JP2012009886A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2012009886A
JP2012009886A JP2011183773A JP2011183773A JP2012009886A JP 2012009886 A JP2012009886 A JP 2012009886A JP 2011183773 A JP2011183773 A JP 2011183773A JP 2011183773 A JP2011183773 A JP 2011183773A JP 2012009886 A JP2012009886 A JP 2012009886A
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light emitting
emitting device
light
sealing body
insulating substrate
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JP5730711B2 (en
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Masahiro Konishi
正宏 小西
Makoto Egatani
誠 英賀谷
Toshio Hata
俊雄 幡
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Sharp Corp
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device that achieves sufficient electric insulation and is inexpensively manufactured through easy manufacturing processes.SOLUTION: In a light emitting device 1 which has a emitting light part 2, a region surrounding the light emitting part on an insulating substrate 3 with a high thermal conductivity, and a positive electrode external connection land 12 and a negative electrode external connection land 13 provided on the insulating substrate in the region surrounding the light emitting part, a plurality of wiring patterns is directly formed on the insulating substrate, the wiring patterns comprises a wiring pattern for anode electrically connected to the positive electrode external connection land and a wiring pattern for cathode electrically connected to the negative electrode external connection land. In the light emitting part, a plurality of semiconductor light emitting element is adhered to the insulating substrate, and are sealed by a sealing body, the semiconductor light emitting is a semiconductor LED chip, and the positive electrode external connection land and the negative electrode external connection land are provided opposite each other so as to interleave the light emitting part.

Description

本発明は、発光装置に関する。   The present invention relates to a light emitting device.

近年、照明装置の光源としてＬＥＤが多く用いられるようになってきている。ＬＥＤを使った照明装置の白色光を得る方法として、赤色ＬＥＤ、青色ＬＥＤおよび緑色ＬＥＤの三種類のＬＥＤを用いる方法、青色ＬＥＤから発した励起光を変換して黄色光を発する蛍光体を用いる方法などがある。照明用光源としては、十分な輝度の白色光が要求されているために、ＬＥＤチップを複数個用いた照明装置が商品化されている。   In recent years, many LEDs have been used as light sources for lighting devices. As a method for obtaining white light of an illumination device using LEDs, a method using three types of LEDs, a red LED, a blue LED, and a green LED, and a phosphor that emits yellow light by converting excitation light emitted from the blue LED is used. There are methods. As a light source for illumination, white light with sufficient luminance is required, and lighting devices using a plurality of LED chips have been commercialized.

このような照明装置の一例として、たとえば特開２００３−１５２２２５号公報（特許文献１）には、図１４に模式的に示すような発光装置１０１が開示されている。図１４に示す発光装置１０１は、アルミニウムで形成された金属板１０２上に凹状の素子格納部１０３が設けられるとともに、素子格納部間には、絶縁性のガラスエポキシ基板であって、その上に銅箔で形成された配線部１０５が設けられたプリント回路基板１０４が形成されてなる。そして、図１４に示す例では、素子格納部１０３に載置（配置）された発光素子１０６と、前記プリント回路基板１０４上の配線部１０５とが、ボンディングワイヤ１０７を介して電気的に接続されてなる。さらに、この素子格納部１０３を、発光素子１０６およびボンディングワイヤ１０７ごと覆うようにして、樹脂封止体１０８にて封止されて構成される。特許文献１には、このような構成を備えることによって、放熱性を向上でき、かつ、発光ダイオードチップからの光を効率良く外部へ取り出すことができる発光装置を提供できると記載されている。   As an example of such an illuminating device, for example, Japanese Patent Laying-Open No. 2003-152225 (Patent Document 1) discloses a light emitting device 101 as schematically shown in FIG. The light emitting device 101 shown in FIG. 14 is provided with a concave element storage portion 103 on a metal plate 102 made of aluminum, and an insulating glass epoxy substrate between the element storage portions. A printed circuit board 104 provided with a wiring portion 105 formed of copper foil is formed. In the example shown in FIG. 14, the light emitting element 106 placed (arranged) in the element storage portion 103 and the wiring portion 105 on the printed circuit board 104 are electrically connected via a bonding wire 107. It becomes. Further, the element storage portion 103 is configured to be sealed with a resin sealing body 108 so as to cover the light emitting element 106 and the bonding wire 107 together. Patent Document 1 describes that by providing such a configuration, it is possible to provide a light-emitting device that can improve heat dissipation and can efficiently extract light from a light-emitting diode chip to the outside.

しかしながら、図１４に示すような発光装置１０１では、アルミニウムで形成された金属板１０２の直近に、銅箔で形成された配線部１０５が設けられたプリント回路基板１０４が配置されている（図中、金属板１０２と配線部１０５との間の間隔として、水平方向に関する直線距離ｄを示している）。このため、金属板１０２と配線部１０５との間に充分な電気的絶縁が達成されていないことが想定される。また、図１４に示すような発光装置１０１では、ガラスエポキシ基板で形成されたプリント回路基板１０４を有するため、製造工程が複雑となり、安価な発光装置を提供できないという問題もある。   However, in the light emitting device 101 as shown in FIG. 14, a printed circuit board 104 provided with a wiring portion 105 formed of copper foil is disposed in the immediate vicinity of a metal plate 102 formed of aluminum (in the drawing). As a distance between the metal plate 102 and the wiring portion 105, a linear distance d in the horizontal direction is shown). For this reason, it is assumed that sufficient electrical insulation is not achieved between the metal plate 102 and the wiring part 105. Further, since the light emitting device 101 as shown in FIG. 14 includes the printed circuit board 104 formed of a glass epoxy substrate, there is a problem that a manufacturing process becomes complicated and an inexpensive light emitting device cannot be provided.

また、たとえば特開２００６−２８７０２０号公報（特許文献２）には、図１５に模式的に示すようなＬＥＤ部品２０１が開示されている。図１５に示すＬＥＤ部品２０１は、配線基板２０２に形成された貫通孔内に、ＬＥＤチップ２０４が搭載された金属またはセラミックで形成された放熱板２０３が接合されてなる。そして、図１５に示す例では、ＬＥＤチップ２０４と、配線基板２０２に形成された配線パターン２０５とがボンディングワイヤＷにより電気的に接続され、このＬＥＤチップ２０４およびボンディングワイヤＷが透明樹脂で形成された樹脂封止体２０６により埋設されてなる。特許文献２には、このような構成を備えることによって、ＬＥＤチップの発熱を効率的に放熱させることができ、生産性に優れた表面実装型のＬＥＤ部品およびその製造方法を提供できると記載されている。   Further, for example, Japanese Patent Laid-Open No. 2006-287020 (Patent Document 2) discloses an LED component 201 as schematically shown in FIG. The LED component 201 shown in FIG. 15 is formed by joining a heat sink 203 made of metal or ceramic on which an LED chip 204 is mounted in a through hole formed in a wiring board 202. In the example shown in FIG. 15, the LED chip 204 and the wiring pattern 205 formed on the wiring substrate 202 are electrically connected by the bonding wire W, and the LED chip 204 and the bonding wire W are formed of a transparent resin. The resin sealing body 206 is buried. Patent Document 2 describes that by providing such a configuration, it is possible to efficiently dissipate the heat generated by the LED chip, and to provide a surface-mount type LED component excellent in productivity and a method for manufacturing the same. ing.

しかしながら、特許文献２には、ＬＥＤチップ２０４およびボンディングワイヤＷを埋設するための透明樹脂を塗布する方法について詳細には記載されていない。また、特許文献２に開示された図１５に示すＬＥＤ部品２０１では、配線パターン２０５は配線基板２０２の側面と裏面の一部に形成されているため製造が困難であり、安価に製造することができないという問題がある。   However, Patent Document 2 does not describe in detail a method of applying a transparent resin for embedding the LED chip 204 and the bonding wire W. Further, the LED component 201 shown in FIG. 15 disclosed in Patent Document 2 is difficult to manufacture because the wiring pattern 205 is formed on a part of the side surface and the back surface of the wiring substrate 202, and can be manufactured at low cost. There is a problem that you can not.

特開２００３−１５２２２５号公報JP 2003-152225 A 特開２００６−２８７０２０号公報JP 2006-287020 A

本発明は、上記課題を解決するためになされたものであって、その目的とするところは、充分な電気的絶縁が達成でき、かつ、製造工程が容易で安価に製造することができる発光装置を提供することである。   The present invention has been made in order to solve the above-described problems, and an object of the present invention is to provide a light emitting device that can achieve sufficient electrical insulation, can be easily manufactured at low cost. Is to provide.

本発明は、熱伝導性の高い絶縁基板上に発光部が設けられると共に、該発光部を取り囲む領域を有しており、該発光部を取り囲む領域における前記熱伝導性の高い絶縁基板上に正電極外部接続ランドおよび負電極外部接続ランドが設けられた発光装置であって、前記熱伝導性の高い絶縁基板上に複数の配線パターンが直接形成され、当該配線パターンは、前記正電極外部接続ランドと電気的に接続されたアノード用配線パターンと前記負電極外部接続ランドと電気的に接続されたカソード用配線パターンを含み、前記発光部は、複数個の半導体発光素子が前記熱伝導性の高い絶縁基板に接着され、前記複数個の半導体発光素子が１つの封止体で封止されたものであり、前記半導体発光素子は、半導体ＬＥＤチップであり、前記正電極外部接続ランドおよび前記負電極外部接続ランドは、前記発光部を挟むように対向して設けられている発光装置に関する。   In the present invention, a light emitting portion is provided on an insulating substrate having high thermal conductivity, and has a region surrounding the light emitting portion, and the region surrounding the light emitting portion is positively disposed on the insulating substrate having high heat conductivity. A light-emitting device provided with an electrode external connection land and a negative electrode external connection land, wherein a plurality of wiring patterns are directly formed on the insulating substrate having high thermal conductivity, and the wiring pattern is connected to the positive electrode external connection land. An anode wiring pattern electrically connected to the negative electrode external connection land, and a cathode wiring pattern electrically connected to the negative electrode external connection land, wherein the light emitting portion includes a plurality of semiconductor light emitting elements having high thermal conductivity. The semiconductor light emitting device is bonded to an insulating substrate and the plurality of semiconductor light emitting devices are sealed with a single sealing body, and the semiconductor light emitting device is a semiconductor LED chip, and the positive electrode external connection Command and the negative electrode external connection land relates to a light emitting device provided opposite so as to sandwich the light emitting portion.

本発明の発光装置は、前記半導体発光素子同士が直列に電気的に接続されていることが好ましい。   In the light emitting device of the present invention, it is preferable that the semiconductor light emitting elements are electrically connected in series.

本発明の発光装置は、前記半導体発光素子同士が並列に電気的に接続されていることが好ましい。   In the light emitting device of the present invention, it is preferable that the semiconductor light emitting elements are electrically connected in parallel.

本発明の発光装置は、前記配線パターンが、前記半導体発光素子との間の電気的接続の位置決め用のパターン、または、前記半導体発光素子の搭載位置の目安用のパターンをさらに有することが好ましい。   In the light emitting device of the present invention, it is preferable that the wiring pattern further includes a pattern for positioning electrical connection with the semiconductor light emitting element or a pattern for indicating a mounting position of the semiconductor light emitting element.

本発明における前記熱伝導性の高い絶縁基板は白色のセラミック基板であることが好ましく、この場合、前記白色のセラミック基板は、酸化アルミニウム、窒化アルミニウム、ボロンナイトライド、窒化ケイ素、酸化マグネシウム、フォルステライト、ステアタイト、低温焼結セラミックから選ばれるいずれか、または、これらの複合材料で形成されていることがより好ましい。   The insulating substrate having high thermal conductivity in the present invention is preferably a white ceramic substrate. In this case, the white ceramic substrate is made of aluminum oxide, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite. , Steatite, low-temperature sintered ceramic, or a composite material thereof is more preferable.

本発明においては、前記封止体が蛍光体を含有し、前記発光装置が所望の色度の発光をすることが好ましい。   In this invention, it is preferable that the said sealing body contains fluorescent substance and the said light-emitting device light-emits desired chromaticity.

本発明の発光装置は、液晶ディスプレイのバックライト光源または照明用光源として用いられるものであることが好ましい。   The light-emitting device of the present invention is preferably used as a backlight light source or an illumination light source for a liquid crystal display.

本発明によれば、充分な電気的絶縁が達成でき、かつ、製造工程が容易で安価に製造することができる発光装置およびその製造方法を提供することができる。また本発明の発光装置は、従来と比較して演色性が向上され、また色ズレが発生しにくいものであり、液晶ディスプレイ、照明用光源に好適に適用することができるものである。   According to the present invention, it is possible to provide a light emitting device that can achieve sufficient electrical insulation, can be easily manufactured at low cost, and a manufacturing method thereof. In addition, the light emitting device of the present invention has improved color rendering properties as compared with conventional ones and is less likely to cause color misregistration, and can be suitably applied to a liquid crystal display and an illumination light source.

本発明の好ましい第１の例の発光装置１を模式的に示す上面図である。It is a top view which shows typically the light-emitting device 1 of the preferable 1st example of this invention. 図１に示す例の発光装置１における発光部２を模式的に示す断面図である。It is sectional drawing which shows typically the light emission part 2 in the light-emitting device 1 of the example shown in FIG. 図１に示す例の発光装置１の絶縁基板３を模式的に示す上面図である。It is a top view which shows typically the insulated substrate 3 of the light-emitting device 1 of the example shown in FIG. 本発明の好ましい第２の例の発光装置２１を模式的に示す上面図である。It is a top view which shows typically the light-emitting device 21 of the preferable 2nd example of this invention. 本発明の好ましい第３の例の発光装置３１を模式的に示す上面図である。It is a top view which shows typically the light-emitting device 31 of the preferable 3rd example of this invention. 本発明の好ましい第４の例の発光装置４１を模式的に示す上面図である。It is a top view which shows typically the light-emitting device 41 of the preferable 4th example of this invention. 本発明の好ましい第５の例の発光装置５１を模式的に示す上面図である。It is a top view which shows typically the light-emitting device 51 of the preferable 5th example of this invention. 図１に示した例の発光装置１を蛍光灯型ＬＥＤランプ６１に適用した場合を示す斜視図である。2 is a perspective view showing a case where the light emitting device 1 of the example shown in FIG. 1 is applied to a fluorescent lamp type LED lamp 61. FIG. 図６に示した例の発光装置４１を蛍光灯型ＬＥＤランプ７１に適用した場合を示す斜視図である。It is a perspective view which shows the case where the light-emitting device 41 of the example shown in FIG. 6 is applied to the fluorescent lamp type LED lamp 71. 図６に示した例の発光装置４１を電球型ＬＥＤランプ８１に適用した場合を示す断面図である。It is sectional drawing which shows the case where the light-emitting device 41 of the example shown in FIG. 本発明の発光装置の製造方法の好ましい一例を段階的に示す図である。It is a figure which shows one preferable example of the manufacturing method of the light-emitting device of this invention in steps. 本発明の発光装置の製造方法に用いられる、好ましい一例のシリコーンゴムシート９１を模式的に示す図である。It is a figure which shows typically the silicone rubber sheet 91 of a preferable example used for the manufacturing method of the light-emitting device of this invention. ＣＩＥの色度座標を示すグラフである。It is a graph which shows the chromaticity coordinate of CIE. 従来の典型的な発光装置１０１を模式的に示す断面図である。It is sectional drawing which shows the conventional typical light-emitting device 101 typically. 従来の典型的なＬＥＤ部品２０１を模式的に示す断面図である。It is sectional drawing which shows the conventional typical LED component 201 typically.

図１は、本発明の好ましい第１の例の発光装置１の上面図であり、図２は、図１に示す例の発光装置１における発光部２を模式的に示す断面図である。また図３は、図１に示す例の発光装置１の絶縁基板３を模式的に示す上面図である。本発明の発光装置１は、絶縁基板３上に、直線状の配線パターン４が平行に配置されて複数形成され、その配線パターン４間に複数個の発光素子５が配線パターン４に電気的に接続された状態で搭載され、封止体６で封止された発光部２を備えることを特徴とする。本発明の発光装置１では、特に、絶縁基板３に発光素子５を直に搭載することで隣接する発光素子間、および発光素子／電極間の絶縁耐圧を高くすることができる。   FIG. 1 is a top view of a light emitting device 1 of a preferred first example of the present invention, and FIG. 2 is a cross-sectional view schematically showing a light emitting unit 2 in the light emitting device 1 of the example shown in FIG. FIG. 3 is a top view schematically showing the insulating substrate 3 of the light emitting device 1 of the example shown in FIG. In the light emitting device 1 of the present invention, a plurality of linear wiring patterns 4 are formed in parallel on an insulating substrate 3, and a plurality of light emitting elements 5 are electrically connected to the wiring patterns 4 between the wiring patterns 4. The light emitting unit 2 is mounted in a connected state and sealed with a sealing body 6. In the light emitting device 1 of the present invention, in particular, by directly mounting the light emitting element 5 on the insulating substrate 3, the withstand voltage between adjacent light emitting elements and between the light emitting elements / electrodes can be increased.

本発明の発光装置１によれば、絶縁基板３上に複数形成された直線状の配線パターン４間に、配線パターン４に電気的に接続された状態で複数個の発光素子５を搭載してなることで、従来の金属基板上に絶縁層を形成する場合とは異なり、充分な電気絶縁性が達成される。すなわち、上述したように、従来の図１４に示した例のような構成では、発光素子が搭載されている金属板１０２の直近に配線部１０５が設けられたプリント回路基板１０４が配置されているため、充分な電気的絶縁を達成することが困難であった。このような構成において絶縁物で隔離することなく充分な電気的絶縁を達成するためには、金属板１０２と配線部１０５との間の水平方向に関する直線距離ｄを充分な長さだけ確保する必要がある。これに対し、本発明の発光装置１では、絶縁基板３上に配線パターン４を直接形成し、またこの絶縁基板３上に発光素子５を直に搭載し、配線パターン４とはボンディングワイヤＷを用いて電気的に接続した状態とするため、上述した直線距離を考慮することなく発光装置を設計することができ、製造も容易となる。また本発明の発光装置１では、金属板上に絶縁層を形成する構成でないため、製造に際して金属板上に絶縁層を形成する工程が不要であり、この点からも製造は容易である。   According to the light emitting device 1 of the present invention, a plurality of light emitting elements 5 are mounted in a state of being electrically connected to the wiring pattern 4 between the plurality of linear wiring patterns 4 formed on the insulating substrate 3. Thus, unlike the conventional case where an insulating layer is formed on a metal substrate, sufficient electrical insulation is achieved. That is, as described above, in the configuration as in the example shown in FIG. 14 of the related art, the printed circuit board 104 provided with the wiring portion 105 is disposed in the immediate vicinity of the metal plate 102 on which the light emitting element is mounted. For this reason, it has been difficult to achieve sufficient electrical insulation. In such a configuration, in order to achieve sufficient electrical insulation without being separated by an insulator, it is necessary to secure a sufficient linear distance d in the horizontal direction between the metal plate 102 and the wiring portion 105. There is. On the other hand, in the light emitting device 1 of the present invention, the wiring pattern 4 is directly formed on the insulating substrate 3, and the light emitting element 5 is directly mounted on the insulating substrate 3, and the bonding wire W is connected to the wiring pattern 4. Since it is used and electrically connected, the light-emitting device can be designed without considering the linear distance described above, and the manufacture is facilitated. In addition, since the light emitting device 1 of the present invention is not configured to form an insulating layer on a metal plate, a process for forming the insulating layer on the metal plate is not necessary in manufacturing, and the manufacturing is easy from this point.

また、発光強度の強い発光素子を１つ備える発光装置を発光させた場合には、輝点状の発光となり、人の目には眩しく感じられるため用途が限定されてしまう。本発明の発光装置１では、複数個の発光素子５を備えるため、輝点状の発光が生じることなく均一な発光を実現することができ、広範な用途に適用することができる。本発明の発光装置１においてはまた、平行に複数形成された直線状の配線パターン４に沿って、複数個の発光素子５の搭載位置を自在に設定することができ、発光装置１の輝度調整、色度調整が容易にできる。またこの発光装置１では、発光素子の発熱が集中しないように、発光素子５の搭載位置を設定して放熱対策を講じることも容易にできる。さらに本発明の発光装置１では、発光素子の搭載個数も調整することができるため、所望の仕様に応じて全光束、消費電力を調整することができる。   In addition, when a light emitting device including one light emitting element having a high light emission intensity is caused to emit light, the light emission is a bright spot shape, which is dazzling to the human eye, so that the application is limited. Since the light-emitting device 1 of the present invention includes a plurality of light-emitting elements 5, uniform light emission can be realized without causing bright spot-like light emission, and can be applied to a wide range of applications. In the light emitting device 1 according to the present invention, the mounting positions of the plurality of light emitting elements 5 can be freely set along the linear wiring patterns 4 formed in parallel. The chromaticity can be easily adjusted. Further, in the light emitting device 1, it is possible to easily take a heat dissipation measure by setting the mounting position of the light emitting element 5 so that heat generation of the light emitting element is not concentrated. Furthermore, in the light emitting device 1 of the present invention, the number of light emitting elements mounted can be adjusted, so that the total luminous flux and power consumption can be adjusted according to the desired specifications.

本発明の発光装置１において、発光素子５は、直線状の各配線パターンを挟んで、配線パターンに沿って直線状に複数個搭載されてなることが好ましい。本発明の発光装置における配線パターンの数は、特に制限されるものではないが、アノード用配線パターン、カソード用配線パターンがそれぞれ１本以上必要であるため、少なくとも２本以上の配線パターンが必要であり、２〜４本の範囲内が好ましい。発光装置から電流３５０ｍＡの時に全光束を３００ｌｍを得るためには、発光素子が３６個必要となる。その場合、たとえば配線パターン４は、４つの配線パターン４ａ，４ｂ，４ｃ，４ｄを有するように形成され、配線パターン４ａ，４ｂ間に１２個、配線パターン４ｂ，４ｃ間に１２個、配線パターン４ｃ，４ｄ間に１２個の発光素子５がそれぞれ搭載される（図１〜図３に示す例）。   In the light-emitting device 1 of the present invention, it is preferable that a plurality of light-emitting elements 5 are mounted in a straight line along the wiring pattern with each linear wiring pattern interposed therebetween. The number of wiring patterns in the light emitting device of the present invention is not particularly limited. However, since at least one wiring pattern for anode and one wiring pattern for cathode are required, at least two wiring patterns are required. Yes, preferably in the range of 2-4. In order to obtain a total luminous flux of 300 lm at a current of 350 mA from the light emitting device, 36 light emitting elements are required. In this case, for example, the wiring pattern 4 is formed so as to have four wiring patterns 4a, 4b, 4c, and 4d, twelve wiring patterns 4a and 4b, twelve wiring patterns 4b and 4c, and wiring pattern 4c. , 4d are respectively mounted with 12 light emitting elements 5 (example shown in FIGS. 1 to 3).

なお、図１〜図３には、発光装置１が正方形状の上面形状を有するように実現された例を示しているが、この場合には、図３に示すように、直線状の配線パターン４は、発光装置１の上面形状である正方形状の対角線の１つに平行になるように形成されてなることが好ましい。このように配線パターン４が形成されてなることで、配線パターン４の長さおよび間隔を十分に確保することができ、また後述する発光装置の固定用穴、外部配線用穴などを形成できる領域も確保できるというような利点がある。なお、上述した発光装置の上面形状とは、絶縁基板３の基板面に平行な断面における形状を意味する。   1 to 3 show an example in which the light-emitting device 1 is realized to have a square upper surface shape. In this case, as shown in FIG. 3, a linear wiring pattern is used. 4 is preferably formed so as to be parallel to one of the diagonal lines of the square shape that is the top surface shape of the light emitting device 1. By forming the wiring pattern 4 in this way, the length and interval of the wiring pattern 4 can be sufficiently secured, and a region for fixing a light emitting device and a hole for external wiring, which will be described later, can be formed. There is an advantage that can be secured. Note that the above-described top surface shape of the light emitting device means a shape in a cross section parallel to the substrate surface of the insulating substrate 3.

また本発明の発光装置１において、配線パターン４を挟んで搭載された各発光素子５は、側面同士が対向しないようにずらして配置されていることが好ましい。このように発光素子５が配置されていることで、輝度が均一となり、輝度ムラを低減できるという利点がある。   Moreover, in the light-emitting device 1 of this invention, it is preferable that each light emitting element 5 mounted on both sides of the wiring pattern 4 is shifted and arrange | positioned so that side surfaces may not oppose. By arranging the light emitting element 5 in this manner, there is an advantage that the luminance becomes uniform and luminance unevenness can be reduced.

また本発明の発光装置１においては、発光素子５は上面形状が長方形状の発光素子を用いることが好ましい。ここで、発光素子５の上面形状は、絶縁基板３上に搭載された状態での当該絶縁基板３の基板面に平行な上面における形状を指す。このような上面形状が長方形状の発光素子５として、具体的には、当該上面形状における短辺が２００〜３００μｍの範囲内であり、長辺が４００〜１０００μｍの範囲内である発光素子が例示される。本発明の発光装置１では、このような上面形状が長方形状の発光素子５を用いる場合には、当該発光素子５の上面形状の短辺に沿った方向が配線パターン４の長手方向と平行となるように搭載されていることが好ましい。通常、上面形状が長方形状の発光素子５においては、その上面の短辺側に電極パッドが形成されているため、上述のように発光素子５を搭載することで、ボンディングワイヤＷを用いた発光素子５の電極パッドと配線パターン４との間の電気的接続を容易に行うことができ、ボンディングワイヤＷの切断、ボンディングワイヤＷの剥れなどの不良を防止することができる。また、このようにすることで、配線パターン４の長手方向に沿って所望の間隔、所望の数だけ発光素子５を搭載することにより所望の光が得られるよう容易に調整することができるという利点がある。   In the light emitting device 1 of the present invention, the light emitting element 5 is preferably a light emitting element having a rectangular top surface shape. Here, the upper surface shape of the light emitting element 5 indicates the shape of the upper surface parallel to the substrate surface of the insulating substrate 3 when mounted on the insulating substrate 3. Specific examples of such a light emitting element 5 having a rectangular top surface include a light emitting element having a short side in the range of 200 to 300 μm and a long side in the range of 400 to 1000 μm. Is done. In the light emitting device 1 of the present invention, when such a light emitting element 5 having a rectangular upper surface shape is used, the direction along the short side of the upper surface shape of the light emitting element 5 is parallel to the longitudinal direction of the wiring pattern 4. It is preferable to be mounted so as to be. Usually, in the light emitting element 5 having a rectangular upper surface shape, since the electrode pad is formed on the short side of the upper surface, the light emission using the bonding wire W can be performed by mounting the light emitting element 5 as described above. Electrical connection between the electrode pad of the element 5 and the wiring pattern 4 can be easily performed, and defects such as cutting of the bonding wire W and peeling of the bonding wire W can be prevented. Moreover, by doing in this way, the advantage that it can adjust easily so that desired light can be obtained by mounting the light emitting element 5 by a desired space | interval and a desired number along the longitudinal direction of the wiring pattern 4 is obtained. There is.

上述のように本発明に用いる発光素子５は、長方形状の上面形状を有する発光素子を用いることが好ましいが、上述したような発光素子の上面の短辺側に通常電極パッドが形成されていることにより、ボンディングワイヤＷを用いた配線パターン４との間の電気的接続が容易であり、ボンディングワイヤＷの切断、剥れなどの不良の防止の効果が特に顕著であることから、長尺状の上面形状を有する発光素子を用いることがより好ましい。ここで、「長尺状」とは、上面形状における短辺の長さに対し長辺の長さが顕著に長い形状を指し、たとえば、長辺が４８０μｍであり、短辺が２４０μｍであるような上面形状を有する発光素子が例示される。長尺状の上面形状を有する発光素子を用いる場合には、電極パッドが短辺の端（短辺側）に設けられ、電極パッドが対向するように設けられた発光素子を用いることが好ましい。   As described above, the light-emitting element 5 used in the present invention is preferably a light-emitting element having a rectangular upper surface shape, but a normal electrode pad is formed on the short side of the upper surface of the light-emitting element as described above. This facilitates electrical connection with the wiring pattern 4 using the bonding wires W, and the effect of preventing defects such as cutting and peeling of the bonding wires W is particularly remarkable. It is more preferable to use a light emitting element having an upper surface shape. Here, the “long shape” refers to a shape in which the length of the long side is significantly longer than the length of the short side in the top surface shape. For example, the long side is 480 μm and the short side is 240 μm. The light emitting element which has various upper surface shapes is illustrated. In the case of using a light-emitting element having a long upper surface shape, it is preferable to use a light-emitting element in which an electrode pad is provided at the end of the short side (short side) and the electrode pad is opposed.

なお、本発明の発光装置１において、平行に配置された複数の直線状の配線パターン４と、複数個の発光素子５との間をどのように電気的に接続するかは特に制限されるものではなく、直線状の配線パターン４を挟んで搭載された発光素子５同士は、直列に電気的に接続されていてもよいし、並列に電気的に接続されていてもよい。直線状の配線パターン４を挟んで搭載された発光素子５同士が直列に電気的に接続され、直線状の配線パターンに沿って直線状に搭載された発光素子５同士が並列に電気的に接続されていてもよい。なお、発光素子と電極との距離は近い方が配線の抵抗による電圧降下が最も小さくなるので好ましい。さらに、配線パターンに沿って直線状に配列されて複数個搭載されている発光素子は全て電極と電気的に接続するのではなく、一部の発光素子は予備の発光素子として搭載しただけの状態にしておくことが好ましい。このようにすることで、発光素子を封止体で封止する前の検査工程（後述）で故障して発光しない発光素子があることが分かった場合に、予備の発光素子を電極と電気的に接続して所定の明るさとすることができる。   In the light emitting device 1 of the present invention, how to electrically connect the plurality of linear wiring patterns 4 arranged in parallel and the plurality of light emitting elements 5 is particularly limited. Instead, the light emitting elements 5 mounted with the linear wiring pattern 4 interposed therebetween may be electrically connected in series or may be electrically connected in parallel. The light emitting elements 5 mounted with the linear wiring pattern 4 interposed therebetween are electrically connected in series, and the light emitting elements 5 mounted linearly along the linear wiring pattern are electrically connected in parallel. May be. Note that it is preferable that the distance between the light emitting element and the electrode is short because the voltage drop due to the resistance of the wiring is minimized. Furthermore, a plurality of light emitting elements arranged in a straight line along the wiring pattern are not electrically connected to the electrodes, but a part of the light emitting elements are simply mounted as spare light emitting elements. It is preferable to keep it. In this manner, when it is found that there is a light emitting element that fails and does not emit light in an inspection process (described later) before sealing the light emitting element with the sealing body, the spare light emitting element is electrically connected to the electrode. To a predetermined brightness.

本発明の発光装置はまた、配線パターンが、発光素子との間の電気的接続の位置決め用のパターン、または、発光素子の搭載位置の目安用のパターンをさらに有することが、好ましい。図３には、平行に形成された４つの直線状の配線パターン４に繋がって、パターン７が点在して形成された例を示している。このパターン７を、配線パターン４と発光素子５との間の電気的接続の位置決め、または、発光素子５の搭載位置の目安として用いることで、発光素子の搭載および配線パターンとの間の電気的接続が容易となり、さらに自動化装置を用いる場合の認識パターンとして用いることもできるという利点がある。   In the light emitting device of the present invention, it is also preferable that the wiring pattern further has a pattern for positioning electrical connection with the light emitting element or a pattern for indicating the mounting position of the light emitting element. FIG. 3 shows an example in which four linear wiring patterns 4 formed in parallel are connected with patterns 7. By using this pattern 7 as a guide for positioning the electrical connection between the wiring pattern 4 and the light emitting element 5 or mounting the light emitting element 5, the electrical connection between the light emitting element and the wiring pattern can be achieved. There is an advantage that the connection can be facilitated and that it can also be used as a recognition pattern when using an automation device.

本発明の発光装置１では、発光素子５と配線パターン４との間の直線距離が０．１ｍｍ以上であることが好ましく、０．５ｍｍ以上であることがより好ましい。ここで、この直線距離は、絶縁基板３の基板面に沿った方向における発光素子５と配線パターン４との間の直線距離を意味する。上記直線距離が０．１ｍｍ以上であることで、電気的絶縁性が確実に達成される。なお、ワイヤボンディングの際のタレ、ボンディングワイヤの切断防止の観点からは、発光素子５と配線パターン４との間の水平方向に沿った直線距離は、１．５ｍｍ以下であることが好ましく、１．０ｍｍ以下であることがより好ましい。   In the light emitting device 1 of the present invention, the linear distance between the light emitting element 5 and the wiring pattern 4 is preferably 0.1 mm or more, and more preferably 0.5 mm or more. Here, this linear distance means a linear distance between the light emitting element 5 and the wiring pattern 4 in the direction along the substrate surface of the insulating substrate 3. Electrical insulation is reliably achieved because the linear distance is 0.1 mm or more. From the viewpoint of sagging during wire bonding and prevention of cutting of the bonding wire, the linear distance along the horizontal direction between the light emitting element 5 and the wiring pattern 4 is preferably 1.5 mm or less. More preferably, it is 0.0 mm or less.

本発明の発光装置１はまた、図２に示すように、配線パターン４の厚みは、発光素子の厚みよりも小さいことが好ましい。これによって、発光素子５から発光する光を、配線パターンによって外部に放出される光が遮蔽することが低減され、外部に効率よく光を放出できる発光装置１が実現できる。具体的には、配線パターン４の上記領域の厚みと発光素子５の厚みとの差は、０．００５ｍｍ以上であることが好ましく、０．０７ｍｍ以上であることがより好ましい。   In the light emitting device 1 of the present invention, as shown in FIG. 2, the thickness of the wiring pattern 4 is preferably smaller than the thickness of the light emitting element. Thereby, the light emitted from the light emitting element 5 is reduced from being blocked by the light emitted to the outside by the wiring pattern, and the light emitting device 1 that can efficiently emit the light to the outside can be realized. Specifically, the difference between the thickness of the region of the wiring pattern 4 and the thickness of the light emitting element 5 is preferably 0.005 mm or more, and more preferably 0.07 mm or more.

本発明の発光装置１における絶縁基板３は、少なくともその表面が絶縁性を有する材料で形成されていればよく、特に制限されるものではないが、熱膨張が小さく、熱伝導性が高く、かつ光反射率が高いことから、白色のセラミック基板であることが好ましい。ここで、「白色」とは、物体が全ての波長の可視光線をほぼ１００％反射するような物体の色を指す（ただし、１００％の反射率をもった理想的な白色の物体は存在しない。）。白色のセラミック基板を絶縁基板３として用いることで、発光素子５からの出射光のうち、特に下面方向への光を白色のセラミック基板にて反射することができ、発光素子５からの出射光をロスなく有効に活用できるとともに、高い放熱性および耐熱性が要求される駆動電流として大電流を供給する用途にも好適に適用することができる。さらに、発光素子５の信頼性を向上できるとともに、封止体６が蛍光体を含有する場合（後述）には、発光素子５からの熱による蛍光体の劣化を抑えることもでき、蛍光体により波長変換されて出光する光の色度ズレが生じにくい。またさらに、上述のように光反射率の高いセラミック基板を用いることで、基板材料および／または配線パターンの形成材料に光反射率９０％以上の銀を用いる必要がないため、銀マイグレーションの心配がなく、さらに銀が硫化してしまう問題もない。   The insulating substrate 3 in the light emitting device 1 of the present invention is not particularly limited as long as at least the surface thereof is formed of an insulating material, but has a small thermal expansion, a high thermal conductivity, and Since the light reflectance is high, a white ceramic substrate is preferable. Here, “white” refers to the color of an object such that the object reflects almost 100% of visible light of all wavelengths (however, there is no ideal white object having a reflectance of 100%). .) By using a white ceramic substrate as the insulating substrate 3, light emitted from the light emitting element 5 can be reflected by the white ceramic substrate, particularly in the lower surface direction. In addition to being able to be used effectively without loss, it can also be suitably applied to applications that supply a large current as a drive current that requires high heat dissipation and heat resistance. Furthermore, the reliability of the light-emitting element 5 can be improved, and when the sealing body 6 contains a phosphor (described later), deterioration of the phosphor due to heat from the light-emitting element 5 can be suppressed. The chromaticity deviation of the light emitted after wavelength conversion is unlikely to occur. Furthermore, by using a ceramic substrate having a high light reflectivity as described above, there is no need to use silver having a light reflectivity of 90% or more as a substrate material and / or a wiring pattern forming material. Furthermore, there is no problem that silver is further sulfided.

白色のセラミック基板を用いる場合には、光反射率が９０％以上と高いことから、酸化アルミニウム（アルミナ）、窒化アルミニウム、ボロンナイトライド、窒化ケイ素、酸化マグネシウム、フォルステライト、ステアタイト、低温焼結セラミックから選ばれるいずれか、または、これらの複合材料で形成されたセラミック基板が好ましい。上述した中でも、安価で、反射率が高く、加工しやすく、工業材料として広く使われている酸化アルミニウム（アルミナ）で形成された白色のセラミック基板が特に好ましい。   When using a white ceramic substrate, the light reflectivity is as high as 90% or more, so aluminum oxide (alumina), aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite, steatite, low temperature sintering Any one selected from ceramics or a ceramic substrate formed of these composite materials is preferable. Among these, a white ceramic substrate made of aluminum oxide (alumina), which is inexpensive, has high reflectance, is easy to process, and is widely used as an industrial material, is particularly preferable.

本発明の発光装置１に用いられる発光素子５としては、当分野において通常用いられる発光素子を特に制限なく用いることができる。このような発光素子としては、たとえば、サファイヤ基板、ＺｎＯ（酸化亜鉛）基板、ＧａＮ基板、Ｓｉ基板、ＳｉＣ基板、スピネルなどの基板上に、窒化ガリウム系化合物半導体、ＺｎＯ（酸化亜鉛）系化合物半導体などの材料を成長させた青色系ＬＥＤ（発光ダイオード）チップ、ＩｎＧａＡｌＰ系化合物半導体ＬＥＤチップ、ＡｌＧａＡｓ系化合物半導体ＬＥＤチップなどの半導体発光素子を挙げることができる。中でも、絶縁性基板に片面２電極構造を容易に作製でき、結晶性のよい窒化物半導体を量産性よく形成できることから、サファイヤ基板上に窒化ガリウム系化合物半導体を成長させた青色系ＬＥＤを発光素子として用いることが、好ましい。このような青色系ＬＥＤを発光素子として用いる場合には、当該半導体発光素子からの光で励起されて黄色系の光を発する蛍光体を封止体中に分散させることで、白色を得るように発光装置を実現することが好ましい（後述）。   As the light emitting element 5 used in the light emitting device 1 of the present invention, a light emitting element usually used in this field can be used without any particular limitation. Examples of such a light-emitting element include a gallium nitride compound semiconductor and a ZnO (zinc oxide) compound semiconductor on a substrate such as a sapphire substrate, a ZnO (zinc oxide) substrate, a GaN substrate, a Si substrate, a SiC substrate, and a spinel. Examples thereof include semiconductor light emitting devices such as blue LED (light emitting diode) chips, InGaAlP compound semiconductor LED chips, and AlGaAs compound semiconductor LED chips on which materials such as these are grown. Above all, a single-sided two-electrode structure can be easily formed on an insulating substrate, and a nitride semiconductor with good crystallinity can be formed with high productivity. Therefore, a blue LED in which a gallium nitride compound semiconductor is grown on a sapphire substrate is used as a light emitting element. It is preferable to use as. When such a blue LED is used as a light emitting element, white is obtained by dispersing a phosphor that emits yellow light when excited by light from the semiconductor light emitting element. It is preferable to realize a light emitting device (described later).

なお、本発明の発光装置に用いられる発光素子は、発光色は青色発光に限定されるものではなく、たとえば紫外線発光、緑色発光などの発光色の発光素子を用いても勿論よい。また、青色系ＬＥＤを発光素子として用い、この青色系ＬＥＤから発せられる光を蛍光体によって変換して白色を得る構成に換えて、蛍光体を用いずにたとえば赤、緑、青の三色のＬＥＤチップをそれぞれ発光素子として用いて、白色などの照明に必要な色が得られるように発光装置を実現するようにしても勿論よい。   Note that the light-emitting element used in the light-emitting device of the present invention is not limited to blue light emission, and for example, a light-emitting element having a light emission color such as ultraviolet light emission or green light emission may be used. In addition, instead of using a blue LED as a light emitting element and converting the light emitted from the blue LED by a phosphor to obtain white, for example, three colors of red, green, and blue are used without using the phosphor. Of course, the light emitting device may be realized by using each LED chip as a light emitting element so as to obtain a color necessary for illumination such as white.

本発明の発光装置１に用いられる発光素子５は、その形状については特に制限されるものではないが、上述したように、上面形状が長方形状であることが好ましく、長尺状であることがより好ましい。なお、本発明の発光装置１においては、一方の面にＰ側電極およびＮ側電極が形成された発光素子５を用いる必要がある。このような発光素子５を、Ｐ側電極およびＮ側電極が形成された面を上面として絶縁基板３上の配線パターン４の間に搭載し、配線パターン４との間を電気的に接続する。   The shape of the light-emitting element 5 used in the light-emitting device 1 of the present invention is not particularly limited. However, as described above, the top surface shape is preferably rectangular, and it is long. More preferred. In addition, in the light-emitting device 1 of this invention, it is necessary to use the light emitting element 5 by which the P side electrode and the N side electrode were formed in one surface. Such a light emitting element 5 is mounted between the wiring patterns 4 on the insulating substrate 3 with the surface on which the P-side electrode and the N-side electrode are formed as an upper surface, and is electrically connected to the wiring pattern 4.

発光素子５と配線パターン４との電気的接続は、図２に示すように、Ｐ側電極およびＮ側電極をそれぞれ配線パターン４にボンディングワイヤＷをボンディングすることで実現される。ボンディングワイヤＷとしては、当分野において従来から広く用いられている適宜の金属細線を特に制限されることなく用いることができる。このような金属細線としては、たとえば金線、アルミニウム線、銅線、白金線などが挙げられるが、中でも腐食が少なく、耐湿性、耐環境性、密着性、電気伝導性、熱伝導性、伸び率が良好であり、ボールが出来やすいことから、金線をボンディングワイヤＷとして用いることが好ましい。   As shown in FIG. 2, the electrical connection between the light emitting element 5 and the wiring pattern 4 is realized by bonding bonding wires W to the wiring pattern 4 for the P-side electrode and the N-side electrode, respectively. As the bonding wire W, any appropriate fine metal wire that has been widely used in the art can be used without particular limitation. Examples of such fine metal wires include gold wires, aluminum wires, copper wires, platinum wires, etc., among which there is little corrosion, moisture resistance, environmental resistance, adhesion, electrical conductivity, thermal conductivity, elongation. It is preferable to use a gold wire as the bonding wire W because the rate is good and a ball can be easily formed.

本発明の発光装置１は、上述したように配線パターン４の間に、配線パターン４に電気的に接続された状態で搭載された複数個の発光素子５を、電気的接続を行っているボンディングワイヤＷごと、封止体６にて封止してなる。封止体６による封止は、直線状の配線パターン４に沿って両側に搭載された発光素子５を含むように直線状の封止体を複数形成するようにしてもよいし、絶縁基板上の直線状の配線パターンおよび発光素子の全てを１つの封止体で封止するようにしてもよい。発光装置の輝度ムラを低減でき、封止体の厚みのバラツキを低減できる観点からは、図１〜図３に示す例のように、絶縁基板上の直線状の配線パターンおよび発光素子の全てを１つの封止体で封止することが好ましい。   In the light emitting device 1 of the present invention, as described above, a plurality of light emitting elements 5 mounted in a state of being electrically connected to the wiring pattern 4 are electrically connected between the wiring patterns 4. Each wire W is sealed with a sealing body 6. The sealing with the sealing body 6 may be performed by forming a plurality of linear sealing bodies so as to include the light emitting elements 5 mounted on both sides along the linear wiring pattern 4. All of the linear wiring pattern and the light emitting element may be sealed with one sealing body. From the viewpoint of reducing the luminance unevenness of the light emitting device and reducing the variation in the thickness of the sealing body, all of the linear wiring patterns and the light emitting elements on the insulating substrate as shown in FIGS. It is preferable to seal with one sealing body.

本発明の発光装置１における封止体６を形成するための材料（封止材料）としては、透光性を有する材料であれば特に制限されるものではなく、当分野において従来から広く知られた適宜の材料を用いて形成することができる。このような封止材料としては、たとえば、エポキシ樹脂、ユリア樹脂、シリコーン樹脂などの耐候性に優れた透光性樹脂材料、耐光性に優れたシリカゾル、硝子などの透光性無機材料が好適に用いられる。   The material (sealing material) for forming the sealing body 6 in the light emitting device 1 of the present invention is not particularly limited as long as it is a light-transmitting material, and has been widely known in the art. It can be formed using any appropriate material. As such a sealing material, for example, a translucent resin material excellent in weather resistance such as an epoxy resin, a urea resin, or a silicone resin, or a translucent inorganic material such as silica sol or glass excellent in light resistance is suitable. Used.

本発明における封止体６は、所望の光が得られるように調整可能であり、また、白色、昼白色、電球色などが容易に得られることから、蛍光体を含有してなることが好ましい。蛍光体としては、たとえば、Ｃｅ：ＹＡＧ（セリウム賦活イットリウム・アルミニウム・ガーネット）蛍光体、Ｅｕ：ＢＯＳＥ（ユーロピウム賦活バリウム・ストロンチウム・オルソシリケート）蛍光体、Ｅｕ：ＳＯＳＥ（ユーロピウム賦活ストロンチウム・バリウム・オルソシリケート）蛍光体、ユーロピウム賦活αサイアロン蛍光体などを好適に用いることができるが、これらに制限されるものではない。   The sealing body 6 in the present invention can be adjusted so as to obtain desired light, and white, day white, light bulb color and the like can be easily obtained. Therefore, the sealing body 6 preferably contains a phosphor. . Examples of the phosphor include Ce: YAG (cerium activated yttrium, aluminum, garnet) phosphor, Eu: BOSE (europium activated barium / strontium / orthosilicate) phosphor, Eu: SOSE (europium activated strontium / barium / orthosilicate). ) Phosphors, europium activated α sialon phosphors and the like can be suitably used, but are not limited thereto.

なお、本発明における封止体６には、蛍光体と共に拡散剤を含有させるようにしてもよい。拡散剤としては、特に制限されるものではないが、たとえば、チタン酸バリウム、酸化チタン、酸化アルミニウム、酸化珪素、炭酸カルシウム、二酸化珪素などが好適に用いられる。   In addition, you may make it make the sealing body 6 in this invention contain a diffusing agent with fluorescent substance. Although it does not restrict | limit especially as a diffusing agent, For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, calcium carbonate, silicon dioxide etc. are used suitably.

本発明における封止体６は、発光装置１の所望される光の色度に応じて、２層で実現することができる。この場合、図２に示すように第１の蛍光体を含有する第１の封止体層８と、第１の封止体層８上に積層された第２の蛍光体を含有する第２の封止体層９とを備えるように実現されることが好ましい。このように封止体６を第１の封止体層８と第２の封止体層９とで構成することで、色度を容易に調整でき、色度ズレのない発光装置を、良好な歩留りで安価に提供することができるという利点がある。好適な具体例としては、樹脂材料としてメチルシリコーンを用い、これに第１の蛍光体としてＥｕ：ＢＯＳＥを分散させ、硬化させることにより第１の封止体層８を形成し、この第１の封止体層８を覆うようにして、樹脂材料として有機変性シリコーンを用い、これに第２の蛍光体としてＥｕ：ＳＯＳＥを分散させ、硬化させることにより第２の封止体層９を形成する場合が例示される。色度ズレの調色の観点からは、第２の封止体層９は、第１の封止体層８の上面の少なくとも一部を覆うようにして第１の封止体層８上に積層されていることが好ましく、図２に示すように第１の封止体層８の上面の全面を第２の封止体層９で覆うようにして実現されることが特に好ましい。なお、１層（第１の蛍光体層）のみで所望の色度の光を発する発光装置が得られる場合には、封止体６は単層で実現されても勿論よい。ここで、第１の蛍光体を含有する第１の封止体層８と、第２の蛍光体を含有する第２の封止体層９の境界は、明確に分離していても、明確に分離していなくともよい。   The sealing body 6 in the present invention can be realized in two layers according to the desired light chromaticity of the light emitting device 1. In this case, as shown in FIG. 2, a first sealing body layer 8 containing the first phosphor and a second phosphor containing the second phosphor laminated on the first sealing body layer 8. It is preferable that the sealing body layer 9 be provided. Thus, by comprising the sealing body 6 by the 1st sealing body layer 8 and the 2nd sealing body layer 9, chromaticity can be adjusted easily and the light-emitting device without a chromaticity shift is favorable. There is an advantage that it can be provided at a low yield with a reasonable yield. As a preferred specific example, methylsilicone is used as the resin material, and Eu: BOSE is dispersed and cured as the first phosphor to form the first encapsulant layer 8, and the first encapsulant layer 8 is formed. The second sealing body layer 9 is formed by covering the sealing body layer 8 using organically modified silicone as the resin material, and dispersing and curing Eu: SOSE as the second phosphor. Cases are illustrated. From the viewpoint of chromaticity misalignment, the second sealing body layer 9 is formed on the first sealing body layer 8 so as to cover at least part of the upper surface of the first sealing body layer 8. It is preferable that the layers are laminated, and it is particularly preferable that the entire surface of the upper surface of the first sealing body layer 8 is covered with the second sealing body layer 9 as shown in FIG. In addition, when the light-emitting device which emits light of desired chromaticity is obtained only by one layer (1st fluorescent substance layer), of course, the sealing body 6 may be implement | achieved by the single layer. Here, even if the boundary between the first sealing body layer 8 containing the first phosphor and the second sealing body layer 9 containing the second phosphor is clearly separated, it is clear. It does not have to be separated.

本発明における封止体６は、その形状については特に制限されるものではないが、六角形状、円形状、長方形状または正方形状の上面形状を有することが好ましい。図１〜図３には、第１の封止体層８を正方形状の上面形状を有するように形成し、この第１の封止体層８の上面の全面を覆うようにして正方形状の上面形状を有するように第２の封止体層９を形成してなる例を示している。なお、上述した封止体６、第１の封止体層８および第２の封止体層９の上面形状とは、基板３の絶縁基板面に平行な断面における形状を指す。   The shape of the sealing body 6 in the present invention is not particularly limited, but it is preferable to have a hexagonal shape, a circular shape, a rectangular shape, or a square top surface shape. In FIG. 1 to FIG. 3, the first sealing body layer 8 is formed to have a square top surface shape, and the first sealing body layer 8 has a square shape so as to cover the entire top surface of the first sealing body layer 8. An example in which the second sealing body layer 9 is formed so as to have an upper surface shape is shown. In addition, the upper surface shape of the sealing body 6, the first sealing body layer 8, and the second sealing body layer 9 described above refers to a shape in a cross section parallel to the insulating substrate surface of the substrate 3.

ここで、図４は、本発明の好ましい第２の例の発光装置２１の上面図である。図４に示す例の発光装置２１は、封止体２２の上面形状が円形状であることを除いては図１に示した例の発光装置１と同様の構成を有するものであり、同様の構成を有する部分については同一の参照符を付して説明を省略する。図４に示すように封止体２２が円形状の上面形状を有するように実現されることで、対称形状であるため光指向性がよいという利点がある。このため、上述した六角形状、円形状、長方形状または正方形状の中でも、図４に示すように円形状の上面形状を有するように封止体２２を実現することが特に好ましい。   Here, FIG. 4 is a top view of the light emitting device 21 of the second preferred example of the present invention. The light emitting device 21 of the example shown in FIG. 4 has the same configuration as the light emitting device 1 of the example shown in FIG. 1 except that the top surface shape of the sealing body 22 is circular. The parts having the configuration are denoted by the same reference numerals and description thereof is omitted. As shown in FIG. 4, since the sealing body 22 is realized to have a circular upper surface shape, there is an advantage that the light directivity is good because of the symmetrical shape. For this reason, it is particularly preferable to realize the sealing body 22 so as to have a circular upper surface shape as shown in FIG. 4 among the above-described hexagonal shape, circular shape, rectangular shape, or square shape.

また封止体６は、上方に凸となる半球状に形成するようにしてもよい。この場合には、封止体６にレンズとしての機能を持たせることも可能になる。   Moreover, you may make it form the sealing body 6 in the hemisphere which becomes convex upwards. In this case, it becomes possible to give the sealing body 6 a function as a lens.

本発明の発光装置１は、その全体の形状についても特に制限されるものではないが、六角形状、円形状、長方形状または正方形状の上面形状を有するように実現されることが好ましい。発光装置が長方形状または正方形状の上面形状を有する場合には、発光素子を密着させて配置することができるため、発光装置を蛍光灯型ＬＥＤランプに適用する場合に特に好ましい。また、発光装置を電球型ＬＥＤランプ（後述）に適用する場合には、発光装置が円形状の上面形状を有するように実現されることが好ましい。図１および図４には、上述のように発光装置１が正方形状の上面形状を有するように実現された例を示している。   The light emitting device 1 of the present invention is not particularly limited as to the overall shape, but is preferably realized to have a hexagonal shape, a circular shape, a rectangular shape, or a square shape. In the case where the light emitting device has a rectangular or square upper surface shape, the light emitting elements can be arranged in close contact with each other, which is particularly preferable when the light emitting device is applied to a fluorescent lamp type LED lamp. In addition, when the light emitting device is applied to a light bulb type LED lamp (described later), it is preferable that the light emitting device is realized to have a circular upper surface shape. 1 and 4 show an example in which the light-emitting device 1 is realized to have a square upper surface shape as described above.

また図５は、本発明の好ましい第３の例の発光装置３１の上面図である。図５に示す例の発光装置３１は、封止体３３の上面形状が六角形状であり、発光装置３１の上面形状が円形状であることを除いては図１に示した例の発光装置１と同様の構成を有するものであり、同様の構成を有する部分については同一の参照符を付して説明を省略する。図５に示す例の発光装置３１のように封止体３３を六角形状の上面形状を有するように実現することでも、対称形状であるため、光の指向性がよいという利点がある。また、図５に示す例のように円形状の上面形状を有する（円形状の上面形状を有する絶縁基板３２を用いる）された発光装置３１は、電球型ＬＥＤランプに特に好適に適用できる。   FIG. 5 is a top view of the light emitting device 31 of the third preferred example of the present invention. The light emitting device 31 in the example shown in FIG. 5 has the hexagonal shape on the top surface of the sealing body 33 and the light emitting device 1 in the example shown in FIG. 1 except that the top surface shape of the light emitting device 31 is circular. The parts having the same configuration are denoted by the same reference numerals, and the description thereof is omitted. Realizing the sealing body 33 to have a hexagonal top surface shape as in the light emitting device 31 of the example shown in FIG. 5 also has an advantage of good light directivity because of the symmetrical shape. In addition, the light emitting device 31 having a circular upper surface shape (using the insulating substrate 32 having a circular upper surface shape) as in the example shown in FIG. 5 can be particularly preferably applied to a light bulb type LED lamp.

図６は、本発明の好ましい第４の例の発光装置４１の上面図である。図６に示す例の発光装置４１は、封止体４２（第１の封止体層４３）の上面形状が円形状であり、第２の封止体層４４が第１の封止体層４３の上面の一部のみを覆うように形成されていることを除いては図５に示した例の発光装置３１と同様の構成を有するものであり、同様の構成を有する部分については同一の参照符を付して説明を省略する。図６に示す例の発光装置４１のように封止体４２を円形状の上面形状を有するように実現することで、対称形状であるため、光の指向性がよいという利点がある。また図６に示す例では、円形状の上面形状を有するように形成された第１の封止体層４３と、この第１の封止体層４３を部分的に覆うようにして形成された第２の封止体層４４とで封止体４２が形成されている。このように第１の封止体層４３を部分的に覆うようにして第２の封止体層４４を形成することで、第１の封止体層の一部のみの調整で発光装置として所望の色度特性を有する（たとえば、後述する色度座標を示す図１３の（ｂ）の範囲内に入る）発光装置を得ることができるという利点がある。なお、このような場合、第２の封止体層４４にて覆う第１の封止体層４３の部分は、所望の色度特性に応じて選択する（たとえば、後述する色度座標を示す図１３の（ｂ）の範囲内に入っていない部分など）。また図６に示す例の発光装置４１は、円形状の上面形状を有するため、図５に示した例の発光装置３１と同様に電球型ＬＥＤランプに特に好適に適用できる。   FIG. 6 is a top view of a light emitting device 41 according to a fourth preferred embodiment of the present invention. In the light emitting device 41 of the example illustrated in FIG. 6, the upper surface shape of the sealing body 42 (first sealing body layer 43) is circular, and the second sealing body layer 44 is the first sealing body layer. 5 has the same configuration as that of the light emitting device 31 of the example shown in FIG. 5 except that it is formed so as to cover only a part of the upper surface of 43, and the portions having the same configuration are the same. A description is omitted with reference marks. By realizing the sealing body 42 to have a circular upper surface shape like the light emitting device 41 of the example shown in FIG. 6, there is an advantage that the directivity of light is good because of the symmetrical shape. Further, in the example shown in FIG. 6, the first sealing body layer 43 formed so as to have a circular upper surface shape and the first sealing body layer 43 are formed so as to partially cover the first sealing body layer 43. A sealing body 42 is formed with the second sealing body layer 44. In this way, by forming the second sealing body layer 44 so as to partially cover the first sealing body layer 43, a light emitting device can be obtained by adjusting only a part of the first sealing body layer. There is an advantage that a light emitting device having desired chromaticity characteristics (for example, falling within the range of FIG. 13B showing chromaticity coordinates described later) can be obtained. In such a case, the portion of the first sealing body layer 43 covered with the second sealing body layer 44 is selected according to desired chromaticity characteristics (for example, chromaticity coordinates described later are shown). A portion that does not fall within the range of FIG. 13B). Further, since the light emitting device 41 of the example shown in FIG. 6 has a circular upper surface shape, the light emitting device 41 can be particularly suitably applied to the light bulb type LED lamp, similarly to the light emitting device 31 of the example shown in FIG.

図７は、本発明の好ましい第５の例の発光装置５１の上面図である。図７に示す例の発光装置５１は、封止体５２（第１の封止体層５３）の上面形状が正方形状であり、第２の封止体層４４が第１の封止体層５３の上面の一部のみを覆うように形成されていることを除いては図５に示した例の発光装置３１と同様の構成を有するものであり、同様の構成を有する部分については同一の参照符を付して説明を省略する。図７に示す例の発光装置５１のように封止体５２（第１の封止体層５３）を正方形状の上面形状を有するように実現することで、後述する固定用穴、外部配線用穴などを形成できる領域を確保できるという利点がある。また図７に示す例では、正方形状の上面形状を有するように形成された第１の封止体層５３と、この第１の封止体層５３を部分的に覆うようにして形成された第２の封止体層４４とで封止体４２が形成されており、これによって図６に示した例と同様の効果が奏される。また図７に示す例の発光装置５１は、円形状の上面形状を有するため、図５、図６に示した例の発光装置３１，４１と同様に電球型ＬＥＤランプに特に好適に適用できる。上記第１の封止体層４３、第１の封止体層５３は第１の蛍光体を含有し、第２の封止体層４４は第２の蛍光体を含有する。   FIG. 7 is a top view of a light emitting device 51 according to a preferred fifth example of the present invention. In the light emitting device 51 of the example illustrated in FIG. 7, the upper surface shape of the sealing body 52 (first sealing body layer 53) is a square shape, and the second sealing body layer 44 is the first sealing body layer. 5 has the same configuration as that of the light emitting device 31 of the example shown in FIG. 5 except that it is formed so as to cover only a part of the upper surface of 53, and the portions having the same configuration are the same. A description is omitted with reference marks. By realizing the sealing body 52 (first sealing body layer 53) to have a square upper surface shape like the light emitting device 51 of the example shown in FIG. 7, a fixing hole and an external wiring, which will be described later, are realized. There is an advantage that a region where a hole or the like can be formed can be secured. Further, in the example shown in FIG. 7, the first sealing body layer 53 formed so as to have a square top surface shape and the first sealing body layer 53 are partially covered. The sealing body 42 is formed with the second sealing body layer 44, and thereby the same effect as the example shown in FIG. 6 is exhibited. Further, since the light emitting device 51 of the example shown in FIG. 7 has a circular upper surface shape, the light emitting device 51 can be particularly suitably applied to the light bulb type LED lamp, similarly to the light emitting devices 31 and 41 of the examples shown in FIGS. The first sealing body layer 43 and the first sealing body layer 53 contain a first phosphor, and the second sealing body layer 44 contains a second phosphor.

本発明の発光装置は、製造方法が容易で、色ズレが発生しにくい発光装置が提供でき、このことから、液晶ディスプレイのバックライト光源または照明用光源に特に好適に用いられる。本発明の発光装置を用いることで、白色を含め電球色など任意の色調の上記光源を実現できる。   The light-emitting device of the present invention can provide a light-emitting device that is easy to manufacture and is less likely to cause color misregistration, and is therefore particularly suitable for a backlight light source or an illumination light source for a liquid crystal display. By using the light emitting device of the present invention, the light source having an arbitrary color tone such as a light bulb color including white can be realized.

本発明の発光装置は、通常、上述した用途に供するために、相手部材に取り付け、固定するための固定用穴を有する。図１および図４に示した正方形状の上面形状を有する発光装置１，２１では、正方形状の上面形状を有する絶縁基板３の対向する角部に、絶縁基板３を貫通するように設けられた固定用穴１１が対角線上に配置されて１つずつ形成された場合を示している。また、図５〜図７に示した円形状の上面形状を有する発光装置３１，４１，５１では、切り欠き状の固定用穴３４が、円形状の上面形状を有する絶縁基板３２の中心を通る直線上に配置されて１つずつ形成された例を示している。   The light-emitting device of the present invention usually has a fixing hole for attaching and fixing to a counterpart member in order to provide the above-described use. In the light emitting devices 1 and 21 having a square top surface shape shown in FIGS. 1 and 4, the light emitting devices 1 and 21 are provided so as to penetrate through the insulating substrate 3 at opposite corners of the insulating substrate 3 having a square top surface shape. The case where the fixing holes 11 are arranged diagonally and formed one by one is shown. Further, in the light emitting devices 31, 41, 51 having the circular upper surface shape shown in FIGS. 5 to 7, the notch-shaped fixing hole 34 passes through the center of the insulating substrate 32 having the circular upper surface shape. An example is shown in which they are arranged on a straight line and formed one by one.

また本発明の発光装置は、上述した用途に供するために、固定用冶具を用いて相手部材に取り付けられ、固定される。この固定用冶具としては、たとえば図１および図４に示す固定用冶具１９のように、内壁にネジ山が形成された固定用穴１１に挿入され、螺合するネジなどが挙げられる。また固定用冶具は、接着シートなどであってもよい。   Moreover, in order to use for the use mentioned above, the light-emitting device of this invention is attached and fixed to a counterpart member using a fixing jig. Examples of the fixing jig include a screw that is inserted into the fixing hole 11 having a thread formed on the inner wall and screwed therein, as in the fixing jig 19 shown in FIGS. 1 and 4. The fixing jig may be an adhesive sheet.

本発明の発光装置においては、絶縁基板と同じ材料で形成された固定用冶具を用いて固定されてなることが好ましい。絶縁基板と同じ材料で形成された固定用冶具を用いることで、絶縁基板と固定用冶具との熱膨張率を同じにすることができ、熱による反りなどで基板に割れ、ヒビは発生することを低減でき、発光装置の歩留りを向上することができる。具体的には、酸化アルミニウム、窒化アルミニウム、ボロンナイトライド、窒化ケイ素、酸化マグネシウム、フォルステライト、ステアタイト、低温焼結セラミックから選ばれるいずれか、または、これらの複合材料で形成された固定用冶具を、絶縁基板の形成材料に合わせて好適に用いることができる。   In the light emitting device of the present invention, it is preferable that the light emitting device is fixed using a fixing jig formed of the same material as the insulating substrate. By using a fixing jig made of the same material as the insulating substrate, the thermal expansion coefficient of the insulating substrate and the fixing jig can be made the same, and the substrate can be cracked and cracked due to heat warpage. And the yield of the light emitting device can be improved. Specifically, a fixing jig formed of any one selected from aluminum oxide, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite, steatite, low-temperature sintered ceramic, or a composite material thereof. Can be suitably used according to the forming material of the insulating substrate.

ここで、図８〜図１０には、本発明の発光装置を照明用光源として適用した例をそれぞれ示している。図８は、図１に示した例の発光装置１を蛍光灯型ＬＥＤランプ６１に適用した場合を示す斜視図であり、図９は、図６に示した例の発光装置４１を蛍光灯型ＬＥＤランプ７１に適用した場合（第１の蛍光体層４３を部分的に覆う第２の蛍光体層４４については省略している）を示す斜視図であり、図１０は、図６に示した例の発光装置４１を電球型ＬＥＤランプ８１に適用した場合を示す断面図である。図８〜図１０に示すように、発光装置１，４１は、それぞれ固定用穴１１，３４で、固定用冶具１９を用いて取り付けられ、固定される。   Here, FIGS. 8 to 10 show examples in which the light-emitting device of the present invention is applied as a light source for illumination. FIG. 8 is a perspective view showing a case where the light emitting device 1 of the example shown in FIG. 1 is applied to a fluorescent lamp type LED lamp 61. FIG. 9 shows a light emitting device 41 of the example shown in FIG. FIG. 10 is a perspective view showing a case where the present invention is applied to an LED lamp 71 (the second phosphor layer 44 partially covering the first phosphor layer 43 is omitted), and FIG. 10 is shown in FIG. It is sectional drawing which shows the case where the light-emitting device 41 of an example is applied to the light bulb type LED lamp 81. As shown in FIGS. 8 to 10, the light emitting devices 1 and 41 are attached and fixed using fixing jigs 19 in the fixing holes 11 and 34, respectively.

なお、本発明の発光装置は、図１、図４〜図７にそれぞれ示されているように、絶縁基板３，３２上に、正電極外部接続ランド１２および負電極外部接続ランド１３が直接設けられ、この正電極外部接続ランド１２および負電極外部接続ランド１３と電源（図示せず）との間をそれぞれ電気的に接続するための外部接続配線１４が設けられてなることが好ましい。   In the light emitting device of the present invention, as shown in FIGS. 1 and 4 to 7, the positive electrode external connection land 12 and the negative electrode external connection land 13 are directly provided on the insulating substrates 3 and 32. It is preferable that an external connection wiring 14 for electrically connecting the positive electrode external connection land 12 and the negative electrode external connection land 13 and a power source (not shown) is provided.

また本発明の発光装置は、図１、図４〜図７にそれぞれ示されているように、絶縁基板３，３２に、外部接続配線１４を通すための外部配線用穴１５が形成されてなることが好ましい。図１および図４に示す例では、正方形状の上面形状を有する絶縁基板３に、上述した固定用穴１１が設けられている対角線上とは異なるもう１つの対角線上に配置されるように正電極外部接続ランド１２および負電極外部接続ランド１３が設けられており、さらに絶縁基板３の対向する２つの辺の中央付近に切り欠き状の外部配線用穴１５が形成されている。また、図５〜図７に示す例では、円形状の上面形状を有する絶縁基板３２上に、上述したように固定用穴３４が形成された中心を通る直線上に概ね垂直な中心を通る直線上に、切り欠き状の外部配線用穴１５が形成され、この固定用穴３４と外部配線用穴１５との間に、対向して正電極外部接続ランド１２および負電極外部接続ランド１３が設けられている。なお、図４〜図７に示す例のように円形状の上面形状を有する絶縁基板３２に固定用穴３４および外部配線用穴１５を切り欠き状に形成した場合には、相手部材に取り付けられた状態で、発光装置が周方向に回るのを防止する、回り止めの役割も果たす。   Further, the light emitting device of the present invention is formed by forming external wiring holes 15 through the insulating substrates 3 and 32 in the insulating substrates 3 and 32 as shown in FIGS. 1 and 4 to 7 respectively. It is preferable. In the example shown in FIGS. 1 and 4, the insulating substrate 3 having a square top surface shape is arranged so as to be arranged on another diagonal line different from the diagonal line provided with the fixing holes 11 described above. An electrode external connection land 12 and a negative electrode external connection land 13 are provided, and a notched external wiring hole 15 is formed in the vicinity of the center of two opposing sides of the insulating substrate 3. In the example shown in FIGS. 5 to 7, a straight line that passes through a substantially vertical center on a straight line that passes through the center where the fixing hole 34 is formed on the insulating substrate 32 having a circular upper surface shape as described above. A notch-like external wiring hole 15 is formed thereon, and a positive electrode external connection land 12 and a negative electrode external connection land 13 are provided oppositely between the fixing hole 34 and the external wiring hole 15. It has been. 4 to 7, when the fixing hole 34 and the external wiring hole 15 are formed in a cutout shape in the insulating substrate 32 having a circular upper surface shape, it is attached to the mating member. In this state, it also serves as a detent that prevents the light emitting device from rotating in the circumferential direction.

また、本発明の発光装置は、図３に示すように、絶縁基板３上に、配線パターン４の一端と正電極外部接続ランド１２および負電極外部接続ランド１３との間を電気的に接続するための外部引き出し配線パターン１６，１７がさらに形成されていることが好ましい。このような外部引き出し配線パターン１６，１７により、電源（図示せず）と配線パターン４との間を、正電極外部接続ランド１２および外部引き出し配線パターン１６、負電極外部接続ランド１３および外部引き出し配線パターン１７をそれぞれ介して、電気的に接続することができる。   Further, as shown in FIG. 3, the light emitting device of the present invention electrically connects one end of the wiring pattern 4 to the positive electrode external connection land 12 and the negative electrode external connection land 13 on the insulating substrate 3. Preferably, external lead wiring patterns 16 and 17 are further formed. With such external lead wiring patterns 16 and 17, a positive electrode external connection land 12, an external lead wiring pattern 16, a negative electrode external connection land 13, and an external lead wiring are provided between a power source (not shown) and the wiring pattern 4. Electrical connection can be made via the patterns 17.

さらに本発明の発光装置は、絶縁基板上に、検査用のパターンがさらに形成されてなるのが好ましい。図３には、配線パターン４ａと配線パターン４ｂとの間、配線パターン４ｃと配線パターン４ｄとの間にそれぞれスポット状の検査用のパターン１８が形成された例を示している。このような検査用のパターン１８が絶縁基板３上に形成されていることで、配線パターン４ａと配線パターン４ｂとの間、配線パターン４ｂと配線パターン４ｃとの間および配線パターン４ｃと配線パターン４ｄとの間の導通の検査を検査用のパターン１８を介して容易に行うことができるようになる。また、この検査用のパターン１８は、ダイボンド、ワイヤボンディングを自動化装置で行う際の認識パターンとしても用いることができる。なお、検査用のパターンは、図３に示したようなスポット状に限定されるものではなく、配線パターン４ｂと配線パターン４ｃとそれぞれ電気的に繋がっておりプローブを当てられる大きさのパターンにて実現されてもよい。   In the light emitting device of the present invention, it is preferable that an inspection pattern is further formed on the insulating substrate. FIG. 3 shows an example in which spot-shaped inspection patterns 18 are formed between the wiring patterns 4a and 4b and between the wiring patterns 4c and 4d. Since the inspection pattern 18 is formed on the insulating substrate 3, the wiring pattern 4a and the wiring pattern 4b, the wiring pattern 4b and the wiring pattern 4c, and the wiring pattern 4c and the wiring pattern 4d are formed. Can be easily inspected through the inspection pattern 18. The inspection pattern 18 can also be used as a recognition pattern when die bonding and wire bonding are performed by an automated apparatus. Note that the pattern for inspection is not limited to the spot shape as shown in FIG. 3, but is a pattern that is electrically connected to the wiring pattern 4b and the wiring pattern 4c and can be applied to the probe. It may be realized.

本発明はまた、発光装置の製造方法についても提供する。上述してきた本発明の発光装置は、その製造方法については特に制限されるものではないが、本発明の発光装置の製造方法を適用することで好適に製造することができる。本発明の発光装置の製造方法は、絶縁基板上に複数の配線パターンを形成する工程と、配線パターン間に複数個の発光素子を搭載する工程と、発光素子と配線パターンとを電気的に接続する工程と、貫通孔を有するシリコーンゴムシートを絶縁基板上に載置する工程と、シリコーンゴムシートの貫通孔内に、発光素子を封止する封止体を形成する工程とを基本的に含む。ここで、図１１は、本発明の発光装置の製造方法の好ましい一例として、図１に示した発光装置１を製造する場合を段階的に示す図である。以下、図１１を参照して、本発明の発光装置の製造方法について具体的に説明する。   The present invention also provides a method for manufacturing a light emitting device. The manufacturing method of the light emitting device of the present invention described above is not particularly limited, but can be preferably manufactured by applying the manufacturing method of the light emitting device of the present invention. The method for manufacturing a light emitting device of the present invention includes a step of forming a plurality of wiring patterns on an insulating substrate, a step of mounting a plurality of light emitting elements between the wiring patterns, and electrically connecting the light emitting elements and the wiring pattern. And a step of placing a silicone rubber sheet having a through hole on the insulating substrate, and a step of forming a sealing body for sealing the light emitting element in the through hole of the silicone rubber sheet. . Here, FIG. 11 is a diagram showing step by step a case where the light emitting device 1 shown in FIG. 1 is manufactured as a preferred example of the method for manufacturing the light emitting device of the present invention. Hereinafter, with reference to FIG. 11, the manufacturing method of the light-emitting device of this invention is demonstrated concretely.

まず、図１１（ａ）に示すように、絶縁基板３上に、配線パターン４を形成する。上述したように図１１は図１に示した発光装置１を製造する場合であるので、配線パターン４として、４つの直線状の配線パターン４ａ，４ｂ，４ｃ，４ｄを平行に配置して絶縁基板３上に形成する。好適な具体例として、厚み１ｍｍの酸化アルミニウムで形成された白色の絶縁基板３上に、厚み０．０７ｍｍの金膜をスパッタリング法を用いて形成した後、フォトエッチング法にて配線パターン４ａ，４ｂ，４ｃ，４ｄ（幅１ｍｍ、間隔２ｍｍ）を形成する場合が挙げられるが、これに限定されるものではない。なお、上述したように発光素子との間の電気的接続の位置決め用または発光素子の搭載位置の目安用のパターン７として直線から外側に膨らんだパターン、外部引き出し配線パターン１６，１７、検査用のパターンを形成する場合には、所望のパターンとなるように設計してフォトエッチングを行えばよい。   First, as shown in FIG. 11A, the wiring pattern 4 is formed on the insulating substrate 3. As described above, FIG. 11 shows a case where the light emitting device 1 shown in FIG. 1 is manufactured. As the wiring pattern 4, four linear wiring patterns 4a, 4b, 4c and 4d are arranged in parallel to each other. 3 is formed. As a preferred specific example, a gold film having a thickness of 0.07 mm is formed on a white insulating substrate 3 made of aluminum oxide having a thickness of 1 mm using a sputtering method, and then the wiring patterns 4a and 4b are formed by a photoetching method. , 4c, 4d (width 1 mm, interval 2 mm), but is not limited thereto. As described above, as a pattern 7 for positioning the electrical connection with the light emitting element or as a guide 7 for the mounting position of the light emitting element, a pattern bulging outward from the straight line, external lead wiring patterns 16 and 17, and for inspection In the case of forming a pattern, the photo-etching may be performed by designing the pattern so as to be a desired pattern.

次に、図１１（ｂ）に示すように、配線パターン４間に発光素子５を搭載する。ここで、発光素子５の搭載は、たとえばエポキシ樹脂、アクリル樹脂、イミド樹脂などの熱硬化性樹脂を用いて発光素子５を絶縁基板３に直に接着することで行うことができる。そうすることにより、沿面放電電圧で決まる絶縁耐圧をできる限り高くすることができる。すなわち、電極方向に配列された発光素子と発光素子との間の絶縁耐圧は発光素子間の距離と絶縁基板の誘電率で決まり、発光素子と電極との間の絶縁耐圧も同様に発光素子と電極との最短距離と絶縁基板の誘電率で決まる。好適な具体例としては、絶縁基板３上に平行に形成された直線状の配線パターン４ａ，４ｂ，４ｃ，４ｄのそれぞれの間に、発光素子５として短辺幅０．２４ｍｍ、長辺０．４８ｍｍ、厚み０．１４ｍｍのＬＥＤチップをエポキシ樹脂を用いて接着し、固定する場合が挙げられるが、これに限定されるものではない。その後、図１１（ｂ）に示すように、所望の電気的接続の状態に応じて、配線パターン４と発光素子５とをワイヤボンディングＷを用いて電気的に接続する。   Next, as shown in FIG. 11B, the light emitting element 5 is mounted between the wiring patterns 4. Here, the light emitting element 5 can be mounted by directly bonding the light emitting element 5 to the insulating substrate 3 using a thermosetting resin such as an epoxy resin, an acrylic resin, or an imide resin. By doing so, the withstand voltage determined by the creeping discharge voltage can be made as high as possible. That is, the withstand voltage between the light emitting elements arranged in the electrode direction is determined by the distance between the light emitting elements and the dielectric constant of the insulating substrate, and the withstand voltage between the light emitting elements and the electrodes is also the same as that of the light emitting elements. It is determined by the shortest distance to the electrode and the dielectric constant of the insulating substrate. As a preferred specific example, the light-emitting element 5 has a short side width of 0.24 mm and a long side of 0.2 mm between the linear wiring patterns 4 a, 4 b, 4 c and 4 d formed in parallel on the insulating substrate 3. Although the case where the LED chip of 48 mm and thickness 0.14 mm is adhere | attached and fixed using an epoxy resin is mentioned, it is not limited to this. Thereafter, as shown in FIG. 11B, the wiring pattern 4 and the light emitting element 5 are electrically connected using wire bonding W according to a desired electrical connection state.

なお、本発明の発光装置の製造方法では、上述のように発光素子と配線パターンとを電気的に接続した後に、発光素子の特性を検査する工程と、検査の結果、特性不良があった場合に、予備の発光素子を配線パターンと接続する工程とをさらに含むことが好ましい。この検査は、たとえば発光素子に電流を流し、その光出力特性を測定することで行なうことができる。また、外観検査としてボンディングワイヤＷの断線、ボンディング不良も併せて行なうようにしてもよい。   In the method for manufacturing a light emitting device according to the present invention, after the light emitting element and the wiring pattern are electrically connected as described above, the characteristics of the light emitting element are inspected. It is preferable that the method further includes a step of connecting the spare light emitting element to the wiring pattern. This inspection can be performed, for example, by passing a current through the light emitting element and measuring its light output characteristics. Further, as an appearance inspection, disconnection of the bonding wire W and bonding failure may be performed together.

次に、図１１（ｃ）に示すように、貫通孔９２を有するシリコーンゴムシート９１を絶縁基板３上に載置する。ここで、図１２は、本発明の発光装置の製造方法において用いられる、好ましい一例のシリコーンゴムシート９１を模式的に示す図である。本発明の製造方法に用いるシリコーンゴムシートは、封止体を形成するための空間となる貫通孔を有するものを用いるが、この貫通孔の形状については特に制限されるものではなく、形成しようとする封止体の上面形状に応じた形状のものを用いることができる。上述したように、封止体は、六角形状、円形状、長方形状または正方形状の上面形状を有することが好ましいため、シリコーンゴムシート９１の貫通孔は、六角形状、円形状、長方形状または正方形状の上面形状を有することが好ましい。図１２には、一例として、長方形状の上面形状を有する貫通孔９２を有するシリコーンゴムシート９１を示している。なお、上述したような貫通孔９２を有するシリコーンゴムシート９１は、絶縁基板上の直線状の配線パターンおよび発光素子の全てを１つの封止体で封止する場合に特に好適に用いることができるが、直線状の配線パターン４に沿って両側に搭載された発光素子５を含むように直線状の封止体を複数形成する場合には、対応する複数個の所望の形状の貫通孔を有するシリコーンゴムシートを用いるようにすればよい。   Next, as shown in FIG. 11C, a silicone rubber sheet 91 having a through hole 92 is placed on the insulating substrate 3. Here, FIG. 12 is a view schematically showing a preferred example of the silicone rubber sheet 91 used in the method for manufacturing a light emitting device of the present invention. The silicone rubber sheet used in the production method of the present invention has a through hole that becomes a space for forming a sealing body. However, the shape of the through hole is not particularly limited, and is intended to be formed. The thing of the shape according to the upper surface shape of the sealing body to be used can be used. As described above, since the sealing body preferably has a hexagonal shape, a circular shape, a rectangular shape, or a square shape, the through hole of the silicone rubber sheet 91 has a hexagonal shape, a circular shape, a rectangular shape, or a square shape. It is preferable to have an upper surface shape. FIG. 12 shows a silicone rubber sheet 91 having a through hole 92 having a rectangular upper surface shape as an example. Note that the silicone rubber sheet 91 having the through-hole 92 as described above can be used particularly suitably when all of the linear wiring pattern and the light emitting element on the insulating substrate are sealed with one sealing body. However, when a plurality of linear sealing bodies are formed so as to include the light emitting elements 5 mounted on both sides along the linear wiring pattern 4, a plurality of corresponding through holes having a desired shape are provided. A silicone rubber sheet may be used.

シリコーンゴムシート９１は、容易に入手可能であり、ゴム製であるため弾性を有し、配線パターンなどの段差があっても隙間なく密着させて設けることができ、好ましい。また、シリコーンゴムシート９１には、絶縁基板３に設けた状態では後述する封止体形成用の樹脂の漏れを防ぐことができ、また、封止体形成後に容易に除去できることから、一面に両面接着シートを接着しておき、この接着シートで絶縁基板３に接着させるようにすることが好ましい。   The silicone rubber sheet 91 is preferable because it is easily available and has elasticity because it is made of rubber, and can be provided in close contact with a gap such as a wiring pattern without gaps. In addition, the silicone rubber sheet 91 can prevent leakage of a resin for forming a sealing body, which will be described later, in a state of being provided on the insulating substrate 3, and can be easily removed after the sealing body is formed. It is preferable that an adhesive sheet is bonded, and the adhesive sheet is bonded to the insulating substrate 3 with this adhesive sheet.

本発明の発光装置の製造方法に用いるシリコーンゴムシートは、その厚みが、形成する第１の封止体層の厚みの２倍以上であることが好ましい。シリコーンゴムシートが、第１の封止体層の厚みの２倍以上の厚みを有することで、色度ズレを修正するために２度塗りができ、封止材料の漏れを防止できるという利点がある。   The thickness of the silicone rubber sheet used in the method for manufacturing a light emitting device of the present invention is preferably at least twice the thickness of the first encapsulant layer to be formed. Since the silicone rubber sheet has a thickness that is twice or more the thickness of the first sealing body layer, the silicone rubber sheet can be applied twice to correct the chromaticity deviation, thereby preventing the leakage of the sealing material. is there.

次に、図１１（ｄ）に示すように、シリコーンゴムシート９１の貫通孔９２内に、発光素子５を封止する封止体６を形成する。ここで、封止体６には、上述のように蛍光体を含有させることが、好ましい。また、封止体６は単層、二層のいずれの形態で形成するようにしてもよい（図１１は、図１に示した発光装置１を製造する場合であるため、第１の蛍光体を含有する第１の封止体層８と、第２の蛍光体を含有する第２の封止体層９とを有するように封止体６を形成する場合を示している。   Next, as illustrated in FIG. 11D, a sealing body 6 that seals the light emitting element 5 is formed in the through hole 92 of the silicone rubber sheet 91. Here, the sealing body 6 preferably contains a phosphor as described above. The sealing body 6 may be formed in either a single layer or a double layer (FIG. 11 shows the case where the light emitting device 1 shown in FIG. The case where the sealing body 6 is formed so as to have the first sealing body layer 8 containing the second sealing body layer 9 containing the second phosphor is shown.

本発明の発光装置の製造方法におけるこの封止体で発光素子を封止する工程は、シリコーンゴムシートの貫通孔内に第１の蛍光体を含有する封止材料を注入する工程と、第１の蛍光体を含有する樹脂を硬化させて第１の封止体層を形成する工程と、第１の封止体層形成後の発光装置の色度特性を測定する工程とを含むことが、好ましい。   The step of sealing the light emitting element with this sealing body in the method for manufacturing the light emitting device of the present invention includes the step of injecting a sealing material containing the first phosphor into the through hole of the silicone rubber sheet, Including a step of curing the resin containing the phosphor and forming the first encapsulant layer, and a step of measuring the chromaticity characteristics of the light emitting device after the formation of the first encapsulant layer. preferable.

この場合、まず、シリコーンゴムシート９１の貫通孔９２内に第１の蛍光体を含有する封止材料を注入する。ここで、封止材料としては、上述したようにたとえば、エポキシ樹脂、ユリア樹脂、シリコーン樹脂などの耐候性に優れた透光性樹脂材料、耐光性に優れたシリカゾル、硝子などの透光性無機材料が好適に用いられる。また、第１の蛍光体としては、上述したようにたとえば、Ｃｅ：ＹＡＧ蛍光体、Ｅｕ：ＢＯＳＥあるいはＥｕ：ＳＯＳＥ蛍光体、ユーロピウム賦活αサイアロン蛍光体などを好適に用いることができる。また、封止材料には上述した拡散剤が添加されていてもよい。   In this case, first, a sealing material containing the first phosphor is injected into the through hole 92 of the silicone rubber sheet 91. Here, as the sealing material, for example, as described above, a light-transmitting resin material having excellent weather resistance such as epoxy resin, urea resin, and silicone resin, silica sol having excellent light resistance, and light-transmitting inorganic material such as glass. Materials are preferably used. Further, as described above, for example, Ce: YAG phosphor, Eu: BOSE or Eu: SOSE phosphor, europium activated α sialon phosphor, etc. can be suitably used as the first phosphor. Moreover, the diffusion agent mentioned above may be added to the sealing material.

次に、シリコーンゴムシート９１の貫通孔９２内に注入された第１の蛍光体を含有する封止材料を硬化させる。封止材料を硬化させる方法としては、用いる封止材料に応じて従来公知の適宜の方法を特に制限されることなく用いることができる。たとえば封止材料として透光性樹脂材料であるシリコーン樹脂を用いる場合には、シリコーン樹脂を熱硬化させることで、封止材料を硬化させることができる。なお、封止材料としてモールド用の樹脂を用い、金型を用いて封止材料を硬化させるようにしてもよい。封止材料の硬化により形成される封止体（第１の封止体層）の形状は特にされるものではなく、たとえば上方に凸となる半球状の形状に封止体を形成することで、封止体にレンズとしての機能を持たせるようにしてもよい。   Next, the sealing material containing the first phosphor injected into the through hole 92 of the silicone rubber sheet 91 is cured. As a method for curing the sealing material, a conventionally known appropriate method can be used without particular limitation depending on the sealing material to be used. For example, when a silicone resin that is a translucent resin material is used as the sealing material, the sealing material can be cured by thermosetting the silicone resin. Note that a molding resin may be used as the sealing material, and the sealing material may be cured using a mold. The shape of the sealing body (first sealing body layer) formed by curing the sealing material is not particularly limited. For example, by forming the sealing body into a hemispherical shape that protrudes upward. The sealing body may have a function as a lens.

次に、上述のようにして第１の封止体層を形成した後の発光装置の色度特性を測定する。ここで、図１３はＣＩＥの色度座標を示すグラフである。発光装置の色度特性は、ＪＩＳ２８７２２の条件Ｃ，ＤＩＮ５０３３ｔｅｉｌ７、ＩＳＯｋ７７２４１１に準拠のｄ・８（拡散照明・８°受光方式）光学系を採用した測定装置を用いて測定することができる。たとえば、ＣＩＥの色度表でｘ、ｙ＝（０．３２５、０．３３５）となる光を発するように、第１の蛍光体と封止材料であるシリコーン樹脂とを５：１００の重量比で混合したものをシリコーンゴムシート９１の貫通孔９２内に注入し、１５０℃の温度で３０分間熱硬化させて第１の封止体層を形成した場合、形成された第１の封止体層の色度範囲は、図１３中の（ａ）の領域内となる。このような第１の封止体層を有する発光装置について色度特性を測定する場合には、色度範囲は図１３中の（ｂ）の領域から外れてしまう。このような場合には、発光装置の色度範囲が図１３中の（ｂ）の領域内となるように、第１の封止体層上に第２の封止体層を形成する。   Next, the chromaticity characteristics of the light emitting device after forming the first sealing body layer as described above are measured. Here, FIG. 13 is a graph showing CIE chromaticity coordinates. The chromaticity characteristics of the light emitting device can be measured by using a measuring device employing a d · 8 (diffuse illumination · 8 ° light receiving method) optical system in accordance with JIS 28722, Condition C, DIN5033tail7 and ISOk772411. For example, the weight ratio of the first phosphor and the silicone resin as the sealing material is 5: 100 so as to emit light with x, y = (0.325, 0.335) in the CIE chromaticity table. When the first sealing body layer is formed by injecting the mixture in the through hole 92 of the silicone rubber sheet 91 and thermosetting at a temperature of 150 ° C. for 30 minutes to form the first sealing body. The chromaticity range of the layer is within the region (a) in FIG. When measuring the chromaticity characteristics of the light emitting device having such a first sealing body layer, the chromaticity range is out of the region (b) in FIG. In such a case, the second sealing body layer is formed on the first sealing body layer so that the chromaticity range of the light emitting device is in the region (b) in FIG.

第２の封止体層を形成する場合、本発明の発光装置の製造方法は、上述した第１の封止体層形成後の発光装置の色度特性を測定する工程の後に、第１の封止体層上に、第２の蛍光体を含有する封止材料を注入する工程と、第２の蛍光体を含有する封止材料を硬化させて第２の封止体層を形成する工程と、第２の封止体層形成後の発光装置の色度特性を測定する工程と、シリコーンゴムシートを除去する工程とをさらに含むことが好ましい。すなわち、上述した第１の封止体層を形成する各工程と同様にして、まず、第１の封止体層上に第２の蛍光体を含有する封止材料を注入し、硬化させて、第２の封止体層を形成する。第２の封止体層を形成するための第２の蛍光体および封止材料は、上述した第１の封止体層を形成するための第１の蛍光体および封止材料のうち、所望される色度特性に応じて適宜選択し、場合によっては拡散剤をさらに添加して用いることができる。上述した例の場合には、ＣＩＥの色度表でｘ、ｙ＝（０．３４５、０．３５）となる光が得られるように、たとえば第２の蛍光体と封止材料であるシリコーン樹脂とを２：１００の重量比で混合して第１の封止体層上に注入し、１５０℃で１時間熱硬化させて第２の封止体層を形成する。そうすることで、第２の封止体層を形成した後、発光装置の色度特性を同様に測定した場合には、図１３中の（ｂ）の領域内の色度範囲の発光装置を得ることができる。   In the case of forming the second encapsulant layer, the method for manufacturing the light emitting device of the present invention includes the first method after the step of measuring the chromaticity characteristics of the light emitting device after the formation of the first encapsulant layer described above. A step of injecting a sealing material containing a second phosphor on the sealing body layer, and a step of forming a second sealing body layer by curing the sealing material containing the second phosphor. Preferably, the method further includes a step of measuring chromaticity characteristics of the light emitting device after the formation of the second sealing body layer and a step of removing the silicone rubber sheet. That is, in the same manner as each step of forming the first sealing body layer described above, first, a sealing material containing the second phosphor is injected onto the first sealing body layer and cured. Then, a second encapsulant layer is formed. The second phosphor and the sealing material for forming the second sealing body layer are preferably selected from the first phosphor and the sealing material for forming the first sealing body layer described above. Depending on the chromaticity characteristics to be obtained, it is appropriately selected, and in some cases, a diffusing agent can be further added and used. In the case of the above-described example, for example, the second phosphor and a silicone resin that is a sealing material so that light with x, y = (0.345, 0.35) is obtained in the CIE chromaticity table. Are mixed at a weight ratio of 2: 100 and injected onto the first encapsulant layer and thermally cured at 150 ° C. for 1 hour to form a second encapsulant layer. By doing so, when the chromaticity characteristics of the light emitting device are similarly measured after forming the second sealing body layer, the light emitting device in the chromaticity range in the region (b) in FIG. Obtainable.

このように、本発明の発光装置の製造方法では、必要に応じて第２の封止体層をさらに形成するようにすることで、色度ズレのない発光装置を、歩留りよく安価に製造することができるようになる。なお、上述したように、第２の封止体層は第１の封止体層の上面の少なくとも一部を覆うように形成すればよく、第１の封止体層の上面の全面を覆うように形成されてもよいし（たとえば、図１、図４、図５に示した例）、第１の封止体層の上面を部分的に覆うように形成されてもよい（たとえば、図６、図７に示した例）。   As described above, in the method for manufacturing a light-emitting device of the present invention, a second encapsulant layer is further formed as necessary, whereby a light-emitting device free from chromaticity deviation is manufactured at a low yield with a low yield. Will be able to. As described above, the second sealing body layer may be formed so as to cover at least part of the upper surface of the first sealing body layer, and covers the entire upper surface of the first sealing body layer. (For example, the example shown in FIGS. 1, 4, and 5), or may be formed so as to partially cover the upper surface of the first sealing body layer (for example, FIG. 6, example shown in FIG.

また、たとえばＣＩＥの色度表でｘ、ｙ＝（０．３２５、０．３３５）となる光を発するように、第１の蛍光体と封止材料であるシリコーン樹脂とを５：８０の重量比で混合したものをシリコーンゴムシート９１の貫通孔９２内に注入し、１２０℃の温度で３０分間熱硬化させて第１の封止体層を形成した場合など、当該第１の封止体層形成後の発光装置の色度特性を測定した際に、色度範囲が図１３中の（ｂ）の領域内となるような場合には、上述したような第２の封止体層をさらに形成する必要はなく、第１の封止体層をそのまま封止体として備える発光装置を製造すればよい。   Further, for example, the first phosphor and the silicone resin as the sealing material have a weight of 5:80 so as to emit light with x, y = (0.325, 0.335) in the CIE chromaticity table. When the first mixture is injected into the through-hole 92 of the silicone rubber sheet 91 and thermally cured at a temperature of 120 ° C. for 30 minutes to form the first encapsulant layer, etc. When the chromaticity range of the light emitting device after layer formation is measured and the chromaticity range is within the region (b) in FIG. 13, the second encapsulant layer as described above is provided. Further, it is not necessary to form the light-emitting device, and a light-emitting device including the first sealing body layer as it is as a sealing body may be manufactured.

本発明の発光装置の製造方法では、上述したように第１の封止体層単独、または、第１の封止体層および第２の封止体層を形成した後に、シリコーンゴムシート９１を取り除き、上述した本発明の発光装置が提供される。上述したように、シリコーンゴムシート９１は一面に両面接着シートを接着しておき、この接着シートで絶縁基板３に接着させるようにしておくことで、容易に除去することができる。なお、シリコーンゴムシートは何度も使用することが可能である。   In the method for manufacturing a light emitting device of the present invention, as described above, after forming the first sealing body layer alone or the first sealing body layer and the second sealing body layer, the silicone rubber sheet 91 is formed. The light emitting device of the present invention described above is provided. As described above, the silicone rubber sheet 91 can be easily removed by adhering a double-sided adhesive sheet on one surface and adhering it to the insulating substrate 3 with this adhesive sheet. The silicone rubber sheet can be used many times.

１，２１，３１，４１，５１ 発光装置、２ 発光部、３，３２ 絶縁基板、４ 位置決め用配線パターン、５ 発光素子、６，２２，３３，４２，５２ 封止体、７ パターン、８，４３，５３ 第１の封止体層、９，４４ 第２の封止体層、１１，３４ 固定用穴、１２ 正電極外部接続ランド、１３ 負電極外部接続ランド、１４ 外部接続配線、１５ 外部配線用穴、１６，１７ 外部引き出し配線パターン、１８ 検査用パターン、１９ 固定冶具、６１，７１ 蛍光灯型ＬＥＤランプ、８１ 電球型ＬＥＤランプ、９１
シリコーンゴムシート、９２ 貫通孔。 1, 21, 31, 41, 51 Light emitting device, 2 Light emitting portion, 3, 32 Insulating substrate, 4 Positioning wiring pattern, 5 Light emitting element, 6, 22, 33, 42, 52 Sealed body, 7 pattern, 8, 43, 53 1st sealing body layer, 9, 44 2nd sealing body layer, 11, 34 Fixing hole, 12 Positive electrode external connection land, 13 Negative electrode external connection land, 14 External connection wiring, 15 External Hole for wiring, 16, 17 External lead wiring pattern, 18 Inspection pattern, 19 Fixing jig, 61, 71 Fluorescent lamp type LED lamp, 81 Light bulb type LED lamp, 91
Silicone rubber sheet, 92 through hole.

Claims (8)

熱伝導性の高い絶縁基板上に発光部が設けられると共に、該発光部を取り囲む領域を有しており、該発光部を取り囲む領域における前記熱伝導性の高い絶縁基板上に正電極外部接続ランドおよび負電極外部接続ランドが設けられた発光装置であって、
前記熱伝導性の高い絶縁基板上に複数の配線パターンが直接形成され、
当該配線パターンは、前記正電極外部接続ランドと電気的に接続されたアノード用配線パターンと前記負電極外部接続ランドと電気的に接続されたカソード用配線パターンを含み、
前記発光部は、複数個の半導体発光素子が前記熱伝導性の高い絶縁基板に接着され、前記複数個の半導体発光素子が１つの封止体で封止されたものであり、
前記半導体発光素子は、半導体ＬＥＤチップであり、
前記正電極外部接続ランドおよび前記負電極外部接続ランドは、前記発光部を挟むように対向して設けられている、発光装置。 A light emitting portion is provided on an insulating substrate having high thermal conductivity, and has a region surrounding the light emitting portion, and a positive electrode external connection land on the insulating substrate having high thermal conductivity in the region surrounding the light emitting portion. And a light emitting device provided with a negative electrode external connection land,
A plurality of wiring patterns are directly formed on the insulating substrate having high thermal conductivity,
The wiring pattern includes an anode wiring pattern electrically connected to the positive electrode external connection land and a cathode wiring pattern electrically connected to the negative electrode external connection land.
The light emitting portion is formed by bonding a plurality of semiconductor light emitting elements to the insulating substrate having high thermal conductivity, and sealing the plurality of semiconductor light emitting elements with one sealing body,
The semiconductor light emitting element is a semiconductor LED chip,
The positive electrode external connection land and the negative electrode external connection land are provided to face each other so as to sandwich the light emitting portion. 前記半導体発光素子同士が直列に電気的に接続されている、請求項１に記載の発光装置。   The light-emitting device according to claim 1, wherein the semiconductor light-emitting elements are electrically connected in series. 前記半導体発光素子同士が並列に電気的に接続されている、請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the semiconductor light emitting elements are electrically connected in parallel. 前記配線パターンが、前記半導体発光素子との間の電気的接続の位置決め用のパターン、または、前記半導体発光素子の搭載位置の目安用のパターンをさらに有する、請求項１〜３のいずれかに記載の発光装置。   The wiring pattern according to any one of claims 1 to 3, wherein the wiring pattern further includes a pattern for positioning electrical connection with the semiconductor light emitting element, or a pattern for indicating a mounting position of the semiconductor light emitting element. Light-emitting device. 前記熱伝導性の高い絶縁基板が白色のセラミック基板である、請求項１〜４のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein the insulating substrate having high thermal conductivity is a white ceramic substrate. 前記白色のセラミック基板が、酸化アルミニウム、窒化アルミニウム、ボロンナイトライド、窒化ケイ素、酸化マグネシウム、フォルステライト、ステアタイト、低温焼結セラミックから選ばれるいずれか、または、これらの複合材料で形成されている、請求項５に記載の発光装置。   The white ceramic substrate is made of any one selected from aluminum oxide, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite, steatite, low-temperature sintered ceramic, or a composite material thereof. The light emitting device according to claim 5. 前記封止体が蛍光体を含有し、前記発光装置が所望の色度の発光をする、請求項１〜６のいずれかに記載の発光装置。   The light emitting device according to claim 1, wherein the sealing body contains a phosphor, and the light emitting device emits light having a desired chromaticity. 液晶ディスプレイのバックライト光源または照明用光源として用いられるものである、請求項１〜７のいずれかに記載の発光装置。   The light emitting device according to any one of claims 1 to 7, which is used as a backlight light source or an illumination light source of a liquid crystal display.
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