JP2012074568A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and substrate processing method which can detect ignition on a processing surface of an object to be processed.SOLUTION: According to an embodiment, there is provided the substrate processing apparatus which supplies an organic solvent to a processing surface of an object to be processed and evaporates the supplied organic solvent. The substrate processing apparatus comprises an organic solvent supply unit for supplying the organic solvent to the processing surface, and a detection unit for detecting ignition on the processing surface.

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method.

In the manufacture of electronic devices such as semiconductor devices and flat panel displays, an object to be processed (for example, a wafer or a glass substrate) is treated with a chemical solution and then washed with pure water or the like. After the cleaning, a drying process using an organic solvent such as IPA (isopropyl alcohol) is performed.
Here, since an organic solvent such as IPA is flammable, a substrate processing apparatus provided with a fire extinguishing mechanism has been proposed in case the organic solvent ignites.

In such a fire extinguishing mechanism, a detection unit provided in an organic solvent tank or the like detects a fire in the substrate processing apparatus itself, and performs fire extinguishing using carbon dioxide gas or the like (for example, Patent Document 1). reference).
However, when the organic solvent remaining on the processing surface of the workpiece is ignited by a spark generated by static electricity or the like, the amount of organic solvent is small, so the combustion time and temperature rise are slight. . Therefore, unless such a slight ignition spreads and becomes a fire, the detection part provided in the fire extinguishing mechanism cannot detect the occurrence of the ignition.

  Therefore, even if a slight ignition occurs on the processing surface of the object to be processed, this cannot be detected, and soot is generated to contaminate the object to be processed, the substrate processing apparatus, the processing apparatus in the subsequent process, and the elements in the manufacturing process. There is a risk of it. In addition, there is a high possibility that the object to be processed becomes a defective product, and there is a possibility that even if this is processed in a subsequent process, it is wasted.

JP-A-6-244166

  Embodiments of the present invention provide a substrate processing apparatus and a substrate processing method capable of detecting ignition on a processing surface of an object to be processed.

  According to the embodiment, the substrate processing apparatus supplies an organic solvent to a processing surface of an object to be processed and evaporates the supplied organic solvent, and an organic solvent supply unit that supplies the organic solvent to the processing surface; There is provided a substrate processing apparatus comprising: a detection unit that detects ignition on the processing surface.

  According to another embodiment, there is provided a substrate processing method for supplying an organic solvent to a processing surface of an object to be processed and evaporating the supplied organic solvent, the step of supplying the organic solvent to the processing surface; And evaporating the organic solvent supplied to the processing surface, and detecting ignition on the processing surface in at least one of the step of supplying the organic solvent and the step of evaporating the organic solvent. A featured substrate processing method is provided.

  According to the embodiments of the present invention, there are provided a substrate processing apparatus and a substrate processing method capable of detecting ignition on a processing surface of an object to be processed.

It is a schematic diagram for illustrating the substrate processing apparatus concerning this embodiment. It is a schematic diagram for illustrating the separation angle with respect to the central axis of a detection part from an ignition position. It is a schematic graph for demonstrating the light reception characteristic based on the difference in an ignition position. It is a schematic graph for demonstrating the light emission characteristic at the time of ignition of IPA.

Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic view for illustrating a substrate processing apparatus according to the present embodiment.
As shown in FIG. 1, the substrate processing apparatus 1 includes a processing container 2, a placement unit 3, a processing unit 4, a shielding unit 5, a detection unit 6, and a control unit 7.
The processing container 2 can be made of an organic material having high chemical resistance. The processing container 2 can be made of, for example, a fluororesin (for example, polytetrafluoroethylene). Further, the processing container 2 can have an airtight structure so that the vapor of the organic solvent used for the processing does not leak to the outside.

  An opening 2a for carrying in / out a workpiece W (for example, a wafer or a glass substrate) is provided on the side wall of the processing container 2, and an opening / closing door 2b capable of opening and closing the opening 2a in an airtight manner is provided. ing. The opening / closing door 2b is opened and closed by an opening / closing mechanism 2c. Further, when the opening 2a is closed, the opening 2a can be hermetically closed by pressing the seal portion 2d provided on the open / close door 2b against the side wall surface of the processing container 2.

  Further, at the bottom of the processing container 2, an exhaust port 2 e for exhausting the exhaust in the processing container 2 and the used processing liquid is provided. The exhaust port 2e can be connected to a processing device (not shown) that processes the exhaust and exhausted processing liquid.

A placement unit 3 is provided inside the processing container 2.
The mounting table 3 that holds and rotates the workpiece W is provided with a mounting table 22 and a driving unit 23.
The mounting table 22 has a disk shape, and one main surface is a mounting surface 22a on which the workpiece W is mounted. In addition, the mounting unit 3 is provided with a holding unit (not shown) such as a vacuum chuck, so that the mounted workpiece W can be held. In addition, the not-shown support part which supports the peripheral edge of the to-be-processed object W is provided in the periphery of the mounting surface 22a, and the to-be-processed mounted in the mounting surface 22a by supporting the peripheral edge of the to-be-processed object W is supported. The object W may be held.

A rotation shaft 22 b is provided at the center of the other main surface of the mounting table 22. The rotating shaft 22b is connected to the drive unit 23 so that the workpiece W held on the placement surface 22a can be rotated around the rotating shaft 22b. Further, a seal portion 26 is provided at a portion where the rotating shaft 22b is inserted through the bottom portion of the processing container 2, so that used processing liquid and the like do not leak out of the processing container 2.
The drive unit 23 is composed of, for example, a control motor such as a servo motor, and rotates the mounting table 22 around the rotation shaft 22b, and can control the rotation speed, the stop position, and the like.

The processing unit 4 includes a processing liquid supply unit 4a, a cleaning liquid supply unit 4b, and an organic solvent supply unit 4c.
As an example, the case where the processing liquid supply unit 4a, the cleaning liquid supply unit 4b, and the organic solvent supply unit 4c are provided is illustrated, but at least the organic solvent supply unit 4c may be provided.

  The processing liquid supply unit 4 a supplies the processing liquid to the processing surface Wa of the workpiece W placed on the placement unit 3. Examples of the treatment liquid include ammonia perwater (aqueous solution containing ammonia and hydrogen peroxide), hydrochloric acid perwater (aqueous solution containing hydrochloric acid and hydrogen peroxide), hydrofluoric acid (aqueous solution of hydrogen fluoride), buffered fluoride. An acid (an aqueous solution containing hydrogen fluoride and ammonium fluoride) can be exemplified. However, it is not limited to these, and can be appropriately changed according to the material of the processing surface Wa of the workpiece W, the processing purpose, and the like. Note that the processing liquid supply unit 4a can be appropriately provided with a tank, a liquid supply pipe, a liquid supply pump, a flow rate control valve, and the like (not shown), but these elements can be applied with known techniques in detail. The detailed explanation is omitted.

  The cleaning liquid supply unit 4 b supplies the cleaning liquid to the processing surface Wa of the workpiece W placed on the placement unit 3. Examples of the cleaning liquid include pure water and deionized pure water. However, the present invention is not limited to these, and a liquid that can wash away the processing liquid supplied to the processing surface Wa of the workpiece W can be appropriately selected. The cleaning liquid supply unit 4b can be appropriately provided with a tank, a liquid supply pipe, a liquid supply pump, a flow rate control valve, and the like (not shown). However, since known techniques can be applied to these elements, detailed descriptions are provided. Description is omitted.

The organic solvent supply unit 4 c supplies the organic solvent to the processing surface Wa of the workpiece W placed on the placement unit 3. Examples of the organic solvent include methyl alcohol, ethyl alcohol, IPA, and a mixed solution thereof. However, the present invention is not limited to these, and a material that can be replaced with the cleaning liquid supplied to the processing surface Wa of the workpiece W or mixed with the cleaning liquid to evaporate can be appropriately selected.
In this case, the organic solvent supplied to the processing surface Wa may be an organic solvent solution, an organic solvent vapor, or an organic solvent solution atomized using an inert gas.
The organic solvent supply unit 4c can be appropriately provided with a tank, a liquid supply pipe, a liquid supply pump, a flow rate control valve and the like (not shown), but these elements can be applied with known techniques in detail. The detailed explanation is omitted.

In addition, at least a portion of the elements constituting the processing liquid supply unit 4a, the cleaning liquid supply unit 4b, and the organic solvent supply unit 4c that comes into contact with the liquid to be used is formed of a material having high resistance to the liquid to be used. be able to. For example, when the liquid (treatment liquid) used in the treatment liquid supply unit 4a is hydrofluoric acid, the portion in contact with hydrofluoric acid is formed from a fluororesin such as polytetrafluoroethylene, polyethylene, or the like. Can be.
In addition, the processing liquid supply unit 4a, the cleaning liquid supply unit 4b, and the organic solvent supply unit 4c may be appropriately provided with a moving unit (not shown) for changing the liquid supply position with respect to the workpiece W. In addition, the supply position of the liquid with respect to the to-be-processed object W is not necessarily limited to what was illustrated in FIG. 1, and can be changed suitably.

The shielding unit 5 is provided with a cup body 24 and a driving unit 25.
The cup body 24 is provided so as to cover the outer peripheral direction of the mounting table 22.
The cup body 24 is provided with a base 24a, a cover 24b, and a lifting shaft 24c.
The base 24a has a cylindrical shape, and has an upper surface and a lower surface opened.
The cover 24b is provided at the upper end of the base portion 24a. The cover 24b is an inclined surface, and its upper end is inclined in a direction approaching the center of the base 24a. By setting it as the cover 24b which has such a form, it can suppress that the liquid supplied to the process surface Wa of the to-be-processed object W splashes from the upper surface of the cover 24b. Further, the upper surface of the cover 24b is opened, and the opening of the cover 24b is larger than the workpiece W.
One end of an elevating shaft 24c is connected to the lower end of the base 24a, and the other end of the elevating shaft 24c is connected to the drive unit 25. Further, a seal portion 27 is provided at a portion where the elevating shaft 24c is inserted through the bottom portion of the processing container 2, so that used processing liquid and the like do not leak out of the processing container 2. Is constituted by a control motor such as a servo motor, a pneumatic cylinder, and the like, and can raise and lower the base 24a and the cover 24b via a lifting shaft 24c. In this case, the position at which the liquid supplied to the processing surface Wa of the workpiece W can be prevented from scattering from the upper surface of the cover 24b is the rising end, and the workpiece W is placed on the mounting table 22. The easy position can be the descending end. The positions of the rising end and the lowering end can be controlled by detecting the raising / lowering position of the cup body 24 by a detector (not shown).

The detection unit 6 detects the ignition of the workpiece W on the processing surface Wa.
Since the organic solvent supplied to the processing surface Wa of the workpiece W by the organic solvent supply unit 4c is flammable, it may be ignited by a spark generated by static electricity or the like. In this case, since the amount of the organic solvent supplied to the processing surface Wa of the workpiece W by the organic solvent supply unit 4c is small, the combustion time, temperature rise, and the like are slight. Further, in the so-called spin drying process, the organic solvent supplied to the processing surface Wa is discharged in the radial direction of the workpiece W by rotating the workpiece W, so that the amount of the organic solvent is further reduced. As a result, the combustion time and temperature rise are further reduced.

According to experiments conducted by the present inventors, the amount of the organic solvent remaining on the processing surface Wa of the workpiece W depends on the rotational speed of the workpiece W, but is approximately 0.5 cc at a practical rotational speed. Met. In this case, if the organic solvent is IPA, the combustion enthalpy is 2005.8 kilojoules per mole, and if all 0.5 cc IPA of 6.58 × 10 ⁻³ moles is combusted, the combustion energy is 13 2 kilojoules, approximately 3.2 kilocalories. In this case, the combustion time was about 5 seconds.

Here, if a slight ignition occurs on the processing surface Wa of the workpiece W, soot and the like may be generated, and the workpiece W, elements provided inside the processing container 2 and the like may be contaminated. Further, when the workpiece W contaminated with soot or the like is processed in a subsequent process, there is a risk of contaminating a processing apparatus in a subsequent process, an element in a manufacturing process, or the like. In addition, the workpiece W in which slight ignition has occurred is highly likely to be a defective product, and even if this is processed in a subsequent process, there is a possibility that it will be wasted.
Therefore, in the substrate processing apparatus 1 according to the present embodiment, the detection unit 6 that detects the ignition of the workpiece W on the processing surface Wa is provided.

The detection unit 6 is provided at a position where the processing surface Wa of the workpiece W placed on the mounting table 22 can be faced.
The detection unit 6 can detect light when ignition occurs on the processing surface Wa of the workpiece W. In this case, it is difficult to predict where the ignition will occur on the processing surface Wa. Therefore, the detection unit 6 can be provided at a position where the entire area of the processing surface Wa becomes a detection region so that the detection can be performed no matter where the ignition occurs on the processing surface Wa.
For example, when the ignition occurs, the detection unit 6 is provided at a position where the ignition location is not hidden behind the cup body 24, the treatment liquid supply unit 4a, the cleaning liquid supply unit 4b, the organic solvent supply unit 4c, and the like. be able to.
Specifically, it can be provided on the ceiling or side wall of the processing container 2. In this case, as an arrangement position where the entire processing surface Wa can be set as the detection region, the center portion of the ceiling of the processing container 2 can be exemplified.

Here, the amount of light received by the detection unit 6 differs between the case where ignition occurs in the central portion of the processing surface Wa and the case where ignition occurs in the peripheral portion of the processing surface Wa.
FIG. 2 is a schematic diagram for illustrating the separation angle from the ignition position with respect to the central axis of the detection unit.
FIG. 3 is a schematic graph for illustrating the light receiving characteristics based on the difference in the ignition position.
As shown in FIG. 2, when the detection unit 6 is disposed so that the central axis 6a of the detection unit 6 passes through the center of the processing surface Wa, light from the central portion of the processing surface Wa is incident on the light receiving surface. Only a part of the light from the peripheral portion of the surface Wa can enter the light receiving surface.
Therefore, the separation angle θ with respect to the central axis 6a of the detection unit 6 from one detection point (ignition position) of the processing surface Wa is as illustrated in FIG. FIG. 2 shows a case where the detection point (ignition position) is the peripheral portion. When viewed from the front, the counterclockwise separation angle from the central axis 6a is + θ, and the clockwise separation angle is −θ.
The relationship between the separation angle θ and the ratio of the amount of received light is as illustrated in FIG. The ratio of the received light amount is “the received light amount at each separation angle / the received light amount when the separation angle θ is 0 deg”.

In this case, since the amount of received light is smaller in the case where ignition occurs in the peripheral portion of the processing surface Wa than in the case where ignition occurs in the central portion of the processing surface Wa, detection becomes difficult.
According to the knowledge obtained by the present inventor, the amount of received light when ignition occurs at the peripheral portion of the processing surface Wa is about 0.1 times the amount of received light when ignition occurs at the central portion of the processing surface Wa. Become. For this reason, if the detection unit 6 has a detection characteristic such that the light reception characteristic with respect to the peripheral part is 10 times or more the light reception characteristic with respect to the central part, this can be detected regardless of where the ignition occurs on the processing surface Wa. .
In this case, for example, a mirror is disposed at a position where the light caused by the ignition can be reflected and incident on the detection unit 6, and the light caused by the ignition at the peripheral portion of the processing surface Wa is reflected by reflecting the light caused by the ignition. 6 may be condensed, or a plurality of detection units may be provided so that light from the firing at the peripheral edge of the processing surface Wa is received by the plurality of detection units.

Moreover, the light emission characteristics at the time of ignition differ depending on the type of the organic solvent.
FIG. 4 is a schematic graph for illustrating the light emission characteristics at the time of ignition of IPA.
As shown in FIG. 4, when IPA ignites, a peak value appears in the emission intensity ratio at a specific wavelength. Therefore, it is possible to detect IPA firing by detecting light of a specific wavelength.
As shown in FIG. 4, in the case of IPA, a peak value appears in the emission intensity ratio at four wavelengths. Therefore, the ignition of IPA is detected by appropriately combining at least one of these four wavelengths or combining the four wavelengths. Can be. In this case, the wavelength to be measured can be selected in consideration of disturbance light and the like. In addition, the detection in a specific wavelength can be performed by providing the light-receiving surface of the detection part 6 with the filter etc. which permeate | transmit the light which has a specific wavelength.
In particular, when infrared light is used as a detection target, the influence of disturbance light can be reduced, so that light generated by ignition can be received efficiently. Therefore, detection accuracy can be improved.
In particular, it is preferable to detect light having a wavelength of 0.3 μm or more and 2 μm or less. If the light receiving element is used in the processing container 2 with the light receiving element exposed, the light receiving element may corrode in the atmosphere containing the chemical solution in the processing container 2 and the performance may be deteriorated. For this reason, it is preferable to arrange the light receiving element outside the processing container 2 and perform detection through a quartz window provided in the processing container 2. By doing so, it is possible to prevent corrosion and performance degradation of the light receiving element.
Here, light having a wavelength of 0.3 micrometer or more and 2 micrometers or less has a high transmittance of quartz.
For this reason, if light having a wavelength of 0.3 micrometer or more and 2 micrometers or less is to be detected, the light receiving element is disposed outside the processing container 2 and the precision is obtained through the quartz window provided in the processing container 2. High detection can be performed.
In other words, efficient detection can be performed by detecting light in the infrared wavelength region and having a wavelength of 0.3 μm or more and 2 μm or less, which has a high transmittance with respect to quartz.

The control unit 7 performs control based on the signal from the detection unit 6.
As described above, since the amount of the organic solvent on the processing surface Wa of the workpiece W is small, the combustion time, that is, the light emission time is also short. Therefore, it is possible to distinguish between the ignition of the organic solvent and another heat source by utilizing the short emission time.
In addition, since the organic solvent is ignited suddenly, the organic solvent can be distinguished from other heat sources by changing the intensity of light. For example, even when there is another heat source in the detection region of the detection unit 6, it often occurs suddenly because the heat source often generates heat constantly or has a moderate temperature change. A distinction can be made between the ignition of organic solvents and other heat sources.

For example, when the detection unit 6 converts incident light into an electrical signal corresponding to the intensity, the emission time is measured and the organic solvent is ignited from the emission time and the intensity of the incident light. Can be determined. Further, it can be determined that the organic solvent is ignited by the change in the intensity of the incident light.
In addition, when the detection unit 6 generates an electrical signal according to the change in the intensity of the incident light, the electrical signal is generated when the change in the intensity of the light occurs, that is, when ignition occurs. Therefore, by detecting this, it can be determined that the organic solvent is ignited. Furthermore, it can be determined that the organic solvent is ignited in consideration of the light emission time.
In this case, such a determination can be made in the control unit 7.
That is, the control unit 7 can detect firing on the processing surface Wa based on at least one of the light emission time and the change in light intensity.
Note that a predetermined threshold value can be used for the determination regarding the ignition of the organic solvent.
In this way, it is possible to improve the detection accuracy and detection reliability of organic solvent ignition.

In addition, when the firing on the processing surface Wa is detected, the control unit 7 gives a process abnormality identification mark (for example, an abnormality flag in the process management data) to the workpiece W from which the firing has been detected. To be able to.
In addition, when ignition is detected, the control unit 7 causes the cleaning liquid supply unit 4b to supply the cleaning liquid to the processing surface Wa of the workpiece W to extinguish the fire, or a fire extinguishing mechanism (not shown) such as carbon dioxide gas Fire extinguishing using can be performed.

In addition, an air flow control unit (not shown) that forms an air flow that flows from the ceiling side toward the bottom side (discharge port 2 e) can be appropriately provided inside the processing container 2. If an airflow control unit (not shown) is provided, it is possible to prevent the exhaust from leaking from the inside of the processing container 2 to the outside. Moreover, it can suppress that a particle adheres to the to-be-processed object W. FIG. In this case, it is possible to form an air stream such that the atmosphere concentration of the organic solvent (for example, IPA) is less than 0.5%. Note that a detection device (not shown) that detects the atmospheric concentration of the organic solvent can be provided to control the formation of the air current so that the atmospheric concentration of the organic solvent is less than 0.5%.
Further, an ionizer (not shown) or the like can be provided inside the processing container 2 to suppress ignition due to static electricity.

In addition, when the organic solvent is supplied to the processing surface Wa of the workpiece W, a pure water supply unit (not shown) that supplies pure water to the surface opposite to the processing surface Wa can be provided. In this case, pure water can be supplied via the mounting table 22. For example, the pure water supply unit can supply pure water of about 2 liters / minute. In addition, about the structure of the pure water supply part which is not shown in figure, since a well-known technique can be applied similarly to the washing | cleaning liquid supply part 4b, detailed description is abbreviate | omitted.
A fire extinguishing mechanism (not shown) that performs fire extinguishing using carbon dioxide gas or the like may be provided. Since a known technique can be applied to a fire extinguishing mechanism (not shown), a detailed description is omitted.

Next, the operation of the substrate processing apparatus 1 will be illustrated.
First, the base 24a and the cover 24b are lowered by the drive unit 25 to the lower end.
Next, the opening / closing door 2b is opened by the opening / closing mechanism 2c, and the workpiece W is carried into the processing container 2 through the opening 2a by a loading / unloading device (not shown). The loaded workpiece W is placed on the placement surface 22 a of the placement table 22. The workpiece W placed on the placement surface 22a is held by a holding unit (not shown) such as a vacuum chuck. In addition, when the support part (not shown) which supports the peripheral edge of the to-be-processed object W is provided in the periphery of the mounting surface 22a, the peripheral edge of the to-be-processed object W is supported by the support part (not shown). The workpiece W placed on the placement surface 22a is held.
By holding the workpiece W, it is possible to prevent the position of the workpiece W from shifting when the mounting table 22 rotates.

Next, the opening / closing door 2b is closed by the opening / closing mechanism 2c, and the base 24a and the cover 24b are raised to the rising end by the drive unit 25.
Next, by rotating the rotating shaft 22b by the drive unit 23, the workpiece W held on the placement surface 22a is rotated at a predetermined rotation speed (for example, 100 to 1500 rpm (revolutions per minute)).
In addition, as an example, the case where the processing liquid, the cleaning liquid, and the organic solvent are supplied to the processing surface Wa of the rotated processing target W is illustrated. However, the processing liquid, the cleaning liquid, and the organic solvent are supplied to the processing surface Wa. The object W can also be rotated.

  Next, the processing liquid is supplied to the processing surface Wa of the workpiece W by the processing liquid supply unit 4a. The processing liquid supplied to the processing surface Wa reaches the entire surface of the processing surface Wa by rotating the workpiece W, and a desired processing is performed. And the used process liquid is discharged | emitted by the centrifugal force in the diameter outward direction of the to-be-processed object W. FIG. The used processing liquid discharged in the radially outward direction of the workpiece W is suppressed from being scattered by the base 24 a and the cover 24 b of the cup body 24 and collected at the bottom of the processing container 2. The used processing liquid collected at the bottom of the processing container 2 is discharged from the discharge port 2e.

  Next, the cleaning liquid is supplied to the processing surface Wa of the workpiece W by the cleaning liquid supply unit 4b. The cleaning liquid supplied to the processing surface Wa reaches the entire surface of the processing surface Wa by rotating the workpiece W, or the processing liquid remaining on the processing surface Wa is washed away. Then, the used cleaning liquid and the washed-out processing liquid are discharged out of the diameter of the workpiece W by centrifugal force. The used cleaning liquid discharged to the outside of the workpiece W and the processed processing liquid are discharged from the discharge port 2e in the same manner as the processing liquid described above. Alternatively, a partition wall and a discharge port (not shown) are provided so that the used cleaning liquid discharged in the radially outward direction of the workpiece W and the washed processing liquid are discharged from a discharge port different from the processing liquid described above. It can also be.

Next, the organic solvent is supplied to the processing surface Wa of the workpiece W by the organic solvent supply unit 4c. The organic solvent supplied to the processing surface Wa reaches the entire surface of the processing surface Wa by rotating the workpiece W. This organic solvent and the cleaning liquid remaining on the processing surface Wa are replaced. Alternatively, the cleaning liquid and the organic solvent are mixed to form a mixed liquid that is more easily evaporated. And an organic solvent and liquid mixture are discharged | emitted in the radial direction of the to-be-processed object W with a centrifugal force. The organic solvent or mixed liquid discharged in the radially outward direction of the workpiece W is discharged from the discharge port 2e in the same manner as in the case of the processing liquid described above. Alternatively, a partition wall and a discharge port (not shown) may be provided, and the organic solvent or mixed solution discharged in the radially outward direction of the workpiece W may be discharged from a discharge port different from the processing liquid and the cleaning liquid described above. .
In this case, the organic solvent supplied to the processing surface Wa may be an organic solvent solution, an organic solvent vapor, or a solution obtained by atomizing an organic solvent solution using a gas.

  Further, when the organic solvent is supplied to the processing surface Wa of the workpiece W, pure water of about 2 liters / minute is supplied from a pure water supply unit (not shown) to the surface opposite to the processing surface Wa. Can be done. If pure water is supplied to the surface opposite to the processing surface Wa, the variation in the in-plane temperature distribution of the workpiece W can be reduced, so that the in-plane in the replacement of the cleaning liquid with the organic solvent can be reduced. Uniformity can be improved. Moreover, the organic solvent discharged | emitted by the centrifugal force in the outer diameter direction of the to-be-processed object W, and the pure water discharged | emitted by the centrifugal force in the outer diameter direction of the to-be-processed object W are mixed and diluted (for example, Since the concentration of the organic solvent is about 0.01% by weight), the occurrence of ignition can be suppressed.

The organic solvent or mixed liquid remaining on the processing surface Wa can be evaporated by performing so-called spin drying.
In this case, the organic solvent and the cleaning liquid remaining on the processing surface Wa are replaced, or a mixed liquid that is more easily evaporated is formed to perform drying with suppressed destruction of the watermark and pattern. it can.

Here, in the present embodiment, the detection unit 6 detects the firing of the workpiece W on the processing surface Wa.
If the control unit 7 determines that the process surface Wa is ignited, the cleaning liquid supply unit 4b supplies the cleaning liquid to the processing surface Wa of the workpiece W and extinguishes the fire. Fire extinguishing using carbon gas or the like can be performed.
In addition, the control unit 7 can add a process abnormality identification mark to the workpiece W. The to-be-processed object W provided with the process abnormality identification mark can be configured such that, for example, processing in a subsequent process is limited or discarded. For this reason, it is possible to suppress contamination of the processing apparatus in the post-process and elements in the manufacturing process, and it is possible to eliminate the generation of useless processing in the post-process.

  Next, the rotation of the workpiece W is stopped, and the base 24a and the cover 24b are lowered to the lower end by the drive unit 25. Then, the opening / closing door 2b is opened by the opening / closing mechanism 2c, and the workpiece W is unloaded by a loading / unloading device (not shown). Thereafter, the processing of the workpiece W can be continuously performed by repeating the above-described operation as necessary.

  According to the present embodiment, it is possible to detect even a slight ignition on the processing surface Wa of the workpiece W. Therefore, it can suppress that the processing apparatus of a post process, the element in a manufacturing process, etc. are contaminated with the to-be-processed object W contaminated with the soot. In addition, it is possible to eliminate generation of useless processing in the subsequent process.

Next, the substrate processing method according to this embodiment is illustrated.
First, a processing liquid is supplied to the processing surface Wa of the workpiece W (Step S1).
At this time, the processing liquid can be supplied to the processing surface Wa of the rotated processing target W, or the processing target W supplied with the processing liquid can be rotated to the processing surface Wa.
Next, the cleaning liquid is supplied to the processing surface Wa of the workpiece W (step S2).
At this time, the cleaning liquid can be supplied to the processing surface Wa of the rotated workpiece W, or the workpiece W having the cleaning liquid supplied to the processing surface Wa can be rotated.
Next, an organic solvent is supplied to the processing surface Wa of the workpiece W (step S3).
At this time, the organic solvent can be supplied to the processing surface Wa of the rotated workpiece W, or the workpiece W supplied with the organic solvent can be rotated to the processing surface Wa.
Next, the organic solvent supplied to the processing surface Wa of the workpiece W is evaporated (step S4). Further, in at least one of step S3 and step S4, the firing of the workpiece W on the processing surface Wa is detected (step S5).
That is, in at least one of the step of supplying the organic solvent to the processing surface Wa of the workpiece W and the step of evaporating the organic solvent supplied to the processing surface Wa of the workpiece W, the ignition on the processing surface Wa is detected. .
Further, in the detection of the ignition on the processing surface Wa, the ignition on the processing surface Wa can be detected based on at least one of the light emission time and the change in light intensity. When ignition is detected, the cleaning liquid can be supplied to the processing surface Wa of the workpiece W to extinguish it, or extinguishment using carbon dioxide gas or the like can be performed by a fire extinguishing mechanism (not shown).
Further, a process abnormality identification mark may be given to the workpiece W. The to-be-processed object W provided with the process abnormality identification mark can be configured such that, for example, processing in a subsequent process is limited or discarded.
In addition, since the content in each process can be made the same as that demonstrated when the substrate processing apparatus 1 was illustrated, detailed description is abbreviate | omitted.

  According to the present embodiment, even a slight ignition on the processing surface Wa of the workpiece W is detected. Therefore, it can suppress that the processing apparatus of a post process, the element in a manufacturing process, etc. are contaminated with the to-be-processed object W contaminated with the soot. In addition, it is possible to eliminate generation of useless processing in the subsequent process.

The embodiment has been illustrated above. However, the present invention is not limited to these descriptions.
Regarding the above-described embodiment, those in which those skilled in the art appropriately added, deleted, or changed the design, or added the process, omitted, or changed the conditions also have the features of the present invention. As long as it is within the scope of the present invention.
For example, the case of a so-called single-wafer type substrate processing apparatus has been illustrated, but the present invention may be applied to a substrate processing apparatus or a substrate processing method that has a tank for storing an organic solvent and in which the workpiece W is immersed in the organic solvent. it can. In this case, the main surface (front surface, back surface) of the workpiece W taken out from the tank containing the organic solvent becomes the processing surface.
Further, the shape, size, material, arrangement, number, and the like of each element included in the substrate processing apparatus 1 are not limited to those illustrated, but can be changed as appropriate.
Moreover, each element with which each embodiment mentioned above is combined can be combined as much as possible, and what combined these is also included in the scope of the present invention as long as the characteristics of the present invention are included.

  DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus, 2 Processing container, 3 Placement part, 4 Processing part, 4a Processing liquid supply part, 4b Cleaning liquid supply part, 4c Organic solvent supply part, 5 Shielding part, 6 Detection part, 24 Cup body, W Processed Material, Wa treatment surface

Claims (9)

A substrate processing apparatus for supplying an organic solvent to a processing surface of an object to be processed and evaporating the supplied organic solvent,
An organic solvent supply unit for supplying an organic solvent to the treatment surface;
A detection unit for detecting ignition in the processing surface;
A substrate processing apparatus comprising:   The substrate processing apparatus according to claim 1, wherein the detection unit has a detection characteristic in which a light reception characteristic with respect to a peripheral portion of the processing surface is 10 times or more a light reception characteristic with respect to a central portion of the processing surface. . A control unit that performs control based on a signal from the detection unit;
3. The substrate processing according to claim 1, wherein the control unit detects firing on the processing surface based on at least one of a light emission time based on light emission by the firing and a change in light intensity. 4. apparatus.   4. The substrate according to claim 3, wherein when the ignition on the processing surface is detected, the control unit gives a process abnormality identification mark to the workpiece on which the ignition is detected. Processing equipment. A cleaning liquid supply unit for supplying a cleaning liquid to the processing surface;
5. The substrate processing apparatus according to claim 3, wherein the control unit causes the cleaning liquid supply unit to supply a cleaning liquid when ignition is detected on the processing surface. 6. A substrate processing method of supplying an organic solvent to a processing surface of an object to be processed and evaporating the supplied organic solvent,
Supplying an organic solvent to the treated surface;
Evaporating the organic solvent supplied to the treated surface;
With
A substrate processing method comprising detecting an ignition on the processing surface in at least one of the step of supplying the organic solvent and the step of evaporating the organic solvent.   The substrate processing method according to claim 6, wherein in the detection of ignition on the processing surface, the ignition on the processing surface is detected based on at least one of a light emission time and a change in light intensity.   The substrate processing method according to claim 7, wherein, when firing on the processing surface is detected, a process abnormality identification mark is attached to the workpiece on which the firing is detected.   9. The substrate processing method according to claim 7, wherein when the ignition on the processing surface is detected, the ignition on the processing surface is extinguished.

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