KR20110076246A - Pcb and oled module using the same - Google Patents

Abstract

PURPOSE: A printed circuit board and an OLED module using the same are provided to reduce manufacturing costs without an additional wiring by forming an electrode on a protection layer to be mounted on a circuit. CONSTITUTION: A driving circuit unit(5) is formed on one side of a printed circuit board. A heat radiation circuit is formed on the other side of the printed circuit board. An OLED device is mounted on the printed circuit board and includes a protruded fixing unit. A connection contact(1,1') for an anode is contacted with the OLED device.

Description

Printed circuit board and OLED module using the same {PCB AND OLED MODULE USING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board and an OLED module using the same, and more particularly, to an OLED device having a back electrode on which an electrode is formed on a protective film of an OLED device, and a printed circuit board on which the OLED device is seated. The present invention relates to a driving circuit for driving an OLED device and an OLED module implementing a heat dissipation circuit capable of simultaneously dissipating heat generated from the OLED device and heat generated from the drive circuit.

In general, an OLED is formed between an anode layer and a cathode layer on a wafer through an organic thin film layer, which is an organic EL layer, and forms a matrix having a very thin thickness.

Such OLEDs can be driven at low voltages and have advantages such as thinness. In addition, it is possible to solve the drawbacks that have been pointed out as a problem in LCDs in the past, such as narrow wide viewing angle and slow response speed, and in comparison with other types of displays, in particular, it is equal to or less than other displays such as 'TFT LCD' in the medium size or less. In addition to having the above image quality, it is attracting attention as a next-generation flat panel display from the simple manufacturing process.

However, OLEDs used for lighting have to emit the same in a large area, so that no pixels are formed, and a large area of light emitting devices are formed, and one or several light emitting regions are provided.

1 is a cross-sectional view of a portion of an OLED device according to the prior art.

Referring to FIG. 1, in the conventional OLED device, the anode layer 20, the organic material layer 30, and the cathode layer 40 are sequentially stacked on the substrate 10, and between the anode layer 20 and the cathode layer 40. Appropriate energy difference is applied to the organic material layer 30 by applying a voltage to the self-luminous principle. In other words, the excitation energy left by recombination of injected electrons and holes is generated as light.

In addition, since the organic material layer 30 is very weak to moisture and oxygen in the air, an encapsulation layer 50 is formed at the top to increase the life time of the device.

However, in the conventional OLED device, the anode wiring 21 and the cathode wiring 41 are formed to be drawn out to the side of the OLED device rather than to the rear side, so that a plurality of OLED devices can be connected and used for lighting, the side of the OLED device and the lighting device. Since there is a separate wiring for connecting the drive system there was a problem that increases the manufacturing cost accordingly.

On the other hand, the driving circuit for driving the conventional OLED has a high possibility of causing thermal damage due to the accumulation of heat generated from the OLED device and the heat generation of the driving circuit itself has a lot of problems caused by this noise.

The present invention for solving the above problems, by forming the electrode on the back of the protective film of the OLED device to be seated on the seating portion on the printed circuit board by the separate wiring is not required, the manufacturing cost is reduced, the driving circuit and It is an object of the present invention to provide an OLED module having an OLED device having a rear surface electrode which is aesthetic and easy to attach and detach because wiring is eliminated due to the back contact.

On the other hand, the printed circuit board has a driving circuit for driving the OLED device, while implementing a heat dissipation circuit on the printed circuit board that can dissipate heat generated in the OLED device and heat generated in the drive circuit at the same time, generated in the OLED device It can reduce the thermal damage of OLED devices or thermal damage to the elements (chips, etc.) of the driving circuit, which can occur due to the accumulation of heat and heat generated from the driving circuits, and as a result, noise components that can occur in OLED devices or driving circuits. Reducing the above is another object of the present invention.

According to an embodiment of the present invention for achieving the above object, a driving circuit of the OLED device is formed on one side, and provides a printed circuit board formed with a heat dissipation circuit on the other side.

On the other hand, according to another embodiment of the present invention, a driving circuit of the OLED device is formed on one side, and a printed circuit board having a heat dissipation circuit formed on the other side, and is mounted on the printed circuit board, by the drive circuit An OLED module is provided that includes an OLED device that is driven to light up.

In addition, the OLED device, a transparent material and a light emitting region is divided substrate; An anode layer laminated on the light emitting region of the substrate and having an anode terminal formed on one side outside the light emitting region; An organic material layer laminated on the light emitting region of the anode layer; A cathode layer laminated on the organic material layer and having a cathode terminal formed at one side outside the emission region; A protective film for sealing the anode layer, the organic material layer and the cathode layer; One side is connected to the positive electrode terminal, the other side is a positive electrode back electrode formed on the protective film and one side is connected to the negative electrode terminal, the other side includes a negative electrode back electrode formed on the protective film, the positive electrode The back electrode and the cathode back electrode are connected to the anode connection contact and the cathode connection contact on the printed circuit board.

In addition, it is preferable that the protrusion fixing part is formed on the circuit board so that the OLED device can be seated on the printed circuit board.

In addition, the positive electrode terminal is formed of two terminals, the negative electrode terminal is formed to correspond to the space between the positive electrode terminal, the negative electrode terminal and the positive electrode terminal is spaced apart, the positive electrode back electrode, the positive electrode It may be connected to at least one of the terminals.

In addition, the positive electrode terminal may be formed of one terminal, and the negative electrode terminal may be formed to correspond to a space where the positive electrode terminal is not formed.

In addition, the anode terminal and the cathode terminal may be formed outside the light emitting area, and may be formed in opposite directions. In other words, the anode layer may have an anode terminal formed on one side outside the light emitting region, and the cathode layer may have a cathode terminal formed on the other side outside the light emitting region.

In addition, the material for forming the anode layer may be indium tin oxide or indium zinc oxide.

In addition, the material for forming the negative electrode layer may be any one metal selected from aluminum, copper, silver, or lithium fluoride, or two or more alloys.

In addition, the protective film may be encapsulated with glass or metal or passivated with a film.

The heat dissipation circuit may be formed by stacking a substrate layer, an insulating layer, a layer made of epoxy, a ceramic filler, and FRP, and a circuit layer formed by patterning a copper foil or a conductive paste coating layer.

According to the present invention, an electrode is formed on the protective layer of the OLED device to be seated on the circuit, so that no additional wiring is required, thereby reducing manufacturing costs, and wiring is eliminated due to back contact with the driving circuit. It is possible to provide an OLED module having an OLED device having a back electrode which is easily removable.

In addition, the printed circuit board has a driving circuit for driving the OLED device, and by implementing a heat dissipation circuit on the printed circuit board that can simultaneously dissipate heat generated in the OLED device and heat generated in the drive circuit, it is generated in the OLED device It can reduce the thermal damage of OLED devices or thermal damage to the elements (chips, etc.) of the driving circuit, which can occur due to the accumulation of heat and heat generated from the driving circuits, and as a result, noise components that can occur in OLED devices or driving circuits. It is possible to reduce the

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the present specification and claims should not be construed as being limited to the common or dictionary meanings, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

2 is a plan view of a printed circuit board according to an embodiment of the present invention, FIG. 3 is a side cross-sectional view of a portion A of FIG. 2 viewed from the side, and FIG. 4 is a printed circuit board according to an embodiment of the present invention. 5 to 9 are views illustrating a manufacturing process of an OLED device seated on a printed circuit board according to an embodiment of the present invention.

As shown in Figure 2, the printed circuit board, the driving circuit portion 5 is formed on one side, the heat dissipation circuit is formed on the other side. Further, on the printed circuit board, positive connection contacts 1 and 1 'and negative connection contacts 2 and 2' are formed in contact with the OLED device 8 seated on the printed circuit board.

Here, the driving circuit unit 5 is not driven by a plurality of data lines for transmitting data current or a plurality of scanning lines for transmitting a selection signal for each general pixel, such as a flat panel display (FPD). It should be seen as driving. Although not shown in the driving circuit section 5, it is possible to mount a driving chip or other elements.

In addition, the OLED device 8 may include indoor lighting (office, home, school, factory, etc.), outdoor lighting (road lighting, bridge lighting, architectural lighting, airport lighting, stadium lighting, etc.), psychological lighting (hotel, restaurant, Hospitals, theme parks, casinos, department stores, exhibition halls), physiological lighting (hospital recovery room, silver town, children's classroom, etc.), landscape lighting (indoor and outdoor decorative lighting, fountain lighting, wall lighting, etc.), others (museums, art galleries, galleries, Studio, cinema, stage, art, leisure, etc.). In addition, the OLED device 8 may be a BLU of an LCD TV.

In general, the driving circuit unit 5, the heat dissipation circuit (not shown), the positive connection contacts 1 and 1 'and the negative connection contacts 2 and 2' can be manufactured by integrally forming a printed circuit board. .

As an example, forming surface roughness in an aluminum core, forming an etching resist pattern, forming a circuit pattern in the aluminum core by etching, laminating an insulating layer and an additional circuit layer, and in an additional circuit layer A printed circuit board is formed by forming a via hole and forming a circuit pattern in an additional circuit layer, and implements a circuit suitable for heat dissipation, and a part of the circuit pattern is connected to the anode contact contacts 1 and 1 '. It can also be implemented as connection contacts 2 and 2 'for the cathode. Here, the circuit pattern may be formed by removing a coating layer coated with a paste containing copper foil, carbon nanotubes, or the like.

Meanwhile, in FIG. 3, the component labeled 6 may be understood as a combination of a substrate layer, an insulating layer, a laminate of layers made of epoxy + ceramic filler, and FRP (FR-4, etc.). Usually, a copper foil layer is present on a layer made of epoxy + ceramic filler and FRP (FR-4, etc.), and patterned to remove it according to a circuit pattern, thereby forming a circuit pattern, and a part of the circuit pattern is a connection contact for an anode ( 1, 1 ') and the cathode connection contact (2.2'). The remaining circuit pattern may not be a circuit pattern for driving the OLED device 8 but a circuit pattern for heat dissipation. The heat dissipation function may be performed through the heat dissipation circuit pattern.

Of course, the circuit pattern may also form a circuit pattern for driving the OLED device 8 and a circuit pattern for heat dissipation by a simultaneous process.

The substrate layer used herein is preferably a material that is easy for heat dissipation, and may be a metal such as aluminum or a ceramic material such as alumina.

Here, the forms of the anode connection contacts 1 and 1 'and the cathode connection contacts 2 and 2' on FIG. 1 are one example. The anode back electrode and the cathode back electrode of the OLED device 8 are connected. As long as it is a possible form, it can change into any form or shape.

As shown in Figs. 2 and 3, the OLED device 8 may form the protruding fixing portion 7 so that it can be inserted and fixed by both protruding fixing portions 7 on both sides. 3 is merely described in FIG. 3, but may form a coupling structure with the OLED device 8 to facilitate coupling with each other, or may be implemented in a sliding form.

The structure of the specific OLED device 8 will be described below with reference to FIGS. 4 to 13.

As shown in FIG. 4, the OLED device 8 mounted on the printed circuit board according to the exemplary embodiment of the present invention has a substrate 110 and a grid formed on the substrate 110 where the light emitting regions L are divided. (210), the anode layer 310 formed in the light emitting region L on the grid 210, the organic layer 410 formed in the light emitting region L on the anode layer 310, and the light emission on the organic layer 410. A protective layer 610 is formed of the cathode layer 510 formed in the region L and seals the light emitting region L to include the anode layer 310, the organic layer 410, and the cathode layer 510 therein. It is included.

In addition, the structure of the some OLED device 8 used here can use any one or more of a bottom emission structure, a top emission structure, and a double-sided emission structure.

The bottom emission structure emits light from the side of the TFT substrate using a transparent anode, and since the TFT and the wiring are opaque portions, only the portion where the TFT or wiring is not formed can emit light. There was a problem that the area was narrow.

The top emission structure proposed to solve this problem emits light to the upper side where the TFT is not formed by using a transparent cathode. Thus, since light is emitted without using a TFT substrate, it is possible to emit light regardless of the arrangement of TFTs or wirings, and the light emitting area can be widely used. In particular, the top emission structure is advantageous for large displays requiring high brightness.

Hereinafter, a manufacturing process of an OLED device according to an exemplary embodiment of the present invention will be described with reference to FIGS. 5 to 9.

First, as shown in FIG. 5, the grid 210 is formed on the substrate 110 where the light emitting regions L are divided.

In general, the substrate 110 may be made of glass, and the grid 210 may be in contact with the anode layer 310 to be described later, and the anode layer 310 may be connected to a wiring unit (not shown) of the lighting driving device. When connecting, it serves to lower the electrical resistance value of the anode layer 310. The grid 210 is a metal having a smaller resistance value than the anode layer 310, and includes chromium (Cr), copper (Cu), molybdenum (Mo), nickel (Ni), aluminum (Al), silver (Ag), or gold. (Au) can be. Therefore, light may be emitted at a constant illuminance in all regions of the light emitting region L. FIG.

The grid 210 is formed by the following process. First, a low resistance metal is deposited on the substrate 110 and then photoresist coated. Here, the photoresist is photosensitive and may be polyimide (PI) or polymer resin.

Subsequently, a photoresist is developed after exposure to ultraviolet rays using a line mask (not shown) for a predetermined time, followed by etching a line formed through the line mask to remove the photoresist.

Subsequently, the anode layer 310 is deposited on the grid 210 by sputtering. The anode layer 310 uses the first mask 700 to be deposited only in the light emitting region L, so that the anode layer 310 is deposited only in the light emitting region L. FIG.

The anode layer 310 is an anode electrode corresponding to an anode of an OLED device. The anode layer 310 is made of indium tin oxide (ITO) or indium zinc oxide (IZO), which has a low surface resistance and good permeability. Of transparent conductive materials may be used.

As such, by forming the anode layer 310 on the grid 210, the resistance of the anode layer 310 is lowered, and thereafter, the power consumption and the driving voltage are low when the OLED device is connected to an external driving circuit (not shown). The electrical characteristics of the device can be improved.

Subsequently, as shown in FIG. 6, the organic layer 410 is deposited in the light emitting region L on the anode layer 310 using the first mask 700.

The organic layer 410 is formed on the anode layer 310 and is a part in which light emission occurs in the OLED device. In order to increase the light emission efficiency, a hole injection layer (HIL), a hole transport layer (HTL), An emission material layer (EML), an electron transfer layer (ETL), an electron injection layer (EIL), and the like are sequentially deposited.

Organic materials used as the organic material layer 410 are Alq3, TPD, PBD, m-MTDATA, TCTA and the like.

In general, when the organic material layer 410 uses a high molecular organic material, the organic material layer 410 generally has a two-layer structure of a light emitting layer and a hole injection layer. In contrast, when the organic material layer 410 uses a low molecular organic material, The organic layer 410 generally has a multilayer structure such as a five-layer structure of a hole injection layer, a hole transport layer, a light emitting layer, a hole block layer, and an electron transport layer.

Subsequently, the cathode layer 510 is deposited on the emission region L on the organic layer 410 using the first mask 700.

The material for forming the cathode layer 510 may be formed of any one metal selected from aluminum, copper, silver, or lithium fluoride (LiF), or two or more alloys.

Here, the anode layer 310 is deposited in the form as shown in FIG. 7A using a separate anode layer mask (not shown), and the cathode layer 510 is shown in FIG. 7B using a separate cathode layer mask (not shown). It is deposited in the form of.

In addition, an anode terminal 311 and a cathode terminal 515 are formed in the anode layer 310 and the cathode layer 510 at one side outside the light emitting region L, respectively, and the anode terminal 311 has two anode layers. At 310, the recess 315 is interposed therebetween, and the cathode terminal 515 is formed to extend from the cathode layer 510 to correspond to the recess 315, which is a space between the anode terminals 311. do.

Thus, as shown in FIG. 7C, when the anode layer 310 and the cathode layer 510 are stacked, a spaced portion 950 is formed between the outer circumferential surface of the cathode terminal 515 and the anode terminal 311 to form the anode terminal 311. The negative electrode terminal 511 is spaced apart. Therefore, the positive electrode terminal 311 and the negative electrode terminal 515 may be electrically insulated from each other.

Subsequently, as shown in FIG. 8, a protective film 610 is formed to seal the light emitting region L such that the anode layer 310, the organic layer 410, and the cathode layer 510 are included therein.

The passivation layer 610 is for encapsulation to protect the organic layer 410 from moisture or oxygen. Preferably, the passivation layer 610 may be passivated with a thin film.

On the other hand, since the protective film 610 sealed only the light emitting region L, the protective layer 610 and the anode terminal 311

The negative electrode terminal 515 is drawn out of the protective layer 610.

Subsequently, as shown in FIG. 9, a positive electrode rear electrode 910 and a negative electrode rear electrode 930 are formed on the upper surface of the passivation layer 610 using the second mask 800 in a sputtering manner.

Accordingly, one side of the positive electrode back electrode 910 is connected to the positive electrode terminal 311, the other side is formed of the upper surface of the protective film 610, one side of the negative electrode back electrode 930 is connected to the negative electrode terminal 515 The other side is formed as an upper surface of the passivation layer 610.

Here, the anode back electrode 910 and the cathode back electrode 930 correspond to a wiring pattern for connecting to a separate lighting driving circuit (not shown), and thus, only enough electrodes may be formed to be connected to the driving circuit. The other side of the anode back electrode 910 and the cathode back electrode 930 may be formed on a portion of the top surface of the passivation layer 610 or may be formed on the top surface of the passivation layer 610 in the form of a band.

After the OLED device is connected to the driving circuit, the organic material layer 410 emits light by supplying power between the anode back electrode 910 and the cathode back electrode 930, and the emitted light is externally provided through the substrate 110. It is irradiated with and used for lighting.

10 and 11 illustrate OLED devices mounted on a printed circuit board according to another exemplary embodiment of the present invention, and FIGS. 12 and 13 illustrate OLED devices mounted on a printed circuit board according to another exemplary embodiment of the present invention. The figure which shows.

Another embodiment of the present invention forms one anode terminal outside the light emitting region in the anode layer 310, as shown in Figure 10a, and one cathode terminal outside the light emitting region of the cathode layer 510, as shown in Figure 10b To form.

Thus, as shown in Fig. 11, one anode back electrode and one cathode back electrode are formed.

Another embodiment of the present invention forms one anode terminal outside the light emitting region on one side of the anode layer 310 as shown in FIG. 12A, and one outside the light emitting region on the other side of the cathode layer 510 as shown in FIG. 12B. To form a negative terminal.

Thus, as shown in Fig. 13, the anode back electrode and the cathode back electrode are formed at opposite positions.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications, changes and variations are possible within the scope of the claims to be described.

1 is a cross-sectional view showing a conventional OLED device.

2 is a plan view of a printed circuit board according to an exemplary embodiment of the present invention.

3 is a side cross-sectional view of the portion A in FIG. 2 viewed from the side.

4 is a perspective view illustrating an OLED device mounted on a printed circuit board according to an embodiment of the present invention.

5 to 9 are views illustrating a manufacturing process of an OLED device mounted on a printed circuit board according to an embodiment of the present invention.

10 and 11 are views illustrating an OLED device mounted on a printed circuit board according to another embodiment of the present invention.

12 and 13 are views illustrating an OLED device mounted on a printed circuit board according to another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

1, 1 'anode contact 2, 2' cathode contact

5 driving circuits 8 OLED devices

110 substrate 310 anode layer

311 Anode Terminal 410 Organic Compound

510 Cathode layer 515 Cathode terminal

610 Protective film 910 Back electrode for anode

930 Cathode back electrode L emitting area

Claims (8)

The printed circuit board is formed with a driving circuit of the OLED device on one side, the heat radiation circuit is formed on the other side. On one side, a driving circuit of an OLED device is formed, and on the other side, a printed circuit board having a heat dissipation circuit, And an OLED device mounted on the printed circuit board and driven by the driving circuit to emit light. The method of claim 2, The OLED device, A substrate having a transparent material and having a light emitting area therein; An anode layer laminated on the light emitting region of the substrate and having an anode terminal formed on one side outside the light emitting region; An organic material layer laminated on the light emitting region of the anode layer; A cathode layer laminated on the organic material layer and having a cathode terminal formed at one side outside the emission region; A protective film for sealing the anode layer, the organic material layer and the cathode layer; One side is connected to the anode terminal, the other side of the positive electrode back electrode formed on the protective film and One side is connected to the negative electrode terminal, the other side includes a negative electrode back electrode formed on the protective film, The anode back electrode and the cathode back electrode are connected to an anode connection contact and a cathode connection contact on the printed circuit board. The method of claim 2, And an protrusion fixing part formed on the printed circuit board so that the OLED device can be seated on the printed circuit board. The method of claim 3, wherein The anode terminal is formed of two terminals, the cathode terminal is formed to correspond to the space between the anode terminal, the cathode terminal and the anode terminal is spaced apart, The anode back electrode is connected to at least one of the anode terminal, the OLED module. The method of claim 3, wherein The anode terminal is formed of one terminal, the cathode terminal is formed so as to correspond to the space in which the anode terminal is not formed. The method of claim 3, wherein And the anode terminal and the cathode terminal are formed outside the light emitting area, and are formed in opposite directions to each other. The method according to any one of claims 2 to 7, The heat dissipation circuit is an OLED module, comprising a substrate layer, an insulating layer, a layer made of epoxy, ceramic filler and FRP, and a circuit layer formed by patterning a copper foil or a conductive paste coating layer.

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