JP2012043986A - Thermal countermeasure structure of electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal countermeasure structure of an electronic device, which protects a heat sensitive electronic component from heat in a small type electronic device.SOLUTION: A housing outer wall 11 comprises multiple fins 12 integrally formed with the housing outer wall 11, and a housing 13 comprises an airtight heat insulating container 14 which is closely contacted with or is integrally formed with the housing outer wall 11 and is used for housing an electronic component. The heat insulating container 14 houses the electronic component such as a reference oscillator 15, which is sensitive to high temperature, for protecting the electronic component from heat emitted from a high temperature heat source, such as a power amplifier, in a device. Low temperature outside air is transmitted from the housing outer wall 11 to a wall of the heat insulating container 14, and the temperature increase is suppressed in the heat insulating container 14. Thus, the electronic component is protected from the heat.

Description

  The present invention relates to a heat countermeasure structure of an electronic device, and more particularly to a heat countermeasure structure of a small base station apparatus.

In an electronic device such as a base station that performs wireless communication with a mobile phone terminal, an electronic component such as an oscillation circuit that is vulnerable to high temperatures is used as a component installation place in a base station housing where the ambient temperature is relatively low.
Conventionally, in order to suppress fluctuations in the oscillation frequency with respect to changes in the temperature of the oscillation circuit, for example, the oscillation circuit is housed in a thermostatic chamber, the temperature change of the oscillation circuit is suppressed, and the oscillation frequency is stabilized, or As disclosed in Patent Document 1, a voltage-controlled oscillation circuit is used for the oscillation circuit, a temperature sensor is provided in the oscillation circuit, and an input to the oscillation circuit is made according to the temperature of the oscillation circuit detected by the temperature sensor. For example, the oscillation frequency with respect to the temperature change is automatically corrected by changing the control voltage.

JP 2000-036739 A

However, in recent years, the base station has been further miniaturized, and the number of parts where the temperature is low has been reduced. Therefore, electronic parts that are vulnerable to high temperatures cannot be used.
In addition, the thermostatic chamber is not suitable for a base station or the like that is becoming smaller because a size scale is increased because a circuit for controlling the temperature is required.
Therefore, there is a demand for heat insulation of electronic parts that are weak against heat mounted in a small electronic device.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a heat countermeasure structure for an electronic device that can prevent heat of electronic components that are vulnerable to heat in a small electronic device. There is to do.

  In order to achieve the above object, the present invention provides a heat countermeasure structure for an electronic device having a heat generating member in the electronic device casing, and the outer wall of the casing includes a plurality of fins integrated with the outer wall of the casing, It is characterized in that a sealed heat-proof container is provided in the housing for accommodating electronic components sensitive to heat, which are in close contact with the outer wall or integrated with the outer wall.

  The heat insulation container is preferably formed of the same material as the outer wall. Moreover, it is preferable that the said heat insulation container is formed with material with high heat conductivity, such as aluminum and copper.

  In the present invention, the outer wall having fins communicates the low temperature of the external air to the wall of the heat insulating container that is in close contact with or integrated with the outer wall, and the heat insulating container prevents high temperature heat transfer from the heat generating member inside the housing. Therefore, it is possible to suppress the temperature rise of the electronic components that are weak against heat stored in the heat-insulating container. That is, according to the present invention, it is possible to prevent heat of electronic components that are weak against heat in a small electronic device.

It is a whole perspective view of a base station apparatus. It is a principal part expansion perspective view which shows embodiment of the heat countermeasure structure of the base station apparatus which concerns on this invention. It is a partial expanded sectional view which shows embodiment of the heat countermeasure structure of the base station apparatus which concerns on this invention. It is a temperature distribution figure which shows the thermal radiation state from a base station apparatus.

  Embodiments of the present invention will be described with reference to the drawings. The electronic device heat countermeasure structure of the present invention is a natural air-cooled small base station device in which the temperature rise is large, and the electronic components such as a reference oscillator that is weak at high temperature are protected from high-temperature heat sources such as a power amplifier inside the device. Therefore, the electronic component is housed in a heat insulating container, the low temperature of the external air is transmitted from the outer wall of the housing to the wall of the heat insulating container, and the temperature rise in the heat insulating container is suppressed to prevent heat of the electronic component.

  FIG. 1 is an overall perspective view of the base station apparatus. As shown in the drawing, the casing 13 of the base station apparatus is surrounded by a plurality of fins 12. The plurality of fins 12 are arranged at predetermined intervals so as to protrude outward from the housing such that the fin direction is perpendicular to the outer wall 11 of the housing.

  FIG. 2 is an enlarged perspective view of a main part showing an embodiment of the heat countermeasure structure of the base station apparatus according to the present invention, and FIG. 3 is a partially enlarged sectional view. FIG. 2 shows a state in which the top plate of the base station apparatus is removed. As shown in FIGS. 2 and 3, the casing outer wall 11 of the base station apparatus includes a plurality of fins 12 integrated with the casing outer wall 11. In addition, a heat insulating container 14 is provided in close contact with the inside of the outer wall 11 of the base station apparatus.

  The heat-insulating container 14 accommodates heat-sensitive electronic components, and here, a reference oscillator 15 of an oscillation circuit is accommodated. The heat insulating container 14 has a sealed rectangular parallelepiped shape having three sides of 4 to 6 cm, 8 to 12 cm, and 1 to 3 cm, respectively. The heat insulating container 14 is formed of the same material as the outer casing wall 11 and the fins 12, and has a good thermal conductivity such as aluminum (thermal conductivity of about 200 W / mK) or copper (thermal conductivity of about 400 W / mK). (Material with thermal conductivity of 100 W / mK or more). The wall thickness of the heat insulating container 14 is preferably at least 1 mm.

  Further, the heat insulating container 14 has the largest surface among the six surfaces and is in close contact with the outer wall 11 of the casing, and the heat insulating container 11 is in contact with the outer wall 11 and the heat insulating container 14 with reliability. Thermally conductive grease (not shown) is applied to improve the resistance. The thickness of the heat conductive grease is preferably 100 μm or less. Examples of the thermally conductive grease include silicon grease containing aluminum oxide or the like. The housing outer wall 11 can receive heat outside the housing via the fins 12 and supply the received heat to the heat insulating container 14.

  FIG. 4 is a temperature distribution diagram showing a heat dissipation state from the base station apparatus. FIG. 4 shows a temperature distribution when the base station apparatus is viewed from the same position and the same direction as FIG. In the center of the base station device, for example, a component with high heat dissipation such as a power amplifier is arranged to raise the temperature inside the base station device. Looking at the temperature distribution diagram, the temperature is 94 ° C. to 100 ° C. near the center of the base station apparatus, but the temperature is 69 ° C. to 75 ° C. at the position where the heat insulating container 14 is provided. It cannot be seen that the heat-insulating container 14 suppresses the temperature rise inside the container.

  In the above-described embodiment, the heat insulating container is separated from the outer wall of the casing and is in close contact with the outer wall of the casing. However, when the outer wall of the casing and the fin are molded, the heat insulating container is also integrally molded. The heat insulating container and the outer wall of the housing may be integrated.

  As described above, in the heat countermeasure structure for an electronic device according to the present invention, the outer wall having fins transmits the low temperature of the external air to the wall of the heat insulating container that is in close contact with or integrated with the outer wall, and the heat insulating container is Since high temperature heat transfer from the heat generating member inside the body is prevented, it is possible to suppress the temperature rise of the heat sensitive electronic components such as the reference oscillator housed in the heat insulating container. That is, according to the present invention, it is possible to prevent heat of electronic components that are weak against heat in a small electronic device.

11 Housing outer wall 12 Fin 13 Housing 14 Thermal insulation container 15 Reference oscillator

Claims (3)

In the heat countermeasure structure of an electronic device having a heat generating member in the electronic device casing,
The outer wall of the housing includes a plurality of fins integrated with the outer wall of the housing,
A heat countermeasure structure for an electronic device, comprising: a sealed heat insulating container for housing an electronic component that is in close contact with the outer wall or integrated with the outer wall in the housing.   2. The heat countermeasure structure for an electronic device according to claim 1, wherein the heat insulating container is made of the same material as the outer wall.   3. The heat countermeasure structure for an electronic device according to claim 2, wherein the heat insulation container is formed of a material having high thermal conductivity such as aluminum or copper.

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