JP2012018617A - Recording method of program execution history information in electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a recording method of program execution history information in an electronic component mounting apparatus capable of ensuring content of data necessary and sufficient for a required analysis purpose while reducing the data amount of log information as small as possible so as to transmit the log information to a manufacturer of the apparatus from a customer through an ordinary mail service when a problem occurs on the apparatus.SOLUTION: In an operation control process of an electronic component mounting apparatus by an operation control section 21, a log record processing section 24 continuously stores execution history information output from a processing section 22, while associating it with time information, in a ring buffer memory 28. When storing the temporally recorded information in a storing log file 29, the execution history information and the time information written in the ring buffer memory 28 is written in the log file 29 at a timing when a certain event has occurred using an alarm signal which is output from a data output section 23 when the event has occurred as a trigger signal.

Description

  The present invention relates to a program execution history information recording method for recording an execution history of a control program in an electronic component mounting apparatus used for mounting electronic components on a board.

  In the component mounting field in which electronic components are mounted on a substrate, the electronic component mounting device includes various electronic component mounting devices such as a die bonding device that takes a semiconductor chip from a wafer and mounts it on the substrate. The operation and processing of each part of these devices are performed by a computer, which is a control device included in each device, executing various control programs. In the program execution process, a signal having a predetermined content is output as execution history information indicating the program execution history. Then, by recording this execution history information in a predetermined format, it is used as analysis data when an abnormality occurs (for example, Patent Document 1). In the example shown in this patent document, the identification codes of the modules and functions constituting the control program are stored in time series according to the execution order. By storing the execution history information in this way, when a trouble occurs, the customer (device user) can send a record of the execution history information to the device manufacturer to request analysis, thereby facilitating problem solving. There is an advantage that you can.

JP 2001-92691 A

  In recent years, the amount of data required to record sequence log data indicating the program execution history has increased significantly due to the complexity of control content accompanying the advancement of functions in electronic component mounting equipment and the demand for sophisticated production management and quality control. It tends to increase. In the prior art including the above-described prior art, since all the execution history information output in the program execution process is recorded in time series, the data amount of log information to be recorded is Become enormous.

  However, the storage capacity allowed for the device is limited. Also, when trouble occurs in the device and the customer requests the device manufacturer to analyze all log information that is the program execution history, the log information data is enormous, so it is normal for the customer to send log information to the device manufacturer. The mail service via this line could not cope, and it was necessary to prepare a high-speed communication line and a large capacity data storage area (server) separately. For this reason, the customer cannot immediately send the log information data to the device manufacturer, and there is a problem that the troubleshooting is delayed. Furthermore, in the prior art, the relationship between individual log information and time is not necessarily clarified, and it is difficult to accurately grasp the relationship between recorded events and actual events such as abnormal operation. there were.

  Therefore, the present invention is necessary for an analysis purpose that is required while reducing the data amount of log information as much as possible so that the log information can be transmitted from the customer to the device manufacturer by a normal mail service when a trouble occurs in the device. It is an object of the present invention to provide a method for recording program execution history information in an electronic component mounting apparatus capable of ensuring sufficient data contents.

  The recording method of the program execution history information in the electronic component mounting apparatus of the present invention is a recording method of the program execution history information for recording the execution history information of the control program in the electronic component mounting apparatus. An information acquisition step for acquiring execution history information indicating the execution history of a control program executed by the control unit in order to execute a predetermined work operation and arithmetic processing in time, and the acquired execution history information as time information Buffer buffer writing step for continuously writing to the ring buffer memory in association with the log buffer writing step, the log file writing step for writing the execution history information and time information written in the ring buffer memory to a log file for recording, and the log file writing Event occurrence indicating the occurrence of a pre-specified event in the process Writes the execution history information and the time information written to the ring buffer memory at a timing when the event has occurred as a trigger signal to a log file items.

  According to the present invention, in the log file writing step of continuously writing the acquired execution history information in the ring buffer memory in association with the time information, and writing the written execution history information and time information in the log file for recording, By adopting a method of writing the execution history information and time information written in the ring buffer memory at the timing when the event has occurred using an event occurrence signal indicating the occurrence of a specified event as a trigger signal to the log file, In order to send log information from customers to the equipment manufacturer via a normal mail service when trouble occurs in the equipment, the data content necessary and sufficient for the analysis purpose required while reducing the data volume of the log information as much as possible. Can be secured.

The front view of the electronic component mounting apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the apparatus for electronic component mounting of one embodiment of this invention Structure explanatory drawing of the log data which becomes the object of the recording method of the program execution history information of one embodiment of this invention Explanatory drawing of traceability data output from the electronic component mounting apparatus of one embodiment of the present invention Structure explanatory drawing of the ring buffer memory used for the recording method of the program execution history information of one embodiment of this invention The flowchart which shows the ring bach memory write processing in the recording method of the program execution history information of one embodiment of this invention Explanatory drawing of the ring Bach memory writing process in the program execution history information recording method of the embodiment of the present invention Explanatory drawing of the preservation | save process to the log file in the recording method of the program execution history information of one embodiment of this invention Explanatory drawing of the preservation | save process to the log file in the recording method of the program execution history information of one embodiment of this invention The flowchart which shows the recording method of the program execution history information of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the configuration of a die bonding apparatus 1 as an electronic component mounting apparatus to which the present invention is applied will be described. The die bonding apparatus 1 has a function of mounting an electronic component such as a semiconductor chip on a substrate by bonding.

  In FIG. 1, a component supply stage 3, a unit assembly stage 4, and a substrate holding stage 10 are arranged on the base 2 with their arrangement directions aligned with the Y direction. The component supply stage 3 holds a semiconductor wafer 6 on which a plurality of semiconductor chips 6a (hereinafter abbreviated as “chips 6a”) are arranged. The unit assembly stage 4 has a configuration in which functional units such as a mounting stage 7 and a component recognition camera 9 are collectively disposed on a moving table that reciprocates in the X direction by an X-axis moving mechanism 8. The chip 6 a taken out by the pickup head 5 in the component supply stage 3 is placed on the placement stage 7. The substrate holding stage 10 is configured to horizontally drive a substrate holding table 10a that holds the substrate 11 by an XY table mechanism.

  A first head 13 and a second head 14 that are moved in the Y direction by a head moving mechanism 12 are disposed above the substrate holding stage 10. The first head 13 and the second head 14 each have a mounting head 15. A resin coating head 16 is mounted. The chip 6a placed on the placement stage 7 is bonded to the substrate 11 held on the substrate holding table 10a by the mounting head 15, and prior to this bonding operation, the resin application head 16 applies the adhesive to the substrate 11. Is executed.

  The pick-up head 5 picks up the chip 6a from the component supply stage 3, the pick-up head 15 picks up the chip 6a from the mounting stage 7, and the mounting head 15 bonds the chip 6a to the substrate 11 at what time. A first camera 17, a second camera 18, and a third camera 19 are provided, respectively. By recognizing the images acquired by the first camera 17, the second camera 18, and the third camera 19, the pickup operation of the chip 6 a from the semiconductor wafer 6, the positional deviation detection of the chip 6 a on the mounting stage 7, and the substrate 11 Whether the bonding operation is correct or not can be determined.

  An outline of work operation by the die bonding apparatus 1 will be described. When the semiconductor wafer 6 is newly set on the component supply stage 3 and the substrate 11 is loaded on the substrate holding stage 10, the ID codes of the semiconductor wafer 6 and the substrate 11 are read, and the correctness is confirmed in the host computer. After confirmation, the bonding operation is started. That is, the operation of picking up the chip 6a from the semiconductor wafer 6 and bonding it to the substrate 11 is repeatedly executed by the number of bondings for one substrate.

  When the substrate is unloaded after the bonding operation is completed, traceability data 33 (see FIG. 4) indicating the work operation history for the substrate is output. If an error such as a bonding error is detected in the traceability data, an alarm signal notifying that is output and the apparatus stops. In the present embodiment, along with this, the execution history information of the control program in the operation control of each part of the die bonding apparatus 1 is written and stored in the log file using this alarm signal as a trigger.

  Hereinafter, a configuration of a control system for executing the above-described control program execution history information recording process in the die bonding apparatus 1 will be described. In FIG. 2, in addition to the function of controlling each part of the die bonding apparatus 1 to execute the bonding work operation, the control apparatus 20 creates traceability data for each substrate 11 as a product and operates the die bonding apparatus 1. Has a function of recording and storing the execution history information of the control program in a log file.

  The control device 20 includes a work control unit 21, a log recording processing unit 24, a log control unit 25, a log storage processing unit 26 and a storage unit 27. The work control unit 21 includes a processing unit 22 and a data output unit 23, and executes the following processing based on an operation command input from the operation input unit 30. The processing unit 22 performs control processes necessary for executing the bonding operation, that is, control processes necessary for executing the pickup process 22a, the substrate transport process 22b, the adhesive application process 22c, the bonding process 22d, and the recognition process 22e. Do. Further, the processing unit 22 executes in a time-series manner the execution history of the control program executed by the processing unit 22 (control unit) in order to execute predetermined work operation and arithmetic processing by each unit in the execution process of the control process. It has a function of outputting history information as storage data.

  That is, as shown in FIG. 3, the log data 32 that is execution history information includes time information 32 a that specifies the year, month, day, hour, minute, and second when individual logs are output, and a log that indicates the contents of the log output at that time The output contents 32b are associated with each other. These pieces of execution history information are temporarily recorded in the ring buffer memory 28 of the storage unit 27 and further written in the log file 29 for storage as necessary. Then, the execution history information stored in the log file 29 is output to the external device by the output unit 31, and further transmitted as failure analysis data to the device manufacturer using a transmission means such as an e-mail if necessary. Is done.

  The pickup process 22a is a process of picking up the chip 6a by the pickup head 5 in the component supply stage 3, and the substrate transfer process 22b carries the substrate 11 into the substrate holding table 10a and carries it out of the substrate holding table 10a. It is processing to do. The adhesive application process 22c is a process of applying a resin adhesive for chip bonding to the substrate 11 by the resin application head 16, and the bonding process 22d is bonding the chip 6a by the mounting head 15 to the substrate 11 after the adhesive application. It is processing. The recognition process 22e is a process for detecting the presence / absence of the chip 6a, a positional deviation, and the like by performing a recognition process on images acquired by the first camera 17, the second camera 18, and the third camera 19.

  The data output unit 23 is configured to output an alarm signal that is notified when a countermeasure is required from a signal or information acquired in the process in which the processing unit 22 controls each unit of the die bonding apparatus 1, or for production management / quality control. It has a function to output data such as traceability data stored as reference data for the purpose. Here, an example of the traceability data 33 output for each substrate 11 in the die bonding apparatus 1 will be described with reference to FIG. In the example shown here, for each unit bonding operation, the wafer ID 33e for specifying the semiconductor wafer 6 to be picked up, the position coordinates at which the individual chip 6a is picked up in the semiconductor wafer 6 and the type of nozzle used are specified. In-wafer coordinates 33c, nozzle type 33d, position coordinates where the chip 6a is bonded to the substrate 11 by the bonding operation, and in-substrate coordinates 33a and nozzle type 33b for specifying the type of nozzle used are recorded as traceability data.

  In one bonding operation, when the pickup or bonding of the chip 6a is not normally executed due to an abnormal operation, 0 is written in each column of the traceability data, and an alarm indicating the fact by the data output unit 23. A signal is output. In addition, although the example of the operation | movement error in bonding operation was shown as a target example of an alarm signal here, if it is an event which should be related with a program execution history at the time of work operation and arithmetic processing in the target electronic component mounting apparatus, It can be appropriately defined as the target of the alarm signal.

  The log recording processing unit 24 continuously writes the execution history information acquired and output by the processing unit 22 in the ring buffer memory 28 in association with time information specifying the time at which each individual control processing step is executed. Process. That is, as shown in FIG. 5, a plurality of write areas (write lines) 1 to n specified by the number of the address 28a are set in the ring buffer memory 28, and log data is stored in each write line. The log information 28b having the contents corresponding to the log output contents 32b in 32 is written. Then, the write date 28c corresponding to the time information 32a in the log data 32 is written in the head area whose address 28a is number 1. Here, the write area size of the ring buffer memory 28 is variable as needed by controlling the log recording processing unit 24 by the log control unit 25 described below. In this embodiment, the write area size becomes a write target. The address number n for specifying the tail area is changed according to the execution contents of the control program.

  The log storage processing unit 26 performs processing for storing the log data temporarily recorded in the ring buffer memory 28 in the log file 29. As a result, the log data output from the ring buffer memory 28 is stored in the log file 29. Log recording processing by the log recording processing unit 24 and log storage processing by the log storage processing unit 26 are controlled by the log control unit 25 based on an operation command input from the operation input unit 30. That is, when the log control unit 25 performs the storage time setting 25a, a set time serving as a standard time for writing to the ring buffer memory 28 by the log recording processing unit 24 is determined, and the log recording processing unit 24 is instructed. The Further, when the log control unit 25 performs the output operation 25b, the log data output operation from the ring buffer memory 28 to the log file 29 is performed.

  Further, by performing the output mode switching 25c, the output mode of the log data output from the ring buffer memory 28 and written in the log file 29 can be switched by selecting one of the two types described below. . In one of the output modes, log data is written to the log file 29 using the alarm signal output from the data output unit 23 as a trigger signal. Here, as an example of the alarm signal, the example of the operation abnormality in the bonding operation shown in FIG. 4 is shown, but if it is an event occurrence signal indicating the occurrence of an event specified in advance in the work control of the component mounting apparatus, This corresponds to the alarm signal in the present embodiment.

  Next, the ring buffer memory writing process will be described with reference to FIGS. In FIG. 6, the log output from the processing unit 22 is first written in the head area of the ring buffer memory 28 together with time information (ST1). That is, as shown in FIG. 7, the address 28a (1) and the write date / time 28c (t1) corresponding to the log information 28b (aaaa...) Are assigned to the head area, that is, the write line with the address 28a number 1. Write. Similarly, the log output from the processing unit 22 is sequentially written to the subsequent write lines in the ring buffer memory 28 (ST2). Then, in this writing process, it is determined whether or not the write target has reached the last area, that is, the write row with address 28a number n (ST3).

  Here, if it has not yet reached, the process returns to (ST2) and similarly writes to the ring buffer memory 28, and writes to the last area in (ST3). If it is confirmed that the tail area has been reached, the process returns to the head area again (see the broken line arrow), continues writing log information to the subsequent write line, and at that time t2 and address A time difference (t2−t1) from the time t1 at which writing is started in the head area whose number 28a is 1 is obtained (ST4).

Next, the memory area size of the ring buffer memory 28 is changed based on the obtained time difference (t2−t1) and a preset set time T (ST5). The memory area size is changed by changing n defining the address of the last area number to a new n * by the following formula. That is, in the present embodiment, the numerical value n * that defines the memory area size after the change is expressed by the following equation: n * = n × T / (t2−t1) (Equation 1)
It is made to calculate by. The change of the memory area size according to (Equation 1) has the following technical significance. That is, in the control of each part of the component mounting apparatus, the number of steps output increases or decreases from the processing unit 22 because the control density varies depending on the work operation to be performed and the content of the arithmetic processing, and the number of steps increases or decreases. Is different.

  For this reason, when the memory area size of the ring buffer memory 28 is fixed, the time required for data recording is shortened when work or processing requiring complicated control is being executed, and work or processing that is easy to control. When is being executed, the data recording target time becomes longer. As a result, there are cases where the usefulness as analysis data to be referred to for elucidation of the cause when an abnormality occurs, which is the main purpose of the program execution history information, is not guaranteed.

  On the other hand, in the write processing to the ring buffer memory 28 shown in the present embodiment, in order to collect analysis data for each work operation of one cycle according to the work operation to be executed and the contents of the arithmetic processing. A recording time which is considered to be necessary and sufficient is determined and input as a set time T from the operation input unit 30 in advance, and the log control unit 25 dynamically sets the memory area size of the ring buffer memory 28 based on the set time T. change. Here, the set time T is not uniformly fixed, but is appropriately determined according to the work operation to be executed and the control content of the arithmetic processing.

  Next, output mode switching performed by the log control unit 25 executing the output mode switching 25c will be described with reference to FIGS. In the present embodiment, when the log data recorded in the ring buffer memory 28 is stored in the log file 29, two different output modes are set in advance. These output modes can be switched as required by an operation input from the operation input unit 30.

  First, FIG. 8 shows an example of the total amount storage mode used when all log data output from the processing unit 22 is recorded and stored. This total amount storage mode is selected when it is necessary to store all program execution history information output from the processing unit 22 in the operating state of the die bonding apparatus 1. In FIG. 8, m at address 28a indicates the write line where the last log write was performed at that time, and in the log saving process, the log data after the write line m + 1 after the write line m is the log file. It is transferred to 29 and saved. That is, after the log data in the range indicated by the arrow (A) is transferred, the log data from the write line 1 to the final write line m indicated by the arrow (B) is transferred to the log file 29 and stored.

  Thereby, the log information temporarily recorded in the ring buffer memory 28 at that time is rearranged in time series by one log storage process, and the log indicating a set of log information in one unit control process It is stored in the log file 29 as data LD. Each time the log saving process is repeatedly executed, the individual log information temporarily recorded in the ring buffer memory 28 is sequentially stored in the log file 29 as the second log data LD2, the third log data LD3,. All the log data stored and output from the processing unit 22 are saved in a time-series continuous form without being omitted.

  Next, referring to FIG. 9, the sampling data used when the log data output from the processing unit 22 is sampled and stored using the alarm signal output from the data output unit 23 as a trigger signal is stored. An example of the mode will be described. This sampling / save mode is saved due to restrictions on data capacity, such as e-mail used to send program execution history information from the device user to the device manufacturer when requesting the cause of the abnormal operation. This is selected when it is necessary to minimize the amount of data to be stored. That is, the program execution history information output from the processing unit 22 is stored only when an operation abnormality caused by a factor such as a malfunction of the control program is detected and output as an alarm signal in the operating state of the die bonding apparatus 1. It is a thing.

  In FIG. 9, a at address 28a is a write line in which log information corresponding to the time (timing) ta at which the output of the alarm signal from the data output unit 23 is detected is written. As described above, the alarm signal is a signal for informing that the occurrence of an event specified as an event to be associated with the program execution history is detected during a work operation or arithmetic processing in the target electronic component mounting apparatus. In this sampling / save mode, log information belonging to a time range retroactive by a preset retroactive time Ta (predetermined time) from time ta is stored using this alarm signal as a trigger signal.

  Here, the retroactive time Ta is determined empirically from the viewpoint of securing an amount of information considered necessary and sufficient for cause analysis according to the contents of the malfunction such as an operation abnormality indicated by the alarm signal. Of course, the retroactive time Ta may not be set, and all log information recorded in the ring buffer memory 28 at that time may be saved, but the amount of information saved for the purpose of failure analysis is minimized. When it is necessary to reduce the time, it is desirable to appropriately set the retroactive time Ta.

  That is, when the log storage processing unit 26 receives an alarm signal output from the data output unit 23, the log storage processing unit 26 collects log data LD in which log information in the range of the retroactive time Ta is collected in time series. , Transfer to log file 29 and save. Thereafter, log information is continuously written to the ring buffer memory 28, but log data is not stored in the log file 29 until the alarm signal is output again from the data output unit 23. I will not. Thereafter, when the alarm signal is output again at time tb, the log file 29 similarly stores log data LD corresponding to the retroactive time Ta.

  Next, the program execution history information recording process by the configuration of the control device 20 will be described with reference to FIG. In FIG. 10, first, execution history information indicating the execution history of the control program is acquired (information acquisition step) (ST11). Next, the execution history information is associated with the time information and written to the ring buffer memory 28 (ring buffer memory writing step) (ST12). In the process of repeating this writing, the output of the alarm signal from the data output unit 23 is monitored (ST13).

  If no alarm signal is output, the process returns to (ST12) to write to the next writing line (log file writing step). If an alarm signal is output in (ST13), the log information 28b written in the ring buffer memory 28 at this timing as described with reference to FIG. 9 using this alarm signal as a trigger signal. The (execution history information) and the writing date and time 28c (time information) are written and stored in the log file 29 (log file writing step) (ST14).

  In this log file writing step, log information 28b written in the ring buffer memory 28 at the timing when the event occurs, using an alarm signal, which is an event occurrence signal indicating the occurrence of an event specified in advance, as a trigger signal; The write date and time 28c is written in the log file 29. Further, in the log file writing step, the retroactive time Ta (predetermined time) from the timing ta at which the event occurs, out of the log information 28b and the write date 28c written in the ring buffer memory 28 at the timing ta at which the event has occurred. Only the retroactive part is written in the log file 29.

  In the process of repeatedly writing log information to the ring buffer memory 28 as described above, every time the head returns from the tail area of the ring buffer memory 28 to the head area, the ring buffer memory 28 is operated according to the example shown in FIG. The address number n indicating the rearmost area of is updated. As a result, the larger the number of pieces of information per unit time output from the processing unit 22, the larger the memory area size of the ring buffer memory 28 is set. That is, here, the memory area size of the ring buffer memory 28 is changed in accordance with the operation of the target electronic component mounting apparatus and the control contents in the arithmetic processing (ST15).

  As described above, the program execution history information recording method in the electronic component mounting apparatus shown in the present embodiment is temporarily recorded in the ring buffer memory 28 in association with the acquired execution history information. In the log file writing step of writing execution history information and time information to a log file for recording and saving, an alarm signal indicating the occurrence of an event specified in advance is recorded as a trigger signal in the ring buffer memory 28 at the timing when the event occurs. The executed execution history information and time information are stored in the log file 29.

  Thereby, the information memorize | stored in the log file 29 can be limited only to the thing about the log information acquired in the specific time slot | zone relevant to the generation | occurrence | production time of a specific event. Therefore, it is possible to secure the data content necessary and sufficient for the analysis purpose required while reducing the data amount of the log information as much as possible. Therefore, even if trouble such as abnormal operation occurs in the electronic component mounting device and log information needs to be sent from the customer to the device manufacturer for analysis of the cause of the trouble, a large-capacity dedicated communication line is required. It can be sent by a normal e-mail service without need.

  The recording method of the program execution history information in the electronic component mounting apparatus of the present invention is such that when a trouble occurs in the apparatus, the log information can be transmitted from the customer to the apparatus manufacturer by a normal mail service. It has a feature that data contents necessary and sufficient for analysis purposes required while reducing the data amount as much as possible can be secured, and is useful in the field of mounting electronic components such as die bonding apparatuses.

DESCRIPTION OF SYMBOLS 1 Die bonding apparatus 6 Semiconductor wafer 6a Chip 11 Substrate T Set time Ta Retroactive time (predetermined time)
LD log data

Claims (3)

A method of recording program execution history information for recording control program execution history information in an electronic component mounting apparatus,
An information acquisition step of acquiring execution history information indicating in a time series the execution history of a control program executed by the control unit in order to execute a predetermined work operation and arithmetic processing in the electronic component mounting apparatus;
A ring buffer memory writing step of continuously writing the acquired execution history information in association with time information into the ring buffer memory;
A log file writing step of writing execution history information and time information written in the ring buffer memory to a log file for recording;
In the log file writing step, an event occurrence signal indicating the occurrence of a specified event is used as a trigger signal, and the execution history information and time information written in the ring buffer memory at the timing when the event occurs are stored in the log file. A method for recording program execution history information in an electronic component mounting apparatus, wherein:   2. The program execution in the electronic component mounting apparatus according to claim 1, wherein the memory area size of the ring buffer memory is changed in accordance with a work operation of the target electronic component mounting apparatus and a control content in arithmetic processing. How to record history information.   In the log file writing step, only the portion of the execution history information and time information written in the ring buffer memory at the timing when the event occurs, retroactive for a predetermined time from the timing when the event occurred is stored in the log file. 3. The method for recording program execution history information in the electronic component mounting apparatus according to claim 2, wherein the writing is performed.

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