JP2003217836A - Electroluminescence display and fitting method for its circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroluminescence display small-sized and light- weighted, and having a small packaging area and high reliability of connection to a driving device, and a fitting method for its circuit board. <P>SOLUTION: A light emitting part 2 having an electrode and adapted to emit light by applying voltage to the electrode and a wire for applying voltage are provided on a substrate 1. The light emitting part 2 is covered with one or more films 11, 12, and the wire is connected to the circuit board 3. The circuit board 3 is fitted with the end face of the end connected to the wire in the circuit board 3 confronting with the opposite side to the light emitting part. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroluminescence display and a method for mounting a circuit board on the electroluminescence display.

[0002]

2. Description of the Related Art Electroluminescence
minescence: EL) displays are multiple electroluminescent (EL) elements (electroluminescent elements) on a substrate.
Is an image display panel in which an image is formed by arranging the elements in a grid pattern and causing each element to emit light as a pixel.

FIG. 5 shows the structure of an EL element forming a pixel of an EL display. The EL element has a structure in which an anode 6, a light emitting layer 10 including a layer that emits light when a voltage is applied, and a cathode 7 are laminated on a substrate 1. As the substrate 1,
A transparent glass substrate is usually used so as to transmit light emitted from the EL element. The light emitting layer 10 is sandwiched between the anode 6 and the cathode 7, and is composed of a thin film of an inorganic or organic material. When a voltage is applied between the anode 6 and the cathode 7, holes from the anode 6 and electrons from the cathode 7 flow into the light emitting layer 10 and are recombined. The resulting energy excites the material forming the light-emitting layer 10, causing the pixels of the EL display to emit light. For the sake of simplicity, although not shown in FIG. 5, a layer such as a hole transport layer for improving the conductivity of holes from the anode 6 to the light emitting layer 10 is provided between the anode 6 and the light emitting layer 10. Similarly, a layer such as an electron transport layer for improving the conductivity of electrons from the cathode to the light emitting layer may be included between the light emitting layer and the cathode 7.

FIG. 6 shows an E having the structure shown in FIG.
A specific example of an EL display in which a plurality of L elements are arranged will be shown. In the EL display, first, a plurality of wirings for the anodes 6 are formed on the substrate 1 in one direction, and a plurality of wirings for the cathodes 7 are formed at right angles to the wirings for the anodes 6 with the light emitting layer 10 interposed therebetween. Finally, the anode 6, the light emitting layer 10, and the cathode 7 are entirely covered with the sealing cover 4 to be formed.

In the EL display as shown in FIG. 6, the cross section of the intersection of the wiring of the anode 6 and the wiring of the cathode 7 has the substrate 1, the anode 6, the light emitting layer 10 and the cathode 7 sequentially laminated as shown in FIG. It is an EL element having a structure, and pixels of these EL elements will be formed. Therefore, by selecting the anode wiring and the cathode wiring and applying a voltage,
Pixels where those wirings intersect can be made to selectively emit light.

[0006]

FIG. 7 shows a sectional view of a conventional EL display. The light emitting layer 10 and the like of the EL element are easily deteriorated by moisture and oxygen, and in the pixel of the EL element, the area of a non-light emitting portion called a dark spot (DS) increases in the presence of water and oxygen. The light emission life is shortened. For this reason, it is necessary to shield the portion including the anode 6, the light emitting layer 10 and the cathode 8 (these layers are hereinafter referred to as the light emitting portion 2) formed on the glass substrate by blocking them from moisture and oxygen.

Conventionally, as shown in FIG. 7, the light emitting portion 2 is covered with a sealing cover 4 such as a glass or a metal container, and the bottom surface of the side wall of the sealing cover 4 is adhered to the substrate 1 to form the light emitting portion 2. Is hermetically sealed. A moisture absorbent 5 is attached to the sealing cover 4 in order to further protect the light emitting unit 2 from moisture. In this sealing method using the sealing cover 4, since the inner surface of the sealing cover 4 is placed on the substrate 1 apart from the light emitting section 2, the sealing cover is usually thickened to about 1.5 mm to 2 mm, and therefore EL The display becomes thicker. Further, the presence of the sealing cover 4 and the moisture absorbing material 5 also increases the weight of the EL display.

Further, in the EL display, as shown in FIG.
It is necessary to connect the wiring of the anode 6 and the cathode 7 as shown in (1) to the circuit for controlling the display of the EL display. Here, a flexible resin-made flexible circuit board (FP) having a connector connecting portion 9 at the tip as shown in FIG.
The use of C) 3 is advantageous for downsizing a device including an EL display. That is, if the FPC 3 is used as the circuit board connected to the wiring of the electrodes, the FPC can be bent as shown in FIG. 7, so that it is not necessary to arrange the circuit boards connected to the wiring outside the substrate 1 and The mounting area can be reduced.

Further, in order to reduce the size and weight of the device including the EL display, it is desired to reduce the size and weight of the EL display itself as well as the liquid crystal panel.
Specifically, the area of the substrate 1 of the EL display is made as small as possible. That is, if the portion of the substrate 1 not covered with the sealing cover 4 is called a frame, it is necessary to reduce the area of this frame. Here, a frame having a particularly small area will be referred to as a narrow frame.

The FPC 3 is connected on the substrate 1 of the EL display having the sealing cover 4 and the narrow frame 13.
In order to make an EL display with a small mounting area,
It is necessary to bend the FPC 3 in the opposite direction as shown in FIG. That is, since the glass or metal sealing cover 4 that covers the light emitting unit 2 is thick and the frame of the substrate 1 is the narrow frame 13, the end of the FPC 3 connected to the wiring on the substrate 1 and the narrow frame 13 are connected. It has a small contact area with and is difficult to bond by a press using a conductive adhesive. That is, FP
It is difficult to connect C3 in a non-bending direction. If the FPC 3 is connected in a bending direction as shown in FIG. 7, a sufficient contact area can be secured between the narrow frame 13 and the end of the FPC 3 connected to the wiring on the substrate 1, and the conductive adhesive is applied. It becomes possible to bond with the press used. Therefore, the mounting area of the EL display can be reduced by bending the FPC 3 and connecting it to the substrate 1.

However, since stress concentrates on the bent portion of the FPC 3, peeling of the connecting portion between the FPC 3 and the substrate 1 and disconnection of the conductor wiring on the FPC are likely to occur, and the EL display and its driving device are easily separated. Reduce the reliability of the connection. Also, to reduce the mounting area, FPC
3 is forcibly bent, but the bent portion protrudes from the substrate 1 to increase the mounting area of the EL display.

Further, in the EL display as shown in FIG. 6, if the wiring of the anode 6 and the wiring of the cathode 7 are separately mounted, two FPCs are required. Therefore, two connectors for the drive unit connected to each FPC and two drive ICs are required, which is not preferable because of an increase in the number of parts. Therefore, a method of connecting the wirings of the anode 6 and the cathode 7 to the connector of the driving device with one FPC can be considered. In this case, there is only one driving IC,
Control both anode 6 and cathode 7.

FIG. 8 shows an EL display in which one FPC 3 having one driving IC is connected to the substrate 1.
In FIG. 8A, the FPC 3 is connected to the side of the substrate 1 where the wiring of the anode 6 is present, and the cathode 7 is connected to the FPC 3 by pulling out the wiring to the side where the anode 6 of the substrate 1 is present. The attached FPC 3 is bent along the line A in FIG. As described above, in the EL display having vertical and horizontal wirings as shown in FIG. 6, the method of attaching the FPC to the side having one wiring and pulling out the wiring of the other side is when the number of wirings, that is, the number of pixels is small. Is effective, but when the number of pixels increases, the number of wirings to be drawn and arranged on one side also increases, so that the substrate must be made large, and the EL display cannot be downsized.

FIG. 8B shows an E having one FPC 3 connected to both sides of the substrate 1 where the wirings of both electrodes 6 and 7 exist.
L display is shown. If the FPC 3 is attached so that both wirings are connected to one side of the board as shown in FIG. 8A, the board becomes large. Must be installed so that it connects with. As shown in FIG. 8B, if one FPC 3 is used, in order to reduce the mounting area of the EL display, the FPC 3 is first set in FIG.
The portion without the driving IC is bent along the dotted line A in (b), and then the portion on which the driving IC is attached is bent along the dotted line B.
There is one connector connecting portion 9 near the driving IC,
It is connected to the drive unit. However, in this way FP
When the C3 is bent twice, stress concentrates on the two bent portions as described above, so that peeling of the connecting portion between the FPC 3 and the substrate 1 or disconnection of the conductor wiring on the FPC is likely to occur. The reliability of the connection between the EL display and its driving device is reduced.

The present invention has been made in view of the above problems, and provides an electroluminescent display which is small and lightweight, has a small mounting area, and has high reliability of connection with a driving device, and a method of mounting a circuit board thereof. The purpose is to do.

[0016]

The invention according to claim 1 is
On a substrate, a light emitting unit having an electrode and emitting light by applying a voltage to the electrode, and an electroluminescent display having a wiring for applying the voltage, the light emitting unit is covered with one or more films, A circuit board is connected to the wiring, and the circuit board is attached such that an end surface of an end of the circuit board connected to the wiring faces the side opposite to the light emitting unit.

According to the invention of claim 1, the light emitting portion is covered with one or a plurality of films, the wiring is connected to a circuit board, and the circuit board is connected to the wiring on the circuit board. Since it is attached so that the end surface of the end portion facing the opposite side to the light emitting portion, it is small and lightweight,
It is possible to provide an electroluminescent display having a small mounting area and high reliability of connection with a driving device.

According to a second aspect of the present invention, in the electroluminescence display having a light emitting portion which has an electrode on the substrate and emits light when a voltage is applied to the electrode, and a wiring which applies the voltage, the substrate is And a connecting portion for directly connecting the wiring to the driving device of the electroluminescence display.

According to the second aspect of the present invention, since the substrate has the connecting portion for directly connecting the wiring to the driving device of the electroluminescent display, the circuit substrate having the connecting portion for connecting to the driving device is unnecessary. As a result, the thickness of the electroluminescence display is reduced, and it is possible to provide an electroluminescence display having higher reliability of connection with the driving device.

According to a third aspect of the present invention, in an electroluminescence display, a light emitting portion having an electrode on a substrate and emitting light by applying a voltage to the electrode, a driving IC for controlling the voltage, and the driving. IC for
It has a circuit board connected to.

According to the invention of claim 3, on the substrate,
The electroluminescent display has a small thickness because it has an electrode and a light emitting portion that emits light by applying a voltage to the electrode, a driving IC that controls the voltage, and a circuit board connected to the driving IC. As a result, it is possible to provide an electroluminescence display having a highly reliable connection with a driving device.

According to a fourth aspect of the invention, in the electroluminescent display according to the second or third aspect,
The light emitting unit is covered with one or a plurality of films.

According to the invention described in claim 4, since the light emitting portion is covered with one or a plurality of films, it is possible to provide an electroluminescent display which is further compact and lightweight and has the light emitting portion protected. You can

According to a fifth aspect of the present invention, in the electroluminescent display according to any one of the first to fourth aspects, the substrate is made of resin.

According to the fifth aspect of the present invention, since the substrate is made of resin, it has flexibility.
It is possible to provide an electroluminescent display that can be mounted on a curved surface and can be easily manufactured into a curved shape and a shape different from a flat surface.

According to a sixth aspect of the invention, the substrate has an electrode, and light is emitted by applying a voltage to the electrode.
In a method of mounting a circuit board of an electroluminescent display, comprising: a light emitting portion covered with one or a plurality of films; and a wiring for applying the voltage, the circuit board being connected to the circuit board, It is characterized in that it is attached such that an end face of an end connected to the wiring faces the side opposite to the light emitting unit.

According to the sixth aspect of the present invention, the circuit board is attached so that the end surface of the end portion of the circuit board connected to the wiring faces the side opposite to the light emitting portion, so that the size is small. Further, it is possible to provide a method for mounting a circuit board of an electroluminescence display which is lightweight, has a small mounting area, and has high reliability of connection with a drive device.

[0028]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings.

First, a first embodiment of the EL display of the present invention will be described with reference to FIG. Figure 1
FIG. 7A is a cross-sectional view taken along the wiring of an EL display in which EL elements as shown in FIG. 6 are arranged in a grid. As shown in FIG. 1 (a), in the present invention, a light emitting part 2 including at least an anode, a cathode, and a light emitting layer formed on a glass (or resin) substrate 1 is attached to a conventional hygroscopic material 5. Instead of the metal or metal sealing cover 4, it is covered with an inorganic thin film 11, and further the light emitting part 2 and the inorganic thin film 11 are covered with a resin sealing film 12. Finally, the FPC 3 is attached to the narrow frame 13 on the substrate 1 without bending in the opposite direction.

The inorganic thin film 11 is made of silicon oxide (Si
Metal oxide such as O _x ), metal nitride such as silicon nitride (SiN _x ), or magnesium fluoride (MgF ₂ ).
It is formed of a material such as metal fluoride, and mainly blocks moisture, and prevents deterioration of the light emitting performance of the light emitting unit 2 such as an increase in the area of the non-light emitting unit in the pixel. Inorganic thin film 11
As the formation method of the above, a conventional film formation method such as a vacuum vapor deposition method, a sputtering method, an ion plating method, and a plasma CVD (vapor phase chemical deposition method) method can be used. The thickness of the inorganic thin film 11 in an EL display is usually 0.01.
Although it is about 10 μm to about 10 μm, particularly 0.1 μm to 3
μm is desirable. The thickness of the inorganic thin film 11 is 0.
If the thickness is less than 1 μm, the blocking of moisture to the light emitting portion 2 is insufficient, and the increase in the area of the non-light emitting portion in the pixel cannot be effectively suppressed. If the thickness of the inorganic thin film 11 is thicker than 3 μm, The display becomes thicker, and the FPC 3 is formed on the substrate 1 (narrow frame 13) of the EL display having the narrow frame 13.
It becomes difficult to attach. However, the inorganic thin film 11 may be formed by laminating a plurality of inorganic thin films of the same type or different types as long as the reduction of the light emitting portion of the manufactured EL display can be sufficiently suppressed. When laminating a plurality of inorganic thin films 11, an organic adhesive layer may be inserted between the plurality of inorganic thin film 11 layers, if necessary.

The resin encapsulating film 12 is formed in order to protect the inorganic thin film 11 and the light emitting portion 2 from being scratched by an external impact. The resin sealing film 12 is formed of a material such as a fluorine-based resin, a silicone-based resin, an epoxy-based resin, or an acrylic resin. The resin sealing film 12 can be formed by a conventional spin coating method, dip coating method, or dispensing method. A coating method such as a gravure coating method, a reverse coating method, a wire bar coating method, a roll coating method, or a knife coating method can be used. The thickness of the resin sealing film 12 is usually 1 μm to 500 μm, and particularly 50 μm to 1
It is preferably 00 μm. If the thickness of the resin sealing film 12 is less than 50 μm, the inorganic thin film 11 and the light emitting portion 2 covered by the resin sealing film 12 cannot be sufficiently protected from external impact, and E
The reliability of the L display decreases, and conversely the resin sealing film 12
If the thickness of the EL display is greater than 100 μm, the EL display becomes thicker and the substrate 1 of the EL display having the narrow frame 13 is formed.
It becomes difficult to attach the FPC 3 to the (narrow frame 13).

However, the resin encapsulating film 12 is the manufactured EL.
If the light emitting unit 2 and the inorganic thin film 11 of the display can be sufficiently protected from external impact, a plurality of resin sealing films 12 of the same kind or different kinds may be laminated.

The method of sealing the light emitting portion 2 with the inorganic thin film 11 and the resin sealing film 12 according to the present invention sufficiently shields the light emitting portion 2 from moisture in the manufactured EL display and removes the light emitting portion 2 from the outside. When the light emitting unit 2 can be protected from a physical impact, the light emitting unit 2 may be the inorganic thin film 11 only, the resin sealing film 12 only, or a laminate of a single or plural inorganic thin films 11 and the resin sealing film 12, respectively.

In the EL display of the present invention, since the light emitting portion 2 is covered with the thin inorganic thin film 11 and the resin sealing film 12,
An EL display having a small thickness can be manufactured.
Typically, the EL display of the present invention includes a substrate 1, a light emitting portion 2, an inorganic thin film 11, and a resin sealing film 12 in a total of 200.
A thin EL display having a thickness of about 1 μm and a thickness of about 1/5 to 1/10 is manufactured as compared with an EL display in which the light emitting unit 2 is sealed with a conventional glass or metal sealing cover 4. You can do it. Further, when the light emitting section 2 is sealed using a relatively lightweight film system such as the inorganic thin film 11 and the resin sealing film 12, the thickness of the EL display can be reduced and a relatively heavy glass or metal film can be used. The weight of the EL display can be reduced as compared with the case where the sealing cover is used.

Further, according to the present invention, since an EL display having a small thickness can be manufactured, even the substrate 1 having the narrow frame 13 can be connected to the connector connecting portion 9 without bending the FPC 3 as shown in FIG. The part on the opposite side can be connected to the wiring on the substrate 1 by using a conductive adhesive for the narrow frame 13. Substrate 1 for EL display without bending FPC3
Therefore, peeling of the FPC 3 or disconnection of the conductor wiring on the FPC 3 due to stress concentration in the bent portion of the FPC 3 as shown in FIG. 7 does not occur. Therefore,
The long-term reliability of the connection between the EL display by FPC and the driving device is improved. Further, the fact that the FPC 3 does not need to be bent is another reason why the thickness of the EL display is not increased.

FIG. 1B shows a plan view of an EL display according to the first embodiment of the present invention. EL of the present invention
Also in the display, one FPC 3 can be connected to the wiring of the anode 6 and the cathode 7 on the two sides of the substrate. In the case of the present invention, it is not necessary to bend the FPC 3, and the FPC 3 has an area that is substantially equal to or smaller than that of the substrate 1 as shown in FIG. 1B, and is smaller than the conventional FPC. Further, since the FPC 3 can be connected without protruding from the substrate 1, the mounting area of the EL display is smaller than the conventional one. In the present invention, as compared with the conventional example of FIG.
The area of PC3 is FP in the conventional EL display.
It is about 1/4 of the area of C. Thereby, the material cost related to the material of the FPC 3 can be reduced. It should be noted that only one drive IC is required, and wiring of electrode lines in two directions is integrated and controlled.

As described above, the EL display of the present invention is small and lightweight, and because the mounting area is small and the thickness is thin, high-density mounting is possible, and the EL display is highly reliable in connection with the driving device. Can be provided.

Next, a second embodiment of the EL display of the present invention will be described with reference to FIG. In the second embodiment of the EL display of the present invention, as shown in the cross-sectional view of FIG. 2A, the light emitting section 2 formed on the substrate is sealed with the inorganic thin film 11 and the resin as in the first embodiment. Although the FPC 3 is covered with the film 12 and attached to the narrow frame, the resin substrate 1a is used as the substrate unlike the first embodiment in the material of the substrate. In this embodiment, the flexible resin substrate 1a is used, and the light emitting portion 2, the inorganic thin film 11, and the resin sealing film 12 are used.
Is a laminate of films, so the entire EL display is flexible. Therefore, the EL display of this embodiment can be mounted not only on a flat surface but also on a curved surface. Therefore, in an apparatus that requires an EL display, the EL display of the present embodiment can be mounted by effectively utilizing the space by bending or bending the EL display.

Further, since resin is easier to mold than injection molding such as injection molding as compared with glass, an EL display having a curved surface shape or a shape different from a flat surface can be easily manufactured.
For example, it is possible to manufacture an EL display having a head mount display shape shown in FIG. 2B and an EL display having a wristwatch shape as shown in FIG. 2C. here,
2B and 2C are plan views seen from the resin substrate 1a side. The resin substrate 1a is transparent, and the shape of the light emitting portion 2 is also adapted to the shape of the resin substrate 1a. be able to.

Next, a third embodiment of the EL display of the present invention will be described with reference to FIG. Figure 3
FIG. 3A is a sectional view of the EL display of the present embodiment, and FIG. 3B is a plan view seen from the side opposite to the substrate. As shown in FIG. 3A, the EL display of the present invention includes a light emitting section 2 having an electrode and a light emitting layer on a resin substrate 1a.
Is common to the second embodiment of the present invention in that it is covered with the inorganic thin film 11 and the resin sealing film 12.
The FPC attached in the second embodiment is removed, a part of the narrow frame 13 in the resin substrate 1a is widened, and the driving IC 8 and the connector connecting portion 9 attached to the FPC in the second embodiment are narrow frame. It is provided as an integral part of the. Although not particularly shown, the narrow frame 13 of the resin substrate 1a includes
Wiring of electrodes in the light emitting portion 2 is provided, and
It is connected to the connector connecting portion 9 through C8.

When the substrate is glass, it is not very suitable to connect the connector connecting portion 9 to the glass substrate integrally with the driving device because the glass is not flexible and is easily damaged. However, since the connector connecting portion 9 provided integrally with the resin substrate 1a has flexibility, it is suitable for connecting to the connector of the driving device. When the resin substrate 1a is used as described above, wirings and elements on the FPC are not
It can be integrated on the substrate a, and a part of the substrate 1a becomes large as shown in FIG. 3 (b), but since it is not necessary to use an FPC, the thickness of the EL display becomes thin. The size can be further reduced as a whole as compared with the above embodiment. Further, the wiring connecting the electrodes, the driving IC 8, the connector connecting portion 9 and the like is directly wired on the resin substrate 1a which is more durable than the FPC, so that the reliability of the connection between the respective elements is further improved.

Further, the FPC is not necessary, and the board and the FPC are
Since it is possible to omit the step of connecting the wirings, it is possible to reduce the man-hours and the number of parts, and the wiring on the substrate 1 and the FP
EL is inexpensive because a connecting device for connecting to C is not required.
A display can be manufactured. Specifically, a resin substrate 1a provided with electrodes, wirings, and connector connecting portions 9
It is manufactured by forming the light emitting portion 2 on the top, covering the light emitting portion 2 with the inorganic thin film 11, sealing with the resin sealing film 12, and attaching the driving IC.

Next, a fourth embodiment of the EL display of the present invention will be described with reference to FIG. The EL display in FIG. 4 has a light emitting unit 2 on a glass substrate 1b.
Is the same as that of the first embodiment of the EL display of the present invention in that it is formed and covered with the inorganic thin film 11 and the resin sealing film 12, but instead of using the FPC, a driving IC
The small FPC 3 is attached to a part of the narrow frame 13 of the glass substrate 1b, and wiring is provided on the glass substrate 1b. In this embodiment, one of the small FPCs 3 is fixed to the narrow frame 13 of the glass substrate 1b, and the other has a connector connecting portion 9 so that the FPC 3 can be connected to the connector of the driving device. In this embodiment, the glass substrate 1b
Although the narrow frame 13 is slightly wider to mount the FPC, the FPC used in this embodiment is small, and therefore the FPC 3 can be mounted on the glass substrate 1b without bending in the opposite direction. Therefore, as compared with an EL display in which a conventional FPC is bent in the opposite direction, the thickness of the EL display can be reduced in this embodiment.
Since the PC is not bent in the opposite direction, the reliability of the connection between the electrode and the driving device is improved.

[0044]

According to the present invention, it is small and lightweight,
It is possible to provide an electroluminescence display having a small mounting area and high reliability of connection with a drive device, and a method for mounting a circuit board thereof.

[0045]

[Brief description of drawings]

FIG. 1 is a diagram illustrating a first embodiment of an electroluminescent display according to the present invention, (a)
Is a sectional view and (b) is a plan view.

FIG. 2 is a diagram illustrating a second embodiment of the electroluminescent display according to the present invention, (a)
Is a cross-sectional view, (b) is a plan view of a head-mounted display-shaped electroluminescence display,
FIG. 3C is a plan view of a wristwatch-shaped electroluminescent display.

FIG. 3 is a diagram illustrating a third embodiment of the electroluminescent display according to the present invention, (a)
Is a sectional view and (b) is a plan view.

FIG. 4 is a cross-sectional view illustrating a fourth embodiment of the electroluminescent display according to the present invention.

FIG. 5 is a diagram showing an EL element forming a pixel of an electroluminescence display.

FIG. 6 is a diagram showing a specific example of an electroluminescence display in which a plurality of electroluminescence elements are arranged.

FIG. 7 is a cross-sectional view of a conventional electroluminescent display.

FIG. 8 is a diagram showing an EL display in which a single flexible circuit substrate is connected to a substrate, and (a) is an electroluminescent display in which one wiring is drawn to the side of the substrate where the other wiring exists. Illustration of
(B) is a diagram of an electroluminescent display having one flexible circuit board connected to both sides of the board on which wiring of both electrodes exists.

[Explanation of symbols]

1 substrate 1a Resin substrate 1b glass substrate 2 Light emitting part 3 Flexible circuit board (FPC) 4 Sealing cover 5 Hygroscopic material 6 Anode 7 cathode 8 Driving IC 9 Connector connection part 10 Light emitting layer 11 Inorganic thin film 12 Resin sealing film 13 narrow frame

─────────────────────────────────────────────────── ─── Continued Front Page (51) Int.Cl. ⁷ Identification Code FI Theme Coat (Reference) G09F 9/30 365 G09F 9/30 365Z H05B 33/10 H05B 33/10 33/14 33/14 A F Term (Reference) 3K007 AB18 BA07 BB02 BB07 CA06 DB03 FA02 5C094 AA15 AA32 AA36 AA43 AA48 BA27 CA19 DA06 DA07 DA09 DA12 DA13 DB01 DB02 EB01 FA01 FA02 FB01 FB20 GB01 5G435 AA13 AA14 AA17 BB05 CC09HEEHEEEEEE

Claims (6)

[Claims] 1. An electroluminescent display, comprising: a light emitting section having an electrode on a substrate and emitting light by applying a voltage to the electrode; and an electroluminescent display having a wiring for applying the voltage, wherein the light emitting section is one or more. Covered with a film, the wiring is connected to a circuit board, the circuit board, so that the end surface of the end portion of the circuit board connected to the wiring faces the side opposite to the light emitting unit,
An electroluminescence display characterized by being attached. 2. An electroluminescent display, comprising: a light emitting portion having an electrode on a substrate and emitting light when a voltage is applied to the electrode; and a wiring for applying the voltage, wherein the substrate has An electroluminescent display having a connecting portion directly connected to a driving device of the luminescent display. 3. A light emitting portion having an electrode and emitting light by applying a voltage to the electrode, a driving IC for controlling the voltage, and a circuit board connected to the driving IC. An electroluminescent display characterized by. 4. The electroluminescent display according to claim 2, wherein the light emitting portion is covered with one or a plurality of films. 5. The electroluminescent display according to claim 1, wherein the substrate is made of resin. 6. A light-emitting portion which has an electrode on a substrate and which emits light when a voltage is applied to the electrode and a light-emitting portion covered with one or a plurality of films are connected to a circuit board, and the voltage is applied. In a method for mounting a circuit board of an electroluminescence display having a wiring, the circuit board is such that an end surface of an end portion of the circuit board connected to the wiring faces the side opposite to the light emitting unit,
A method of mounting a circuit board in an electroluminescence display, characterized in that the circuit board is mounted.