JP2012067234A - Resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition having excellent rigidity and heat resistance, light in weight and excellent in damping.SOLUTION: The resin composition comprises resin ingredients (C) and ceramic balloon (D), wherein the resin ingredients (C) comprise 30-70 mass% of a polyarylate resin (A) and 70-30 mass% of a reinforced polyamide resin (B), and 50-15 mass% of the ceramic balloon (D) is contained based on 50-85 mass% of the resin ingredients (C), and the reinforced polyamide resin (B) is provided by containing swelling phyllosilicate in the polyamide resin with an average interlayer distance of ≥20 Å so that the ≥50% silicate layer of the swelling phyllosilicate does not form a lump.

Description

  The present invention relates to a resin composition having excellent vibration damping properties. Furthermore, it is related with the molded article which consists of this resin composition.

  In recent years, in the fields of automobiles, home appliances, precision equipment, etc., vibration generated from automobiles and vibrations propagated to automobiles are absorbed and attenuated to prevent vibrations and noise caused by vibrations, creating a comfortable environment. There is an increasing demand to release. That is, high vibration damping properties are required for members constituting automobiles, home appliances, precision equipment, and the like. Furthermore, in such a field, from the viewpoint of energy saving, it is also demanded to reduce the weight of the above members.

  In addition, in members constituting automobiles, home appliances, precision devices, etc., molded products made of polyamide resin are widely used because of having excellent mechanical properties and chemical resistance. Therefore, many attempts have been made to improve the vibration damping properties of molded products made of polyamide resin.

  For example, Patent Document 1 proposes to obtain a molded article having excellent vibration damping properties by blending an inorganic filler with a polyamide resin. Patent Document 2 proposes that a polyamide resin composition for molding having excellent vibration damping properties is obtained by blending an inorganic filler such as mica and glass with a polyamide resin. Patent Document 3 proposes that a polyamide resin composition for molding having excellent vibration damping properties is obtained by blending an elastomer such as an olefin elastomer with a polyamide resin reinforced with glass fibers. However, in the case of Patent Documents 1 to 3, the density of the obtained polyamide resin composition becomes too high, and the use of a molded product made of the polyamide resin composition may be limited.

  Furthermore, Patent Document 4 proposes to obtain a polyamide resin composition having excellent vibration damping properties by blending a ceramic balloon with a polyamide resin. However, in the case of Patent Document 4, the heat resistance may be low. Furthermore, in Patent Document 5, a resin having excellent vibration damping properties is obtained by blending a polyarylate resin with a reinforced polyamide resin in which a silicate layer of a swellable layered silicate is uniformly dispersed in a polyamide resin at a molecular level. It has been proposed to obtain a composition. However, in the case of Patent Document 5, the rigidity may be inferior.

Japanese Patent No. 2618721 Japanese Patent No. 3024152 JP-A 64-74264 Japanese Patent No. 4263929 JP 2008-75008 A

  In view of these problems, an object of the present invention is to provide a resin composition and a molded product having good vibration damping properties, excellent rigidity and heat resistance, low density and light weight. is there.

As a result of intensive studies to solve the above-mentioned problems, the present inventors contain a polyarylate resin, a polyamide resin reinforced with a silicate layer of a swellable layered silicate, and a ceramic balloon in a specific ratio. The present inventors have found that a resin composition can achieve the above object, and have reached the present invention.
That is, the gist of the present invention is as follows.
(1) A resin composition containing a resin component (C) and a ceramic balloon (D), wherein the resin component (C) is 30 to 70% by mass of a polyarylate resin (A) and a reinforced polyamide resin (B) 70 And 30% by mass of ceramic resin (D) with respect to 50 to 85% by mass of the resin component (C), and the reinforced polyamide resin (B) is a polyamide. Resin composition characterized in that swellable layered silicate is contained in the resin at an average distance of 20 mm or more and 50% or more of the swellable layered silicate layer is formed without forming a lump. .
(2) The resin composition according to (1), wherein the reinforced polyamide resin (B) contains 0.01 to 10 parts by mass of a swellable layered silicate with respect to 100 parts by mass of the polyamide resin.
(3) A molded article comprising the resin composition of (1) or (2), wherein the molded article has the following physical properties (i) to (iv).
(I) The internal loss tan δ is 0.08 or more.
(Ii) The density measured by JIS K7112 is 1.20 g / cm ³ or less.
(Iii) The flexural modulus measured by ASTM D790 is 5.0 GPa or more.
(Iv) The deflection temperature under load measured by ASTM D648 under a load of 1.82 MPa is 160 ° C. or higher.

  The resin composition of the present invention has excellent rigidity and heat resistance, is lightweight, and has excellent vibration damping properties. Therefore, the molded product obtained from the resin composition is useful in various fields where vibration damping is required, such as the electronic / electrical / information equipment field, the automobile field, the machine part field, and the industrial utility value of the molded product. Is extremely large.

Hereinafter, the present invention will be described in detail.
The resin composition of the present invention comprises a resin component (C) comprising a polyarylate resin (A) and a polyamide resin (reinforced polyamide resin) (B) reinforced with a silicate layer of a swellable layered silicate, and a ceramic. It contains a balloon (D).

  In this invention, there exists an effect that it is excellent in damping property by using the polyarylate resin (A) and the polyamide resin (B) reinforced with the silicate layer of the swellable layered silicate. Furthermore, since the polyarylate resin has a high melting point, a resin composition having excellent heat resistance can be obtained. Furthermore, by using the ceramic balloon (D), by reducing the density of the obtained resin composition, it is possible to increase the vibration damping property while achieving weight reduction, and to increase the rigidity.

  The polyarylate resin constituting the resin composition of the present invention is an aromatic polyester polymer composed of an aromatic dicarboxylic acid unit and a bisphenol residue unit. The polyarylate resin can be produced by a known and usual method such as melt polymerization or interfacial polymerization.

  Preferable examples of the raw material of the aromatic dicarboxylic acid residue unit constituting the polyarylate resin include terephthalic acid, isophthalic acid, phthalic acid, 2,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7- Naphthalene dicarboxylic acid, 1,5-naphthalene dicarboxylic acid, methyl terephthalic acid, 4,4'-biphenyl dicarboxylic acid, 2,2'-biphenyl dicarboxylic acid, 4,4'-biphenyl ether dicarboxylic acid, 4,4'-diphenyl Examples include isopropylidene dicarboxylic acid, 1,2-bis (4-carboxyphenoxy) ethane, and 5-sodium sulfoisophthalic acid.

  Among these, terephthalic acid and isophthalic acid are preferable as the raw material for the aromatic dicarboxylic acid residue unit, and the combination of both is preferable because a polyarylate resin excellent in melt processability and mechanical properties can be obtained.

  When terephthalic acid and isophthalic acid are used in combination, the mixing ratio can be arbitrarily selected, but considering the balance of melt processability and performance, the molar fraction of (terephthalic acid) / ( Isophthalic acid) = 90/10 to 10/90 is preferable, more preferably (terephthalic acid) / (isophthalic acid) = 70/30 to 30/70, and particularly preferably (terephthalic acid) / (Isophthalic acid) = 50/50. If the mixing ratio of terephthalic acid and isophthalic acid is outside the above range, the degree of polymerization of the polyarylate resin may be insufficient, and the corrosion resistance discoloration of the resulting polyarylate resin may be exhibited.

  Examples of bisphenols that are raw materials for polyarylate resins include 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, and 2,2-bis ( 4-hydroxy-3,5-dichlorophenyl) propane, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydrodiphenyl ether, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4 '-Dihydroxydiphenylmethane, 2,2-bis (4-hydroxy-3,5-dimethylphenyl) propane, 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4'-dihydroxydiphenyl, hydroquinone, etc. , 2,2-bis (4-hydroxyphenyl) propane, is (bisphenol A) preferred. These may be used singly or in combination of two or more. Further, a small amount of ethylene glycol, propylene glycol or the like may be used in combination with these bisphenols. Of these, 2,2-bis (4-hydroxyphenylpropane) is preferably used from the viewpoint of excellent cost performance and polymerizability, and it is preferably used alone.

  The intrinsic viscosity of the polyarylate resin is not particularly limited, but from the viewpoint of good mechanical properties and fluidity, the intrinsic viscosity measured at 25 ° C. using 1,1,2,2-tetrachloroethane as a solvent is 0.4. -0.8 are preferable and 0.4-0.7 are more preferable. If the intrinsic viscosity of the polyarylate resin exceeds 0.8, the melt viscosity becomes high and the fluidity is lowered, so that kneading extrusion and injection molding may be difficult. In addition, discoloration may occur during melt processing. On the other hand, when the molecular weight is less than 0.4, the molecular weight of the resulting resin composition becomes low, and thus mechanical properties such as impact strength and heat resistance tend to be lowered when formed into a molded product.

  In the present invention, the reinforced polyamide resin is one in which a silicate layer of a swellable layered silicate is uniformly dispersed in a polyamide resin at a molecular level. Here, the silicate layer is a basic unit constituting the swellable layered silicate, and is obtained by cleaving the swellable layered silicate. In the present invention, when a normal (non-strengthened) polyamide resin is used instead of the reinforced polyamide resin, the effect of the present invention “excellent in vibration damping” cannot be achieved.

  In the present invention, “uniformly dispersed at the molecular level” means that when the silicate layer of the swellable layered silicate is dispersed in the polyamide resin, the interlayer distance is maintained at an average of 20 mm or more. Say. The interlayer distance refers to the distance between the center of gravity of the silicate layer of the silicate layer. Furthermore, when the silicate layer of the swellable layered silicate is uniformly dispersed at the molecular level, a single silicate layer or a multilayer of silicate layers with an average overlap of 5 layers or less In the parallel or random state, or in a state where parallel and random are mixed, it is necessary that 50% or more of them be dispersed without forming a lump. More preferably, 70% or more is in a dispersed state without forming a lump. Specifically, when a wide-angle X-ray diffraction measurement is performed on the pellets obtained from the reinforced polyamide resin, the peak due to the thickness direction of the silicate layer disappears, so that it is uniformly dispersed at the molecular level. (That is, the silicate layer of the swellable layered silicate has an average distance of 20 mm or more and 50% or more of the silicate layer is dispersed without forming a lump).

  The polyamide resin is a polymer having an amide bond formed from an amino acid, lactam or diamine and a dicarboxylic acid (including a pair of salts thereof). Preferred examples of such polyamide resin include polycapramide (nylon 6), polytetramethylene adipamide (nylon 46), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebacamide (nylon 610), Polyhexamethylene dodecamide (nylon 612), polyundecamethylene adipamide (nylon 116), polyundecamide (nylon 11), polydodecamide (nylon 12), polytrimethylhexamethylene terephthalamide (nylon TMDT), polyhexamethylene isophthalamide (Nylon 6I), polyhexamethylene terephthalate / isophthalamide (nylon 6T / 6I), polybis (4-aminocyclohexyl) methane dodecamide (nylon PACM12), polybis (3-methyl 4-aminocyclohexyl) methane dodecamide (nylon dimethyl PACM12), polymetaxylylene adipamide (nylon MXD6), polynonamethylene terephthalamide (nylon 9T), polyundecamethylene terephthalamide (nylon 11T), polyundecamethylene Hexahydroterephthalamide [nylon 11T (H)] or a copolymerized polyamide thereof, a mixed polyamide or the like can be mentioned, among which nylon 6 or a copolymerized polyamide thereof, nylon 66 or a copolymerized polyamide is preferable, and nylon 6 and nylon 66 Is particularly preferred.

  The polyamide resin in the present invention is a polymer having an amide bond in the main chain mainly composed of aminocarboxylic acid, lactam or diamine and dicarboxylic acid, and a pair of salts thereof. Specific examples of the raw material of the polyamide resin include aminocarboxylic acids such as 6-aminocaproic acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid; lactams such as ε-caprolactam, ω-undecanolactam, and ω-laurolactam; Examples include diamines such as tetramethylene diamine, hexamethylene diamine, undecamethylene diamine, and dodecamethylene diamine; dicarboxylic acids such as adipic acid, suberic acid, sebacic acid, and dodecanedioic acid.

  Preferred examples of the polyamide resin include polycapramide (nylon 6), polytetramethylene adipamide (nylon 46), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebamide (nylon 610), polyhexa Methylene dodecamide (nylon 612), polyundecamethylene adipamide (nylon 116), polyundecamide (nylon 11), polydodecamide (nylon 12), polytrimethylhexamethylene terephthalamide (nylon TMDT), polyhexamethylene isophthalamide (nylon) 6I), polyhexamethylene terephthalate / isophthalamide (nylon 6T / 6I), polybis (4-aminocyclohexyl) methane dodecamide (nylon PACM12), polybis (3-methyl-4) Aminocyclohexyl) methane dodecamide (nylon dimethyl PACM12), polymetaxylylene adipamide (nylon MXD6), polynonamethylene terephthalamide (nylon 9T), polyundecamethylene terephthalamide (nylon 11T), polyundecamethylene hexahydro Examples thereof include terephthalamide [nylon 11T (H)] or a copolymerized polyamide or mixed polyamide thereof.

  Among these, from the viewpoint of compatibility with the polyarylate resin and moldability, nylon 6 or copolymer polyamide obtained by copolymerizing nylon 6 and other polyamides, nylon 66 or nylon 66 and other polyamides copolymerized. Copolymer polyamides are preferred, and nylon 6 and nylon 66 are particularly preferred.

  Examples of the swellable layered silicate contained in the polyamide resin and constituting the reinforced polyamide resin include smectite group (for example, montmorillonite, beidellite, saponite, hectorite, and soconite), vermiculite group (for example, vermiculite), mica group ( For example, fluoric mica, muscovite, paragonite phlogopite, biotite, lepidite), brittle mica (eg, margarite, clintonite, anandite), chlorite (eg, donbassite, sudite, kukuite, clinochlore, chamosite) ), Hydrous inosilicate minerals such as sepiolite, and the like. Among these, montmorillonite, saponite, hectorite, vermiculite and fluorine mica are preferable from the viewpoint of dispersibility of the silicate layer in the polyamide resin, and fluorine mica is more preferable from the viewpoint of color tone.

Fluorine mica is generally represented by the following formula.
α (MF) · β (aMgF 2 · bMgO) · γSiO
(In the formula, M represents sodium or lithium. Α, β, γ, a and b represent coefficients, respectively, 0.1 ≦ α ≦ 2, 2 ≦ β ≦ 3.5, 3 ≦ γ ≦ 4, 0. ≦ a ≦ 1, 0 ≦ b ≦ 1, and a + b = 1.

  In the present invention, the content of the swellable layered silicate in the reinforced polyamide resin is preferably 0.01 to 10% by mass, and more preferably 1.5 to 6% by mass. When this content exceeds 10 mass%, the toughness of the molded product formed by shape | molding the obtained resin composition may fall, and it may become weak. If the content is less than 0.01% by mass, the mechanical properties of a molded product obtained by molding the obtained resin composition may be deteriorated.

  Although the relative viscosity of the reinforced polyamide resin is not particularly limited, the value obtained under the conditions of a temperature of 25 ° C. and a concentration of 1 g / dl using 96 mass% concentrated sulfuric acid as a solvent is in the range of 1.5 to 5.0. It is particularly preferred that it is in the range of 2.0 to 3.5. If the relative viscosity is less than 1.5, the mechanical properties of the molded product may be deteriorated. On the other hand, if the relative viscosity exceeds 5.0, the moldability may be significantly reduced.

  The method for obtaining the reinforced polyamide resin by dispersing the silicate layer of the swellable layered silicate in the polyamide resin is not particularly limited, but aminocaproic acid and lactam that form the polyamide resin in the presence of a predetermined amount of the swellable layered silicate. Alternatively, a monomer such as diamine and dicarboxylic acid may be polymerized by a known and usual polymerization method. It can also be obtained by melt-kneading a swellable layered silicate preliminarily treated with an onium salt and a polyamide resin by a known and conventional method.

  As described above, the resin composition of the present invention includes a resin component containing a polyarylate resin and a reinforced polyamide resin. In the resin component, the content of the polyarylate resin needs to be 30 to 70% by mass, and preferably 40 to 60% by mass. That is, in the above resin component, the content of the reinforced polyamide resin is required to be 70 to 30% by mass, and preferably 60 to 40% by mass. When the proportion of the polyarylate resin in the resin component is less than 30% by mass, a resin composition having excellent heat resistance cannot be obtained. Moreover, it will be in the state which cannot knead | mix uniformly, and a molded article may not be obtained. On the other hand, when the proportion of the polyarylate resin exceeds 70% by mass, there is a problem that fluidity and chemical resistance are impaired.

  The ceramic balloon contained in the resin composition of the present invention is a fine hollow glass sphere mainly composed of silica and alumina. Examples of the ceramic balloon include those that do not settle in water from coal incineration ash (fly ash), or those that are produced by firing shirasu or mica. The method of producing by baking is not particularly limited, and industrially used methods can be applied. Commercially available ceramic balloons can be suitably used, and examples include “Senolite” manufactured by Sakai Kogyo Co., Ltd., “Metasphere” manufactured by Tokai Kogyo Co., Ltd. and the like.

  The preferred average particle size of the ceramic balloon is 250 μm or less, more preferably 200 μm or less, and particularly preferably 100 μm or less. When the average particle diameter exceeds 250 μm, the ceramic balloon particles are easily broken during the kneading process with the polyamide resin, and as a result, the apparent density of the resin composition is likely to increase. Furthermore, the surface of the molded product molded from the obtained resin composition becomes fine unevenness and streaks are observed, and the appearance is impaired. Although the minimum of an average particle diameter is not specifically limited, Generally what is marketed and available is 5 micrometers or more.

  The apparent density (density of the hollow body) of the ceramic balloon is preferably in the range of 0.2 to 1.2, and more preferably in the range of 0.4 to 1.0. When the apparent density is less than 0.2, the shell forming the hollow body becomes too thin and is easily broken in the kneading process with the polyamide resin. Further, when the apparent density exceeds 1.2, the density of the resin composition increases, which is not preferable.

  In the present invention, from the viewpoint of vibration damping properties, density, and rigidity, it is preferable that the ceramic balloon is contained in the resin composition without being damaged. In order to prevent the ceramic balloon from being damaged at the time of melt molding such as resin composition or molded product production, the temperature of the melt molding should be as high as possible within the range that can be molded, and the conditions for low melt viscosity of the resin should be selected. Is preferred. Specifically, in the present invention, the cylinder temperature during melt molding is preferably 260 to 280 ° C.

  In the resin composition of the present invention, the content of the ceramic balloon is required to be 15 to 50% by mass, and preferably 20 to 40% by mass with respect to the total amount of the resin composition. If it is less than 15% by mass, there is a problem that vibration damping properties and rigidity are lowered. When it exceeds 50 mass%, there exists a problem that fluidity | liquidity falls.

  That is, the content of the polyarylate resin when the resin composition is 100 parts by mass is required to be 15 to 59.5 parts by mass, and preferably 20 to 30 parts by mass. Further, the content of the reinforced polyamide resin when the resin composition is 100 parts by mass is required to be 59.5 to 15 parts by mass, and preferably 30 to 20 parts by mass.

  In the resin composition of the present invention, a pigment, a release agent, a heat stabilizer, an antioxidant, a flame retardant, a plasticizer, etc. may be added as necessary within a range that does not greatly impair the characteristics. Can do.

  The resin composition of the present invention is prepared by kneading a polyarylate resin, a reinforced polyamide resin, a ceramic balloon and other components as necessary, such as a tumbler, a V-type blender, a nauter mixer, a Banbury mixer, a kneading roll, and an extruder. It can be produced by mixing with a machine. Especially, it is preferable to melt-knead with an extruder and to manufacture a resin composition, and it is preferable to use a biaxial extruder especially.

  Moreover, it is preferable to melt-knead the resin composition of this invention using the extruder provided with the side feeder from a viewpoint of reducing destruction of a ceramic balloon. That is, if the polyarylate resin and the reinforced polyamide resin are introduced from the main supply port and the ceramic balloon is introduced from the side feeder, the damage of the ceramic balloon can be reduced.

  The molded article of the present invention can be obtained by subjecting the resin composition obtained as described above to extrusion molding, injection molding, compression molding, blow molding, and vacuum molding. Among these, the production by injection molding is preferable, and in such a case, it is possible to produce not only a normal cold runner type molding method but also a hot runner that enables runnerless. Also in injection molding, not only ordinary molding methods but also various molding methods such as gas-assisted injection molding, injection compression molding, ultra-high speed injection molding, two-color molding, insert molding, in-mold coating molding, sandwich molding, etc. are used. can do.

  Further, by using the resin composition of the present invention as an inner layer or an outer layer of a molded article having a laminated structure by various composite molding methods, it is possible to more effectively exhibit vibration damping properties.

A molded article formed from the resin composition of the present invention satisfies the following various characteristics.
That is, the internal loss (tan δ) of the molded product needs to be 0.08 or more, preferably 0.08 to 0.25, and more preferably 0.10 to 0.18. If the internal loss (tan δ) is less than 0.08, the vibration damping performance is insufficient. Further, if the internal loss exceeds 0.25, it may not coexist with rigidity. The method for obtaining the internal loss will be described in detail in the examples.

Moreover, the density measured according to JISK7112 of a molded article needs to be 1.20 g / cm < ³ > or less, and it is preferable that it is 0.90-1.20 g / cm < ³ >, and 0.95-1. More preferably, it is 15. When the density exceeds 1.20 g / cm ³ , the required lightness is not satisfied. On the other hand, when the density is less than 0.90 g / cm ³ , it may not be possible to coexist with rigidity.

  Furthermore, the flexural modulus measured according to ASTM D790 of the molded product needs to be 5.0 GPa or more, preferably 5.0 to 9.0 GPa, and 5.5 to 8.0 GPa. More preferred. If it is less than 5.0 GPa, the rigidity is not sufficient, and if it exceeds 12 GPa, the moldability may be significantly reduced.

  Furthermore, according to ASTMD648 of a molded article, the deflection temperature under load measured under a 1.82 MPa load needs to be 160 ° C. or higher, preferably 160 to 200 ° C., and more preferably 165 to 190 ° C. When the deflection temperature under load is less than 160 ° C., the heat resistance is not sufficient, while when it exceeds 200 ° C., the moldability may be inferior.

  The molded product of the present invention thus obtained has excellent rigidity and heat resistance, is lightweight, and has excellent vibration damping properties. Therefore, it is suitable as a member used for applications such as automobiles and OA equipment.

EXAMPLES Next, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.
In addition, the raw material used by the Example and the comparative example, and the measuring method of a physical property test are as follows.

1. Raw material (1) Polyarylate resin (A)
Unitika, trade name “U polymer U-100” (hereinafter sometimes referred to as “U-100”) (bisphenol A / phthalic acid copolymer = 50/50 (molar ratio)) (Intrinsic viscosity: 0 .64)

(2) Reinforced polyamide resin (B)
・ B-1
To 10 kg of ε-caprolactam, 1 kg of water and 400 g of swellable fluorinated mica (trade name “ME-100”, manufactured by Co-op Chemical Co., Ltd.) were added, and this was put into an autoclave with an internal volume of 30 liters and heated to 260 ° C. Heating was performed until the internal pressure reached 1.5 MPa. Thereafter, while gradually releasing water vapor, polymerization was performed for 2 hours while maintaining the pressure at 1.5 MPa and the temperature of 260 ° C., then, the pressure was released to normal pressure over 1 hour, and polymerization was further performed for 40 minutes. When the polymerization was completed, the reaction product was discharged in a strand form, cooled, solidified, and then cut to obtain reinforced polyamide resin pellets. Next, the pellets were scoured with hot water at 95 ° C. for 8 hours and then vacuum-dried to obtain (B-1). The obtained reinforced polyamide resin (B-1) contained 4.4% by mass of a swellable layered silicate silicate layer and had a relative viscosity of 2.5. Further, when wide angle X-ray diffraction measurement was performed on the pellets of the reinforced polyamide resin, the peak in the thickness direction of the fluorine mica disappeared completely, and the silicate layer of the swellable layered silicate was uniformly in the polyamide resin. I found that it was distributed.

・ B-2
(B-2) was obtained in the same manner as (B-1) except that 182 g of swellable fluorine mica (trade name “ME-100”, manufactured by Corp Chemical Co., Ltd.) was used. The obtained reinforced polyamide resin contained 2.0% by mass of a swellable layered silicate silicate layer, and the relative viscosity was 2.5. Further, when wide angle X-ray diffraction measurement was performed on the pellets of the reinforced polyamide resin, the peak in the thickness direction of the fluorine mica disappeared completely, and the silicate layer of the swellable layered silicate was uniformly in the polyamide resin. I found that it was distributed.

・ B-3
(B-3) was obtained in the same manner as (B-1) except that 455 g of swellable fluoromica (trade name “ME-100”, manufactured by Corp Chemical Co., Ltd.) was used. The obtained reinforced polyamide resin contained 5.0% by mass of a swellable layered silicate silicate layer and had a relative viscosity of 2.5. Further, when wide angle X-ray diffraction measurement was performed on the pellets of the reinforced polyamide resin, the peak in the thickness direction of the fluorine mica disappeared completely, and the silicate layer of the swellable layered silicate was uniformly in the polyamide resin. I found that it was distributed.

(3) Polyamide resin (non-reinforced polyamide resin)
Product name “A1030BRL” manufactured by Unitika Co., Ltd. (component: nylon 6, viscosity: 2.50 (measured using 96 mass% sulfuric acid at a temperature of 25 ° C. and a concentration of 1 g / dl) (hereinafter referred to as “A1030BRL”) There is.)

(4) Product name “Suzolite Mica 325S” (average particle size 40 μm) manufactured by Mica Kuraray Co., Ltd. (hereinafter sometimes referred to as “325S”)
(5) Glass fiber manufactured by Nippon Electric Glass Co., Ltd., trade name “T-289” (size: 3 mm × 13 μmφ) (hereinafter sometimes referred to as “T-289”)

(6) Ceramic balloon (D)
(D-1) Product name “Senolite” manufactured by Sakai Kogyo Co., Ltd. (average particle size: 35 μm, apparent density 0.6)

2. Measurement method of physical properties (1) Flexural modulus (rigidity)
Measured according to ASTM D790.

(2) Deflection temperature under load (heat resistance)
Measurements were made at a load of 1.82 MPa according to ASTM D648.

(3) Density (apparent density) (lightness)
Measured according to ASTM D792.

(4) Internal loss (tan δ) (vibration suppression)
According to JIS G0602, the molded article for bending elastic modulus evaluation of (1) was used as a test piece, and the internal loss (tan δ) was measured by an excitation method using a servo analyzer (trade name “R92CFTT” manufactured by ADVANTEST). The larger tan δ, the better the damping performance.

Example 1
40 parts by mass of (U-100), 40 parts by mass of (B-1) and 20 parts by mass of (D-1) were converted into a twin-screw extruder (manufactured by Toshiba Machine Co., Ltd., trade name “TEM37-BS”). ) Was melt-kneaded and extruded at a resin temperature of 270 ° C. and pelletized. Next, after drying this pellet, various tests were conducted by injection molding under the conditions of a cylinder temperature of 270 ° C. and a mold temperature of 100 ° C. using an injection molding machine (trade name “IS100E-3A” manufactured by Toshiba Machine Co., Ltd.). A piece was made. These test pieces were subjected to evaluation, and the evaluation results are shown in Table 1.

Examples 2-5
As shown in Table 1, the compositions of (U-100), (B-1), and (D-1) were changed, and test pieces were produced in the same manner as in Example 1 and were subjected to physical property tests. The obtained results are shown in Table 1.

Example 6
As shown in Table 1, test pieces were prepared in the same manner as in Example 2 except that (B-1) was changed to (B-2), and subjected to physical property tests. The obtained results are shown in Table 1.

Example 7
As shown in Table 1, test pieces were prepared in the same manner as in Example 2 except that (B-1) was changed to (B-3), and subjected to physical property tests. The obtained results are shown in Table 1.

Comparative Example 1
Various types of (U-100) 100 parts by mass were injection molded under conditions of a cylinder temperature of 360 ° C. and a mold temperature of 120 ° C. using an injection molding machine (trade name “IS100E-3A” manufactured by Toshiba Machine Co., Ltd.). A test piece was prepared. These test pieces were subjected to evaluation, and the evaluation results are shown in Table 2.

Comparative Example 2
(B-1) 100 parts by mass of an injection molding machine (trade name “IS100E-3A” manufactured by Toshiba Machine Co., Ltd.) are injection-molded under conditions of a cylinder temperature of 250 ° C. and a mold temperature of 60 ° C. A test piece was prepared. These test pieces were subjected to evaluation, and the evaluation results are shown in Table 2.

Comparative Examples 3-8
As shown in Table 2, the compositions of (U-100), (B-1), and (D-1) were changed, and test pieces were prepared in the same manner as in Example 1, and were subjected to physical property tests. The obtained results are shown in Table 2.

Comparative Example 9
A test piece was prepared in the same manner as in Example 2 except that A1030BRL was used in place of the reinforced polyamide resin, and was subjected to a physical property test. The obtained results are shown in Table 2.

Comparative Example 10
A test piece was prepared in the same manner as in Example 2 except that 325S was used in place of (D-1), and subjected to a physical property test. The obtained results are shown in Table 2.

Comparative Example 11
A test piece was prepared in the same manner as in Example 2 except that T-289 was used instead of (D-1), and was subjected to a physical property test. The obtained results are shown in Table 2.

  As is apparent from the results in Table 1, in Examples 1 to 7, molded products having excellent rigidity and heat resistance, light weight, and excellent vibration damping properties were obtained.

Since Comparative Example 1 used only the polyarylate resin, tan δ was small and the vibration damping property was inferior. In addition, the density was high and the rigidity was poor.
Since Comparative Example 2 used only the reinforced polyamide resin, tan δ was small and the vibration damping property was inferior. And it was inferior in rigidity and heat resistance.

Since Comparative Example 3 did not contain a ceramic balloon, tan δ was small and the vibration damping property was inferior. And it was inferior in rigidity.
In Comparative Examples 4 and 5, tan δ was small because the ceramic balloons were insufficient, and the vibration damping properties were inferior. And it was inferior in rigidity.

In Comparative Example 6, since the ceramic balloon was excessive, the fluidity was lowered and a molded product could not be obtained.
Since the comparative example 7 had too few polyarylate resin, it became a state which cannot be knead | mixed uniformly, and a molded article could not be obtained.

In Comparative Example 8, the reinforced polyamide resin was insufficient, so that the fluidity was lowered and a molded product could not be obtained.
In Comparative Example 9, since a normal (non-reinforced) polyamide resin was used instead of the reinforced polyamide resin, tan δ was small and the vibration damping property was inferior.

In Comparative Example 10, since glass fiber was used instead of the ceramic balloon, tan δ was small and the vibration damping property was inferior. In addition, the density was high and the practicality was lacking.
In Comparative Example 11, since mica was used instead of the ceramic balloon, tan δ was small and the vibration damping property was inferior. In addition, the density was high and the practicality was lacking.

Claims (3)

  A resin composition comprising a resin component (C) and a ceramic balloon (D), wherein the resin component (C) is a polyarylate resin (A) 30 to 70 mass% and a reinforced polyamide resin (B) 70 to 30 mass And containing 50 to 15% by mass of ceramic balloon (D) with respect to 50 to 85% by mass of the resin component (C), and the reinforced polyamide resin (B) is contained in the polyamide resin. A resin composition comprising a swellable layered silicate having an average distance of 20 mm or more and 50% or more of the swellable layered silicate layer without forming a lump.   The resin composition according to claim 1, wherein the reinforced polyamide resin (B) contains 0.01 to 10 parts by mass of a swellable layered silicate with respect to 100 parts by mass of the polyamide resin. A molded article comprising the resin composition according to claim 1 or 2, wherein the molded article has the following physical properties (i) to (iv).
(I) The internal loss tan δ is 0.08 or more.
(Ii) The density measured by JIS K7112 is 1.20 g / cm ³ or less.
(Iii) The flexural modulus measured by ASTM D790 is 5.0 GPa or more.
(Iv) The deflection temperature under load measured by ASTM D648 under a load of 1.82 MPa is 160 ° C. or higher.