JP2012018857A - Electronic circuit unit and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a damage to a circuit component and others due to electrostatic discharge even if a ground side electrode is formed in a distant position.SOLUTION: An electronic circuit unit 3 comprises an insulating substrate 4 and a conductive cover 5 covering at least one of substrate surfaces of the insulating substrate 4. A first side electrode 11 and a second side electrode 12 are formed on the side surface of the insulating substrate 4. A leg portion 15 of the cover 5 and the first side electrode 11 are soldered together, and a protrusion 16 is formed in the cover 5 so as to face the second side electrode 12.

Description

  The present invention relates to an electronic circuit unit and an electronic apparatus including the electronic circuit unit.

  An electronic circuit unit has an electronic circuit module including a plurality of electronic components mounted on a substrate, and is easily damaged or damaged by a surge voltage or the like generated during electrostatic discharge. Conventionally, a surge voltage avoidance device that avoids this type of surge voltage is known (Patent Document 1). In this surge voltage avoidance device, two conductor patterns are arranged opposite to each other on a printed circuit board, and each conductor pattern is provided with a protruding pattern that faces each other. One of the two conductor patterns is connected to the ground. When a surge voltage is applied between two conductor patterns, it is discharged to the conductor pattern on the ground side via the protruding pattern, and it is configured to prevent failure and damage of circuit components etc. that are close to the other conductor pattern. ing.

JP 2002-319746 A

  However, in the device described in Patent Document 1, when the conductor patterns (electrodes) are formed at positions adjacent to each other, the ground side electrode can be appropriately discharged, but the two electrodes are formed at positions separated from each other. In the case where it is applied, the ground side electrode cannot be properly discharged, and there is a problem that the circuit components near the electrode are damaged or damaged.

  The present invention has been made in view of such points, and an electronic circuit unit capable of preventing damage or the like due to electrostatic discharge to a circuit component or the like even when the ground-side electrode is formed at a distant position, and An object is to provide electronic equipment.

  The electronic circuit unit of the present invention includes an insulating substrate and a conductive cover that covers at least one substrate surface of the insulating substrate, and a first side electrode and a second side surface are provided on a side surface of the insulating substrate. An electrode is formed, and the cover is formed with a leg portion to be soldered to the first side electrode and a protrusion facing the second side electrode.

  According to this configuration, since the protrusion facing the second side electrode is formed, the distance between the second side electrode and the protrusion is reduced, and corona discharge is likely to occur. Therefore, when static electricity is discharged to the second side electrode, it is appropriately discharged to the cover through the protrusions, and failure or damage of the electronic circuit components on the insulating substrate can be prevented. In addition, even when the distance between the cover and the second side electrode is widened, the cover is discharged to the cover side through the protrusions, so even if the accuracy of the mounting position of the cover on the insulating substrate is low, countermeasures against static electricity are possible. is there.

  In the electronic circuit unit, it is preferable that the protrusion is formed so as to become narrower as the second side electrode is approached.

  According to this configuration, since the tip of the protrusion close to the second side electrode is formed to be thin, corona discharge is more likely to occur, so that static electricity can be appropriately discharged to the cover side.

  In the electronic circuit unit, the first side surface electrode is formed on a surface of a first groove portion where a side surface of the insulating substrate is cut out, and the second side surface electrode is a second surface formed by cutting out a side surface of the insulating substrate. Preferably, the cover leg portion is provided at a position facing the first groove portion, and the protrusion is formed so as to face the notch portion of the second groove portion. .

  According to this configuration, since the protrusion is formed so as to face the notch portion of the second groove portion, static electricity generated in the notch portion can be appropriately discharged to the cover side.

  In the electronic circuit unit, it is preferable that a tip of the protrusion is positioned above the substrate surface of the insulating substrate.

  According to this configuration, since the tip of the protrusion is positioned above the substrate surface of the insulating substrate, it is possible to prevent the protrusion from contacting the substrate surface or the second side electrode of the insulating substrate.

  In the electronic circuit unit, the second side surface electrode can be constituted by a non-connect terminal that is not electrically connected to the electrode.

  According to this configuration, for example, when the second side electrode and the power supply electrode formed on the mother side circuit board are connected, the second side electrode Since it is possible to discharge the cover through the adjacent protrusion, it is possible to take a countermeasure against surge voltage by the power supply of the mother circuit board.

  An electronic apparatus of the present invention includes an insulating substrate, a conductive cover that covers at least one of the insulating substrates, and a mother substrate on which the insulating substrate is mounted. The insulating substrate includes the insulating substrate. A first side surface electrode is formed on the surface of the first groove part cut out from the side surface of the substrate, and a second side surface electrode is formed on the surface of the second groove part cut out from the side surface of the insulating substrate, The cover is formed with a leg portion to be soldered to the first side electrode and a projection facing the second side electrode, and the projection is directed to a notch portion of the second groove portion. And the tip of the protrusion is positioned above the substrate surface of the insulating substrate, the first electrode formed on the substrate surface of the mother substrate is soldered to the first side electrode, The second electrode formed on the mother substrate Wherein the second side surface electrodes and soldered, wherein the second side surface electrodes, wherein the solder fillet is formed to be thinner toward the projection side.

  According to this configuration, since the protrusion facing the second side electrode is formed, the distance between the second side electrode and the protrusion is reduced, and corona discharge is likely to occur. Therefore, when static electricity is discharged to the second side electrode, it is appropriately discharged to the cover through the protrusions, and failure or damage of the electronic circuit components on the insulating substrate can be prevented. Further, since the solder fillet formed on the second side electrode becomes thinner (tapered) toward the protrusion side, corona discharge is likely to occur between the solder fillet and the protrusion.

  In the electronic apparatus, it is preferable that the protrusion is formed so as to become narrower as the second side electrode is approached.

  According to this configuration, since the tip of the protrusion close to the second side electrode is formed to be thin, corona discharge is more likely to occur, so that static electricity can be appropriately discharged to the cover side.

  In the electronic apparatus, the first electrode can be a ground electrode.

  According to this configuration, the static electricity discharged to the cover through the protrusion can be discharged to the ground through the first side electrode and the first electrode.

  In the above electronic device, the second electrode may be connected to a power source.

  According to this configuration, the surge current that has entered the power source can be discharged from the second electrode to the cover side via the second side electrode and the protrusion.

  According to the present invention, even when the ground-side electrode is formed at a distant position, it is possible to prevent damage to circuit components and the like due to electrostatic discharge.

It is the perspective view which showed the structure of the electronic device provided with the electronic circuit unit which concerns on embodiment of this invention. It is the bottom view and side view of an electronic circuit unit concerning this embodiment. It is the partial side view which showed typically the side electrode vicinity of the electronic circuit unit which concerns on this Embodiment.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The electronic circuit unit according to the present embodiment can be applied to an electronic device such as a wireless communication device. For example, a conductive material that covers static electricity generated during an ESD (Electro-Static Discharge) test or the like covers the substrate surface. The cover is discharged to prevent discharge to circuit components on the substrate.

  FIG. 1 is a perspective view showing a configuration of an electronic apparatus including an electronic circuit unit according to an embodiment of the present invention. 2A is a bottom view of the electronic circuit unit according to the present embodiment, and FIG. 2B is a side view of the electronic circuit unit.

  As shown in FIG. 1, the electronic device 1 includes a mother-side circuit board (mother board) 2 and an electronic circuit unit 3 provided on the circuit board 2. The electronic circuit unit 3 includes an insulating substrate 4 provided on the circuit substrate 2 and a cover 5 that covers one main surface of the insulating substrate 4.

  The circuit board 2 is formed in a substantially rectangular shape in plan view, and a ground pattern (ground electrode) 6 and a wiring pattern 7 are formed on the main surface. The wiring pattern 7 is connected to a power source (not shown). The ground electrode 6 is bonded to a first side electrode 11 formed on the insulating substrate 4 described later by solder S, and the wiring pattern 7 is bonded to the second side electrode 12 formed on the insulating substrate 4 by solder S. The

  As shown in FIG. 2A, the insulating substrate 4 is formed in a rectangular shape in plan view, and a plurality of electronic circuit components 8 are mounted on the facing surface facing the cover 5. Three grooves 9 and 10 are formed on the long side surface of the insulating substrate 4, and one groove 10 is formed on each short side surface. Each of the groove portions 9 and 10 is cut out in a substantially semicircular shape in plan view, and side electrodes 11 and 12 are formed so as to cover the surface of the cutout portion. In the present embodiment, the first side electrodes 11 and 11 are formed on the surfaces of the two groove portions 9 and 9 formed at both end portions of the side surface on the long side of the insulating substrate 4, respectively, and are formed at the middle portion of the side surface. A second side surface electrode 12 is formed on the surface of the groove portion 10 formed. A second side surface electrode 12 is formed in the groove portion 10 formed in the intermediate portion on the short side of the insulating substrate 4. Note that the number and shape of the groove portions 9 and 10 and the side surface electrodes 11 and 12 formed in the groove portions 9 and 10 are not limited to the above configuration, and may depend on the configuration of the electronic device 1 on which the electronic circuit unit 3 is mounted. Any number and shape can be used.

  The first side surface electrode 11 is bonded to a leg portion 15 of the cover 5 described later by solder S, and is also bonded to the ground pattern 6 formed on the mother-side circuit board 2 by solder S. That is, the first side electrode 11 functions as a ground electrode. Thereby, the static electricity discharged to the cover 5 side through the protrusion 16 is discharged to the ground via the leg portion 15, the first side surface electrode 11, and the ground electrode 6.

  The second side surface electrode 12 is a non-connection (NC) terminal that is not electrically connected to other electrodes, and can be used by connecting to other electrodes in the future. Above the second side electrode 12, a protrusion 16 formed on the cover 5 described later is disposed. When a voltage is applied to the second side electrode 12 by electrostatic discharge, the protrusion 16 is It is comprised so that it may discharge to the cover 5 via. Further, the second side electrode 12 is joined to the wiring pattern 7 formed on the circuit board 2 by solder S (FIG. 3). At this time, since the solder fillet is formed on the surface of the second side electrode 12 so as to become thinner (tapered) toward the protrusion 16, corona discharge is likely to occur between the solder fillet and the protrusion 16. .

  The cover 5 is formed in a substantially box shape by bending a conductive member toward the insulating substrate 4, and has a substantially rectangular top plate 13 in plan view and a bent portion 14 connected to each long side portion of the top plate 13. , 14 are integrally formed. The top plate 13 is formed to have substantially the same size as the substrate surface so as to cover the electronic circuit components of the insulating substrate 4. Leg portions 15 and 15 projecting toward the insulating substrate 4 are formed at both ends of each bent portion 14, and a protrusion 16 projecting toward the insulating substrate 4 is formed between the leg portions 15 and 15. .

  Each leg portion 15 is formed at a position facing the groove portion 9 of the insulating substrate 4 in the bent portion 14, inserted into a notch portion of the groove portion 9, and joined to the first side electrode 11 by solder S. As a result, the cover 5 is fixed to the insulating substrate 4.

  The protrusion 16 is formed at a position facing the notch portion of the groove portion 9 in the bent portion 14 so as to face the notch portion. The tip of the protrusion 16 is formed so as to be positioned above the substrate surface of the insulating substrate 4 (FIGS. 2B and 3). Thereby, it is possible to prevent the protrusion 16 from contacting the substrate surface of the insulating substrate 4 or the second side surface electrode 12 and to appropriately discharge the static electricity generated in the notched portion of the groove 9 to the cover 5 side. Further, the tip of the protrusion 16 is formed so as to become thinner as it approaches the second side electrode 12. Thereby, since corona discharge is more likely to occur, static electricity can be appropriately discharged to the cover 5 side.

  In the electronic device 1 configured as described above, when static electricity is discharged to the second side electrode 12, corona discharge is generated between the second side electrode 12 and the protrusion 16, and the cover is interposed through the protrusion 16. Static electricity is discharged on the 5 side. Therefore, even when the electronic circuit component 8 is arranged at a position close to the second side electrode 12 on the insulating substrate 4, damage to the electronic circuit component 8 and the like are prevented. The static electricity discharged to the cover 5 side is discharged to the ground via the leg 15, the first side electrode 11, and the ground pattern 6. Further, a surge current mixed in the power supply of the circuit board 2 on the mother side is also discharged to the cover 5 side through the wiring pattern 7, the second side surface electrode 12, and the protrusion 16.

  As described above, according to the present embodiment, since the protrusion 16 facing the second side electrode 12 is formed, the distance between the second side electrode 12 and the protrusion 16 is reduced, and corona discharge occurs. It becomes easy. Therefore, when static electricity is discharged to the second side electrode 12, it is appropriately discharged to the cover 5 through the protrusions 16, and the electronic circuit component 8 is positioned in the vicinity of the second side electrode 12 on the insulating substrate 4. Even when the electronic circuit component 8 is mounted, failure and damage of the electronic circuit component 8 can be prevented. Even when the gap between the cover 5 and the second side electrode 12 is widened, the cover 5 is discharged to the cover 5 side via the protrusions 16, so the accuracy of the mounting position of the cover 5 on the insulating substrate 4 is low. Can also take measures against static electricity. Further, since the second side surface electrode 12 and the wiring pattern (power supply electrode) 7 formed on the mother circuit board 2 are connected, the second side surface can be provided without providing a dedicated component for surge voltage. It is possible to discharge to the cover 5 through the protrusion 16 adjacent to the electrode 12, and a surge voltage countermeasure by the power source of the mother side circuit board 2 is also possible.

  The present invention is useful as an electronic circuit unit used in an electronic device such as a wireless communication device.

1 Electronic equipment 2 Circuit board (mother board)
3 Electronic circuit unit 4 Insulating substrate 5 Cover 6 Ground pattern (first electrode)
7 Wiring pattern (second electrode)
8 Electronic circuit parts 9 Groove (first groove)
10 Groove (second groove)
DESCRIPTION OF SYMBOLS 11 1st side electrode 12 2nd side electrode 13 Top plate 14 Bending part 15 Leg part 16 Protrusion S Solder

Claims (9)

An insulating substrate;
A conductive cover covering at least one substrate surface of the insulating substrate,
A first side electrode and a second side electrode are formed on the side surface of the insulating substrate,
The electronic circuit unit according to claim 1, wherein the cover is formed with a leg portion soldered to the first side electrode and a protrusion facing the second side electrode.   2. The electronic circuit unit according to claim 1, wherein the protrusion is formed so as to become thinner as approaching the second side electrode. 3. The first side electrode is formed on a surface of a first groove part in which a side surface of the insulating substrate is cut away,
The second side surface electrode is formed on the surface of the second groove part obtained by cutting out the side surface of the insulating substrate,
The leg part of the said cover is provided in the position facing the said 1st groove part, The said protrusion is formed so that it may go to the notch part of the said 2nd groove part, The Claim 1 or Claim characterized by the above-mentioned. 3. An electronic circuit unit according to 2.   The electronic circuit unit according to claim 3, wherein a tip of the protrusion is positioned above the substrate surface of the insulating substrate.   5. The electronic circuit unit according to claim 1, wherein the second side surface electrode is a non-connect terminal that is not electrically connected to the electrode. An insulating substrate;
A conductive cover covering at least one substrate surface of the insulating substrate;
A mother board on which the insulating board is mounted,
In the insulating substrate, a first side electrode is formed on the surface of the first groove part where the side surface of the insulating substrate is cut out, and a second side electrode is formed on the surface of the second groove part where the side surface of the insulating substrate is cut out. Side electrodes are formed,
The cover is formed with a leg portion to be soldered to the first side electrode and a protrusion facing the second side electrode,
The protrusion is formed so as to be directed toward the cutout portion of the second groove, and the tip of the protrusion is positioned above the substrate surface of the insulating substrate,
The first electrode formed on the substrate surface of the mother substrate is soldered to the first side electrode,
The second electrode formed on the mother substrate on the substrate surface is soldered to the second side electrode,
An electronic apparatus, wherein a solder fillet is formed on the second side electrode so as to become thinner toward the protrusion side.   The electronic apparatus according to claim 6, wherein the protrusion is formed so as to become thinner as the second side electrode is approached.   The electronic device according to claim 6, wherein the first electrode is a ground electrode.   The electronic device according to claim 6, wherein the second electrode is connected to a power source.

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