JP2012069255A - Connection structure manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent magnetic conductive particles from becoming localized in an anisotropic conductive adhesive film when a connection structure is manufactured by an anisotropic conductive connection of terminals of a fist and a second electronic component, thereby keeping particle capturing property, insulation quality, and connection reliability from decreasing.SOLUTION: The manufacturing method of a connection structure comprised of an anisotropic conductive connection of a terminal 3 of a fist electronic component 2 and the terminal of a second electronic component includes: an ACF temporary pasting process where an anisotropic conductive film 4 which contains magnetic conductive particles is temporarily pasted to the terminal of the first electronic component; a demagnetization process in which the anisotropic conductive film temporarily pasted to the first electronic component is demagnetized; an electronic component temporary placement process in which the second electronic component is temporarily disposed on the demagnetized anisotropic conductive film on the first electronic component; and an anisotropic conductive connection process in which the temporarily disposed second electronic component, while being heated by a heating-and-pressurizing bonder, is pressed against the first electronic component to make an anisotropic conductive connection of the first and the second electronic components.

Description

  The present invention relates to a method for manufacturing a connection structure in which a terminal of a first electronic component and a terminal of a second electronic component are anisotropically conductively connected.

  An anisotropic conductive film (ACF) is manufactured by dispersing conductive particles in an insulating adhesive and forming the film into a film. In this case, as the conductive particles, those having a smaller particle size are used according to the fine pitch of the wiring, and also show conductivity and deformability suitable for anisotropic conductive connection, In addition, resin particles coated with a nickel plating film that is relatively inexpensive to obtain (hereinafter referred to as nickel-coated resin particles) are widely used (Patent Document 1).

JP 2009-259787 A

  However, when an anisotropic conductive film using magnetic powder such as nickel metal particles or nickel-coated resin particles as conductive particles is used, for example, when a driving semiconductor chip is anisotropically conductively connected to a display panel, Since the insulating adhesive component is melted and fluidized at the time of the conductive conductive connection, the conductive particles are also easily moved, and as a result, there is a problem that the magnetic powder as the conductive particles is aggregated. Such agglomeration of the conductive particles causes localization of the conductive particles, causes a short circuit between adjacent wirings, and causes a problem in insulation. In addition, the conductive particles may not be trapped between the electrodes to be connected, and the particle trapping property is lowered. For this reason, the conduction resistance value increases and the conduction failure occurs, and as a result, the risk of lowering the conduction reliability increases.

  An object of the present invention is to solve the above-described problems of the prior art, and an anisotropic conductive film using magnetic conductive particles composed of magnetic powder such as nickel metal particles and nickel-coated resin particles. Is used to manufacture a connection structure by anisotropically conductively connecting terminals of a first electronic component such as a display panel and terminals of a second electronic component such as a driving semiconductor chip. It is to prevent the conductive particles from being localized in the conductive adhesive and to prevent the particle trapping property, the insulating property and the connection reliability from being deteriorated.

  The present inventor has a high possibility of solving the above-mentioned object by using magnetic powder that has been demagnetized in advance as conductive particles when producing an anisotropic conductive film. Because the magnetic powder is easy to move, we faced the problem that it was difficult to efficiently demagnetize the magnetic powder in a fine powder state. For this reason, as a result of earnest research on demagnetization treatment in another aspect, unexpectedly, the above-mentioned problems can be solved by demagnetizing the anisotropic conductive film temporarily attached to the electronic component as it is As a result, the present invention has been completed.

That is, according to the present invention, in a method for manufacturing a connection structure in which the terminals of the first electronic component and the terminals of the second electronic component are anisotropically conductively connected, the following steps (A2), (B), (C) and (D):
Step (A2)
An anisotropic conductive film (ACF) temporary attachment step of temporarily attaching an anisotropic conductive film containing magnetic conductive particles to the terminals of the first electronic component;
Process (B)
A demagnetizing treatment step of demagnetizing the anisotropic conductive film temporarily attached to the first electronic component;
Process (C)
An electronic component temporary installation step of temporarily installing the second electronic component on the anisotropic conductive film subjected to the demagnetization treatment on the first electronic component; and
Process (D)
The terminal of the first electronic component is different from the terminal of the second electronic component by pressing the temporarily installed second electronic component against the first electronic component while being heated by a heat and pressure bonder. Provided is a manufacturing method characterized by having an anisotropic conductive connection step for conducting a conductive conductive connection, and a connection structure manufactured by the manufacturing method.

  In the manufacturing method of the connection structure of the present invention, an anisotropic conductive film containing magnetic conductive particles is used as an anisotropic conductive connection, and is temporarily attached to an electronic component prior to the thermocompression bonding. Demagnetization treatment is performed on the anisotropic conductive film. As a result, the aggregation of the magnetic conductive particles can be prevented or greatly suppressed when the anisotropic conductive film flows under the conditions of the thermocompression bonding. Therefore, when a connection structure is manufactured using an anisotropic conductive film using magnetic conductive particles, it is possible to provide a connection structure that exhibits good insulating properties, particle trapping properties, and conduction reliability.

FIG. 1 is an explanatory diagram of a demagnetizing method that can be preferably applied to the present invention.

  Hereinafter, the present invention will be described in detail.

  The present invention is a method for manufacturing a connection structure in which a terminal of a first electronic component and a terminal of a second electronic component are anisotropically conductively connected. The following steps (A2), (B), ( C) and (D). Details will be described below for each process.

Step (A2) [ACF Temporary Bonding Step]
First, an anisotropic conductive film containing magnetic conductive particles is temporarily attached to the terminals of the first electronic component. Temporary sticking is performed by the adhesiveness of the anisotropic conductive film itself or by the adhesiveness expressed by heating and softening the anisotropic conductive film. Specifically, by using a heat and pressure bonder, the anisotropic conductive film can be temporarily stuck to the terminal of the first electronic component by heating and pressing so that the anisotropic conductive film is not cured. As the heat and pressure bonder, a known flip chip bonder equipped with a metallic head or a rubber elastic head can be used. As for the heating, the bonder may be provided with a heating means, and the heating may be provided on a stage on which the first electronic component or the second electronic component is placed. You may use both together.

  As the first electronic component, an electronic component to which an anisotropic conductive connection by an anisotropic conductive film can be applied can be used. For example, a glass wiring board, a silicon wiring board, a polyimide flexible wiring board, a glass epoxy wiring board, a ceramic wiring board, etc. can be mentioned. In particular, display panels such as LCP, PDP, and organic ELD can be preferably applied.

  Moreover, the terminal comprised from the well-known wiring material is applicable also as a terminal of a 1st electronic component. For example, electrode pads and bumps composed of copper, gold, silver, palladium, ITO (indium-tin composite oxide), and the like can be given. Moreover, a terminal can be comprised from magnetic materials, such as nickel.

  When the terminal is composed of a magnetic material, it is preferable to carry out the following step (A1) [magnetization treatment step].

Process (A1) [Magnetization process]
Prior to this step (A2), the first electronic component is magnetized. Thereby, a terminal made of a magnetic material can be positively magnetized. In this case, it is preferable to perform temporary sticking by heating the anisotropic conductive film at 80 ° C. so that the melt viscosity is 150 to 5000 Pa · s, preferably under conditions that allow the conductive particles to move. Thereby, the magnetic conductive particles can be concentrated on the terminals magnetized at the time of temporary attachment, and it becomes possible to cope with the fine pitch of electronic components. The magnetization process can be performed using a known detachable magnetic device.

  The anisotropic conductive film used in this step (A2) is a film in which magnetic conductive particles are dispersed in an insulating adhesive composition and is formed into a film shape.

(Magnetic conductive particles)
The magnetic conductive particles used in the present invention are magnetizable conductive particles, at least a part of which is made of a magnetic material. Therefore, the magnetic conductive particle includes a case where it is magnetized and a case where it is demagnetized. Such magnetic conductive particles include not only the case where the entire conductive particles are formed of a single magnetic material, but also particles in which a thin film of magnetic material is formed on the surface of the conductive particles or insulating particles, such as Examples thereof include particles in which a nonmagnetic metal film is further formed on a magnetic thin film, and particles in which a thin film of nonmagnetic insulating resin is further formed on the outermost surface of these magnetic powders.

  Specific examples of magnetic powders that can be used as magnetic conductive particles include powders of magnetic metals or magnetic alloys such as nickel, iron, iron oxide, chromium oxide, ferrite, cobalt, sendust, and nonmagnetic conductive particles such as solder and copper. Powders such as metal-coated resin particles with a thin film of magnetic material formed on the surface of insulating resin core particles, powders with a gold-plated thin film formed on those surfaces, or powders coated with an insulating resin layer And so on.

  Among these, as the magnetic conductive particles for anisotropic conductive connection, nickel-coated resin particles can be preferably mentioned in consideration of manufacturing cost, deformation due to heating and pressurization at the time of connection, and the like. The resin that becomes the core is not particularly limited, but inorganic or organic materials having heat resistance and chemical resistance can be preferably used.

  Moreover, when using nickel as a magnetic material which comprises a magnetic conductive particle, in order to suppress aggregation of a magnetic conductive particle, it is preferable to contain a phosphorus element in nickel. The content of the phosphorus element is greater than 0% by mass, preferably 0.1% by mass or more, more preferably 4% by mass or more. On the other hand, if the content of the phosphorus element in nickel is too large, the connection becomes high resistance, so that it is preferably 10% by mass or less, more preferably 8% by mass or less. The phosphorus element in nickel is usually derived from a phosphoric acid compound, a phosphorous acid compound, or the like used for adjusting the pH of the nickel plating bath, but is not limited thereto.

  If the average particle diameter of the magnetic conductive particles used in the present invention is too small, the ratio of the magnetic metal in the entire magnetic conductive particles becomes high, so that the magnetic conductive particles are easily affected by magnetism. In addition, there is a tendency that the anisotropic conductive function of the conductive particles is reduced and the variation in the height of the terminals of the electronic component cannot be followed, and the connection reliability becomes defective. Since the insulating property between the wirings is reduced by the particles and the fine pitch connection itself tends not to be supported, the thickness is preferably 0.5 to 30 μm, more preferably 1 to 10 μm.

  If the content of the magnetic conductive particles in the anisotropic conductive film described above is too small, the connection reliability becomes insufficient, and if it is too large, the anisotropy is lost. Therefore, preferably in the insulating adhesive composition The resin solid content (all components (monomers, oligomers, non-polymerizable polymers, curing agents, etc.) that become film-forming components after curing) is preferably 1 to 100 parts by mass, more preferably 2 to 70 parts by mass, based on 100 parts by mass. Part.

(Insulating adhesive composition)
The insulating adhesive composition constituting the anisotropic conductive adhesive film of the present invention is appropriately selected from thermosetting binder resin compositions used in conventional anisotropic conductive adhesives. can do. For example, an insulating adhesive composition in which a curing agent such as an imidazole curing agent or an amine curing agent is blended with a thermosetting epoxy resin, a thermosetting urea resin, a thermosetting melamine resin, a thermosetting phenol resin, or the like. Can be mentioned. Among these, in consideration of a good adhesive strength after curing, an insulating adhesive composition using a thermosetting epoxy resin as a binder resin can be preferably used.

  Such a thermosetting epoxy resin may be liquid or solid, and preferably has an epoxy equivalent of usually about 100 to 4000 and having two or more epoxy groups in the molecule. For example, a bisphenol A type epoxy compound, a phenol novolac type epoxy compound, a cresol novolac type epoxy compound, an ester type epoxy compound, an alicyclic epoxy compound, or the like can be preferably used. These compounds include monomers and oligomers.

  Such an insulating adhesive composition can contain a filler such as silica and mica, a colorant, an antistatic agent, and the like, if necessary. Furthermore, a preservative, a polyisocyanate crosslinking agent, a silane coupling agent, a solvent, and the like can also be contained.

(Anisotropic conductive adhesive film)
The anisotropic conductive adhesive film used in the present invention can be produced by the same technique as that of a conventional anisotropic conductive film.

Process (B) [Demagnetization process]
Next to the step (A2), demagnetization treatment is performed on the anisotropic conductive film temporarily attached to the first electronic component. The meaning of this demagnetization treatment means that the magnetic conductive particles are fixed in a film-like insulating resin composition and efficiently demagnetized. As a demagnetizing treatment method, a conventional demagnetizing treatment method can be applied. Specifically, the whole may be put into a known demagnetizing device and temporarily demagnetized while the anisotropic conductive film is temporarily attached to the first electronic component.

  If the magnetic field strength at the time of demagnetization is too low, the effect of demagnetization cannot be obtained, and the magnetic conductive particles will aggregate. If it is too high, there is a possibility that the conductive particles will be magnetized. It can be suitably used in the range of 2000G, preferably 200 to 2000G, more preferably 200 to 400G.

  Furthermore, since the demagnetization rate during the demagnetization process is too slow, the production efficiency is lowered, and when it is too fast, it tends to be difficult to obtain the magnetic efficiency, so it is preferably 0.1 to 100 mm / s, more preferably. 1-100 mm / s, more preferably 1-50 mm / s.

  If the terminal of the first electronic component is made of a magnetic material and the step (A1) [magnetization treatment step] is performed, the demagnetization treatment in this step (B) is performed. In the process, when the demagnetizing treatment is performed on the anisotropic conductive film, it is preferable to simultaneously demagnetize the terminal made of the magnetic material of the first electronic component.

  As a specific example of the demagnetization treatment method, as shown in FIG. 1, the first electronic component 2 and the anisotropic conductive film 4 temporarily attached to the terminal 3 on the nonmagnetic base 1 are used. The laminated body 5 is placed and pressed by the nonmagnetic cover 6 from above, and the anisotropic conductive film 4 is formed by the detachable magnetic coil 10 while being temporarily attached to the first electronic component 2. The magnetic field may be moved away from the removable magnetic coil 10 at least once in the direction of the arrow while the magnetic field strength is attenuated.

  As another specific example of the demagnetization treatment method, the anisotropic conductive film wound in a reel shape is demagnetized, and then the demagnetized anisotropic conductive film is temporarily placed on the terminal 3. It may be pasted.

  If the magnetic field strength during the demagnetization treatment is too low, the effect of demagnetization cannot be obtained, and the conductive particles will aggregate. If it is too high, the conductive particles may be magnetized. Can be suitably used within the range of 200 to 2000G, preferably 200 to 400G.

  Further, in the case of the configuration shown in FIG. 1, the demagnetization speed in the case of the demagnetization treatment is preferably too low because production efficiency is lowered if it is too slow, and magnetic efficiency tends to be difficult to obtain if it is too fast. It is 1-100 mm / s, More preferably, it is 1-100 mm / s, More preferably, it is 1-50 mm / s.

Process (C) [Temporary installation process for electronic components]
A second electronic component is temporarily installed on the anisotropic conductive film subjected to the demagnetization treatment on the first electronic component. In this case, the terminal of the second electronic component is temporarily installed while being aligned with the corresponding terminal of the first electronic component. Also in the case of temporary installation, a conventionally known heat and pressure bonder is used, and the insulating adhesive composition of the anisotropic conductive film does not substantially thermoset, and the surface of the anisotropic conductive film exhibits stickiness. What is necessary is just to heat-press on such conditions.

Process (D) [Anisotropic conductive connection process]
After the step (C), the second electronic component temporarily installed is pressed against the first electronic component while being heated by a heat and pressure bonder, that is, by thermocompression bonding. The terminal of the first electronic component and the terminal of the second electronic component are anisotropically conductively connected. Thereby, a connection structure is obtained in which the terminals of the first electronic component and the terminals of the second electronic component are anisotropically conductively connected.

  The optimum thermocompression bonding conditions may be appropriately selected according to the materials and types of electronic components and terminals used, the structure of the anisotropic conductive film, and the like.

  Hereinafter, the present invention will be specifically described by way of examples.

Reference example 1
(Preparation of nickel-coated resin particles)
A palladium catalyst was supported on the 3 μm diameter divinylbenzene resin particles (5 g) by an immersion method. Next, an electroless nickel plating solution (pH 12, plating solution temperature 50 ° C.) prepared from nickel sulfate hexahydrate, sodium hypophosphite, sodium citrate, triethanolamine and thallium nitrate is applied to the resin particles. Electroless nickel plating was used to obtain nickel-coated resin particles having a nickel plating layer (metal layer) formed on the surface as conductive particles. The average particle diameter of the obtained conductive particles was in the range of 3 to 4 μm.

Reference example 2
(Preparation of gold / nickel coated resin particles)
An aqueous suspension was prepared by mixing 12 g of electroless nickel plating particles obtained in Reference Example 1 with a solution of 10 g of sodium chloroaurate dissolved in 1000 mL of ion-exchanged water. A gold plating bath was prepared by adding 15 g of ammonium thiosulfate, 80 g of ammonium sulfite, and 40 g of ammonium hydrogen phosphate to the obtained aqueous suspension. After adding 4 g of hydroxylamine to the obtained gold plating bath, the pH of the gold plating bath is adjusted to 9 using ammonia, and the bath temperature is maintained at 60 ° C. for about 15 to 20 minutes, whereby gold / nickel coated resin particles Got.

Reference example 3
(Production of low melt viscosity type single layer anisotropic conductive film)
35 parts by mass of the nickel-coated resin particles obtained in Reference Example 1, 22 parts by mass of bisphenol A type phenoxy resin (YP50, Toto Kasei Co., Ltd.) as a film forming component, and a bisphenol A epoxy compound (EP828, Japan) as a liquid component Epoxy Resin Co., Ltd.) 38 parts by mass, amine-based curing agent (PHX3941HP, Asahi Kasei Co., Ltd.) 39 parts by mass, and epoxy silane coupling agent (A-187, Momentive Performance Materials Co., Ltd.) 1 part by mass An anisotropic conductive adhesive was prepared by diluting a part with toluene so that the solid content was 50% by mass and mixing. The adhesive was applied on a peeled polyethylene terephthalate film with a bar coater so that the dry thickness was 25 μm, and dried in an oven at 80 ° C. for 5 minutes to produce a single-layer anisotropic conductive film. . The single layer anisotropic conductive film had a melt viscosity at 80 ° C. of 250 Pa · s.

Reference example 4
(Production of low melt viscosity type two-layer anisotropic conductive film)
22 parts by mass of a bisphenol A type phenoxy resin (YP50, Toto Kasei Co., Ltd.) as a film forming component, 38 parts by mass of a bisphenol A epoxy compound (EP828, Japan Epoxy Resin Co., Ltd.) as a liquid component, and an amine curing agent ( PHX3941HP, Asahi Kasei Co., Ltd.) 39 parts by mass, and epoxy silane coupling agent (A-187, Momentive Performance Materials Co., Ltd.) 1 part by mass so that the solid content is 50 mass% with toluene. An insulating adhesive was prepared by diluting and mixing. This insulating adhesive was formed on a release substrate and dried in an oven at 80 ° C. for 5 minutes to produce an insulating adhesive film. A two-layer anisotropic conductive film was prepared by laminating this insulating adhesive film and a single-layer anisotropic conductive film prepared in the same manner as in Reference Example 3 so that the dry thickness was 25 μm. The melt viscosity at 80 ° C. of this two-layer anisotropic conductive film was 150 Pa · s.

Reference Example 5
(Preparation of medium melt viscosity type single layer anisotropic conductive film)
Other than using 30 parts by mass of bisphenol A type phenoxy resin (YP50, Toto Kasei Co., Ltd.) as a film forming component and 30 parts by mass of bisphenol A epoxy compound (EP828, Japan Epoxy Resin Co., Ltd.) as a liquid component. A single-layer anisotropic conductive film was produced in the same manner as in Example 3. The single layer anisotropic conductive film had a melt viscosity at 80 ° C. of 2400 Pa · s.

Reference Example 6
(Preparation of medium melt viscosity type two-layer anisotropic conductive film)
Other than using 30 parts by mass of bisphenol A type phenoxy resin (YP50, Toto Kasei Co., Ltd.) as a film-forming component and 30 parts by mass of bisphenol A epoxy compound (EP828, Japan Epoxy Resin Co., Ltd.) as a liquid component, A two-layer anisotropic conductive film was produced in the same manner as in Reference Example 4. The melt viscosity at 80 ° C. of this two-layer anisotropic conductive film was 2000 Pa · s.

Reference Example 7
(Production of high melt viscosity type single layer anisotropic conductive film)
Except for using 40 parts by mass of bisphenol A type phenoxy resin (YP50, Toto Kasei Co., Ltd.) as a film forming component and 20 parts by mass of bisphenol A epoxy compound (EP828, Japan Epoxy Resin Co., Ltd.) as a liquid component. A single-layer anisotropic conductive film was produced in the same manner as in Example 3. The single layer anisotropic conductive film had a melt viscosity at 80 ° C. of 5000 Pa · s.

Reference Example 8
(Production of high melt viscosity type two-layer anisotropic conductive film)
Except for using 40 parts by mass of bisphenol A type phenoxy resin (YP50, Toto Kasei Co., Ltd.) as a film forming component and 20 parts by mass of bisphenol A epoxy compound (EP828, Japan Epoxy Resin Co., Ltd.) as a liquid component, A two-layer anisotropic conductive film was produced in the same manner as in Reference Example 4. The melt viscosity at 80 ° C. of this two-layer anisotropic conductive film was 4000 Pa · s.

Example 1
(Production of connection structure (there is no demagnetization process but demagnetization process))
The low melt viscosity type single layer anisotropic conductive film of Reference Example 3 is placed on a terminal of a glass wiring board having a peripheral arrangement terminal made of nickel having a thickness of 0.5 μm at 80 ° C. with a flip chip bonder. Temporary pasting was performed by heating and pressing at 5 MPa for 2 seconds. The single-layer anisotropic conductive film temporarily attached to the glass wiring board is put into the detachable magnetic apparatus (Sony Chemical & Information Device Co., Ltd.) together with the glass wiring board, and the magnetic field strength is 400 G and the demagnetization speed is 100 mm / s. Demagnetization treatment was performed under the conditions.

  A 13 mm × 1.5 mm square IC chip in which gold bumps with a peripheral arrangement of 15 μm in height are formed on a single-layer anisotropic conductive film that has been demagnetized, and the bumps and the terminals of the glass wiring board are connected. , And temporarily installed by heating and pressing at 50 ° C. and 5 MPa for 1 second with a flip chip bonder, followed by main thermocompression bonding by heating and pressing at 210 ° C. and 60 MPa for 10 seconds to form an anisotropic conductive connection. The connection structure was obtained by doing.

Example 2
(Fabrication of connection structure (demagnetization process after magnetizing process))
As a glass wiring board, the same as in Example 1 except that a detachable magnetic apparatus (Sony Chemical & Information Device Co., Ltd.) is used which has been preliminarily magnetized under a condition of being left in a 1000 G magnetic field for 5 minutes. A connection structure was obtained.

Example 3
(Fabrication of connection structure (demagnetization process after magnetizing process))
A single-layer anisotropic conductive film was prepared by repeating Reference Example 3 except that the Au / nickel-coated resin particles of Reference Example 2 were used instead of the nickel-coated resin particles of Reference Example 1. A connection structure was obtained in the same manner as in Example 2 except that the obtained single layer anisotropic conductive film was used.

Example 4
(Fabrication of connection structure (demagnetization process after magnetizing process))
A connection structure in the same manner as in Example 2 except that the low melt viscosity type single layer anisotropic conductive film of Reference Example 3 is used instead of the low melt viscosity type two layer anisotropic conductive film of Reference Example 4. Got the body.

Example 5
(Fabrication of connection structure (demagnetization process after magnetizing process))
Connection structure in the same manner as in Example 2 except that a medium melt viscosity type single layer anisotropic conductive film of Reference Example 5 is used instead of the low melt viscosity type single layer anisotropic conductive film of Reference Example 3. Got the body.

Example 6
(Fabrication of connection structure (demagnetization process after magnetizing process))
A connection structure in the same manner as in Example 2 except that a medium melt viscosity type two-layer anisotropic conductive film of Reference Example 6 is used instead of the low melt viscosity type single layer anisotropic conductive film of Reference Example 3 Got the body.

Example 7
(Fabrication of connection structure (demagnetization process after magnetizing process))
Connection structure in the same manner as in Example 2 except that the high melt viscosity type single layer anisotropic conductive film of Reference Example 7 is used instead of the low melt viscosity type single layer anisotropic conductive film of Reference Example 3 Got the body.

Example 8
(Fabrication of connection structure (demagnetization process after magnetizing process))
Connection structure in the same manner as in Example 2 except that the low melt viscosity type single-layer anisotropic conductive film of Reference Example 3 is used and the high melt viscosity type two-layer anisotropic conductive film of Reference Example 8 is used. Got the body.

Comparative Example 1
(Preparation of connection structure (no magnetizing process or demagnetizing process))
A connection structure was obtained in the same manner as in Example 1 except that the demagnetization treatment at the time of temporary attachment was not performed. This connection structure was neither magnetized nor demagnetized.

Comparative Example 2
(Production of connection structure (there is a magnetizing process but no demagnetizing process))
A connection structure was obtained in the same manner as in Example 2 using a glass wiring board that had been magnetized, except that the demagnetization process at the time of temporary attachment was not performed.

Comparative Example 3
(Preparation of connection structure (there is a magnetizing process after the demagnetizing process)
The same glass wiring substrate as in Example 1 was put into a detachable magnetic apparatus (Sony Chemical & Information Device Co., Ltd.), and demagnetization treatment was performed in advance under the same conditions as in Example 1.

  The low melt viscosity type single-layer anisotropic conductive film of Reference Example 3 is heated and pressed at 80 ° C. and 0.5 MPa for 2 seconds on the terminal of the glass wiring board that has been demagnetized. Was temporarily attached. The single-layer anisotropic conductive film temporarily attached to the glass wiring board is put into the detachable magnetic apparatus (Sony Chemical & Information Device Co., Ltd.) together with the glass wiring board, and magnetized under the same conditions as in Example 2. Went.

  A 13 mm × 1.5 mm square IC chip in which gold bumps with a peripheral arrangement of 15 μm in height are formed on a single-layer anisotropic conductive film that has been magnetized, and the bumps and the terminals of the glass wiring board are connected. Is temporarily installed by heating and pressing at 50 ° C. and 5 MPa for 1 second with a flip chip bonder, followed by main thermocompression bonding by heating and pressing at 200 ° C. and 60 MPa for 10 seconds for anisotropic conductive connection To obtain a connection structure.

(Evaluation)
About the obtained anisotropic conductive film or connection structure, “particle capture rate”, “insulation” and “connection reliability (initial and after accelerated test (85 ° C., 85 RH%, 500 hours)) are as follows: Evaluation was performed as described, and the results obtained are shown in Table 1.

<Particle capture rate>
From the substrate side of the obtained connection structure, the number of conductive particles arranged between the bump and the substrate electrode was counted with an optical microscope, and the particle capture rate was calculated from the following equation.

  Particle capture rate = [number of conductive particles arranged between bump and electrode after pressure bonding] / [number of conductive particles arranged between bump and electrode before pressure bonding].

Rank Criteria AA: 35% or more A: 20% or more and less than 35% B: 10% or more and less than 20% C: Less than 10%

<Insulation>
Insulation TEG for short evaluation (chip size 25 ×) on the ITO wiring arranged in a comb tooth shape on the glass substrate on the adhesive layer surface of each anisotropic conductive film on which the peeled polyethylene terephthalate film has not been peeled off 2.5 mm; number of bumps: 8376; bump size: 35 × 55 μm; space between bumps: 10 μm) was bonded with a bonder under conditions of an ultimate temperature of 210 ° C. and a pressing time of 10 seconds. Then, the insulation resistance between the bumps was measured, the number of occurrences of short circuits was counted, and evaluated according to the following evaluation criteria. In addition, in the short generation | occurrence | production part, the presence or absence and the grade of aggregation were observed using the optical microscope from the clogging condition of the conductive particles.

Rank Standard AA: Number of insulation shorts occurring less than 5 out of 40 samples A: Number of insulation shorts occurring between 5 and less than 10 out of 40 samples B: Number of insulation shorts occurring between 10 and 20 out of 40 samples Less than C: The number of insulation shorts is 20 or more in 40 samples

<Connection reliability (after initial and accelerated tests)>
The conduction resistance of the connection structure immediately after obtained in the examples and comparative examples was measured by the four-terminal method. The connection reliability of the connection structure was evaluated according to the following evaluation criteria using the obtained measurement value as an index.

Rank Contents A: Conduction resistance value is less than 10Ω B: Conduction resistance value is 10Ω or more and less than 50Ω C: Conduction resistance value is 50Ω or more

  As can be seen from the results in Table 1, the connection structures of Examples 1 to 8 in which the anisotropic conductive film temporarily attached to the glass wiring substrate was demagnetized were subjected to particle trapping properties, insulating properties, and connection reliability (initial stage). Good results were obtained for all evaluation items (after the accelerated test).

  Further, from the comparison between Example 2 and Example 1, when a glass wiring board that has been pre-magnetized is used, the particle capture rate is higher than when a non-magnetized glass wiring board is used. It can be seen that the improved connection reliability is exhibited.

  From the comparison between Example 3 and Example 2, when gold / nickel resin particles are used as the conductive particles, the effect of the magnetized electrode is reduced because gold is not a magnetic material, and nickel resin particles are used. In comparison, the particle capture rate was slightly inferior, but it was at a level that was not problematic for practical use.

  From the comparison between Example 4 and Example 2, the comparison between Example 6 and Example 5, and the comparison between Example 8 and Example 7, a two-layer anisotropic conductive film provided with an insulating adhesive layer It can be seen that the use of, the particle capture rate is improved as compared with the case where a single-layer anisotropic conductive film is used.

  From the comparison between Example 2, Example 5 and Example 7, as the melt viscosity at the time of temporary attachment of the anisotropic conductive film increases, the flow of particles decreases, so that the particle capture rate may decrease. Recognize.

  On the other hand, the connection structure of Comparative Example 1 in which the demagnetization treatment was not performed on the anisotropic conductive film temporarily attached to the glass wiring board that was not magnetized had a problem in the particle capture rate. Moreover, the connection structure of Comparative Example 2 in which the demagnetization treatment was not performed on the anisotropic conductive film temporarily attached to the glass wiring substrate on which the magnetization treatment was performed had a problem in insulation. The connection structure of Comparative Example 3 in which the anisotropic conductive film temporarily attached to the glass wiring substrate on which the demagnetization treatment has been performed has a problem in the particle capture rate and the insulation. .

  In the manufacturing method of the connection structure of the present invention, an anisotropic conductive film containing magnetic conductive particles is used as an anisotropic conductive connection, and is temporarily attached to an electronic component prior to the thermocompression bonding. Demagnetization treatment is performed on the anisotropic conductive film. As a result, the aggregation of the magnetic conductive particles can be prevented or greatly suppressed when the anisotropic conductive film flows under the main heating and pressing conditions. Therefore, the manufacturing method of the present invention provides a connection structure that exhibits good insulating properties, particle trapping properties, and conduction reliability when a connection structure is manufactured using an anisotropic conductive film using magnetic conductive particles. It is useful when manufacturing.

DESCRIPTION OF SYMBOLS 1 Nonmagnetic base 2 1st electronic component 3 Terminal 4 Anisotropic conductive film 5 Laminated body 6 Nonmagnetic cover 10 Detachable magnetic coil

Claims (11)

In the method for manufacturing a connection structure in which the terminals of the first electronic component and the terminals of the second electronic component are anisotropically conductively connected, the following steps (A2), (B), (C) and (D) ):
Step (A2)
An anisotropic conductive film temporary sticking step of temporarily sticking an anisotropic conductive film containing magnetic conductive particles to the terminals of the first electronic component;
Process (B)
A demagnetizing treatment step of demagnetizing the anisotropic conductive film temporarily attached to the first electronic component;
Process (C)
An electronic component temporary installation step of temporarily installing the second electronic component on the anisotropic conductive film subjected to the demagnetization treatment on the first electronic component; and step (D)
The terminal of the first electronic component is different from the terminal of the second electronic component by pressing the temporarily installed second electronic component against the first electronic component while being heated by a heat and pressure bonder. A manufacturing method comprising an anisotropic conductive connecting step for conducting a conductive conductive connection.   The manufacturing method according to claim 1, wherein the magnetic conductive particles are gold / nickel-coated resin particles, nickel-coated resin particles, or nickel metal particles.   The manufacturing method according to claim 1, wherein the magnetic conductive particles are phosphorus-coated nickel-coated resin particles.   The production method according to claim 3, wherein the content of the phosphorus element in the nickel of the nickel-coated resin particles is 0.1 to 10% by mass.   The production method according to claim 1, wherein the magnetic conductive particles have an average particle diameter of 0.5 to 30 μm.   The manufacturing method according to claim 1, wherein the terminal of the first electronic component is made of a magnetic material. Prior to the anisotropic conductive film temporary pasting step of step (A2), the following step (A1)
Step (A1)
The manufacturing method according to claim 6, further comprising a magnetizing process for magnetizing a terminal of the first electronic component.   The manufacturing method according to claim 7, wherein in the demagnetizing treatment step of the step (B), the demagnetizing treatment of the terminal made of the magnetic material of the first electronic component is also performed when the anisotropic conductive film is demagnetized. .   The anisotropic conductive film temporary sticking process of a process (A2) WHEREIN: An anisotropic conductive film is heated and temporarily stuck so that melt viscosity may be set to 150-5000 Pa.s. Production method.   The manufacturing method according to claim 1, wherein the first electronic component is a display panel.   The connection structure manufactured by the manufacturing method in any one of Claims 1-10.

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