JP2011253974A - Electronic component mounting device, and electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting device and an electronic component mounting method, capable of ensuring the stable holding force of a suction nozzle in a component holding state, and facilitating attaching/detaching when exchanging a nozzle.SOLUTION: A nozzle holding portion 25 detachably holding the suction nozzle 26 is equipped with a clamping mechanism composed of a plurality of clamp arms clamping a clamped portion provided at the suction nozzle 26 and an annular spring member 33 energizing the clamp arms 32 in a clamping direction, a clamping force reinforcing mechanism reinforcing clamping force by making an cylindrical member 30 abut on the annular spring member 33 from an outer peripheral side to regulate displacement in an outer diametrical direction, and reinforcement switching means switching the executing of the reinforcement and the releasing of the reinforcement of the clamping force by fitting/detaching the cylindrical member 30 to/from the annular spring member 33.

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.

  In an electronic component mounting apparatus that mounts an electronic component on a substrate, the electronic component stored in the component supply unit is picked up by a mounting head, transferred onto the substrate, and mounted at a predetermined mounting point. As a method for picking up electronic components, a method of vacuum suction using a suction nozzle is widely used. Since the suction nozzle generally has a different type and size depending on the electronic component to be sucked, it is detachably attached to the mounting head according to the electronic component to be sucked. The suction nozzle can be attached to the mounting head in a detachable manner by providing a plurality of clamp arms concentrically arranged in the nozzle holding portion that holds the suction nozzle and fitting into the recess provided in the suction nozzle. A configuration is known in which an annular spring is mounted around the outer surface of the arm (see Patent Document 1).

  In attaching and detaching the suction nozzle, since the fitting protrusion of the clamp arm and the concave portion of the suction nozzle are slid in a state where they are pressed by the elastic force of the spring, wear tends to occur. Wearing by sliding is reduced by providing a groove for storing the lubricant in the fitting protrusion.

Japanese Patent No. 3714080

  In recent years, with the diversification of the types of electronic components mounted on electronic boards, the types of electronic components to be held by the suction nozzle in the electronic component mounting apparatus include large components that are heavier than conventional ones. It is like that. When such a large component is held by suction, the load acting on the suction nozzle increases, so if the holding force of the spring for clamping the suction nozzle is not sufficient, the suction nozzle holds it. May fall out of the nozzle holding part together with the removed parts. In order to reduce such a problem of nozzle dropout, it is possible to obtain a large holding force by increasing the spring strength of the spring. Requires a great deal of force when removing from. As a result, the wear of the sliding surface between the fitting protrusion and the recess is promoted, resulting in a problem that the life of the component is reduced. As described above, in the conventional electronic component mounting apparatus, there is a problem that it is difficult to achieve both the securing of the stable holding force of the suction nozzle in the component holding state and the ease of attachment / detachment at the time of nozzle replacement.

  Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of ensuring both stable holding force of the suction nozzle in the component holding state and easy attachment / detachment at the time of nozzle replacement. To do.

  The electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that sucks and holds an electronic component from a component supply unit by a suction nozzle and mounts the electronic component on a substrate positioned in a substrate positioning unit. A mounting head mounted on the head, a head moving means for moving the mounting head between the component supply unit and the substrate positioning unit, and a nozzle holding unit provided in the mounting head for detachably holding the suction nozzle A plurality of clamp arms for clamping a clamped portion provided in the suction nozzle, and mounted around the outer surface side of the clamp arms and clamped with respect to the clamp arm. A clamping mechanism comprising an annular tension spring member that provides a biasing force of at least the tension spring member A clamping force reinforcing mechanism that reinforces a clamping force by the clamping mechanism by restricting displacement of the annular tension spring member in the outer diameter direction by contacting a regulating member from the outer peripheral side at two facing positions; A first position in which the regulating member is reciprocated in the nozzle axial direction with respect to the nozzle holding portion by relative movement means provided in the mounting head, and the position of the setting member abuts on the outer peripheral surface of the tension spring member. And a reinforcing switching means for switching between executing and releasing the reinforcement of the clamping force by the clamping mechanism by switching to the second position where the tension spring member is disengaged from the outer peripheral surface.

  The electronic component mounting method of the present invention includes a mounting head to which a suction nozzle is detachably mounted, a head moving means for moving the mounting head between the component supply unit and the substrate positioning unit, and a mounting head. A nozzle holding portion that detachably holds the suction nozzle, and the nozzle holding portion includes a plurality of clamp arms that clamp a clamped portion provided in the suction nozzle and an outer surface side of these clamp arms. A clamp mechanism comprising an annular tension spring member which is mounted so as to circulate and applies a biasing force in the clamping direction to the clamp arm, and is regulated from the outer periphery side at least at two positions opposite to the tension spring member. The clamp mechanism controls the displacement of the annular tension spring member in the outer diameter direction by contacting the member. The regulating member is reciprocated in the nozzle axial direction with respect to the nozzle holding portion by a clamping force reinforcing mechanism that reinforces the clamping force and a relative moving means provided on the mounting head, and the position of the regulating member is pulled by the tension. Reinforcement switching means for switching between executing and releasing reinforcement of the clamping force by the clamp mechanism by switching between a first position contacting the outer peripheral surface of the spring member and a second position separating from the outer peripheral surface of the tension spring member. The electronic component mounting apparatus including the electronic component mounting apparatus includes: an electronic component mounting method in which the electronic component is sucked and held from the component supply unit by the suction nozzle and mounted on the substrate positioned by the substrate positioning unit, and the weight is large in advance. In a case where a predetermined part set as a part is an object to be sucked and held, the position of the restriction member is set to the first position. When the electronic component is sucked and held by the suction nozzle in a state of being positioned and the electronic component other than the predetermined component is to be sucked and held and when the suction nozzle is replaced in the nozzle holding portion, The operation is performed with the position positioned at the first position.

  According to the present invention, the ring-shaped tension member that is mounted around the outer surface side of the plurality of clamp arms provided in the clamp mechanism that clamps the clamped portion provided in the suction nozzle to provide the urging force in the clamping direction. A clamping force reinforcement mechanism that reinforces the clamping force by the clamping mechanism by abutting a setting member against the spring member from the outer peripheral side and restricting the displacement of the tension spring member in the outer diameter direction, and a relative provided on the mounting head The regulating member is reciprocated in the nozzle axis direction by the moving means, and the position of the regulating member is switched between the first position where the regulating member abuts on the outer circumferential surface of the tension spring member and the second position where the regulating member is detached from the outer circumferential surface of the tension spring member. By providing reinforcement switching means for switching between the reinforcement execution of the clamping force by the mechanism and the cancellation of the reinforcement, the suction nozzle can be stabilized in the component holding state. And securing lifting force, it is possible to achieve both quick release at the time of nozzle replacement.

The perspective view of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the mounting head unit used for the electronic component mounting apparatus of one embodiment of this invention Configuration and function explanatory diagram of a nozzle holding unit in an electronic component mounting apparatus according to an embodiment of the present invention The fragmentary sectional view of the mounting head in the electronic component mounting apparatus of one embodiment of this invention Functional explanatory drawing of the moving member provided in the clamping force reinforcement mechanism of the mounting head in the electronic component mounting apparatus of one embodiment of the present invention Explanatory drawing of operation | movement of the clamping force reinforcement mechanism of the mounting head in the electronic component mounting method of one embodiment of this invention Explanatory drawing of operation | movement of the clamping force reinforcement mechanism of the mounting head in the electronic component mounting method of one embodiment of this invention FIG. 1 is a work flow diagram illustrating an electronic component mounting method according to an embodiment of the present invention.

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the electronic component mounting apparatus 1 will be described with reference to FIG. The electronic component mounting apparatus 1 has a function of picking up and holding an electronic component from a component supply unit by a suction nozzle and mounting it on a substrate positioned in the substrate positioning unit. In FIG. 1, a substrate transport mechanism 2 is disposed in the X direction at the center of a base 1a. The board transport mechanism 2 transports the board 3 on which electronic components are mounted in the X direction.

  A substrate positioning portion that positions and holds the substrate at the mounting position is provided in the transport path by the substrate transport mechanism 2, and electronic components are mounted on the substrate 3 positioned by the substrate positioning portion. A component supply unit 4 is disposed on both sides of the substrate transport mechanism 2, and a plurality of tape feeders 5 are arranged in parallel in the component supply unit 4. The tape feeder 5 pitches a carrier tape containing electronic components and supplies the electronic components to a component mounting mechanism described below.

  A Y-axis moving table 6 is disposed in the Y direction at one end of the base 1a in the X direction, and a pair of X-axis moving tables 7 is slidably coupled to the Y-axis moving table 6 in the Y direction. ing. Mounting heads 8 each having a suction nozzle 26 (see FIG. 2) at the lower end are mounted on the two X-axis moving tables 7, and are mounted by driving the Y-axis moving table 6 and the X-axis moving table 7. The head 8 moves horizontally. Thus, a component mounting operation is performed in which the electronic component is taken out from the tape feeder 5 of each component supply unit 4 by the mounting head 8 and transferred and mounted on the substrate 3 positioned by the substrate transport mechanism 2. Therefore, the Y-axis moving table 6 and the X-axis moving table 7 constitute a head moving mechanism that moves the mounting head 8.

  Next, the structure of the mounting head 8 will be described with reference to FIG. In FIG. 2, the mounting head 8 includes a vertical mounting plate 10, and is mounted via a mounting plate 10 on a lifting member 9 a that is lifted and lowered by a Z-axis drive mechanism 9. By driving the Z-axis drive mechanism 9, the entire mounting head 8 moves up and down (arrow a). A motor 11 is disposed vertically on a flat surface portion 10 a provided on the top of the mounting plate 10. The rotating shaft 11 a of the motor 11 is coupled to the upper end shaft 13 a of the rotating block 13 through the coupling 12. A lower portion of the rotary block 13 is coupled to the hollow shaft 14, and a hollow portion 13 b provided at a coupling portion with the hollow shaft 14 is connected to a positive pressure supply source 15 through a pipe line 13 c. The Z-axis drive mechanism 9, the motor 11, and the positive pressure supply source 15 are controlled by the control unit 17.

  A housing 18 is fixed to the side surface of the mounting plate 10. The housing 18 rotatably supports the hollow shaft 14 via upper and lower bearings 19. A spline shaft 21 is vertically inserted into the spline housing 20 mounted in the hollow shaft 14 so as to be movable up and down. The upper end portion of the spline shaft 21 abuts on the bellophram 16 mounted in the hollow portion 13 b, and the lower end portion is coupled to the nozzle block 22 that holds the suction nozzle 26. As the spline shaft 21 moves up and down, the suction nozzle 26 held by the nozzle holding unit 25 moves up and down (arrow b). Therefore, the spline shaft 21 is a nozzle shaft that moves the suction nozzle 26 up and down.

  A horizontal coupling member 27 is coupled to the lower surface of the housing 18, and the coupling member 27 is coupled to a horizontal plate-shaped moving member 29 via a vertical coupling portion 28. As will be described later, the moving member 29 is provided to raise and lower the cylindrical member 30 in the function of reinforcing the clamping force for clamping the suction nozzle 26 as necessary, and moves the mounting head 8 up and down. The drive mechanism 9 relatively moves in the up and down direction. That is, the control unit 17 controls the Z-axis drive mechanism 9, the motor 11, and the positive pressure supply source 15, and combines the lifting / lowering operation of the housing 18 and the spline shaft 21 and the θ rotation operation of the nozzle holding unit 25 to form a cylindrical shape. The member 30 is fitted and detached from the outer periphery of an annular spring member 33 which is an annular tension spring member. Thereby, the presence or absence of reinforcement of the clamping force by the annular spring member 33 is switched. The nozzle block 22 is biased upward by a tension spring member 35 (see FIG. 4) supported at the upper end by the housing 18, thereby restricting the downward movement of the spline shaft 21 and the nozzle block 22. ing.

  When the positive pressure supply source 15 is driven to apply a positive pressure in the hollow portion 13b, the belofram 16 presses the spline shaft 21 downward against the biasing force of the tension spring member 35 described above. That is, the positive pressure supply source 15 and the belofram 16 apply a downward load due to air pressure to the spline shaft 21, so that the nozzle holding portion 25 provided so as to be movable up and down with respect to the mounting head 8 is moved downward. This is a pressing mechanism that variably applies the pressing force. At this time, by controlling the pneumatic pressure supplied from the positive pressure supply source 15 by the control unit 17, the pressing force for pressing the electronic component is controlled. Note that other types of air actuators other than belofram may be used as the pressing mechanism.

  The lower part of the nozzle block 22 coupled to the lower end of the spline shaft 21 is a nozzle holding portion 25 to which the suction nozzle 26 is detachably attached. When the suction nozzle 26 is attached, the suction nozzle 26 The suction hole 26 b provided in the shaft portion 26 a is connected to the vacuum suction source 24 through the pipe line 23. By driving the vacuum suction source 24, vacuum suction is performed via the pipe line 23, whereby the electronic component is vacuum-sucked and held in the suction hole 26 b of the suction nozzle 26.

  By rotating the motor 11, the rotation is transmitted to the nozzle block 22 through the rotary block 13, the hollow shaft 14, the spline housing 20, and the spline shaft 21. As a result, the suction nozzle 26 rotates in the θ direction together with the nozzle block 22 (arrow c). The motor 11 serves as θ rotation driving means for rotating the spline shaft 21 by θ. Therefore, the rotational position in the θ direction of the electronic component sucked and held by the suction nozzle 26 can be arbitrarily adjusted. In this rotation operation, the rotation of the nozzle block 22 relative to the pipe line 23 connected to the vacuum suction source 24 is allowed by the rotary joint portion 22a incorporated in the nozzle block 22, and the rotary joint portion 22a The rotation prevention member 22b prevents rotation.

  When mounting the electronic component held by the suction nozzle 26 on the substrate, it is necessary to press the electronic component with a predetermined mounting load determined by the type of the electronic component. This pressing is performed by applying a positive pressure from the positive pressure supply source 15 to the hollow portion 13 b and pressing the spline shaft 21 downward by the bellophram 16. At this time, by adjusting the pressure supplied from the positive pressure supply source 15, the load pressed by the bellophram 16 can be arbitrarily set. Therefore, it is possible to mount various types of electronic components having different mounting loads using the same mounting head 8.

  Next, the structure of the suction nozzle 26 and the nozzle holding part 25 will be described with reference to FIG. As shown in FIG. 3, the suction nozzle 26 has a suction shaft 26 a that has a suction hole 26 b and extends downward on the lower surface side of the disk-shaped flange portion 26 c, and the suction nozzle 26 is clamped by the nozzle holding portion 25. The mounting projection 26d provided with the clamped portion 26f for holding the projection 26d is projected on the upper surface side of the flange portion 26c.

  The nozzle holding portion 25 has a function of detachably holding the suction nozzle 26 having the above-described configuration, and mainly includes a main body portion 25a provided with a suction opening 25b penetrating vertically and communicating with the suction nozzle 26. . The main body portion 25a has a hook-like extending portion 25d extending outward, and an inner tapered surface 25c is formed on the lower portion of the main body portion 25a to which the outer tapered surface 26e of the mounting projection 26d is fitted. Yes. By driving the vacuum suction source 24, the inside of the suction opening 25 b is vacuum-sucked through the pipe line 23. Two clamp arms 32 are mounted on both side surfaces of the main body 25a, and an annular spring member 33 is mounted around the outer surface of the clamp arm 32 of the clamp arms 32. The annular spring member 33 is an endless annular tension spring member, and has a function as a biasing unit that applies a biasing force in the inner direction (clamping direction) to the clamp arm 32. The clamp arm 32 and the annular spring member 33 constitute a clamp mechanism that clamps the suction nozzle 26.

  In a state where the outer tapered surface 26e is fitted to the inner tapered surface 25c and the suction nozzle 26 is held by the nozzle holding portion 25, the clamp arm 32 is urged by the biasing force of the annular spring member 33 as shown in FIG. The lower protrusion 32b is pressed against the clamped portion 26f, whereby the suction nozzle 26 is clamped. Since this clamping force depends on the urging force of the annular spring member 33, when a large clamping force is required, the annular spring member 33 having an appropriate spring strength is selected according to the required clamping force. It is necessary to select. However, if the annular spring member 33 having an excessive spring strength is employed, inconveniences such as excessive surface friction acting on the lower protrusion 32b and the clamped portion 26f during the nozzle attaching / detaching operation may cause inconvenience. There is a limit to the spring strength of the annular spring member 33 that can be employed.

  For this reason, in this embodiment, a clamping force reinforcing mechanism described below is provided so that the clamping force can be increased without using the annular spring member 33 having a strong spring strength. Hereinafter, the configuration of the clamping force reinforcing mechanism will be described with reference to FIGS. As shown in FIG. 4, a substantially cylindrical cylindrical member 30 having an inner diameter corresponding to the outer diameter of the annular spring member 33 in the state of being mounted on the clamp arm 32 is mounted on the outer periphery of the main body portion 25 a. . The upper end portion of the cylindrical member 30 is provided with a locked portion 30a extending outward at two opposing positions and a flange portion 30b extending inwardly in a hook shape (see FIG. 5).

  In the state shown in FIG. 4, the upper surface of the locked portion 30 a is in contact with the lower surface of the moving member 29. A compression spring member 31 is mounted between the extension portion 25 d and the flange portion 30 b in the inner peripheral portion of the cylindrical member 30. The cylindrical member 30 is attached to the moving member 29 by the urging force of the compression spring member 31. It is pressed against the bottom surface. The cylindrical member 30 has a size and shape in which the annular spring member 33 is fitted on the inner peripheral surface. When the cylindrical member 30 is lowered relative to the nozzle holding portion 25, the cylindrical member 30 The inner peripheral surface abuts on the outer peripheral surface of the annular spring member 33 (see FIG. 6B) and restricts displacement of the annular spring member 33 in the outer diameter direction. Thereby, the clamp force which presses the clamp arm 32 inward (clamp direction) by the annular spring member 33 is reinforced. That is, by changing the relative position in the height direction of the cylindrical member 30 with respect to the nozzle holding portion 25, the reinforcement execution / removal of the clamping force is switched.

  In the above configuration, the cylindrical member 30 into which the annular spring member 33 is fitted is in contact with the annular spring member 33 from the outer peripheral side, and serves as a regulating member that regulates the displacement of the annular spring member 33 in the outer diameter direction. It has a function. As a result, a clamping force reinforcement mechanism that reinforces the clamping force by the clamping mechanism including the clamp arm 32 and the annular spring member 33 is configured. In the present embodiment, the cylindrical member 30 is used as the restricting member. However, in order to fulfill the function of restricting the displacement of the annular spring member 33 in the outer diameter direction, at least two positions facing each other are annular. What is necessary is just to contact | abut with respect to the spring member 33 from an outer peripheral side, and if it is a member of the shape which has such a function, it will not be limited to a shape like the cylindrical member 30. FIG.

  The spline shaft 21 and the nozzle block 22 are biased upward by a tension spring member 35 supported by the housing 18 via a pin 36 (arrow d), and positive pressure air (arrow) supplied into the hollow portion 13b. By e), it is pressed downward through the bellofram 16 with a pressing force corresponding to the air pressure (arrow f). With this configuration, by controlling the air pressure applied to the hollow portion 13b, the nozzle holding portion 25 and the suction nozzle 26 can be pushed down or returned upward via the spline shaft 21 and the nozzle block 22. It has become. That is, by making the pressing force by the air pressure smaller than the urging force of the tension spring member 35, the nozzle holding portion 25 and the suction nozzle 26 move upward by the urging force of the tension spring member 35, and the air pressure is pulled. By making it larger than the urging force of the spring member 35, the nozzle holding portion 25 and the suction nozzle 26 move downward against the urging force of the tension spring member 35.

  Thus, in the present embodiment, the cylindrical member is obtained by combining the operation of the moving member 29 that is relatively moved in the ascending / descending direction by the Z-axis drive mechanism 9 and the operation of the pressing mechanism that elevates and lowers the spline shaft 21. 30 can be moved relative to the nozzle holding portion 25 in the nozzle axis direction. Therefore, the moving member 29, the tension spring member 35, and the pressing mechanism described above constitute relative moving means for moving the cylindrical member 30 relative to the nozzle holding portion 25 in the nozzle axis direction. By adopting such a configuration, the relative movement function of the cylindrical member 30 can be realized without complicating the mechanism of the mounting head 8.

  In the present embodiment, the relative moving means is configured using the tension spring member 35 and the pressing mechanism already provided in the mounting head 8, but the present invention is not limited to this. Instead, a moving mechanism using a drive source such as a pneumatic actuator may be added separately as long as the cylindrical member 30 is a mechanism that can move relative to the nozzle holding portion 25 in the nozzle axis direction.

  Next, the function of the moving member 29 will be described with reference to FIG. As described above, in the clamping force reinforcement mechanism in the present embodiment, the reinforcement execution and the reinforcement cancellation are switched by changing the relative position of the cylindrical member 30 with respect to the nozzle holding portion 25. The moving member 29 is used for changing the relative position. The rectangular plate-shaped moving member 29 is formed with a circular opening 29a located at the center, and the opening 29a is provided with notches 29b at two opposite positions. The opening 29a and the notch 29b are set to dimensions that allow the main body of the cylindrical member 30 and the locked portion 30a to be inserted vertically.

  5A, 5B, and 5C show the relative positional relationship between the moving member 29 and the cylindrical member 30. A bottom view of the moving member 29 viewed from the lower surface side is shown in FIG. It is shown together with the -A cross section, the BB cross section, and the CC cross section. First, FIG. 5 (a) shows a state where the locked portion 30a is aligned in a direction substantially orthogonal to the notch portion 29b by driving the motor 11 and rotating the spline shaft 21. The state where 30a is brought into contact with the lower surface 29d of the moving member 29 is shown. In this state, the Z-axis drive mechanism 9 is driven to lower the housing 18, and the moving member 29 is lowered together with the coupling member 27, so that the cylindrical member 30 is moved relative to the spline shaft 21 and the nozzle block 22. Can be lowered.

  FIG. 5B shows a state in which the cylindrical member 30 is moved with respect to the moving member 29 in a state where the direction of the locked portion 30 a is aligned with the notched portion 29 b by driving the motor 11 and rotating the spline shaft 21. Shows a state of relatively moving up and down. That is, in this state, since the cylindrical member 30 can be inserted through the opening 29a and the notch 29b together with the locked portion 30a, the cylindrical member 30 is moved by the operation described in FIG. 29 can be raised or lowered relative to 29 (arrow h). In other words, the locked portion 30a located on the lower surface 29d side can be moved to the upper surface 29c side, or vice versa.

  In FIG. 5C, the notched portion 29b in FIG. 5B is inserted and moved to the upper surface 29c side, and the motor 11 is driven to rotate the spline shaft 21, whereby the locked portion 30a. In this state, the locked portion 30a is brought into contact with the upper surface 29c of the moving member 29 in a state in which is aligned in a direction substantially orthogonal to the notch portion 29b. In this state, the locked portion 30a can be pressed against the upper surface 29c by lowering the cylindrical member 30 relative to the moving member 29 by the operation described in FIG.

  Next, actual examples of functions of the clamping force reinforcing mechanism and the reinforcing switching means will be described with reference to FIGS. FIG. 6A shows an operation when the cylindrical member 30 is lowered relative to the nozzle holding portion 25 from the state shown in FIG. That is, in this case, first, the mounting head 8 is moved above the fixed plane 37 provided with the insertion hole 37a through which the shaft part 26a can be inserted, such as a nozzle housing part arranged in the vicinity of the component supply part 4. Let Next, the Z-axis drive mechanism 9 is driven to lower the housing 18, and the flange portion 26 c is brought into contact with the upper surface 37 b of the fixed plane 37 while the shaft portion 26 a is inserted into the insertion hole 37 a. In this state, the cylindrical member 30 has not yet reached the position where it contacts the outer peripheral surface of the annular spring member 33.

  Thereafter, as shown in FIG. 6B, the Z-axis drive mechanism 9 is driven to further lower the coupling member 27 by a predetermined amount (arrow j). Thereby, the cylindrical member 30 is also lowered (arrow k), the inner peripheral surface comes into contact with the outer peripheral surface of the annular spring member 33, and the displacement of the annular spring member 33 in the outer diameter direction is restricted. Thereby, the clamping force of the suction nozzle 26 by the clamping mechanism including the clamp arm 32 and the annular spring member 33 is reinforced. The position of the cylindrical member 30 shown in FIG. 6B is a first position where the inner peripheral surface comes into contact with the outer peripheral surface of the annular spring member 33.

  FIG. 7A shows an operation when the cylindrical member 30 is lifted relative to the nozzle holding portion 25 from the state shown in FIG. Yes. First, by driving the motor 11 and rotating the spline shaft 21 (arrow m), the direction of the locked portion 30a is aligned with the notch portion 29b. In this state, the tension spring member 35 is moved by the operation shown in FIG. The spline shaft 21 is raised by the urging force (arrow l). As a result, the inner circumferential surface of the cylindrical member 30 separates from the outer circumferential surface of the annular spring member 33 (arrow n), and the locked portion 30a moves to the upper surface 29c side of the moving member 29.

  Thereafter, by driving the motor 11 and rotating the spline shaft 21 (arrow o), as shown in FIG. 7B, the locked portion 30a is positioned in a direction perpendicular to the opening 29a. In this state, the spline shaft 21 is lowered by the operation shown in FIG. 4 (arrow p). Thereby, the locked portion 30a is pressed against the upper surface 29c (arrow q), and the position is fixed. In this state, the clamping force by the clamp reinforcing mechanism is in a state of releasing the reinforcement. The position of the cylindrical member 30 shown in FIG. 7B is a second position where the cylindrical member 30 is detached from the outer peripheral surface of the annular spring member 33.

  In the above-described configuration, the cylindrical member 30 as a regulating member that regulates the displacement of the annular spring member 33 in the outer diameter direction is reciprocated in the nozzle axis direction of the spline shaft 21 with respect to the nozzle holding portion 25 to form a cylindrical shape. By switching the position of the member 30 between the first position and the second position described above, execution of reinforcement of the clamping force by the aforementioned clamping mechanism and reinforcement cancellation are switched. In other words, in the configuration shown in the present embodiment, the control unit 17 that controls the relative movement unit and the motor 11 that rotates the spline shaft 21 by θ moves the cylindrical member 30 to the nozzle holding unit 25 by the relative movement unit. By reciprocating in the axial direction, the position of the cylindrical member 30 is switched between the first position and the second position shown in FIG. 6B and FIG. A reinforcement switching means for switching between reinforcement execution and reinforcement cancellation is configured.

  The function of executing the reinforcement of the clamping force and the function of releasing the reinforcement are the upper surface 29c and the lower surface 29d that function as the locking portions in the moving member 29 by using the locked portions 30a provided on the cylindrical member 30 so as to extend in the outer circumferential direction. In this state, the relative movement means is driven to switch the position of the cylindrical member 30 between the first position and the second position.

  This electronic component mounting apparatus is configured as described above, and the electronic component mounting work flow will be described below. First, when the component mounting operation is started (ST1), it is determined whether or not the suction nozzle 26 needs to be replaced in the mounting head 8 (ST2). This determination is made based on mounting data stored in advance in the storage device. Here, if the nozzle needs to be replaced, the nozzle replacement operation is executed in a state where the reinforcement of the clamping force is released (ST3). That is, the nozzle replacement operation is performed in a state where the position of the cylindrical member 30 is positioned at the second position shown in FIG. After the nozzle replacement operation is performed, and when nozzle replacement is not necessary in (ST2), it is determined whether or not the target component to be mounted next is a predetermined component set as a large component. (ST4). That is, the control unit 17 reads out the component data stored in the storage device in advance, and determines whether or not it is necessary to reinforce the clamping force for clamping the suction nozzle 26 by the nozzle holding unit 25 with a large mass.

  If the target component is other than a large component, the electronic component is sucked and held in a state where the reinforcement of the clamping force is released (ST5). That is, the electronic component is sucked and held by the suction nozzle 26 in a state where the cylindrical member 30 is positioned at the second position shown in FIG. On the other hand, if the target component is a large component, the electronic component is sucked and held in a state where the clamping force is reinforced (ST6). That is, the electronic component is sucked and held by the suction nozzle 26 in a state where the cylindrical member 30 is positioned at the first position shown in FIG. Next, the mounting head 8 that sucks and holds the electronic component by the suction nozzle 26 moves to the substrate 3 positioned and held by the substrate transport mechanism 2, and mounts the held electronic component on the substrate 3 (ST7).

  As described above, in the electronic component mounting method shown in the present embodiment, when a predetermined component previously set as a large component having a large weight is to be sucked and held, the position of the cylindrical member 30 is set as described above. When the electronic component is sucked and held by the suction nozzle 26 in the state where it is located at the first position and the electronic component other than the predetermined component is to be sucked and held, and when the suction nozzle 26 is replaced in the nozzle holding unit 25, The operation is performed while the cylindrical member 30 is positioned at the first position. As a result, the clamping force of the suction nozzle 26 can be appropriately selected according to the target part, and the clamping force can be reduced during nozzle replacement, ensuring stable nozzle holding force and ensuring nozzle replacement. It is possible to achieve both easy attachment and detachment.

  The electronic component mounting apparatus and the electronic component mounting method of the present invention have the effect of ensuring both stable holding force of the suction nozzle in the component holding state and ease of attachment / detachment when replacing the nozzle. This is useful in the field where electronic components are held by a nozzle and transferred to a substrate.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate conveyance mechanism 3 Board | substrate 4 Component supply part 5 Tape feeder 6 Y-axis movement table 7 X-axis movement table 8 Mounting head 25 Nozzle holding part 25a Main body part 25b Suction opening part 26 Adsorption nozzle 26b Adsorption hole 26f Clamp part 29 Moving member 29a Opening part 30 Cylindrical member 30a Locked part 32 Clamp arm 33 Annular spring member

Claims (4)

An electronic component mounting apparatus that mounts on a substrate positioned by a substrate positioning unit by sucking and holding an electronic component by suction nozzle from a component supply unit,
A mounting head to which the suction nozzle is detachably mounted, a head moving means for moving the mounting head between the component supply unit and the board positioning unit, and the suction nozzle provided in the mounting head are detachable. A nozzle holding part for holding the
The nozzle holding portion is mounted around a plurality of clamp arms that clamp the clamped portion provided in the suction nozzle and the outer surface side of these clamp arms, and exerts an urging force in the clamping direction on the clamp arm. A clamping mechanism comprising an annular tension spring member to be applied;
Clamping force by the clamp mechanism by restricting displacement of the annular tension spring member in the outer diameter direction by bringing a regulating member into contact with the tension spring member from the outer peripheral side at least at two positions opposite to each other. Clamping force reinforcement mechanism to reinforce,
A first position in which the regulating member is reciprocated in the nozzle axial direction with respect to the nozzle holding portion by relative movement means provided in the mounting head, and the position of the setting member abuts on the outer peripheral surface of the tension spring member. And an electronic component mounting comprising: a reinforcing switching means for switching between executing and releasing reinforcement of the clamping force by the clamp mechanism by switching to a second position where the tension spring member is separated from the outer peripheral surface of the tension spring member apparatus. The regulating member is a cylindrical member into which the annular tension spring member is fitted,
The relative movement means applies a downward pressing force to a moving member that moves relative to the mounting head by a Z-axis drive mechanism that moves the mounting head up and down, and the nozzle holding portion that is movable up and down relative to the mounting head. A pressing mechanism that variably applies,
The reinforcement switching means drives the relative movement means in a state in which a locked portion provided extending in the outer peripheral direction on the cylindrical member is locked by a locking portion provided on the moving member. To switch the position of the cylindrical member between the first position and the second position. A mounting head to which the suction nozzle is detachably mounted, a head moving means for moving the mounting head between the component supply unit and the substrate positioning unit, and the suction nozzle provided in the mounting head to be detachable. A plurality of clamp arms for clamping a clamped portion provided on the suction nozzle, and mounted around the outer surface side of the clamp arms. A clamping mechanism comprising an annular tension spring member that applies a biasing force in the clamping direction against the tension spring member, and at least two positions opposed to the tension spring member by contacting a setting member from the outer peripheral side. Clamp that reinforces the clamping force by the clamping mechanism by restricting the displacement of the shape tension spring member in the outer diameter direction The regulating member is reciprocated in the nozzle axial direction with respect to the nozzle holding portion by a force reinforcing mechanism and relative moving means provided on the mounting head, and the position of the regulating member is set on the outer peripheral surface of the tension spring member. Electronic component mounting comprising reinforcement switching means for switching between the reinforcement execution and release of the clamping force by the clamp mechanism by switching between a first position of contact and a second position of separation from the outer peripheral surface of the tension spring member An electronic component mounting method in which an electronic component is sucked and held by a suction nozzle from a component supply unit and mounted on a substrate positioned on a substrate positioning unit by an apparatus,
In the case where a predetermined component set in advance as a large component having a large weight is to be sucked and held, the electronic component is sucked and held by the suction nozzle in a state where the position of the regulating member is positioned at the first position,
When an electronic component other than the predetermined component is to be sucked and held, and when the suction nozzle is replaced in the nozzle holding portion, the operation is performed with the position of the restricting member at the first position. An electronic component mounting method characterized by the above. The regulating member is a cylindrical member into which the annular tension spring member is fitted,
The relative movement means applies a downward pressing force to a moving member that moves relative to the mounting head by a Z-axis drive mechanism that moves the mounting head up and down, and the nozzle holding portion that is movable up and down relative to the mounting head. A pressing mechanism that variably applies,
The cylindrical member is driven by driving the relative moving means in a state in which a locked portion provided extending in the outer peripheral direction on the cylindrical member is locked by a locking portion provided on the moving member. The electronic component mounting method according to claim 3, wherein the position is switched between the first position and the second position.

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