JP2012064345A - Globe with phosphor layer for led bulb, its manufacturing method, and led bulb - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a globe with phosphor layer for an LED bulb in which the phosphor layer is hardly peeled from the inner surface of the globe, and to provide its manufacturing method and an LED bulb.SOLUTION: The globe 10 with a phosphor layer 10 for an LED bulb has a globe 11 to cover a semiconductor light emitting element 30 arranged on a substrate 20 and a phosphor layer 16 to cover the inner surface of the globe 11. The inner surface of the globe 11 is formed in an irregular shape, and the phosphor layer 16 covers closely adhered to the irregular shape on the inner surface of the globe 11.

Description

  Embodiments of the present invention relate to a globe with a phosphor layer for an LED bulb, a manufacturing method thereof, and an LED bulb.

  The phosphor powder is used for a light emitting device such as a light emitting diode (LED). The light emitting device includes, for example, a semiconductor light emitting element that is arranged on a substrate and emits light of a predetermined color, and a phosphor that emits visible light when excited by light such as ultraviolet light and blue light emitted from the semiconductor light emitting element. And a phosphor layer (light emitting portion) containing the powder in a transparent resin cured product.

  The phosphor layer may be formed so as to directly cover the semiconductor light emitting element via a transparent resin, or may be formed so as to cover the inner surface of the globe that covers the semiconductor light emitting element in a state of being separated from the semiconductor light emitting element. Hereinafter, the light emitting device in which the latter phosphor layer is formed so as to cover the inner surface of the globe is referred to as “remote phosphor type LED light emitting device”. A globe in which the inner surface of the globe is covered with a phosphor layer is referred to as a “globe with a phosphor layer”. The phosphor layer emits visible light when excited by light emitted from the semiconductor light emitting element.

  For example, GaN, InGaN, AlGaN, InGaAlP or the like is used as the semiconductor light emitting element of the light emitting device. Examples of the phosphor of the phosphor powder include a blue phosphor, a green phosphor, and a yellow phosphor that are excited by light emitted from the semiconductor light emitting element and emit blue light, green light, yellow light, and red light, respectively. A phosphor, a red phosphor or the like is used.

  The light-emitting device uses a combination of a semiconductor light-emitting element and phosphor powder in the phosphor layer as appropriate, so that visible light can be obtained by the action of light emitted from the semiconductor light-emitting element and light emitted from the phosphor powder. It becomes possible to emit light of the region and white light.

  Among the above light emitting devices, the remote phosphor type LED light emitting device is preferable because the luminance of the entire light bulb can be easily made uniform, thereby reducing glare of the light bulb and local glare, so-called glare.

Japanese Patent Laid-Open No. 2005-5546

  However, in a phosphor with a phosphor layer of a remote phosphor type LED light-emitting device, the phosphor layer may be peeled off from the inner surface of the globe due to a poor adhesion level of the phosphor layer during processing or a change with time. When the phosphor layer is peeled off from the inner surface of the globe in the remote phosphor type LED light emitting device, there arises a problem that the light emission intensity is reduced or the ultraviolet light emitted from the semiconductor light emitting element is emitted outside the light emitting device. .

  This invention is made | formed in view of the said situation, and it aims at providing the glove with the fluorescent substance layer for LED bulbs for which a fluorescent substance layer is hard to peel from the inner surface of a glove, its manufacturing method, and a LED bulb. To do.

  The globe with a phosphor layer for an LED bulb according to the embodiment, the manufacturing method thereof, and the LED bulb are found to be difficult to peel off the phosphor layer from the inner surface of the globe by forming the inner surface of the globe into an uneven shape. It was completed.

  The globe with a phosphor layer according to the embodiment solves the above-described problem, and an LED bulb having a globe that covers a semiconductor light emitting element disposed on a substrate and a phosphor layer that covers the inner surface of the globe. A glove with a phosphor layer for use, wherein the inner surface of the glove is formed in a concavo-convex shape, and the phosphor layer is coated in close contact with the concavo-convex shape of the inner surface of the glove. .

  Moreover, the manufacturing method of the glove with a fluorescent substance layer of embodiment solves the said problem, the unevenness | corrugation formation process which forms an unevenness | corrugation in the inner surface of a globe, and the inner surface of the said globe in transparent resin It has the application | coating process which apply | coats the fluorescent substance slurry which disperse | distributed fluorescent substance, and the hardening process which hardens the said apply | coated fluorescent substance slurry, It is characterized by the above-mentioned.

  Furthermore, the LED light bulb according to the embodiment solves the above-described problems. A substrate, a semiconductor light emitting element that is disposed on the substrate and emits light, a globe that covers the semiconductor light emitting element, An LED bulb including a phosphor layer-coated globe having an inner surface and a phosphor layer that emits visible light when excited by light emitted from the semiconductor light-emitting element, wherein the globe with the phosphor layer is: It is a glove with a phosphor layer for the LED bulb.

The fragmentary sectional view of the LED bulb of an embodiment. Sectional drawing of the glove with a fluorescent substance layer of embodiment. A sectional view of a globe. The figure explaining arithmetic mean inclination (DELTA) a. The figure which shows the test flow of an Example.

  A globe with a phosphor layer for an LED bulb, a method of manufacturing the same, and an LED bulb will be described with reference to the drawings.

(First embodiment)
[LED bulb]
FIG. 1 is a partial cross-sectional view of an LED bulb according to an embodiment. An LED bulb 1 shown as the first embodiment in FIG. 1 includes a truncated cone-shaped base portion 50, a base 70 provided at one end of a small-diameter circular shape of the base portion 50 via an insulating member 60, a base The substrate 20 provided at the other end of the large-diameter circular shape of the portion 50, the semiconductor light emitting element 30 disposed on the substrate 20 and emitting light, and the semiconductor light emitting element 30 are separated from the semiconductor light emitting element 30 and covered A substantially hemispherical glove 10 with a phosphor layer having a substantially hemispherical glove 11 and a phosphor layer 16 covering the inner surface 12 of the glove 11. The phosphor layer 16 emits visible light when excited by light emitted from the semiconductor light emitting element 30. A lighting circuit (not shown) is provided in the base unit 50.

  In addition, a space 25 is provided between the semiconductor light emitting element 30 and the phosphor layer 16 of the globe 10 with the phosphor layer, and the semiconductor light emitting element 30 and the phosphor layer 16 are spaced apart. The space 25 is not a particularly sealed space but is filled with atmospheric air.

<Glove with phosphor layer>
As shown in FIG. 1, a globe 10 with a phosphor layer includes a substantially hemispherical globe 11 that covers a semiconductor light emitting element 30 disposed on a substrate 20, and a phosphor layer 16 that covers the inner surface of the globe 11. And have.

  FIG. 2 is a cross-sectional view of the glove 10 with a phosphor layer of the embodiment shown in FIG. FIG. 3 is a cross-sectional view of a glove constituting the glove 10 with a phosphor layer of the embodiment shown in FIG.

  As shown in FIG. 2 and FIG. 3, the phosphor layer-attached globe 10 includes a substantially hemispherical globe 11 and a phosphor layer 16 that covers the inner surface 12 of the globe 11. The inner surface 12 of the globe 11 is formed in an uneven shape, and the phosphor layer 16 is in close contact with the uneven shape of the inner surface 12 of the globe 11 to cover it.

  The surface shape of the outer surface 13 of the globe 11 is not particularly limited. In the LED bulb 1 shown in FIG. 1 as the first embodiment, the outer surface 13 of the globe 11 is smooth.

  The uneven shape of the inner surface 12 of the globe 11 has an arithmetic average inclination Δa of 0.25 ° or more, preferably 0.32 ° or more, and more preferably 0.32 ° to 0.36 °. The arithmetic average slope Δa of the concave-convex shape of the inner surface 12 of the globe 11 is preferably 0.25 ° or more because the adhesion between the inner surface 12 of the globe 11 and the phosphor layer 16 is good.

The arithmetic average slope Δa will be described. FIG. 4 is a diagram for explaining the arithmetic average slope Δa.
For example, when a stylus type surface shape measuring device is used and the stylus is moved in the horizontal direction while applying the stylus to the surface of the object from the vertical direction of the surface, measurement of the surface shape of the object as shown in FIG. Curve 80 is obtained. When the general formula (1) shown in FIG. 4 is applied to the measurement curve 80, the arithmetic average slope Δa is calculated. Here, in the general formula (1), ΔX is a distance in the horizontal direction of a predetermined section, and ΔYi is a distance in the height direction with respect to ΔX. In addition, it can replace with a stylus type surface shape measuring apparatus, and can also calculate arithmetic mean inclination (DELTA) a also using a non-contact-type surface shape measuring apparatus.

  When the arithmetic average inclination Δa is a large value, the minute inclination of the surface of the object is steep, and when the arithmetic average inclination Δa is a small value, the minute inclination of the object surface is gentle.

  For this reason, the arithmetic average inclination Δa of the inner surface 12 of the globe 11 being equal to or greater than 0.25 ° indicates that the minute uneven shape of the inner surface 12 of the globe 11 is steep on average. If the minute uneven shape of the inner surface 12 of the globe 11 is steep, it is assumed that the adhesion between the inner surface 12 of the globe 11 and the phosphor layer 16 is improved due to the anchor effect of the uneven shape of the inner surface 12. .

  Examples of the material of the globe 11 include polycarbonate, acrylic resin, and glass. Among these, it is preferable that the material of the globe 11 is made of a transparent resin such as polycarbonate or an acrylic resin because there is substantially no risk of the globe 11 being broken and the safety is high.

  However, the polycarbonate or acrylic resin has low adhesion to the cured silicone resin generally used as the cured transparent resin constituting the phosphor layer 16. On the other hand, in the LED bulb 1 of the embodiment, the adhesion between the inner surface 12 of the globe 11 and the phosphor layer 16 is increased by forming the inner surface 12 of the globe 11 in an uneven shape.

  The phosphor layer 16 is obtained by dispersing a phosphor in a cured transparent resin. As the transparent resin, for example, a silicone resin or an epoxy resin is used. Silicone resins are preferred because they have higher UV resistance than epoxy resins. For this reason, it is preferable that the phosphor layer 16 has the phosphor dispersed in the cured silicone resin. Among silicone resins, dimethyl silicone resin is more preferable because of its high UV resistance.

  The phosphor used for the phosphor layer 16 is not particularly limited. As the phosphor, for example, a red phosphor, a blue phosphor, a green phosphor, a yellow phosphor, a purple phosphor, an orange phosphor, or the like can be used. As the phosphor, a powdery one is usually used.

The particle size of the phosphor powder is not particularly limited. For example, the phosphor powder has an average particle diameter of preferably 1 μm or more and 100 μm or less. Here, the average particle diameter is a value measured by the Coulter counter method, it means the median D ₅₀ of the cumulative volume distribution.

  It is preferable that the fluorescent substance layer 16 is comprised in the ratio of 20-1000 mass parts of transparent resin hardened | cured materials with respect to 100 mass parts of fluorescent substance. When the ratio of the transparent resin cured product to the phosphor is within this range, the emission intensity of the phosphor layer 16 is high.

  The film thickness of the phosphor layer 16 is usually 80 μm or more and 800 μm or less, preferably 150 μm or more and 600 μm or less. When the thickness of the phosphor layer 16 is not less than 80 μm and not more than 800 μm, practical brightness can be ensured with a small amount of leakage of light such as ultraviolet light to blue light emitted from the semiconductor light emitting element. When the film thickness of the phosphor layer 16 is 150 μm or more and 600 μm or less, light emission from the phosphor layer 16 can be made brighter.

  In addition, in 1st Embodiment shown in FIG. 1, although the glove | globe 10 with a phosphor layer showed the example of a substantially hemispherical shape, the shape of the glove with a phosphor layer is not specifically limited in this invention. The shape of the globe with the phosphor layer can be various shapes other than a substantially hemispherical shape, such as a spherical shape or a cylindrical shape.

[Production method of glove with phosphor layer]
The manufacturing method of the glove with a fluorescent substance layer for LED bulbs has an uneven | corrugated formation process, an application | coating process, and a hardening process.

<Roughness formation process>
The unevenness forming step is a step of forming unevenness on the inner surface of the globe. Examples of the method of forming irregularities on the inner surface of the globe include a method of rubbing the inner surface of the globe with sandpaper or a leuter, or a method of performing shot blasting on the inner surface of the globe. Here, the luter is a pen type grinder.
As the sandpaper, those with coarse grains are # 100 to # 180.

  In the unevenness forming step, the arithmetic average inclination Δa of the inner surface of the globe is usually 0.25 ° or more, preferably 0.32 ° or more, more preferably 0.32 ° to 0.36 °. The arithmetic average slope Δa of the irregular shape on the inner surface of the globe is preferably 0.25 ° or more because the adhesion between the inner surface of the globe and the phosphor layer is good.

<Application process>
The application step is a step of applying a phosphor slurry in which a phosphor is dispersed in a transparent resin on the inner surface of the globe.
The phosphor slurry is obtained by dispersing a phosphor in a transparent resin.

  As the transparent resin, for example, a silicone resin or an epoxy resin is used. Silicone resins are preferred because they have higher UV resistance than epoxy resins. Among silicone resins, dimethyl silicone resin is more preferable because of its high UV resistance.

  The phosphor is not particularly limited. As the phosphor, for example, a red phosphor, a blue phosphor, a green phosphor, a yellow phosphor, a purple phosphor, an orange phosphor, or the like can be used. As the phosphor, a powdery one is usually used.

The particle size of the phosphor powder is not particularly limited. For example, the phosphor powder has an average particle diameter of preferably 1 μm or more and 100 μm or less. Here, the average particle diameter is a value measured by the Coulter counter method, it means the median D ₅₀ of the cumulative volume distribution.

  The phosphor slurry is preferably composed of 20 to 1000 parts by mass of a transparent resin with respect to 100 parts by mass of the phosphor. When the ratio of the transparent resin to the phosphor is within this range, the phosphor layer formed on the inner surface of the globe tends to have a high emission intensity.

  The application of the phosphor slurry is preferably performed in such a coating amount that the film thickness of the obtained phosphor layer is usually 80 μm or more and 800 μm or less, preferably 150 μm or more and 600 μm or less.

  As a method of applying the phosphor slurry to the inner surface of the globe, for example, a spray spraying method in which the phosphor slurry is sprayed on the inner surface of the globe with a spray, or the globe is immersed in a tank filled with the phosphor slurry. And a dipping method in which the phosphor slurry is applied to the inner surface of the glove, a spin coating method in which the phosphor slurry is dropped on the inner surface of the glove rotated at high speed, and a thin film of the phosphor slurry is formed by centrifugal force. In order to apply the phosphor slurry only to the inner surface of the globe by the dipping method, there is a method in which the outer surface of the globe is coated with a resist in advance, and the resist is peeled off after the phosphor slurry is applied.

<Curing process>
The curing step is a step of curing the applied phosphor slurry.
The phosphor slurry can be cured, for example, by heating to 100 ° C to 160 ° C. Examples of the method for heating the phosphor slurry include a resistance heating method using a nichrome wire or the like, a method using an infrared lamp, and the like.
When the curing step is completed, the phosphor slurry on the inner surface of the globe is cured to form a phosphor layer, and a glove with a phosphor layer is obtained.
In addition, the burr | flash may have generate | occur | produced in the fluorescent substance layer which finished the hardening process. In this case, the burrs that are unnecessary phosphor layers may be removed by cutting or the like.

  Examples are shown below, but the present invention is not construed as being limited thereto.

[Example 1]
After the phosphor film was formed on the surface of the cross-cut test resin plate that imitated the globe and the surface was roughened, a cross-cut test was performed in which the phosphor film was cut and the phosphor film was peeled off.

(Preparation of phosphor film-forming resin plate)
First, a polycarbonate plate having a smooth surface of length 100 mm × width 100 mm × thickness 2 mm was prepared. When the surface roughness of the surface of this polycarbonate plate was measured, Ra was 0.09 μm, Rz was 0.72 μm, and Δa was 0.01 °.

Next, the surface of the polycarbonate plate was rubbed with sandpaper # 100, and a minute uneven shape was imparted to the surface to prepare a resin plate for cross-cut test. When the surface roughness Ra, Rz, and Δa of the surface of the resin plate for cross-cut test were measured, they were as shown in Table 1.
On the other hand, a phosphor-containing slurry was prepared by dispersing 100 parts by mass of a phosphor having an average particle diameter D ₅₀ of 25 μm in 500 parts by mass of a silicone resin.

  After the phosphor-containing slurry is applied to the surface of the cross-cut test resin plate, the phosphor-containing slurry is formed by heat-treating the phosphor-containing slurry by heat treatment at 100 ° C. for 5 hours to form a phosphor film on the surface. Was made.

(Cross cut test)
Next, a portion of 10 mm × 10 mm in width of the phosphor film on the surface of the phosphor film-forming resin plate is cut linearly at 2 mm intervals and 2 mm intervals using a cutter, and 2 mm × horizontal A total of 25 2 × 2 square square cells were formed to produce a cross-cut test piece.
The tape was adhered to and peeled off from the phosphor film surface of the crosscut test piece, and the number of masses of the phosphor layer peeled off from the crosscut test resin plate was counted.
The measurement results are shown in Table 1.

[Comparative Example 1]
A cross-cut is performed in the same manner as in Example 1 except that a polycarbonate plate having an Ra of 0.09 μm, an Rz of 0.72 μm, and Δa of 0.01 ° is used as it is, and the phosphor-containing slurry is directly applied to the polycarbonate plate. A test piece was prepared and a cross-cut test was performed.
Table 1 shows the surface roughness Ra, Rz, and Δa of the surface of the cross-cut test resin plate, and the measurement results of the cross-cut test.
In Table 1, the numerical value in the column of the surface roughness of the resin plate for cross-cut test is the numerical value of the surface roughness of the polycarbonate plate.

[Comparative Examples 2 and 3]
Example 1 except that the surface of the polycarbonate plate was formed by embossing at the time of making the polycarbonate plate instead of the polycarbonate plate having an Ra of 0.09 μm, Rz of 0.72 μm, and Δa of 0.01 °. Then, a cross-cut test resin plate was prepared, and a cross-cut test piece was further prepared to perform a cross-cut test.
The embossing was performed in two types A and B.
The polycarbonate plate subjected to the textured processing A had a surface roughness of Ra 7.20 μm, Rz 35.50 μm, and Δa 0.20 °. This experimental example was designated as Comparative Example 2.
Further, the surface roughness of the polycarbonate plate subjected to the texture processing B was Ra 1.28 μm, Rz 7.37 μm, and Δa 0.05 °. This experimental example was designated as Comparative Example 3.
Table 1 shows the surface roughness Ra, Rz, and Δa of the surface of the cross-cut test resin plate, and the measurement results of the cross-cut test.
In Table 1, the numerical value in the column of the surface roughness of the resin plate for cross-cut test is the numerical value of the surface roughness of the polycarbonate plate subjected to the texture processing.

[Examples 2 and 3, Comparative Examples 4 to 7]
A crosscut test resin plate was prepared in the same manner as in Example 1 except that the sandpaper with the count shown in Table 1 was used in place of the sandpaper # 100, and a crosscut test piece was further prepared. A cut test was conducted.
Table 1 shows the surface roughness Ra, Rz, and Δa of the surface of the cross-cut test resin plate, and the measurement results of the cross-cut test.

[Example 4]
Instead of a polycarbonate plate, an acrylic resin plate with a smooth surface of length 100 mm × width 100 mm × thickness 2 mm was used, and the surface of this acrylic resin plate was rubbed with sandpaper # 120 to produce a crosscut test resin plate In the same manner as in Example 1, a cross-cut test piece was prepared and a cross-cut test was performed.

When the surface roughness of the surface of the acrylic resin plate before rubbing with sandpaper # 120 was measured, Ra was 0.01 μm, Rz was 0.05 μm, and Δa was 0.00 °.
Table 1 shows the surface roughness Ra, Rz, and Δa of the surface of the cross-cut test resin plate, and the measurement results of the cross-cut test.

[Comparative Example 8]
Using an acrylic resin plate with an Ra of 0.01 μm, Rz of 0.05 μm, and Δa of 0.00 ° as it is, except that the phosphor-containing slurry was directly applied to the acrylic resin plate, the same as in Example 4, A cross-cut test piece was prepared and a cross-cut test was performed.
Table 1 shows the surface roughness Ra, Rz, and Δa of the surface of the cross-cut test resin plate, and the measurement results of the cross-cut test.
In Table 1, the numerical value in the column of the surface roughness of the cross-cut test resin plate is the numerical value of the surface roughness of the acrylic resin plate.

(Evaluation about the result of Examples 1-4 and Comparative Examples 1-8)
From the results shown in Table 1, it was found that samples having an arithmetic average slope Δa of 0.25 ° or more did not peel in the cross-cut test.

[Example 5]
A hemispherical polycarbonate glove was used to roughen the inner surface with sandpaper, and then a phosphor film was formed on the inner surface of the glove. Thereafter, the natural peeling time of the phosphor film from the globe was evaluated.
FIG. 5 shows a phosphor film forming process on the globe.

  First, hemispherical polycarbonate gloves were made by blow molding. When the surface roughness of the inner surface of this glove was measured, Δa was less than 0.25 °. Specifically, Ra was 0.09 μm, Rz was 0.72 μm, and Δa was 0.01 °.

Next, the inner surface of the globe was rubbed with sandpaper # 100 to give a minute uneven shape to the surface. When the surface roughness of the inner surface of this glove was measured, Δa was 0.25 ° or more. Specifically, Ra was 4.19 μm, Rz was 26.24 μm, and Δa was 0.36 °.
On the other hand, a phosphor-containing slurry was prepared by dispersing 100 parts by mass of a phosphor having an average particle diameter D ₅₀ of 25 μm in 500 parts by mass of a silicone resin.

After applying this phosphor-containing slurry to the inner surface of the globe by spraying, the phosphor-containing slurry is cured by heat treatment at 100 ° C. for 5 hours by resistance heating using a nichrome wire, and a phosphor film is formed on the inner surface of the globe. Formed. Furthermore, in order to deburr the phosphor film, an unnecessary phosphor film was cut from the glove with phosphor film to produce a glove with phosphor film.
This glove with a phosphor film was attached to the base part on which the LED module was installed.

The degree of peeling of the phosphor film was visually observed on the day (0 day after), 1 day after production, and 1 month after production of the glove with phosphor film attached to the substrate.
In the glove with a phosphor film, peeling of the phosphor film was not observed even after one month of production.
The observation results are shown in Table 2.

[Comparative Example 9]
A phosphor film is attached in the same manner as in Example 1 except that the inner surface of the globe is not rubbed with sandpaper # 100, and the phosphor-containing slurry is applied to the inner surface of the globe by spraying on the smooth inner surface of the globe. A glove was produced and the degree of peeling of the phosphor film was visually observed.
The peeling of the phosphor film of the globe with the phosphor film was observed one day after the production.
The observation results are shown in Table 2.

(Evaluation of the results of Example 5 and Comparative Example 9)
From the results shown in Table 2, when the inner surface of the glove is rubbed with sandpaper # 100, the phosphor film does not peel off even after one month of production, but the inner surface of the glove is used with sandpaper # 100. When rubbing and rubbing, it was found that the phosphor film was peeled after one day of production. This is presumably because the silicone resin contained in the phosphor film shrinks with time and peeled off due to the stress difference from the glove.

  In addition, although several embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  According to the embodiment described above, a globe with a phosphor layer for an LED bulb, a method for manufacturing the same, and an LED bulb can be obtained in which the phosphor layer is difficult to peel off from the inner surface of the globe.

DESCRIPTION OF SYMBOLS 1 LED bulb 10 Globe 11 with phosphor layer Globe 12 Inner surface of globe 13 Outer surface of globe 16 Phosphor layer 20 Substrate 25 Space 30 between semiconductor light emitting element and phosphor layer Semiconductor light emitting element 40 Transparent resin layer 50 Base Part 60 Insulating member 70 Base 80 Measuring curve for surface shape of object

Claims (7)

A globe covering the semiconductor light emitting element disposed on the substrate;
A globe with a phosphor layer for an LED bulb having a phosphor layer covering the inner surface of the globe,
The inner surface of the globe is formed in an uneven shape,
The said fluorescent substance layer is closely_contact | adhered and coat | covered with the uneven | corrugated shape of the inner surface of the said globe, The globe with the fluorescent substance layer for LED bulbs characterized by the above-mentioned. 2. The globe with a phosphor layer for an LED bulb according to claim 1, wherein the inner surface of the globe is formed in a concavo-convex shape having an arithmetic average inclination Δa of 0.25 ° or more. The globe with a phosphor layer for an LED bulb according to claim 1 or 2, wherein the globe is made of polycarbonate or acrylic resin. The said fluorescent substance layer has fluorescent substance disperse | distributed in silicone resin hardened | cured material, The glove with the fluorescent substance layer for LED bulbs of any one of Claims 1-3 characterized by the above-mentioned. 5. A space is provided between the semiconductor light emitting element and the phosphor layer, and the semiconductor light emitting element and the phosphor layer are spaced apart from each other. The glove with a fluorescent substance layer for LED bulbs as described in an item. An irregularity forming step for forming irregularities on the inner surface of the globe;
Applying a phosphor slurry in which a phosphor is dispersed in a transparent resin on the inner surface of the globe,
A method for producing a globe with a phosphor layer for an LED bulb, comprising: a curing step of curing the applied phosphor slurry. A substrate,
A semiconductor light emitting element disposed on the substrate and emitting light;
LED bulb comprising: a globe that covers the semiconductor light emitting device; and a globe with a phosphor layer that covers an inner surface of the globe and has a phosphor layer that is excited by light emitted from the semiconductor light emitting device and emits visible light Because
The LED bulb according to claim 1, wherein the globe with a phosphor layer is a globe with a phosphor layer for an LED bulb according to claim 1.

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