JP2012064725A - Reflection optical device, luminaire, exposure device and method of manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reflection optical device in which high throughput can be achieved, and to provide an optical unit, an exposure device, and a method of manufacturing a device.SOLUTION: A first fly-eye optical device 21 is configured by arranging a plurality of light-reflecting mirror surfaces 21a on a two-dimensional plane. The plurality of mirror surfaces 21a are formed while shortening the dimension of at least one of adjoining mirror surfaces so that an air gap is formed at least partially between the adjoining mirror surfaces. The first fly-eye optical device 21 is provided with a detector 26 which receives the light reaching the air gap.

Description

  The present invention relates to a reflection optical apparatus, an illumination apparatus, an exposure apparatus, and a device manufacturing method.

  In a lithography process for manufacturing various devices such as a semiconductor element and a liquid crystal display element, a photosensitive material (resist) is applied with exposure light through a circuit pattern for a device formed on a reticle or a photomask. In order to expose a substrate (such as a wafer or a glass plate), various projection exposure apparatuses called steppers or scanners are used.

  In recent years, in order to manufacture a device with a higher degree of integration, an exposure technique for forming a higher-definition circuit pattern on a substrate is required. As one of exposure apparatuses that achieve such high definition, an EUV exposure apparatus that uses EUV (Extreme Ultra Violet) light having a shorter wavelength and a wavelength of about 5 to 20 nm has been attracting attention. When pattern exposure is performed using such EUV light, each of the illumination optical system and projection optical system of the EUV exposure apparatus has a multilayer mirror in which a plurality of reflective optical elements, for example, layers of molybdenum and silicon are repeatedly stacked. Etc. are used (see, for example, Patent Document 1).

JP 2000-349909 A

  A general exposure apparatus, not limited to an EUV exposure apparatus, is provided with a light amount sensor for measuring light generated from a light source. However, if the illumination light for exposure reaching the mask or wafer is measured during the exposure operation on the wafer, a part of the illumination light is guided to the light quantity sensor, and the amount of light reaching the mask or wafer. Will fall.

  In view of such circumstances, an aspect of the present invention aims to achieve a high throughput by suppressing a decrease in the amount of light reaching the mask or wafer.

  According to the first aspect of the present invention, in the reflective optical device in which a plurality of mirror surfaces that reflect light are arranged on a two-dimensional surface, the plurality of mirror surfaces are at least partially spaced between adjacent mirror surfaces. Is formed by shortening at least one dimension of adjacent mirror surfaces, and is provided with a detection device for receiving light reaching the gap.

  According to the second aspect of the present invention, in the optical unit used for illuminating the irradiated surface using the light from the light source, the optical unit is disposed between the light source and the irradiated surface, and the light from the light source is wavefronted. A first fly-eye optical device including a reflective optical device for splitting; and a second fly-eye optical device that reflects light wave-divided by the first fly-eye optical device, the reflective optical device reflecting light A plurality of mirror surfaces are arranged on a two-dimensional surface, and the plurality of mirror surfaces are formed by shortening at least one dimension of adjacent mirror surfaces so that a gap is formed at least in a part between the adjacent mirror surfaces. A detection device is provided for receiving the light that is formed and reaches the air gap, and the detection device has a detection unit that is provided in the air gap and receives the light reaching the air gap and outputs a detection signal.

  According to the third aspect of the present invention, in the optical unit used for illuminating the irradiated surface using light from the light source, the optical unit is disposed between the light source and the irradiated surface, and the light from the light source is wavefronted. A first fly-eye optical device including a reflective optical device for splitting; and a second fly-eye optical device that reflects light wave-divided by the first fly-eye optical device, the reflective optical device reflecting light A plurality of mirror surfaces are arranged on a two-dimensional surface, and the plurality of mirror surfaces are formed by shortening at least one dimension of adjacent mirror surfaces so that a gap is formed at least in a part between the adjacent mirror surfaces. A detection device is provided to receive the light that reaches the air gap, and the detection device is specified by the detection mirror surface provided in the air gap and the detection mirror surface so as to reflect the light reaching the air gap in a specific direction. The light reflected in the direction It characterized by having a detecting section for outputting a detection signal light.

  According to the fourth aspect of the present invention, in the illumination device that illuminates the illuminated surface using light from the light source, the optical unit is used to illuminate the illuminated surface using light from the light source. Is disposed between the light source and the irradiated surface, and includes a first fly's eye optical device that includes a reflection optical device that divides light from the light source into a wavefront, and reflects light that has been wavefront divided by the first fly's eye optical device. A second fly's eye optical device, wherein the reflecting optical device has a plurality of mirror surfaces that reflect light arranged in a two-dimensional surface, and the plurality of mirror surfaces are at least partially spaced between adjacent mirror surfaces. Is formed by shortening at least one dimension of adjacent mirror surfaces, and is provided with a detection device for receiving light reaching the gap.

  According to the fifth aspect of the present invention, in the exposure apparatus that exposes the pattern formed on the mask to the object, the illumination apparatus that illuminates the pattern formed on the mask is used, and the illumination apparatus uses light from the light source. An optical unit is used to illuminate the irradiated surface, and the optical unit is disposed between the light source and the irradiated surface, and the first fly's eye optical device includes a reflective optical device that divides the light from the light source into a wavefront; A second fly's eye optical device that reflects light that has been wavefront-divided by the first fly's eye optical device, wherein the reflective optical device has a plurality of mirror surfaces that reflect light arranged in a two-dimensional plane, The mirror surface is formed by shortening at least one dimension of adjacent mirror surfaces so that a gap is formed in at least a part between the adjacent mirror surfaces, and a detection device for receiving light reaching the gap Provided It is characterized in.

  In the present invention, a high throughput can be achieved by suppressing a decrease in the amount of light reaching the mask or wafer.

1 is a view showing a schematic configuration of an exposure apparatus 100 according to an embodiment of the present invention. It is a figure which shows the 1st fly eye optical apparatus 21 which concerns on embodiment of this invention. It is a figure which shows the 2nd fly eye optical apparatus 24 which concerns on embodiment of this invention. FIG. 6 is an enlarged view of a part of the principle first fly-eye optical device 61 and an illumination area on an irradiated surface of the reticle R. FIG. 3 is an enlarged view of a part of the first fly's eye optical device 21 according to the first embodiment of the present invention, and a diagram showing an illumination area on an irradiated surface of a reticle R. It is the figure which showed the optical element 39 which concerns on 2nd Embodiment of this invention. It is the figure which expanded a part of 1st fly eye optical apparatus 31 concerning a 2nd embodiment of the present invention. It is the figure which showed a part of illuminating device 11 which concerns on 2nd Embodiment of this invention. It is the figure which showed the flowchart which shows the manufacturing process of the semiconductor device which concerns on embodiment of this invention.

<First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram schematically showing the overall configuration of an exposure apparatus 100 according to the first embodiment of the present invention. The exposure apparatus 100 moves the reticle R and the wafer W relative to the projection optical system PL using EUV (Extreme Ultra Violet) light having a wavelength of about 5 to 40 nm as the exposure light EL. Thus, a step-and-scan type scanning exposure type projection exposure apparatus that transfers the pattern of the reticle R onto a resist (photosensitive material) layer on the wafer W. In the following description, the XYZ orthogonal coordinate system shown in FIG. 1 is set, the direction parallel to the optical axis of the projection optical system PL is the Z axis, the direction parallel to the paper surface in the plane perpendicular to the Z axis is the Y axis, The configuration of each member and the positional relationship thereof will be described with the direction perpendicular to the paper surface as the X axis.

  As shown in FIG. 1, an exposure apparatus 100 includes a laser plasma light source device 2 that generates light (exposure light EL) used for exposure, and an exposure light EL emitted from the laser plasma light source device 2, and a circuit pattern for a device. An illumination device 11 (or illumination optical system) that illuminates the reticle R (or mask) on which is formed, a reticle stage RS that holds the reticle R, a projection optical system PL, and a wafer holder (not shown) that holds the wafer W A wafer stage WS.

The laser plasma light source device 2 includes a high output laser light source 4 such as a CO ₂ laser, a YAG laser light source or an excimer laser light source excited by a semiconductor laser, and a condensing lens 6 that condenses the laser light emitted from the high output laser light source 4. And a nozzle 8 for jetting xenon gas (Xe), krypton gas (Kr) or the like as a target material of the laser plasma light source device 2, and an elliptical reflecting mirror 10 for condensing the generated light.

  The laser light emitted from the high-power laser light source 4 is condensed at one point by the condenser lens 6. A target material such as xenon gas or krypton gas is ejected from the nozzle 8 to the condensing point, and these target materials are excited into a plasma state by the energy of laser light. When this transitions to a low potential state, EUV light, ultraviolet light having a wavelength of 100 nm or more, visible light, and light of other wavelengths are emitted.

  The elliptical reflecting mirror 10 includes a reflecting surface having an elliptical curved surface, and a multilayer film capable of selectively reflecting the exposure light EL is formed on the reflecting surface. It is provided so as to coincide with the position. Thereby, the exposure light EL emitted from the laser plasma light source device 2 is reflected toward the second focal position of the elliptical reflecting mirror 10. The illumination device 11 includes an oblique incident mirror 12 that reflects the exposure light EL emitted from the laser plasma light source device 2, and an optical unit 20 that is used to make the illuminance distribution of the exposure light EL uniform on the irradiated surface of the reticle R. And the condenser mirror 18.

  The oblique incidence mirror 12 is provided between the laser plasma light source device 2 and the optical unit 20 and has a concave reflecting surface. The exposure light EL emitted from the laser plasma light source device 2 is reflected by the oblique incidence mirror 12, collimated as parallel light, and guided to the optical unit 20.

  The optical unit 20 includes a reflective first fly-eye optical device 21 (reflective optical device) and a reflective second fly-eye optical device 24, and uniform illuminance distribution of the exposure light EL on the irradiated surface of the reticle R. Can be. The first fly-eye optical device 21 is configured by arranging a plurality of arc-shaped mirror surfaces in the X-axis direction and the Y-axis direction, details of which will be described later.

  The condenser mirror 18 has a concave reflecting surface and is arranged so as to reflect the exposure light EL emitted from the optical unit 20 so as to form an arcuate illumination area on the irradiated surface of the reticle R. . Instead of the condenser mirror 18, a condenser optical system in which a plurality of reflection mirrors are combined may be used.

  Reflective surfaces (or mirror surfaces) of the oblique incidence mirror 12, the first fly-eye optical device 21, the second fly-eye optical device 24, and the condenser mirror 18 have a high reflectance with respect to EUV light having a wavelength of about 13.5 nm. Thus, a multilayer film in which a molybdenum (Mo) layer and a silicon (Si) layer are repeatedly laminated is formed.

The reticle stage RS includes a reticle holder (not shown) that holds a reticle R on which a circuit pattern for a device is formed by electrostatic adsorption. The reticle stage RS is mounted on a guide surface on a reticle base (not shown), and is driven at a predetermined scanning speed in the Y-axis direction by a reticle stage drive unit (not shown) including a linear motor and the like. , X-axis direction, Z-axis direction, and micro-drive in the rotation direction (θ _Z direction) around an axis parallel to the Z-axis. The position of the reticle stage RS on the guide surface is always measured by a reticle interferometer (not shown) with a resolution of about 0.1 to 0.5 nm, for example. Based on the position information, a reticle stage control unit (not shown) controls the position and speed of the reticle stage RS via the reticle stage driving unit. As the reticle R that is attracted and held using a reticle holder (not shown) by the reticle stage RS, a reflective reticle in which a circuit pattern for a device is formed on a substrate such as quartz is used. As an equivalent to the reflective reticle R, a pattern may be projected using a DMD (Digital Micro-mirror Device).

  The projection optical system PL is composed of a plurality of about 2 to 10 reflecting mirrors, and projects a circuit pattern formed on the reticle R onto the wafer W. A multilayer film that reflects the exposure light EL is formed on the reflecting surfaces of the plurality of reflecting mirrors. The effective numerical aperture (NA) of the projection optical system PL in the present embodiment is, for example, 0.35. The NA value of the projection optical system PL may be set to 0.35 or less or 0.35 or more. The projection optical system PL may be an inverted pupil type optical system. In the inverted pupil type optical system, the entrance pupil of the projection optical system is located on the opposite side of the projection optical system with the object plane (reticle surface) in between. In the exposure apparatus using the inverted pupil type optical system, the condenser mirror 18 or the condenser optical system used in the illumination apparatus 11 is unnecessary, and thus the exposure apparatus 100 can be downsized. Further, since the condenser mirror 18 or the condenser optical system as a reflecting member accompanied by a loss of light quantity of the exposure light EL is unnecessary, the throughput is improved. The configuration of the inverted pupil optical system can be used with the aid of US Pat. No. 6,781,671.

The wafer stage WS includes a wafer holder (not shown) that holds the wafer W by electrostatic adsorption. Wafer stage WS is an XY stage (non-contact) that is floated and supported in a non-contact manner via a plurality of air bearings on a guide surface (XY plane) of a wafer base (not shown) disposed horizontally below projection optical system PL. And a Z tilt stage (not shown). The Z tilt stage individually drives, for example, three Z drive units that can be displaced in the Z axis direction, and the Z tilt stage position in the Z axis direction and the rotation direction around the axis parallel to the X axis (θ The rotation angle is adjusted in the _X direction), the rotation direction around the axis parallel to the Y axis (θ _Y direction), and the rotation direction around the axis parallel to the Z axis (θ _Z direction). The wafer base is supported by the floor member via a plurality of vibration isolation tables. The wafer stage WS is moved in the X axis direction, Y axis direction, Z axis direction, θ _X direction, θ _Y direction, and θ _Z direction by a drive unit (not shown) such as a linear motor or a planar motor on the wafer base. Driven. The position of at least one of the X-axis direction, Y-axis direction, Z-axis direction, θ _X direction, θ _Y direction, and θ _Z direction on the guide surface is, for example, 0.1 by a wafer stage interferometer (not shown). It is always measured with a resolution of about 0.5 nm. Based on the position information, a stage control unit (not shown) controls the position and speed of the wafer stage WS via the drive unit.

  Next, the optical unit 20 according to the first embodiment of the present invention will be described. 2 and 3 show an outline of the first fly-eye optical device 21 and the second fly-eye optical device 24 that constitute the optical unit 20. 2 and 3, the X-axis direction corresponds to the non-scanning direction of the reticle R and the wafer W, and the Y-axis direction corresponds to the scanning direction of the reticle R and the wafer W. For the sake of clarity, the number of individual mirror surfaces 21a and 24a constituting the first fly-eye optical device 21 and the second fly-eye optical device 24 is shown smaller than the actual number.

  As shown in FIG. 2, the first fly-eye optical device 21 has a plurality of mirror surfaces 21a having an arcuate outer shape at positions optically conjugate with the pattern surface of the reticle R in the X-axis direction and the Y-axis direction. Are arranged at a substantially uniform pitch. The plurality of mirror surfaces 21a have an arcuate outer shape because an arcuate illumination region is formed on the reticle R corresponding to the arcuate effective imaging region and effective field of the projection optical system PL, and the wafer This is because an arc-shaped still exposure region is formed on W.

  The first fly's eye optical device 21 is configured by providing a plurality of optical elements (optical members) having one mirror surface 21a on a base substrate. The optical element is, for example, a low thermal expansion member such as Zerodur or a metal member such as aluminum. The surface of these members is processed into a concave surface having a predetermined curvature, and a mirror film is formed on the concave surface by forming a multilayer film. 21a is formed. The first fly's eye optical device 21 may be configured by providing a plurality of mirror blocks having three or four mirror surfaces 21a on the base substrate, or the plurality of mirror surfaces 21a may be formed as one optical surface. You may comprise by forming in an element.

  As shown in FIG. 3, the second fly's eye optical device 24 is configured by arranging a plurality of mirror surfaces 24 a having a rectangular outer shape in the X-axis direction and the Y-axis direction. The rectangular outer shape is, for example, a square. The reason why the mirror surface 24a of the second fly's eye optical device 24 has a rectangular outer shape is that a secondary light source image having a substantially circular shape is formed on or near the surface of the mirror surface 24a. This secondary light source image is a secondary focal image formed at the second focal position of the elliptical reflecting mirror 10. The arrangement of the plurality of mirror surfaces 21a constituting the first fly's eye optical device 21 and the plurality of mirror surfaces 24a constituting the second fly's eye optical device 24 is described in US Patent Application Publication No. 2002/0093636. It can be used with assistance.

  Similar to the first fly's eye optical device 21, the second fly's eye optical device 24 is configured by providing a plurality of optical elements having one mirror surface 24a on the base substrate. The optical element is, for example, a low thermal expansion member such as Zerodur or a metal member such as aluminum. The surface of these members is processed into a concave surface having a predetermined curvature, and a mirror film is formed on the concave surface by forming a multilayer film. 24a is formed. The second fly's eye optical device 24 may be configured by providing a plurality of mirror blocks having three or four optical elements on the base substrate, or a plurality of mirror surfaces 24a may be provided as one optical element. You may comprise by forming in this.

  In the first embodiment of the present invention, the light beam of the exposure light EL incident on the optical unit 20 is divided into wavefronts by a plurality of mirror surfaces 21 a constituting the first fly's eye optical device 21. The light beams reflected by the plurality of mirror surfaces 21 a are incident on the corresponding mirror surfaces 24 a of the second fly's eye optical device 24. The light beams reflected by the respective mirror surfaces 24a of the second fly's eye optical device 24 illuminate the arcuate illumination area in a superimposed manner on the irradiated surface of the reticle R via the condenser mirror 18. Thereby, the illuminance distribution of the exposure light EL on the irradiated surface of the reticle R can be made uniform.

  When the optical unit 20 and its rear optical system are in an ideal state with no aberration and no magnification difference between the mirror surfaces, in principle, as shown in FIG. The plurality of mirror surfaces 61a are closely arranged on a two-dimensional surface in the X-axis direction and the Y-axis direction. Thereby, the light reflected by each mirror surface (for example, 61aa, 61ab, 61ac, 61ad) is superimposed on the illumination surface IR of the reticle R almost accurately in the illumination region IR. However, in practice, as shown in the schematic diagram on the lower side of FIG. 4, due to the influence of aberration, manufacturing error, and magnification difference of each mirror surface, an illumination field overlap error, that is, the size and position of the illumination area shifts, etc. The light reflected by each mirror surface forms different illumination areas (for example, 62aa, 62ab, 62ac, 62ad).

  Therefore, in the first embodiment of the present invention, as shown in FIG. 5, the X axis direction or the ideal dimension (theoretical design value) is not changed without changing the arrangement pitch of the plurality of mirror surfaces 21 a. Mirror surfaces whose dimensions in the Y-axis direction are slightly shortened are arranged at appropriate portions in the X-axis direction and the Y-axis direction. The dimensions of the mirror surface are the illumination area (for example, 22aa, 22ab, 22ac, 22ad) formed on the irradiated surface of the reticle R by the light reflected by each mirror surface (for example, 21aa, 21ab, 21ac, 21ad) and the illumination area IR. Are determined as much as possible. As a result, a gap is formed between adjacent mirror surfaces. Ideally, it is desirable that the dimensions of all the mirror surfaces be appropriately shortened according to the superposition error with respect to the illumination area IR, but in reality, the loss of light amount due to the formation of the gap and the illuminance uniformity in the illumination area In consideration of the manufacturing tolerance and the like, and the manufacturing cost of making mirror surfaces with slightly changing dimensions, the dimensions of some mirror surfaces may be formed short as shown in FIG. In general, the light reflected at the periphery of the first fly's eye optical device 21 is more susceptible to aberrations than the light reflected at the center, so that many of the mirror surfaces arranged in the periphery are It may be a small size, and many gaps may be formed between adjacent mirrors. Further, among the plurality of mirror surfaces 21a arranged in the Y-axis direction, in a portion where the mirror surface having a shortened dimension in the Y-axis direction is disposed, no gap is generated between the mirror surfaces adjacent in the Y-axis direction. You may arrange closely.

  The first fly's eye optical device 21 according to the first embodiment of the present invention includes a detection device 25 as shown in FIG. The detection device 25 includes a detection unit 26 disposed in the gap so as to receive light reaching the gap formed between the plurality of mirror surfaces 21a. The detection unit 26 is, for example, a photodiode or a C-MOS sensor. The light received by the detection unit 26 does not reach the wafer W and is not used for exposure of the wafer W. In FIG. 5, the detection unit 26 is provided in the formed gap, but it is not necessary to provide the detection unit 26 in all the formed gaps. The detection device 25 measures the light intensity of the exposure light EL incident on the first fly's eye optical device 21 or its change over time based on the detection result of the light intensity (illuminance) received by the detection unit 26.

  The control unit 27 shown in FIG. 1 inputs the detection result from the detection unit 26 and controls the intensity of light from the light source. For example, the control unit 27 supplies a target material that generates EUV light, an output amount of excitation light that irradiates the target material, an output amount of light that is generated from a light source, and a filter or shield that adjusts the light from the light source. Controls the plate, etc., and adjusts the light intensity to increase when the light intensity of the exposure light EL decreases, and adjusts the light intensity to increase when the light intensity of the exposure light EL increases. To do. Furthermore, when the light intensity of the exposure light EL decreases with the passage of time, the light intensity is adjusted to increase with the passage of time, and the light intensity increases with the passage of time. Sometimes, the light intensity is adjusted to decrease with the passage of time. Thereby, the light intensity of the exposure light EL incident on the first fly's eye optical device 21 or its change with time can be controlled.

  By the way, the illuminating device 11 in 1st Embodiment of this invention is provided with the to-be-irradiated surface measurement part 28 provided in the position of the to-be-irradiated surface of the reticle R, or its vicinity. The irradiated surface measurement unit 28 measures at least one of the intensity, intensity distribution, and temporal change of the exposure light EL when exposure to the wafer W is stopped. The irradiated surface measurement unit 28 is, for example, a photodiode, a C-MOS sensor, or the like. Based on the measurement result measured by the irradiated surface measurement unit 28 and the detection result received by the detection unit 26, the control unit 27 controls at least one of the light intensity or the intensity distribution of the exposure light EL. As a result, it is possible to adjust the light illuminating the irradiated surface of the reticle R. As a result, the exposure light EL that reaches the wafer W is adjusted appropriately.

  The plurality of mirror surfaces 21a are optical axes of the illuminating device 11 or axes parallel to the optical axes so that the illumination areas of the mirror surfaces 21a formed on the irradiated surface of the reticle R coincide with the illumination areas IR. You may install by adjusting the attitude | position, angle, etc. of the surrounding mirror surface 21a. The distance between the first fly's eye optical device 21 and the second fly's eye optical device 24 may be adjusted and installed.

  In addition, when the detection units 26 are provided at a plurality of locations in the gap formed between the plurality of mirror surfaces 21a constituting the first fly's eye optical device 21, the control unit 27 It may have a function of adjusting the intensity distribution of light from the light source by measuring the light intensity distribution of the exposure light EL or its change over time based on the detection result. In this case, the control unit 27 can adjust the light intensity distribution of the exposure light EL, its temporal change, and the like by controlling the output distribution of light generated from the light source, the filter, the shielding plate, and the like.

Second Embodiment
A first fly's eye optical device 31 according to a second embodiment of the present invention will be described with reference to FIGS. Note that parts different from the first embodiment will be mainly described, and description of the same configuration as that of the first embodiment will be omitted.

  In the first embodiment, the detection unit 26 is provided in the gap between the plurality of mirror surfaces 21a. However, in the second embodiment, a detection mirror surface (for example, a mirror surface) for reflecting light reaching the gap. 36x, 36y). As shown in FIG. 6, the detection mirror surface 36x or 36y has an angle that reflects light in a direction different from the mirror surface (for example, 31ab) that reflects the exposure light EL toward the second fly's eye optical device 24. Is formed. Further, the detection mirror surface 36x or 36y is provided integrally with a part of the optical element 39 having the arc-shaped mirror surface 31ab. On a part of the surface of the optical element 39, an arcuate mirror surface 31ab and a detection mirror surface 36x having a short dimension are formed. As a result, an optical element in which only the arc-shaped mirror surface 31aa is formed, and an optical element 39 in which the arc-shaped mirror surface 31ab having a short dimension and the detection mirror surface 36x (or 36y) are formed are converted into the XY plane. Since the optical elements having the same size can be manufactured, the manufacturing cost can be reduced and the optical elements can be easily installed on the base substrate. The detection mirror surface 36x or 36y may be inclined in the Y-axis direction.

  As shown in FIG. 7, the first fly's eye optical device 31 includes an optical element on which a mirror surface (for example, 31aa, 31ac) that reflects the exposure light EL toward the second fly's eye optical device 24 is formed. (2) A mirror surface having a short dimension in the X-axis direction or the Y-axis direction (for example, 31ab, 31b, etc.) so that the exposure light EL is reflected toward the fly-eye optical device 24 and a gap is formed between the adjacent mirror surfaces. 31ad) and an optical element on which the detection mirror surface 36x or 36y is formed on the base substrate.

  In the second embodiment, as shown in FIG. 8, the light DL reflected by the detection mirror surface 36x or 36y is separated from the exposure light EL, and is arranged at a position where the exposure light EL is not shielded. Is received. As shown in FIG. 8, the detection unit 37 is provided on the back side of the second fly's eye optical device 24 in a direction away from the first fly's eye optical device 31. For example, the detection unit 37 is provided on the back side of the second fly's eye optical device 24 that is separated from the first fly's eye optical device 31 by a distance between the first fly's eye device 31 and the second fly's eye device 24. Thereby, the illumination device 11 and the exposure device 100 can be reduced in size. The detection unit 37 may be installed at an arbitrary location such as the vicinity of the reticle R surface as long as it does not block the exposure light EL. Further, it may be provided adjacent to or near the second fly's eye device 24. In the present embodiment, the detection mirror surface 36x or 36y and the detection unit 37 constitute a detection device.

  Next, a device manufacturing method using the exposure apparatus 100 according to the above-described embodiment will be described. FIG. 9 is a flowchart showing a semiconductor device manufacturing process. As shown in FIG. 9, in the manufacturing process of a semiconductor device, a metal film is deposited on an object (wafer W) serving as a substrate of the semiconductor device (step S1), and a photoresist which is a photosensitive material is formed on the deposited metal film. Is applied (step S2). Subsequently, using the exposure apparatus 100 of the above-described embodiment, the pattern formed on the reticle R is transferred to each shot area of the wafer W (step S3: exposure process), and development of the wafer W after the transfer is completed, that is, The photoresist to which the pattern has been transferred is developed (step S4: development step). Thereafter, using the resist pattern generated on the surface of the wafer W in step S4 as a mask, processing such as etching is performed on the surface of the wafer W (step S5: processing step).

  Here, the resist pattern is a photoresist layer in which unevenness having a shape corresponding to the pattern transferred by the exposure apparatus 100 of the above-described embodiment is generated, and the recess penetrates the photoresist layer. It is. In step S5, the surface of the wafer W is processed through this resist pattern. The processing performed in step S5 includes at least one of etching of the surface of the wafer W or film formation of a metal film, for example.

  Further, each embodiment is not limited to application to a semiconductor device manufacturing process. For example, a liquid crystal display element formed on a square glass plate or a manufacturing process or imaging of a display device such as a plasma display. It can be widely applied to manufacturing processes of various devices such as elements (CCD, etc.), micromachines, MEMS (Micro Electro Mechanical Systems), thin film magnetic heads and DNA chips. Furthermore, the embodiment of the present invention can be applied to a manufacturing process when manufacturing a mask (photomask, reticle, or the like) on which a mask pattern of various devices is formed using a photolithography process.

  The exposure apparatus according to the above-described embodiment is constructed by assembling various sub-devices including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  In addition, each embodiment can take a various structure in the range which does not deviate from a summary.

RS ... reticle stage, PL ... projection optical system, WS ... wafer stage,
EL ... exposure light, 2 ... laser plasma light source device, 11 ... illumination device,
12 ... oblique incidence mirror, 20 ... optical unit,
21, 31, 61 ... first fly-eye optical device, 21 a, 31 a, 61 a ... mirror surface,
24 ... second fly's eye optical device, 25 ... detection device, 26, 37 ... detection unit, 27 ... control unit,
36x, 36y ... mirror surface for detection, 100 ... exposure apparatus

Claims (14)

In a reflective optical device in which a plurality of mirror surfaces that reflect light are arranged in a two-dimensional surface,
The plurality of mirror surfaces are formed by shortening at least one dimension of the adjacent mirror surfaces so that a gap is formed in at least a part between the adjacent mirror surfaces,
A reflection optical device comprising a detection device for receiving light reaching the gap. The detection device includes:
The reflection optical apparatus according to claim 1, further comprising: a detection unit that is provided in the gap and receives light reaching the gap and outputs a detection signal. The detection device includes:
The reflective optical apparatus according to claim 1, wherein at least one of light intensity, light intensity distribution, and temporal change of incident light is measured based on a detection result received by the detection unit. . The detection device includes:
A detection mirror surface provided in the gap so as to reflect light reaching the gap in a specific direction;
The reflection optical apparatus according to claim 1, further comprising: a detection unit that receives light reflected in the specific direction by the detection mirror surface and outputs a detection signal. The reflective optical apparatus according to claim 4, further comprising an optical element in which a mirror surface having a short dimension and the mirror surface for detection are formed among the plurality of mirror surfaces. The detection device includes:
6. The method according to claim 4, wherein at least one of light intensity, light intensity distribution, and temporal change of incident light is measured based on a detection result received by the detection unit. The reflective optical device described. In the optical unit used to illuminate the illuminated surface using light from the light source,
A first fly's eye optical device comprising the reflective optical device according to claim 2 or 3, wherein the first fly's eye optical device is disposed between the light source and the irradiated surface, and divides the light from the light source into a wavefront.
An optical unit comprising: a second fly's eye optical device that reflects light divided by the first fly's eye optical device. In the optical unit used to illuminate the illuminated surface using light from the light source,
A first fly's eye optical device comprising the reflective optical device according to any one of claims 4 to 6, which is disposed between the light source and the irradiated surface and divides the light from the light source into a wavefront. ,
An optical unit comprising: a second fly's eye optical device that reflects light divided by the first fly's eye optical device. The optical unit according to claim 8, wherein the detection unit is provided on a back surface side of the second fly's eye optical device in a direction away from the first fly's eye optical device. In the illumination device that illuminates the illuminated surface using light from the light source,
An illumination device using the optical unit according to any one of claims 7 to 9. The lighting device according to claim 10, further comprising a control unit configured to control at least one of intensity or intensity distribution of light from the light source based on the detection result. Further provided an irradiated surface measurement unit provided at or near the position of the irradiated surface,
The lighting device according to claim 11, wherein the control unit controls at least one of the intensity or the intensity distribution of light from the light source using a measurement result measured by the irradiated surface measurement unit. In an exposure apparatus that exposes an object with a pattern formed on a mask,
An exposure apparatus that illuminates a pattern formed on the mask using the illumination apparatus according to claim 12. In a device manufacturing method including a lithography process,
In the lithography process, exposure is performed using the exposure apparatus according to claim 13.

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