JP2011507226A - 内部合成噴流を用いる冷却装置 - Google Patents
内部合成噴流を用いる冷却装置 Download PDFInfo
- Publication number
- JP2011507226A JP2011507226A JP2010536560A JP2010536560A JP2011507226A JP 2011507226 A JP2011507226 A JP 2011507226A JP 2010536560 A JP2010536560 A JP 2010536560A JP 2010536560 A JP2010536560 A JP 2010536560A JP 2011507226 A JP2011507226 A JP 2011507226A
- Authority
- JP
- Japan
- Prior art keywords
- aperture
- cooling device
- housing
- synthetic jet
- jet cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 59
- 239000002131 composite material Substances 0.000 claims abstract description 11
- 239000012528 membrane Substances 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 239000010453 quartz Substances 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 230000008901 benefit Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000005086 pumping Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
- F04F7/00—Pumps displacing fluids by using inertia thereof, e.g. by generating vibrations therein
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/63—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air using electrically-powered vibrating means; using ionic wind
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
- F21V33/0004—Personal or domestic articles
- F21V33/0052—Audio or video equipment, e.g. televisions, telephones, cameras or computers; Remote control devices therefor
- F21V33/0056—Audio equipment, e.g. music instruments, radios or speakers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
Description
Claims (15)
- オブジェクトを冷却する合成噴流冷却装置であって:
速度波を生成するように設定されたトランスジューサ;及び
作動アパーチャを介して前記速度波を受け入れるように備えられた筐体;
を有する合成噴流冷却装置であり、
前記筐体は、前記作動アパーチャにおいて前記筐体の内部で内部合成噴流を生成するのに十分に大きく、前記筐体は前記オブジェクトを収容するように備えられ、それにより、前記内部合成噴流により前記オブジェクトの冷却を可能にする;
ことを特徴とする合成噴流冷却装置。 - 前記作動アパーチャの直径は、前記作動アパーチャと前記冷却されるオブジェクトとの間の距離の1/10乃至1/2の範囲内にある、請求項1に記載の合成噴流冷却装置。
- 前記筐体及び前記作動アパーチャは、前記トランスジューサにより作動される共振質量−ばねシステムとしての役割を果たすように寸法決めされ、前記筐体内の流体はばねとしての役割を果たし、前記作動アパーチャ内の流体は質量としの役割を果たす、請求項1又は2に記載の合成噴流冷却装置。
- 前記トランスジューサを有するスピーカの共振周波数並びに前記筐体及び前記作動アパーチャにより形成される前記質量−ばねシステムの共振周波数は、2重質量−ばねシステムを構成するように設定される、請求項3に記載の合成噴流冷却装置。
- 前記トランスジューサのストロークは前記作動アパーチャの半径より大きい、請求項1乃至4の何れか一項に記載の合成噴流冷却装置。
- 前記トランスジューサによりもたらされるボリューム変化は前記筐体のボリュームの1%以上である、請求項1乃至5の何れか一項に記載の合成噴流冷却装置。
- 少なくとも1つの作動アパーチャを介して前記筐体と連通している少なくとも1つのキャビティを更に有し、前記少なくとも1つのキャビティ内の流体は前記トランスジューサにより作動され、前記少なくとも1つのキャビティは、前記流体が質量−ばねシステムにおけるばねとしての役割を果たさないように十分に小さく、前記トランスジューサにより作動される表面と前記少なくとも1つのアパーチャの表面との間の表面比は1以上である、請求項1乃至6の何れか一項に記載の合成噴流冷却装置。
- 前記合成アパーチャは前記トランスジューサにより作動される部材において備えられ、前記部材は壁、メンブレン又はチューブである、請求項1乃至7の何れか一項に記載の合成噴流冷却装置。
- 前記合成アパーチャは、前記トランスジューサを有するスピーカのスピーカコイルに取り付けられたチューブの穴である、請求項1乃至8の何れか一項に記載の合成噴流冷却装置。
- 前記スピーカは後方が閉状態にあり、第1キャビティは、前記スピーカ、前記チューブのフランジ及び/又はスピーカメンブレンの内側表面により形成されている、請求項9に記載の合成噴流冷却装置。
- 前記トランスジューサの前方を囲むハウジングを更に有し、それにより、第2キャビティが形成されている、請求項7乃至10の何れか一項に記載の合成噴流冷却装置。
- 前記第2キャビティは、λ/2の長さを有するパイプを介して第2作動アパーチャに接続され、ここで、λは前記スピーカにより生成された前記速度波の波長である、請求項11に記載の合成噴流冷却装置。
- 前記筐体は、前記筐体の内部で追加の内部合成噴流を生成するように設定された少なくとも1つの非作動アパーチャを有する、請求項1乃至12の何れか一項に記載の合成噴流冷却装置。
- 請求項1乃至13の何れか一項に記載の合成噴流冷却装置と、前記合成噴流冷却装置により冷却されるようになっている前記筐体の内部に備えられた電子部品とを有する電子装置。
- 請求項1乃至14の何れか一項に記載の合成噴流冷却装置を有する照明装置であって、該照明装置は、前記合成噴流冷却装置により冷却されるようになっている筐体の内部に複数のホットスポットを有する、照明装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07122623.7 | 2007-12-07 | ||
EP07122623 | 2007-12-07 | ||
PCT/IB2008/055004 WO2009072046A1 (en) | 2007-12-07 | 2008-11-28 | Cooling device utilizing internal synthetic jets |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011507226A true JP2011507226A (ja) | 2011-03-03 |
JP5480154B2 JP5480154B2 (ja) | 2014-04-23 |
Family
ID=40547873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010536560A Expired - Fee Related JP5480154B2 (ja) | 2007-12-07 | 2008-11-28 | 内部合成噴流を用いる冷却装置 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9726201B2 (ja) |
EP (1) | EP2220921A1 (ja) |
JP (1) | JP5480154B2 (ja) |
KR (1) | KR101799485B1 (ja) |
CN (1) | CN101889485B (ja) |
RU (1) | RU2525826C2 (ja) |
TW (1) | TW200931608A (ja) |
WO (1) | WO2009072046A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2310738B1 (en) * | 2008-07-10 | 2016-05-25 | Philips Intellectual Property & Standards GmbH | Remote cooling by combining heat pipe and resonator for synthetic jet cooling |
US8418934B2 (en) | 2008-08-26 | 2013-04-16 | General Electric Company | System and method for miniaturization of synthetic jets |
US8506105B2 (en) * | 2010-08-25 | 2013-08-13 | Generla Electric Company | Thermal management systems for solid state lighting and other electronic systems |
US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
US8529097B2 (en) | 2010-10-21 | 2013-09-10 | General Electric Company | Lighting system with heat distribution face plate |
DE102010063550A1 (de) * | 2010-12-20 | 2012-06-21 | Tridonic Jennersdorf Gmbh | Kühlsystem und Verfahren für elektronische Komponenten |
US20120181360A1 (en) * | 2010-12-21 | 2012-07-19 | Nuventix Inc. | Systems And Methodologies For Preventing Dust and Particle Contamination of Synthetic Jet Ejectors |
WO2012176083A2 (en) * | 2011-06-20 | 2012-12-27 | Koninklijke Philips Electronics N.V. | Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode |
CN102364712B (zh) * | 2011-10-22 | 2013-03-20 | 中山伟强科技有限公司 | 一种合成射流散热装置 |
KR101254985B1 (ko) * | 2011-12-28 | 2013-04-17 | 재단법인 포항산업과학연구원 | 엘이디 조명장치 |
US9417017B2 (en) | 2012-03-20 | 2016-08-16 | Thermal Corp. | Heat transfer apparatus and method |
JP6060553B2 (ja) | 2012-04-06 | 2017-01-18 | 株式会社豊田自動織機 | 半導体装置 |
US10282965B2 (en) * | 2014-12-11 | 2019-05-07 | Intel Corporation | Synthetic jet delivering controlled flow to sensor system |
US9559037B2 (en) * | 2015-06-02 | 2017-01-31 | Intel Corporation | Package integrated synthetic jet device |
JP2017157735A (ja) * | 2016-03-03 | 2017-09-07 | Necディスプレイソリューションズ株式会社 | 冷却装置、電子機器及び投射型表示装置 |
KR102662161B1 (ko) | 2023-08-14 | 2024-04-30 | 주식회사 제니유니 | 통기성과 착용감을 개선한 이중 지지 구조의 허리 및 척추 보호대 |
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JP2004108760A (ja) * | 2002-08-28 | 2004-04-08 | Sony Corp | 熱輸送装置、電子機器装置及び熱輸送装置の製造方法 |
JP2007087765A (ja) * | 2005-09-22 | 2007-04-05 | Sony Corp | 光源用冷却装置、光源装置及び映像表示装置 |
JP2007527618A (ja) * | 2003-07-07 | 2007-09-27 | ジョージア テック リサーチ コーポレイション | 分配された合成ジェットアクチュエータを使用する熱管理のためのシステムおよび方法 |
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2008
- 2008-11-28 KR KR1020107014965A patent/KR101799485B1/ko active IP Right Grant
- 2008-11-28 EP EP08857607A patent/EP2220921A1/en not_active Withdrawn
- 2008-11-28 RU RU2010128105/07A patent/RU2525826C2/ru not_active IP Right Cessation
- 2008-11-28 WO PCT/IB2008/055004 patent/WO2009072046A1/en active Application Filing
- 2008-11-28 US US12/746,208 patent/US9726201B2/en not_active Expired - Fee Related
- 2008-11-28 CN CN2008801196515A patent/CN101889485B/zh not_active Expired - Fee Related
- 2008-11-28 JP JP2010536560A patent/JP5480154B2/ja not_active Expired - Fee Related
- 2008-12-04 TW TW097147172A patent/TW200931608A/zh unknown
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JP2004108760A (ja) * | 2002-08-28 | 2004-04-08 | Sony Corp | 熱輸送装置、電子機器装置及び熱輸送装置の製造方法 |
JP2007527618A (ja) * | 2003-07-07 | 2007-09-27 | ジョージア テック リサーチ コーポレイション | 分配された合成ジェットアクチュエータを使用する熱管理のためのシステムおよび方法 |
JP2007087765A (ja) * | 2005-09-22 | 2007-04-05 | Sony Corp | 光源用冷却装置、光源装置及び映像表示装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2220921A1 (en) | 2010-08-25 |
RU2525826C2 (ru) | 2014-08-20 |
KR101799485B1 (ko) | 2017-11-20 |
TW200931608A (en) | 2009-07-16 |
CN101889485B (zh) | 2013-05-08 |
JP5480154B2 (ja) | 2014-04-23 |
RU2010128105A (ru) | 2012-01-20 |
KR20100095005A (ko) | 2010-08-27 |
WO2009072046A1 (en) | 2009-06-11 |
US20100258274A1 (en) | 2010-10-14 |
CN101889485A (zh) | 2010-11-17 |
US9726201B2 (en) | 2017-08-08 |
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