third electrode, the fourth electrode, the coil, the control element, the rectifier circuit, and the wiring are formed on the second surface side of the substrate. Since the outside can be sealed with the first sealing layer and the second sealing layer, it can be reliably sealed and can be easily manufactured by a conventionally known method.

  The manufacturing method of the organic EL element which concerns on the 5th aspect of this invention is a manufacturing method which manufactures an organic EL element provided with the light emission part formed with the organic compound, Comprising: The said manufacturing method includes a 1st board | substrate formation process, The first substrate forming step includes a plurality of first through holes and second holes penetrating through the insulating first substrate in the thickness direction. The first substrate forming step includes a second substrate forming step, a substrate laminating step, and a sealing step. A through hole forming step of forming a through hole, and forming a conductive land electrically connected to the first through hole on the first surface side of the first substrate, opposite to the first surface; A third electrode electrically connected to the first through hole, a wiring connected to the third electrode, a coil for receiving power transmission from the outside, and an electrical connection to the second through hole Electrode etc. forming the fourth electrode connected to A plating step for plating the walls of the first and second through holes to provide conductivity, a rectifying circuit forming step for forming a rectifying circuit on the substrate for rectifying the current flowing from the coil, and the first A control element mounting step of mounting a control element for controlling light emission of the light emitting unit on the substrate, wherein the second substrate forming step includes the second through-hole in the second substrate having insulation and translucency. A second electrode electrically connected to the second electrode, a second electrode for forming a light emitting part formed of an organic compound on the second electrode, and a light emitting part forming step, and an organic compound at an end of the second electrode. A second electrode contact portion forming step for peeling the layer to form a contact portion to the second electrode, and a charge injection blocking portion forming step for forming a charge injection blocking portion for blocking charge injection into the light emitting portion And the charge injection blocking unit And a first electrode forming step of forming a first electrode in contact with the light emitting portion, wherein the substrate stacking step forms the second substrate on the first substrate formed in the first substrate forming step. The second substrate formed in the step is laminated and fixed, and the sealing step is a first step that has insulation and translucency on the second electrode of the second substrate on the side opposite to the light emitting part side. A sealing layer is provided, and a second sealing layer having at least an insulating property is provided on the second surface side of the first substrate to seal the entire organic EL element.

  According to the fifth aspect, the first substrate including the rectifier circuit, the wiring, the control element, and the coil is formed in the first substrate forming step, and the second substrate including the light emitting unit is formed in the second substrate forming step. Since these substrates are stacked and fixed in the stacking step and the entire substrate is sealed in the sealing step, the organic EL element can be easily manufactured and the assembly efficiency can be improved. In addition, sealing can be ensured.

It is a top view of organic EL element 1 of a first embodiment. It is a bending sectional view of organic EL element 1 in the XX line in FIG. 3 is a plan view of a control board 2. FIG. 2 is a plan view of a primary coil 100 that applies power to an organic EL element 1. FIG. It is a flowchart which shows the manufacturing process of the organic EL element 1 in 1st embodiment. It is a top view of the control board 2 of the modification of 1st embodiment. It is a top view of the organic EL element 101 of 2nd embodiment. It is a bending sectional view of organic EL element 101 in the XI-XI line in FIG. It is a flowchart which shows the manufacturing process of the organic EL element 101 in 2nd embodiment. It is a flowchart of a 1st board | substrate formation process. It is a flowchart of a 2nd board | substrate formation process. 3 is a longitudinal sectional view of a first substrate 42. FIG. 3 is a longitudinal sectional view of a second substrate 31. FIG. It is a top view of the organic EL element 130 of 3rd embodiment. It is a top view of the control board 2 of 3rd embodiment. It is a top view of the organic EL element 150 of 4th embodiment. FIG. 17 is a cross-sectional view in the direction of the arrows along the line XII-XII of FIG. FIG. 17 is a cross-sectional view in the direction of the arrows along the line XIII-XIII of FIG. 16 of the organic EL element 150 of the fourth embodiment. FIG. 17 is a cross-sectional view in the direction of the arrows along the line XIV-XIV in FIG.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. The drawings to be referred to are used for explaining the technical features that can be adopted by the present invention, and the device configuration and the manufacturing method described are not intended to limit the present invention, but are merely described. It is an example.

  Hereinafter, the organic EL element 1 which is 1st embodiment of this invention is demonstrated with reference to FIGS. In the organic EL element 1 of the present embodiment, the light emitting unit 5 is provided on the upper surface side (upper side in FIG. 2) of one control board 2, and the lower surface side (lower side in FIG. 2) of the control board 2 is provided. In addition, a control element and a rectifier circuit are provided. This is a single-sided light emitting type organic EL element.

  The physical structure of the organic EL element 1 of the first embodiment will be described with reference to FIGS. In the following, the left side of FIG. 2 is the upper surface side from which the organic EL element 1 emits light. The right side of FIG. 2 is the lower surface side of the organic EL element 1. As shown in FIG. 1, the organic EL element 1 of the present embodiment has a tape-like structure formed in a substantially rectangular shape in plan view.

  As shown in FIGS. 1 to 3, the organic EL element 1 includes a cathode 3 provided on the upper surface side of a control substrate 2 serving as a skeleton, and a light emitting unit 5 provided on the cathode 3. In addition, an anode 7 formed in a layer shape is provided on the upper side of the light emitting unit 5 (see FIG. 2). An anode terminal 15 connected to the anode 7 is provided on the upper surface side of the control board 2. Further, on the lower surface side of the control board 2, a secondary that receives power from a control element 8 that controls light emission of the light emitting unit 5 and a primary coil 100 (see FIG. 4) that supplies power from the outside of the organic EL element 1. A coil 9, a rectifier circuit 20 for rectifying the current from the secondary coil 9, a land 10 connected to the cathode 3 through a through hole 11, and a land 14 connected to the anode terminal 15 through a through hole 16, A wiring 12 that connects the control element 8 and each land 10, a wiring 13 that connects the control element 8, the secondary coil 9, and the land 14 are provided. The element body 30 is formed by these configurations.

  Further, on the upper surface side of the anode 7, a first sealing layer 17 having a rectangular shape in plan view, which is slightly larger than the control substrate 2, is provided. The 1st sealing layer 17 is comprised from the film of the synthetic resin which has insulation and translucency. Further, a second sealing layer 18 having the same shape as that of the first sealing layer 17 is provided on the lower surface side of the control substrate 2. Note that the second sealing layer 18 may be made of the same material as that of the first sealing layer 17 so as to have insulating properties and translucency. Moreover, the outer peripheral part of the 1st sealing layer 17 and the 2nd sealing layer 18 becomes the sealing part 19 adhere | attached and sealed with the adhesive agent outside illustration. As an example of the material of the first sealing layer 17 and the second sealing layer 18, for example, a transparent resin film formed of PET or the like can be used. The element body 30 is sealed by adhering the entire outer periphery of the first sealing layer 17 and the second sealing layer 18. In addition, as an adhesive which adhere | attaches the outer peripheral part of the 1st sealing layer 17 and the 2nd sealing layer 18, a UV curable epoxy adhesive or a thermosetting epoxy adhesive can be used.

  Hereafter, each said structure is demonstrated in detail. The control substrate 2 is an insulating substrate that constitutes the skeleton of the organic EL element 1. For example, the control board 2 is a synthetic resin film formed of PET, PEN, PS, PES, PC, polyimide, cycloolefin, or the like. The control substrate 2 may have a gas barrier film made of an inorganic material on the surface thereof. The control board 2 of this embodiment is formed of PET.

  The cathode 3 is an electrode stacked on the upper surface of the control substrate 2 that injects electrons into the light-emitting portion 5 by applying a current. For example, the cathode 3 is an electrode made of Al formed on the upper surface of the control substrate 2 by mask vapor deposition or the like. The cathode 3 is formed with a thickness of about 100 nm as an example.

The light emitting unit 5 is an organic thin film formed of an organic compound that is a light emitting material, and is laminated on the upper surface of the cathode 3. In this embodiment, as shown in FIG. 1, four 7-segment display parts are formed by the plurality of light emitting parts 5. Examples of the light emitting material that can be used to form the light emitting portion 5 include the following. A polyparaphenylene vinylene derivative, a polyfluorene derivative, a polythiophene derivative, or the like can be used as the polymer light emitting material (corresponding to each color of R, G, and B). As the blue light emitting low molecular weight material, TPB (tetraphenyl butadiene), perylene, a distyryl biphenyl derivative, DPT, or the like can be used. As the green light-emitting low molecular weight material, PMDFB, coumarin, quinacridone, aluminum complex (for example, AlQ ₃ ), Beq2, BeMq2, ZnMq2, Mgq2, or the like can be used. As the yellow light emitting low molecular weight material, rubrene, BTX, ABTX, AlPrq3 and the like can be used. As red light emitting low molecular weight materials, Nile red, DCM (4-dicyanomethylene-2-methyl-6-dimethylaminostyryl-4-pyran), DCJTB (4-dicyanomethylene-6-Cipidurolidinostyryl-2-tarscha) Rubutyl-4H-pyran), squarylium and the like can be used. The light emitting unit 5 of the present embodiment is formed of a polyfluorene derivative. In addition, as an example of the thickness of the light emission part 5, it is 70 nm.

  A hole injection layer (not shown) is laminated on the upper surface of the light emitting unit 5. This hole injection layer is a layer that lowers the energy barrier of hole injection to the light emitting portion 5. For example, the hole injection layer can be formed using PEDOT or polyaniline.

  The anode 7 is an electrode stacked on the upper surface of the light emitting unit 5 that injects holes into the light emitting unit 5 by applying a current. The anode 7 is a transparent electrode formed of, for example, ITO, IZO, PEDOT, polyaniline, or the like. The anode 7 of this embodiment is made of ITO.

  As shown in FIG. 2, the control board 2 is formed with a plurality of through holes 11 and through holes 16 penetrating the control board 2 in the vertical direction. The inner walls of the plurality of through holes 11 and through holes 16 are made conductive by plating. The cathode 3 provided on the upper surface side of the control substrate 2 is connected to the upper end portion of the through hole 11, and the land 10 provided on the lower surface side of the control substrate 2 is connected to the lower end portion of the through hole 11, 3 and the land 10 are electrically connected. Each land 10 is connected to the control element 8 by a wiring 12. The anode terminal 15 provided on the upper surface side of the control board 2 is connected to the upper end portion of the through hole 16, and the land 14 provided on the lower surface side of the control board 2 is connected to the lower end portion of the through hole 16. Thus, the anode terminal 15 and the land 14 are electrically connected. The land 14 is connected to the control element 8 by a wiring 13. The anode terminal 15 is connected to the anode 7.

  In the organic EL element 1 having the above configuration, the power from the primary coil 100 is received by the secondary coil 9, rectified by the rectifier circuit 20, and supplied to the control element 8, the anode 7, and the cathode 3. The control element 8 is an IC that controls the lighting of the light emitting unit 5. The control element 8 is activated by the current from the secondary coil 9 and controls the voltage between the anode 7 and the cathode 3 to control the light emitting unit 5 of the organic EL element 1. Control light emission.

  Next, the manufacturing method (first manufacturing process) of the organic EL element 1 will be described with reference to the flowchart of FIG. First, a through hole forming step is performed (S11). In this step, through holes 11 and 16 are drilled from the cathode 3 and the anode 7 to the lower surface of the control board 2 on a substrate of a synthetic resin film having a double-sided copper attached, which has been cut into a rectangle of a predetermined size in advance. Etc. (S11). Further, it may be formed by punching or by laser processing.

  Next, an electrode formation process is performed (S12). In this step, power is transmitted from the land 10 connected to the through hole 11, the land 14 connected to the through hole 16, the wirings 12 and 13 from the control element 8, and the external primary coil 100 to the lower surface of the control board 2. The secondary coil 9 for receiving is formed by an etching method (S12). The copper foil on the upper surface of the control board 2 is removed by etching except for the cathode 3 (S12). Next, a plating process is performed (S13). In this step, the inner wall surfaces of the through holes 11 and 16 are sensitized, electrolessly plated, and then electroplated to impart conductivity (S13). Next, a first electrode forming step is performed (S14). In this step, an AL film is formed as a cathode 3 on the upper surface of the control substrate 2 as an example by mask vapor deposition or the like to a thickness of 100 nm (S14).

  Next, a light emitting portion forming step is performed (S15). In this step, an organic EL is formed on the cathode 3 as an example with a thickness of 70 nm by a coating method or the like (S15). Next, a second electrode forming step is performed (S16). In this step, the anode 7 is formed on the entire surface with a thickness of 150 nm by vapor deposition or sputtering, using ITO as an example (S16). At this time, the anode terminal 15 is formed so as to be in contact with the through hole 16 wired from the anode 7 to the lower surface. Next, a rectifier circuit forming step is performed (S17). In this step, a rectifier circuit 20 for converting electric power from the secondary coil 9 into direct current is formed on the lower surface side of the control board 2. As the rectifier circuit 20, a silicon diode chip or the like is soldered.

  Next, a control element mounting step (S18) is performed. In this step, the control element 8 made of a flat package IC is mounted on the lower surface of the control board 2, and the segmented cathode formed in the DC output from the rectifier circuit 20 and the electrode forming step (S12). 3 and the land 10 corresponding to the anode 7 are connected by soldering. Next, a sealing step is performed (S19). The element body 30 is sandwiched between the first sealing layer 17 and the second sealing layer 18, and the outer peripheral portions of the first sealing layer 17 and the second sealing layer 18 are bonded together with an adhesive and sealed (S19). .

  In the organic EL element 1 having the above-described configuration, the element body 30 is completely sealed in the first sealing layer 17 and the second sealing layer 18, and terminals and the like are not drawn out to the outside. Become. Therefore, it is possible to prevent deterioration by preventing the ingress of air and moisture. As shown in FIG. 6, the control element 8, the rectifier circuit 20, the secondary coil 9, and the like may be provided on the upper surface side of the control board 2. In this case, the control board 2 is not provided with the through holes 11 and 16. This is because the light emitting unit 5 is provided on the upper surface side of the control board 2 on the same side as the side on which the control element 8, the rectifier circuit 20, and the secondary coil 9 are provided. In the modification of the first embodiment shown in FIG. 6, if the anode 7 and the first sealing layer 17 are light-transmitting members, the first sealing layer 17 side can be a light emitting surface. In addition, if the cathode 3, the control substrate 2, the land 10, and the second sealing layer 18 are light-transmitting members, the second sealing layer 18 side can be a light emitting surface. Further, if the anode 7, the first sealing layer 17, the cathode 3, the control substrate 2, the land 10, and the second sealing layer 18 are light-transmitting members, double-sided light emission can be achieved.

  Next, the organic EL element 101 according to the second embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the second substrate 31 on which the light emitting unit 5 is formed and the first substrate 42 on which the control element 8 and the wirings 12 and 13 are formed are manufactured in separate steps, and then these substrates are overlapped. The organic EL element 101 of single-sided emission is manufactured by sealing.

  First, the physical structure of the organic EL element 101 will be described with reference to FIGS. In the following, the left side of FIG. 8 is the upper surface side of the organic EL element 101. The right side of FIG. 8 is the lower surface side of the organic EL element 101. In the present embodiment, the upper surface side of the organic EL element 101 functions as a light emitting surface.

  As shown in FIG. 7, the organic EL element 101 has a tape-like structure formed in a substantially rectangular shape in plan view. Further, as shown in FIG. 8, a plurality of thin substrates configured by function are stacked in the vertical direction, and have a thin plate-like appearance as a whole. Specifically, in the organic EL element 101, the second substrate 31 is laminated on the upper side, and the first substrate 42 is laminated on the lower side.

  The second substrate 31 is a substrate having insulating properties and translucency, and is a transparent resin film formed of PET or the like. As shown in FIG. 8, a light-transmitting anode 37 made of ITO is formed on the lower surface side of the second substrate 31, and formed on the lower surface side of the anode 37 with an organic compound that is a light emitting material. A light emitting portion 35 made of the organic thin film is formed. The anode 37 and the light emitting unit 35 are developed in substantially the same area as the second substrate 31. Also, a cathode 33 is formed below the light emitting portion 35, and is configured between the light emitting portion 35 and the cathode 33 by Cr or the like that blocks injection of charges for the light emitting portion 35 made of an organic thin film to emit light. A contact portion 36 is formed. Further, a contact portion 32 is formed at the left end portion of the second substrate 31 so that the organic thin film on the anode 37 can be removed for electrical conduction. The above configuration is formed on the second substrate 31 side. A hole injection layer (not shown) is formed between the light emitting unit 35 and the anode 37. The hole injection layer is a layer that lowers the energy barrier for hole injection with respect to the light emitting portion 35. For example, the hole injection layer can be formed using PEDOT or polyaniline.

  As shown in FIG. 8, the first substrate 42 has a plurality of through holes 11 and through holes 16 penetrating in the thickness direction of the first substrate 42. Further, on the upper surface side of the first substrate 42, lands 34 that contact the cathode 33 and anode terminals 15 that contact the contact portion 32 are formed. Further, on the lower surface side of the first substrate 42 and on the lower surface side of the control substrate 2, the control element 8 that controls the light emission of the light emitting unit 35 and the primary coil 100 that supplies power from the outside of the organic EL element 101. A secondary coil 9 that receives power from (see FIG. 4), a rectifier circuit 20 that rectifies the current from the secondary coil 9, a land 10 that is connected to the cathode 33 via the land 34 through the through hole 11, A land 14 connected to the anode terminal 15 through the through hole 16, a wiring 12 connecting the control element 8 and each land 10, a wiring 13 connecting the control element 8 and the secondary coil 9, and the like are provided. ing. The 1st board | substrate 42 is comprised from the material similar to the control board 2 of 1st embodiment. Moreover, the control element 8, the secondary coil 9, the rectifier circuit 20, the land 10, the land 14, and the wirings 12 and 13 are the same material and configuration as in the first embodiment. The second substrate 31 is laminated and fixed on the first substrate 42 having such a configuration, and the whole is sealed with the first sealing layer 17 and the second sealing layer 18 having insulating properties and translucency. The outer peripheral portions of the first sealing layer 17 and the second sealing layer 18 are sealed portions 19 that are bonded and sealed with an adhesive (not shown).

  Next, a method for manufacturing the organic EL element 101 (hereinafter, also referred to as “second manufacturing process”) will be described with reference to the flowcharts of FIGS. As shown in FIG. 9, the second manufacturing process includes a first substrate forming process (S 31) for forming the first substrate 42, a second substrate forming process (S 32) for forming the second substrate 31, Substrate lamination in which the second substrate 31 formed in the second substrate formation step (S32) is laminated on the first substrate 42 formed in the substrate formation step (S31), and the cathode 33 is brought into contact with and fixed to the land 34. It consists of a process (S33) and a sealing process (S34).

  First, the first substrate forming step (S31) will be described with reference to the flowchart shown in FIG. In the first substrate forming step (S31), first, a through hole forming step is performed (S51). In this process, a through hole 11 is formed for wiring development from the cathode 33 and the anode 37 to the back surface of the control board 2 on the first substrate 42 of a synthetic resin film bonded with copper on both sides, which has been cut into a rectangle of a predetermined size in advance. 16 is formed with a drill or the like (S51). Further, it may be formed by punching or by laser processing.

  Next, an electrode forming process is performed (S52). In this step, the land 10 connected to the through hole 11, the land 14 connected to the through hole 16, the wirings 12 and 13 from the control element 8, and the external primary coil 100 are formed on the lower surface side of the first substrate 42. A secondary coil 9 for receiving power transmission is formed by etching (S52). At this time, the copper foil on the upper surface of the first substrate 42 is etched leaving only the land 34 (S52). Next, a plating process is performed (S53). The inner wall surfaces of the through holes 11 and 16 are sensitized, electrolessly plated, and then electroplated to impart conductivity (S53). Next, a rectifier circuit forming step is performed (S54). In this step, the rectifier circuit 20 for converting the electric power from the secondary coil 9 into direct current is formed on the lower surface side of the first substrate 42. Next, a control element mounting step (S55) is performed. In this step, the control element 8 made of a flat package IC is mounted on the lower surface of the first substrate 42, and the DC output from the rectifier circuit 20 and the land 10 formed in the electrode formation step (S52) are soldered. Connect with. This state is the first substrate 42 in the sectional view shown in FIG. Further, when the first substrate 42 is viewed from the lower surface side, it is in the same state as the control substrate 2 of FIG.

  Next, the second substrate forming step (S32) will be described with reference to the flowchart shown in FIG. In the second substrate forming step (S32), first, a second electrode and light emitting portion forming step is performed (S41). In this step, an anode 37 made of an ITO film is formed on the lower surface side of the second substrate 31 made of a film substrate formed in a substantially rectangular shape in plan view having insulation and translucency such as PET. Thereafter, a PEDOT layer (not shown) is formed on the lower surface side of the anode 37, and a light emitting portion 35 made of an organic thin film (organic EL film) formed of an organic compound as a light emitting material is formed on the entire surface below the PEDOT layer. . Next, a second electrode contact portion forming step (S42) is performed. In this step, the organic thin film at the left end portion (see FIG. 13) of the second substrate 31 is removed to form a contact portion 32 for receiving power from the first substrate 42 (S42).

  Next, a charge injection blocking portion forming step is performed (S43). In this step, the segmented contact portion 36 of the cathode 33 is formed of a Cr layer by mask vapor deposition. As an example, the thickness is 100 nm. Alternatively, the portion corresponding to the contact portion 36 of the light emitting portion 35 is subjected to mask exposure and photobleached. This is to prevent the light emitting portion 35 facing the contact portion 36 from emitting light. In the organic EL, it is necessary to inject electrons from the cathode 33 and holes from the anode 37 in order to emit light. When the contact portion 36 is formed by Cr vapor deposition, the work function of Cr is large, so that the energy gap with the LUMO level of the light emitting portion 35 is widened and electron injection from the cathode 33 is inhibited. Accordingly, this portion does not emit light. Further, when the light emitting portion 35 (organic layer) of the contact portion 36 is photobleached, the electrical conductivity of the organic layer is lowered, and either or both of holes and electrons are not injected. Accordingly, this portion does not emit light. A common point between the above two methods is to make it difficult for either or both of holes and electrons to be injected. That is, the contact part 36 functions as a charge injection blocking part.

  Next, a first electrode forming step is performed (S44). In this step, the segmented cathode 33 is mask-deposited so as to contact the contact portion 36 and the light emitting portion 35. As an example, an electrode layer of 100 nm of AL is formed (S44). The substrate formed in the above steps S41 to S44 is referred to as a second substrate 31. This state is the second substrate 31 in the cross-sectional view shown in FIG.

  Next, a substrate stacking step is performed in which the second substrate 31 shown in FIG. 13 is stacked on the first substrate 42 shown in FIG. 12 and fixed (FIG. 9: S33). At this time, the land 34 of the first substrate 42 and the cathode 33 of the second substrate 31 come into contact with each other and are electrically connected. At this time, as shown in FIG. 8, the first substrate 42 and the second substrate 31 are laminated so that the land 34 comes into contact with the portion of the cathode 33 extending to the lower surface side of the contact portion 36. Then, a sealing process (FIG. 9: S34) is performed. In this step, as shown in FIG. 8, the laminated element body 30 is entirely sealed with the first sealing layer 17 and the second sealing layer 18, and the first sealing layer 17 and the second sealing layer 18 are then sealed. The outer peripheral portion is a sealing portion 19 that is sealed with an adhesive (not shown).

  In the organic EL element 101 formed in the second manufacturing process, since the second substrate 31 is simply laminated on the first substrate 42 formed in advance, the element structure can be simplified, and manufacturing can be easily and efficiently performed. . Further, the entire laminated element body 30 is sealed with the first sealing layer 17 and the second sealing layer 18, and the outer peripheral portions of the first sealing layer 17 and the second sealing layer 18 are not shown. Since the sealing portion 19 is sealed by being bonded with an agent, the sealing performance is high, and entry of air and moisture can be prevented.

  Next, with reference to FIG.14 and FIG.15, the organic EL element 130 of 3rd embodiment is demonstrated. Below, only a different point from the organic EL element 101 of 2nd embodiment is demonstrated. As shown in FIG. 7, in the organic EL element 101 of the second embodiment, the contact portion 36 is formed inside the segment (cathode 33) that emits light. The organic EL element of the third embodiment In 130, the contact part 36 is formed outside the segment (cathode 33) that emits light. Further, as shown in FIG. 15, the land 10 and the through hole 11 are also provided at positions corresponding to the cathode 33 and the contact portion 36 shown in FIG. By doing in this way, 7-segment characters can be displayed large, and the area can be used effectively.

  Next, an organic EL element 150 according to the fourth embodiment will be described with reference to FIGS. 17 is a cross-sectional view taken along line XII-XII in FIG. 16 of the organic EL element 150, and FIG. 18 is a cross-sectional view taken along line XIII-XIII in FIG. FIG. 19 is a cross-sectional view of the organic EL element 150 taken along the line XIV-XIV in FIG. In the organic EL element 150 of the fourth embodiment, as shown in FIGS. 16 and 17, the control substrate 2 is eliminated, and a transparent film substrate 152 on which a light emitting portion is formed is provided on an anode that is a transparent electrode. 7 is formed. In addition, as shown in FIG. 17, the light emitting part 5 is formed on the anode 7, and the contact part 36 and the cathode 33 are formed on the light emitting part 5. And it is covered with a resist sheet 151. Further, the secondary coil 9 and the wiring 13 are formed on the resist sheet 151. As shown in FIG. 18, the control element 8 is provided on the resist sheet 151. As shown in FIG. 19, an electrode 115 is provided on the film substrate 152, and an electrode 116 is provided on the anode 7. In addition, these electrodes 115 and 116 are connected to the secondary coil 9 and the wiring 113. Further, as shown in FIG. 16, a rectifier circuit 20 is also provided on the resist sheet 151. Note that the organic EL element 150 is entirely sealed with an insulating sealing layer (not shown), and the sealing layer on the light emitting surface side is further translucent. In the organic EL element 150 according to the fourth embodiment, since the control board 2 is eliminated, the board can be made flexible and thin. In the present embodiment, since the secondary coil 9 is provided at the edge of the organic EL element 150, it can correspond to the primary coil 100 that uses radio waves having a long wavelength. In the organic EL element 150 according to the fourth embodiment, light can be extracted from any surface as long as the cathode 33, the film substrate 152, and the sealing layer are made translucent.

  An example of the “board” of the present invention is the “control board 2” of the first embodiment. An example of “first electrode” is “cathode 3 and cathode 33”. An example of the “second electrode” is “anode 7 and anode 37”. An example of the “third electrode” is “land 10”. An example of the “fourth electrode” is the “land 14”. An example of the charge injection blocking layer is the “contact portion 36”. An example of “first through hole” is “through hole 11”, and an example of “second through hole” is “through hole 16”.

  It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, although not shown, in the first embodiment, the formation positions of the cathode 3 and the anode 7 may be interchanged. In the second embodiment, the formation positions of the cathode 33 and the anode 37 may be interchanged. The first electrode may be a cathode and the second electrode may be an anode. Conversely, the first electrode may be an anode and the second electrode may be a cathode.

  In the above embodiment, the position, quantity, hole diameter, pitch, and the like of the plurality of through holes 11 can be changed as appropriate. For example, for the purpose of increasing the strength of the control board 2 or the first board 42, the hole diameter of the through holes 11 may be reduced or the pitch may be increased. For the purpose of increasing the light emission luminance of the organic EL element 1, the hole diameter of the through holes 11 may be increased or the pitch may be decreased. Further, the first substrate forming step and the second substrate forming step may be performed first or simultaneously. In addition, the charge injection blocking unit may be between the second electrode and the light emitting unit.

  In the above-described embodiment, the organic EL elements 1, 101, 130, and 150 that emit light on one side have been exemplified. In this case, the cathode 3 and the control substrate 2 may be formed of a transparent material. In addition, the thickness, shape, and size of the organic EL elements 1, 101, 130, and 150, the thickness of each layer included in the organic EL elements 1, 101, 130, and 150, the material, the forming method, the position and quantity of various electrodes, Needless to say, the shape and the like can be appropriately changed. In the first embodiment, the cathode 3 and the land 10 may be connected by a wiring not shown, and the anode terminal 15 and the land 14 may be connected by a wiring not shown, without using the through hole 11. The same applies to the second to fourth embodiments.

DESCRIPTION OF SYMBOLS 1 Organic EL element 2 Control board 3 Cathode 5 Light emission part 7 Anode 8 Control element 9 Secondary coil 10 Land 11 Through hole 12 Wiring 13 Wiring 14 Land 15 Anode terminal 16 Through hole 17 First sealing layer 18 Second sealing layer DESCRIPTION OF SYMBOLS 20 Rectifier circuit 30 Element main body 31 2nd board | substrate 32 Contact part 33 Cathode 34 Land 35 Light emission part 36 Contact part 37 Anode 42 1st board | substrate 100 Primary coil 101 Organic EL element 130 Organic EL element 150 Organic EL element

Claims (8)

An insulating substrate;
A plurality of first electrodes provided on the first surface side of the substrate;
A light emitting part formed of an organic compound provided on the first electrode;
A second electrode provided on the side opposite to the first electrode in the light emitting portion, and having a polarity different from that of the first electrode;
A control element for controlling light emission of the light emitting unit by controlling a voltage applied between the first electrode and the second electrode;
A coil for supplying power to the control element;
A rectifier circuit that rectifies current from the coil and supplies the current to the control element;
A first sealing layer provided on the opposite side of the light emitting part in the second electrode and having at least an insulating property;
A second sealing layer provided on the second surface side opposite to the first surface of the substrate, and having at least an insulating property;
The outer periphery of the first sealing layer and the outer periphery of the second sealing layer are sealed, and the substrate, the first electrode, the second electrode, the control element, the coil, and the rectifier circuit are contained therein Enclosed,
A member of at least one of the combination of the second electrode and the first sealing layer or the combination of the first electrode, the substrate and the second sealing layer has translucency. An organic EL device characterized by that. An insulating substrate;
A plurality of first through holes and second through holes provided on the substrate and having conductivity penetrating in a thickness direction of the substrate;
A first electrode provided on the first surface side of the substrate and electrically connected to the first through hole;
A light emitting part formed of an organic compound provided on the first electrode;
The second light emitting portion is provided on the opposite side of the first electrode, has a different polarity from the first electrode, has translucency, and is electrically connected to the second through hole. Electrodes,
A first sealing layer provided on the side opposite to the light emitting part side in the second electrode and having insulating properties and translucency;
A third electrode provided on the second surface side opposite to the first surface of the substrate and electrically connected to the first through hole;
A fourth electrode provided on the second surface side of the substrate and electrically connected to the second through hole;
Wiring provided on the second surface side of the substrate and connected to the third electrode and the fourth electrode,
A control element that is provided on the second surface side of the substrate, is connected to the wiring, and controls light emission of the light emitting unit;
A coil for supplying power to the control element;
A rectifier circuit that rectifies current from the coil and supplies the current to the control element;
A second sealing layer provided so as to cover the wiring, the control element, the coil and the rectifier circuit, and having at least an insulating property;
The outer periphery of the first sealing layer and the outer periphery of the second sealing layer are sealed, and the substrate, the first electrode, the second electrode, the wiring, the third electrode, and the fourth are inside. An organic EL element, wherein an electrode, the control element, the coil, and the rectifier circuit are enclosed. An insulating first substrate;
A plurality of first through holes and second through holes provided in the first substrate and having conductivity penetrating in a thickness direction of the first substrate;
A conductive land provided on the first surface side of the first substrate and electrically connected to the first through hole;
A first electrode that contacts and is electrically connected to the land;
A light emitting part formed of an organic compound in contact with the first electrode;
The second light emitting portion is provided on the opposite side of the first electrode, has a different polarity from the first electrode, has translucency, and is electrically connected to the second through hole. Electrodes,
An insulating and translucent second substrate in which the second electrode is formed on the first surface;
A first sealing layer provided on the second surface side opposite to the first surface in the second substrate and having insulating properties and translucency;
A third electrode provided on the second surface side opposite to the first surface of the first substrate and electrically connected to the first through hole;
A fourth electrode provided on the second surface side opposite to the first surface of the first substrate and electrically connected to the second through hole;
Wiring provided on the second surface side of the first substrate and connected to the third electrode and the fourth electrode,
A control element that is provided on the second surface side of the first substrate, is connected to the wiring, and controls light emission of the light emitting unit;
A coil for supplying power to the control element;
A rectifier circuit that rectifies current from the coil and supplies the current to the control element;
A second sealing layer provided so as to cover the wiring, the control element, the coil and the rectifier circuit, and having at least an insulating property;
The outer periphery of the first sealing layer and the outer periphery of the second sealing layer are sealed, and the first substrate, the second substrate, the first electrode, the second electrode, the wiring, An organic EL element, wherein a third electrode, the fourth electrode, the control element, the coil, and the rectifier circuit are enclosed.   4. The charge injection blocking unit provided between a part on the first electrode and the light emitting unit, the charge injection blocking unit blocking injection of charges for the light emitting unit to emit light. Organic EL element. The first electrode is a cathode;
The organic EL element according to claim 1, wherein the second electrode is an anode. The first electrode is an anode;
The organic EL element according to claim 1, wherein the second electrode is a cathode. A manufacturing method for manufacturing an organic EL device including a light emitting portion formed of an organic compound,
A through hole forming step of forming a plurality of first through holes and second through holes penetrating in the thickness direction on an insulating substrate;
A first electrode electrically connected to the first through hole is formed on the first surface side of the substrate, and the first surface is formed on the second surface side opposite to the first surface of the substrate. An electrode forming a third electrode electrically connected to the through hole, a wiring connected to the third electrode, a coil for receiving power from the outside, and a fourth electrode electrically connected to the second through hole Isoformation process;
A plating step of providing conductivity by plating the wall surfaces of the first and second through holes;
A first electrode forming step of forming a first electrode electrically connected to the first through hole on the first surface side of the substrate;
A light emitting portion forming step of forming the light emitting portion formed of an organic compound on the first electrode formed in the first electrode forming step;
A second electrode forming step of forming a second electrode having a polarity different from that of the first electrode on the light emitting portion and having translucency and electrically connected to the second through hole; ,
A rectifier circuit forming step of forming a rectifier circuit for rectifying a current flowing from the coil on the substrate;
A control element mounting step of mounting a control element for controlling light emission of the light emitting unit on the substrate;
In the second electrode, a first sealing layer having insulating properties and translucency is provided on the side opposite to the light emitting portion side, and at least insulating is provided on the second surface side opposite to the first surface of the substrate. The manufacturing method which manufactures the organic EL element characterized by providing the 2nd sealing layer which has this, and the sealing process which seals the said organic EL element whole. A manufacturing method for manufacturing an organic EL device including a light emitting portion formed of an organic compound,
The manufacturing method includes a first substrate forming step, a second substrate forming step, a substrate laminating step, and a sealing step.
The first substrate forming step includes
A through hole forming step of forming a plurality of first through holes and second through holes penetrating in the thickness direction on the insulating first substrate;
A conductive land electrically connected to the first through hole is formed on the first surface side of the first substrate, and the first surface is formed on the second surface side opposite to the first surface. A third electrode that is electrically connected to the through hole, a wiring that is connected to the third electrode, a coil that receives power from the outside, and an electrode that forms a fourth electrode that is electrically connected to the second through hole Isoformation process;
A plating step of providing conductivity by plating the wall surfaces of the first and second through holes;
A rectifier circuit forming step of forming a rectifier circuit for rectifying a current flowing from the coil on the substrate;
A control element mounting step of mounting a control element for controlling light emission of the light emitting unit on the first substrate;
The second substrate forming step includes
A second electrode that is electrically connected to the second through hole and a light emitting portion formed of an organic compound on the second electrode on a second substrate having insulation and translucency And a light emitting part forming step,
A second electrode contact part forming step of peeling the organic compound layer at the end of the second electrode to form a contact part to the second electrode;
A charge injection blocking portion forming step of forming a charge injection blocking portion for blocking charge injection into the light emitting portion; and
A first electrode forming step of forming a first electrode in contact with the charge injection blocking portion and the light emitting portion,
In the substrate lamination step, the second substrate formed in the second substrate formation step is laminated and fixed on the first substrate formed in the first substrate formation step,
In the sealing step, a first sealing layer having insulating properties and translucency is provided on the second electrode of the second substrate on the side opposite to the light emitting unit side, and the second sealing of the first substrate is performed. A manufacturing method for manufacturing an organic EL element, wherein a second sealing layer having at least an insulating property is provided on the surface side to seal the entire organic EL element.

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