JP2011243841A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component which can ensure good electrical connection state of a circuit board and a terminal member while reducing the cost.SOLUTION: The electronic component 10 comprises a circuit board 16 having a mounting surface 16A on which electronic elements 12 and 14 are surface-mounted and lands 20 are formed, a terminal body 22 arranged on the mounting surface 16A and capable of being connected to an external connection terminal 30, and a terminal member 18 in which connections 54 soldered to the lands 20 and fixing portions 26 which are inserted into holes 34 formed through the circuit board 16 and fixing the terminal body 22 to the circuit board 16 are formed integrally.

Description

  The present invention relates to an electronic component.

  Patent Document 1 discloses a connector having a brace for preventing stress from being generated in an electrical connection portion with a circuit board.

Japanese Patent Laid-Open No. 11-149968 (FIG. 6)

  However, in the connector described in Patent Document 1, since the brace is a separate part, when this connector is used as an electronic part, the number of parts increases and the cost of the electronic part increases.

  Further, in this type of electronic component, it is desirable that the electrical connection between the circuit board and the connector is good. Here, as a method of electrically connecting the circuit board and the connector, there is a connection by soldering. On the other hand, as a method not requiring the soldering, for example, a connection by a press-fit structure is proposed. ing.

  However, the connection by this press-fit structure has a problem that the allowable current value is small or the temperature dependency is large, and a good electrical connection state between the circuit board and the connector (terminal member) can be obtained. It becomes difficult.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component capable of obtaining a good electrical connection state between a circuit board and a terminal member and reducing the cost. And

  In order to solve the above-described problem, an electronic component according to claim 1 has a mounting surface on which an electronic element is surface-mounted, a circuit board having a land formed on the mounting surface, and an electronic component disposed on the mounting surface. A terminal body portion that can be connected to an external connection terminal, a connection portion soldered to the land, and a hole formed in the circuit board to fix the terminal body portion to the circuit board. And a terminal member integrally formed with the fixing portion.

  According to this electronic component, the connection portion formed on the terminal member is soldered to the land formed on the circuit board. Therefore, for example, a better electrical connection state between the circuit board and the terminal member can be obtained as compared with the case where the terminal member and the circuit board are electrically connected by the press-fit structure.

  Moreover, since the terminal member is formed with a fixing portion for fixing the terminal main body portion to the circuit board, for example, even when an external force is applied to the terminal main body portion when an external connection terminal is inserted into or removed from the terminal main body portion. It is possible to suppress the occurrence of stress at the connection portion between the connection portion and the land. Thereby, the favorable electrical connection state of a circuit board and a terminal member can be maintained.

  In addition, since the connection destination of the connection part of the terminal member is a land formed on the mounting surface of the circuit board, the surface mounting on the mounting surface of the electronic element and the soldering of the connection part to the land are reflowed. It can be done simultaneously by soldering. Therefore, compared with the case where these are performed separately (for example, when the connection pin is formed on the terminal member and the connection pin is soldered to the circuit board by flow soldering or soldering), the soldering process The cost can be reduced.

  Moreover, since the terminal main body portion, the connection portion, and the fixing portion are integrally formed, an increase in the number of parts can be avoided, and this can also reduce the cost.

  The electronic component according to claim 2 is the electronic component according to claim 1, wherein the terminal member has elasticity, and the terminal body portion is fixed to the circuit board by the fixing portion. An elastic portion that presses the connection portion toward the land side with respect to the terminal main body portion is formed.

  According to this electronic component, in a state where the terminal main body portion is fixed to the circuit board by the fixing portion, the connection portion is pressed to the land side by the elastic portion, so that the electrical connection state between the connection portion and the land is further increased. It can be made even better.

It is a top view of the electronic component which concerns on 1st embodiment of this invention. It is a front view of the electronic component shown by FIG. It is a principal part enlarged front view containing the partial cross section of the electronic component shown by FIG. It is a principal part expanded side view including the partial cross section of the electronic component shown by FIG. It is a top view of the electronic component which concerns on 2nd embodiment of this invention. FIG. 6 is a front view of the electronic component shown in FIG. 5. FIG. 6 is a side view of the electronic component shown in FIG. 5. It is a principal part enlarged front view containing the partial cross section of the electronic component shown by FIG. It is a principal part expanded side view containing the partial cross section of the electronic component shown by FIG.

[First embodiment]
First, a first embodiment of the present invention will be described.

  The electronic component 10 according to the first embodiment of the present invention shown in FIGS. 1 and 2 is, for example, integrated with a vehicle motor to control the vehicle motor, and includes a plurality of electronic elements 12. , 14, a circuit board 16, and a terminal member 18.

  The plurality of electronic elements 12 and 14 are of a so-called surface mount type, and are surface mounted on the mounting surface 16 </ b> A of the circuit board 16. A wiring pattern (not shown) is formed on the mounting surface 16A of the circuit board 16, and the plurality of electronic elements 12 and 14 are electrically connected to the wiring pattern.

  Further, as shown in FIG. 3, a pair of lands 20 are formed on the mounting surface 16 </ b> A of the circuit board 16. The pair of lands 20 are electrically connected to the wiring pattern (not shown).

  As shown in FIGS. 3 and 4, the terminal member 18 integrally includes a terminal main body portion 22, a connection portion 24, a fixing portion 26, and an elastic portion 28, and the entirety thereof is electrically conductive. It is formed with the metal material which has.

  The terminal main body 22 is configured to be connectable to an external connection terminal 30 (see FIG. 3), and is mounted on the mounting surface 16A so that the connection terminal 30 is inserted and removed along the normal direction of the mounting surface 16A. It is arranged in a standing state.

  The connection portion 24 is connected to the terminal main body portion 22 via an elastic portion 28 described later, and is soldered to the land 20. The soldering of the connecting portion 24 to the land 20 is performed by reflow soldering simultaneously with the surface mounting of the electronic elements 12 and 14 (see FIGS. 1 and 2) to the mounting surface 16A.

  The fixing portion 26 is formed in a pin shape that protrudes from the terminal body portion 22 toward the back side of the circuit board 16, and a press-fit portion 32 is formed at the center in the longitudinal direction. The fixing portion 26 is inserted into the hole 34 formed in the circuit board 16, and the press fit portion 32 is engaged with the inner peripheral surface of the hole 34. It is fixed to the substrate 16.

  The elastic portion 28 is configured to have elasticity, and when the terminal main body portion 22 is fixed to the circuit board 16 by the fixing portion 26 as described above, the connection portion 24 is landed to the terminal main body portion 22. 20 side is pressed.

  Next, the operation and effect of the first embodiment of the present invention will be described.

  According to the electronic component 10, the connection portion 24 formed on the terminal member 18 is soldered to the land 20 formed on the circuit board 16. Therefore, for example, a better electrical connection state between the circuit board 16 and the terminal member 18 can be obtained as compared with the case where the terminal member 18 and the circuit board 16 are electrically connected by a press-fit structure. That is, an allowable current value can be secured and temperature dependency can be reduced.

  In addition, since the terminal member 18 is formed with a fixing portion 26 that fixes the terminal main body portion 22 to the circuit board 16, for example, when the external connection terminal 30 is inserted into and removed from the terminal main body portion 22, Even when an external force is applied, it is possible to suppress the occurrence of stress at the connection portion between the connection portion 24 and the land 20. Thereby, the favorable electrical connection state of the circuit board 16 and the terminal member 18 can be maintained.

  Further, since the connection destination of the connection portion 24 of the terminal member 18 is the land 20 formed on the mounting surface 16A of the circuit board 16, surface mounting on the mounting surface 16A of the electronic elements 12, 14 and the connection portion The 24 lands 20 can be soldered simultaneously by reflow soldering. Therefore, compared to the case where these are performed separately (for example, when the connection pin is formed on the terminal member 18 and the connection pin is soldered to the circuit board 16 by flow soldering or soldering), the soldering is performed. Since the attaching process can be shortened, the cost can be reduced.

  Moreover, since the terminal main body portion 22, the connection portion 24, the fixing portion 26, and the elastic portion 28 are integrally formed, an increase in the number of parts can be avoided, and this also reduces the cost. Can be down.

  Further, in a state where the terminal main body portion 22 is fixed to the circuit board 16 by the fixing portion 26, the connection portion 24 is pressed toward the land 20 by the elastic portion 28, so that the electrical connection between the connection portion 24 and the land 20 is performed. The state can be made even better.

  In the first embodiment of the present invention, each of the pair of connection portions 24 is connected to the terminal main body portion 22 via the elastic portion 28. However, either one of the pair of connection portions 24 or one of the connection portions 24 is connected. The interposed elastic portion 28 may be omitted.

  Moreover, although the terminal member 18 has the four fixing | fixed parts 26, the number of the fixing | fixed parts 26 may be other than four.

  Further, the terminal main body portion 22 is a so-called female type, but may be a male type.

[Second Embodiment]
Next, a second embodiment of the present invention will be described.

  The electronic component 40 according to the second embodiment of the present invention shown in FIG. 5 to FIG. 7 is configured as follows with respect to the electronic component 10 according to the first embodiment of the present invention described above.

  That is, the electronic component 40 includes a terminal member 48 instead of the terminal member 18 (see FIGS. 1 and 2) in the first embodiment of the present invention described above.

  As shown in FIGS. 8 and 9, the terminal member 48 integrally includes a terminal main body portion 52, a connection portion 54, a fixing portion 56, and an elastic portion 58. It is formed with the metal material which has.

  The terminal body 52 is configured to be connectable to an external connection terminal 60 (see FIG. 8), and is mounted on the mounting surface 16A so that the connection terminal 60 is inserted and removed along a direction parallel to the mounting surface 16A. It is arranged in a recumbent state.

  The connection portion 54 is connected to the terminal main body portion 52 via an elastic portion 58 described later, and is soldered to a land 50 formed on the mounting surface 16A of the circuit board 16. The soldering of the connecting portion 54 to the land 50 is performed by reflow soldering simultaneously with the surface mounting of the electronic elements 12 and 14 (see FIGS. 5 to 7) to the mounting surface 16A.

  The fixing portion 56 is formed in a pin shape protruding from the terminal main body portion 52 toward the back side of the circuit board 16. Then, the fixing portion 56 is inserted into the hole portion 64 formed in the circuit board 16, and the tip portion 56A of the fixing portion 56 is bent and engaged with the peripheral edge portion of the hole portion 64, whereby the terminal The main body 52 is fixed to the circuit board 16.

  6 and 7, the distal end portion 56A of the fixing portion 56 is shown in a folded state, and in FIGS. 8 and 9, the distal end portion 56A of the fixing portion 56 is shown in a state before being bent. ing.

  The elastic portion 58 is configured to have elasticity. When the terminal main body portion 52 is fixed to the circuit board 16 by the fixing portion 56 as described above, the connection portion 54 is landed with respect to the terminal main body portion 52. It is pressing to the 50 side.

  Next, the operation and effect of the second embodiment of the present invention will be described.

  According to the electronic component 40, the connection portion 54 formed on the terminal member 48 is soldered to the land 50 formed on the circuit board 16. Therefore, for example, a better electrical connection state between the circuit board 16 and the terminal member 48 can be obtained as compared with the case where the terminal member 48 and the circuit board 16 are electrically connected by a press-fit structure. That is, an allowable current value can be secured and temperature dependency can be reduced.

  In addition, since the terminal member 48 is formed with a fixing portion 56 that fixes the terminal main body 52 to the circuit board 16, for example, when the external connection terminal 60 is inserted into and removed from the terminal main body 52, Even when an external force is applied, it is possible to suppress the occurrence of stress at the connection portion between the connection portion 54 and the land 50. Thereby, the favorable electrical connection state of the circuit board 16 and the terminal member 48 can be maintained.

  Further, since the connection destination of the connection portion 54 of the terminal member 48 is the land 50 formed on the mounting surface 16A of the circuit board 16, surface mounting on the mounting surface 16A of the electronic elements 12, 14 and the connection portion The soldering of 54 to the land 50 can be performed simultaneously by reflow soldering. Therefore, compared with the case where these are performed separately (for example, when a connection pin is formed on the terminal member 48 and soldering of the connection pin to the circuit board 16 is performed by flow soldering or iron soldering), soldering is performed. Since the attaching process can be shortened, the cost can be reduced.

  In addition, since the terminal main body 52, the connecting portion 54, the fixing portion 56, and the elastic portion 58 are integrally formed, an increase in the number of parts can be avoided, which also reduces the cost. Can be down.

  Furthermore, in a state where the terminal main body 52 is fixed to the circuit board 16 by the fixing portion 56, the connection portion 54 is pressed toward the land 50 by the elastic portion 58, so that the electrical connection between the connection portion 54 and the land 50 is performed. The state can be made even better.

  In the second embodiment of the present invention, the terminal body 52 is a so-called female type, but may be a male type.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above, and other various modifications can be made without departing from the spirit of the present invention. It is.

DESCRIPTION OF SYMBOLS 10,40 ... Electronic component, 12, 14 ... Electronic element, 16 ... Circuit board, 16A ... Mounting surface, 18, 48 ... Terminal member, 20, 50 ... Land, 22 , 52 ... Terminal body part, 24, 54 ... Connection part, 26, 56 ... Fixed part, 28, 58 ... Elastic part, 30, 60 ... Connection terminal, 32 ... Press Fit part, 34, 64 ... hole

Claims (2)

A circuit board having a mounting surface on which an electronic element is surface-mounted, and a land formed on the mounting surface;
A terminal main body portion disposed on the mounting surface and connectable to an external connection terminal, a connection portion soldered to the land, and a terminal body portion inserted into a hole formed in the circuit board A terminal member integrally formed with a fixing portion for fixing the circuit board to the circuit board;
With electronic components. The terminal member has elasticity, and an elastic portion that presses the connection portion toward the land side with respect to the terminal main body portion in a state where the terminal main body portion is fixed to the circuit board by the fixing portion. Formed,
The electronic component according to claim 1.

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