JP2012032748A - Resist composition for semiconductors, and method for resist-film and pattern formation using this composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resist composition for semiconductors with excellent sensitivity and roughness properties, and a method for resist-film and pattern formation using the same.SOLUTION: The resist composition for semiconductors contains a compound represented by the following general formula (I).

Description

  The present invention relates to a resist composition for semiconductors, and a resist film and a pattern forming method using the composition. More specifically, the present invention relates to an actinic ray-sensitive or radiation-sensitive resist composition suitable for semiconductor manufacturing processes such as ICs and photomasks, and a resist film and a pattern forming method using the same.

  Here, “active light” or “radiation” means, for example, an emission line spectrum of a mercury lamp, far ultraviolet rays represented by an excimer laser, extreme ultraviolet (EUV) rays, X rays, soft X rays, or electron rays (EB). ). In the present invention, “light” means actinic rays or radiation.

  In addition, “exposure” means not only light irradiation with a mercury lamp, far ultraviolet rays, X-rays, EUV light, etc., but also drawing with particle beams such as electron beams and ion beams, unless otherwise specified. .

  The chemically amplified resist composition generates an acid in the exposed area by irradiation with radiation such as far ultraviolet light, and dissolves in the developing solution of the actinic ray or radiation irradiated part and the non-irradiated part by a reaction using this acid as a catalyst. It is a pattern forming material that changes the properties and forms the pattern on the substrate.

  When a KrF excimer laser is used as an exposure light source, a resin having a basic skeleton of poly (hydroxystyrene) having a small absorption mainly in the 248 nm region is used as a main component. A pattern is formed, which is a better system than the conventional naphthoquinone diazide / novolak resin system.

On the other hand, when a further short wavelength light source, for example, ArF excimer laser (193 nm) is used as the exposure light source, the compound having an aromatic group essentially shows a large absorption in the 193 nm region. It wasn't.
For this reason, an ArF excimer laser resist containing a resin having an alicyclic hydrocarbon structure has been developed.

A triphenylsulfonium salt is generally known as an acid generator that is a main constituent of a chemically amplified resist (see, for example, Patent Document 1).
However, since the acid generator still has many inadequate points, the development of a photosensitive composition with improved sensitivity, pattern shape, roughness characteristics, stability over time, etc. can be achieved by improving the acid generator. It is desired.
In particular, the roughness characteristic becomes more serious as the pattern dimension is smaller. For example, in lithography using X-rays, electron beams, or EUV, since a target is to form a fine pattern of several tens of nanometers, particularly excellent roughness characteristics are required.

  In addition, electron beam lithography used as an ultrafine processing technique is indispensable as a method for processing a photomask blank when manufacturing a photomask for semiconductor manufacturing.

US Pat. No. 6,548,221

  An object of the present invention is to provide a resist composition for semiconductors excellent in sensitivity and roughness characteristics, and a resist film and a pattern forming method using the same.

  For example, the present invention is as follows. In the present invention, “volume of acid” means the volume of a region occupied by van der Waals spheres based on the van der Waals radii of atoms constituting the acid. Specifically, the “acid volume” is a volume calculated as follows. That is, first, the most stable conformation of the acid is determined by molecular force field calculation using the MM3 method. Thereafter, the van der Waals volume is calculated for this most stable conformation by molecular orbital calculation using the PM3 method. The van der Waals volume is defined as “acid volume”.

[1] A resist composition for a semiconductor containing a compound represented by the following general formula (I).

In the formula, R represents a monovalent substituent.

Represents a monocyclic or polycyclic heterocycle containing a nitrogen atom.
S ^N represents a substituent.
m represents an integer of 0 or more.
X ⁻ represents an anion.

[2] The X ^- the anion represented by the sulfonate anion, A composition according to imide anion, and is selected from the group consisting methide anion [1].

[3] The compound represented by the general formula (I) is decomposed by irradiation with actinic rays or radiation to generate an acid represented by the general formula HX and having a volume of 130 ³ or more [1] or [2] The composition according to [2].

[4] The composition according to any one of [1] to [3], wherein the anion represented by X ^{− is} represented by the following general formula (SA1) or (SA2).

In formula (SA1),
Ar represents an aryl group and may further have a substituent other than a-(D-B) group.
n represents an integer of 1 or more.
D represents a single bond or a divalent linking group.
B represents a monovalent substituent.
In formula (SA2),
Xf each independently represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.
R ₁ and R ₂ each independently represent a group selected from the group consisting of a hydrogen atom, a fluorine atom, an alkyl group, and an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.
L each independently represents a single bond or a divalent linking group.
E represents a group having a cyclic structure.
x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10.

  [5] The composition according to any one of [1] to [4], wherein the heterocyclic ring is an aromatic ring.

  [6] The composition according to any one of [1] to [5], further containing a resin that is decomposed by the action of an acid to increase the solubility in an alkali developer.

[7] The composition according to [6], wherein the resin includes a repeating unit represented by the following general formula (VI).

Where
R ₀₁ , R ₀₂ and R ₀₃ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. R ₀₃ represents an alkylene group, and may combine with Lp or Ar ₁ to form a ring.
Ar ₁ represents an aromatic ring group.
n represents an integer of 1 or more.
Lp represents a single bond or a divalent linking group.

  [8] The composition according to any one of [1] to [5], further comprising a resin soluble in an alkali developer and an acid crosslinking agent that crosslinks the resin by the action of an acid.

[9] The composition according to [8], wherein the resin includes a repeating unit represented by the following general formula (VI).

Where
R ₀₁ , R ₀₂ and R ₀₃ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. R ₀₃ represents an alkylene group and may combine with L or Ar ₁ to form a ring.
Ar ₁ represents an aromatic ring group.
n represents an integer of 1 or more.
Lp represents a single bond or a divalent linking group.

  [10] The composition according to any one of [1] to [9], further containing a basic compound.

  [11] The composition according to any one of [1] to [10], which is exposed to an electron beam, an X-ray or EUV light.

  [12] A resist film formed using the composition according to any one of [1] to [11].

  [13] A pattern including forming a film using the composition according to any one of [1] to [11], exposing the film, and developing the exposed film Forming method.

  [14] The method according to [13], wherein the exposure is performed with an electron beam, an X-ray, or EUV light.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the resist composition for semiconductors which was excellent in the sensitivity and roughness characteristics, and the resist film and pattern formation method using the same.

Hereinafter, embodiments of the present invention will be described in detail.
Here, the groups and atomic groups that do not explicitly indicate substitution or non-substitution include both those that do not have a substituent and those that have a substituent. For example, an “alkyl group” that does not clearly indicate substitution or unsubstituted is not only an alkyl group that does not have a substituent (unsubstituted alkyl group) but also an alkyl group that has a substituent (substituted alkyl group) Is also included.

  The resist composition for a semiconductor according to the present invention contains [1] a compound that generates an acid upon irradiation with actinic rays or radiation (hereinafter also referred to as “photo acid generator”).

The composition according to the present invention may be used as a positive composition or a negative composition.
In the former case, the composition according to the present invention typically comprises [2] a resin (hereinafter also referred to as “acid-decomposable resin”) that decomposes by the action of an acid and increases the solubility in an alkaline developer. Furthermore, it contains. In this case, the composition further includes [4] a compound having a molecular weight of 3000 or less (hereinafter also referred to as a dissolution inhibiting compound) that is decomposed by the action of an acid to increase the solubility in an alkali developer. Also good.
In the latter case, the composition according to the present invention typically contains [3] an alkali developer-soluble resin (hereinafter also referred to as “alkali-soluble resin”) and [5] the above-mentioned alkali by the action of an acid. It further contains a soluble resin and an acid crosslinking agent that crosslinks.

The composition according to the present invention further comprises [6] a substance that decomposes by the action of an acid to produce an acid stronger than a carboxylic acid (hereinafter also referred to as an acid proliferating agent), [7] a basic compound, [8] It may contain at least one of a fluorine-based and / or silicon-based surfactant, [9] a hydrophobic resin, [10] an organic solvent, and [11] other additives.
Hereinafter, each of these components will be described in order.

[1] Photoacid generator The composition according to the present invention contains a compound represented by the following general formula (I) as a photoacid generator.

In the formula, R represents a monovalent substituent.

Represents a monocyclic or polycyclic heterocycle containing a nitrogen atom. S ^N represents a substituent. m represents an integer of 0 or more. X ⁻ represents an anion.

  The present inventors have found that the compound represented by the general formula (I) has extremely high acid generation efficiency. In addition, the present inventors have found that when a composition containing this compound is used, outstanding sensitivity and roughness characteristics can be achieved.

  In addition, the present inventors have found that this compound has a particularly high acid generation efficiency when irradiated with an electron beam, an X-ray or EUV light. The present inventors have also found that particularly excellent sensitivity and roughness characteristics can be achieved when a film formed using a composition containing this compound is exposed to an electron beam, X-ray or EUV light. Yes.

  In general formula (I), R represents a monovalent substituent. This substituent may be an organic group or an inorganic group. Examples of the substituent include an alkyl group, a cycloalkyl group, an aryl group, an alkenyl group, an alkynyl group, a substituted carbonyl group, and a substituted sulfonyl group. Each of these groups may have a further substituent.

  The alkyl group represented by R may be linear or branched. The alkyl group preferably has 1 to 50 carbon atoms, more preferably 1 to 30 carbon atoms, and still more preferably 1 to 20 carbon atoms. Examples of such alkyl groups include methyl, ethyl, propyl, butyl, hexyl, octyl, decyl, dodecyl, octadadecyl, isopropyl, isobutyl, sec-butyl, t- A butyl group, 1-ethylpentyl group, and 2-ethylhexyl group are mentioned.

  The alkyl group represented by R may have a substituent. That is, R may be a substituted alkyl group. Examples of the substituted alkyl group include a trifluoromethyl group, a phenacyl group, a 1-naphthoylmethyl group, a 2-naphthoylmethyl group, a 4-methylsulfanylphenacyl group, a 4-phenylsulfanylphenacyl group, and 4-dimethyl. Aminophenacyl group, 4-cyanophenacyl group, 4-methylphenacyl group, 2-methylphenacyl group, 3-fluorophenacyl group, 3-trifluoromethylphenacyl group, 3-nitrophenacyl group, chloromethyl group , Bromomethyl group, 2-chloroethyl group, methoxymethyl group, methoxycarbonylmethyl group, isopropoxymethyl group, butoxymethyl group, s-butoxybutyl group, methoxyethoxyethyl group, allyloxymethyl group, phenoxymethyl group, acetyloxymethyl Group, methylthiomethyl group, tolylti Methyl group, pyridylmethyl group, tetramethylpiperidinylmethyl group, N-acetyltetramethylpiperidinylmethyl group, trimethylsilylmethyl group, methoxyethyl group, ethylaminoethyl group, diethylaminopropyl group, morpholinopropyl group, acetyloxymethyl Group, benzoyloxymethyl group, N-cyclohexylcarbamoyloxyethyl group, N-phenylcarbamoyloxyethyl group, acetylaminoethyl group, N-methylbenzoylaminopropyl group, 2-oxoethyl group, 2-oxopropyl group, carboxypropyl group , Methoxycarbonylethyl group, allyloxycarbonylbutyl group, chlorophenoxycarbonylmethyl group, carbamoylmethyl group, N-methylcarbamoylethyl group, N, N-dipropylcarbamoyl Til group, N- (methoxyphenyl) carbamoylethyl group, N-methyl-N- (sulfophenyl) carbamoylmethyl group, sulfobutyl group, sulfonatobutyl group, sulfamoylbutyl group, N-ethylsulfamoylmethyl group, N, N-dipropylsulfamoylpropyl group, N-tolylsulfamoylpropyl group, N-methyl-N- (phosphonophenyl) sulfamoyloctyl group, phosphonobutyl group, phosphonatohexyl group, diethylphosphonobutyl group, diphenyl Phosphonopropyl group, methylphosphonobutyl group, methylphosphonatobutyl group, tolylphosphonohexyl group, tolylphosphonatohexyl group, phosphonooxypropyl group, phosphonatoxybutyl group, benzyl group, phenethyl group, α-methyl Benzyl group, 1-methyl-1-phen Ruechiru group and, include p- methylbenzyl group.

Examples of the substituent that can be introduced into the alkyl group represented by R include, for example, the monovalent substituents composed of the nonmetallic atoms exemplified below in addition to the substituents described in the description of the substituted alkyl group. Also mentioned. Preferred examples including the above-described substituent include a halogen atom (—F, —Br, —Cl, or —I), a hydroxyl group, an alkoxy group, an aryloxy group, a mercapto group, an alkylthio group, an arylthio group, an amino group, and an acyloxy group. Group, carbamoyloxy group, alkylsulfoxy group, arylsulfoxy group, acylthio group, acylamino group, ureido group, alkoxycarbonylamino group, aryloxycarbonylamino group, N-alkyl-N-alkoxycarbonylamino group, N-alkyl -N-aryloxycarbonylamino group, N-aryl-N-alkoxycarbonylamino group, N-aryl-N-aryloxycarbonylamino group, formyl group, acyl group, carboxyl group, carbamoyl group, alkylsulfinyl group, aryls Luffy Group, an alkylsulfonyl group, an arylsulfonyl group, (referred to as a sulfonato group) sulfo group (-SO 3 _H) and its conjugated base group, alkoxy sulfonyl group, aryloxy sulfonyl group, sulfinamoyl group, a phosphono group (-PO ₃ H ₂ ) and its conjugate base group (referred to as phosphonato group), phosphonooxy group (—OPO ₃ H ₂ ) and its conjugate base group (referred to as phosphonatoxy group), cyano group, nitro group, aryl group, alkenyl group, alkynyl group, A heterocyclic group and a silyl group are mentioned.

  Specific examples of the aryl group that can be included in the substituent that can be introduced into the alkyl group represented by R include a phenyl group, a biphenyl group, a naphthyl group, a tolyl group, a xylyl group, a mesityl group, and a cumenyl group.

  The cycloalkyl group represented by R may be monocyclic or polycyclic. The cycloalkyl group preferably has 3 to 50 carbon atoms, more preferably 4 to 30 carbon atoms, and still more preferably 5 to 20 carbon atoms. Examples of such a cycloalkyl group include a cyclopentyl group, a cyclohexyl group, an adamantyl group, and a norbornyl group.

  The cycloalkyl group represented by R may have further substituents. As this further substituent, the thing similar to what was demonstrated previously as a substituent which can be introduce | transduced into an alkyl group is mentioned, for example.

  The aryl group represented by R may be monocyclic or polycyclic. This group may be a heteroaryl group. The number of carbon atoms of the aryl group represented by R is preferably 6 to 50, more preferably 6 to 30, and still more preferably 6 to 20. Examples of the aryl group include a phenyl group, a biphenyl group, a 1-naphthyl group, a 2-naphthyl group, a 9-anthryl group, a 9-phenanthryl group, a 1-pyrenyl group, a 5-naphthacenyl group, and a 1-indenyl group. , 2-azurenyl group, 9-fluorenyl group, terphenyl group, quarterphenyl group, o-, m-, and p-tolyl group, xylyl group, o-, m-, and p-cumenyl group, mesityl group, pentarenyl Group, binaphthalenyl group, turnaphthalenyl group, quarternaphthalenyl group, heptaenyl group, biphenylenyl group, indacenyl group, fluoranthenyl group, acenaphthylenyl group, aceanthrylenyl group, phenalenyl group, fluorenyl group, anthryl group, bianthracenyl group, teranthracenyl group Senyl group, Quarter anthracenyl group, Ant Quinolyl group, phenanthryl group, triphenylenyl group, pyrenyl group, chrysenyl group, naphthacenyl group, preadenyl group, picenyl group, perylenyl group, pentaphenyl group, pentacenyl group, tetraphenylenyl group, hexaphenyl group, hexacenyl group, rubicenyl group , A coronenyl group, a trinaphthylenyl group, a heptaphenyl group, a heptacenyl group, a pyrantrenyl group, and an ovalenyl group.

  The aryl group represented by R may have a further substituent. As this further substituent, the thing similar to what was demonstrated previously as a substituent which can be introduce | transduced into an alkyl group is mentioned, for example.

  The alkenyl group represented by R may be linear or branched. The alkenyl group preferably has 2 to 50 carbon atoms, more preferably 2 to 30 carbon atoms, and still more preferably 3 to 20 carbon atoms. Moreover, this alkenyl group may have a further substituent.

  Examples of such alkenyl groups include vinyl groups, allyl groups, and styryl groups. Further, examples of the further substituent that the alkenyl group may have include those described above as the substituent that can be introduced into the alkyl group.

  The alkynyl group represented by R may be linear or branched. The alkynyl group preferably has 2 to 50 carbon atoms, more preferably 2 to 30 carbon atoms, and still more preferably 3 to 20 carbon atoms. Moreover, this alkynyl group may have a further substituent.

  Examples of such alkynyl group include ethynyl group, propynyl group, and propargyl group. Further, examples of the further substituent that the alkynyl group may have include those described above as the substituent that can be introduced into the alkyl group.

The substituted carbonyl group represented by R is a group represented by the general formula —CO—R ⁰¹³ . Here, R ⁰¹³ is a group consisting of a monovalent nonmetallic atomic group.

  Examples of the substituted carbonyl group include a formyl group, an acyl group, a carboxyl group, an alkoxycarbonyl group, an aryloxycarbonyl group, and a carbamoyl group. Examples of the alkyl group and aryl group in each of these groups include the same groups as those described above as the group represented by R.

The substituted sulfonyl group represented by R is a group represented by the general formula —SO ₂ —R ⁰¹¹ . Here, R ⁰¹¹ is a group consisting of a monovalent nonmetallic atomic group.

  Examples of the substituted sulfonyl group include an alkylsulfonyl group, an arylsulfonyl group, and a sulfamoyl group. The sulfamoyl group may have a substituent or may not have a substituent. Moreover, as an alkyl group and an aryl group in each said group, the thing similar to what was demonstrated previously as a group represented by R is mentioned, for example.

  The heterocyclic ring containing a nitrogen atom in general formula (I) may be an aromatic ring or a non-aromatic ring. In addition to the nitrogen atom in the formula, the heterocycle may further contain a heteroatom such as a nitrogen atom, an oxygen atom and a sulfur atom. In addition, as described above, this heterocyclic ring may be monocyclic or polycyclic.

  Examples of such heterocycle include imidazole ring, pyridine ring, pyrazine ring, pyrimidine ring, pyridazine ring, 2H-pyrrole ring, 3H-indole ring, 1H-indazole, purine ring, isoquinoline ring, 4H-quinolidine ring, Quinoline ring, phthalazine ring, naphthyridine ring, quinoxaline ring, quinazoline ring, cinnoline ring, pteridine ring, phenanthridine ring, acridine ring, phenanthroline ring, phenazine ring, perimidine ring, triazine ring, benzisoquinoline ring, thiazole ring, thiadiazine ring , An azepine ring, an azocine ring, an isothiazole ring, an isoxazole ring, and a benzothiazole ring. Among these, a pyridine ring or a quinoline ring is particularly preferable.

S ^N represents a substituent as described above. Examples of this substituent include the same as those described above for R. These groups may further have a substituent.

  As described above, m is an integer of 0 or more. The upper limit value of m is equal to the number of atoms that can be substituted with a substituent among the atoms constituting the heterocyclic ring.

X ⁻ represents an anion. X ^- by the anion represented, it will be described in detail later.

The compound represented by the general formula (I) is preferably represented by the following general formula (II) or (III). That is, the heterocyclic ring containing a nitrogen atom in the general formula (I) preferably contains a 6-membered ring or a 5-membered ring.

Where
A represents a carbon atom, a nitrogen atom, an oxygen atom, or a sulfur atom each independently.
Y each independently represents a substituent. At least two of Y may be bonded to each other to form a ring. p represents an integer of 0 to 5.
Z each independently represents a substituent. At least two of Z may be bonded to each other to form a ring. q represents an integer of 0 to 4.
R and X ⁻ have the same meanings as in general formula (I).

  In both general formulas (II) and (III), the number of those representing nitrogen, oxygen, or sulfur atoms in A is preferably 0-2, more preferably 0 or 1.

Specific examples of Y and Z include the same as those described above for ^SN in the general formula (I). Each of Y and Z may be bonded to each other to form a ring. That is, the compound represented by the general formula (II) or (III) may have a condensed ring structure.

  The ring that can be formed by bonding Y or Z to each other may be an aromatic ring or a non-aromatic ring. Further, this ring may be a heterocycle containing a hetero atom. The ring that Y or Z may be bonded to each other is preferably a 5- to 7-membered ring, more preferably a 5- or 6-membered ring, and particularly preferably a 6-membered ring.

In addition, the ring that can be formed by bonding Y or Z to each other may have a substituent. Examples of this substituent include the same as those described above for S ^N in the general formula (I).

When at least one of A is a nitrogen atom, an oxygen atom or a sulfur atom, the compound represented by the general formula (II) may be represented by the following general formula (II-1) or (II-2). preferable.

In general formulas (II-1) and (II-2), A represents a nitrogen atom, an oxygen atom or a sulfur atom. Y, p, R, and X ⁻ have the same meanings as in general formula (II).

When at least one of A is a nitrogen atom, an oxygen atom or a sulfur atom, the compound represented by the general formula (III) is more preferably represented by the following general formula (III-1).

In general formula (III-1), A represents a nitrogen atom, an oxygen atom, or a sulfur atom. Z, q, R, and X ⁻ have the same meanings as in general formula (III).

Below, the specific example of the cation part of the compound represented by general formula (I) is given.

  The cationic moiety of the compound represented by the general formula (I) is, for example, J. AM. CHEM. SOC. 2004, 126, 14071-14078 or J. AM. CHEM. SOC. 2002, 124, 15225-15238. It can be synthesized by the method described in 1.

Subsequently, the anion represented by X ⁻ will be described. X ^- it is typically a non-nucleophilic anion. Here, the “non-nucleophilic anion” is an anion having an extremely low ability to cause a nucleophilic reaction, and an anion capable of suppressing degradation with time due to an intramolecular nucleophilic reaction. When such an anion is used, the temporal stability of the resist composition and the resist film is improved.

X ⁻ is preferably an organic anion containing a carbon atom. Preferred organic anions include, for example, sulfonic acid anions, imidoic acid anions, and methide acid anions. More specifically, for example, organic anions shown in the following AN1 to AN3 can be mentioned.

In the formula _AN1~AN3, Rc 1 ~Rc ₃ independently represents an organic group. Examples of the organic group include those having 1 to 30 carbon atoms, preferably an alkyl group, an aryl group, or a group in which a plurality of these groups are linked through a linking group. Examples of this linking group include a single bond, —O—, —CO ₂ —, —S—, —SO ₃ —, and —SO ₂ N (Rd ₁ ) —. Here, Rd ₁ represents a hydrogen atom or an alkyl group, and may form a ring structure with a bonded alkyl group or aryl group.

The organic group of Rc _{1 to} Rc ₃ may be an alkyl group substituted at the 1-position with a fluorine atom or a fluoroalkyl group, or a phenyl group substituted with a fluorine atom or a fluoroalkyl group. By containing a fluorine atom or a fluoroalkyl group, it becomes possible to increase the acidity of the acid generated by light irradiation. Thereby, the sensitivity of the actinic ray-sensitive or radiation-sensitive resin composition can be improved. Rc _{1 to} Rc ₃ may be bonded to other alkyl groups and aryl groups to form a ring structure.

Further, as preferred X ⁻ , a sulfonate anion represented by the following general formula (SA1) or (SA2) can be mentioned.

In formula (SA1),
Ar represents an aryl group and may further have a substituent other than a-(D-B) group.
n represents an integer of 1 or more. n is preferably 1 to 4, more preferably 2 to 3, and most preferably 3.
D represents a single bond or a divalent linking group. The divalent linking group is, for example, an ether group, a thioether group, a carbonyl group, a sulfoxide group, a sulfone group, a sulfonic acid ester group, or an ester group.
B represents a hydrocarbon group.

In formula (SA2),
Xf each independently represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.

R ₁ and R ₂ each independently represent a group selected from the group consisting of a hydrogen atom, a fluorine atom, an alkyl group, and an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, and a plurality of R ₁ and R ₂ are present. Each of R ₁ and R _{2 in} the case may be the same as or different from each other.
L represents a single bond or a divalent linking group, and when there are a plurality of L, they may be the same as or different from each other.
E represents a group having a cyclic structure.
x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10.

First, the sulfonate anion represented by the formula (SA1) will be described in detail.
In formula (SA1), Ar is preferably an aromatic ring having 6 to 30 carbon atoms. Specifically, Ar represents, for example, a benzene ring, naphthalene ring, pentalene ring, indene ring, azulene ring, heptalene ring, indecene ring, perylene ring, pentacene ring, acetaphthalene ring, phenanthrene ring, anthracene ring, naphthacene ring, chrysene Ring, triphenylene ring, fluorene ring, biphenyl ring, pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyridine ring, pyrazine ring, pyrimidine ring, pyridazine ring, indolizine ring, indole ring, benzofuran ring Benzothiophene ring, isobenzofuran ring, quinolidine ring, quinoline ring, phthalazine ring, naphthyridine ring, quinoxaline ring, quinoxazoline ring, isoquinoline ring, carbazole ring, phenanthridine ring, acridine ring, phenanthroline ring, Antoren ring, a chromene ring, a xanthene ring, a phenoxathiin ring, a phenothiazine ring or a phenazine ring. Of these, a benzene ring, a naphthalene ring or an anthracene ring is preferable, and a benzene ring is more preferable, from the viewpoint of achieving both roughness improvement and high sensitivity.

  In the case where Ar further has a substituent other than a-(D-B) group, examples of this substituent include the same as those described above for R. From the viewpoint, a linear alkyl group and a branched alkyl group are preferable.

  In formula (SA1), D is preferably a single bond, or an ether group or an ester group. More preferably, D is a single bond.

  In formula (SA1), B is, for example, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a cycloalkyl group. B is preferably an alkyl group or a cycloalkyl group. The alkyl group, alkenyl group, alkynyl group, aryl group or cycloalkyl group as B may have a substituent.

  The alkyl group as B is preferably a branched alkyl group. Examples of the branched chain alkyl group include isopropyl group, tert-butyl group, tert-pentyl group, neopentyl group, sec-butyl group, isobutyl group, isohexyl group, 3,3-dimethylpentyl group and 2-ethylhexyl group. Can be mentioned.

  The cycloalkyl group as B may be a monocyclic cycloalkyl group or a polycyclic cycloalkyl group. Examples of the monocyclic cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a cyclooctyl group. Examples of the polycyclic cycloalkyl group include adamantyl group, norbornyl group, bornyl group, camphenyl group, decahydronaphthyl group, tricyclodecanyl group, tetracyclodecanyl group, camphoroyl group, dicyclohexyl group and pinenyl group. Can be mentioned.

  When the alkyl group, alkenyl group, alkynyl group, aryl group or cycloalkyl group as B has a substituent, examples of the substituent include the same as those described above for R. . Among these, a straight chain alkyl group and a branched chain alkyl group are preferable from the viewpoint of achieving both improved roughness and high sensitivity.

Next, the sulfonate anion represented by the formula (SA2) will be described in detail.
In formula (SA2), Xf represents a fluorine atom or an alkyl group in which at least one hydrogen atom has been substituted with a fluorine atom. As this alkyl group, a C1-C10 thing is preferable and a C1-C4 thing is more preferable. The alkyl group substituted with a fluorine atom is preferably a perfluoroalkyl group.

Xf is preferably a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms. Specifically, Xf is preferably a fluorine atom, CF ₃ , C ₂ F ₅ , C ₃ F ₇ , C ₄ F ₉ , C ₅ F ₁₁ , C ₆ F ₁₃ , C ₇ F ₁₅ , C ₈ F _{17, CH 2 CF 3, CH} 2 CH 2 CF 3, CH 2 C 2 F 5, CH 2 CH 2 C 2 F 5, CH 2 C 3 F 7, CH 2 CH 2 C 3 F 7, CH 2 C 4 F ₉ or CH ₂ CH ₂ C ₄ F ₉ . Among these, a fluorine atom or CF ₃ is preferable, and a fluorine atom is most preferable.

In formula (SA2), each of R ₁ and R ₂ is a group selected from a hydrogen atom, a fluorine atom, an alkyl group, and an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom. The alkyl group which may be substituted with a fluorine atom is preferably an alkyl group having 1 to 4 carbon atoms. Moreover, as an alkyl group substituted by the fluorine atom, a C1-C4 perfluoroalkyl group is especially preferable. Specifically, CF ₃ , C ₂ F ₅ , C ₃ F ₇ , C ₄ F ₉ , C ₅ F ₁₁ , C ₆ F ₁₃ , C ₇ F ₁₅ , C ₈ F ₁₇ , CH ₂ CF ₃ , CH _{2 CH 2 CF 3, CH 2 C} 2 F 5, CH 2 CH 2 C 2 F 5, CH 2 C 3 F 7, CH 2 CH 2 C 3 F 7, CH 2 C 4 F 9 and _CH 2 _CH 2 _{C 4} F ₉ is mentioned, and among them, CF ₃ is preferable.

  In the formula (SA2), x is preferably 1 to 8, and more preferably 1 to 4. y is preferably 0 to 4, and more preferably 0. z is preferably from 0 to 8, and more preferably from 0 to 4.

In formula (SA2), L represents a single bond or a divalent linking group. Examples of the divalent linking group include —COO—, —OCO—, —CO—, —O—, —S—, —SO—, —SO ₂ —, an alkylene group, a cycloalkylene group, and an alkenylene group. It is done. Among these, —COO—, —OCO—, —CO—, —O—, —S—, —SO— or —SO ₂ — is preferable, and —COO—, —OCO— or —SO ₂ — is more preferable.

  In formula (SA2), E represents a group having a cyclic structure. Examples of the group having a cyclic structure include a cyclic aliphatic group, an aryl group, and a group having a heterocyclic structure.

  The cycloaliphatic group as E may have a monocyclic structure or a polycyclic structure. As the cyclic aliphatic group having a monocyclic structure, monocyclic cycloalkyl groups such as a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group are preferable. The cycloaliphatic group having a polycyclic structure is preferably a polycyclic cycloalkyl group such as a norbornyl group, a tricyclodecanyl group, a tetracyclodecanyl group, a tetracyclododecanyl group or an adamantyl group. In particular, when a cycloaliphatic group having a bulky structure of 6-membered ring or more is adopted as E, diffusibility in the film in the PEB (post-exposure heating) step is suppressed, and the resolution and EL (exposure latitude) are further improved. It becomes possible to improve.

The aryl group as E is, for example, a phenyl group, a naphthyl group, a phenanthryl group, or an anthryl group.
The group having a heterocyclic structure as E may have aromaticity or may not have aromaticity. The heteroatom contained in this group is preferably a nitrogen atom or an oxygen atom. Specific examples of the heterocyclic structure include lactone ring, furan ring, thiophene ring, benzofuran ring, benzothiophene ring, dibenzofuran ring, dibenzothiophene ring, pyridine ring, piperidine ring and morpholine ring. Among these, a furan ring, a thiophene ring, a pyridine ring, a piperidine ring, and a morpholine ring are preferable.

  E may have a substituent. Examples of the substituent include an alkyl group (which may be linear, branched or cyclic, preferably 1 to 12 carbon atoms), an aryl group (preferably 6 to 14 carbon atoms), a hydroxy group, Examples include an alkoxy group, an ester group, an amide group, a urethane group, a ureido group, a thioether group, a sulfonamide group, and a sulfonic acid ester group.

The compound represented by the general formula (I) is decomposed by irradiation with actinic rays or radiation to generate an acid represented by the general formula HX. The present inventors have found that scum defects can be further suppressed when the acid volume represented by the general formula HX is 130 ³ or more as X ⁻ in the general formula (I).

The volume of the acid represented by the general formula HX is preferably 130 ³ or more, more preferably 200 ³ or more, and further preferably 240 ³ or more. The volume is preferably 2000 ³ or less, and more preferably 1500 ³ or less. If this volume is excessively increased, the sensitivity and / or coating solvent solubility may decrease.

  The volume of the acid was determined using “WinMOPAC” manufactured by Fujitsu Limited as follows. That is, first, the chemical structure of each acid was input. Next, using this structure as an initial structure, the most stable conformation of each acid was determined by molecular force field calculation using the MM3 method. Thereafter, molecular orbital calculation using the PM3 method was performed for these most stable conformations to calculate the “accessible volume” of each acid.

In the following Table 1, X ^- Specific examples of the anion represented by. In Table 1, the calculated value of the volume of the corresponding generated acid is also shown.

Specific examples of the compound represented by the general formula (I) are given below.

  The compound represented by the general formula (I) is synthesized, for example, as follows. First, a hydroxide, bromide, or chloride corresponding to the above-described cation moiety is prepared. Next, a lithium salt, a sodium salt, or a potassium salt corresponding to the above-described anion portion is prepared. These are reacted by a salt exchange method or a method using an ion exchange resin. Thus, the compound represented by general formula (I) is obtained. The salt exchange method or the method using an ion exchange resin is described in, for example, JP-T-11-501909 and JP-A-2003-246786.

  The composition according to the present invention may further contain a compound other than the compound represented by the general formula (I) as a photoacid generator.

Examples of the photoacid generator that can be used in combination include compounds represented by the following general formulas (ZX), (ZXI), and (ZXII).

In the general formula (ZX), R ₂₀₁ , R ₂₀₂ and R ₂₀₃ each independently represents an organic group. The carbon number of the organic group as R _201, R ₂₀₂ and R ₂₀₃ is, for example, 1 to 30, preferably 1 to 20.
Two of R _{201 to} R ₂₀₃ may be bonded to each other via a single bond or a linking group to form a ring structure. Examples of the linking group in this case include an ether bond, a thioether bond, an ester bond, an amide bond, a carbonyl group, a methylene group, and an ethylene group. Examples of the group formed by combining two of R _{201 to} R ₂₀₃ include alkylene groups such as a butylene group and a pentylene group.

Other preferable examples of the photoacid generator that can be used in combination include compounds represented by the following general formula (ZIV), (ZV), or (ZVI).

In general formulas (ZIV) to (ZVI),
Ar ₃ and Ar ₄ each independently represents a substituted or unsubstituted aryl group.
R ₂₀₈ represents an alkyl group, a cycloalkyl group, or an aryl group independently in the general formulas (ZV) and (ZVI). These alkyl group, cycloalkyl group and aryl group may be substituted or unsubstituted.
These groups are preferably substituted with a fluorine atom. If it carries out like this, it will become possible to raise the intensity | strength of the acid which a photo-acid generator generate | occur | produces.

R ₂₀₉ and R ₂₁₀ each independently represents an alkyl group, a cycloalkyl group, an aryl group, or an electron-withdrawing group. These alkyl group, cycloalkyl group, aryl group and electron-withdrawing group may be substituted or unsubstituted.
Preferable R ₂₀₉ includes a substituted or unsubstituted aryl group.
Preferable R ₂₁₀ includes an electron withdrawing group. As this electron attractive group, Preferably, a cyano group and a fluoroalkyl group are mentioned.

  A represents an alkylene group, an alkenylene group or an arylene group. These alkylene group, alkenylene group and arylene group may have a substituent.

Below, the specific example of the photo-acid generator which can be used together is shown.

  As the compound represented by the general formula (I), one type may be used alone, or two or more types may be used in combination.

  The content of the compound represented by the general formula (I) is preferably 0.1 to 50% by mass, more preferably 0.5 to 45% by mass, based on the total solid content of the composition, More preferably, it is 1-40 mass%.

  When the compound represented by formula (I) is used in combination with another photoacid generator, the ratio of the former to the latter is preferably in the range of 50:50 to 99: 1, more preferably 70. : Within the range of 30 to 90:10.

  The total amount of the photoacid generator is preferably 0.1 to 50% by mass, more preferably 0.5 to 40% by mass, further preferably 1 to 40, based on the total solid content of the composition. % By mass.

[2] Acid-decomposable resin The acid-decomposable resin typically includes a group (hereinafter also referred to as an acid-decomposable group) that is decomposed by the action of an acid to generate an alkali-soluble group. This resin may have an acid-decomposable group in one of the main chain and side chain of the resin, or in both of them. This resin preferably has an acid-decomposable group in the side chain.

  As the acid-decomposable group, a group in which a hydrogen atom of an alkali-soluble group such as a —COOH group and a —OH group is substituted with a group capable of leaving by the action of an acid is preferable. As the group capable of leaving by the action of an acid, an acetal group or a tertiary ester group is particularly preferable.

  Examples of the base resin in the case where these acid-decomposable groups are bonded as side chains include alkali-soluble resins having —OH or —COOH groups in the side chains. Examples of such alkali-soluble resins include those described later.

  The alkali dissolution rate of these alkali-soluble resins is preferably 17 nm / second or more as measured with 0.261N tetramethylammonium hydroxide (TMAH) (23 ° C.). This speed is particularly preferably 33 nm / second or more.

  From this point of view, particularly preferable alkali-soluble resins include o-, m- and p-poly (hydroxystyrene) and copolymers thereof, hydrogenated poly (hydroxystyrene), halogen or alkyl-substituted poly (hydroxystyrene). ), Partially O-alkylated or O-acylated product of poly (hydroxystyrene), styrene-hydroxystyrene copolymer, α-methylstyrene-hydroxystyrene copolymer, and hydrogenated novolac resin. And a resin containing a repeating unit having a carboxy group such as (meth) acrylic acid and norbornenecarboxylic acid.

  Examples of the preferred repeating unit having an acid-decomposable group include t-butoxycarbonyloxystyrene, 1-alkoxyethoxystyrene, and (meth) acrylic acid tertiary alkyl ester. As this repeating unit, 2-alkyl-2-adamantyl (meth) acrylate or dialkyl (1-adamantyl) methyl (meth) acrylate is more preferable.

  Resins that are decomposed by the action of an acid and have increased solubility in an alkaline developer are disclosed in European Patent 254853, JP-A-2-25850, JP-A-3-223860, JP-A-4-251259, and the like. As disclosed, for example, a resin is reacted with a precursor of a group capable of leaving by the action of an acid, or an alkali-soluble resin monomer having a group capable of leaving by the action of an acid is combined with various monomers. It is obtained by polymerizing.

  In the case where the composition of the present invention is irradiated with KrF excimer laser light, electron beam, X-ray or high energy light having a wavelength of 50 nm or less (for example, EUV), this resin preferably has a hydroxystyrene repeating unit. . More preferably, the resin is a copolymer of hydroxystyrene and hydroxystyrene protected with a group capable of leaving by the action of an acid, or a copolymer of hydroxystyrene and a (meth) acrylic acid tertiary alkyl ester. It is.

Specific examples of such a resin include a resin having a repeating unit represented by the following general formula (A).

In the formula, R ₀₁ , R ₀₂ and R ₀₃ each independently represent, for example, a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. Ar ₁ represents an aromatic ring group, for example. Note that R ₀₃ is an alkylene group, and may combine with L ₁ or Ar ₁ as an aromatic ring group to form a ring together with the —C—C— chain. R ₀₃ and Ar ₁ are alkylene groups, and they may be bonded to each other to form, for example, a 5-membered or 6-membered ring together with the —C—C— chain.

n Y's each independently represent a hydrogen atom or a group capable of leaving by the action of an acid. However, at least one of Y represents a group capable of leaving by the action of an acid.
n represents an integer of 1 or more, preferably 1 to 4, more preferably 1 to 2, and more preferably 1.
Lp represents a single bond or a divalent linking group.

The alkyl group as R _{01 to} R ₀₃ is, for example, an alkyl group having 20 or less carbon atoms, and preferably a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, or a hexyl group. , 2-ethylhexyl group, octyl group or dodecyl group. More preferably, these alkyl groups are alkyl groups having 8 or less carbon atoms. In addition, these alkyl groups may have a substituent.

The alkyl group contained in the alkoxycarbonyl group is preferably the same as the alkyl group in R _{01 to} R ₀₃ described above.

  The cycloalkyl group may be a monocyclic cycloalkyl group or a polycyclic cycloalkyl group. Preferably, a C3-C8 monocyclic cycloalkyl group, such as a cyclopropyl group, a cyclopentyl group, and a cyclohexyl group, is mentioned. In addition, these cycloalkyl groups may have a substituent.

  Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and a fluorine atom is more preferable.

When R ₀₃ represents an alkylene group, the alkylene group is preferably an alkylene group having 1 to 8 carbon atoms such as a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group and an octylene group.

The aromatic ring group as Ar ₁ preferably has 6 to 14 carbon atoms, and examples thereof include a benzene ring, a toluene ring and a naphthalene ring. In addition, these aromatic ring groups may have a substituent.

Examples of the divalent linking group of Lp include an alkylene group, a cycloalkylene group, an arylene group, —COO—, —OCO—, —CO—, —O—, —S—, —S (═O) —, -S (= O) _2- , -OS (= O) _2- , -NH-, or a combination of two or more thereof can be given.

  The alkylene group represented by Lp may be linear or branched. The alkylene group preferably has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms. Examples of such an alkylene group include a methylene group, an ethylene group, and a propylene group.

  The cycloalkylene group represented by Lp may be monocyclic or polycyclic. The cycloalkylene group preferably has 3 to 20 carbon atoms, and more preferably 3 to 10 carbon atoms. Examples of such a cycloalkylene group include a 1,4-cyclohexylene group.

  The number of carbon atoms of the arylene group represented by Lp is preferably 6-20, and more preferably 6-10. Examples of such an arylene group include a phenylene group and a naphthylene group.

  The alkylene group, cycloalkylene group and arylene group may have a substituent. Examples of such a substituent include the same substituents as those described above for R in the general formula (I).

Examples of the group Y leaving by the action of an acid include —C (R ₃₆ ) (R ₃₇ ) (R ₃₈ ), —C (═O) —O—C (R ₃₆ ) (R ₃₇ ) (R ₃₈ ). ), -C (R ₀₁ ) (R ₀₂ ) (OR ₃₉ ), -C (R ₀₁ ) (R ₀₂ ) -C (= O) -O-C (R ₃₆ ) (R ₃₇ ) (R ₃₈ ) and And a group represented by —CH (R ₃₆ ) (Ar).

In the formula, R _{36 to} R ₃₉ each independently represents an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or an alkenyl group. R ₃₆ and R ₃₇ may be bonded to each other to form a ring structure.
R ₀₁ and R ₀₂ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group or an alkenyl group.
Ar represents an aryl group.

The alkyl group as R _{36 to} R ₃₉ , R ₀₁ or R ₀₂ is preferably an alkyl group having 1 to 8 carbon atoms, for example, methyl group, ethyl group, propyl group, n-butyl group, sec-butyl. Groups, hexyl groups and octyl groups.

The cycloalkyl group as R _{36 to} R ₃₉ , R ₀₁ or R ₀₂ may be a monocyclic cycloalkyl group or a polycyclic cycloalkyl group. The monocyclic cycloalkyl group is preferably a cycloalkyl group having 3 to 8 carbon atoms, and examples thereof include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. The polycyclic cycloalkyl group is preferably a cycloalkyl group having 6 to 20 carbon atoms, such as an adamantyl group, norbornyl group, isobornyl group, camphanyl group, dicyclopentyl group, α-pinel group, tricyclodecanyl group, A tetracyclododecyl group and an androstanyl group are mentioned. A part of carbon atoms in the cycloalkyl group may be substituted with a hetero atom such as an oxygen atom.

The aryl group as R _{36 to} R ₃₉ , R ₀₁ , R ₀₂ or Ar is preferably an aryl group having 6 to 10 carbon atoms, and examples thereof include a phenyl group, a naphthyl group, and an anthryl group.

The aralkyl group as R _{36 to} R ₃₉ , R ₀₁ or R ₀₂ is preferably an aralkyl group having 7 to 12 carbon atoms, and for example, a benzyl group, a phenethyl group and a naphthylmethyl group are preferable.

The alkenyl group as R _{36 to} R ₃₉ , R ₀₁ or R ₀₂ is preferably an alkenyl group having 2 to 8 carbon atoms, and examples thereof include a vinyl group, an allyl group, a butenyl group, and a cyclohexenyl group.

The ring formed by combining R ₃₆ and R ₃₇ with each other may be monocyclic or polycyclic. The monocyclic type is preferably a cycloalkane structure having 3 to 8 carbon atoms, and examples thereof include a cyclopropane structure, a cyclobutane structure, a cyclopentane structure, a cyclohexane structure, a cycloheptane structure, and a cyclooctane structure. As the polycyclic type, a cycloalkane structure having 6 to 20 carbon atoms is preferable, and examples thereof include an adamantane structure, a norbornane structure, a dicyclopentane structure, a tricyclodecane structure, and a tetracyclododecane structure. Note that some of the carbon atoms in the ring structure may be substituted with a heteroatom such as an oxygen atom.

  Each of the above groups may have a substituent. Examples of the substituent include an alkyl group, a cycloalkyl group, an aryl group, an amino group, an amide group, a ureido group, a urethane group, a hydroxyl group, a carboxy group, a halogen atom, an alkoxy group, a thioether group, an acyl group, and an acyloxy group. , Alkoxycarbonyl group, cyano group and nitro group. These substituents preferably have 8 or less carbon atoms.

As the group Y leaving by the action of an acid, a structure represented by the following general formula (B) is more preferable.

In the formula, L ₁ and L ₂ each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, an aryl group or an aralkyl group.
M represents a single bond or a divalent linking group.
Q represents an alkyl group, a cycloalkyl group, a cycloaliphatic group, an aromatic ring group, an amino group, an ammonium group, a mercapto group, a cyano group, or an aldehyde group. In addition, these cycloaliphatic groups and aromatic ring groups may contain a hetero atom.
In addition, at least two of Q, M, and L ₁ may be bonded to each other to form a 5-membered or 6-membered ring.

The alkyl group as L ₁ and L ₂ is, for example, an alkyl group having 1 to 8 carbon atoms, and specifically includes a methyl group, an ethyl group, a propyl group, an n-butyl group, a sec-butyl group, a hexyl group, and An octyl group is mentioned.

The cycloalkyl group as L ₁ and L ₂ is, for example, a cycloalkyl group having 3 to 15 carbon atoms, and specific examples include a cyclopentyl group, a cyclohexyl group, a norbornyl group, and an adamantyl group.

The aryl group as L ₁ and L ₂ is, for example, an aryl group having 6 to 15 carbon atoms, and specifically includes a phenyl group, a tolyl group, a naphthyl group, and an anthryl group.

The aralkyl group as L ₁ and L ₂ is, for example, an aralkyl group having 6 to 20 carbon atoms, and specific examples include a benzyl group and a phenethyl group.

The divalent linking group as M is, for example, an alkylene group (for example, methylene group, ethylene group, propylene group, butylene group, hexylene group or octylene group), cycloalkylene group (for example, cyclopentylene group or cyclohexylene group). ), an alkenylene group (e.g., an ethylene group, a propenylene group or a butenylene group), an arylene group (e.g., phenylene, tolylene or naphthylene group), - S -, - O -, - CO -, - SO 2 -, - N (R ₀ ) — or a combination of two or more thereof. Here, R ₀ is a hydrogen atom or an alkyl group. The alkyl group as R ₀ is, for example, an alkyl group having 1 to 8 carbon atoms, and specifically includes a methyl group, an ethyl group, a propyl group, an n-butyl group, a sec-butyl group, a hexyl group, and an octyl group. Can be mentioned.

The alkyl group and cycloalkyl group as Q are the same as the above-described groups as L ₁ and L ₂ .

Examples of the cycloaliphatic group or aromatic ring group represented by Q include the above-described cycloalkyl groups and aryl groups as L ₁ and L ₂ . These cycloalkyl group and aryl group are preferably groups having 3 to 15 carbon atoms.

  Examples of the cycloaliphatic group or aromatic ring group containing a hetero atom represented by Q include thiirane, cyclothiolane, thiophene, furan, pyrrole, benzothiophene, benzofuran, benzopyrrole, triazine, imidazole, benzimidazole, triazole, Examples thereof include groups having a heterocyclic structure such as thiadiazole, thiazole, and pyrrolidone. However, the ring is not limited to these as long as it is a ring formed of carbon and a heteroatom, or a ring formed only of a heteroatom.

Examples of the ring structure that can be formed by bonding at least two of Q, M, and L ₁ to each other include a 5-membered or 6-membered ring structure in which these form a propylene group or a butylene group. This 5-membered or 6-membered ring structure contains an oxygen atom.

Each group represented by L ₁ , L ₂ , M and Q in the general formula (B) may have a substituent. Examples of the substituent include an alkyl group, a cycloalkyl group, an aryl group, an amino group, an amide group, a ureido group, a urethane group, a hydroxyl group, a carboxy group, a halogen atom, an alkoxy group, a thioether group, an acyl group, and an acyloxy group. , Alkoxycarbonyl group, cyano group and nitro group. These substituents preferably have 8 or less carbon atoms.

  The group represented by-(MQ) is preferably a group having 1 to 30 carbon atoms, and more preferably a group having 5 to 20 carbon atoms. In particular, from the viewpoint of outgas suppression, a group having 6 or more carbon atoms is preferable.

Other preferred resins include resins having a repeating unit represented by the following general formula (X).

In general formula (X),
Xa ₁ represents a hydrogen atom, a methyl group, a trifluoromethyl group or a hydroxymethyl group. T represents a single bond or a divalent linking group.
Rx ₁ to Rx ₃ are each independently a linear or branched alkyl group, or a cycloalkyl group of monocyclic or polycyclic ring. In addition, at least two of Rx _{1 to} Rx ₃ may be bonded to each other to form a monocyclic or polycyclic cycloalkyl group.

  Examples of the divalent linking group as T include an alkylene group, a-(COO-Rt)-group, and a-(O-Rt)-group. Here, Rt represents an alkylene group or a cycloalkylene group.

T is preferably a single bond or a-(COO-Rt)-group. Here, Rt is preferably an alkylene group having 1 to 5 carbon atoms, more preferably a —CH ₂ — group or a — (CH ₂ ) ₃ — group.

The alkyl group as Rx _{1 to} Rx ₃ is preferably an alkyl group having 1 to 4 carbon atoms such as methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group and t-butyl group. It is.

The cycloalkyl group as Rx _{1 to} Rx ₃ is preferably a monocyclic cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, or a norbornyl group, a tetracyclodecanyl group, a tetracyclododecanyl group and an adamantyl group. It is a polycyclic cycloalkyl group.

Examples of the cycloalkyl group that can be formed by combining at least two of Rx _{1 to} Rx ₃ with each other include a monocyclic cycloalkyl group such as a cyclopentyl group and a cyclohexyl group, or a norbornyl group, a tetracyclodecanyl group, a tetracyclododecane group, and the like. Polycyclic cycloalkyl groups such as nyl group and adamantyl group are preferred.

In particular, an embodiment in which Rx ₁ is a methyl group or an ethyl group, and Rx ₂ and Rx ₃ are bonded to each other to form the above-described cycloalkyl group is preferable.

Specific examples of the repeating unit represented by the general formula (X) are shown below, but the present invention is not limited thereto.

  The content of the repeating unit represented by the general formula (X) in the acid-decomposable resin is preferably in the range of 3 to 90 mol%, more preferably 5 to 80 mol%, based on all repeating units. And particularly preferably within the range of 7 to 70 mol%.

  In addition, when the composition of the present invention is irradiated with KrF excimer laser light, electron beam, X-ray or high energy light beam having a wavelength of 50 nm or less (for example, EUV), this resin is a compound represented by the general formula (VI). It is preferable to have a unit. Since the repeating unit of the general formula (VI) has an alkali-soluble group, it can assist the alkali solubility of the resin. Further, the pattern strength can be improved, and further, a function of controlling the Tg of a film formed using the composition of the present invention can be imparted.

In addition, when the present inventors use a combination of an acid-decomposable resin containing a repeating unit represented by the general formula (VI) and a compound represented by the above general formula (I), the present invention relates to the present invention. It has been found that the sensitivity of the composition can be further improved. The reason for this is not necessarily clear, but the present inventors have found that the amount of acid generated increases because the chain reaction described in J. Org. Chem. 2005, 70, 6809-6819 tends to occur. I guess that.

Where
R ₀₁ , R ₀₂ and R ₀₃ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. R ₀₃ represents an alkylene group, and may combine with Lp or Ar ₁ to form a ring.

Ar ₁ represents an aromatic ring group.

  n represents an integer of 1 or more.

  Lp represents a single bond or a divalent linking group.

  n is preferably 1 to 4, more preferably 1 to 2, and still more preferably 1.

The alkyl group as R _{01 to} R ₀₃ is, for example, an alkyl group having 20 or less carbon atoms, and preferably a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, or a hexyl group. , 2-ethylhexyl group, octyl group or dodecyl group. More preferably, these alkyl groups are alkyl groups having 8 or less carbon atoms. In addition, these alkyl groups may have a substituent.

The alkyl group contained in the alkoxycarbonyl group is preferably the same as the alkyl group in R _{01 to} R ₀₃ described above.
The cycloalkyl group may be a monocyclic cycloalkyl group or a polycyclic cycloalkyl group. Preferably, a C3-C8 monocyclic cycloalkyl group, such as a cyclopropyl group, a cyclopentyl group, and a cyclohexyl group, is mentioned. In addition, these cycloalkyl groups may have a substituent.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and a fluorine atom is more preferable.
When R ₀₃ represents an alkylene group, the alkylene group is preferably an alkylene group having 1 to 8 carbon atoms such as a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group and an octylene group.
The aromatic ring group as Ar ₁ preferably has 6 to 14 carbon atoms, and examples thereof include a benzene ring, a toluene ring and a naphthalene ring. In addition, these aromatic ring groups may have a substituent.
As Lp, the thing similar to having demonstrated previously general formula (A) is mentioned, for example.

Specific examples of the repeating unit represented by the general formula (VI) are shown below.

  The content of the repeating unit represented by the general formula (VI) in the acid-decomposable resin is preferably in the range of 20 to 90 mol%, more preferably 30 to 80 mol%, based on all repeating units. Is within the range.

Although the specific example of resin demonstrated above is shown below, this invention is not limited to these.

In the above specific example, tBu represents a t-butyl group.
The content of the group capable of decomposing with an acid is determined by the formula B according to the number of groups (B) capable of decomposing with an acid in the resin and the number of alkali-soluble groups not protected by a group capable of leaving with an acid (S). / (B + S). This content is preferably 0.01 to 0.7, more preferably 0.05 to 0.50, and still more preferably 0.05 to 0.40.

  When the composition of the present invention is irradiated with ArF excimer laser light, the resin preferably has a monocyclic or polycyclic alicyclic hydrocarbon structure. Hereinafter, such a resin is referred to as “alicyclic hydrocarbon-based acid-decomposable resin”.

Examples of the alicyclic hydrocarbon-based acid-decomposable resin include a repeating unit having a partial structure containing an alicyclic hydrocarbon represented by the following general formulas (pI) to (pV), and the following general formula (II-
A resin containing at least one selected from the group consisting of repeating units represented by AB) is preferred.

In general formulas (pI) to (pV),
R ₁₁ represents a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group or a sec-butyl group, and Z is an atom necessary for forming a cycloalkyl group together with a carbon atom. Represents a group.
R _{12 to} R ₁₆ each independently represents a linear or branched alkyl group having 1 to 4 carbon atoms or a cycloalkyl group. However, at least one of R _{12 to} R ₁₄ represents a cycloalkyl group. Moreover, any of R ₁₅ and R ₁₆ represents a cycloalkyl group.

R _{17 to} R ₂₁ each independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 4 carbon atoms, or a cycloalkyl group. However, at least one of R _{17 to} R ₂₁ represents a cycloalkyl group. Further, any one of R ₁₉ and R ₂₁ represents a linear or branched alkyl group or cycloalkyl group having 1 to 4 carbon atoms.
R _{22 to} R ₂₅ each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 4 carbon atoms, or a cycloalkyl group. However, at least one of R _{22 to} R ₂₅ represents a cycloalkyl group. R ₂₃ and R ₂₄ may be bonded to each other to form a ring structure.

In general formula (II-AB),
R ₁₁ ′ and R ₁₂ ′ each independently represents a hydrogen atom, a cyano group, a halogen atom or an alkyl group.
Z ′ represents an atomic group necessary for forming an alicyclic structure with two bonded carbon atoms (C—C).

The general formula (II-AB) is more preferably the following general formula (II-AB1) or general formula (II-AB2).

In general formulas (II-AB1) and (II-AB2),
R ₁₃ ′ to R ₁₆ ′ each independently represents a hydrogen atom, a halogen atom, a cyano group, a hydroxy group, —COOH, —COOR ₅ , a group that decomposes by the action of an acid, —C (═O) —XA '−
R ₁₇ ′ represents an alkyl group or a cycloalkyl group. Here, R ₅ represents an alkyl group, a cycloalkyl group, or a group having a lactone structure. X represents an oxygen atom, a sulfur atom, -NH -, - NHSO ₂ - or an -NHSO ₂ NH-. A ′ represents a single bond or a divalent linking group. R ₁₇ ′ represents —COOH, —COOR ₅ , —CN, a hydroxy group, an alkoxy group, —CO—NH—R ₆ , —CO—NH—SO ₂ —R ₆ or a group having a lactone structure. Here, R ₆ represents an alkyl group or a cycloalkyl group. In addition, at least two of R ₁₃ ′ to R ₁₆ ′ may be bonded to each other to form a ring structure.
n represents 0 or 1.

In general formulas (pI) to (pV), the alkyl group in R _{12 to} R ₂₅ is preferably a linear or branched alkyl group having 1 to 4 carbon atoms, such as a methyl group, an ethyl group, or a propyl group. , N-butyl group, sec-butyl group and t-butyl group.

The cycloalkyl group in R _{12 to} R ₂₅ or the cycloalkyl group formed by Z and a carbon atom may be a monocyclic cycloalkyl group or a polycyclic cycloalkyl group. Specific examples include groups having a monocyclo, bicyclo, tricyclo, and tetracyclo structure having 5 or more carbon atoms. 6-30 are preferable and, as for the carbon number, 7-25 are especially preferable.

  Preferred cycloalkyl groups include, for example, an adamantyl group, norbornyl group, cyclohexyl group, cyclopentyl group, tetracyclododecanyl group, and tricyclodecanyl group.

  The structures represented by the general formulas (pI) to (pV) can be used for protecting alkali-soluble groups. Examples of the alkali-soluble group include various groups known in this technical field.

  Specifically, for example, a structure in which a hydrogen atom such as a carboxylic acid group, a sulfonic acid group, a phenol group, and a thiol group is substituted with a structure represented by general formulas (pI) to (pV) can be given. A structure in which a hydrogen atom of a carboxylic acid group or a sulfonic acid group is substituted with a structure represented by general formulas (pI) to (pV) is preferable.

As the repeating unit having an alkali-soluble group protected by the structure represented by the general formulas (pI) to (pV), a repeating unit represented by the following general formula (pA) is preferable.

In general formula (pA),
R represents a hydrogen atom, a halogen atom, or a linear or branched alkyl group having 1 to 4 carbon atoms. Each of the plurality of Rs may be the same as or different from each other.
A is selected from the group consisting of a single bond, an alkylene group, an ether group, a thioether group, a carbonyl group, an ester group, an amide group, a sulfonamide group, a urethane group, a urea group, and combinations of two or more thereof, preferably It is a single bond.
Rp ₁ is a group represented by any one of the general formulas (pI) to (pV).

  The repeating unit represented by the general formula (pA) is most preferably a repeating unit of 2-alkyl-2-adamantyl (meth) acrylate or dialkyl (1-adamantyl) methyl (meth) acrylate.

Specific examples of the repeating unit represented by the general formula (pA) are shown below.

In the above structural formulas, Rx is _H, represent CH 3, CF ₃ or _CH 2 OH, Rxa and Rxb each independently represents an alkyl group having 1 to 4 carbon atoms.

The halogen atom as R ₁₁ ′ or R ₁₂ ′ in the general formula (II-AB) is, for example, a chlorine atom, a bromine atom, a fluorine atom or an iodine atom.

The alkyl group as R ₁₁ ′ or R ₁₂ ′ is preferably a linear or branched alkyl group having 1 to 10 carbon atoms. For example, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and a linear group Or a branched butyl group, a pentyl group, a hexyl group, and a heptyl group are mentioned.

  The atomic group represented by Z ′ is an atomic group that forms a repeating unit of an alicyclic hydrocarbon which may have a substituent in the resin. As this atomic group, those forming a repeating unit of a bridged alicyclic hydrocarbon are preferable.

Examples of the skeleton of the alicyclic hydrocarbon formed include the same cycloalkyl groups as R _{12 to} R ₂₅ in the general formulas (pI) to (pVI).

The alicyclic hydrocarbon skeleton may have a substituent. Examples of such a substituent include R ₁₃ ′ to R ₁₆ ′ in the above general formulas (II-AB1) and (II-AB2).

In the alicyclic hydrocarbon-based acid-decomposable resin, the group capable of decomposing by the action of an acid is a repeating unit having a partial structure containing an alicyclic hydrocarbon represented by the general formula (pI) to the general formula (pV). , At least one of the repeating unit represented by the general formula (II-AB) and the repeating unit of the copolymer component described later.

Each substituent of R ₁₃ ′ to R ₁₆ ′ in the general formulas (II-AB1) and (II-AB2) is an alicyclic structure or a bridged alicyclic structure in the general formula (II-AB). It can also be a substituent of the atomic group Z ′ to form.

Specific examples of the repeating unit represented by the general formula (II-AB1) or (II-AB2) are shown below, but the present invention is not limited to these examples.

  The alicyclic hydrocarbon-based acid-decomposable resin preferably has a repeating unit containing a lactone group. This lactone group is preferably a group having a 5- to 7-membered ring lactone structure, and in particular, other ring structures are condensed to form a bicyclo structure or a spiro structure in the 5- to 7-membered ring lactone structure. Is preferred.

This alicyclic hydrocarbon-based acid-decomposable resin more preferably contains a repeating unit having a group containing a lactone structure represented by any of the following general formulas (LC1-1) to (LC1-17). Yes. The group having a lactone structure may be directly bonded to the main chain. Preferred lactone structures include (LC1-1), (LC1-4), (LC1-5), (LC1-6), (LC1-13), (LC1-14) and (LC1-17). . By using specific lactone structures, line edge roughness and development defects can be further reduced.

The lactone structure portion may or may not have a substituent (Rb ₂ ). Preferred substituents (Rb ₂ ) include, for example, an alkyl group having 1 to 8 carbon atoms, a cycloalkyl group having 3 to 7 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkoxycarbonyl group having 1 to 8 carbon atoms, Examples thereof include a carboxy group, a halogen atom, a hydroxy group, a cyano group, and an acid-decomposable group.

n ₂ represents an integer of 0-4. When n ₂ is an integer of 2 or more, a plurality of Rb ₂ may be the same or different from each other. In this case, a plurality of Rb2s may be bonded to each other to form a ring structure.

Examples of the repeating unit having a group containing a lactone structure represented by any one of the general formulas (LC1-1) to (LC1-17) include those in the general formulas (II-AB1) and (II-AB2). Wherein at least one of R ₁₃ ′ to R ₁₆ ′ has a group represented by general formulas (LC1-1) to (LC1-17), and a repeating unit represented by the following general formula (AI) Is mentioned. Examples of the former include structures in which R _{5 of} —COOR ₅ is a group represented by general formulas (LC1-1) to (LC1-17).

In general formula (AI), Rb ₀ represents a hydrogen atom, a halogen atom, or an alkyl group having 1 to 4 carbon atoms.
The alkyl group as Rb ₀ is, for example, a methyl group, an ethyl group, a propyl group, an n-butyl group, a sec-butyl group or a t-butyl group. These alkyl groups may have a substituent. Examples of the substituent include a hydroxy group and a halogen atom.

Examples of the halogen atom for Rb ₀ include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.
Rb ₀ is preferably a hydrogen atom or a methyl group.

Ab is an alkylene group, a divalent linking group having a monocyclic or polycyclic alicyclic hydrocarbon structure,
A single bond, an ether group, an ester group, a carbonyl group, a carboxy group, or a combination thereof is represented. Ab is preferably a single bond or a linking group represented by —Ab ₁ —CO ₂ —.
Ab ₁ is a linear or branched alkylene group or a monocyclic or polycyclic cycloalkylene group, preferably a methylene group, an ethylene group, a cyclohexylene group, an adamantylene group or a norbornylene group.

  V is a group represented by any one of the general formulas (LC1-1) to (LC1-17).

  The repeating unit having a lactone structure usually has an optical isomer, but any optical isomer may be used. One optical isomer may be used alone, or a plurality of optical isomers may be mixed and used. When one kind of optical isomer is mainly used, the optical purity thereof is preferably 90% ee or more, more preferably 95% ee or more.

Particularly preferred repeating units having a lactone group include the following repeating units. By selecting an optimal lactone group, the pattern profile and the density dependency are improved. In the formula, Rx and R represent H, CH ₃ , CH ₂ OH or CF ₃ .

  The alicyclic hydrocarbon-based acid-decomposable resin preferably has a repeating unit containing an alicyclic hydrocarbon structure substituted with a polar group. Thereby, substrate adhesiveness and developer affinity can be improved. As this polar group, a hydroxy group or a cyano group is preferable. In addition, the hydroxy group as a polar group forms an alcoholic hydroxy group.

Examples of the alicyclic hydrocarbon structure substituted with a polar group include structures represented by the following general formula (VIIa) or (VIIb).

In General Formula (VIIa), R ₂ c to R ₄ c each independently represents a hydrogen atom, a hydroxy group, or a cyano group. However, at least one of R ₂ c to R ₄ c represents a hydroxy group or a cyano group. Preferably, a one or two hydroxy groups of the R ₂ c to R 4 _c, and the remainder is a hydrogen atom. More preferably, a two are hydroxyl groups of R ₂ c to R 4 _c, the remaining one is a hydrogen atom.

  The group represented by the general formula (VIIa) is preferably a dihydroxy body or a monohydroxy body, and more preferably a dihydroxy body.

The repeating unit having a group represented by the general formula (VIIa) or (VIIb) includes at least one of R ₁₃ ′ to R ₁₆ ′ in the general formula (II-AB1) or (II-AB2). Examples thereof include those having a group represented by the above general formula (VIIa) or (VIIb) and repeating units represented by the following general formula (AIIa) or (AIIb). Examples of the former include structures in which R _{5 of} —COOR ₅ is a group represented by the general formula (VIIa) or (VIIb).

In general formulas (AIIa) and (AIIb),
R ₁ c represents a hydrogen atom, a methyl group, a trifluoromethyl group, or a hydroxymethyl group.

R ₂ c to R ₄ c have the same meanings as _{R 2} c to R ₄ c in the general formula (VIIa).

Specific examples of the repeating unit represented by the general formula (AIIa) or (AIIb) are shown below, but the present invention is not limited thereto.

The alicyclic hydrocarbon-based acid-decomposable resin may have a repeating unit represented by the following general formula (VIII).

In General Formula (VIII), Z ₂ represents —O— or —N (R ₄₁ ) —. R ₄₁ represents a hydrogen atom, a hydroxy group, an alkyl group, or —OSO ₂ —R ₄₂ . Wherein R ₄₂ represents an alkyl group, a cycloalkyl group or a camphor residue. The alkyl group as R ₄₁ or R ₄₂ may be substituted with a halogen atom or the like. In this case, the halogen atom is preferably a fluorine atom.

Examples of the repeating unit represented by the general formula (VIII) include the following specific examples, but the present invention is not limited thereto.

  The alicyclic hydrocarbon-based acid-decomposable resin preferably has a repeating unit containing an alkali-soluble group, and more preferably has a repeating unit containing a carboxy group. Thereby, the resolution in contact hole use can be improved.

  As the repeating unit containing a carboxy group, any of a repeating unit in which a carboxy group is directly bonded to the main chain of the resin and a repeating unit in which a carboxy group is bonded to the main chain of the resin via a linking group. preferable.

  As an example of the former, a repeating unit by acrylic acid or methacrylic acid can be mentioned. The linking group in the latter may have a monocyclic or polycyclic cycloalkyl structure.

  The repeating unit containing a carboxy group is most preferably a repeating unit of acrylic acid or methacrylic acid.

The resin containing the repeating unit (A) may further contain a repeating unit which has an alicyclic hydrocarbon structure having no polar group and does not exhibit acid decomposability. Examples of such a repeating unit include a repeating unit represented by the following general formula (IV).

In general formula (IV), R ₅ represents a hydrocarbon group having at least one cyclic structure and having neither a hydroxy group nor a cyano group.
Ra represents a hydrogen atom, an alkyl group, or a group represented by —CH ₂ —O—Ra ₂ . Here, Ra2 represents a hydrogen atom, an alkyl group, or an acyl group. Ra is preferably a hydrogen atom, a methyl group, a hydroxymethyl group or a trifluoromethyl group, and particularly preferably a hydrogen atom or a methyl group.

Examples of the cyclic structure provided in R ₅ include a monocyclic hydrocarbon group and a polycyclic hydrocarbon group.
Examples of the monocyclic hydrocarbon group include a cycloalkyl group having 3 to 12 carbon atoms such as a cyclopentyl group, a cyclohexyl group, a cycloheptyl group and a cyclooctyl group, and 3 carbon atoms such as a cyclohexenyl group. ˜12 cycloalkenyl groups. Preferred monocyclic hydrocarbon groups include those having 3 to 7 carbon atoms. Examples of such monocyclic hydrocarbon groups include a cyclopentyl group and a cyclohexyl group.

The polycyclic hydrocarbon group includes a ring assembly hydrocarbon group and a bridged cyclic hydrocarbon group.
Examples of the ring assembly hydrocarbon group include a bicyclohexyl group and a perhydronaphthalenyl group.

Preferred examples of the bridged cyclic hydrocarbon group include a norbornyl group, an adamantyl group, a bicyclooctanyl group, and a tricyclo [5,2,1,0 ^2,6 ] decanyl group. More preferable examples of the bridged cyclic hydrocarbon group include a norbornyl group and an adamantyl group.

Preferred halogen atoms include bromine, chlorine and fluorine atoms.
Preferred alkyl groups include methyl, ethyl, butyl and t-butyl groups. This alkyl group may further have a substituent. Examples of the substituent include a halogen atom, an alkyl group, a hydroxy group protected with a protecting group, and an amino group protected with a protecting group.

  Examples of the protecting group include an alkyl group, a cycloalkyl group, an aralkyl group, a substituted methyl group, a substituted ethyl group, an alkoxycarbonyl group, and an aralkyloxycarbonyl group. Preferred alkyl groups include those having 1 to 4 carbon atoms. Preferred substituted methyl groups include methoxymethyl, methoxythiomethyl, benzyloxymethyl, t-butoxymethyl and 2-methoxyethoxymethyl groups. Preferred substituted ethyl groups include 1-ethoxyethyl and 1-methyl-1-methoxyethyl groups. Preferable acyl groups include aliphatic acyl groups having 1 to 6 carbon atoms such as formyl, acetyl, propionyl, butyryl, isobutyryl, valeryl and pivaloyl groups. Preferred alkoxycarbonyl groups include those having 1 to 4 carbon atoms.

Specific examples of the repeating unit having an alicyclic hydrocarbon structure having no polar group and not exhibiting acid decomposability are shown below. In these specific examples, Ra represents H, CH ₃ , CH ₂ OH or CF ₃ .

  The content of the repeating unit having an alicyclic hydrocarbon structure not having a polar group and not exhibiting acid decomposability is preferably 0 to 40 mol% with respect to all repeating units in the resin. More preferably, it is -20 mol%.

  Resins suitable for KrF, EB, EUV and the like may have a repeating unit other than the repeating units described above. Examples of such a repeating unit include a repeating unit that is stable against the action of an acid.

Examples of the repeating unit stable to the action of an acid include a non-acid-decomposable aryl structure or cycloalkyl structure in the side chain of the acrylic structure, such as the repeating unit represented by the general formula (IV) described above. The repeating unit which has is mentioned. In the repeating unit represented by the general formula (IV), R ₅ is preferably a hydrocarbon group and has a cyclic structure therein. Specific examples in the case of having a cyclic structure include a monocyclic or polycyclic cycloalkyl group (preferably having 3 to 12 carbon atoms, more preferably 3 to 7 carbon atoms, and particularly preferably a cyclohexyl group), monocyclic or polycyclic A cycloalkenyl group (preferably having 3 to 12 carbon atoms), an aryl group (preferably having 6 to 20 carbon atoms, more preferably having 6 to 12 carbon atoms, particularly preferably a phenyl group or a naphthyl group), and an aralkyl group (preferably C7-20, more preferably C7-12, and particularly preferably benzyl group). By having such a structure, adjustment of contrast and improvement of etching resistance can be expected.

  The content of the repeating unit that is stable with respect to the action of the acid is preferably 0 to 40 mol%, more preferably 1 to 20 mol%, based on all repeating units in the acid-decomposable resin. .

Specific examples of the repeating unit that is stable against the action of an acid include the following in addition to the specific examples of the repeating unit represented by the general formula (IV). In the formula, Ra represents H, CH ₃ , CH ₂ OH, or CF ₃ .

  Specific examples of the repeating unit that is stable against the action of an acid are selected from, for example, (meth) acrylamides, allyl compounds, vinyl ethers, vinyl esters, styrenes, and crotonic acid esters in addition to the above. Examples thereof include compounds having at least one addition polymerizable unsaturated bond. Other examples include maleic anhydride, maleimide, acrylonitrile, methacrylonitrile, and maleilonitrile.

Although the preferable specific example of the repeating unit derived from such another polymerizable monomer is given to the following, it is not limited to these.

  The weight average molecular weight of the acid-decomposable resin is preferably in the range of 2,000 to 200,000 as a polystyrene conversion value determined by the GPC method. By setting the weight average molecular weight to 2,000 or more, heat resistance and dry etching resistance can be particularly improved. When the weight average molecular weight is 200,000 or less, the developability can be particularly improved, and the film forming property can also be improved due to the decrease in the viscosity of the composition.

  A more preferable molecular weight is in the range of 2,500 to 50,000, and still more preferably in the range of 3,000 to 20,000. Moreover, in the fine pattern formation using an electron beam, X-rays, and a high energy ray (for example, EUV) having a wavelength of 50 nm or less, the weight average molecular weight is most preferably in the range of 3,000 to 10,000. By adjusting the molecular weight, an improvement in the heat resistance and resolution of the composition and a reduction in development defects can be achieved at the same time.

  The resin dispersibility (Mw / Mn) which decomposes by the action of an acid and increases the solubility in an alkali developer is preferably from 1.0 to 3.0, more preferably from 1.2 to 2.5. 2 to 1.6 is more preferable. By adjusting the degree of dispersion, for example, the line edge roughness performance can be improved.

  The blending ratio of the acid-decomposable resin in the composition according to the present invention is preferably 0 to 99.9% by mass, more preferably 50 to 95% by mass, and 60 to 93% by mass based on the total solid content. Is more preferable.

[3] Alkali-soluble resin The alkali dissolution rate of the alkali-soluble resin is preferably 2 nm / second or more as measured with 0.261N tetramethylammonium hydroxide (TMAH) (23 ° C.). Particularly preferably, this rate is 20 nm / second or more.

  Examples of the alkali-soluble resin include novolak resin, hydrogenated novolak resin, acetone-pyrogallol resin, o-polyhydroxystyrene, m-polyhydroxystyrene, p-polyhydroxystyrene, hydrogenated polyhydroxystyrene, halogen or alkyl-substituted poly. Hydroxystyrene, hydroxystyrene-N-substituted maleimide copolymer, o / p- and m / p-hydroxystyrene copolymer, partially O-alkylated product with respect to hydroxy group of polyhydroxystyrene (for example, 5 to 30 mol%) O-methylated product, O- (1-methoxy) ethylated product, O- (1-ethoxy) ethylated product, O-2-tetrahydropyranylated product or O- (t-butoxycarbonyl) methylated product) or O-acyl (E.g. 5-30 mol% O-acetylated) Or O- (t-butoxy) carbonylated), styrene-maleic anhydride copolymer, styrene-hydroxystyrene copolymer, α-methylstyrene-hydroxystyrene copolymer, carboxy group-containing methacrylic resin and derivatives thereof, In addition, examples include, but are not limited to, polyvinyl alcohol derivatives.

  Preferred alkali-soluble resins include, for example, novolak resins, o-polyhydroxystyrene, m-polyhydroxystyrene, p-polyhydroxystyrene and copolymers thereof, alkyl-substituted polyhydroxystyrene, and partly O- of polyhydroxystyrene. Examples include alkylated or O-acylated products, styrene-hydroxystyrene copolymers, and α-methylstyrene-hydroxystyrene copolymers.

  In particular, a resin having a hydroxystyrene structure is preferable. Of the hydroxystyrene structures, the m-hydroxystyrene structure is particularly preferable.

  It is preferable that alkali-soluble resin contains the repeating unit represented by the general formula (VI) mentioned above. When the inventors use a combination of an alkali-soluble resin containing a repeating unit represented by the general formula (VI) and a compound represented by the general formula (I), the composition of the present invention It has been found that the sensitivity can be further improved. The reason for this is not necessarily clear, but the present inventors have found that the amount of acid generated increases because the chain reaction described in J. Org. Chem. 2005, 70, 6809-6819 tends to occur. I guess that.

  The novolak resin can be obtained, for example, by subjecting a predetermined monomer as a main component to addition condensation with aldehydes in the presence of an acidic catalyst.

  Moreover, the weight average molecular weight of alkali-soluble resin is 2000 or more, Preferably it is 5000-200000, More preferably, it is 5000-100000. Here, the weight average molecular weight is defined by a polystyrene conversion value obtained by GPC (gel permeation chromatography).

These alkali-soluble resins may be used alone or in combination of two or more.
The content of the alkali-soluble resin is, for example, 40 to 97% by mass, preferably 60 to 90% by mass, based on the total solid content in the composition.

  In place of the resin described above, a compound (A) described in JP2009-222920A and / or a fullerene derivative described in JP2010-024221A is used. Also good.

[4] Dissolution-inhibiting compound As the dissolution-inhibiting compound, an alicyclic or aliphatic compound containing an acid-decomposable group is preferable because it does not lower the permeability at 220 nm or less. Examples of such a compound include cholic acid derivatives containing an acid-decomposable group described in Proceeding of SPIE, 2724, 355 (1996). Examples of these alicyclic structures and acid-decomposable groups include those described for the alicyclic hydrocarbon-based acid-decomposable resin.

  When the composition according to the present invention is exposed with a KrF excimer laser or irradiated with an electron beam, the dissolution inhibiting compound may contain a structure in which the phenolic hydroxy group in the phenol compound is substituted with an acid-decomposable group. preferable. As this phenol compound, those containing 1 to 9 phenol skeletons are preferred, and those containing 2 to 6 are more preferred.

The molecular weight of the dissolution inhibiting compound is 3000 or less, preferably 300 to 3000, and more preferably 500 to 2500.
The addition amount of the dissolution inhibiting compound is preferably 3 to 50% by mass, more preferably 5 to 40% by mass, based on the total solid content in the composition.
Specific examples of the dissolution inhibiting compound are shown below, but the present invention is not limited thereto.

[5] Acid cross-linking agent Any acid cross-linking agent can be used as long as it is a compound that cross-links a resin soluble in an alkali developer by the action of an acid, but the following (1) to (3) are preferred. .

(1) A hydroxymethyl body, an alkoxymethyl body or an acyloxymethyl body of a phenol derivative.
(2) A compound having an N-hydroxymethyl group, an N-alkoxymethyl group or an N-acyloxymethyl group.
(3) A compound having an epoxy group.

  Here, as an alkoxymethyl group, a C6 or less thing is preferable. Moreover, as an acyloxymethyl group, a C6 or less thing is preferable.

Among these acid crosslinking agents, particularly preferred are listed below.

In the formula, L _{1 to} L ₈ each independently represent a hydrogen atom, a hydroxymethyl group, a methoxymethyl group, an ethoxymethyl group, or an alkyl group having 1 to 6 carbon atoms.

  The addition amount of the acid crosslinking agent is, for example, 3 to 70% by mass, preferably 5 to 50% by mass, based on the total solid content of the composition.

[6] Acid Proliferating Agent As described above, the acid proliferating agent is a substance that decomposes by the action of an acid and generates an acid stronger than carboxylic acid.
The acid produced from the acid proliferating agent is preferably one having a high acid strength. Specifically, the acid dissociation constant (pKa) is preferably 3 or less, more preferably 2 or less. The acid generated from the acid proliferating agent is preferably sulfonic acid.

Examples of the acid proliferating agent include International Publication No. 95/29968, International Publication No. 98/24000, Japanese Unexamined Patent Publication No. 8-305262, Japanese Unexamined Patent Publication No. 9-34106, Japanese Unexamined Patent Publication No. 8-248561, No. 8-503082, U.S. Pat. No. 5,445,917, JP-T-8-503081, U.S. Pat. No. 5,534,393, U.S. Pat. No. 5,395,736 US Pat. No. 5,741,630, US Pat. No. 5,334,489, US Pat. No. 5,582,956, US Pat. No. 5,578,424, US Patent No. 5,453,345, US Pat. No. 5,445,917, European Patent 665,960, European Patent 757,628, European Patent 665,961 Light U.S. Pat. No. 5,667,943, JP-A-10-1508, JP-A-10-282642, JP-A-9-512498, JP-A-2000-62337, JP-A-2005-2005. The acid proliferating agents described in Japanese Patent No. 17730, Japanese Patent Application Laid-Open No. 2008-209889, and the like can be used alone or in combination of two or more.
Specifically, compounds represented by the following general formulas (1) to (6) are preferable.

In the general formulas (1) to (6),
R represents an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group.

R ₀ represents a group capable of leaving by the action of an acid.
R ₁ represents an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group, an aralkyl group, an alkoxy group, or an aryloxy group.
R ₂ represents an alkyl group or an aralkyl group.
R ₃ represents an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group.
R ₄ and R ₅ each independently represents an alkyl group, and R ₄ and R ₅ may be bonded to each other to form a ring.

R ₆ represents a hydrogen atom or an alkyl group.
R ₇ represents a hydrogen atom, an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group.
R ₈ represents an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group.

R ₉ represents a hydrogen atom, an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group.
R ₉ may combine with R ₇ to form a ring.
R ₁₀ represents an alkyl group, a monovalent aliphatic hydrocarbon ring group, an alkoxy group, an aryl group, an aralkyl group, an aryloxy group or an alkenyloxy group.
R ₁₁ represents an alkyl group, a monovalent aliphatic hydrocarbon ring group, an alkoxy group, an aryl group, an aralkyl group, an aryloxy group or an alkenyl group.
R ₁₀ and R ₁₁ may combine with each other to form a ring.
R ₁₂ represents an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group, an alkenyl group, an alkynyl group or a cyclic imide group.

Preferred examples of each of R, R ₀ and R _{1 to} R ₁₁ include the following.
R: methyl group, ethyl group, propyl group, butyl group, octyl group, trifluoromethyl group, nonafluorobutyl group, heptadecafluorooctyl group, 2,2,2-trifluoroethyl group, phenyl group, pentafluorophenyl Group, methoxyphenyl group, toluyl group, mesityl group, fluorophenyl group, naphthyl group, cyclohexyl group, camphor group.

_R0 : t-butyl group, methoxymethyl group, ethoxymethyl group, 1-ethoxyethyl group, tetrahydropyranyl group.

R ₁ ; methyl group, ethyl group, propyl group, cyclopropyl group, cyclopentyl group, cyclohexyl group, phenyl group, naphthyl group, benzyl group, phenethyl group, methoxy group, ethoxy group, propoxy group, phenoxy group, naphthoxy group.

R ₂ : methyl group, ethyl group, propyl group, butyl group, benzyl group.

R ₃ : methyl group, ethyl group, propyl group, cyclopropyl group, cyclopentyl group, cyclohexyl group, phenyl group, naphthyl group, benzyl group, phenethyl group, naphthylmethyl group.

R ₄ , R ₅ : Methyl group, ethyl group, propyl group, those bonded to each other to form an ethylene group or a propylene group.

R ₆ : hydrogen atom, methyl group, ethyl group.

R ₇ , R ₉ ; hydrogen atom, methyl group, ethyl group, propyl group, butyl group, pentyl group, cyclopropyl group, cyclopentyl group, cyclohexyl group, phenyl group, naphthyl group, benzyl group, phenethyl group, bonded to each other Forming a cyclopentyl ring or a cyclohexyl ring.

R ₈ ; methyl group, ethyl group, isopropyl group, t-butyl group, neopentyl group, cyclohexyl group, phenyl group, benzyl group.

R ₁₀ : methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, cyclopropyl group, cyclopentyl group, cyclohexyl group, methoxy group, ethoxy group, phenyl group, naphthyl group, benzyl group, phenoxy group, naphthoxy Group formed by forming a 3-oxocyclohexenyl ring or a 3-oxoindenyl ring which may be bonded to each other to contain an oxygen atom.

R ₁₁ : methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, cyclopropyl group, cyclopentyl group, cyclohexyl group, methoxy group, ethoxy group, phenyl group, naphthyl group, benzyl group, phenoxy group, naphthoxy A group, a vinyl group, an allyl group, or a 3-oxocyclohexenyl ring or a 3-oxoindenyl ring which may be bonded to each other to contain an oxygen atom.

In the general formula (6), when R ₁₂ represents an alkyl group, a linear alkyl group having 1 to 12 carbon atoms and a branched alkyl group having 3 to 12 carbon atoms are more preferable.

When R ₁₂ represents a monovalent aliphatic hydrocarbon ring group, a monocyclic or polycyclic monovalent aliphatic hydrocarbon ring group having 5 to 10 carbon atoms is more preferable.

When R ₁₂ represents an aryl group, examples of the aryl group include those in which 1 to 3 benzene rings form a condensed ring, and those in which a benzene ring and a 5-membered unsaturated ring form a condensed ring. Specific examples include a phenyl group, a naphthyl group, an anthryl group, a phenanthryl group, an indenyl group, an acenaphthenyl group, a fluorenyl group, and the like. Among these, a phenyl group and a naphthyl group are more preferable. The aryl group includes a heterocyclic (hetero) aryl group in addition to the carbocyclic aryl group. Examples of the heterocyclic aryl group include those having 3 to 20 carbon atoms and 1 to 5 hetero atoms such as a pyridyl group, a furyl group, and other quinolyl groups condensed with a benzene ring, a benzofuryl group, a thioxanthone group, and a carbazole group. Can be mentioned.

When R ₁₂ represents an alkenyl group, a substituted alkenyl group [—C (R ₁₄ ) ═C (R ₁₅ ) (R ₁₆ )], an alkynyl group, or a substituted alkynyl group [—C≡C (R ₁₇ )] As R _{14 to} R ₁₇ , a monovalent nonmetallic atomic group can be used. Preferable examples of R _{14 to} R ₁₇ include a hydrogen atom, a halogen atom, an alkyl group, a substituted alkyl group, an aryl group, and a substituted aryl group. Specific examples thereof include those shown as the above examples. More preferable substituents for R _{14 to} R ₁₇ include a hydrogen atom, a halogen atom, and a linear, branched, or cyclic alkyl group having 1 to 10 carbon atoms.

When R ₁₂ represents a cyclic imide group, examples of the cyclic imide include those having 4 to 20 carbon atoms such as succinic imide, phthalic imide, cyclohexane dicarboxylic imide, norbornene dicarboxylic imide and the like.
Specific examples of the compounds represented by the general formulas (1) to (6) include, for example, compounds (1-1) to (1-11) exemplified after [0215] of JP-A-2008-209889. , (2-1) to (2-6), (3-1) to (3-6), (4-1) to (4-7), (5-1) to (5-4), ( 6-1) to (6-20).

[7] Basic Compound The composition according to the present invention preferably contains a basic compound in order to reduce a change in performance over time from exposure to heating. The basic compound plays a role of quenching the deprotection reaction by the acid generated by exposure, and its diffusibility, basicity, etc. can affect the effective diffusibility of the acid.
The basic compound is preferably a nitrogen-containing organic compound. Examples of such a compound include an ammonium salt represented by the following formula (A) and a basic compound having a structure represented by formulas (B) to (E).

In the formula (A), R ²⁵⁰ , R ²⁵¹ and R ²⁵² are each independently a hydrogen atom, an alkyl group (preferably having 1 to 20 carbon atoms), a cycloalkyl group (preferably having 3 to 20 carbon atoms) or an aryl group. (Preferably having 6 to 20 carbon atoms). R ²⁵⁰ and R ²⁵¹ may be bonded to each other to form a ring structure. Moreover, these groups may have a substituent.

Examples of the alkyl group and cycloalkyl group having a substituent include an aminoalkyl group having 1 to 20 carbon atoms, an aminocycloalkyl group having 3 to 20 carbon atoms, a hydroxyalkyl group having 1 to 20 carbon atoms, or 3 to 20 carbon atoms. Of these, a hydroxycycloalkyl group is preferred.
These may contain an oxygen atom, a sulfur atom or a nitrogen atom in the alkyl chain.

In formula (E), R ^{253 to} R ²⁵⁶ each independently represents an alkyl group (preferably having 1 to 6 carbon atoms) or a cycloalkyl group (preferably having 3 to 6 carbon atoms).

  Preferred compounds include guanidine, aminopyrrolidine, pyrazole, pyrazoline, piperazine, aminomorpholine, aminoalkylmorpholine and piperidine. These compounds may have a substituent.

  More preferable compounds include compounds having an imidazole structure, diazabicyclo structure, onium hydroxide structure, onium carboxylate structure, trialkylamine structure, aniline structure or pyridine structure, alkylamine derivatives having a hydroxy group and / or an ether bond, and , An aniline derivative having a hydroxy group and / or an ether bond.

  Examples of the compound having an imidazole structure include imidazole; 2,4,5-triphenylimidazole; and benzimidazole.

  Examples of the compound having a diazabicyclo structure include 1,4-diazabicyclo [2,2,2] octane; 1,5-diazabicyclo [4,3,0] non-5-ene; and 1,8-diazabicyclo [5. , 4,0] undec-7-ene.

  Examples of the compound having an onium hydroxide structure include triarylsulfonium hydroxide, phenacylsulfonium hydroxide, and sulfonium hydroxide having a 2-oxoalkyl group. Specifically, for example, triphenylsulfonium hydroxide, tris (t-butylphenyl) sulfonium hydroxide, bis (t-butylphenyl) iodonium hydroxide, phenacylthiophenium hydroxide, and 2-oxopropylthiophene. And nium hydroxide.

  The compound having an onium carboxylate structure is a compound in which the anion portion of the compound having an onium hydroxide structure is converted to a carboxylate, and examples thereof include acetate, adamantane-1-carboxylate, and perfluoroalkylcarboxylate.

  Examples of the compound having a trialkylamine structure include tri (n-butyl) amine and tri (n-octyl) amine.

  Examples of aniline compounds include 2,6-diisopropylaniline and N, N-dimethylaniline.

  Examples of the alkylamine derivative having a hydroxy group and / or an ether bond include ethanolamine, diethanolamine, triethanolamine, and tris (methoxyethoxyethyl) amine.

  Examples of aniline derivatives having a hydroxy group and / or an ether bond include N, N-bis (hydroxyethyl) aniline.

  Examples of the other basic compound include at least one nitrogen-containing compound selected from an amine compound having a phenoxy group and an ammonium salt compound having a phenoxy group.

  As the amine compound, a primary, secondary or tertiary amine compound can be used, and an amine compound in which at least one alkyl group is bonded to a nitrogen atom is preferable. The amine compound is more preferably a tertiary amine compound. In addition to the alkyl group, the amine compound may be a cycloalkyl group (preferably a carbon number of 3 to 20) or an aryl group, provided that at least one alkyl group (preferably having a carbon number of 1 to 20) is bonded to the nitrogen atom. A group (preferably having 6 to 12 carbon atoms) may be bonded to a nitrogen atom.

The amine compound preferably contains an oxygen atom in the alkyl chain and has one or more oxyalkylene groups. The number of oxyalkylene groups is preferably 3-9, and more preferably 4-6. The oxyalkylene group is preferably an oxyethylene group (—CH ₂ CH ₂ O—) or an oxypropylene group (—CH (CH ₃ ) CH ₂ O— or —CH ₂ CH ₂ CH ₂ O—). Groups are more preferred.

  As long as at least one alkyl group (preferably having 1 to 20 carbon atoms) is bonded to a nitrogen atom, the ammonium salt compound has a cycloalkyl group (preferably having 3 to 20 carbon atoms) or an aryl group in addition to the alkyl group. (Preferably having 6 to 12 carbon atoms) may be bonded to a nitrogen atom.

The ammonium salt compound contains an oxygen atom in the alkyl chain and may have one or more oxyalkylene groups. The number of oxyalkylene groups is preferably 3-9, and more preferably 4-6. The oxyalkylene group is preferably an oxyethylene group (—CH ₂ CH ₂ O—) or an oxypropylene group (—CH (CH ₃ ) CH ₂ O— or —CH ₂ CH ₂ CH ₂ O—). Groups are more preferred.

Examples of the anion of the ammonium salt compound include halides, sulfonates, borates, phosphates, hydroxides, and the like. Among these, hydroxides are preferable.
As the halide, chloride, bromide or iodide is particularly preferable.

  The amine compound having a phenoxy group is prepared by reacting, for example, a primary or secondary amine having a phenoxy group with a haloalkyl ether, and adding an aqueous solution of a strong base such as sodium hydroxide, potassium hydroxide or tetraalkylammonium. And then extracted with an organic solvent such as ethyl acetate and roloform. In addition, the amine compound having a phenoxy group reacts by heating a primary or secondary amine and a haloalkyl ether having a phenoxy group at the terminal, and a strong base such as sodium hydroxide, potassium hydroxide or tetraalkylammonium. It can also be obtained by adding an aqueous solution and then extracting with an organic solvent such as ethyl acetate and chloroform.

  In view of sensitivity, roughness, stability, etc., it is particularly preferable to use an ammonium salt compound as the basic compound, and it is most preferable to use a hydroxide of a quaternary ammonium salt compound.

(Compound whose basicity is increased by the action of acid)
A compound whose basicity is increased by the action of an acid can also be used as one kind of basic compound. As this example, what has a structure represented, for example by the following general formula (A) is mentioned. The following compound has an electron-withdrawing ester bond adjacent to the N atom, so that the basicity is low as it is. However, when an acid acts on the following compound, first, -C (Rb) (Rb) (Rb) Since the site is decomposed and then the ester bond site is decarboxylated, the electron withdrawing ester bond site is removed, so that it is considered that substantial basicity is developed.

In the general formula (A), Ra represents a hydrogen atom, an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group. When n = 2, the two Ras may be the same or different, and the two Ras are bonded to each other to form a divalent heterocyclic hydrocarbon group (preferably having 20 or less carbon atoms) or a derivative thereof. May be formed.
Rb each independently represents a hydrogen atom, an alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group. However, in —C (Rb) (Rb) (Rb), three Rb's are not hydrogen atoms at the same time.

At least two Rb's may combine to form an alicyclic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic hydrocarbon group or a derivative thereof.
n represents an integer of 0 to 2, m represents an integer of 1 to 3, and n + m = 3.

  In general formula (A), the alkyl group, monovalent aliphatic hydrocarbon ring group, aryl group and aralkyl group represented by Ra and Rb are a hydroxyl group, a cyano group, an amino group, a pyrrolidino group, a piperidino group, a morpholino group, an oxo group. It may be substituted with a functional group such as a group, an alkoxy group, or a halogen atom.

An alkyl group, a monovalent aliphatic hydrocarbon ring group, an aryl group or an aralkyl group of the Ra and Rb (these alkyl group, aliphatic hydrocarbon ring group, aryl group and aralkyl group are the above functional group, alkoxy group, (Optionally substituted with a halogen atom)
For example, a group derived from a linear or branched alkane such as methane, ethane, propane, butane, pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, etc., a group derived from these alkanes, for example, A group substituted with a cycloalkyl group,
Groups derived from cycloalkanes such as cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, norbornane, adamantane, noradamantane, groups derived from these cycloalkanes, for example, substituted with linear or branched alkyl groups Group,
A group derived from an aromatic compound such as benzene, naphthalene, anthracene, a group obtained by substituting a group derived from these aromatic compounds with, for example, a linear or branched alkyl group,
Groups derived from heterocyclic compounds such as pyrrolidine, piperidine, morpholine, tetrahydrofuran, tetrahydropyran, indole, indoline, quinoline, perhydroquinoline, indazole, benzimidazole, and groups derived from these heterocyclic compounds are linear or branched A group substituted with a group derived from an aromatic compound or a group derived from an aromatic compound, a group derived from a linear or branched alkane, or a group derived from a cycloalkane, for example, a group derived from an aromatic compound Or a group in which the above substituent is substituted with a functional group such as a hydroxyl group, a cyano group, an amino group, a pyrrolidino group, a piperidino group, a morpholino group, or an oxo group.

  Examples of the divalent heterocyclic hydrocarbon group (preferably having a carbon number of 2 to 20) or a derivative thereof formed by bonding of Ra to each other include pyrrolidine, piperidine, morpholine, 1, 4, 5 , 6-tetrahydropyrimidine, 1,2,3,4-tetrahydroquinoline, 1,2,3,6-tetrahydropyridine, homopiperazine, 4-azabenzimidazole, benzotriazole, 5-azabenzotriazole, 1H-1, 2,3-triazole, 1,4,7-triazacyclononane, tetrazole, 7-azaindole, indazole, benzimidazole, imidazo [1,2-a] pyridine, (1S, 4S)-(+)-2 , 5-diazabicyclo [2.2.1] heptane, 1,5,7-triazabicyclo [4.4.0] dec-5-ene Groups derived from heterocyclic compounds such as indole, indoline, 1,2,3,4-tetrahydroquinoxaline, perhydroquinoline, 1,5,9-triazacyclododecane, groups derived from these heterocyclic compounds A group derived from a linear or branched alkane, a group derived from a cycloalkane, a group derived from an aromatic compound, a group derived from a heterocyclic compound, a hydroxyl group, a cyano group, an amino group, a pyrrolidino group, a piperidino group , A morpholino group, a group substituted with an oxo group, and the like.

Although the compound which basicity increases by the effect | action of the acid especially preferable in this invention is shown concretely, this invention is not limited to this.

These basic compounds may be used alone or in combination of two or more.
The molecular weight of the basic compound is preferably 250 to 1000, more preferably 250 to 800, and particularly preferably 400 to 800.
The content of the basic compound is preferably 1.0 to 8.0% by mass, more preferably 1.5 to 5.0% by mass, and still more preferably based on the total solid content of the composition. It is 2.0-4.0 mass%.

[8] Fluorine-based and / or silicon-based surfactant The composition according to the present invention may further contain a fluorine-based and / or silicon-based surfactant. Examples of the fluorine-based and / or silicon-based surfactant include a fluorine-based surfactant, a silicon-based surfactant, a surfactant containing both a fluorine atom and a silicon atom, and a mixture thereof.

  By incorporating fluorine and / or silicon surfactant into the composition according to the present invention, when using an exposure light source of 250 nm or less, particularly 220 nm or less, with good sensitivity and resolution, there are few adhesion and development defects. A pattern can be given.

  Examples of commercially available surfactants that can be used include F-top EF301 and EF303 (manufactured by Shin-Akita Kasei Co., Ltd.), Florard FC430 and 431 (manufactured by Sumitomo 3M Co., Ltd.), MegaFuck F171, F173, F176, F189, R08 (manufactured by Dainippon Ink & Chemicals, Inc.), Surflon S-382, SC101, 102, 103, 104, 105, 106 (manufactured by Asahi Glass Co., Ltd.), and Troisol S-366 (manufactured by Troy Chemical Co., Ltd.) And fluorine-based surfactants such as silicon-based surfactants. Polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) can also be used as a silicon-based surfactant.

  In addition to the known surfactants described above, surfactants are derived from fluoroaliphatic compounds produced by the telomerization method (also referred to as the telomer method) or the oligomerization method (also referred to as the oligomer method). A polymer containing a polymer having a fluoroaliphatic group may be used. This fluoroaliphatic compound can be synthesized, for example, by the method described in JP-A-2002-90991.

  The polymer having a fluoroaliphatic group is preferably a copolymer of a monomer having a fluoroaliphatic group and (poly (oxyalkylene)) acrylate or methacrylate and / or (poly (oxyalkylene)) methacrylate. Even if it distributes, block copolymerization may be sufficient.

  Examples of the poly (oxyalkylene) group include a poly (oxyethylene) group, a poly (oxypropylene) group, and a poly (oxybutylene) group. In addition, units having different chain length alkylene in the same chain, such as poly (block connection body of oxyethylene, oxypropylene, and oxyethylene) and poly (block connection body of oxyethylene and oxypropylene) Also good.

  Further, a copolymer of a monomer having a fluoroaliphatic group and (poly (oxyalkylene)) acrylate or methacrylate has a monomer having two or more different fluoroaliphatic groups and two or more different (poly (oxyalkylene). )) It may be a ternary or higher copolymer obtained by copolymerizing acrylate or methacrylate simultaneously.

For example, Megafac F178, F-470, F-473, F-475, F-476 and F-472 (Dainippon Ink Chemical Co., Ltd.) are mentioned as commercially available surfactants. Further, a copolymer of an acrylate or methacrylate having a C ₆ F ₁₃ group and (poly (oxyalkylene)) acrylate or methacrylate, an acrylate or methacrylate having a C ₆ F ₁₃ group and (poly (oxyethylene)) acrylate or methacrylate And a copolymer of (poly (oxypropylene)) acrylate or methacrylate, a copolymer of an acrylate or methacrylate having a C ₈ F ₁₇ group and (poly (oxyalkylene)) acrylate or methacrylate, and C ₈ F ₁₇ And a copolymer of an acrylate or methacrylate having a group and (poly (oxyethylene)) acrylate or methacrylate and (poly (oxypropylene)) acrylate or methacrylate. That.

  The amount of fluorine and / or silicon-based surfactant used is preferably 0.0001 to 2 mass%, more preferably 0.001 to 1 mass%, based on the total solid content of the composition.

[9] Hydrophobic resin The composition according to the present invention may further contain a hydrophobic resin as described above. When the hydrophobic resin is further contained, the hydrophobic resin is unevenly distributed on the surface layer of the film formed using this composition, and the receding contact angle of the film with respect to the immersion liquid is improved when water is used as the immersion liquid. It becomes possible. Thereby, the immersion liquid followability of a film | membrane can be improved.

  The hydrophobic resin typically contains fluorine atoms and / or silicon atoms. These fluorine atoms and / or silicon atoms may be contained in the main chain of the resin or may be contained in the side chain.

  In the case where the hydrophobic resin contains a fluorine atom, the resin has an alkyl group containing a fluorine atom, a cycloalkyl group containing a fluorine atom, or an aryl group containing a fluorine atom as a partial structure containing a fluorine atom. It is preferable to provide.

  The alkyl group containing a fluorine atom is a linear or branched alkyl group in which at least one hydrogen atom is substituted with a fluorine atom. The alkyl group preferably has 1 to 10 carbon atoms, and more preferably 1 to 4 carbon atoms.

  The cycloalkyl group containing a fluorine atom is a monocyclic or polycyclic cycloalkyl group in which at least one hydrogen atom is substituted with a fluorine atom.

  An aryl group containing a fluorine atom is an aryl group in which at least one hydrogen atom is substituted with a fluorine atom. Examples of the aryl group include a phenyl group and a naphthyl group.

Preferable examples of the alkyl group containing a fluorine atom, the cycloalkyl group containing a fluorine atom, and the aryl group containing a fluorine atom include groups represented by the following general formulas (F2) to (F4).

In general formulas (F2) to (F4), R _{57 to} R ₆₈ each independently represents a hydrogen atom, a fluorine atom, or an alkyl group. However, at least one of R _{57 to} R ₆₁ represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom. At least one of R _{62 to} R ₆₄ represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom. At least one of R _{65 to} R ₆₈ represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom. These alkyl groups preferably have 1 to 4 carbon atoms.

R _{57 to} R ₆₁ and R _{65 to} R ₆₇ are preferably all fluorine atoms.
R ₆₂ , R ₆₃ and R ₆₈ are preferably an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, and more preferably a perfluoroalkyl group having 1 to 4 carbon atoms. R ₆₂ and R ₆₃ may be bonded to each other to form a ring.

  Examples of the group represented by the general formula (F2) include a p-fluorophenyl group, a pentafluorophenyl group, and a 3,5-di (trifluoromethyl) phenyl group.

  Examples of the group represented by the general formula (F3) include a hexafluoroisopropyl group, a heptafluoroisopropyl group, a hexafluoro (2-methyl) isopropyl group, an octafluoroisobutyl group, a nonafluoro-t-butyl group, and a perfluoroiso group. A pentyl group is more preferable, and a hexafluoroisopropyl group or a heptafluoroisopropyl group is still more preferable.

Examples of the group represented by the general formula (F4) include —C (CF ₃ ) ₂ OH, —C (C ₂ F ₅ ) ₂ OH, —C (CF ₃ ) (CH ₃ ) OH, and —CH. (CF ₃ ) OH. Of these, -C (CF _{3) 2} OH is particularly preferred.

Specific examples of the repeating unit containing a fluorine atom are shown below.
In specific examples, X ₁ represents a hydrogen atom, —CH ₃ , —F or —CF ₃ . X ₂ represents —F or —CF ₃ .

When the hydrophobic resin contains a silicon atom, the resin preferably has an alkylsilyl structure or a cyclic siloxane structure as a partial structure containing a silicon atom. This allylsilyl structure is preferably a structure containing a trialkylsilyl group.
Preferable examples of the alkylsilyl structure and the cyclic siloxane structure include groups represented by the following general formulas (CS-1) to (CS-3).

In general formulas (CS-1) to (CS-3), R _{12 to} R ₂₆ each independently represents a linear or branched alkyl group or a cycloalkyl group. This alkyl group preferably has 1 to 20 carbon atoms. This cycloalkyl group preferably has 3 to 20 carbon atoms.

L < ₃ > -L < ₅ > represents a single bond or a bivalent coupling group. Examples of the divalent linking group include an alkylene group, a phenylene group, an ether group, a thioether group, a carbonyl group, an ester group, an amide group, a urethane group, a urea group, or a combination thereof.
n represents an integer of 1 to 5. n is preferably an integer of 2 to 4.

Below, the specific example of the repeating unit provided with group represented by general formula (CS-1)-(CS-3) is given. In specific examples, X ₁ represents a hydrogen atom, —CH ₃ , —F or —CF ₃ .

The hydrophobic resin may further include at least one group selected from the group consisting of the following (x) to (z).
(X) an alkali-soluble group;
(Y) a group that decomposes by the action of an alkali developer and increases the solubility in the alkali developer; (z) an acid-decomposable group.

  (X) The alkali-soluble group is preferably a fluorinated alcohol group, a sulfonimide group or a bis (carbonyl) methylene group. Preferred fluorinated alcohol groups include hexafluoroisopropanol groups.

  The content of the repeating unit having an alkali-soluble group is preferably 1 to 50 mol%, more preferably 3 to 35 mol%, based on all repeating units in the hydrophobic resin. More preferably, it is 20 mol%.

Specific examples of the repeating unit having an alkali-soluble group are shown below.

  (Y) Examples of the group that is decomposed by the action of the alkali developer and increases the solubility in the alkali developer include a group having a lactone structure, an acid anhydride group, and an acid imide group. Of these, a group having a lactone structure is particularly preferable.

  Examples of the repeating unit having a group that is decomposed by the action of the alkaline developer and increases the solubility in the alkaline developer include the same repeating units as those having the lactone structure described above in [3]. Things.

  The content of the repeating unit having a group that is decomposed by the action of the alkali developer and increases the solubility in the alkali developer is 1 to 40 mol% based on all repeating units in the hydrophobic resin. Is more preferable, it is more preferable that it is 3-30 mol%, and it is still more preferable that it is 5-15 mol%.

Examples of the (z) acid-decomposable group include the same groups as those described above in [3].
The content of the repeating unit having an acid-decomposable group is preferably 1 to 80 mol%, more preferably 10 to 80 mol%, based on all repeating units in the hydrophobic resin. More preferably, it is -60 mol%.
The hydrophobic resin may further contain a repeating unit represented by the following general formula (III).

In formula (III), R _c31 represents a hydrogen atom, an alkyl group, an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, a cyano group, or a —CH ₂ —O—Rac ₂ group. Here, Rac ₂ represents a hydrogen atom, an alkyl group or an acyl group.

R _c31 is preferably a hydrogen atom, a methyl group, a hydroxymethyl group or a trifluoromethyl group, and particularly preferably a hydrogen atom or a methyl group.

R _c32 represents a group containing an alkyl group, a cycloalkyl group, an alkenyl group, a cycloalkenyl group or an aryl group. These groups may be substituted with a fluorine atom and / or a silicon atom.

The alkyl group represented by R _c32 is preferably a linear or branched alkyl group having 3 to 20 carbon atoms.
The cycloalkyl group preferably has 3 to 20 carbon atoms.
The alkenyl group preferably has 3 to 20 carbon atoms.
The cycloalkenyl group is preferably a cycloalkenyl group having 3 to 20 carbon atoms.

  The aryl group is preferably a phenyl group or naphthyl group having 6 to 20 carbon atoms, and these may have a substituent.

R _c32 is preferably an unsubstituted alkyl group or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.

L _c3 represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group (preferably having a carbon number of 1 to 5), an oxy group, a phenylene group, and an ester bond (a group represented by —COO—).

The hydrophobic resin may further contain a repeating unit represented by the following general formula (CII-AB).

In the formula (CII-AB),
R _c11 ′ and R _c12 ′ each independently represents a hydrogen atom, a cyano group, a halogen atom or an alkyl group. Zc ′ represents an atomic group necessary for forming an alicyclic structure together with two carbon atoms (C—C) to which R _c11 ′ and R _c12 ′ are bonded.

Specific examples of the repeating unit represented by the general formula (III) or (CII-AB) are given below. In specific examples, Ra represents H, CH ₃ , CH ₂ OH, CF ₃ or CN.

Specific examples of the hydrophobic resin are given below. Table 2 below summarizes the molar ratio of the repeating units in each resin (corresponding to each repeating unit in order from the left), the weight average molecular weight, and the degree of dispersion.

[10] Organic Solvent The composition according to the present invention typically further contains a predetermined organic solvent that dissolves the above components.
Examples of the organic solvent that can be used include ethylene dichloride, cyclohexanone, cyclopentanone, 2-heptanone, γ-butyrolactone, methyl ethyl ketone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, 2-methoxyethyl acetate, ethylene glycol monoethyl. Ether acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, toluene, ethyl acetate, methyl lactate, ethyl lactate, methyl methoxypropionate, ethyl ethoxypropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, N, N -Dimethylformamide, dimethyl sulfoxide, N-methylpyrrolidone and tetrahydrofuran.

Examples of the solvent having a ketone structure include a chain ketone solvent and a cyclic ketone solvent. From the viewpoint of applicability, those having a total carbon number of 5 to 8 are particularly preferred.
Examples of the chain ketone solvent include 2-heptanone, methyl ethyl ketone, and methyl isobutyl ketone. Of these, 2-heptanone is particularly preferred.
Examples of the cyclic ketone solvent include cyclopentanone, 3-methyl-2-cyclopentanone, cyclohexanone, 2-methylcyclohexanone, 2,6-dimethylcyclohexanone, cycloheptanone, cyclooctanone and isophorone. Of these, cyclohexanone and cycloheptanone are particularly preferred.

As the organic solvent, a solvent having a ketone structure is preferably used alone, or a mixed solvent of a solvent having a ketone structure and another solvent is preferably used.
Examples of other solvents (combined solvent) to be mixed with the solvent having a ketone structure include propylene glycol monoalkyl ether carboxylate, alkyl lactate, propylene glycol monoalkyl ether, alkyl alkoxypropionate, and lactone compounds.

Examples of the propylene glycol monoalkyl ether carboxylate include propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, and propylene glycol monoethyl ether acetate.
Examples of the alkyl lactate include methyl lactate and ethyl lactate.
Examples of the propylene glycol monoalkyl ether include propylene glycol monomethyl ether and propylene glycol monoethyl ether.
Examples of the alkyl alkoxypropionate include methyl methoxypropionate, ethyl methoxypropionate, methyl ethoxypropionate and ethyl ethoxypropionate.
Examples of the lactone compound include γ-butyrolactone.

  Preferable combination solvents include propylene glycol monoalkyl ether carboxylate, alkyl lactate and propylene glycol monoalkyl ether. A more preferred combination solvent is propylene glycol monomethyl ether acetate.

  Further, from the viewpoint of film thickness uniformity and development defect performance, a high boiling point solvent having a boiling point of 200 ° C. or higher such as ethylene carbonate and propylene carbonate may be mixed.

  The amount of these high-boiling solvents added is usually 0.1 to 15% by mass, preferably 0.5 to 10% by mass, and more preferably 1 to 5% by mass in the total solvent.

In the present invention, typically, an actinic ray-sensitive or radiation-sensitive resin composition is prepared using an organic solvent, preferably two or more mixed solvents.
The solid content concentration of the composition is usually 1 to 25% by mass, preferably 2 to 20% by mass, and more preferably 2.5 to 10% by mass. In particular, when pattern formation is performed with an electron beam, EUV light or ArF light, the solid content concentration is preferably 2.5 to 20% by mass.

[11] Other additives In the composition according to the present invention, if necessary, a dye, a plasticizer, a surfactant other than the fluorine-based and / or silicon-based surfactants listed above, and a photosensitizer. Further, an additive such as a compound that promotes solubility in a developer may be further contained.

  The compound that promotes solubility in the developer (dissolution promoting compound) is, for example, a low molecular compound having a molecular weight of 1,000 or less and having two or more phenolic OH groups or one or more carboxy groups. When it has a carboxy group, an alicyclic or an aliphatic compound is preferable.

  The addition amount of these dissolution promoting compounds is preferably 2 to 50% by mass, more preferably 5 to 30% by mass, based on the resin described above. From the viewpoint of suppressing development residue and preventing pattern deformation during development, the amount added is preferably 50% by mass or less.

  Such a phenol compound having a molecular weight of 1000 or less can be easily obtained by referring to the methods described in, for example, JP-A-4-1222938, JP-A-2-28531, U.S. Pat. No. 4,916,210 and European Patent 219294. Can be synthesized.

  Specific examples of the alicyclic or aliphatic compound having a carboxy group include carboxylic acid derivatives having a steroid structure such as cholic acid, deoxycholic acid and lithocholic acid, adamantane carboxylic acid derivatives, adamantane dicarboxylic acid, cyclohexane carboxylic acid, and Although cyclohexane dicarboxylic acid etc. are mentioned, it is not limited to these.

  Specific examples of surfactants other than fluorine and / or silicon surfactants include polyoxyethylene alkyl ethers, polyoxyethylene alkyl allyl ethers, polyoxyethylene / polyoxypropylene block copolymers , Nonionic surfactants such as sorbitan aliphatic esters and polyoxyethylene sorbitan aliphatic esters. These surfactants may be added alone or in combination of two or more.

[Pattern formation method]
Hereinafter, a pattern forming method using the composition according to the present invention will be described.

  The composition according to the present invention is typically used after being dissolved in a predetermined organic solvent, preferably the above mixed solvent, and coated on a predetermined support. For example, this composition can be used for substrates used in the manufacture of precision integrated circuit elements and imprint mold structures (eg, silicon, silicon / silicon dioxide coating, silicon nitride, quartz with Cr layer, TiN, WSi, BPSG, SOG, organic antireflection film, etc.), photomask blanks [light shielding layer (material containing transition metal silicide is used, and applicable transition metals include molybdenum, tantalum, tungsten, titanium, chromium, hafnium Nickel, vanadium, zirconium, ruthenium, rhodium, etc.) and antireflection film layer (for example, molybdenum, chromium, tantalum, tungsten, titanium, hafnium, nickel, vanadium, zirconium, ruthenium, rhodium, etc.) Oxides and nitrides based on transition metals Oxynitrides, carbides, transition metal silicide materials containing these transition metals and silicon (Si), oxides, nitrides, oxynitrides, carbides, and the transition metals of these transition metal silicide materials And the like are applied by an appropriate application method such as a spinner or a coater. Thereafter, this is dried to obtain an actinic ray-sensitive or radiation-sensitive film (hereinafter also referred to as a photosensitive film). Moreover, 60-150 degreeC is preferable for drying temperature, and 80-130 degreeC is more preferable. In addition, a known antireflection film can be applied in advance.

  Next, the photosensitive film is irradiated with actinic rays or radiation, preferably baked (heated), and then developed. The baking temperature is preferably 80 ° C. to 150 ° C., more preferably 90 to 130 ° C. from the viewpoints of sensitivity and stability. Thereby, a good pattern can be obtained.

Examples of actinic rays or radiation include infrared light, visible light, ultraviolet light, far ultraviolet light, X-rays, and electron beams. As these actinic rays or radiation, for example, those having a wavelength of 250 nm or less, particularly 220 nm or less are more preferable. Examples of such actinic rays or radiation include KrF excimer laser (248 nm), ArF excimer laser (193 nm), F ₂ excimer laser (157 nm), electron beam, X-ray, and EUV light (13 nm).

  Particularly preferred actinic rays or radiation include electron beam, X-ray, and EUV light. When the composition according to the present invention is exposed to these active rays or radiation, particularly excellent sensitivity and roughness characteristics can be achieved. The present inventors believe that this is because the compound represented by the general formula (I) can generate an acid with particularly high efficiency when irradiated with an electron beam, an X-ray or EUV light. .

  Note that exposure may be performed by filling a liquid (such as pure water) having a higher refractive index than air between the photosensitive film and the lens. That is, immersion exposure may be performed. Thereby, the resolution can be further increased. In this case, an immersion liquid sparingly soluble film (also referred to as “topcoat”) is provided on the resist film between the resist film and the immersion liquid in order to avoid contact between the resist film and the immersion liquid. May be. Further, as another means for avoiding contact between the resist film and the immersion liquid, a hydrophobic resin (HR) may be added to the above-described composition in advance. Specific examples of the hydrophobic resin (HR) include resins described in paragraphs 0172 to 0253 of US2008 / 0305432A1.

In the development step, an alkali developer is usually used.
Examples of the alkaline developer include inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate and aqueous ammonia, primary amines such as ethylamine and n-propylamine, diethylamine and Secondary amines such as di-n-butylamine, tertiary amines such as triethylamine and methyldiethylamine, alcohol amines such as dimethylethanolamine and triethanolamine, and fourth amines such as tetramethylammonium hydroxide and tetraethylammonium hydroxide. Examples include alkaline aqueous solutions containing a quaternary ammonium salt or cyclic amines such as pyrrole and pihelidine.

An appropriate amount of alcohol and / or surfactant may be added to the alkaline developer.
The alkali concentration of the alkali developer is usually from 0.1 to 20% by mass. The pH of the alkali developer is usually from 10.0 to 15.0.

  For details of the process for producing an imprint mold using the composition of the present invention, see, for example, Japanese Patent No. 4109085, Japanese Patent Application Laid-Open No. 2008-162101, and “Nanoimprint Basics and Technology Development / Application development-Nanoimprint substrate technology and latest technological development-Editing: Yoshihiko Hirai (Frontier Publishing) "

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, the content of this invention is not limited by this.

<Photo acid generator>
As a photoacid generator, compounds 1 to 20 and comparative compounds 1 to 4 shown in Table 3 below were prepared. Among these, the compounds 1-20 correspond to the compound represented by the said general formula (I). Table 3 also shows the volume of the corresponding generated acid. This volume is a value calculated by the method described above in [1].

<Synthesis of Compound 1>
... J. AM CHEM SOC 2004 , 126, by the method described in 14071-14078, compound 1 of BF ₄ ^- was synthesized salt.
¹ H NMR (300 MHz, CD ₃ CN): δ (ppm) 4.42 (s, 3 H), 8.14 (t, 2 H, J = 7.2 Hz), 8.57 (t, 1 H, J = 7.5 Hz), 9.01 (dd, 2 H, J = 1.2, 7.5 Hz).
This was subjected to salt exchange according to a conventional method to synthesize Compound 1.

<Synthesis of Compound 2>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, PF ₆ compound 2 ^- was synthesized salt.
¹ H NMR (400 MHz, CDCl ₃ ): δ (ppm) 0.97-0.87 (m, 6 H), 1.60-1.27 (m, 8H), 1.87-1.77 (m, 1H), 4.52 (t, 2 H, J = 5.8 Hz), 7.59-7.52 (m, 3 H), 7.76 (d, 2 H, J = 8.5 Hz)), 8.22 (d, 2 H, J = 7.2 Hz), 8.80 (d, 2 H, J = 7.2 Hz).
This was subjected to salt exchange according to a conventional method to synthesize Compound 2.

<Synthesis of Compound 3>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, PF ₆ compound 3 ^- were synthesized salt.
¹ H NMR (400 MHz, CDCl ₃ ): δ (ppm) 0.89 (t, 3 H), 1.42-1.28 (m, 8H), 1.60-1.55 (m, 2H), 2.06-1.99 (m, 2H), 4.74 (t, 2 H, J = 6.4 Hz), 8.04-8.00 (m, 1 H), 8.15 (dd, 1 H, J = 8.4, 6.3 Hz), 8.26-8.22 (m, 2 H), 8.34 ( dd, 1 H, J = 8.0, 3.2 Hz), 9.09 (d, 1 H, J = 8.4 Hz), 9.42 (d, 1 H, J = 7.2 Hz).
This was subjected to salt exchange according to a conventional method to synthesize Compound 3.

<Synthesis of Compound 4>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, compound 4 BF ₄ ^- was synthesized salt.
¹ H NMR (300 MHz, CD ₃ CN): δ (ppm) 4.49 (s, 3 H), 7.57-7.62 (m, 2 H), 7.73-7.85 (m, 3 H), 8.26 (dd, 2 H , J = 1.8, 5.1 Hz), 9.14 (dd, 2 H, J = 1.5, 4.8 Hz).
This was subjected to salt exchange according to a conventional method to synthesize Compound 4.

<Synthesis of Compound 5>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, BF ₄ compound 5 ^- were synthesized salt.
¹ H NMR (300 MHz, DMSO-d ₆ ): δ (ppm) 4.48 (s, 3 H), 8.83 (d, 2 H, J = 6.6 Hz), 9.75 (d, 2 H, J = 6.6 Hz) .

  This was subjected to salt exchange according to a conventional method to synthesize Compound 5.

<Synthesis of Compound 6>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, BF ₄ compounds 6 ^- was synthesized salt.
¹ H NMR (300 MHz, CD ₃ CN): δ (ppm) 4.35 (s, 3 H), 7.36 (d, 1 H, J = 16.5 Hz), 7.45-7.47 (m, 3 H), 7.69-7.72 (m, 2 H), 7.81 (d, 1 H, J = 16.5 Hz), 8.08 (d, 2 H, J = 7.2 Hz), 8.76 (d, 2 H, J = 7.2 Hz).

  This was subjected to salt exchange according to a conventional method to synthesize Compound 6.

<Synthesis of Compound 7>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, PF ₆ compound 7 ^- was synthesized salt.
¹ H NMR (300 MHz, CDCl ₃ ): δ (ppm) 0.88 (t, 3 H, J = 16.5 Hz), 1.40-1.24 (m, 8H), 1.53-1.45 (m, 2H), 1.93-1.85 ( m, 2 H), 4.73 (t, 2 H, J = 6.8 Hz), 8.03-7.98 (m, 1 H), 8.19-8.14 (m, 2 H), 8.39 (d, 1 H, J = 6.8 Hz ), 8.49 (dd, 2H, J = 7.2, 2.4 Hz), 8.52 (d, 1 H, J = 8.8 Hz).

  This was subjected to salt exchange according to a conventional method to synthesize Compound 7.

<Synthesis of Compound 8>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, BF ₄ Compound 8 ^- was synthesized salt.

¹ H NMR (300 MHz, CD ₃ CN): δ (ppm) 4.07 (s, 3 H), 4.27 (s, 3 H), 7.45 (d, 2 H, J = 7.8 Hz), 8.74 (d, 2 H, J = 7.8 Hz).

  This was subjected to salt exchange according to a conventional method to synthesize Compound 8.

<Synthesis of Compound 9>
... J. AM CHEM SOC 2004 , 126, by the method described in 14071-14078, BF ₄ compound 9 ^- was synthesized salt. This was subjected to salt exchange according to a conventional method to synthesize Compound 9.

¹ H NMR (400 MHz, CDCl ₃ ): δ (ppm) 2.10-1.80 (m, 45 H), 2.50-2.20 (m, 2 H), 4.40-4.20 (m, 2 H), 4.62 (d, 2 H, J = 5.6 Hz), 7.00 (s, 2 H), 7.58-7.50 (m, 3 H), 7.84 (d, 2 H, J = 9.6 Hz, 8.51 (d, 2 H, J = 7.2 Hz) , 9.39 (d, 2 H, J = 7.2 Hz).

<Synthesis of Compound 10>
... J. AM CHEM SOC 2004 , 126, by the method described in 14071-14078, BF ₄ compounds 10 ^- was synthesized salt.
¹ H NMR (500 MHz, CD ₃ OD at 55 ° C): δ (ppm) 4.67 (s, 3 H), 8.08-8.20 (m, 3 H), 8.38 (dt, 1 H, J = 1.5, 7.8 Hz ), 8.58 (dt, 2 H, J = 1.0, 8.0 Hz), 9.02 (d, 1 H, J = 8.5 Hz), 9.07 (d, 1 H, J = 8.0 Hz), 10.46 (s, 1 H) .
This was subjected to salt exchange according to a conventional method to synthesize Compound 10.

<Synthesis of Compound 11>
Chemical and Pharmaceutical Bulletin, 1970, vol.18 , according to the method described in p.1176-1184, BF ₄ compounds 11 ^- was synthesized salt. This was subjected to salt exchange according to a conventional method to synthesize Compound 11.

<Synthesis of Compound 12>
... J. AM CHEM SOC 2002 , 124, by the method described in 15225-15238, BF ₄ compounds 12 ^- was synthesized salt. This was subjected to salt exchange according to a conventional method to synthesize Compound 12.

<Example A>
(Resist preparation)
The components shown in Table 4 below were dissolved in a solvent to prepare a solution having a solid concentration of 4.0% by mass. This solution was filtered through a polytetrafluoroethylene filter having a pore size of 0.1 μm to obtain a positive resist solution.

(Resist evaluation)
First, an antireflection film DUV-42 manufactured by Brewer Science Co., Ltd. was uniformly applied with a film thickness of 60 nm on a silicon substrate subjected to hexamethyldisilazane treatment using a spin coater. This was dried on a hot plate at 100 ° C. for 90 seconds, and then heat-dried at 190 ° C. for 240 seconds. Thereafter, each positive resist solution was applied using a spin coater and dried at 120 ° C. for 90 seconds to form a resist film having a thickness of 0.12 μm.

  This resist film was exposed with an ArF excimer laser stepper (manufactured by ISI; NA = 0.6) through a mask, and immediately after the exposure, it was heated on a hot plate at 120 ° C. for 90 seconds. Further, development was performed at 23 ° C. for 60 seconds using an aqueous 2.38 mass% tetramethylammonium hydroxide solution, rinsed with pure water for 30 seconds, and then dried to obtain a line pattern.

〔sensitivity〕
Surface exposure was performed while changing the exposure amount by 0.5 mJ in the range of 10 to 40 mJ / cm ² , and baking was performed at 110 ° C. for 90 seconds. Then, using a 2.38 mass% tetramethylammonium hydroxide (TMAH) aqueous solution, the dissolution rate at each exposure amount was measured to obtain a dissolution rate curve.
In this dissolution rate curve, the exposure amount when the resist dissolution rate is saturated was defined as sensitivity.

[Line edge roughness (LER)]
A 150 nm line pattern (L / S = 1/1) was formed at an irradiation dose showing the above sensitivity. And about arbitrary 30 points | pieces contained in the length direction 50 micrometers, the distance from the reference line which should have an edge was measured using the scanning electron microscope (S-9220 by Hitachi, Ltd.). And the standard deviation of this distance was calculated | required and 3 (sigma) was computed.

[Pattern shape]
The exposure amount for reproducing a mask pattern having a line width of 150 nm and a line and space (L / S = 1/1) was set as the optimum exposure amount, and the profile at the optimum exposure amount was observed with a scanning microscope (SEM).

[Scum defect]
A line pattern was formed by the above method. Thereafter, a cross-sectional SEM was obtained with S4800 (manufactured by Hitachi High-Tech Co., Ltd.), and the residue in the space portion was observed. And it evaluated as follows.
X (Insufficient): Scum is observed, but the patterns are partially connected.
Δ (slightly insufficient): Scum is observed, but the patterns are not connected.
○ (Good): Only a small portion of the scum is seen and the patterns are not connected.
A (very good): No scum is seen.
These measurement results are shown in Table 4 below.

In addition, as acid-decomposable resin, any of the following (RA-1), (RA-20), (RA-23) and (RA-25) to (RA-29) was used. In the following formula, the number on the right side of the repeating unit represents the molar ratio. Mw represents the weight average molecular weight, and Mw / Mn represents the degree of dispersion.

  About a basic compound, surfactant, and a solvent, it selected suitably from the following and used.

[Basic compounds]
B1: Tetrabutylammonium hydroxide B2: Tri (n-octyl) amine B3: Triphenylimidazole B4:

[Surfactant]
W-1: MegaFuck F176 (Dainippon Ink Chemical Co., Ltd.) (Fluorine)
W-2: Megafuck R08 (Dainippon Ink Chemical Co., Ltd.) (fluorine and silicon)
W-3: Polysiloxane polymer KP-341 (manufactured by Shin-Etsu Chemical Co., Ltd.) (silicon-based)
W-4: PF6320 (manufactured by OMNOVA) (fluorine-based)
〔solvent〕
S1: Propylene glycol monomethyl ether acetate (PGMEA; 1-methoxy-2-acetoxypropane)
S2: Propylene glycol monomethyl ether (PGME; 1-methoxy-2-propanol)
S3: Ethyl lactate S4: 2-Heptanone S5: Cyclohexanone S6: γ-Butyrolactone S7: Propylene carbonate As shown in Table 4, the composition according to the present invention is excellent in sensitivity, LER, and pattern shape in ArF exposure. It was also found that there were few scum defects. That is, it was found that the composition of the present invention has excellent performance as a positive resist composition in ArF excimer laser exposure.

<Example B1>
A resist solution was prepared and coated in the same manner as in Example A except that 0.06 g of the following polymer (1) was added to the composition of Example 1A to obtain a resist film. The obtained resist film was subjected to pattern exposure through an immersion liquid (pure water) using an ArF excimer laser immersion scanner (XTML1250i; NA0.85 manufactured by ASML), and a pattern was formed in the same manner as in Example A. did. And about the obtained pattern, it confirmed that the same evaluation result was obtained in any of a sensitivity, LER, a pattern shape, and a scum defect characteristic.

<Example B2>
A resist solution was prepared and coated in the same manner as in Example A except that 0.06 g of the following polymer (2) was added to the composition of Example 1A to obtain a resist film. The obtained resist film was subjected to pattern exposure through an immersion liquid (pure water) using an ArF excimer laser immersion scanner (XTML1250i; NA0.85 manufactured by ASML), and a pattern was formed in the same manner as in Example A. did. And about the obtained pattern, it confirmed that the same evaluation result was obtained in any of a sensitivity, LER, a pattern shape, and a scum defect characteristic.

<Example B>
A resist solution was prepared and coated in the same manner as in Example A except that 0.06 g of the following polymer (3) was added to the composition of Example 1A to obtain a resist film. The obtained resist film was subjected to pattern exposure through an immersion liquid (pure water) using an ArF excimer laser immersion scanner (XTML1250i; NA0.85 manufactured by ASML), and a pattern was formed in the same manner as in Example A. did. And about the obtained pattern, it confirmed that the same evaluation result was obtained in any of a sensitivity, LER, a pattern shape, and a scum defect characteristic.

<Example C>
(Resist preparation)
The components shown in Table 5 below were dissolved in a solvent, and then filtered through a polytetrafluoroethylene filter having a pore size of 0.1 μm to prepare a positive resist solution having a solid content concentration of 4.5 mass%.

(Resist evaluation)
The prepared positive resist solution is uniformly coated on a silicon substrate subjected to hexamethyldisilazane treatment using a spin coater, and is heated and dried on a hot plate at 100 ° C. for 90 seconds to obtain a 0.4 μm resist. A film was formed.
The resist film was subjected to pattern exposure using a KrF excimer laser stepper (NA = 0.63) using a line and space mask, and immediately after the exposure, it was heated on a hot plate at 110 ° C. for 90 seconds. Thereafter, development was performed at 23 ° C. for 60 seconds using an aqueous 2.38 mass% tetramethylammonium hydroxide solution, rinsed with pure water for 30 seconds, and then dried to form a line pattern.

〔sensitivity〕
Sensitivity was determined in the same manner as described in Example A.

[Line edge roughness (LER)]
A 180 nm line pattern (L / S = 1/1) was formed at an irradiation dose showing the above sensitivity. And about arbitrary 30 points | pieces contained in the length direction 50 micrometers, the distance from the reference line which should have an edge was measured using the scanning electron microscope (S-9220 by Hitachi, Ltd.). And the standard deviation of this distance was calculated | required and 3 (sigma) was computed.

[Pattern shape]
The exposure amount for reproducing a line and space (L / S = 1/1) mask pattern having a line width of 180 nm was set as the optimal exposure amount, and the profile at the optimal exposure amount was observed with a scanning microscope (SEM).

[Scum defect]
A line pattern was formed by the above method. Thereafter, a cross-sectional SEM was obtained with S4800 (manufactured by Hitachi High-Tech Co., Ltd.), and the residue in the space portion was observed. And it evaluated as follows.
X (Insufficient): Scum is observed, but the patterns are partially connected.
Δ (slightly insufficient): Scum is observed, but the patterns are not connected.
○ (Good): Only a small portion of the scum is seen and the patterns are not connected.
A (very good): No scum is seen.
These measurement results are shown in Table 5 below.

In addition, the basic compound, the surfactant, and the solvent were appropriately selected from those shown above.
The acid-decomposable resin was appropriately selected from (R-1) to (R-43) and (RA-1) exemplified above. The molar ratio and weight average molecular weight of each repeating unit in the resins listed in Table 5 and the following tables are as shown in Table 6 below.

  As shown in Table 5, it was found that the composition according to the present invention is excellent in sensitivity, LER, and pattern shape in KrF exposure, and has few scum defects. That is, it was found that the composition of the present invention has excellent performance as a positive resist composition in KrF excimer laser exposure.

<Example D>
(Resist preparation)
The components shown in Table 7 below were dissolved in a solvent, and then filtered through a polytetrafluoroethylene filter having a pore size of 0.1 μm to prepare a positive resist solution having a solid content concentration of 4.0% by mass.

(Resist evaluation)
The prepared positive resist solution is uniformly coated on a silicon substrate having a Cr layer on the surface as a photomask blank model using a spin coater, and is heated and dried on a hot plate at 100 ° C. for 60 seconds. A resist film having a thickness of 12 μm was formed.
This resist film was irradiated with an electron beam projection lithography apparatus (acceleration voltage 100 keV) manufactured by Nikon Corporation, and immediately after the irradiation, it was heated on a hot plate at 110 ° C. for 90 seconds. Thereafter, development was performed at 23 ° C. for 60 seconds using a 2.38 mass% tetramethylammonium hydroxide aqueous solution, rinsed with pure water for 30 seconds, and then dried to form a line and space pattern.

〔sensitivity〕
The obtained pattern was observed using a scanning electron microscope (S-9220 manufactured by Hitachi, Ltd.). The electron beam irradiation amount when resolving a line and space (L / S = 1/1) having a line width of 100 nm was defined as sensitivity (E ₀ ).

[Line edge roughness (LER)]
A 100 nm line pattern (L / S = 1/1) was formed at an irradiation dose showing the above sensitivity. And about arbitrary 30 points | pieces contained in the length direction 50 micrometers, the distance from the reference line which should have an edge was measured using the scanning electron microscope (S-9220 by Hitachi, Ltd.). And the standard deviation of this distance was calculated | required and 3 (sigma) was computed.

[Pattern shape]
The exposure amount for reproducing a line and space (L / S = 1/1) mask pattern with a line width of 50 nm was set as the optimum exposure amount, and the profile at the optimum exposure amount was observed with a scanning microscope (SEM).

[Outgas (Evaluation of film thickness fluctuation rate after exposure)]
The irradiation dose twice as high as the above sensitivity was irradiated, the film thickness after exposure (before post-heating) was measured, and the variation rate from the unexposed film thickness was determined from the following equation.

Film thickness fluctuation rate = 100 × (film thickness at unexposed−film thickness after exposure) / film thickness at unexposed The smaller the film thickness fluctuation rate, the better the outgas reduction.

[Scum defect]
A line pattern was formed by the above method. Thereafter, a cross-sectional SEM was obtained with S4800 (manufactured by Hitachi High-Tech Co., Ltd.), and the residue in the space portion was observed. And it evaluated as follows.
X (Insufficient): Scum is observed, but the patterns are partially connected.
Δ (slightly insufficient): Scum is observed, but the patterns are not connected.
○ (Good): Only a small portion of the scum is seen and the patterns are not connected.
A (very good): No scum is seen.
These measurement results are shown in Table 7 below.

  As shown in Table 7, it was found that the composition according to the present invention was excellent in sensitivity, LER, pattern shape, and outgas characteristics in electron beam exposure, and had few scum defects. That is, it was found that the composition of the present invention has excellent performance as a positive resist composition in electron beam exposure.

<Example E>
(Resist preparation)
The components shown in Table 8 below were dissolved in a solvent, and then filtered through a polytetrafluoroethylene filter having a pore size of 0.1 μm to prepare a negative resist solution having a solid content concentration of 12% by mass.

(Resist evaluation)
Using a spin coater, the prepared negative resist solution was uniformly applied as a photomask blank model on a silicon substrate with Cr layered on the surface, and heated and dried on a hot plate at 120 ° C. for 60 seconds. A resist film having a film thickness of 3 μm was formed.
This resist film was irradiated with an electron beam projection lithography apparatus (acceleration voltage 100 keV) manufactured by Nikon Corporation, and immediately after the irradiation, it was heated on a hot plate at 110 ° C. for 90 seconds. Thereafter, development was performed at 23 ° C. for 60 seconds using an aqueous tetramethylammonium hydroxide solution having a concentration of 2.38 mass%, followed by rinsing with pure water for 30 seconds, followed by drying to form a line and space pattern.

Evaluation was performed in the same manner as described for Example D. The results are shown in Table 8.

Below, the structure of an alkali-soluble resin, molecular weight and molecular weight distribution, and the structure of an acid crosslinking agent are shown.

  As shown in Table 8, it was found that the composition according to the present invention was excellent in sensitivity, LER, pattern shape, and outgas characteristics in electron beam exposure, and had few scum defects. That is, it was found that the composition of the present invention has excellent performance as a negative resist composition in electron beam exposure.

<Example F>
(Resist preparation)
The components shown in Table 9 below were dissolved in a solvent and filtered through a polytetrafluoroethylene filter having a pore size of 0.1 μm to prepare a positive resist solution having a solid content concentration of 8% by mass.

(Resist evaluation)
The prepared positive resist solution was uniformly applied on a silicon substrate subjected to hexamethyldisilazane treatment using a spin coater, and then heated and dried on a hot plate at 100 ° C. for 60 seconds to obtain 0.12 μm. A resist film having a film thickness was formed.

〔sensitivity〕
The obtained resist film was subjected to surface exposure using EUV light (wavelength 13 nm) while changing the exposure amount by 0.5 mJ / cm ^{2 in} the range of 0 to 10.0 mJ / cm ² , and then at 110 ° C. Bake for 90 seconds. Then, using a 2.38 mass% tetramethylammonium hydroxide (TMAH) aqueous solution, the dissolution rate at each exposure amount was measured to obtain a dissolution rate curve.
In this dissolution rate curve, the exposure amount when the resist dissolution rate is saturated was defined as sensitivity.

[Pattern shape]
The exposure amount for reproducing a line and space (L / S = 1/1) mask pattern with a line width of 50 nm was set as the optimum exposure amount, and the profile at the optimum exposure amount was observed with a scanning microscope (SEM).

[Line edge roughness (LER)]
A 50 nm line pattern (L / S = 1/1) was formed at an irradiation dose showing the above sensitivity. And about arbitrary 30 points | pieces contained in the length direction 50 micrometers, the distance from the reference line which should have an edge was measured using the scanning electron microscope (S-9220 by Hitachi, Ltd.). And the standard deviation of this distance was calculated | required and 3 (sigma) was computed.

[Outgas (Evaluation of film thickness fluctuation rate after exposure)]
The irradiation dose twice as high as the above sensitivity was irradiated, the film thickness after exposure (before post-heating) was measured, and the variation rate from the unexposed film thickness was determined from the following equation.

Film thickness fluctuation rate = 100 × (film thickness at unexposed−film thickness after exposure) / film thickness at unexposed The smaller the film thickness fluctuation rate, the better the outgas reduction.

[Scum defect]
A line pattern was formed by the above method. Thereafter, a cross-sectional SEM was obtained with S4800 (manufactured by Hitachi High-Tech Co., Ltd.), and the residue in the space portion was observed. And it evaluated as follows.
X (Insufficient): Scum is observed, but the patterns are partially connected.
Δ (slightly insufficient): Scum is observed, but the patterns are not connected.
○ (Good): Only a small portion of the scum is seen and the patterns are not connected.
A (very good): No scum is seen.
These evaluation results are shown in Table 9 below.

  From the results shown in Table 9, it was found that the composition according to the present invention was excellent in sensitivity, LER, pattern shape, and outgas characteristics in EUV exposure, and had few scum defects. That is, it was found that the composition of the present invention has excellent performance as a positive resist composition in EUV exposure.

<Example G>
(Resist preparation)
The components shown in Table 10 below were dissolved in a solvent, and this was filtered through a polytetrafluoroethylene filter having a pore size of 0.1 μm to prepare a negative resist solution having a solid content concentration of 8% by mass. went.

<Resist evaluation>
The prepared negative resist solution was uniformly applied on a silicon substrate subjected to hexamethyldisilazane treatment using a spin coater, and then heated and dried on a hot plate at 120 ° C. for 60 seconds to obtain a 0.15 μm film. A resist film having a film thickness was formed.

This resist film was evaluated in the same manner as described in Example F. The results are shown in Table 10 below.

  From the results shown in Table 10, it was found that the composition according to the present invention was excellent in sensitivity, LER, pattern shape and outgas characteristics in EUV exposure, and had few scum defects. That is, it was found that the composition of the present invention has excellent performance as a negative resist composition in EUV exposure.

Claims (14)

The resist composition for semiconductors containing the compound represented by the following general formula (I).

In the formula, R represents a monovalent substituent.

Represents a monocyclic or polycyclic heterocycle containing a nitrogen atom.
S ^N represents a substituent.
m represents an integer of 0 or more.
X ⁻ represents an anion. The composition according to claim 1, wherein the anion represented by X ⁻ is selected from the group consisting of a sulfonate anion, an imido acid anion, and a methide acid anion. The said compound represented by the said general formula (I) decomposes | disassembles by irradiation of actinic light or a radiation, and generates the acid which is represented by the general formula HX and whose volume is 130 or more ³ or more. Composition. Wherein X ^- the anion represented by the composition according to any one of claims 1 to 3 represented by the following general formula (SA1) or (SA2).

In formula (SA1),
Ar represents an aryl group and may further have a substituent other than a-(D-B) group.
n represents an integer of 1 or more.
D represents a single bond or a divalent linking group.
B represents a monovalent substituent.
In formula (SA2),
Xf each independently represents a fluorine atom or an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.
R ₁ and R ₂ each independently represent a group selected from the group consisting of a hydrogen atom, a fluorine atom, an alkyl group, and an alkyl group in which at least one hydrogen atom is substituted with a fluorine atom.
L each independently represents a single bond or a divalent linking group.
E represents a group having a cyclic structure.
x represents an integer of 1 to 20, y represents an integer of 0 to 10, and z represents an integer of 0 to 10. The composition according to claim 1, wherein the heterocyclic ring is an aromatic ring.
.   The composition according to any one of claims 1 to 5, further comprising a resin that is decomposed by the action of an acid to increase the solubility in an alkali developer. The composition according to claim 6, wherein the resin contains a repeating unit represented by the following general formula (VI).

Where
R ₀₁ , R ₀₂ and R ₀₃ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. R ₀₃ represents an alkylene group, and may combine with Lp or Ar ₁ to form a ring.
Ar ₁ represents an aromatic ring group.
n represents an integer of 1 or more.
Lp represents a single bond or a divalent linking group.   The composition according to any one of claims 1 to 5, further comprising a resin soluble in an alkali developer and an acid crosslinking agent that crosslinks the resin by the action of an acid. The composition according to claim 8, wherein the resin contains a repeating unit represented by the following general formula (VI).

Where
R ₀₁ , R ₀₂ and R ₀₃ each independently represents a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group or an alkoxycarbonyl group. R ₀₃ represents an alkylene group and may combine with L or Ar ₁ to form a ring.
Ar ₁ represents an aromatic ring group.
n represents an integer of 1 or more.
Lp represents a single bond or a divalent linking group.   The composition according to any one of claims 1 to 9, further comprising a basic compound.   The composition according to any one of claims 1 to 10, which is exposed to an electron beam, an X-ray or EUV light.   A resist film formed using the composition according to claim 1. Forming a film using the composition according to any one of claims 1 to 11,
Exposing the film;
Developing a pattern of the exposed film.   The method according to claim 13, wherein the exposure is performed by electron beam, X-ray or EUV light.