JP2012032212A - Radiation detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation detector capable of suppressing deterioration in energy resolution.SOLUTION: A radiation detector 1 includes: a device mounting area 28 in which a semiconductor device 10 capable of detecting a radial ray is mounted; a card edge part 29 which is provided on opposed side of the device mounting area 28 and connectable to an external electric circuit; a substrate 20 having a signal line 23 and a signal line 24 for transferring signals from the semiconductor device 10 from the device mounting area 28 towards the card edge part 29; and a support member for supporting the substrate 20 in contact with a surface of the substrate 20 at a position separated from an edge 28a of the device mounting area to a side of the card edge part 29 and a surface of the substrate 20 at a position separated from edges 29a of the card edge part to a side of the device mounting area 28.

Description

  The present invention relates to a radiation detector. In particular, the present invention relates to a radiation detector that detects radiation such as gamma rays and X-rays.

  Conventionally, a semiconductor element, an anode electrode attached to one surface of the semiconductor element, a cathode electrode attached to the other surface of the semiconductor element, and one end side connected to at least one of the anode electrode and the cathode electrode A semiconductor radiation detector having a signal line that extends straight from an electrode and outputs a signal from the electrode is known (for example, see Patent Document 1).

JP 2005-109269 A

  In a radiation detector using a semiconductor element including the semiconductor radiation detector according to Patent Document 1, if there is a parasitic capacitance in a signal line that supplies a signal from the semiconductor element to a predetermined electronic component or the like, the energy resolution is reduced. May deteriorate.

  Accordingly, an object of the present invention is to provide a radiation detector capable of suppressing deterioration of energy resolution.

  To achieve the above object, the present invention provides an element mounting region on which a semiconductor element capable of detecting radiation is mounted, a card edge portion provided on the opposite side of the element mounting region and connectable to an external electric circuit, and a semiconductor A substrate having a signal line for transmitting a signal from the element toward the card edge portion from the element mounting region, a surface of the substrate at a position away from the end of the element mounting region toward the card edge portion, and an end of the card edge portion And a support member that supports the substrate in contact with the surface of the substrate at a position remote from the element mounting region.

  In the radiation detector, the signal line may be arranged in a region including a surface of the substrate on the card edge portion side of the device mounting region and a surface of the substrate on the device mounting region side of the card edge portion.

  Further, in the radiation detector, the support member has a first support part that contacts a part of the surface along an end of the element mounting area on the card edge part side, and an end of the card edge part on the element mounting area side. And a second support portion in contact with a part of the surface.

  In the radiation detector, the first support portion is on the card edge portion side of the element mounting region and is in contact with the region near the center of the side in the longitudinal direction of the substrate, and the second support portion is the card edge portion. It may be an area spaced from the end of the card and may be in contact with a plurality of areas along the longitudinal direction of the card edge part.

  In the radiation detector, each of the first support portion and the second support portion may be in contact with the surface of the substrate on which no signal line is provided.

  In the radiation detector, the support member may include a first support member and a second support member that support the substrate by sandwiching the substrate.

  According to the radiation detector according to the present invention, it is possible to provide a radiation detector capable of suppressing deterioration of energy resolution.

1 is a perspective view of a radiation detector according to a first embodiment of the present invention. It is a front view of the board | substrate which concerns on the 1st Embodiment of this invention. It is a front view of the card holder which concerns on the 1st Embodiment of this invention. It is a perspective view of the back surface of the card holder which concerns on the 1st Embodiment of this invention. It is a schematic diagram of the area | region where the 1st thru | or 3rd support part of the card holder which concerns on the 1st Embodiment of this invention contacts a board | substrate. It is a schematic diagram of the card holder which concerns on the 2nd Embodiment of this invention. It is a schematic diagram of the area | region where the 1st support part thru | or 3rd support part of the card holder which concerns on the 2nd Embodiment of this invention contact a board | substrate.

[First Embodiment]
FIG. 1 shows an example of a perspective view of a radiation detector according to the first exemplary embodiment of the present invention.

(Outline of configuration of radiation detector 1)
The radiation detector 1 according to the first embodiment of the present invention is a radiation detector that has a card-like shape and includes a semiconductor element 10 that can detect radiation such as γ-rays and X-rays. For example, the radiation detector 1 is used for the purpose of detecting radiation in a nuclear medicine diagnostic apparatus such as a gamma camera, SPECT, or PET.

  In FIG. 1, the radiation 100 enters from the upper side to the lower side of the page. That is, the radiation 100 enters the radiation detector 1 along the direction from the semiconductor element 10 of the radiation detector 1 toward the card holder 30 and the card holder 31 as support members. The radiation 100 is incident on the side surface of the semiconductor element 10 (that is, the surface facing upward in FIG. 1). Therefore, the side surface of the semiconductor element 10 is an incident surface for the radiation 100. As described above, the radiation detector in which the side surface of the semiconductor element 10 is the incident surface of the radiation 100 is referred to as an edge-on type radiation detector in the present embodiment. The radiation detector 1 detects a plurality of radiations 100 through a collimator having a plurality of openings through which the radiation 100 incident along a specific direction (for example, a direction toward the radiation detector 1) passes. The radiation detector 1 can be used as a radiation detector 1 for a radiation detection apparatus configured by arranging the radiation detectors 1 side by side.

  The radiation detector 1 includes a pair of semiconductor elements 10 capable of detecting radiation 100, a thin substrate 20, and a card holder that supports the substrate 20 by sandwiching the substrate 20 at a position away from the ends of the pair of semiconductor elements 10. 30 and a card holder 31. As an example, four pairs of semiconductor elements 10 are fixed to the substrate 20 at positions where the substrate 20 is sandwiched. That is, the pair of semiconductor elements 10 in each set is fixed to a symmetric position with the substrate 20 as a symmetry plane on each of one surface and the other surface of the substrate 20.

  The substrate 20 is supported by being sandwiched between a card holder 30 and a card holder 31. The card holder 30 and the card holder 31 are formed to have the same shape, and the protruding portion 36 of the card holder 31 is fitted into the grooved hole 34 of the card holder 30 and the grooved hole of the card holder 31 is fitted. The board | substrate 20 is supported by the projection part (not shown) which the card holder 30 has fitted in (not shown).

  The elastic member mounting portion 32a is a leaf spring that presses and fixes the radiation detector 1 to the radiation detector stand when the radiation detector 1 is inserted into the radiation detector stand that supports the plurality of radiation detectors 1. This is a portion where an elastic member 32 such as is provided. The radiation detector stand has a connector into which the card edge portion 29 is inserted. In the radiation detector 1, the card edge portion 29 is inserted into the connector, and the connector and the pattern 29a are electrically connected. Thus, the circuit is electrically connected to a control circuit as an external electric circuit, an external power supply line, a ground line, and the like.

  The radiation detector 1 includes a wiring pattern (the substrate 20 of the semiconductor element 10) that electrically connects each of the electrodes that each semiconductor element 10 has on the opposite side of the substrate 20 and the plurality of substrate terminals 22 provided on the substrate 20. A flexible substrate having an electrode on the opposite side of the element surface, a flexible substrate and the like (not shown) can be further provided on the opposite side of the substrate 20 of the pair of semiconductor elements 10.

(Details of semiconductor element 10)
The semiconductor element 10 is mainly composed of a compound semiconductor. The semiconductor element 10 is formed in a substantially rectangular parallelepiped shape or a flat plate shape. A plurality of grooves 10a are provided on the element surface which is one surface perpendicular to the surface on which the radiation of the semiconductor element 10 is incident. The groove 10a is formed, for example, having a concave shape or a V shape in a cross-sectional view. The semiconductor element 10 is fixed to the substrate 20 with the surface on which the groove 10a is provided facing the substrate 20 side.

  In addition, a region of the semiconductor element 10 on which the radiation is incident, the region delimited by a virtual perpendicular from each groove 10a to a surface opposite to the surface on which the groove 10a is provided, and the virtual perpendicular A region delimited by the end of the short side of the semiconductor element 10 is referred to as a pixel region. The semiconductor element 10 has (n−1) grooves 10a, so that n pixel regions are formed. In addition, a surface electrode is provided on each of the plurality of element surfaces which are flat regions between the plurality of grooves 10a, and a back electrode is provided on the element surface opposite to the surface on which the surface electrode is provided. Each of the plurality of pixel regions corresponds to one pixel (pixel) that detects radiation. Thereby, one semiconductor element 10 has a plurality of pixels.

  As an example, when one radiation detector 1 includes eight semiconductor elements 10 (four pairs of semiconductor elements 10) and one semiconductor element 10 has eight pixel regions, one radiation detector 1 , It will have a resolution of 64 pixels. By increasing or decreasing the number of grooves 10a, the number of pixels of one semiconductor element 10 can be increased or decreased. As an example, the width of the semiconductor element 10 is about 1.2 mm, the length is about 11.2 mm, and the height is about 5 mm.

As a compound semiconductor constituting the semiconductor element 10, for example, CdTe can be used. Further, the semiconductor element 10 is not limited to a CdTe element as long as radiation such as γ rays can be detected. For example, a compound semiconductor element such as a CdZnTe (CZT) element or an HgI ₂ element can also be used as the semiconductor element 10.

(Details of substrate 20)
FIG. 2 shows an outline of the front surface of the substrate according to the first embodiment of the present invention.

  The substrate 20 is provided with an element mounting area 28 for mounting the semiconductor element 10, a card edge portion 29 provided on the opposite side of the element mounting area 28 and connectable to an external electric circuit, and a signal from the semiconductor element 10. The signal line 23 and the signal line 24 are transmitted from the region 28 toward the card edge portion 29. The substrate 20 has an electronic component mounting portion 25 for mounting electronic components (not shown) such as resistors and capacitors to which signals from the semiconductor element 10 are input between the element mounting region 28 and the card edge portion 29. The electronic component mounting portion 25 further includes a plurality of substrate terminals 22 having a shape protruding from the substrate 20 (for example, a columnar shape) on the element mounting region 28 side.

  The element mounting area 28 can be set for each area where the semiconductor elements 10 are mounted, or can be set as an area where a plurality of semiconductor elements 10 are mounted. In the example of FIG. 2, an example is shown in which a rectangular element mounting region 28 is set for each of the plurality of semiconductor elements 10 in a front view. When a plurality of element mounting areas 28 are set, each of the plurality of element mounting areas 28 is provided with their short sides adjacent to each other.

  The element mounting region 28 is provided with a plurality of element connection portions 26 that are electrically connected to the plurality of electrodes of the semiconductor element 10. As an example, the element connecting portion 26 has a rectangular shape in front view. The plurality of element connection portions 26 are arranged along the longitudinal direction of the element mounting region 28 at a predetermined interval. In this case, each of the plurality of element connection portions 26 is arranged with the long side of the element connection portion 26 oriented in a direction perpendicular to the longitudinal direction of the element mounting region 28. The predetermined interval corresponds to the interval between the plurality of surface electrodes provided on the substrate 20 side of the semiconductor element 10.

  The end portions on the card edge portion 29 side of the plurality of element connection portions 26 are electrically connected to the plurality of signal lines 23, respectively. Each of the signal lines 23 is electrically connected to an electronic component mounted on the electronic component mounting portion 25. Here, the plurality of signal lines 23 are provided between the element mounting region 28 and the electronic component mounting portion 25 and are disposed in a region including the surface of the substrate 20 on the card edge portion 29 side of the element mounting region 28. As an example, the main portions of the plurality of signal lines 23 are formed to extend in a direction substantially parallel to the longitudinal direction of the element mounting region 28.

  The card edge portion 29 is provided including a plurality of patterns 29 a arranged along the longitudinal direction of the card edge portion 29 on the opposite side of the side where the element mounting area 28 is provided. Each of the plurality of patterns 29a has a rectangular shape when viewed from the front. Each of the plurality of patterns 29 a is arranged with the longitudinal direction oriented in a direction perpendicular to the longitudinal direction of the card edge portion 29. In addition, the end portions on the element mounting region 28 side of the plurality of patterns 29a are electrically connected to the plurality of signal lines 24, respectively. Each of the plurality of signal lines 24 is electrically connected to an electronic component mounted on the electronic component mounting unit 25. For example, the signal line 24 is disposed in a region including the surface of the substrate 20 on the element mounting region 28 side of the card edge portion 29.

  The substrate 20 is a thin substrate (for example, a glass epoxy substrate such as FR4) on which a conductive thin film (for example, copper foil) made of a conductive material such as a metal conductor is formed, and is made of an insulating material such as a solder resist. It is formed sandwiched between insulating layers. As an example, the substrate 20 is formed to have a thickness of 0.2 mm or less. In addition, a conductive adhesive such as a conductive silver paste is provided on the surface of the plurality of element connection portions 26, and the electrodes of the semiconductor element 10 are electrically connected to the element connection portions 26 via the silver paste. And mechanically fixed. In addition, the through-hole 27 is a hole through which the protrusion 36 included in each of the card holder 30 and the card holder 31 passes.

(Details of card holder 30)
FIG. 3A shows the outline of the front surface of the card holder according to the first embodiment of the present invention, and FIG. 3B shows the outline of the perspective view of the back surface of the card holder according to the first embodiment of the present invention. .

  Since the card holder 30 and the card holder 31 according to the present embodiment have substantially the same shape, the card holder 30 will be mainly described below. Each of the card holder 30 and the card holder 31 is made of an insulating resin material, such as polyphenylene sulfide resin (PPS).

  Referring to FIG. 3A, the card holder 30 includes an elastic member mounting portion 32a to which the elastic member 32 is fixed, a plurality of grooved holes 34 into which the protrusions 36 of the card holder 31 that is a pair of the card holder 30 are fitted, A substrate terminal 22 provided on the substrate 20 is formed with a plurality of terminal holes 38 through which the substrate terminal 22 penetrates. Further, the card holder 30 has protrusions 30b at both lower ends when the side on which the plurality of semiconductor elements 10 of the radiation detector 1 are provided is the upper side.

  Referring to FIG. 3B, the card holder 30 has a plurality of protrusions 36 that fit into the grooved holes 34 of the card holder 31 on the back surface thereof. Further, the card holder 30 has a recessed portion 39 at a position corresponding to the electronic component mounting portion 25 of the substrate 20. The electronic component mounted on the electronic component mounting portion 25 of the substrate 20 is covered with the card holder 30 or the card holder 31 by the recessed portion 39.

  Here, the card holder 30 as the first support member contacts the substrate 20 from one surface side of the substrate 20, and the card holder 31 as the second support member contacts the substrate 20 from the other surface side of the substrate 20. As a result, the substrate 20 is sandwiched between the card holder 30 and the card holder 31. Thereby, the substrate 20 is supported by the card holder 30 and the card holder 31.

  As shown in FIG. 3B, the card holder 30 includes a first support portion 33 and a second support portion 35 that are regions in contact with the substrate 20. The first support portion 33 is provided along the side in the longitudinal direction of the card holder 30. And the 2nd support part 35 is the longitudinal direction of the card holder 30, Comprising: It is provided in the other side of the edge | side in which the 1st support part 33 is provided. Further, the card holder 30 has a third support portion 37 in a direction perpendicular to the longitudinal direction of the first support portion 33 and the second support portion 35. The third support portion 37 is provided in the vicinity of both ends on the short side of the card holder 30.

  In the first embodiment, the first support portion 33 contacts the surface of the substrate 20 at a position away from the end of the element mounting region 28 toward the card edge portion 29 side. The second support portion 35 is in contact with the surface of the substrate 20 at a position away from the end of the card edge portion 29 toward the element mounting region 28. Further, the third support portion 37 contacts the surface of the substrate 20 at both ends of the card holder 30. The card holder 30 supports the substrate 20 when the first support portion 33, the second support portion 35, and the third support portion 37 are in contact with the substrate 20. The same applies to the card holder 31.

  FIG. 4 shows an outline of a region where the first to third support portions of the card holder according to the first embodiment of the present invention are in contact with the substrate. It should be noted that the width of each contact region shown in FIG. 4 is only shown for simplicity of explanation, and does not correspond to the width of the first support portion to the third support portion. . In FIG. 4, the signal lines 23 and 24 are not shown for convenience of explanation.

  The 1st support part 33 contacts the contact area 200a of FIG. Specifically, the contact region 200a is a region spaced from the element mounting region 28 on the card edge portion 29 side, that is, the end 28a of the device mounting region, and extends in a direction along the longitudinal direction of the device mounting region 28. Area. Further, the second support portion 35 contacts the contact region 200c. The contact area 200 c is an area that is spaced from the element mounting area 28 side of the card edge portion 29, that is, an end 29 b of the card edge portion, and extends in a direction along the longitudinal direction of the card edge portion 29. is there. In the first embodiment, since the width in the longitudinal direction of the element mounting area 28 is wider than the width in the longitudinal direction of the card edge portion 29, the length of the contact area 200a is longer than the length of the contact area 200c. Further, the third support portion 37 is a short portion of the substrate 20, that is, in the vicinity of both ends of the substrate 20, and in a partial contact region 200 b between the element mounting region 28 and the card edge portion 29. Contact the substrate 20.

  When the first support portion 33 to the third support portion 37 of the card holder 30 and the first support portion 33 to the third support portion 37 of the card holder 31 sandwich the substrate 20 from the front and back surfaces of the substrate 20, The substrate 20 is supported by a card holder 30 and a card holder 31. For the purpose of firmly supporting the substrate 20 on the card holder 30 and the card holder 31, the insulating layer on the surface of the substrate 20 with which the third support portion 37 contacts can be removed.

(Effects of the first embodiment)
In the radiation detector 1 according to the first exemplary embodiment of the present invention, the region where the signal line 23 and the signal line 24 of the substrate 20 are in contact with the card holder 30 and the card holder 31 made of a material having a high dielectric constant is provided. This can be reduced by providing the first support portion 33 and the second support portion 35. Thereby, since the radiation detector 1 can suppress the parasitic capacitance which generate | occur | produces when the signal wire | line 23 and the signal wire | line 24 and the card holder 30 and the card holder 31 contact, it suppresses deterioration of energy resolution. Can do.

[Second Embodiment]
FIG. 5 shows an outline of a card holder according to the second embodiment of the present invention.

  The radiation detector according to the second embodiment is substantially the same as the radiation detector according to the first embodiment, except that the shape of the card holder is different from that of the radiation detector according to the first embodiment. The structure and function are provided. That is, the card holder 30a according to the second embodiment is different from the card holder 30 and the card holder 31 according to the first embodiment except that the card holder 30 and the card holder 31 according to the first embodiment are different from the board 20 side. It has substantially the same configuration and function. Therefore, a detailed description is omitted except for differences.

  The card holder 30 a according to the second embodiment includes a first support portion 33 a that contacts a part of the surface of the substrate 20 along the end of the element mounting region 28 on the card edge portion 29 side, and the card edge portion 29. A plurality of second support portions 35 a that are in contact with a part of the surface of the substrate 20 along the end on the element mounting region 28 side.

  Specifically, referring to FIG. 5, the card holder 30 a has a first support portion 33 a and a plurality of second supports on the back surface (that is, the surface facing the substrate 20), which is a region in contact with the substrate 20. It has a part 35a. The first support portion 33 a is a partial region along the longitudinal side of the card holder 30, and is provided on the side with a convex shape toward the substrate 20. The plurality of second support portions 35a are provided at intervals in the longitudinal direction of the card holder 30a on the opposite side of the side where the first support portion 33a is provided in the longitudinal direction of the card holder 30a. Similarly to the first support portion 33a, the plurality of second support portions 35a are also provided with a convex shape toward the substrate 20 side. In addition, the card holder 30a includes a third support portion 37 in a direction perpendicular to the longitudinal direction of the first support portion 33a and the plurality of second support portions 35a. The third support portion 37 is provided in the vicinity of both ends on the short side of the card holder 30a.

  FIG. 6 shows an outline of a region where the first to third support portions of the card holder according to the second embodiment of the present invention are in contact with the substrate. Note that the width of each contact region shown in FIG. 6 is only shown for simplicity of explanation, and does not correspond to the width of the first support portion to the third support portion. . In FIG. 6, the signal lines 23 and 24 are not shown for convenience of explanation.

  The 1st support part 33a contacts the contact area 202a of FIG. Specifically, the contact region 202a is a region spaced from the element mounting region 28 on the card edge portion 29 side, that is, the end 28a of the device mounting region, and is one of the regions along the longitudinal direction of the device mounting region 28. Part area. The contact area 202a is, for example, an area on the card edge portion 29 side of the element mounting area 28 and corresponding to the vicinity of the center of the side of the substrate 20 in the longitudinal direction.

  The plurality of second support portions 35a are in contact with the contact region 202c or the contact region 202d, respectively. The plurality of contact areas 202d are areas spaced from the element mounting area 28 side of the card edge portion 29, that is, the end 29b of the card edge portion, and a part of the area along the longitudinal direction of the card edge portion 29. It is an area. Further, the contact area 202c is an area corresponding to a position sandwiching the plurality of contact areas 202d. The plurality of contact regions 202d and the contact region 202c are arranged at intervals corresponding to the intervals at which the plurality of second support portions 35a are arranged. Further, the third support portion 37 is in a short portion of the substrate 20, that is, in the vicinity of both ends of the substrate 20, and in a partial contact region 202 b between the element mounting region 28 and the card edge portion 29. Contact the substrate 20.

  In the second embodiment, the first support portion 33a is provided in a partial region near the center of the side on the element connection portion 26 side of the card holder 31a. For example, the first support portion 33a is in contact with the contact region 202a which is a part of the vicinity of the center of the side in the longitudinal direction of the substrate 20 on the card edge portion 29 side of the element mounting region 28. Moreover, the 2nd support part 35a is provided in several places at intervals along the edge by the side of the card edge part 29 of the card holder 31a. The plurality of second support portions 35a are regions spaced from the edge 29b of the card edge portion, and are a plurality of regions separated from each other along the longitudinal direction of the card edge portion 29, and the contact regions 202c and It contacts the contact area 202d. As a result, in the second embodiment, unlike the first embodiment, the area where the card holder and the signal line provided on the surface of the substrate 20 are in contact with each other is reduced. Therefore, the radiation detector according to the second embodiment can further reduce the parasitic capacitance compared to the first embodiment.

(Modification of the second embodiment)
In the modification of the second embodiment, each of the first support portion and the second support portion provided on the card holder contacts the surface of the substrate 20 on which the signal line 23 and the signal line 24 are not provided. To do. For example, by providing a groove in each of the region of the first support portion located directly above the signal line 23 of the substrate 20 and the region of the second support portion located directly above the signal line 24, the card holder and the signal The contact with the wire can be prevented. As a result, the parasitic capacitance can be further reduced as compared with the second embodiment.

  While the embodiments of the present invention have been described above, the embodiments described above do not limit the invention according to the claims. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

DESCRIPTION OF SYMBOLS 1 Radiation detector 10 Semiconductor element 10a Groove 20 Board | substrate 22 Board | substrate terminal 23, 24 Signal line 25 Electronic component mounting part 26 Element connection part 27 Through-hole 28 Element mounting area 28a End of element mounting area 29 Card edge part 29a Pattern 29b Card edge End of part 30, 31 Card holder 30a Card holder 32 Elastic member 32a Elastic member mounting part 33, 33a First support part 34 Slotted hole 35, 35a Second support part 36 Projection part 37 Third support part 38 Terminal Hole 39 Recessed portion 100 Radiation 200a, 200b, 200c Contact area 202a, 202b, 202c, 202d Contact area

Claims (6)

An element mounting area for mounting a semiconductor element capable of detecting radiation, a card edge portion provided on the opposite side of the element mounting area and connectable to an external electric circuit, and a signal from the semiconductor element for the element mounting area A substrate having a signal line for transmission from the card edge portion to the card edge portion;
The substrate is in contact with the surface of the substrate at a position away from the end of the element mounting region toward the card edge portion, and the surface of the substrate at a position away from the end of the card edge portion toward the element mounting region. A radiation detector comprising a supporting member for supporting.   The signal line is arranged in a region including a surface of the substrate on the card edge portion side of the element mounting region and a surface of the substrate on the device mounting region side of the card edge portion. Radiation detector.   The support member includes a first support portion that contacts a part of the surface along an end of the element mounting region on the card edge portion side, and an end of the card edge portion on the element mounting region side. The radiation detector of Claim 2 which has a 2nd support part which touches a part of surface. The first support portion is on the card edge portion side of the element mounting region, and is in contact with a region near the center of the side in the longitudinal direction of the substrate,
4. The radiation detector according to claim 3, wherein the second support part is an area spaced from an end of the card edge part and is in contact with a plurality of areas along a longitudinal direction of the card edge part.   The radiation detector according to claim 4, wherein each of the first support portion and the second support portion is in contact with a surface of the substrate on which the signal line is not provided.   The radiation detector according to claim 5, wherein the support member includes a first support member and a second support member that support the substrate by sandwiching the substrate.

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