JP2012049283A - Film deposition ink, film deposition method, droplet discharge device, device with film, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide film deposition ink and a film deposition method capable of forming a film having desired dimensions and excellent film quality at a desired position relatively easily, and to provide a droplet discharge device for use in the film deposition method, and a device with a film formed using the film deposition method and an electronic apparatus.SOLUTION: The film deposition ink has a film deposition material, and a liquid medium in which the film deposition material is dissolved or dispersed. The liquid medium contains a first component, and a second component having a boiling point under normal pressure higher than that of the first component under normal pressure, a melting point under normal pressure higher than that of the first component under normal pressure, and being dissolved in the first component.

Description

  The present invention relates to an ink for film formation, a film formation method, a droplet discharge device, a device with a film, and an electronic apparatus.

As a film forming method, for example, a film forming ink obtained by dissolving a film forming material in a solvent is supplied onto a substrate using a droplet discharge method, and the solvent is removed from the film forming ink on the substrate. A method of forming a film by doing so is known (for example, see Patent Document 1).
By using such a film formation method, for example, an organic layer of an organic electroluminescence (organic EL) element (for example, a light emitting layer, a hole transport layer, etc.), a colored layer of a color filter, and a conductor pattern of a wiring board are formed. can do. In addition, since such a film forming method can be patterned without using a photolithography method, there is an advantage that the manufacturing process is simplified and the amount of raw materials used is small.

However, conventional film-forming inks, when the boiling point of the solvent is increased and the drying speed is slowed, form a liquid over a long period of time from landing on the substrate to drying (solvent removal). When an external force caused by vibration of the base material or static electricity on the base material is applied, there is a problem that the film-forming ink on the base material flows into an unintended part.
Such a problem, for example, in the case of forming a light emitting layer of an organic EL or a colored portion of a color filter, causes a color mixture between adjacent light emitting layers of different colors or colored portions. Further, when forming the metal wiring of the wiring board, a short circuit between the metal wirings or a disconnection of the metal wiring is caused.

  On the other hand, when the drying speed of the conventional film-forming ink is lowered by lowering the boiling point of the solvent in the film-forming ink, the film-forming ink lands on the substrate and then is dried (solvent removal). Although the time until the above can be shortened and the above-mentioned problems can be avoided, the film cannot be spread and spread within a desired range, or the film forming materials tend to aggregate together. There was a problem that it was difficult to form a thick film.

Japanese Patent Laid-Open No. 11-54270

  An object of the present invention is to provide a film forming ink and a film forming method capable of relatively easily forming a film having an excellent film quality with a desired size at a desired position. An object of the present invention is to provide a droplet discharge device to be used, and to provide a film-equipped device and an electronic apparatus having a film formed by using such a film forming method.

Such an object is achieved by the present invention described below.
The film-forming ink of the present invention comprises a film-forming material,
A liquid medium in which the film forming material is dissolved or dispersed,
The liquid medium has a first component and a boiling point at normal pressure higher than a boiling point at normal pressure of the first component, and a melting point at normal pressure is higher than a melting point at normal pressure of the first component. And a second component that dissolves in the first component.

Thereby, since the boiling point of the first component is lower than the boiling point of the second component, the ink for film formation is applied on the substrate, and the first component is volatilized / preferentially evaporated from the ink for film formation over the second component. Can be removed. And the intermediate film (1st film | membrane) which has a film-forming material and a 2nd component as a main component can be formed.
Also, by relatively lowering the boiling point of the first component, the first component can be quickly volatilized and removed from the film-forming ink applied on the substrate.
Further, the melting point of the second component can be made higher than the environmental temperature in the ink application step, and the first film formed on the substrate can be made solid. Therefore, it is possible to prevent the film-forming ink applied on the base material from flowing into an unintended portion.

  Moreover, the 1st film | membrane on a base material can be made into a liquid state by heating more than melting | fusing point of a 2nd component, and a 2nd component can be removed in the state. Thereby, a film (second film) whose main material is the film forming material can be obtained. At that time, when the first film is made liquid, the first film can be flattened and the film forming material in the first film can be made uniform (homogenized). Therefore, a uniform film (second film) can be formed with a uniform film thickness. Moreover, since the liquid 1st film | membrane is comparatively high, it does not flow into the unintentional site | part on a base material.

In the film-forming ink of the present invention, it is preferable that the first component is a liquid at normal temperature and pressure.
Thereby, the film-forming ink can be easily applied on the base material at room temperature and normal pressure.
In the film-forming ink of the present invention, the melting point of the first component at normal pressure is preferably 0 ° C. or lower.
Thereby, the film-forming ink can be easily applied on the substrate at around room temperature.

In the film-forming ink of the present invention, the boiling point of the first component at normal pressure is preferably 40 ° C. or higher.
Thereby, when the film-forming ink is applied onto the substrate near the room temperature, the rate at which the first component is volatilized and removed from the film-forming ink can be moderately suppressed. Therefore, the film-forming ink can be appropriately wetted and spread on the substrate. Further, when the film-forming ink is applied onto the substrate by the droplet discharge method, clogging of the nozzles of the droplet discharge head can be prevented.
Further, the melting point of the second component can be made higher than room temperature. Therefore, after the first component is removed, the second component can be made solid in the vicinity of room temperature.
In the film-forming ink of the present invention, it is preferable that the second component is a solid at normal temperature and pressure.
Thereby, the 1st film | membrane (film | membrane consisting of the film-forming ink from which the 1st component was removed) formed on the base material under normal temperature normal pressure can be made into a solid state.

In the film-forming ink of the present invention, the film-forming material is preferably an organic material as a main material.
Thereby, the film-forming material can be dissolved in the liquid medium by appropriately selecting the first component and the second component.
In the film-forming ink of the present invention, it is preferable that the film-forming material is soluble in the second component.
Thereby, it can prevent that film-forming material aggregates in the 1st film | membrane formed on the base material. As a result, the obtained film (second film) can be homogenized and the thickness can be made uniform.

In the film forming ink of the present invention, the film forming material is preferably a constituent material of a color layer of a color filter or a precursor thereof.
Thereby, the colored layer of a color filter can be formed.
In the film-forming ink of the present invention, the film-forming material is preferably a constituent material of an organic layer of an organic electroluminescence element or a precursor thereof.
Thereby, the organic layer (For example, hole transport layer, hole injection layer, light emitting layer, intermediate | middle layer, etc.) of an organic electroluminescent element can be formed.

In the film forming ink of the present invention, the film forming material is preferably a constituent material of a conductor pattern of a wiring board or a precursor thereof.
Thereby, the conductor pattern of a wiring board can be formed.
The film-forming ink of the present invention is preferably used for film formation using an inkjet method.
Thereby, fine patterning can be performed relatively easily and reliably.

The film forming method of the present invention comprises a step of applying the film forming ink of the present invention on a substrate,
Removing the first component from the film-forming ink to form a solid first film mainly comprising the film-forming material and the second component;
Heating the first film to form a liquid, removing the second component from the first film in that state, and forming a second film containing the film-forming material as a main component. Features.
Thereby, a film having a uniform and uniform film thickness can be easily formed at a desired position and size.

The droplet discharge device of the present invention includes a droplet discharge head that discharges the film-forming ink of the present invention.
Thereby, a film having a uniform and uniform film thickness can be easily formed at a desired position and size.
The device with a film of the present invention is characterized by having a film formed by the film forming method of the present invention or a film obtained by processing the film.
Thereby, a device with a film having excellent reliability can be provided.
The electronic apparatus of the present invention includes the film-coated device of the present invention.
Thereby, an electronic device having excellent reliability can be provided.

It is a figure for demonstrating the film-forming method of this invention. It is a perspective view which shows schematic structure of the droplet discharge apparatus used for the film-forming method of this invention. FIG. 3 is a schematic diagram for explaining a schematic configuration of a droplet discharge head provided in the droplet discharge apparatus of FIG. 2. It is sectional drawing which shows the display apparatus provided with the light-emitting device and color filter which are examples of the device with a film | membrane of this invention. It is sectional drawing which shows an example of the light emitting element of the light-emitting device with which the display apparatus shown in FIG. 4 was equipped. It is a figure explaining the case where the film-forming method of this invention is applied to manufacture of a color filter. It is a figure explaining the case where the film-forming method of this invention is applied to manufacture of a color filter. 1 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied.

Hereinafter, preferred embodiments of the present invention will be described in detail.
(Ink for film formation)
The film-forming ink of the present invention has a film-forming material and a liquid medium in which the film-forming material is dissolved or dispersed.
In particular, in the film-forming ink of the present invention, the liquid medium has a first component, the boiling point at normal pressure being higher than the boiling point at normal pressure of the first component, and the melting point at normal pressure. The second component is higher than the melting point at normal pressure of the first component, and includes a second component dissolved in the first component.

  As will be described in detail later, such a film-forming ink becomes a target film by removing the first component and the second component after being applied onto the substrate. In particular, after the film-forming ink is applied onto the substrate, the first component is volatilized and removed preferentially over the second component. The film-forming ink from which the first component is removed and the second component remains is solid. In addition, the film-forming ink from which the first component has been removed and the second component remains is liquefied by heating, and the second component is removed by drying under reduced pressure in this state. Thus, the target film | membrane or its precursor film | membrane can be obtained by removing a 1st component and a 2nd component from the film-forming ink.

Hereinafter, each component of the film-forming ink of the present invention will be described in detail.
(Deposition material)
The film forming material contained in the film forming ink of the present invention is a constituent material of a film to be formed or a precursor thereof.
Such a film forming material is determined according to the type of film to be formed, and is not particularly limited, and various organic materials and various inorganic materials can be used. For example, as a film forming material, a constituent material of each layer (particularly an organic layer) of an organic electroluminescence (organic EL) element or a precursor thereof, a constituent material of a colored layer of a color filter or a precursor thereof, a conductor pattern of a wiring board Constituent materials or their precursors may be mentioned.

  As described above, the color filter color layer can be formed by using the film forming material as a constituent material of the color filter color layer or a precursor thereof. Moreover, the conductor pattern of a wiring board can be formed by making the said film-forming material into the constituent material of the conductor pattern of a wiring board, or its precursor. Furthermore, by using the film-forming material as a constituent material of an organic layer of an organic electroluminescence element or a precursor thereof, an organic layer of the organic electroluminescence element (for example, a hole transport layer, a hole injection layer, a light emitting layer, an intermediate layer) Layer, etc.) can be formed. These materials will be described later in detail.

Further, as the film forming material, for example, two or more kinds of components selected from the above may be used in combination.
When the film-forming material is an organic material as a main material, the film-forming material can be dissolved in the liquid medium by appropriately selecting the first component and the second component.
On the other hand, when the film-forming material contains an inorganic material, or when the film-forming material is an organic material but is insoluble in the liquid medium, the film-forming material may be dispersed in the liquid medium. .

  In the film-forming ink, the film-forming material may be dissolved or dispersed in the liquid medium described later, but the film-forming material is contained in the liquid medium. When the film is dispersed, the average particle diameter of the film forming material is preferably 20 to 100 nm, and more preferably 5 to 50 nm. Thereby, the dispersion stability of the film forming material in the film forming ink can be made excellent.

  The content of the film forming material in the film forming ink is determined according to the use of the film forming ink, and is not particularly limited. For example, the content is preferably 0.01 to 10 wt%. It is more preferable that it is 05-5 wt%. When the content of the film forming material is within the above range, the discharge property (discharge stability) from the film forming droplet discharge head (inkjet head) can be made particularly excellent.

(Liquid medium)
The liquid medium contained in the film-forming ink of the present invention is one that dissolves or disperses the film-forming material described above, that is, a solvent or a dispersion medium. Most of the liquid medium is removed in the film forming process described later.
In particular, the liquid medium contained in the film-forming ink of the present invention has a boiling point at normal pressure (hereinafter also simply referred to as “boiling point”) higher than the boiling point at normal pressure of the first component, and And a second component that is soluble in the first component and has a melting point at a pressure (hereinafter also referred to simply as “melting point”) higher than the melting point of the first component at normal pressure.

The first component and the second component have the relationship between the boiling point and the melting point as described above, and are not particularly limited as long as the film-forming ink can dissolve or disperse the film-forming material. Alternatively, various dispersion media can be used.
In the present specification, “normal pressure” refers to a pressure equal to the atmospheric pressure, specifically 10 ⁵ Pa.

As the liquid medium, an optimum medium can be selected and used according to the type of film forming material and the purpose of the film to be formed.
In addition, it is preferable to use a liquid medium that has as little attack as possible to the film forming material and other components contained in the film forming ink.
Further, when there is a possibility that the liquid medium may remain in the film after film formation, it is preferable to use a liquid medium that does not hinder the characteristics according to the use of the film as much as possible. For example, when the film-forming ink is used for forming the organic layer of the organic EL element, it is preferable to select each component of the liquid medium in consideration of electrical characteristics. Further, when the film-forming ink is used for forming a colored layer of a color filter, it is preferable to select each component of the liquid medium in consideration of optical characteristics.

Hereinafter, the first component and the second component will be described in detail.
[First component]
The first component contained in the liquid medium is in a liquid state in an environment in which the film-forming ink is applied to the substrate as described in detail later (under the temperature and pressure in the ink application process).
The first component has a boiling point lower than that of the second component, which will be described later, and the melting point at normal pressure is lower than the melting point of the second component under normal pressure. (Preferably both the second component and the film forming material) are dissolved.

  The first component is not particularly limited. For example, benzene (Benzene, boiling point 80.1 ° C, melting point 5.5 ° C), toluene (Toluene, boiling point 110.6 ° C, melting point -93 ° C), o-xylene (o-Xylene) (p-, m-), boiling point 144 ° C, melting point -25 ° C), trimethylbenzene (trimethylbenzene, boiling point 165 ° C, melting point -45 ° C), tetralin (Tetralin, boiling point 208 ° C, melting point -35.8 ° C), 3-phenoxy Toluene (3-phenoxytoluene, boiling point 273 ° C, melting point-° C), cyclohexylbenzene (cyclohexylbenzene, boiling point 237.5 ° C, melting point 5 ° C), 1,4-dichlorobenzene (1,4-dchlorobenzene, boiling point 174 ° C, melting point 53.5 ° C) 1,2,3-Trichlorobenzene (1,2,3-Trichlorobenzene, boiling point 221 ° C, melting point 52.6 ° C), tetrahydrofuran (Tetrahydrofuran, boiling point 66 ° C, melting point -108.5 ° C), diethyl ether (boiling point 35 ° C) , Melting point -116 ℃), Diisopropyl ether (Diisopr opyl ether, boiling point 69 ℃, melting point -85.6 ℃), ethylene glycol (ethylene glycol boiling point 197.3 ℃, melting point -12.9 ℃), ethylene glycol diethyl ether (both 190 ℃, melting point -44.3 ℃), dioxane (Dioxane, boiling point 101.1 ° C, melting point 11.8 ° C), anisole (methoxybenzene: Anisole, boiling point 154 ° C, melting point -37 ° C), dichloromethane (dichloromethane, boiling point 40 ° C, melting point -96.7 ° C), trichloromethane (boiling point 61.2) ℃, melting point -64 ℃), carbon tetrachloride (tetrachloromethane, boiling point 76.7 ℃, melting point -28.6 ℃), pentane (pentane, boiling point 36 ℃, melting point -131 ℃), hexane (Hexane, boiling point 69 ℃, melting point- 95 ° C), cyclohexane (cyclohexane, boiling point 81 ° C, melting point 7 ° C), acetone (Acetone, boiling point 56.5 ° C, melting point -94 ° C), 1-methyl-2-pyrrolidinone (NMP: 1-Methyl-2-pyrrolidinone, boiling point) 204 ° C, melting point -24 ° C ), Methylethylketone (boiling point 79.6 ° C, melting point -86 ° C), alpha-tetralone (both 257 ° C, melting point 7 ° C), cyclohexanone (Cyclohexanone, boiling point 157 ° C, melting point -45 ° C), ethyl acetate ( ethyl acetate, boiling point 77.1 ℃, melting point -83.6 ℃, butyl acetate (butyl acetate, boiling point 126 ℃, melting point -74 ℃), methanol (methanol, boiling point 67 ℃, melting point -97 ℃), ethanol (ethanol, boiling point 78.4 ℃) , Melting point -114.3 ° C), isopropyl alcohol (boiling point 82.4 ° C, melting point -89.5 ° C), 1-propanol (1-Propanol, boiling point 97.15 ° C, melting point -126.5 ° C), acetonitrile (acetonitrile, boiling point 82 ° C, melting point) -45 ° C), N, N-dimethylformamide (DMF: N, N-dimethylformamide, boiling point 153 ° C, melting point -61 ° C), N, N-dimethylacetamide (DMAc: N, N-Dimethylacetamide, boiling point 165 ° C, melting point) -20 ° C), 1,3-di Examples include til-2-imidazolidinone (1,3-dimethyl-2-imidazolidinone, boiling point 220 ° C., melting point 8 ° C.), dimethyl sulfoxide (boiling point 189 ° C., melting point 18.5 ° C.), etc. Species or a combination of two or more can be used.

Moreover, it is preferable that the first component is a liquid at normal temperature and pressure. Thereby, the film-forming ink can be easily applied on the base material at room temperature and normal pressure. In the present specification, “normal temperature” refers to a range of 20 ° C. ± 15 ° C. (that is, 5 ° C. or more and 35 ° C. or less).
The melting point (or freezing point) of the first component at normal pressure is preferably 0 ° C. or lower. In other words, the first component is preferably a compound that exhibits a liquid state when present alone at normal pressure and a temperature higher than 0 ° C. Thereby, the film-forming ink can be easily applied on the substrate at around room temperature.

  The boiling point of the first component at normal pressure is preferably 40 ° C. or higher. In other words, the first component is preferably a compound that exhibits a liquid state at normal pressure and a temperature lower than 40 ° C. Thereby, when the film-forming ink is applied onto the substrate near the room temperature, the rate at which the first component is volatilized and removed from the film-forming ink can be moderately suppressed. Therefore, the film-forming ink can be appropriately wetted and spread on the substrate. Further, when the film-forming ink is applied onto the substrate by the droplet discharge method, clogging of the nozzles of the droplet discharge head can be prevented.

Moreover, since the boiling point of the second component is higher than the boiling point of the first component and the melting point of the second component is higher than the melting point of the first component, the boiling point of the first component at normal pressure is When it is 40 ° C. or higher, the melting point of the second component can be made higher than room temperature. Therefore, after the first component is removed, the second component can be made solid in the vicinity of room temperature.
In addition, the boiling point of the first component at normal pressure is preferably 160 ° C. or lower, and more preferably 120 ° C. or lower. As a result, the first component can be volatilized relatively quickly from the ink for film formation even under normal temperature and pressure.

The content of the first component in the liquid medium is preferably 10 wt% or more and 60 wt% or less, more preferably 10 wt% or more and 50 wt% or less, and more preferably 10 wt% or more and 40 wt% or less. Further preferred. Thereby, the volatilization of the first component from the film-forming ink can be made rapid, and the viscosity of the film-forming ink before removing the first component can be made suitable for droplet ejection.
On the other hand, when the content is less than the lower limit, it is difficult to make the film-forming ink suitable for droplet discharge depending on the types of the film-forming material, the first component, the second component, and the like. . On the other hand, when the content exceeds the upper limit, it is difficult to quickly remove the first component from the film-forming ink, depending on the types of the film-forming material, the first component, the second component, and the like.

[Second component]
The second component has a boiling point at normal pressure that is higher than the boiling point at normal pressure of the first component and a melting point at normal pressure that is higher than the melting point at normal pressure of the first component. It dissolves in one component.
The second component is liquid in a state where the first component is dissolved, and is in a solid state alone or coexisting with the film forming material.

  Such a second component is not particularly limited. For example, 4-tert-butylanisole (4-tert-Butylanisole, boiling point 222 ° C., melting point 18 ° C.), Trans-anethole (Trans-Anethole, boiling point 235 ° C., Melting point 20 ° C), 1,2-dimethoxybenzene (1,2-Dimethoxybenzene, boiling point 206.7 ° C, melting point 22.5 ° C), 2-methoxybiphenyl (2-Methoxybiphenyl, boiling point 274 ° C, melting point 28 ° C), phenyl ether , Boiling point 258.3 ° C., melting point 28 ° C.), 2-ethoxynaphthalene (2-Ethoxynaphthalene, boiling point 282 ° C., melting point 35 ° C.), benzyl phenyl ether (Benzyl Phenyl Ether, boiling point 288 ° C., melting point 39 ° C.), 2,6-dimethoxy Toluene (2,6-Dimethoxytoluene, boiling point 222 ° C, melting point 39 ° C), 2-propoxynaphthalene (2-Propoxynaphthalene, boiling point 305 ° C, melting point 40 ° C), 1,2,3-trimethoxybenzene (1,2,3 -Trimethoxybenzene, boiling point 235 ℃, melting point 45 ℃), 4- dichlorobenzene (l, 4-dichlorobenzene, boiling point 174 ° C., a melting point 53.5 ° C.), and the like, can be used singly or in combination of two or more of them.

In addition, when the liquid medium dissolves the film forming material, the second component is preferably one that dissolves the film forming material described above. That is, it is preferable that the film forming material is soluble in the second component. Thereby, it can prevent that film-forming material aggregates in the 1st film | membrane formed on the base material. As a result, the obtained film (second film) can be homogenized and the thickness can be made uniform.
Moreover, when the said 2nd component exists independently, it is preferable to make a solid form at normal temperature normal pressure. As a result, the first film formed on the base material (the film made of the film-forming ink from which the first component is removed (mainly made of the film-forming material and the second component)) is made solid at room temperature and normal pressure. can do.

The content of the second component in the liquid medium is preferably 40 wt% or more and 90 wt% or less, more preferably 50 wt% or more and 90 wt% or less, and 60 wt% or more and 90 wt% or less. Further preferred. As a result, the content of the first component is suppressed, the volatilization of the first component from the film-forming ink is accelerated, and the viscosity of the film-forming ink before the first component is removed is ejected by droplets. It can be suitable for.
On the other hand, when the content is less than the lower limit, it is difficult to quickly remove the first component from the film-forming ink depending on the types of the film-forming material, the first component, the second component, and the like. On the other hand, when the content exceeds the upper limit, it is difficult to make the film-forming ink suitable for droplet discharge depending on the types of the film-forming material, the first component, the second component, and the like.

The melting point of the second component may be any as long as it has the above-described relationship with the melting point of the first component, but is preferably 20 ° C. or higher, more preferably 30 ° C. or higher. Thereby, after the first component is removed, the second component (the one obtained by removing the first component from the film-forming ink) can be made solid in the vicinity of room temperature.
In addition, the melting point of the second component is preferably 60 ° C. or lower, and more preferably 40 ° C. or lower. Thereby, when the film | membrane which uses a film-forming material and a 2nd component as a main material is liquefied by heating, the heating temperature can be made comparatively low. Therefore, deterioration, deterioration, or the like of the film forming material due to the heating can be prevented or suppressed.

Further, the boiling point of the second component may be any as long as it has the above-described relationship with respect to the boiling point of the first component, but is preferably 120 ° C. or higher, more preferably 160 ° C. or higher, More preferably, it is 200 ° C. or higher. Thereby, unintentional volatilization of the 2nd component in the ink provision process mentioned later can be controlled or prevented.
The liquid medium as described above may contain components other than the first component and the second component described above.

The film forming ink as described above is used for film formation using an ink jet method (droplet discharge method) as described later. According to the inkjet method, fine patterning can be performed relatively easily and reliably.
Therefore, such a film-forming ink forms a liquid in an ink application step [1] described later.
The viscosity of such a film-forming ink is not particularly limited, but is preferably about 3 cP or more and 20 cP or less.

(Film formation method)
Next, the film forming method using the film forming ink described above, that is, the film forming method of the present invention will be described.
FIG. 1 is a diagram for explaining a film forming method of the present invention, FIG. 2 is a perspective view showing a schematic configuration of a droplet discharge device used in the film forming method of the present invention, and FIG. 3 is a droplet of FIG. It is a schematic diagram for demonstrating schematic structure of the droplet discharge head with which an discharge apparatus is provided.

The film forming method (film manufacturing method) of the present invention includes: [1] a step of applying the above-described film forming ink onto a substrate (ink applying step); and [2] the first from the film forming ink. Removing a component to form a solid first film mainly composed of the film forming material and the second component (first drying process); and [3] heating the first film. Forming a second film containing the film-forming material as a main component by removing the second component from the first film and making it liquid (second drying process).
Thereby, a film having a uniform and uniform film thickness can be easily formed at a desired position and size.

Hereafter, each process of the film-forming method of this invention is demonstrated in detail sequentially.
[1] Ink application process 1-1
First, as shown in FIG. 1A, a base material 15 is prepared.
The base material 15 is an object on which a film intended for film formation is formed, and is not particularly limited. For example, various substrates, or various substrates processed or processed can be used. .

1-2
Next, as illustrated in FIG. 1B, the film-forming ink 1 that is the film-forming ink described above is supplied onto the base material 15. Thereby, a film 1 </ b> A made of the film-forming ink 1 is formed on the base material 15.
In the present embodiment, the film-forming ink 1 is supplied onto the substrate 15 by a droplet discharge method. That is, the film forming ink 1 is discharged as droplets using a droplet discharge device that discharges the film forming ink, and the film forming ink 1 is supplied onto the substrate 15. Thereby, a film having a uniform and uniform film thickness can be easily formed at a desired position and size.

Here, a preferred embodiment of such a droplet discharge device will be described.
2 is a perspective view showing a schematic configuration of a droplet discharge device used in the film forming method of the present invention, and FIG. 3 is a diagram for explaining a schematic configuration of a droplet discharge head provided in the droplet discharge device of FIG. FIG.
As shown in FIG. 2, the droplet discharge device 100 includes a droplet discharge head (inkjet head; hereinafter simply referred to as a head) 110, a base 130, a table 140, an ink reservoir (not shown), Table positioning means 170, head positioning means 180, and control device 190 are provided.

The base 130 is a table that supports each component of the droplet discharge device 100 such as the table 140, the table positioning unit 170, and the head positioning unit 180.
The table 140 is installed on the base 130 via the table positioning means 170. The table 140 is for placing the base material 15 thereon.
A rubber heater (not shown) is disposed on the back surface of the table 140. The base material 15 placed on the table 140 can be heated to a predetermined temperature by a rubber heater on the entire upper surface.

The table positioning unit 170 includes a first moving unit 171 and a motor 172. The table positioning means 170 determines the position of the table 140 in the base 130, and thereby determines the position of the base material 15 in the base 130.
The first moving means 171 has two rails provided substantially parallel to the Y direction and a support base that moves on the rails. The support base of the first moving means 171 supports the table 140 via the motor 172. Then, as the support base moves on the rail, the table 140 on which the base material 15 is placed is moved and positioned in the Y direction.

The motor 172 supports the table 140 and swings and positions the table 140 in the θz direction.
The head positioning unit 180 includes a second moving unit 181, a linear motor 182, and motors 183, 184 and 185. The head positioning unit 180 determines the position of the head 110.

  The second moving means 181 is provided with two support pillars standing from the base 130, a support base provided between the support pillars, the rail support having two rails, and the rails. And a support member (not shown) for supporting the head 110. Then, as the support member moves along the rail, the head 110 is moved and positioned in the X direction.

The linear motor 182 is provided in the vicinity of the support member, and can move and position the head 110 in the Z direction.
Motors 183, 184, and 185 swing and position the head 110 in the α, β, and γ directions, respectively.
By the table positioning unit 170 and the head positioning unit 180 as described above, the droplet discharge device 100 accurately determines the relative position and posture of the ink discharge surface 115P of the head 110 and the base material 15 on the table 140. Can be controlled.

  As shown in FIG. 3, the head 110 ejects the film-forming ink 1 from a nozzle (projection) 118 by an ink jet method (droplet ejection method). In the present embodiment, the head 110 uses a piezo method in which ink is ejected using a piezo element 113 as a piezoelectric element. The piezo method has an advantage that the composition of the material is not affected because no heat is applied to the film-forming ink 1.

The head 110 has a head body 111, a diaphragm 112, and a piezo element 113.
The head main body 111 has a main body 114 and a nozzle plate 115 on the lower end surface thereof. Then, the main body 114 is sandwiched between the plate-like nozzle plate 115 and the vibration plate 112, whereby a reservoir 116 as a space and a plurality of ink chambers 117 branched from the reservoir 116 are formed.

The film forming ink 1 is supplied to the reservoir 116 from an ink storage unit 150 described later. The reservoir 116 forms a flow path for supplying the film forming ink 1 to each ink chamber 117.
The nozzle plate 115 is attached to the lower end surface of the main body 114 and constitutes an ink ejection surface 115P. In the nozzle plate 115, a plurality of nozzles 118 that discharge the film-forming ink 1 are opened corresponding to the ink chambers 117. An ink flow path is formed from each ink chamber 117 toward the corresponding nozzle (ejection unit) 118.

The diaphragm 112 is attached to the upper end surface of the head body 111 and constitutes the wall surface of each ink chamber 117. The diaphragm 112 can vibrate according to the vibration of the piezo element 113.
The piezo element 113 is provided corresponding to each ink chamber 117 on the opposite side of the vibration plate 112 from the head body 111. The piezoelectric element 113 is obtained by sandwiching a piezoelectric material such as quartz with a pair of electrodes (not shown). The pair of electrodes is connected to the drive circuit 191.

  When an electric signal is input from the drive circuit 191 to the piezo element 113, the piezo element 113 is expanded or contracted. When the piezo element 113 contracts and deforms, the pressure in the ink chamber 117 decreases, and the film-forming ink 1 flows from the reservoir 116 into the ink chamber 117. Further, when the piezo element 113 expands and deforms, the pressure in the ink chamber 117 increases and the film-forming ink 1 is ejected from the nozzle 118. Note that the amount of deformation of the piezo element 113 can be controlled by changing the applied voltage. Further, the deformation speed of the piezo element 113 can be controlled by changing the frequency of the applied voltage. That is, by controlling the voltage applied to the piezo element 113, the ejection conditions of the film-forming ink 1 can be controlled.

The control device 190 controls each part of the droplet discharge device 100. For example, the discharge voltage of the film-forming ink 1 is controlled by adjusting the waveform of the applied voltage generated by the drive circuit 191, or the film is formed on the substrate 15 by controlling the head positioning unit 180 and the table positioning unit 170. For example, the ejection position of the ink 1 is controlled.
An ink storage unit (not shown) stores the film-forming ink 1.
As shown in FIG. 3, the ink reservoir (not shown) is connected to the head 110 (reservoir 116) via a transport path (not shown).

Using the droplet discharge device 100 as described above, a desired amount of the film-forming ink 1 can be applied to a desired position on the substrate 15.
The temperature and pressure of the atmosphere in the ink application step [1] are determined according to the composition of the film-forming ink 1 and the boiling points and melting points of the first component and the second component, respectively. Although it will not specifically limit if the ink 1 for film-forming can be applied on it, It is preferable that it is normal temperature normal pressure. Therefore, it is preferable to use the film-forming ink 1 capable of applying the film-forming ink 1 on the base material 15 at normal temperature and pressure. Thereby, the ink application process [1] can be easily performed.

[2] First drying step 2-2
Next, by removing the first component from the film 1A (film-forming ink 1) formed on the substrate 15, as shown in FIG. 1C, a film (first film) is formed as an intermediate film. 10B is formed.
In the first drying step [2], since the boiling point of the first component is lower than the boiling point of the second component, the first component is removed from the film 1A (film-forming ink 1) on the substrate 15 more than the second component. It can be volatilized and removed preferentially. Then, the film 1B can be formed as an intermediate film mainly composed of the film forming material and the second component.

Further, by making the boiling point of the first component relatively low, the first component can be quickly volatilized and removed from the film 1A (film-forming ink 1) on the substrate 15.
In addition, since the melting point (freezing point) of the first component is higher than the melting point (freezing point) of the second component, the film 1B formed on the substrate 15 can be made solid. Therefore, even when external force due to vibration of the base material 15 or static electricity on the base material 15 is received, the film-forming ink 1 applied on the base material 15 can be prevented from flowing into an unintentional portion. it can.

  The temperature and pressure of the atmosphere in the first drying step [2] are determined according to the composition of the film-forming ink 1 and the boiling points and melting points of the first component and the second component, respectively. Although it will not specifically limit if the 1st component can be removed from this film | membrane 1A, It is preferable that it is normal temperature normal pressure. Therefore, it is preferable to use the film-forming ink 1 capable of removing the first component from the film 1A on the base material 15 under normal temperature and pressure. Thereby, a 1st drying process [2] can be performed easily. In this case, the first component can be removed from the film 1A on the substrate 15 almost simultaneously with the ink application step [1] described above.

In addition, evaporation (removal) of the first component can be promoted by heating the base material 15 with the rubber heater provided on the table 140 of the droplet discharge device 100 described above. In that case, the heating temperature of the base material 15 is determined according to the boiling points and melting points of the first component and the second component.
The time required for removing the first component is determined according to the composition of the film-forming ink 1 and the boiling points and melting points of the first component and the second component, and is not particularly limited. It is preferably 90 seconds or less.
In this step, if the film 1A becomes the solidified film 1B, it is not necessary to remove all of the first component in the film 1A, and a part of the first component may remain in the film 1B. .

[3] Second drying step 3-1.
Next, the film 1B is melted by heating to obtain a liquid film 1C as shown in FIG.
This heating is not particularly limited, but can be performed with a hot plate or infrared rays. Further, this heating may be performed by a rubber heater provided on the table 140 of the droplet discharge device 100 described above.

The heating temperature is not particularly limited as long as the second component in the film 1B is melted. Specifically, the film 1B may be heated to a temperature equal to or higher than the melting point of the second component. It is preferably about 5 to 30 ° C. higher than that.
Further, the heating time is not particularly limited as long as the second component in the film 1B is melted, but it is about 1 minute to 30 minutes.
In the film 1C formed in this way, the second component is in a liquid state, so that flattening is achieved and uniform deposition of the film forming material in the film 1C is achieved.

3-2
Then, by removing the second component from the film 1C (that is, the film 1B in a liquid state), as shown in FIG. 1E, a film 1D containing a film forming material as a main component is obtained.
The removal of the second component is not particularly limited, but is preferably performed under reduced pressure. Thereby, a 2nd component can be removed rapidly. In this case, for example, a vacuum dryer with a heater may be used.
As described above, when the pressure is reduced, the pressure is not particularly limited, but is preferably about 10 ⁰ Pa or more and 10 ⁻⁷ Pa or less.
Moreover, the time of the said pressure reduction is although it does not specifically limit, It is preferable that it is about 1 minute or more and 30 minutes or less.

  In this way, the second component can be removed from the liquid state film 1C. Thereby, the film | membrane (2nd film | membrane) 10 which used the film-forming material as the main material can be obtained. At this time, as described above, the film 1D is formed such that the film 1C, which has been flattened and made uniform in film forming material, maintains its state. Therefore, a uniform film 1D can be obtained with a uniform film thickness. Further, since the liquid film 1C has a relatively high viscosity, it does not flow into an unintentional part on the substrate 15.

The film 1D thus obtained is made of a constituent material of the film intended for film formation or a precursor thereof.
When a precursor is used as the film forming material, the film 1D is subjected to a predetermined process as necessary. For example, when the film forming material is a low molecular weight compound, a film containing a high molecular weight compound can be obtained by performing a treatment that causes a polymerization reaction of the low molecular weight compound. In addition, when the film forming material is a resin material, a film including a high molecular weight compound can be obtained by performing a treatment that causes a crosslinking reaction of the resin material. When the film forming material includes metal particles and a binder (resin material), a film made of metal can be obtained by subjecting the film 1D to baking treatment.

As described above, according to the film forming method of the present invention, since the boiling point of the first component is lower than the boiling point of the second component, the film forming ink 1 is applied on the substrate 15 and the film forming ink is applied. 1 (liquid film 1A) can volatilize and remove the first component preferentially over the second component. Then, the film 1B, which is an intermediate film mainly composed of the film forming material and the second component, can be formed.
Further, by making the boiling point of the first component relatively low, the first component can be quickly volatilized and removed from the film-forming ink 1 (film 1A) applied on the substrate 15.
Further, since the melting point (freezing point) of the first component is higher than the melting point (freezing point) of the second component, the film 1A formed on the substrate 15 may be made solid (referred to as a solid film 1B). it can. Therefore, it is possible to prevent the film-forming ink 1 applied on the base material 15 from flowing into an unintentional portion.

Further, the film 1B on the substrate 15 is heated to a temperature equal to or higher than the melting point of the second component, so that the second component can be removed in that state. As a result, a film 1D whose main material is a film forming material can be obtained. At that time, when the film 1B is a liquid film 1C, the film 1C can be flattened and the film forming material in the film 1C can be made uniform (homogenized). Therefore, a uniform film 1D can be formed with a uniform film thickness. Further, since the liquid film 1C has a relatively high viscosity, it does not flow into an unintentional part on the substrate 15.
For this reason, according to the film forming ink and film forming method of the present invention, it is possible to relatively easily form a film 1D having an excellent film quality with a desired size at a desired position.

(Display device)
Next, the device with a film of the present invention will be described.
4 is a cross-sectional view illustrating a light emitting device and a display device including a color filter as an example of a film-coated device of the present invention, and FIG. 5 illustrates an example of a light emitting element of the light emitting device included in the display device illustrated in FIG. It is sectional drawing shown. In the following description, for convenience of explanation, the upper side in FIGS. 4 and 5 is described as “upper” and the lower side is described as “lower”.

A display device 300 illustrated in FIG. 4 includes a light emitting device 101 including a plurality of light emitting elements 200R, 200G, and 200B, and a color including colored layers 19R, 19G, and 19B provided corresponding to the light emitting elements 200R, 200G, and 200B. And a filter 102.
Such a display device 300 includes a plurality of light emitting elements 200R, 200G, and 200B and a plurality of colored layers 19R, 19G, and 19B corresponding to the sub-pixels 300R, 300G, and 300B, and constitutes a top emission display panel. is doing.
In the present embodiment, an example in which an active matrix method is employed as a display device driving method will be described. However, a passive matrix method may be employed.

The light emitting device 101 includes a substrate 21, a plurality of light emitting elements 200R, 200G, and 200B, and a plurality of switching elements 24.
The substrate 21 supports the plurality of light emitting elements 200R, 200G, 200B and the plurality of switching elements 24. Each of the light emitting elements 200R, 200G, and 200B of the present embodiment has a configuration (top emission type) that extracts light from the side opposite to the substrate 21. Accordingly, the substrate 21 can be either a transparent substrate or an opaque substrate. In addition, when each light emitting element 200R, 200G, 200B is the structure which takes out light from the board | substrate 21 side (bottom emission type), the board | substrate 21 shall be substantially transparent (colorless transparent, colored transparent, or translucent). The

  Examples of the constituent material of the substrate 21 include resin materials such as polyethylene terephthalate, polyethylene naphthalate, polypropylene, cycloolefin polymer, polyamide, polyethersulfone, polymethyl methacrylate, polycarbonate, and polyarylate, quartz glass, and soda glass. Such glass materials can be used, and one or more of these can be used in combination.

Examples of the opaque substrate include a substrate made of a ceramic material such as alumina, an oxide film (insulating film) formed on the surface of a metal substrate such as stainless steel, and a substrate made of a resin material. It is done.
Although the average thickness of such a board | substrate 21 is not specifically limited, It is preferable that it is about 0.1-30 mm, and it is more preferable that it is about 0.1-10 mm.

On such a substrate 21, a plurality of switching elements 24 are arranged in a matrix.
Each switching element 24 is provided corresponding to each light emitting element 200R, 200G, 200B, and is a driving transistor for driving each light emitting element 200R, 200G, 200B.
Each switching element 24 includes a semiconductor layer 241 made of silicon, a gate insulating layer 242 formed on the semiconductor layer 241, a gate electrode 243 formed on the gate insulating layer 242, a source electrode 244, And a drain electrode 245.

A planarizing layer 22 made of an insulating material is formed so as to cover the plurality of switching elements 24.
On the planarization layer 22, light emitting elements 200 </ b> R, 200 </ b> G, and 200 </ b> B are provided corresponding to the switching elements 24.
In the light emitting element 200R, a reflective film 32, a corrosion preventing film 33, an anode 3, a laminate (organic EL light emitting unit) 14 (14R), a cathode 12, and a cathode cover 34 are laminated in this order on the planarization layer 22. . In the present embodiment, the anode 3 of each of the light emitting elements 200R, 200G, and 200B constitutes a pixel electrode, and is electrically connected to the drain electrode 245 of each switching element 24 by a conductive portion (wiring) 27. Moreover, the cathode 12 of each light emitting element 200R, 200G, 200B is a common electrode.

The light emitting elements 200G and 200B can be configured in the same manner as the light emitting element 200R. Note that the light emitting elements 200R, 200G, and 200B may have the same configuration or different configurations. For example, the stacked bodies 14R, 14G, and 14B of the light emitting elements 200R, 200G, and 200B may have the same configuration or different configurations. However, when the laminates 14R, 14G, and 14B have different configurations (particularly when the configuration of the light-emitting layer is different), the effect of applying the film-forming ink and film-forming method of the present invention becomes significant.
A partition wall 31 is provided between the adjacent light emitting elements 200R, 200G, and 200B.

The color filter 102 is bonded to the light emitting device 101 configured as described above via a resin layer 35 formed of a thermosetting resin such as an epoxy resin.
The color filter 102 includes a substrate 20, a plurality of colored layers 19 </ b> R, 19 </ b> G, and 19 </ b> B, and a light shielding layer (partition wall) 36.
The substrate (sealing substrate) 20 supports the colored layers 19R, 19G, and 19B and the partition walls 36. As described above, since each of the light emitting elements 200R, 200G, and 200B of this embodiment is a top emission type, a transparent substrate is used as the substrate 20.
The constituent material of the substrate 20 is not particularly limited as long as the substrate 20 has a light transmitting property, and the same constituent material as that of the substrate 20 described above can be used.

The colored layers 19R, 19G, and 19B are provided corresponding to the light emitting elements 200R, 200G, and 200B.
The colored layer 19R is a filter unit that converts the light WR from the light emitting element 200R into red. The colored layer 19G is a filter unit that converts WG from the light emitting element 200G into green. The colored layer 19B is a filter unit that converts light WB from the light emitting element 200B into blue. A full color image can be displayed by using such colored layers 19R, 19G, and 19B in combination with the light emitting elements 200R, 200G, and 200B.

Each of the colored layers 19R, 19G, and 19B includes a colorant corresponding to the color described above. The colored layers 19R, 19G, and 19B may each include a resin material in addition to the colorant.
Such colored layers 19R, 19G, and 19B can be formed by the film forming method as described above. In that case, the above-described colorant, resin material, and the like are included as the film forming material of the film forming ink. The method for manufacturing the color filter 102 will be described in detail later.
A partition wall 36 is formed between the adjacent colored layers 19R, 19G, and 19B.
The partition wall 36 has a function of preventing unintended subpixels 300R, 300G, and 300B from emitting light. Further, as will be described in detail later, when the color filter 102 is manufactured by the droplet discharge method, the partition wall 36 has a function of blocking ink.

(Light emitting element)
Here, the light emitting elements 200R, 200G, and 200B will be described in detail with reference to FIG. Hereinafter, the light-emitting element 200R will be described as a representative, the light-emitting elements 200G and 200B will be described with a focus on differences from the light-emitting element 200R, and descriptions of the same matters as the light-emitting element 200R will be omitted. To do.

A light emitting element (electroluminescent element) 200R shown in FIG. 5 emits light of substantially white by emitting three light emitting layers of R (red), G (green), and B (blue) having different emission spectra from each other. It is.
In such a light emitting element 200R, as described above, the laminate 14 is interposed between the two electrodes (between the anode 3 and the cathode 12). As shown in FIG. From the anode 3 side to the cathode 12 side, the hole injection layer 4, the hole transport layer 5, the first light emitting layer (red light emitting layer) 6, the first intermediate layer 7A, and the second light emitting layer (blue light emitting layer). 8, the second intermediate layer 7B, the third light emitting layer (green light emitting layer) 9, the electron transport layer 10 and the electron injection layer 11 are laminated in this order.

In other words, the light emitting element 200R includes the anode 3, the hole injection layer 4, the hole transport layer 5, the red light emitting layer 6, the first intermediate layer 7A, the blue light emitting layer 8, the second intermediate layer 7B, and the green light emitting element. The layer 9, the electron transport layer 10, the electron injection layer 11, and the cathode 12 are laminated in this order.
In the present embodiment, a reflective film 32 and a corrosion prevention film 33 are provided between the anode 3 and the planarization layer 22, and a cathode cover (sealing) is provided on the opposite side of the cathode 12 from the laminate 14. Layer) 34 is provided.

In such a light emitting element 200R, electrons are supplied (injected) from the cathode 12 side to the light emitting layers of the red light emitting layer 6, the blue light emitting layer 8, and the green light emitting layer 9, and the anode 3 side. Holes are supplied (injected). In each light emitting layer, holes and electrons recombine, and excitons (excitons) are generated by the energy released during the recombination, and energy (fluorescence or phosphorescence) is generated when the excitons return to the ground state. Is emitted (emitted). Thereby, the light emitting element 200R emits substantially white light.
Each layer constituting such a light emitting element 200R can be formed by the above-described film forming method. In particular, it is preferable to form a layer made of an organic material, more preferably a light emitting layer, by the above-described film forming method. In that case, the film-forming ink includes a material constituting the light emitting layer described later or a precursor thereof.

Hereinafter, each part which comprises the light emitting element 200R is demonstrated sequentially.
(anode)
The anode 3 is an electrode that injects holes into the hole transport layer 5 through a hole injection layer 4 described later. As a constituent material of the anode 3, it is preferable to use a material having a large work function and excellent conductivity.

Examples of the constituent material of the anode 3 include oxides such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), In ₃ O ₃ , SnO ₂ , Sb-containing SnO ₂ , and Al-containing ZnO, Au, Pt, and Ag. Cu, alloys containing these, and the like can be used, and one or more of these can be used in combination.
The average thickness of the anode 3 is not particularly limited, but is preferably about 10 to 200 nm, and more preferably about 50 to 150 nm.

(cathode)
On the other hand, the cathode 12 is an electrode that injects electrons into the electron transport layer 10 via an electron injection layer 11 described later. As a constituent material of the cathode 12, it is preferable to use a material having a small work function.
Examples of the constituent material of the cathode 12 include Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, Yb, Ag, Cu, Al, Cs, Rb, and alloys containing these. These can be used alone or in combination of two or more thereof (for example, a multi-layer laminate).

In particular, when an alloy is used as the constituent material of the cathode 12, it is preferable to use an alloy containing a stable metal element such as Ag, Al, or Cu, specifically, an alloy such as MgAg, AlLi, or CuLi. By using such an alloy as the constituent material of the cathode 12, the electron injection efficiency and stability of the cathode 12 can be improved.
Although the average thickness of such a cathode 12 is not specifically limited, It is preferable that it is about 80-10000 nm, and it is more preferable that it is about 100-500 nm.
In addition, since the light emitting element 200 of this embodiment is a bottom emission type, the cathode 12 is not particularly required to have light transmittance.

(Hole injection layer)
The hole injection layer 4 has a function of improving the hole injection efficiency from the anode 3.
The constituent material (hole injection material) of the hole injection layer 4 is not particularly limited. For example, amine compounds such as N, N, N ′, N′-tetraphenyl-p-diaminobenzene and derivatives thereof These can be used, and one or more of these can be used in combination.
The average thickness of the hole injection layer 4 is not particularly limited, but is preferably about 5 to 150 nm, and more preferably about 10 to 100 nm.
The hole injection layer 4 can be omitted.

(Hole transport layer)
The hole transport layer 5 has a function of transporting holes injected from the anode 3 through the hole injection layer 4 to the red light emitting layer 6.
The constituent material of the hole transport layer 5 is not particularly limited, and examples thereof include amine compounds such as N, N, N ′, N′-tetraphenylbenzidine and derivatives thereof. Alternatively, two or more kinds can be used in combination.
The average thickness of the hole transport layer 5 is not particularly limited, but is preferably about 10 to 150 nm, and more preferably about 10 to 100 nm.
The hole transport layer 5 can be omitted.

(Red light emitting layer)
The red light emitting layer (first light emitting layer) 6 includes a red light emitting material that emits red light (first color).
Such a red light emitting material is not particularly limited, and various red fluorescent materials and red phosphorescent materials can be used singly or in combination.

  The red fluorescent material is not particularly limited as long as it emits red fluorescence. For example, perylene derivatives such as diindenoperylene derivatives, europium complexes, benzopyran derivatives, rhodamine derivatives, benzothioxanthene derivatives, porphyrin derivatives, Nile Red, 2- (1,1-dimethylethyl) -6- (2- (2,3,6,7-tetrahydro-1,1,7,7-tetramethyl-1H, 5H-benzo (ij) quinolidine- 9-yl) ethenyl) -4H-pyran-4H-ylidene) propanedinitrile (DCJTB), 4- (dicyanomethylene) -2-methyl-6- (p-dimethylaminostyryl) -4H-pyran (DCM), etc. Can be mentioned.

The red phosphorescent material is not particularly limited as long as it emits red phosphorescence, and examples thereof include metal complexes such as iridium, ruthenium, platinum, osmium, rhenium, and palladium. Among the ligands of these metal complexes, And those having at least one of phenylpyridine skeleton, bipyridyl skeleton, porphyrin skeleton and the like. More specifically, tris (1-phenylisoquinoline) iridium, bis [2- (2′-benzo [4,5-α] thienyl) pyridinate-N, C ³ ′] iridium (acetylacetonate) (btp2Ir ( acac)), 2,3,7,8,12,13,17,18-octaethyl-12H, 23H-porphyrin-platinum (II), bis [2- (2′-benzo [4,5-α] thienyl ) Pyridinate-N, C ³ '] iridium, bis (2-phenylpyridine) iridium (acetylacetonate).
The red light emitting layer 6 may contain a host material to which the red light emitting material is added as a guest material in addition to the red light emitting material described above.

  The host material recombines holes and electrons to generate excitons, and the exciton energy is transferred to the red light-emitting material (Forster transfer or Dexter transfer) to excite the red light-emitting material. Have In the case of using such a host material, for example, a red light-emitting material that is a guest material can be used as a dopant by doping the host material.

Such a host material is not particularly limited as long as it exhibits the functions described above with respect to the red light emitting material to be used. When the red light emitting material includes a red fluorescent material, for example, a naphthacene derivative, naphthalene, etc. Derivatives, acene derivatives such as anthracene derivatives (acene-based materials), distyrylarylene derivatives, perylene derivatives, distyrylbenzene derivatives, distyrylamine derivatives, quinolinolato-based metals such as tris (8-quinolinolato) aluminum complexes (Alq ₃ ) Complexes, triarylamine derivatives such as tetraphenylamine tetramers, oxadiazole derivatives, silole derivatives, dicarbazole derivatives, oligothiophene derivatives, benzopyran derivatives, triazole derivatives, benzoxazole derivatives, benzothiazole derivatives, Norin derivatives, 4,4'-bis (2,2'-diphenylvinyl) biphenyl (DPVBi) and the like, may be used singly or in combination of two or more of them.

When the red light emitting material (guest material) and the host material as described above are used, the content (dope amount) of the red light emitting material in the red light emitting layer 6 is preferably 0.01 to 10 wt%. More preferably, it is 1-5 wt%. Luminous efficiency can be optimized by setting the content of the red light emitting material within such a range.
The average thickness of the red light emitting layer 6 is not particularly limited, but is preferably about 10 to 150 nm, and more preferably about 10 to 100 nm.

(First intermediate layer)
The first intermediate layer 7A is provided between and in contact with the red light emitting layer 6 and the blue light emitting layer 8 described later. The first intermediate layer 7A includes the same kind or the same material as the host material of the red light emitting layer 6 and is substantially free of a light emitting material. It has a function of adjusting the movement of carriers (holes and electrons) between the light emitting layer) 6 and the blue light emitting layer (second light emitting layer) 8. With this function, the red light emitting layer 6 and the blue light emitting layer 8 can each emit light efficiently.

  As a constituent material of the first intermediate layer 7A, the first intermediate layer 7A includes a material having the same or the same material as the host material of the red light emitting layer 6 and having a light emitting property. It is not particularly limited as long as it is configured without being included and can exhibit the carrier adjusting function as described above, but includes an acene-based material as the same or the same material as the host material of the red light emitting layer 6 Are preferably used.

  The acene-based material is not particularly limited as long as it has an acene skeleton and exhibits the effects described above. For example, a naphthalene derivative, anthracene derivative, tetracene (naphthacene) derivative, pentacene derivative, hexacene Derivatives, heptacene derivatives and the like can be mentioned, and one or more of these can be used in combination, but it is preferable to use a tetracene (naphthacene) derivative.

The content of the acene-based material in the first intermediate layer 7A is not particularly limited, but is preferably 10 to 90 wt%, more preferably 30 to 70 wt%, and 40 to 60 wt%. More preferably.
Furthermore, as a constituent material of the first intermediate layer 7A, it is particularly preferable to include an amine-based material (amine derivative) in addition to the acene-based material described above.

The average thickness of the first intermediate layer 7A is not particularly limited, but is preferably 1 to 100 nm, more preferably 3 to 50 nm, and further preferably 5 to 30 nm. Accordingly, the first intermediate layer 7A can reliably adjust the movement of holes and electrons between the red light emitting layer 6 and the blue light emitting layer 8 while suppressing the driving voltage.
The first intermediate layer 7A can be omitted.

(Blue light emitting layer)
The blue light emitting layer (second light emitting layer) 8 includes a blue light emitting material that emits blue light (second color).
Examples of such blue light-emitting materials include various blue fluorescent materials and blue phosphorescent materials, and one or more of these materials can be used in combination.

  The blue fluorescent material is not particularly limited as long as it emits blue fluorescence. For example, distyrylamine derivatives such as distyryldiamine compounds, fluoranthene derivatives, pyrene derivatives, perylene and perylene derivatives, anthracene derivatives, benzo Oxazole derivatives, benzothiazole derivatives, benzimidazole derivatives, chrysene derivatives, phenanthrene derivatives, distyrylbenzene derivatives, tetraphenylbutadiene, 4,4′-bis (9-ethyl-3-carbazovinylene) -1,1′-biphenyl (BCzVBi) ), Poly [(9.9-dioctylfluorene-2,7-diyl) -co- (2,5-dimethoxybenzene-1,4-diyl)], poly [(9,9-dihexyloxyfluorene-2, 7-diyl) -ortho-co- (2-me Xyl-5- {2-ethoxyhexyloxy} phenylene-1,4-diyl)], poly [(9,9-dioctylfluorene-2,7-diyl) -co- (ethylnylbenzene)] and the like. .

The blue phosphorescent material is not particularly limited as long as it emits blue phosphorescence. Examples thereof include metal complexes such as iridium, ruthenium, platinum, osmium, rhenium, and palladium. Specifically, bis [4 , 6-difluorophenyl pyridinium sulfonate -N, ^{C 2} '] - picolinate - iridium, tris [2- (2,4-difluorophenyl) pyridinate -N, ^{C 2']} iridium, bis [2- (3,5 - trifluoromethyl) pyridinate -N, ^{C 2} '] - picolinate - iridium, bis (4,6-difluorophenyl pyridinium sulfonate -N, ^{C 2')} iridium (acetylacetonate) and the like.
In addition to the blue light emitting material described above, the blue light emitting layer 8 may contain a host material to which the blue light emitting material is added as a guest material.

As such a host material, the same host material as described in the red light emitting layer (first light emitting layer) 6 described above can be used.
Moreover, it is preferable to use an acene derivative (acene-based material) as the host material of the blue light emitting layer 8 like the host material of the red light emitting layer 6. Thereby, the blue light emitting layer 8 can emit red light with higher luminance and higher efficiency.

(Second intermediate layer)
The second intermediate layer 7B is provided between the blue light emitting layer 8 described above and a green light emitting layer 9 described later so as to be in contact therewith. The second intermediate layer 7B includes a material having the same or the same kind of material as that of at least one of the host material of the blue light emitting layer 8 and the host material of the green light emitting layer 9, and having a light emitting property. A function of adjusting substantially the movement of carriers (holes and electrons) between the blue light-emitting layer (second light-emitting layer) 8 and the green light-emitting layer (third light-emitting layer) 9 is configured without being substantially included. Have. By this function, the exciton energy transfer between the blue light emitting layer 8 and the green light emitting layer 9 can be prevented, so that the energy transfer from the blue light emitting layer 8 to the green light emitting layer 9 is suppressed, and The light emitting layer 8 and the green light emitting layer 9 can each emit light efficiently. That is, since the blue light emitting layer 8 and the green light emitting layer 9 can emit light in a balanced manner, the light emitting element 200 can emit white light.

  As a constituent material of the second intermediate layer 7B, the second intermediate layer 7B is the same as or the same type as at least one of the host material of the blue light emitting layer 8 and the host material of the green light emitting layer 9. The material is the same as that of the host material, but is not particularly limited as long as it is configured so as to be substantially free of a light emitting material and can exhibit the carrier adjusting function as described above. Alternatively, a material containing an acene material is preferably used as the same material.

As the acene-based material, the same materials as those described for the first intermediate layer 7A described above can be used.
The host material contained in the second intermediate layer 7B is preferably the same as the host material of the blue light emitting layer 8. As a result, delivery of carriers (electrons or holes) between the light emitting layer having the same host material and the second intermediate layer 7B is performed smoothly, and the drive voltage of the light emitting element 200 is increased. While being able to suppress or prevent exactly, exciton diffusion can be suppressed or prevented accurately.

The thickness of the second intermediate layer 7B is not particularly limited, but is preferably about 2 nm or more and 10 nm or less, and more preferably about 3 nm or more and 7 nm or less. By setting the thickness of the second intermediate layer 7B within such a range, diffusion of excitons (holes and electrons) can be suppressed or prevented, and exciton movement can be adjusted with certainty.
The second intermediate layer 7B can be omitted.

(Green light emitting layer)
The green light emitting layer (third light emitting layer) 9 includes a green light emitting material that emits green light (third color).
Such a green light-emitting material is not particularly limited, and examples thereof include various green fluorescent materials and green phosphorescent materials, and one or more of them can be used in combination.

  The green fluorescent material is not particularly limited as long as it emits green fluorescence. For example, quinacridone such as coumarin derivatives and quinacridone derivatives and derivatives thereof, 9,10-bis [(9-ethyl-3-carbazole)- Vinylenyl] -anthracene, poly (9,9-dihexyl-2,7-vinylenefluorenylene), poly [(9,9-dioctylfluorene-2,7-diyl) -co- (1,4-diphenylene-vinylene) -2-methoxy-5- {2-ethylhexyloxy} benzene)], poly [(9,9-dioctyl-2,7-divinylenefluorenylene) -ortho-co- (2-methoxy-5- (2 -Ethoxylhexyloxy) -1,4-phenylene)] and the like.

The green phosphorescent material is not particularly limited as long as it emits green phosphorescence, and examples thereof include metal complexes such as iridium, ruthenium, platinum, osmium, rhenium, and palladium. 2-phenylpyridine) iridium (Ir (ppy) 3), bis (2-phenyl-pyridinium sulfonate -N, ^{C 2} ') iridium (acetylacetonate), fac - tris [5-fluoro-2- (5-tri Fluoromethyl-2-pyridine) phenyl-C, N] iridium and the like.
Further, the green light emitting layer 9 may contain a host material using the green light emitting material as a guest material in addition to the green light emitting material described above.

As such a host material, the same host material as described in the red light emitting layer (first light emitting layer) 6 described above can be used.
Moreover, it is preferable to use an acene derivative (acene-based material) as the host material of the green light emitting layer 9 like the host material of the red light emitting layer 6. Thereby, the green light emitting layer 9 can emit red light with higher luminance and higher efficiency.
Further, the host material of the green light emitting layer 9 is preferably the same as the host material of the blue light emitting layer 8 described above. As a result, both the light emitting layers 8 and 9 can emit green light and blue light in a balanced manner.

(Electron transport layer)
The electron transport layer 10 has a function of transporting electrons injected from the cathode 12 through the electron injection layer 11 to the green light emitting layer 9.
As a constituent material (electron transport material) of the electron transport layer 10, for example, a quinoline derivative such as an organometallic complex having an 8-quinolinol or its derivative such as tris (8-quinolinolato) aluminum (Alq ₃ ) as a ligand. Oxadiazole derivatives, perylene derivatives, pyridine derivatives, pyrimidine derivatives, quinoxaline derivatives, diphenylquinone derivatives, nitro-substituted fluorene derivatives, and the like, and one or more of these can be used in combination.
Although the average thickness of the electron carrying layer 10 is not specifically limited, It is preferable that it is about 0.5-100 nm, and it is more preferable that it is about 1-50 nm.
The electron transport layer 10 can be omitted.

(Electron injection layer)
The electron injection layer 11 has a function of improving the efficiency of electron injection from the cathode 12.
Examples of the constituent material (electron injection material) of the electron injection layer 11 include various inorganic insulating materials and various inorganic semiconductor materials.

  Examples of such inorganic insulating materials include alkali metal chalcogenides (oxides, sulfides, selenides, tellurides), alkaline earth metal chalcogenides, alkali metal halides, and alkaline earth metal halides. Of these, one or two or more of these can be used in combination. By forming the electron injection layer using these as main materials, the electron injection property can be further improved. In particular, an alkali metal compound (alkali metal chalcogenide, alkali metal halide, or the like) has a very small work function. By using this to form the electron injection layer 11, the light-emitting element 200 can obtain high luminance. Become.

Examples of the alkali metal chalcogenide include Li ₂ O, LiO, Na ₂ S, Na ₂ Se, and NaO.
Examples of the alkaline earth metal chalcogenide include CaO, BaO, SrO, BeO, BaS, MgO, and CaSe.
Examples of the alkali metal halide include CsF, LiF, NaF, KF, LiCl, KCl, and NaCl.
Examples of the alkaline earth metal halide include CaF ₂ , BaF ₂ , SrF ₂ , MgF ₂ , and BeF ₂ .

In addition, as the inorganic semiconductor material, for example, an oxide including at least one element of Li, Na, Ba, Ca, Sr, Yb, Al, Ga, In, Cd, Mg, Si, Ta, Sb, and Zn , Nitrides, oxynitrides, and the like, and one or more of these can be used in combination.
The average thickness of the electron injection layer 11 is not particularly limited, but is preferably about 0.1 to 1000 nm, more preferably about 0.2 to 100 nm, and about 0.2 to 50 nm. Further preferred.
The electron injection layer 11 can be omitted.

(Color filter manufacturing method)
Next, as a more specific application example of the film forming method of the present invention, a method for manufacturing the color filter 102 described above will be described.
6 and 7 are diagrams for explaining the case where the film forming method of the present invention is applied to the manufacture of a color filter.
In the following description, except that a plurality of types of film-forming inks having different colors are used and the film-forming ink is supplied into a section (region) defined by a bank (partition) Since this is the same as the film forming method described above, description of the same matters as those of the film forming method described above is omitted.

[A]
A-1
First, as shown in FIG. 6A, a base material 15A in which a partition wall 36 (bank) is formed on a substrate 20 is prepared.
Moreover, you may make the base material 15A lyophilic by the oxygen plasma process under atmospheric pressure as needed.

A-2
Next, as shown in FIG. 6B, the film-forming ink 19RA is supplied to the section where the colored layer 19R is to be formed.
This step can be performed in the same manner as the ink application step [1] of the film forming method described above.
The film forming ink 19RA includes a film forming material and a liquid medium, and is configured in the same manner as the film forming ink 1 described above.
Further, the film forming material of the film forming ink 19RA includes a colorant such as a red dye or pigment. The film forming material of the film forming ink 19RA may include a resin material such as an acrylic resin.

A-3
Then, in the same manner as the first drying step [2] of the film forming method described above, the first component is removed from the film forming ink 19RA applied on the base material 15A. Thereby, as shown in FIG. 6C, a film 19RB which is a solid intermediate film is formed.
Thereafter, as shown in FIG. 6C, the film-forming ink 19GA is supplied to the section where the colored layer 19G is to be formed. At this time, since the film 19RB is solid, it does not flow out to other compartments.

Application of the film-forming ink 19GA to the base material 15A in this step can be performed in the same manner as the ink application step [1] of the film-forming method described above.
The film forming ink 19GA includes a film forming material and a liquid medium, and is configured in the same manner as the film forming ink 1 described above.
Further, the film forming material of the film forming ink 19GA includes a colorant such as a green dye or pigment. Further, the film forming material of the film forming ink 19GA may include a resin material such as an acrylic resin.

A-4
Then, in the same manner as the first drying step [2] of the film forming method described above, the first component is removed from the film forming ink 19GA applied on the base material 15A. Thereby, as shown in FIG. 6D, a film 19GB which is a solid intermediate film is formed.
Thereafter, as shown in FIG. 6D, the film-forming ink 19BA is supplied to the section where the colored layer 19B is to be formed. At this time, since the films 19RB and 19GB are solid, they do not flow out to other compartments.

Application of the film-forming ink 19BA to the base material 15A in this step can be performed in the same manner as the ink application step [1] of the film-forming method described above.
The film-forming ink 19BA includes a film-forming material and a liquid medium, and is configured in the same manner as the film-forming ink 1 described above.
The film forming material of the film forming ink 19BA contains a colorant such as a blue dye or pigment. Further, the film forming material of the film forming ink 19BA may include a resin material such as an acrylic resin.

A-5
Then, in the same manner as the first drying step [2] of the film forming method described above, the first component is removed from the film forming ink 19BA applied on the base material 15A. Thereby, as shown in FIG. 7A, a film 19BB which is a solid intermediate film is formed.
As described above, the films 19RB, 19GB, and 19B, which are solid intermediate films, are formed on the base material 15A. In addition, after all the film-forming inks 19RA, 19GA, and 19BA are applied to the base material 15A, the same processing as the first drying step [2] of the film-forming method described above is performed in a lump to form the films 19RB and 19GB. 19B may be formed.

[B]
B-1
Next, colored layers 19R, 19G, and 19B are formed in the same manner as the second drying step [3] of the film forming method described above.
Specifically, by heating the films 19RB, 19GB, and 19B, liquid films 19RC, 19GC, and 19BC are formed as shown in FIG. 7B.
Thereafter, the second components are removed from the liquid films 19RC, 19GC, and 19BC, respectively, thereby obtaining colored layers 19R, 19G, and 19B as shown in FIG. 7C. Note that the colored layers 19R, 19G, and 19B may be obtained by appropriately performing a predetermined treatment after the removal of the second component.
The color filter 102 can be manufactured as described above.

The color filter 102, which is a device with a film thus obtained, prevents color mixing of the colored layers 19R, 19G, and 19B, and makes the colored layers 19R, 19G, and 19B uniform in thickness and film quality. Therefore, it has desired optical characteristics and has excellent reliability.
Such a film-forming method by separately painting for each pixel is not limited to the manufacture of the color filter 102 described above, but can also be applied to the manufacture of the light-emitting device 101 (particularly, the light-emitting layer). Film Forming Method The present invention as described above can be applied not only to the manufacture of the color filter 102 but also to the manufacture of other types of image display devices such as an electroluminescence display device.

(Other application examples)
The film-forming ink of the present invention can also be used for forming a conductor pattern on a wiring board.
The film-forming ink for forming the conductor pattern is an ink for forming the conductor pattern precursor.
Specifically, the film forming material of the film forming ink contains metal particles. The film-forming ink is a dispersion obtained by dispersing metal particles in a dispersion medium.

  As such metal particles, silver particles are preferably used, and the average particle size of the silver particles is preferably 1 nm or more and 100 nm or less, and more preferably 10 nm or more and 30 nm or less. As a result, the ink ejection stability can be further improved, and a fine conductor pattern can be easily formed. In the present specification, the “average particle size” means a volume-based average particle size unless otherwise specified.

The silver particles (metal particles) are preferably dispersed in a dispersion medium as silver colloid particles (metal colloid particles) having a dispersant attached to the surface thereof. Thereby, the dispersibility of the silver particles in the aqueous dispersion medium is particularly excellent, and the ink ejection stability is particularly excellent.
The content of the silver colloid particles in the ink is preferably 1 wt% or more and 60 wt% or less, and more preferably 10 wt% or more and 50 wt% or less.

  Further, the film forming material of the film forming ink for forming the conductor pattern may include an organic binder. The organic binder prevents aggregation of silver particles in the conductor pattern precursor (film after the second drying step) formed with the film-forming ink. Further, at the time of sintering, the organic binder can be decomposed and removed, and the silver particles in the conductor pattern precursor are bonded to form a conductor pattern.

  Although it does not specifically limit as an organic binder, For example, polyethyleneglycol # 200 (weight average molecular weight 200), polyethyleneglycol # 300 (weight average molecular weight 300), polyethyleneglycol # 400 (average molecular weight 400), polyethyleneglycol # 600 ( Weight average molecular weight 600), polyethylene glycol # 1000 (weight average molecular weight 1000), polyethylene glycol # 1500 (weight average molecular weight 1500), polyethylene glycol # 1540 (weight average molecular weight 1540), polyethylene glycol # 2000 (weight average molecular weight 2000), etc. Polyethylene glycol, polyvinyl alcohol # 200 (weight average molecular weight: 200), polyvinyl alcohol # 300 (weight average molecular weight: 300), polyvinyl alcohol # 400 (average molecular weight: 400), polyvinyl alcohol # 600 (weight average molecular weight: 600), polyvinyl alcohol # 1000 (weight average molecular weight: 1000), polyvinyl alcohol # 1500 (weight average molecular weight: 1500), polyvinyl alcohol # Polyglycerin compounds having a polyglycerin skeleton such as polyvinyl alcohol such as 1540 (weight average molecular weight: 1540), polyvinyl alcohol # 2000 (weight average molecular weight: 2000), polyglycerin, polyglycerin ester, etc. Alternatively, two or more kinds can be used in combination. Examples of polyglycerol esters include polyglycerol monostearate, tristearate, tetrastearate, monooleate, pentaoleate, monolaurate, monocaprylate, polycinnolate, sesquistearate, decaoleate, and sesquioleate. Etc.

  Further, the content of the organic binder in the ink is preferably 1 wt% or more and 30 wt% or less, and more preferably 5 wt% or more and 20 wt% or less. This makes it possible to more effectively prevent the occurrence of cracks and disconnections while making the ink ejection stability particularly excellent. On the other hand, when the content of the organic binder is less than the lower limit, the effect of preventing the occurrence of cracks may be reduced depending on the composition of the organic binder. If the content of the organic binder exceeds the upper limit, it may be difficult to make the viscosity of the ink sufficiently low depending on the composition of the organic binder.

(Electronics)
FIG. 8 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied.
In this figure, a personal computer 1100 includes a main body 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display. The display unit 1106 is rotatable with respect to the main body 1104 via a hinge structure. It is supported by.
In the personal computer 1100, the display unit included in the display unit 1106 is configured by the display device 300 described above.

FIG. 9 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the present invention is applied.
In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204 and a mouthpiece 1206, and a display unit.
In the mobile phone 1200, the display unit is configured by the display device 300 described above.

FIG. 10 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown.
Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD, and functions as a finder that displays an object as an electronic image.
In the digital still camera 1300, the display unit is configured by the display device 300 described above.

A circuit board 1308 is installed inside the case. The circuit board 1308 is provided with a memory that can store (store) an imaging signal.
A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side of the case 1302 (on the back side in the illustrated configuration).
When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory of the circuit board 1308.

In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the data communication input / output terminal 1314 as necessary. Further, the imaging signal stored in the memory of the circuit board 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.
The electronic apparatus having such a film-coated device of the present invention has excellent reliability.

  The electronic apparatus of the present invention includes, for example, a television, a video camera, a viewfinder type, in addition to the personal computer (mobile personal computer) in FIG. 8, the mobile phone in FIG. 9, and the digital still camera in FIG. Monitor direct-view video tape recorder, laptop personal computer, car navigation system, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, video phone, security TV Monitors, electronic binoculars, POS terminals, devices equipped with touch panels (for example, cash dispensers and automatic ticket vending machines for financial institutions), medical devices (for example, electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiographs, ultrasound diagnostic devices, internal Endoscopic display device), fish finder, various measuring instruments Instruments (e.g., gages for vehicles, aircraft, and ships), a flight simulator, various monitors, and a projection display such as a projector.

As described above, the film forming ink, the film forming method, the droplet discharge device, the film-equipped device, and the electronic apparatus according to the present invention have been described based on the illustrated embodiments, but the present invention is not limited thereto.
For example, in the above-described embodiment, the light emitting element has been described as having three light emitting layers. However, the light emitting layer may be one layer or two layers, or may be four layers or more. Further, the emission color of the light emitting layer is not limited to R, G, and B in the above-described embodiment.

In addition, when a plurality of layers are stacked using the film forming method of the present invention, the type of liquid medium used in the subsequent film formation is selected, or the previously formed film is subjected to a cross-linking reaction. It is possible to prevent the film formed in this way from being dissolved during the subsequent film formation.
Further, the device with a film of the present invention is not limited to the above-described color filter, light-emitting device, and wiring board, and can be applied to various devices as long as the device has a film formed using a film-forming ink. .

  DESCRIPTION OF SYMBOLS 1 ... Ink for film-forming 1A ... Film 1B ... Film (1st film) 1C ... Film 1D ... Film (2nd film) 3 ... Anode 4 ... Hole injection layer 5 ... Hole transport Layer 6 ... Red light emitting layer 7A ... First intermediate layer 7B ... Second intermediate layer 8 ... Blue light emitting layer 9 ... Green light emitting layer 10 ... Electron transport layer 11 ... Electron injection layer 12 ... Cathode 14 ... Laminated body 14R, 14G, 14B ... Laminated body 15, 15A ... Base material 19B ... Colored layer (second film) 19BA ... Deposition ink 19BB ... Film (first film) 19BC ... ... Film 19G ... Colored layer 19GA ... Film forming ink 19GB ... Film (first film) 19GC ... Film 19R ... Colored layer (second film) 19RA ... Film forming ink 19RB ... Film (No. 1) (1 film) 19RC ... Film 20 ... Substrate 21 ... Substrate 22 ... Planarization layer 24 ··· Switching element 27 ··· Conducting portion 31 ··· Partition wall 32 ··· Reflection film 33 ··· Corrosion prevention film 34 ··· Cathode cover 35 · · · Resin layer 36 · · · Partition wall 100 · · · Liquid droplet ejection device 101 · · · Light emitting device 102 ... Color filter 110 ... Head 111 ... Head body 112 ... Diaphragm 113 ... Piezo element 114 ... Body 115 ... Nozzle plate 115P ... Ink ejection surface 116 ... Reservoir 117 ... Ink chamber 118 ... Nozzle 130 ... Base 140 ... Table 150 ... Ink reservoir 151 ... Transport path 170 ... Table positioning means 171 ... First moving means 172 ... Motor 180 ... Head positioning means 181 ... Second moving means 182 ... Linear motor 183, 184, 185 ... Motor 190 ... Control device 191 ... Drive circuit 200R, 200G, 200B ... Light emitting element 241 ... Semiconductor layer 242 ... Gate insulating layer 243 ... Gate electrode 244 ... Source electrode 245 ... Drain electrode 300 ... Display device 300R, 300G , 300B ... Sub-pixel 1100 ... Personal computer 1102 ... Keyboard 1104 ... Main unit 1106 ... Display unit 1200 ... Mobile phone 1202 ... Operation buttons 1204 ... Earpiece 1206 ... Mouthpiece 1300 ... Digital Still camera 1302 ... Case 1304 ... Light receiving unit 1306 ... Shutter button 1308 ... Circuit board 1312 ... Video signal output terminal 1314 ... Input / output terminal 1430 ... Television monitor 1440 ... Personal computer Over data

Claims (15)

A film-forming material;
A liquid medium in which the film forming material is dissolved or dispersed,
The liquid medium has a first component and a boiling point at normal pressure higher than a boiling point at normal pressure of the first component, and a melting point at normal pressure is higher than a melting point at normal pressure of the first component. And a second component that dissolves in the first component.   The film-forming ink according to claim 1, wherein the first component is a liquid at normal temperature and pressure.   The ink for film formation according to claim 2, wherein the melting point of the first component at normal pressure is 0 ° or less.   The ink for film formation according to claim 2 or 3, wherein the boiling point of the first component at normal pressure is 40 ° C or higher.   The film-forming ink according to claim 1, wherein the second component is in a solid state at normal temperature and pressure.   The film-forming ink according to claim 1, wherein the film-forming material contains an organic material as a main material.   The film-forming ink according to claim 6, wherein the film-forming material is soluble in the second component.   The film-forming ink according to claim 6 or 7, wherein the film-forming material is a constituent material of a colored layer of a color filter or a precursor thereof.   The film-forming ink according to claim 6 or 7, wherein the film-forming material is a constituent material of an organic layer of an organic electroluminescence element or a precursor thereof.   8. The film forming ink according to claim 1, wherein the film forming material is a constituent material of a conductor pattern of a wiring board or a precursor thereof.   The film-forming ink according to claim 1, which is used for film formation using an inkjet method. Applying the film-forming ink according to claim 1 onto a substrate;
Removing the first component from the film-forming ink to form a solid first film mainly comprising the film-forming material and the second component;
Heating the first film to form a liquid, removing the second component from the first film in that state, and forming a second film containing the film-forming material as a main component. A characteristic film forming method.   A droplet discharge apparatus comprising a droplet discharge head for discharging the film-forming ink according to claim 1.   A device with a film, comprising a film formed by the film forming method according to claim 12 or a film obtained by processing the film.   An electronic apparatus comprising the film-coated device according to claim 14.

Images