JP2011514008A - Wafer inspection system including cooling device - Google Patents

Abstract

  The present invention relates to a wafer inspection system including a wafer prober apparatus having a chuck. The wafer inspection system according to the present invention is a dry air supply apparatus that supplies air by dehumidification and a storage container for storing liquefied gas. Cooling the dry air supplied from the dry air supply device, mixing the cooled dry air with a certain amount of liquefied gas stored in the storage container, and the wafer It is characterized by comprising a central control device which controls to supply to the chuck of the prober device. Thus, the present invention can shorten the preparation time for the ultra-low temperature environment test while having the refrigeration efficiency optimized for the ultra-low temperature environment test of the wafer using the wafer prober device.

Description

  The present invention relates to a wafer inspection system including a cooling device, and more specifically to a wafer inspection system including a cooling device and a wafer prober device so that an ultra-low temperature environment test can be easily performed.

  Conventional wafer prober devices generally include a chuck for transferring a wafer to an appropriate position, an X and Y stage for directly moving the chuck, and a loader unit for placing a wafer loaded on a cassette on the chuck. It is used for the purpose of inspecting electrical defects of individual chips (die) formed on a wafer produced in a semiconductor process.

  In addition, such a wafer prober apparatus should be provided with various apparatuses in order to perform an environmental reliability inspection on the wafer in accordance with the basic inspection as described above.

  In particular, in order to inspect a wafer in an ultra-low temperature environment, a conventional wafer prober apparatus must have a cooling device for cooling the temperature of the wafer.

  This cooling device uses a dual-type and single-stage general-purpose cooler that has been commercially available. However, it is difficult to expect such general-purpose coolers to have specifications and functions optimized for ultra-low temperature environment testing of wafer prober devices.

  Further, this cooling device uses a system in which the liquid coolant cooled by the refrigerant is circulated inside the chuck to cool the wafer temperature.

  However, since the wafer prober apparatus using such a method lowers the chuck temperature by directly using the cooled liquid coolant, the cooling efficiency is excellent. However, when the liquid coolant circulating through the chuck flows out, And the risk of damaging the parts of the wafer prober apparatus.

  One conventional wafer prober apparatus uses a system that uses air instead of a liquid coolant as a fluid circulating in the chuck in order to remove the danger of the conventional system.

  However, such a wafer prober device has a problem that it takes much time to cool the wafer because the specific heat of air is less than that of the liquid coolant.

  In order to reduce the time required for such cooling, it is possible to keep the cooler in an operating state at all times, but it is economically not to operate the cooler continuously only for the cryogenic environment test. Efficient.

  An object of the present invention to solve the above-mentioned problems is to provide a wafer inspection system capable of shortening the preparation time of the ultra-low temperature environment test while having the refrigeration efficiency optimized for the ultra-low temperature environment test of the wafer prober apparatus. is there.

  A feature of the present invention for achieving the above technical problem relates to a wafer inspection system including a wafer prober device having a chuck for placing a wafer, the wafer inspection system being supplied with compressed air. A dry air supply device that dehumidifies and supplies, and a storage container that cools the air supplied from the dry air supply device, supplies the cooled air to the outside, and stores liquefied gas. A cooling device for supplying a liquefied gas stored in a container; a user input unit including a rapid cooling mode key for selecting a rapid cooling mode for rapidly cooling the temperature of the chuck; and the dry air supply device. The cooling device is generally controlled to cool the air supplied from the wafer and supply it to the chuck of the wafer prober device When the quick cooling mode is selected via the rejection mode and the quick cooling mode key, the air supplied from the dry air supply device is cooled, and the cooled air is stored in the storage container. And a central control device that operates in a rapid cooling mode for controlling the cooling device so as to be mixed with a certain amount of liquefied gas and supplied to the chuck of the wafer prober device.

  The wafer prober device includes a cooling channel formed inside the chuck, and the central control unit cools the air supplied from the dry air supply device and supplies the air to the cooling channel. When the rapid cooling mode is selected, the cooling device is controlled so that a certain amount of the liquefied gas stored in the storage container is supplied to the cooling flow path.

  Here, the cooling device includes a general cooling module that cools the air supplied from the dry air supply device, a quick cooling module that includes the storage container and supplies a liquefied gas stored in the storage container, A cooling air supply module that supplies the air cooled by the general cooling module and the liquefied gas supplied by the quick cooling module to the cooling flow path, and the central control unit is connected to the dry air supply device. Control the general cooling module to cool the supplied air and supply it to the cooling air supply module, and supply the cooling air to supply the air supplied by the general cooling module to the cooling channel. When the module is controlled and the rapid cooling mode is selected, a certain amount of the liquefied gas is Controlling the rapid cooling module to provide a retirement air supply module, for controlling the cooling air supply module to supply the supplied liquefied gas to the cooling flow path by the rapid cooling module.

  Further, the temperature control module of the wafer prober apparatus includes a temperature sensor that senses the temperature of the chuck, and the central controller, when the rapid cooling mode is selected through the user input unit, The amount of liquefied gas supplied to the cooling channel is calculated in consideration of the sensed chuck temperature, and the cooling device is controlled to supply the calculated amount of liquefied gas to the cooling channel. To do.

  The user input unit includes a temperature selection key for selecting a temperature of the chuck, and the temperature adjustment module of the wafer prober apparatus includes a heating member for heating (heating) the chuck, When a chuck temperature is selected via the temperature selection key, the central control unit is configured so that the selected chuck temperature and the chuck temperature detected by the temperature sensor coincide with each other. The heating member is controlled.

  The wafer prober device includes a housing for sealing air around the chuck, and an internal air supply module that supplies air that has passed through the cooling flow path to the inside of the housing. The internal air supply module is controlled so that the air that has passed through the cooling flow path is supplied into the housing. The temperature control module includes a dew point detection sensor that detects a dew point temperature of the ambient air of the chuck, and the central control unit detects the chuck temperature detected by the temperature sensor and the dew point detected by the dew point detection sensor. The internal air supply module is controlled so as to adjust the amount of air supplied to the interior of the wafer prober device based on the comparison result by comparing the temperature. Here, the liquefied gas stored in the storage container is preferably liquefied nitrogen.

  As described above, the wafer inspection system according to the present invention is optimized during the ultra-low temperature environment test by implementing the refrigeration apparatus optimized for the wafer prober apparatus that is not a general-purpose cooler with an integrated system. Cooling efficiency can be provided.

  In addition, since the wafer inspection system according to the present invention cools the chuck by using a gas coolant that is not a liquid coolant in the cooling flow path of the chuck, it is possible to reduce the risk associated with the leakage of the liquid coolant.

  In addition, the wafer inspection system according to the present invention implements a rapid cooling mode in which a small amount of liquid nitrogen is jetted and mixed with cooling air, thereby significantly reducing the preparation time for the ultra-low temperature environment test of the wafer. it can.

  In addition, the wafer inspection system according to the present invention sprays the air used to cool the chuck into the housing of the wafer prober device and recycles it, thereby causing condensation to occur inside the housing during the ultra-low temperature environment test. Can be prevented.

1 is a schematic block diagram of a wafer inspection system according to an embodiment of the present invention. It is a schematic block diagram of a wafer inspection system for showing air flow of a wafer inspection system concerning one embodiment of the present invention. It is a control flowchart which shows the process in which the central control apparatus which concerns on one Embodiment of this invention performs a cryogenic environment test. It is a control flowchart which shows the process in which the central control apparatus which concerns on one Embodiment of this invention prevents dew condensation in an ultra-low temperature environment test.

  Hereinafter, the configuration and operation of a wafer inspection system according to an embodiment of the present invention will be specifically described with reference to the accompanying drawings.

  In the wafer inspection system 1 according to an embodiment of the present invention, a wafer prober apparatus 300 capable of roughly testing a wafer temperature environment and a cooling unit for providing the wafer prober apparatus 300 with a low temperature environment are integrated. It is a form. As shown in FIG. 1, a wafer inspection system 1 according to an embodiment includes a dry air supply device 100, a cooling device 200, a wafer prober device 300, a user input unit 400, and a central control device 500. And.

  The wafer prober apparatus 300 according to an embodiment of the present invention operates in two modes for the ultra-low temperature environment test of a wafer. The first operation mode is a general cooling mode that is performed by cooling the air supplied from the dry air supply apparatus 100 and supplying the air to the wafer prober apparatus 300. The second operation mode is the user input unit 400. When the rapid cooling mode is selected, a certain amount of the liquefied gas supplied from the rapid cooling module 230 and the cooling air supplied from the general cooling module 210 are mixed and supplied from the dry air supply device 100. In this rapid cooling mode, the air is cooled and supplied to the wafer prober apparatus 300.

  With reference to FIG.1 and FIG.2, each structure of the wafer inspection system 1 of this embodiment is demonstrated. FIG. 1 is a schematic block diagram of a wafer inspection system 1 according to an embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating an air flow of the wafer inspection system 1 according to an embodiment of the present invention. It is a typical block diagram.

  First, the dry air supply device 100 is a device that is supplied with compressed air, dehumidifies it, and supplies it to the cooling device 200.

  As shown in FIG. 1, the dry air supply device 100 can be composed of an air compressor 120 and an air dryer 110. The air compressor 120 supplies built-in compressed air, and the air dryer 110 plays a role of drying the supplied air. The air dryer 110 dries the supplied air using an adsorbent. Thereby, the dry air supply apparatus 100 can generate | occur | produce dry air of about 20 degreeC.

  Here, the dried air is cooled by the cooling device 200 and used as a medium for lowering the temperature of the chuck 310 provided in the wafer prober device 300.

  The cooling device 200 includes a storage container 231 that cools the air supplied from the dry air supply apparatus 100, supplies the cooled air, and stores the liquefied gas. The liquefied gas stored in the storage container 231 is stored in the cooling apparatus 200. The wafer prober apparatus 300 is supplied under the control of the central controller 500.

  As illustrated in FIG. 1, the cooling device 200 may include a general cooling module 210, a cooling air supply module 220, a quick cooling module 230, and a storage container 231.

  As shown in FIG. 2, the general cooling module 210 can include a refrigerator 211 and a heat exchanger 212, and cools and supplies the air supplied from the dry air supply device 100. Here, as the refrigerator 211, a binary or single-stage refrigerator that can lower the temperature of the refrigerant to −80 ° C. to −90 ° C. or less can be used. The heat exchanger 212 plays a role of cooling the air supplied from the dry air supply apparatus 100 to the heat exchange system using the refrigerant cooled by the refrigerator 211 and supplying the air to the cooling air supply module 220. The heat exchanger 212 can cool the supplied air to about −70 ° C. Since such a refrigerator 211 and a heat exchanger 212 are known techniques, a specific description thereof is omitted.

  The rapid cooling module 230 includes a storage container 231 for storing the liquefied gas therein, and supplies the liquefied gas stored in the storage container 231 to the cooling air supply module 220 under the control of the central controller 500. Here, liquefied nitrogen is generally used as the liquefied gas, and such a storage container 231 is made of a heat-resistant material that can withstand an extremely low temperature (about −190 ° C.) or less.

  The cooling air supply module 220 supplies the air cooled by the general cooling module 210 described above or the liquefied gas supplied by the rapid cooling module 230 to the wafer prober apparatus 300 under the control of the central controller 500.

  The wafer prober apparatus 300 is an apparatus for inspecting whether or not a semiconductor wafer is defective. The wafer prober apparatus 300 includes a chuck 310 for placing a wafer to be inspected, and an X and Y stage unit for moving and fixing the chuck 310. A prober unit (not shown) that provides electrical connection between the wafer (not shown) and the wafer to be inspected and sends and receives electrical signals, and electrical signals sent and received from the prober unit (not shown) A tester (not shown) for performing an inspection suitable for each wafer using a program for inspecting whether or not various wafers are manufactured according to a given specification, and a plurality of wafers are inserted. A loader (not shown) that moves from a cassette (not shown) onto a chuck 310 of a stage unit (not shown). Since such a structure is a well-known technique, detailed description is abbreviate | omitted.

  For convenience, FIG. 2 shows only a partial configuration of the wafer prober apparatus 300. This is because the main object of the present invention is related to the ultra-low temperature environment test.

  The wafer prober apparatus according to an embodiment of the present invention includes a chuck 310, a temperature adjustment module 311, an internal air supply module 320, and a housing 330.

  The chuck 310 is disposed in the housing 330, serves as an arrangement table for arranging and fixing the wafer, and has a cooling flow path 310a formed therein. Here, the chuck 310 also plays a role of transferring heat to the wafer.

  The cooling flow path 310 a is formed so that the cooling air and the liquefied gas supplied from the cooling air supply module 220 of the cooling device 200 pass through the inside of the chuck 310 so as to lower the temperature of the chuck 310. The cooling channel 310a may be formed by various methods so that heat is effectively transferred from the chuck 310.

  The temperature adjustment module 311 adjusts the temperature of the chuck 310, and includes a heating member 311a, a temperature sensor 311b, and a dew point detection sensor 311c.

  The heating member 311a is formed in the lower stage of the cooling channel 310a in order to raise the temperature of the chuck 310, and heat is generated by applying power to the heating member 311a. The central controller 500 controls whether or not power can be applied.

  The temperature sensor 311b senses the temperature of the chuck 310 and transfers it to the central controller 500, and the dew point sensor 311c senses and transfers the dew point temperature around the chuck 310 to the central controller 500.

  The internal air supply module 320 supplies internal air into the housing 330 under the control of the central controller 500. That is, the internal air supply module 320 supplies the air that has passed through the cooling flow path 310 a into the housing 330. Further, the internal air supply module 320 includes a discharge port (not shown) that discharges a part of the air that has passed through the cooling flow path 310 a to the outside of the housing 330 under the control of the central controller 500. Thereby, the amount of air supplied to the inside of the housing 330 can be adjusted.

  The housing 330 provides a sealed space for wafer cryogenic environmental testing. During the ultra-low temperature environment test, the inflow of external air is blocked to prevent condensation on the wafer.

  The user input unit 400 includes a rapid cooling mode key 410 and a temperature selection key 420.

  Here, the rapid cooling mode key 410 is for selecting a rapid cooling mode for rapidly cooling the temperature of the chuck 310. If the user selects the rapid cooling mode key 410, the wafer inspection system of the present embodiment. 1 will operate in a rapid cooling mode. Here, the quick cooling mode key 410 may be provided in various forms such as a button switch and a touch screen on which a user interface is implemented.

  The temperature selection key 420 is used to select the temperature of the chuck 310, and a control signal corresponding to the selected temperature of the chuck 310 is transferred to the central controller 500. Here, the temperature of the chuck 310 is set at about −80 ° C. for the ultra-low temperature environment test of the wafer.

  The central controller 500 includes a low temperature setting module (not shown) and a dew prevention module (not shown) for the ultra-low temperature environment test of the wafer.

  Here, the low temperature setting module (not shown) can be configured again from the quick cooling mode and the general cooling mode.

  That is, the central control device 500 cools the air supplied from the dry air supply device 100 when the rapid cooling mode is not selected via the user input unit 400, that is, in the general cooling mode, The cooling device 200 is controlled so as to be supplied to the chuck 310 of the wafer prober device 300.

  In the general cooling mode, when the refrigerator 211 is operated, the low-temperature side refrigerant is cooled at −80 ° C. to −90 ° C., and the dry air supplied from the dry air supply device 100 via the heat exchanger 212 is The central control device 500 controls the cooling air supply module 220 so that the cooled dry air is supplied to the cooling flow path 310a of the chuck 310 of the prober device 300.

  When the rapid cooling mode is selected via the user input unit 400, that is, when the rapid cooling mode is selected, the central controller 500 determines a certain amount of the liquefied gas stored in the storage container 231 and the general cooling module 210. The cooling device 200 is controlled so as to be mixed with the cooling air supplied from and supplied to the chuck 310 of the wafer prober device 300. Here, liquefied nitrogen is used as the liquefied gas.

  In the rapid cooling mode, the central controller 500 controls the rapid cooling module 230 so that a certain amount of the liquefied gas stored in the storage container 231 is supplied to the cooling air supply module 220. This liquefied gas flows out of the storage container 231 and is mixed with cooling air supplied from the general cooling module 210 while being vaporized. The amount of liquefied gas supplied from the rapid cooling module 230 is smaller than the amount of air supplied from the general cooling module 210. That is, the amount of liquefied gas is about 1/10 of the amount of air.

  Next, the central controller 500 controls the cooling air supply module 220 so that the liquefied gas supplied by the rapid cooling module 230 is supplied to the cooling flow path 310 a of the chuck 310.

  The central controller 500 calculates the amount of liquefied gas to be supplied in consideration of the temperature of the chuck 310 sensed by the temperature sensor 311b of the temperature adjustment module 311. That is, the central controller 500 adjusts the amount of the liquefied gas within the range of about 1/12 to 1/8 of the amount of air in accordance with the sensed temperature of the chuck 310 to the cooling air supply module 220. Supply.

  In addition, when the temperature of the chuck 310 is selected through the temperature selection key 420, the central controller 500 may match the temperature of the selected chuck 310 with the temperature of the chuck 310 sensed by the temperature sensor 311b. Next, the cooling device 200 and the heating member 311a are controlled.

  In order for the central control unit to control the flow of the fluid as described above, the cooling device 200 and the wafer prober device 300 are not shown in FIG. ) Must be provided. The central controller 500 controls the flow of fluid in the cooling device 200 and the wafer prober device 300 by driving the opening / closing member.

  Below, with reference to FIG.3 and FIG.4, the control procedure of the low temperature setting module (not shown) and the dew condensation prevention module (not shown) of the central controller 500 is demonstrated.

  FIG. 3 is a control flowchart illustrating a process in which the central controller 500 performs an ultra-low temperature environment test.

  First, the central controller 500 transmits the temperature set via the temperature selection key 420 and stores it in the memory (S100).

  Here, a case where the set temperature is −60 ° C. will be described as an example. This means that the wafer inspection system 1 starts a −60 ° C. ultra-low temperature environment test on the wafer.

  Next, the central controller 500 receives the current temperature of the chuck 310 and the dew point temperature around the chuck 310 from the temperature adjustment module 311 and stores them in the memory (S110). Such a process is periodically performed to monitor the current state of the chuck 310.

  Next, the central controller 500 controls the cooling device 200 to perform a low temperature setting module (S120). That is, the central controller 500 drives the general cooling module 210 to cool the low temperature side refrigerant of the refrigerator 211 to about −80 ° C. The central controller 500 controls the air cooled via the heat exchanger 212 to cool the air supplied from the dry air supply device 100 to −70 ° C. and supply it to the cooling air supply module 220. To do.

  Further, the central controller 500 performs the above-described step S120 and concurrently performs the control procedure of FIG. The control procedure of FIG. 4 is a control procedure for performing the dew condensation prevention module, and a description thereof will be given later.

  Next, the central controller 500 determines whether or not the quick cooling mode can be selected (S130). This is determined by whether or not the quick cooling mode key 410 can be selected. Here, the rapid cooling mode is again divided into a manual mode and an automatic mode. In FIG. 3, only the automatic mode will be described. The manual mode will be described later.

  Next, if the rapid cooling mode is not selected in step S130, step S150 is performed.

  On the other hand, when the rapid cooling mode is selected in step S130, the central controller 500 calculates the set temperature stored in the steps S100 and S110 and the temperature of the chuck 310, and the difference between the set temperature and the temperature of the chuck 310 is calculated. It is determined whether the temperature is within 5 ° C. (S140).

  Next, when the temperature difference is within 5 ° C. as a result of the determination in step S140, the central controller 500 performs step S150.

  On the other hand, if the result of determination in step S140 is that the temperature difference is greater than 5 ° C., the central controller 500 operates the rapid cooling module 230 (S145). That is, the central controller 500 controls the rapid cooling module 230 so that the supply amount of liquefied nitrogen is increased as the temperature difference is greater than 5 ° C. For example, when the current chuck temperature is sensed at 100 ° C. and the low temperature setting temperature is −60 ° C., the rapid cooling module 230 reduces about 1/8 liquefied nitrogen of the air supplied to the cooling air supply module 220. The cooling air supply module 220 is supplied. When the temperature of the current chuck is −20 ° C., the rapid cooling module 230 reduces the supply amount of liquefied nitrogen to 1/12.

  Here, the amount of liquefied nitrogen with respect to the temperature difference can be stored in a memory in the form of a look-up table or can be calculated in real time by a predetermined calculation formula.

  Next, the central controller 500 supplies the cooling air supplied to the cooling air supply module 220 in the previous step to the cooling flow path 310a of the chuck 310 when the temperature difference is within 5 ° C. as a result of the determination in step S140. (S150).

  Next, the central controller 500 determines whether or not the current temperature of the chuck 310 stored in the steps S100 and S110 is higher than a set temperature (S160).

  Next, when the current temperature of the chuck 310 is higher than the set temperature as a result of the determination in step S160, the central controller 500 returns to step S140.

  On the other hand, if the current temperature of the chuck 310 is lower than the set temperature as a result of the determination in step S160, the central controller 500 drives the heating member 311a and returns to step S160 (S170).

  As described above, when the rapid cooling mode is selected, the central controller 500 can supply liquefied nitrogen to rapidly lower the temperature of the chuck 310, so that the preparation time for the ultra-low temperature environment test of the wafer is remarkably increased. Can be shortened.

  The manual mode will be briefly described separately from the automatic mode of the wafer inspection system according to the embodiment of the present invention described above.

  If the rapid cooling mode is selected via the rapid cooling mode key 410, the central controller 500 recognizes this, and does not consider the current temperature of the chuck 310 and the dew point temperature around the chuck 310 beforehand. The process is terminated after the set sequence is performed. That is, the general cooling module 210 is driven to supply the cooling air to the cooling air supply module 220, which is further supplied to the cooling flow path 310a of the chuck 310. At the same time, the rapid cooling module 230 is operated to supply the cooling air supply module 220 with about 1/10 of the amount of liquefied nitrogen supplied to the cooling air supply module 220. The liquefied nitrogen is vaporized by the air supplied to the cooling air supply module 220 and then supplied to the cooling flow path 310 a of the chuck 310 by the cooling air supply module 220.

  Hereinafter, the dew condensation prevention module (not shown) will be described with reference to FIG.

  FIG. 4 is a control flowchart showing a process in which the central controller 500 prevents condensation during the ultra-low temperature environment test.

  First, the central controller 500 reads the current temperature of the chuck 310 and the dew point temperature around the chuck 310 monitored in step S110, and subtracts the dew point temperature around the chuck 310 from the current temperature of the chuck 310. (S200). That is, it is determined whether the difference between the temperature of the chuck 310 and the dew point temperature around the chuck 310 is within + 10 ° C.

  Next, when the difference between the chuck 310 and the dew point temperature is within + 10 ° C. as a result of the determination in step S200, the central controller 500 supplies all the air that has passed through the cooling flow path 310a to the inside of the housing 330. The internal air supply module 320 is controlled (S210).

  On the other hand, if the difference between the chuck 310 and the dew point temperature is greater than + 10 ° C. as a result of the determination in step S200, 1/2 of the air that has passed through the cooling channel 310a is supplied to the inside of the housing 330, Then, the internal air supply module 320 is controlled so that the discharge port (not shown) is opened and discharged to the outside of the housing 330 (S220).

  As described above, the central controller 500 generates air inside the housing 330 during the ultra-low temperature environment test by injecting and recycling the air used to cool the chuck 310 into the housing 330 of the wafer prober device 300. Condensation can be prevented.

  The wafer inspection system according to the present invention can be effectively used in the fields of semiconductor testing and semiconductor manufacturing.

Claims (8)

In a wafer inspection system including a wafer prober device having a chuck for placing a wafer,
A dry air supply device that supplies compressed air, dehumidifies it, and supplies it to the outside;
A cooling device that cools the air supplied from the dry air supply device, supplies the cooled air, and stores a liquefied gas, and supplies a liquefied gas stored in the storage container; ,
A user input comprising a rapid cooling mode key for selecting a rapid cooling mode for rapidly cooling the temperature of the chuck;
The general cooling mode for controlling the cooling device to cool the air supplied from the dry air supply device and supplying the air to the chuck of the wafer prober device, and the rapid cooling mode via the rapid cooling mode key. When selected, the air supplied from the dry air supply device is cooled, the cooled air is mixed with a certain amount of liquefied gas stored in the storage container, and the chuck of the wafer prober device is mixed. A central controller operating in a rapid cooling mode to control the cooling device to supply;
A wafer inspection system comprising: The wafer prober device comprises a cooling channel formed inside the chuck,
The central control device controls the cooling device to cool the air supplied from the dry air supply device and supply the air to the cooling flow path, and when the rapid cooling mode is selected, the cooling device 2. The cooling device according to claim 1, wherein the cooling device is controlled to mix the air cooled by a certain amount of the liquefied gas stored in the storage container and supply the air to the cooling flow path. Wafer inspection system. The cooling device is
Cooled by the general cooling module that cools the air supplied from the dry air supply device, the quick cooling module that includes the storage container and supplies the liquefied gas stored in the storage container, and the general cooling module A cooling air supply module that supplies air and a liquefied gas supplied by the rapid cooling module to the cooling flow path, and
The central controller is
The general cooling module is controlled so that the air supplied from the dry air supply device is cooled and supplied to the cooling air supply module, and the air supplied by the general cooling module is supplied to the cooling channel. And controlling the cooling air supply module to control the rapid cooling module to supply a certain amount of the liquefied gas to the cooling air supply module when the rapid cooling mode is selected. 3. The wafer inspection system according to claim 2, wherein the cooling air supply module is controlled to supply the liquefied gas supplied by step 1 to the cooling flow path. The temperature control module of the wafer prober apparatus includes a temperature sensor that detects the temperature of the chuck,
The central controller is
When the rapid cooling mode is selected through the user input unit, the amount of liquefied gas supplied to the cooling flow path is calculated in consideration of the temperature of the chuck sensed by the temperature sensor, The wafer inspection system according to claim 2, wherein the cooling device is controlled to supply the calculated amount of liquefied gas to the cooling flow path. The user input unit includes a temperature selection key for selecting the temperature of the chuck,
The temperature control module of the wafer prober apparatus includes a heating member for heating the chuck,
When the chuck temperature is selected via the temperature selection key, the central control unit is configured so that the selected chuck temperature and the chuck temperature detected by the temperature sensor coincide with each other. The wafer inspection system according to claim 4, wherein the heating member is controlled. The wafer prober device includes a housing for sealing air around the chuck, and an internal air supply module that supplies air that has passed through the cooling flow path to the inside of the housing.
6. The wafer inspection system according to claim 5, wherein the central control device controls the internal air supply module so that air that has passed through the cooling flow path is supplied into the housing. The temperature control module includes a dew point detection sensor for detecting a dew point temperature of the ambient air of the chuck,
The central control unit compares the temperature of the chuck sensed by the temperature sensor with the dew point temperature sensed by the dew point detection sensor, and supplies air supplied into the wafer prober device based on the comparison result. 7. The wafer inspection system according to claim 6, wherein the internal air supply module is controlled so as to adjust the amount of the internal air.   The wafer inspection system according to claim 1, wherein the cooling device is configured such that the liquefied gas stored in the storage container is liquefied nitrogen.

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