JP2011513076A - マイクロ固定具 - Google Patents
マイクロ固定具 Download PDFInfo
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- JP2011513076A JP2011513076A JP2010547993A JP2010547993A JP2011513076A JP 2011513076 A JP2011513076 A JP 2011513076A JP 2010547993 A JP2010547993 A JP 2010547993A JP 2010547993 A JP2010547993 A JP 2010547993A JP 2011513076 A JP2011513076 A JP 2011513076A
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- 238000000034 method Methods 0.000 claims abstract description 16
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- 230000004297 night vision Effects 0.000 claims description 5
- 238000000206 photolithography Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/008—Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
- H01J43/04—Electron multipliers
- H01J43/06—Electrode arrangements
- H01J43/18—Electrode arrangements using essentially more than one dynode
- H01J43/24—Dynodes having potential gradient along their surfaces
- H01J43/246—Microchannel plates [MCP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/0013—Miniaturised spectrometers, e.g. having smaller than usual scale, integrated conventional components
- H01J49/0018—Microminiaturised spectrometers, e.g. chip-integrated devices, Micro-Electro-Mechanical Systems [MEMS]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/05—Aligning components to be assembled
- B81C2203/051—Active alignment, e.g. using internal or external actuators, magnets, sensors, marks or marks detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Tubes For Measurement (AREA)
- Micromachines (AREA)
- Multi-Conductor Connections (AREA)
- Manipulator (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
Abstract
Description
従って、本発明は、マイクロシステムにおける構成部品の自己整合実装及び固定を行うための装置に関し、構成部品を整列し固定し構成部品と接触する少なくとも一つの導電性のバネ構造と、構成部品が押圧される少なくとも一つの止め具と、バネ構造及び止め具が非導電性基板に適用されることによって特徴付けられる。
− マイクロチャネルプレートを収容するための導電性材料から構成した構造で、非導電性のキャリアに適用される構造と、
− 自己整合方法でマイクロチャネルプレートを位置決めし、同時に電気接点接続を行なう弾性構造と、
− マイクロチャネルプレートを位置決めする少なくとも一つの止め具と、を備える。
− 高電圧からマイクロシステムの残りの構成部品をシールドするための少なくとも一つのシールド電極、及び/又は
− 電子トラップで、少なくとも一つのシールド電極で好ましくはシールドされる電子トラップ、を備える。
Claims (15)
- マイクロシステムにおける構成部品の自己整合実装及び固定用の装置であって、
構成部品を整列し、固定し、構成部品と接触する、少なくとも一つの導電性のバネ構造と、構成部品が押される少なくとも一つの止め具と、少なくとも一つのバネ構造及び少なくとも一つの止め具は、非導電性基板に適用されることを特徴とする、装置。 - 少なくとも一つのバネ構造及び少なくとも一つの止め具は、マイクロシステム構造と同じマスク面においてフォトリソグラフィーによって製造されることを特徴とする、請求項1記載の装置。
- 構造は、フォトエッチング・プロセスにより製造されることを特徴とする、請求項1又は2記載の装置。
- フォトエッチング・プロセスは、ドープされた半導体材料において達成されることを特徴とする、請求項3記載の装置。
- 構造は、ドープされたシリコンから構成されることを特徴とする、請求項1から4のいずれかに記載の装置。
- 構造は、フォトレジストにおける電解成形により製造されることを特徴とする、請求項1又は2記載の装置。
- ガラスが非導電性基板として使用されることを特徴とする、請求項1から6のいずれかに記載の装置。
- 構造と電気的接触を行うための導体トラックは、非導電性基板に適用されることを特徴とする、請求項1から7のいずれかに記載の装置。
- 請求項1から8のいずれかに記載の装置の使用であって、マイクロシステム、特にマイクロ質量分析計、電子増倍管、暗視装置、光電子増倍管、粒子カウンター、あるいは放射線量計におけるマイクロチャネルプレートの実装、固定、及び電気接点接続のための使用。
- マイクロチャネルプレートと、マイクロチャネルプレートの自己整合実装及び固定を行うための請求項1から8のいずれかに記載の装置と、を少なくとも備えた装置。
- マイクロチャネルプレートでの高電圧の影響に対してマイクロシステムを保護する少なくとも一つのシールド電極をさらに備えた、請求項10に記載の装置。
- 電子トラップをさらに備えた、請求項10又は11に記載の装置。
- 全ての構造は、同じマスク面においてフォトリソグラフィーにより製造されることを特徴とする、請求項10から12のいずれかに記載の装置。
- 装置は非導電性基板にて覆われることを特徴とする、請求項10から13のいずれかに記載の装置。
- マイクロシステム、特にマイクロ質量分析計、電子増倍管、暗視装置、光電子増倍管、粒子カウンター、あるいは放射線量計における、請求項10から14のいずれかに記載の装置の使用。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200810011972 DE102008011972B4 (de) | 2008-02-29 | 2008-02-29 | Vorrichtung zur selbstjustierenden Montage und Halterung von Mikrokanalplatten in Mikrosystemen |
PCT/EP2009/001088 WO2009109288A2 (de) | 2008-02-29 | 2009-02-17 | Mikrohalterung |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014196540A Division JP2015037832A (ja) | 2008-02-29 | 2014-09-26 | マイクロ固定具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011513076A true JP2011513076A (ja) | 2011-04-28 |
JP2011513076A5 JP2011513076A5 (ja) | 2012-04-05 |
Family
ID=41056396
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010547993A Pending JP2011513076A (ja) | 2008-02-29 | 2009-02-17 | マイクロ固定具 |
JP2014196540A Pending JP2015037832A (ja) | 2008-02-29 | 2014-09-26 | マイクロ固定具 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014196540A Pending JP2015037832A (ja) | 2008-02-29 | 2014-09-26 | マイクロ固定具 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9007784B2 (ja) |
EP (1) | EP2259996B1 (ja) |
JP (2) | JP2011513076A (ja) |
CN (1) | CN101965309B (ja) |
AT (1) | ATE529379T1 (ja) |
CA (1) | CA2716978A1 (ja) |
DE (1) | DE102008011972B4 (ja) |
WO (1) | WO2009109288A2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5049167B2 (ja) * | 2008-03-07 | 2012-10-17 | 浜松ホトニクス株式会社 | マイクロチャネルプレート組立体 |
DE202009002192U1 (de) * | 2009-02-16 | 2009-04-23 | Thermo Fisher Scientific (Bremen) Gmbh | Elektrode zur Beeinflussung der Ionenbewegung in Massenspektrometern |
US8602722B2 (en) | 2010-02-26 | 2013-12-10 | General Electric Company | System and method for inspection of stator vanes |
US8587660B2 (en) | 2010-07-30 | 2013-11-19 | General Electric Company | Image recording assemblies and coupling mechanisms for stator vane inspection |
CN102478660B (zh) * | 2010-11-26 | 2013-07-24 | 中国科学院大连化学物理研究所 | 一种组装式带电粒子二维成像探测器 |
CN102014598B (zh) * | 2010-11-27 | 2013-03-06 | 上海大学 | 棱柱阵列射流微通道散热器 |
DE102011015595B8 (de) * | 2011-03-30 | 2015-01-29 | Krohne Messtechnik Gmbh | Verfahren zur Ansteuerung eines synchronous ion shield Massenseparators |
US8667856B2 (en) | 2011-05-20 | 2014-03-11 | General Electric Company | Sensor assemblies and methods of assembling same |
DE102011076693A1 (de) * | 2011-05-30 | 2012-12-06 | Robert Bosch Gmbh | Mikrofluidische Vorrichtung mit elektronischem Bauteil und Federelement |
JP5771447B2 (ja) * | 2011-06-02 | 2015-08-26 | 浜松ホトニクス株式会社 | 電子増倍器 |
US9418827B2 (en) * | 2013-07-23 | 2016-08-16 | Hamilton Sundstrand Corporation | Methods of ion source fabrication |
CN104090290A (zh) * | 2014-07-25 | 2014-10-08 | 中国科学技术大学 | 极坐标读出式双楔条型阳极的二维位置灵敏探测器 |
CN104567946A (zh) * | 2015-01-22 | 2015-04-29 | 清华大学 | 微通道板探测器及光子、电子、离子成像探测仪 |
US11209216B2 (en) | 2017-07-28 | 2021-12-28 | Dana Canada Corporation | Ultra thin heat exchangers for thermal management |
WO2019018945A1 (en) | 2017-07-28 | 2019-01-31 | Dana Canada Corporation | DEVICE AND METHOD FOR ALIGNING PARTS FOR LASER WELDING |
CN111983345B (zh) * | 2020-07-24 | 2023-03-14 | 北方夜视技术股份有限公司 | 异形微通道板测试夹具装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10189168A (ja) * | 1996-01-19 | 1998-07-21 | Sumitomo Electric Ind Ltd | マイクロコネクタおよびその製造方法 |
JP2001150397A (ja) * | 1999-10-01 | 2001-06-05 | St Microelectron Srl | マイクロメカニズムの互いに対して移動可能な2つの部分を電気的に接続する浮遊部材の製造方法 |
JP2003045576A (ja) * | 2001-08-03 | 2003-02-14 | Sumitomo Electric Ind Ltd | マイクロコネクタとその製造方法 |
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JPH06251840A (ja) * | 1993-02-22 | 1994-09-09 | Fujitsu Ltd | センサ用ソケット |
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JPH10134763A (ja) * | 1996-11-01 | 1998-05-22 | Hamamatsu Photonics Kk | 電子増倍器 |
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-
2008
- 2008-02-29 DE DE200810011972 patent/DE102008011972B4/de not_active Expired - Fee Related
-
2009
- 2009-02-17 CA CA 2716978 patent/CA2716978A1/en not_active Abandoned
- 2009-02-17 EP EP20090717253 patent/EP2259996B1/de not_active Not-in-force
- 2009-02-17 JP JP2010547993A patent/JP2011513076A/ja active Pending
- 2009-02-17 CN CN2009801066732A patent/CN101965309B/zh not_active Expired - Fee Related
- 2009-02-17 US US12/865,997 patent/US9007784B2/en not_active Expired - Fee Related
- 2009-02-17 WO PCT/EP2009/001088 patent/WO2009109288A2/de active Application Filing
- 2009-02-17 AT AT09717253T patent/ATE529379T1/de active
-
2014
- 2014-09-26 JP JP2014196540A patent/JP2015037832A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10189168A (ja) * | 1996-01-19 | 1998-07-21 | Sumitomo Electric Ind Ltd | マイクロコネクタおよびその製造方法 |
JP2001150397A (ja) * | 1999-10-01 | 2001-06-05 | St Microelectron Srl | マイクロメカニズムの互いに対して移動可能な2つの部分を電気的に接続する浮遊部材の製造方法 |
JP2003045576A (ja) * | 2001-08-03 | 2003-02-14 | Sumitomo Electric Ind Ltd | マイクロコネクタとその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101965309A (zh) | 2011-02-02 |
WO2009109288A3 (de) | 2010-02-18 |
DE102008011972B4 (de) | 2010-05-12 |
JP2015037832A (ja) | 2015-02-26 |
WO2009109288A2 (de) | 2009-09-11 |
EP2259996B1 (de) | 2011-10-19 |
CN101965309B (zh) | 2012-11-21 |
ATE529379T1 (de) | 2011-11-15 |
DE102008011972A1 (de) | 2009-12-10 |
EP2259996A2 (de) | 2010-12-15 |
US9007784B2 (en) | 2015-04-14 |
CA2716978A1 (en) | 2009-09-11 |
US20110002109A1 (en) | 2011-01-06 |
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