JP2012021923A - Sensor chip mounting structure and mounting method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor chip mounting structure capable of suppressing a decrease in detection accuracy of a sensor chip without providing a glass pedestal; and to provide a mounting method thereof.SOLUTION: This sensor chip mounting structure includes: a projecting part 64 projecting to the backside 61b of a sensor chip 60 in the direction crossing with the backside 61b and surrounding a recessed part 62; and a joining region located in the backside 61b on the other side of the recessed part 62 side with respect to the projecting part 64. A joining material 70 has adhesive 71, and an interval retaining material 72 mixed in the adhesive 71, a member 40 to be mounted is provided with a coating area 41 at a region facing the joining region of the sensor chip 60. A prescribed interval is formed between the sensor chip 60 and the member 40 to be mounted by the interval retaining material 72 which comes into contact with the joining region and the mounting object member 40 out of the sensor chip 60.

Description

  The present invention relates to a sensor chip mounting structure in which a sensor chip having a diaphragm is bonded to a mounted member via a bonding material, and a mounting method thereof.

  Conventionally, mounting a sensor chip having a thin diaphragm formed by forming a recess on the back side of a semiconductor substrate is joined to a mounted member via an adhesive mixed with beads or the like. The structure is known (for example, refer to Patent Document 1). Specifically, in such a mounting structure, the back surface of the sensor chip is provided with a base made of glass or the like and having a thermal expansion coefficient close to that of the sensor chip. Is bonded to the member to be mounted via a base and an adhesive.

JP 2003-247903 A

  However, such a sensor chip mounting structure has a problem in that the number of components increases because a glass pedestal must be provided.

  In order to solve this problem, it is simply considered that the sensor chip is directly bonded to the mounted member via an adhesive without providing a glass pedestal. However, when the sensor chip is directly bonded to the member to be mounted, the adhesive may wet and spread along the wall surface of the recess and adhere to the diaphragm. If the adhesive adheres to the diaphragm, the sensor chip There is a problem in that the detection accuracy of the is reduced.

  In view of the above-described points, an object of the present invention is to provide a sensor chip mounting structure and a mounting method thereof that can suppress a decrease in detection accuracy of the sensor chip without providing a glass pedestal.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided a sensor having a thin diaphragm (63) formed by forming a recess (62) on the back surface (61b) side of a semiconductor substrate (61). Sensor chip mounting structure in which the chip (60) is bonded to the mounted member (40) by wetting and spreading the bonding material (70) applied to the application region (41) of the mounted member (40). The sensor chip (60) protrudes from the back surface (61b) in a direction intersecting the back surface (61b) and surrounds the recess (62), and the back surface (61b) The bonding material (70) has a bonding region located on the opposite side of the concave portion (62) across the convex portion (64), and the bonding material (70) is an adhesive that bonds the sensor chip (60) and the mounted member (40). (71) and an adhesive 71), and the mounted member (40) is applied to a region facing the bonding region among regions facing the back surface (61b) of the sensor chip (60). There is a region (41), and between the sensor chip (60) and the mounted member (40), a spacing member that contacts the bonding region and the mounted member (40) in the sensor chip (60). According to (72), a predetermined interval is formed.

  In such a sensor chip mounting structure, the sensor chip (60) has a convex portion (64) surrounding the concave portion (62) on the back surface (61b). For this reason, when the bonding material (70) applied to the application region (41) spreads out wet, the bonding material (70) collides with the convex part (64) and the momentum of the wet spreading decreases. In addition, since the adhesive (71) of the bonding material (70) is difficult to spread due to surface tension from a narrow space to a wide space, the adhesive spread between the convex portion (64) and the mounted member (40). The agent (71) is suppressed from spreading in the recess (62). Therefore, compared with the case where the convex portion (64) is not formed on the sensor chip (60), the bonding material (70), specifically, in the concave portion (62) of the back surface (61b) of the sensor chip (60). It can suppress that an adhesive agent (71) spreads wet. For this reason, it can suppress that an adhesive agent (71) adheres to the diaphragm (63) of a sensor chip (60), and can suppress that the detection accuracy of a sensor chip (60) falls.

  For example, as in the invention described in claim 2, the length from the back surface (61b) to the tip of the convex portion (64) is maintained so as to be in contact with the sensor chip (60) and the mounted member (40). It can be made shorter than the vertical length of the back surface (61b) of the material (72).

  In such a mounting structure, the application region (41) of the mounted member (40) is in a region facing the bonding region, that is, in a region outside the region facing the convex portion (64), and the convex portion (64 ) Is shorter than the length of the spacing member (72) in the direction parallel to the protruding direction of the convex portion (64). For this reason, it can suppress that a space | interval holding material (72) is pinched | interposed between a convex part (64) and a to-be-mounted member (40). Therefore, the sensor chip (60) can be prevented from being inclined with respect to the mounted member (40), and the distance between the sensor chip (60) and the mounted member (40) is larger than a desired distance. This can be suppressed. Moreover, since it prevents that a convex part (64) contacts a to-be-mounted member (40) directly, it suppresses that a thermal stress etc. are directly transmitted to a sensor chip (60) from a to-be-mounted member (40). be able to.

  Moreover, the recessed part (65) surrounding a convex part (64) can be formed in the back surface (61b) of a sensor chip (60) like invention of Claim 3. In such a mounting structure, when the bonding material (70) spreads wet in the recess (65) as compared with the case where there is no recess (65), the protrusion (64) extends from the recess (65). ) When wetting and spreading to the side, the direction of wetting and spreading changes, reducing the momentum of spreading. For this reason, it can further suppress that an adhesive agent (71) spreads out in a recessed part (62) among the back surfaces (61b) of a sensor chip (60), and it adheres to the diaphragm (63) of a sensor chip (60). It can further suppress that an agent (71) adheres.

  In this case, as in the invention described in claim 4, in the invention described in claim 3, the wall surface forming the recess portion (65) and the wall surface forming the convex portion (64) can be linked. . In such a mounting structure, compared with the case where the wall surface which comprises a hollow part (65) and the wall surface which comprises a convex part (64) are not connected, the force attracted | sucked in a hollow part (65) Since the change in the direction of is small, it is possible to increase the force drawn into the recess (65) with respect to the adhesive (71) between the convex portion (64) and the stem (40). Accordingly, it is possible to further suppress the adhesive (71) from adhering to the diaphragm (63) of the sensor chip (60).

  Further, as in the invention described in claim 5, the spacing member (72) can be formed in a spherical shape. In such a mounting structure, since the spacing member (72) has a spherical shape, when the spacing member (72) in contact with the sensor chip (60) and the mounted member (40) is not spherical, Compared to the case of a cube or the like, the contact area between the sensor chip (60) and the mounted member (40) and the spacing member (72) can be reduced. For this reason, compared with the case where the spacing member (72) is not spherical, the thermal stress transmitted from the mounted member (40) to the sensor chip (60) via the spacing member (72) is reduced. be able to.

  In the first to fifth aspects, the case where the present invention is grasped as a sensor chip mounting structure has been described. However, the present invention can also be grasped as a sensor chip mounting method.

  That is, in the invention described in claim 6, the sensor chip (60) having the thin diaphragm (63) formed by forming the recess (62) on the back surface (61b) side of the semiconductor substrate (61) is covered. A method for mounting a sensor chip that is bonded to a mounting member (40) via a bonding material (70), and projects as a sensor chip (60) in a direction intersecting the back surface (61b) with respect to the back surface (61b). And a step of preparing a convex portion (64) surrounding the concave portion (62) and a back surface (61b) having a bonding region located on the opposite side of the concave portion (62) with the convex portion (64) interposed therebetween, The bonding material (70) has an adhesive (71) for bonding the sensor chip (60) and the mounted member (40), and a spacing member (72) mixed in the adhesive (71). And the process of preparing The step of applying the bonding material (70) to the region facing the bonding region out of the region where the sensor chip (60) is mounted in the mounted member (40), and the sensor chip (60) on the mounted member (40) In the state where the spacing material (72) is in contact with the bonding region of the sensor chip (60) and the mounted member (40) while the bonding material (70) is wetted and spread, And 60) joining the mounted member (40).

  Thus, even when the present invention is grasped as a mounting method of the sensor chip, a sensor chip (60) having a convex portion (64) surrounding the concave portion (62) on the back surface (61b) is prepared, and the sensor In order to join the chip (60) to the mounted member (40) via the bonding material (70) applied to the region facing the bonding region of the mounted member (40), the invention according to claim 1 and Similarly, adhesion of the adhesive (71) to the diaphragm (63) of the sensor chip (60) can be suppressed. For this reason, it can suppress that the detection accuracy of a sensor chip (60) falls.

  For example, as in the invention described in claim 7, in the step of preparing the sensor chip (60), a recess (65) surrounding the convex portion (64) is formed on the back surface (61b) of the sensor chip (60). You may also prepare something.

  In the step of preparing the bonding material (70) as in the invention described in claim 8, a spherical interval holding material (72) is prepared as the interval holding material (72), and the sensor chip (60) is attached. In the step of preparing, even if the sensor chip (60) in which the length from the back surface (61b) of the sensor chip (60) to the tip of the convex part (64) is shorter than the diameter of the spacing member (72) is prepared. Good.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a figure which shows the cross-sectional structure of the pressure sensor to which the mounting structure of the sensor chip in 1st Embodiment of this invention is applied. It is an enlarged view of the dashed-two dotted line part shown in FIG. It is an enlarged view of the dashed-two dotted line part shown in FIG. FIG. 3 is a rear view of the sensor chip shown in FIG. 2. It is a figure which shows a state when the bonding | jointing material is apply | coated to the application | coating area | region of a stem.

(First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is a diagram showing a cross-sectional configuration of a pressure sensor to which a sensor chip mounting structure according to this embodiment is applied.

  As shown in FIG. 1, the pressure sensor includes a box-shaped case body 10, and an upper lid 20 and a lower lid 30 that close the case body 10. The case main body 10, the upper lid 20, and the lower lid 30 are formed by molding a resin material such as PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), or epoxy resin.

  The case body 10 includes a partition portion 13 that constitutes introduction spaces 11 and 12 inside, and pressure introduction ports 14 and 15 connected to the introduction spaces 11 and 12, respectively. As a result, the pressure medium is introduced into the introduction spaces 11 and 12 via the pressure introduction ports 14 and 15. Although not particularly limited, for example, a pressure medium such as exhaust gas is introduced into the introduction space 11 via the pressure introduction port 14, and the atmospheric pressure is introduced into the introduction space 12 via the pressure introduction port 15. Etc. can be introduced.

  Further, two stems 40 as press-fit members are press-fitted and fixed to the case body 10 between the partition portion 13 and the inner wall surface of the case body 10. The stem 40 is formed by pressing, cutting, cold forging, or the like of an iron-based metal or the like, and one having a small difference in thermal expansion coefficient from the sensor chip 60 described later is used. In the present embodiment, since a sensor chip 60 described later is configured using a semiconductor substrate such as silicon, the stem 40 is configured using, for example, ceramics.

  A seal member 50 is provided between the inner wall surface of the case main body 10 and the partition portion 13 and the stem 40 to seal a gap between them. For example, silicone rubber or the like is used as the seal member 50. In addition to the function of sealing the gap, the seal member 50 also has a function of suppressing the generation of bubbles from the inner wall surface of the case body 10 and the partition part 13.

  Each stem 40 has a through hole 40 a, and a sensor chip 60 that closes the through hole 40 a is bonded and fixed to a portion facing the upper lid 20 via a bonding material 70. 2 is an enlarged view of the two-dot chain line portion shown in FIG. 1, and FIG. 3 is an enlarged view of the two-dot chain line portion shown in FIG. FIG. 4 is a back view of the sensor chip 60 shown in FIG. In FIG. 3, the first gel member described later is omitted.

  As shown in FIGS. 2 to 4, the sensor chip 60 is configured using a semiconductor substrate 61 such as silicon having a front surface 61 a and a back surface 61 b parallel to the front surface 61 a. The semiconductor substrate 61 has a thin diaphragm 63 formed by anisotropic etching or the like from the back surface 61b to form a recess 62, and a bridge circuit is formed on the surface of the diaphragm 63. A gauge resistor (not shown) formed as described above is provided. That is, in the sensor chip 60, when a pressure is applied to the diaphragm 63, the resistance value of the gauge resistance changes, the voltage of the bridge circuit changes, and the sensor output signal is output in accordance with the change of the voltage. belongs to.

  The sensor chip 60 includes a convex portion 64 that protrudes in a direction intersecting the rear surface 61 b of the semiconductor substrate 61, specifically, a direction perpendicular to the rear surface 61 b and surrounds the concave portion 62. A depression 65 surrounding the projection 64 is formed. And it has a joining area | region on the opposite side to the recessed part 62 side on both sides of the convex part 64 among the back surfaces 61b. Moreover, in this embodiment, it is set as the structure which the wall surface which comprises the convex part 64, and the wall surface which comprises the recessed part 62 were continued, and the wall surface which comprises the hollow part 65, and the wall surface which comprises the convex part 64 were continued. It is configured. Furthermore, although the convex part 64 is not specifically limited, In this embodiment, the length from the back surface 61b to the front-end | tip is about 50 micrometers.

  In addition, it is set as the structure which the wall surface which comprises the convex part 64, and the wall surface which comprises the recessed part 62 are connected, and it is parallel to the surface 61a between the wall surface which comprises the convex part 64, and the wall surface which comprises the recessed part 62. That is, there is no wall surface. Moreover, it is set as the structure which the wall surface which comprises the hollow part 65, and the wall surface which comprises the convex part 64 are connected, The surface 61a between the wall surface which comprises the hollow part 65, and the wall surface which comprises the convex part 64 There is no wall surface that is parallel to.

  The bonding material 70 is configured to include an adhesive 71 such as a silicone-based adhesive and a plurality of spacing members 72 mixed in the adhesive 71. In the present embodiment, the spacing member 72 has a spherical shape with a diameter longer than the length of the convex portion 64, and has a diameter of about 75 to 100 μm, for example. Moreover, as a material which comprises the space | interval holding material 72, what has a value close | similar to the thermal expansion coefficient of the sensor chip 60 is used, for example, divinylbenzene etc. are used.

  The sensor chip 60 is bonded to the stem 40 via the bonding material 70. Specifically, the sensor chip 60 is bonded via a bonding material 70 applied to a coating region located in a region facing the bonding region in a region facing the back surface 61b of the sensor chip 60 in the stem 40. Yes. That is, the stem 40 has a coating region in a region opposite to the region facing the recess 62 across the region facing the projection 64 among the region facing the back surface 61 b of the sensor chip 60. And the back surface 61b of the sensor chip 60 and the stem 40 are joined by wetting and spreading the joining material 70 applied to the application region. In addition, a predetermined distance, that is, a distance corresponding to the diameter of the spacing member 72 is formed between the sensor chip 60 and the stem 40 by the spacing member 72 in contact with the joining region and the stem 40 in the sensor chip 60. Has been.

  The sensor chip 60 is bonded to the stem 40 by wetting and spreading the bonding material 70, but a convex portion 64 is formed on the back surface 61 b of the sensor chip 60, and the convex portion 64 is bonded to the concave portion 62. Since the agent 71 is suppressed from spreading wet, the adhesive 71 contained in the bonding material 70 is not disposed in the recess 62 of the sensor chip 60. In addition, all the spacing members 72 mixed in the bonding material 70 do not exhibit a spacing function that forms a predetermined spacing between the sensor chip 60 and the stem 40. By being in contact with the stem 40, an interval holding function for forming a predetermined interval between the sensor chip 60 and the stem 40 is exhibited. In other words, not all of the spacing members 72 included in the bonding material 70 are in contact with the sensor chip 60 and the stem 40. As described above, the sensor chip 60 is joined to the stem 40.

  Further, as shown in FIG. 1, on the back surface 61 b side of each sensor chip 60, the first gel member 81 is disposed in a portion near the stem 40 in the through hole 40 a and the introduction spaces 11 and 12 of the stem 40. In addition, a second gel member 82 that covers the first gel member 81 and is harder than the first gel member 81 is disposed in the introduction spaces 11 and 12. As the first and second gel members 81 and 82, it is preferable to use a highly acid-resistant material that can protect the sensor chip 60 from a highly corrosive pressure medium. For example, a fluorine-based gel or the like is used. It is done.

  Further, the case body 10 is provided with a circuit chip (not shown) that receives an electrical signal from each sensor chip 60 and performs processing such as calculation and amplification and outputs a signal to the outside. Is electrically connected to the circuit chip by a bonding wire (not shown).

  Further, the case body 10 includes a connector portion 16 on one side surface portion. The connector portion 16 is insert-molded with a terminal 17 that is exposed in the case body 10 and exposed from the opening 16 a formed in the connector portion 16. One end portion of the terminal 17 exposed in the case body 10 is electrically connected to the circuit chip via a bonding wire (not shown). On the other hand, the other end portion of the terminal 17 exposed from the opening 16a of the connector portion 16 is electrically connected to an external circuit via an external wiring member (not shown) such as a wire harness. In addition, a sealing member 83 made of, for example, gel or the like that seals the gap between the terminal 17 and the case body 10 is disposed in a portion of the terminal 17 that protrudes into the case body 10.

  The case body 10 is provided with a groove 18 and a protruding end 19, the upper lid 20 is provided with an opening end 21, and the lower lid 30 is provided with a groove 31. Then, the groove portion 18 is filled with the adhesive 91 and the opening end 21 of the upper lid 20 is inserted, and the groove portion 31 is filled with the adhesive 92 and the protruding end 19 of the case body 10 is inserted. 10 and the upper lid 20 and the lower lid 30 are integrated. That is, the introduction spaces 11 and 12 are each configured by the case body 10, the partition portion 13, the sensor chip 60, and the lower lid 30, and the introduction spaces 11 and 12 are separated from each other by the partition portion 13. Yes.

  Next, an example of a manufacturing method of such a pressure sensor will be described.

  First, a case body 10 in which a connector portion 16 and pressure introduction ports 14 and 15 are provided and a terminal 17 is insert-molded, an upper lid 20, a lower lid 30, a stem 40 having a through hole 40a, and a sensor chip 60 having the above-described configuration are prepared. To do.

  Then, two stems 40 are press-fitted between the partition portion 13 and the inner wall surface of the case body 10. Thereafter, the bonding material 70 is applied to the application region in the stem 40. FIG. 5 is a diagram illustrating a state when the bonding material 70 is applied to the application region of the stem 40. As shown in FIG. 5, the application region 41 in the stem 40 is a region outside the convex portion facing region 42 facing the convex portion 64 in the region where the sensor chip 60 is mounted, that is, the bonding region of the sensor chip 60. For example, there are four locations. The bonding material 70 is applied to the application region 41.

  Thereafter, the sensor chip 60 is mounted on the stem 40, and the sensor chip 60 and the stem 40 are bonded via the bonding material 70. Specifically, the back surface 61b of the sensor chip 60 and the stem 40 are bonded by mounting the sensor chip 60 on the stem 40 and spreading the applied bonding material 70. 2 and 3, there is no adhesive 71 in the recess 62, and the sensor chip 60 is in a state in which the spacing member 72 is in contact with the joint region and the stem 40 in the sensor chip 60. And the stem 40 are joined.

  That is, the bonding material 70 wets and spreads from the application region 41 to the surroundings. However, since the convex portion 64 is formed on the back surface 61b of the sensor chip 60, the bonding material 70 collides with the convex portion 64 and gets wet. The spreading momentum will decrease. In addition, since the adhesive 71 is difficult to wet and spread due to surface tension from a narrow space to a wide space, the adhesive 71 spread between the convex portion 64 and the stem 40 is suppressed from spreading into the concave portion 62. . Therefore, the adhesive 71 is prevented from spreading in the recess 62 in the back surface 61 b of the sensor chip 60, and the adhesive 71 is prevented from adhering to the diaphragm 63.

  In addition, the spacing member 72 included in the bonding material 70 also moves as the bonding material 70 wets and spreads. However, the application region 41 of the stem 40 is a region facing the bonding region. Is formed in a spherical shape having a diameter longer than the length of the convex portion 64. For this reason, even if the bonding material 70 spreads and spreads, the spacing member 72 collides with the convex portion 64. Therefore, the spacing member 72 comes into contact with the joint region and the stem 40 in the sensor chip 60. In other words, the gap retaining member 72 is suppressed from being sandwiched between the convex portion 64 and the stem 40, and the sensor chip 60 is suppressed from being inclined with respect to the stem 40.

  Subsequently, after the seal member 50 or the circuit board is disposed on the case 10 body, each sensor chip 60 and the circuit chip, or the circuit chip and the terminal 17 are electrically connected via bonding wires. And the sealing member 83 and the 1st, 2nd gel members 81 and 82 are arrange | positioned. Thereafter, the groove portion 18 is filled with the adhesive 91 and the opening end 21 of the upper lid 20 is inserted, and the groove portion 31 is filled with the adhesive 92 and the protruding end 19 of the case body 10 is inserted, and the case body 10 and the upper lid 20 are inserted. And the pressure sensor shown in the said FIG. 1 is manufactured by integrating with the lower cover 30. FIG.

  As described above, in the present embodiment, the convex portion 64 and the recess portion 65 are formed on the back surface 61 b of the sensor chip 60. The sensor chip 60 and the stem 40 are bonded to each other by applying a bonding material 70 to a region of the stem 40 that faces the bonding region when the sensor chip 60 is mounted.

  For this reason, when the sensor chip 60 is mounted on the stem 40 and the bonding material 70 is wetted and spread from the application region 41 to the surroundings, the momentum of the bonding material 70 colliding with the convex portion 64 and spreading is reduced. In addition, the adhesive 71 of the bonding material 70 is difficult to wet and spread due to surface tension from a narrow space to a wide space, so that the adhesive 71 spread between the convex portion 64 and the stem 40 wets and spreads in the concave portion 62. It is suppressed. Therefore, as compared with the case where the convex portion 64 is not formed on the sensor chip 60, the bonding material 70, specifically the adhesive 71, is prevented from being wetly spread in the concave portion 62 of the back surface 61b of the sensor chip 60. it can. For this reason, it can suppress that the adhesive agent 71 adheres to the diaphragm 63 of the sensor chip 60, and can suppress that the detection accuracy of the sensor chip 60 falls.

  Further, since the recess portion 65 surrounding the convex portion 64 is formed on the back surface 61b of the sensor chip 60, when the bonding material 70 spreads out in the recess portion 65, and from the inside of the recess portion 65 to the convex portion 64 side. When wetting and spreading, the direction of wetting and spreading changes, and the momentum spreading and spreading decreases. Further, in the portion of the adhesive 71 between the convex portion 64 and the stem 40, a force attracted into the recess 65 from the adhesive 71 flowing into the recess 65 is also applied. For this reason, it can further suppress that the adhesive agent 71 spreads in the recessed part 62 among the back surfaces 61b of the sensor chip 60.

  Further, in the portion of the adhesive 71 between the convex portion 64 and the stem 40, a force attracted into the recess 65 from the adhesive 71 flowing into the recess 65 is applied. The direction is along the wall surface from the recess 65 toward the tip of the convex portion 64. That is, when the sensor chip 60 does not have a structure in which the wall surface forming the recess 65 and the wall surface forming the protrusion 64 are continuous, that is, the wall surface forming the recess 65 and the wall surface forming the protrusion 64 When there is a wall surface parallel to the surface 61a between the two, the force drawn into the recess 65 changes from the direction along the wall constituting the recess 65 to the direction along the wall parallel to the surface 61a. Then, the direction is along the wall surface of the convex portion 64. That is, in this embodiment, since the wall surface that forms the recess 65 and the wall surface that forms the protrusion 64 are connected, the wall surface that forms the recess 65 and the wall surface that forms the protrusion 64 are provided. Compared to the case where the configuration is not continuous, the change in the direction of the force attracted into the recess 65 can be reduced. For this reason, it is possible to increase the force attracted into the recess 65 with respect to the adhesive 71 in the portion between the convex portion 64 and the stem 40, and the adhesive in the concave portion 62 of the back surface 61 b of the sensor chip 60. It can further suppress that 71 spreads wet.

  In the present embodiment, the bonding material 70 is applied to a region outside the convex portion facing region 42 in the stem 40, that is, a region facing the bonding region of the sensor chip 60, and the diameter of the spacing member 72 is convex. Since it is made longer than the length of the part 64, it is suppressed that the space | interval holding material 72 is pinched | interposed between the convex part 64 and the stem 40 when the joining material 70 spreads wet. Therefore, it is possible to suppress the sensor chip 60 from being inclined with respect to the stem 40, and it is possible to suppress the gap between the sensor chip 60 and the stem 40 from becoming larger than a desired distance.

  In the present embodiment, since the spacing member 72 has a spherical shape, the contact area where the spacing member 72 contacts the sensor chip 60 and the stem 40 as compared to the case where the spacing member 72 is not spherical. The thermal stress transmitted from the stem 40 to the sensor chip 60 via the spacing member 72 can be reduced.

(Other embodiments)
In the first embodiment, the example in which the mounting structure in which the sensor chip 60 having the diaphragm 63 is joined to the stem 40 is applied to the pressure sensor has been described. However, the present invention is not limited to this. Can be applied. That is, the present invention can be applied to a mounting structure and a mounting method in which the sensor chip 60 having the diaphragm 63 is joined to the mounted member without using a pedestal.

  Moreover, although the said 1st Embodiment demonstrated the example in which the wall surface which comprises the convex part 64, and the wall surface which comprises the recessed part 62 were continued, it is not limited to this. That is, a shape having a wall surface parallel to the surface 61 a between the wall surface forming the convex portion 64 and the wall surface forming the concave portion 62 may be used.

  Furthermore, although the said 1st Embodiment demonstrated the example in which the hollow part 65 was formed in the back surface 61b of the sensor chip 60, the hollow part 65 does not need to be formed in the back surface 61b of the sensor chip 60. FIG. That is, if the convex portion 64 is formed on the back surface 61b of the sensor chip 60, it is possible to suppress the adhesive 71 from spreading in the concave portion 62 as compared with the case where the convex portion 64 is not formed. It can suppress that the detection accuracy of the chip | tip 60 falls. Moreover, in the said 1st Embodiment, although the wall surface which comprises the hollow part 65 and the wall surface which comprises the convex part 64 were demonstrated, the wall surface which comprises the hollow part 65, and the wall surface which comprises the convex part 64 It can also be set as the shape which has a wall surface parallel to the surface 61a between.

  In the first embodiment, the spacing member 72 has a spherical shape. For example, the spacing member 72 may be a cube, a regular octahedron, a regular hexahedron, or the like.

  In the first embodiment, the example in which the convex portions 64 and the concave portions 65 are formed one by one on the sensor chip 60 has been described. Of course, a plurality of convex portions 64 and the concave portions 65 are formed on the sensor chip 60. It may be.

DESCRIPTION OF SYMBOLS 10 Case main body 20 Upper cover 30 Lower cover 40 Stem 60 Sensor chip 61 Semiconductor substrate 62 Concave part 63 Diaphragm 64 Convex part 65 Depressed part 70 Bonding material 71 Adhesive 72 Spacing holding material

Claims (8)

A sensor chip (60) having a thin diaphragm (63) formed by forming a recess (62) on the back surface (61b) side of the semiconductor substrate (61) is applied to a coating region (41) on the mounted member (40). A bonding structure (70) applied to the mounting member (40) by wetting and spreading the bonding material (70) applied to the mounting member (40),
The sensor chip (60) protrudes from the back surface (61b) in a direction intersecting the back surface (61b) and surrounds the recess (62), and the back surface (61b) Having a bonding region located on the opposite side to the concave portion (62) across the convex portion (64);
The bonding material (70) includes an adhesive (71) for bonding the sensor chip (60) and the mounted member (40), and a spacing member (72) mixed in the adhesive (71). Have
The mounted member (40) has the application region (41) in a region facing the bonding region among regions facing the back surface (61b) of the sensor chip (60),
Between the sensor chip (60) and the mounted member (40), the spacing member (72) that contacts the bonding region and the mounted member (40) of the sensor chip (60). A mounting structure of a sensor chip, wherein a predetermined interval is formed.   The spacing member (72) in which the length from the back surface (61b) to the tip in the protruding direction of the convex portion (64) is in contact with the sensor chip (60) and the mounted member (40). 2. The sensor chip mounting structure according to claim 1, wherein the sensor chip mounting structure is shorter than a length in a vertical direction of the back surface (61).   The sensor chip mounting according to claim 1 or 2, wherein a recess (65) surrounding the convex portion (64) is formed on the back surface (61b) of the sensor chip (60). Construction.   The mounting structure of the sensor chip according to claim 3, wherein a wall surface constituting the hollow portion (65) and a wall surface constituting the convex portion (64) are continuous.   The sensor chip mounting structure according to any one of claims 1 to 4, wherein the spacing member (72) has a spherical shape. A sensor chip (60) having a thin diaphragm (63) formed by forming a recess (62) on the back surface (61b) side of a semiconductor substrate (61) is bonded to a mounted member (40). A sensor chip mounting method for joining via
Among the sensor chip (60), a convex part (64) projecting in the direction intersecting the back surface (61b) on the back surface (61b) and surrounding the concave part (62), and the back surface (61b) Preparing a bonding region located on the opposite side of the concave portion (62) across the convex portion (64);
As the bonding material (70), an adhesive (71) for bonding the sensor chip (60) and the mounted member (40), and a spacing member (72) mixed in the adhesive (71) Preparing a product having
A step of applying the bonding material (70) to a region facing the bonding region in a region where the sensor chip (60) is mounted in the mounted member (40);
By mounting the sensor chip (60) on the mounted member (40), the bonding material (70) is wetted and spread, and the spacing member (72) is bonded to the sensor chip (60). Bonding the sensor chip (60) to the mounted member (40) in a state of being in contact with the region and the mounted member (40).   The step of preparing the sensor chip (60) includes preparing a recess (65) surrounding the convex portion (64) on the back surface (61b). Sensor chip mounting method. In the step of preparing the bonding material (70), a spherical material is prepared as the spacing member (72),
In the step of preparing the sensor chip (60), the sensor chip (60) having a length from the back surface (61b) to the tip thereof shorter than the diameter of the spacing member (72) is prepared. 8. The sensor chip mounting method according to claim 6, wherein the sensor chip is mounted.

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