JP2011243723A - Printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology to reduce the occurrence of defective in a printed circuit board having a circuit pattern for a continuity test.SOLUTION: A printed circuit board 1a is divided at a part where a V-cut processing part 7 is formed into a cut-away printed circuit board 1b and a mounting printed circuit board 1c. Moreover, a continuity terminal measurement part 4 is formed on the printed circuit board 1a so that the cut-away printed circuit board 1b can be connected to the mounting printed circuit board 1c. An approximate C-shaped state slit 6 is formed so as to enclose the outer periphery of a mounting side continuity terminal measurement part 4c in the continuity terminal measurement part 4. An approximate C-shaped state end part extends to the cut-away printed circuit board 1b side. When divided at the part of the V-cut processing part 7, a continuity test board piece 8 is separated from the mounting printed circuit board 1c.

Description

  The present invention relates to a printed circuit board, and more particularly to a printed circuit board having a circuit pattern for continuity test for determining the state of V-cut processing.

  A V-groove having a V-shaped cross section is processed on the surface of the printed circuit board so that the printed circuit board can be easily divided after component mounting. In order to confirm whether or not the V-groove has been processed properly, a circuit pattern for continuity test is provided on the insulating substrate, and the printed circuit board is divided after the continuity test. There is a technology (for example, see Patent Document 1). As shown in FIG. 5, the printed circuit board has a conductive circuit pattern having continuity test terminal portions on both sides on an insulating substrate, and linear dividing groove processing (hereinafter referred to as “divided into a plurality of printed wiring boards”). , “V cut processing”) is performed between the continuity test terminal portions of the conductive circuit pattern. If the continuity test is not conducted, it is determined that the V-cut processing is properly performed, and the printed circuit board is sent to the next step.

Japanese Patent Laid-Open No. 61-91992

  By the way, in the technique disclosed in Patent Document 1, when the conductive circuit pattern on both sides of the printed circuit board is provided and V-cut processing is performed thereon, the remaining copper foil cut surface is generated, and the remaining copper foil is partially removed from the substrate. May be floating. When this copper foil is assembled, it may become a floating substance due to peeling of the copper foil in the environment after the product, which may cause an electrical short or a gap to cause mechanical stress. Therefore, a technique for avoiding such a problem has been demanded.

  In view of the above problems, an object of the present invention is to provide a technique for reducing the occurrence of defects in a printed circuit board having a circuit pattern for continuity testing.

The apparatus according to the present invention is configured such that a V-cut process is performed to divide the first printed board and the second printed board, and the first printed board is used to determine the state of the V-cut process. The present invention relates to a printed circuit board having a circuit pattern for continuity testing formed so as to be in electrical communication with the second printed circuit board. The printed circuit board includes a first slit formed so as to surround a part of the outer periphery of the circuit pattern, and the circuit pattern includes a first conductive portion formed on a surface of the first printed circuit board. A second conductive part formed on the surface of the second printed circuit board, and a conductive pattern formed so as to electrically connect the first conductive part and the second conductive part. A conductive portion, wherein the connecting conductive portion is formed at a position to be separated when the V-cut processing is performed, and the first slit surrounds an outer periphery of the first conductive portion. And the first conductive portion formed on the first printed circuit board when divided into the first printed circuit board and the second printed circuit board in the region where the V-cut processing is performed. Is separated from the first printed circuit board It is formed in so that.
The first conductive portion has a first through hole that communicates the substrate surface and the substrate back surface, and the second conductive portion has a second through hole that communicates the substrate surface and the substrate back surface. The connecting conductive portion may be formed so as to connect the first through hole and the second through hole inside the substrate.
Further, when the second printed circuit board is divided into the first printed circuit board and the second printed circuit board so as to surround the second conductive part and in the region where the V-cut processing is performed. The second conductive part formed on the second printed board may have a second slit formed so as to be separated from the second printed board.
Another apparatus according to the present invention relates to a printed circuit board having a circuit pattern for continuity testing for determining the state of V-cut processing. This printed circuit board is formed so as to surround the circuit pattern, and has a slit provided so as to separate the circuit pattern when the V-cut processing is performed.

  ADVANTAGE OF THE INVENTION According to this invention, the technique which reduces a malfunction occurrence can be provided in the printed circuit board which has a circuit pattern for a continuity test.

It is the top view which showed the printed circuit board based on embodiment of invention. It is sectional drawing which showed the printed circuit board based on embodiment of invention. It is the top view which showed the printed circuit board after V cut processing based on embodiment of invention. It is sectional drawing which showed the printed circuit board based on the modification of embodiment of invention. It is the figure which showed the printed circuit board which has the circuit pattern for a continuity test based on a prior art.

  Next, modes for carrying out the present invention (hereinafter, simply referred to as “embodiments”) will be specifically described with reference to the drawings.

  FIG. 1 is a diagram (plan view) illustrating a printed circuit board 1a according to the present embodiment. FIG. 1A is an overall view of the printed circuit board 1a, and FIG. 1B is an enlarged view of a region X in which the conduction terminal measuring unit 4 of FIG. 1A is provided. The printed circuit board 1a is separated into a left side printed circuit board 1b and a right side mounted printed circuit board 1c in the vicinity of the left end. In order to separate the discarded printed circuit board 1b and the mounted printed circuit board 1c, a V-cut processing section 7 is formed at the boundary between them. In addition, in FIG. 1, the state before the V-cut process part 7 is formed is shown.

  The configuration of the conduction terminal measurement unit 4 will be described in detail with reference to FIGS. 1B and 2. FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1B. In particular, FIG. 2A shows a state before the V-cut processed portion 7 is formed, and FIG. The state after the V-cut process part 7 is formed is shown.

  As shown mainly in FIG. 1 (b), the conduction terminal measurement unit 4 is made of a good conductive metal such as copper, and the discarding portion side conduction terminal measurement unit 4b provided on the discarding printed circuit board 1b. The mounting-side conductive terminal measuring unit 4c provided on the mounting printed board 1c and the conductive pattern 2 formed inside the substrate so as to communicate with them are provided.

  The discarding part side conduction terminal measuring part 4b includes a discarding part side through hole 3b that communicates the front and back surfaces of the discarding part printed board 1b. The discard portion side conduction terminal measurement portion 4b on the front surface side and the discard portion side conduction terminal measurement portion 4b on the back surface side are electrically connected by the discard portion side through hole 3b.

  Similarly, the mounting-side conduction terminal measurement unit 4c includes a mounting-side through hole 3c that communicates the front and back surfaces of the mounting printed board 1c. The mounting-side conduction terminal measurement unit 4c on the front surface side and the mounting-side conduction terminal measurement unit 4c on the back surface side are electrically connected by the mounting-side through hole 3c.

  In addition, the conductive pattern 2 has two layers inside the substrate so as to connect the discarded portion side through hole 3b of the discarded portion side conducting terminal measuring portion 4b and the mounting side through hole 3c of the mounted side conducting terminal measuring portion 4c. Is formed. And when the V-cut process part 7 is formed, the conduction | electrical_connection pattern 2 will be isolate | separated.

  further. A substantially C-shaped slit 6 is formed so as to surround the outer periphery of the mounting-side conductive terminal measurement unit 4c. Here, the slit 6 has a substantially inverted C shape, and has a shape in which the discard printed circuit board 1b side is open, and the upper and lower opening ends of the substantially C shape extend to the discard printed circuit board 1b side. Yes. That is, the slit 6 extends from the mounting printed circuit board 1c to the discard printed circuit board 1b across the position where the V-cut processing section 7 is formed.

  In the conductive terminal measuring unit 4 having such a configuration, as shown in FIG. 2A, if the V cut processing unit 7 is not formed, the discarding portion side conductive terminal measuring unit 4b and the mounting side are provided. When the continuity test is performed by bringing the continuity test needle 5 into contact with the continuity terminal measuring unit 4c, the continuity state is detected. On the other hand, as shown in FIG. 2 (b), when the V-cut processed portion 7 is formed, the continuity pattern 2 is separated and the continuity test needle 5 is brought into contact with the continuity test. A conduction state is detected. That is, by detecting the non-conductive state, it can be determined that the V-cut processed portion 7 is properly formed. If the conductive state is established, the V-cut processed portion 7 is not formed or is in a defective state. It can be determined that the portion 7 is formed.

  FIG. 3 shows a printed circuit board 1a on which a V-cut processed portion 7 is formed. In particular, FIG. 3 (a) shows a state before the discarded printed circuit board 1b and the mounted printed circuit board 1c are separated. b) shows the state after division. The printed circuit board 1a, which is in the state shown in FIG. 2 (b) and FIG. 3 (a) and determined that the V-cut processed portion 7 is properly formed by the continuity test, is sent to the next step. In a predetermined process, as shown in FIG. 3B, the printed circuit board 1b and the mounting printed board 1c are divided.

  At this time, the V-cut processed portion 7 is formed across the upper and lower ends of the substantially C-shaped slit 6 and is divided at that portion, so that the continuity test board piece 8 is separated from the discarded printed board 1b and the mounted print. The substrate 1c is separated from both substrates. In this way, the structure used for the test of whether or not the V-cut processing is properly performed is removed from the mounting printed board 1c. Therefore, it is possible to prevent the occurrence of defects due to the portion used for the continuity test. That is, it is possible to prevent the generation of suspended matters due to peeling of the copper foil or the like. As a result, it is possible to prevent floating pieces (copper foil or the like) of the conductive terminal measuring unit 4 from remaining on the substrate and causing an electrical short, or entering a gap in the manufacturing apparatus and generating mechanical stress or the like.

  Further, since the conductive pattern 2 is formed in the inner layer portion of the substrate after the V-cut processed portion 7 is formed but before the separation printed circuit board 1b and the mounting printed circuit board 1c are separated, the conductive pattern 2 is V. A phenomenon that occurs only on the formation surface (V-cut surface) of the cut processed portion 7 and the copper foil is lifted from the thickness of the substrate is eliminated. As a result, the occurrence of a short circuit can be avoided, and for example, it is possible to prevent the copper foil from being inappropriately separated during conveyance to the next process and adversely affecting the manufacturing apparatus, other components, and the like. Further, by providing the conductive pattern 2 (copper foil) on the inner layer, it is possible to determine not only the presence or absence of V-cut processing but also the depth of the groove (V-cut depth).

  The present invention has been described based on the embodiments. This embodiment is an exemplification, and it will be understood by those skilled in the art that various modifications can be made to combinations of these components, and such modifications are also within the scope of the present invention.

  FIG. 4 shows a printed circuit board 11a according to a modification. The printed circuit board 11a is a part where the V-cut processing portion 17 is formed, and is separated into a first mounted printed circuit board 11b and a second mounted printed circuit board 11c. The conduction terminal measurement unit 14 is formed so as to connect the first mounting printed board 11 b and the second mounting printed board 11 c by the conduction pattern 22.

  Further, a substantially C-shaped first slit 16b is formed so as to surround the first conductive terminal measurement unit 14b provided on the first mounting printed board 11b. In the first slit 16b, the substantially C-shaped end portion extends to the second mounting printed board 11c side beyond the position where the V-cut processed portion 17 is formed.

  Similarly, a substantially inverted C-shaped second slit 16c is formed so as to surround the second conductive terminal measurement unit 14c provided on the second mounting printed board 11c. In the second slit 16c, the substantially inverted C-shaped end portion extends to the first mounting printed board 11b side beyond the position where the V-cut processed portion 17 is formed.

  Then, when the V-cut processed portion 17 is formed, and the printed board 11a is divided into the first mounted printed board 11b and the second mounted printed board 11c at that portion, the first continuity test board piece 18b and the second The second continuity test board piece 18c is separated from the first mounting printed board 11b and the second mounting printed board 11c.

  With such a configuration, the same effect as that of the above-described embodiment can be obtained, and even in the printed circuit board 11a having a configuration without a discarding part, when the printed circuit board 11a is divided, the conduction terminal measuring unit 14 (first and second) The continuity test board pieces 18b, 18c) can be removed.

  In the embodiment and the modification described above, the configuration in which the conductive patterns 2 and 22 are formed inside the substrate has been described. However, the present invention can also be applied to a printed circuit board having a structure in which a conductive pattern is formed on the substrate surface. The slits 6 and 16 may have any shape as long as the continuity test substrate piece is separated when the printed circuit board is divided.

1a, 11a Printed circuit board 1b Discarded part printed circuit board 1c Mounted printed circuit board 2, 22 Conductive pattern 3b Discarded part side through hole 3c Mounted side through hole 4 Conducted terminal measuring part 4b Discarded part side conducting terminal measuring part 4c Mounted side conducting terminal measuring part 5 Continuity inspection needle 6 Slit 7, 17 V cut processing part 8 Continuity test board piece 11b 1st mounting printed board 11c 2nd mounting printed board 14b 1st conduction terminal measurement part 14c 2nd conduction terminal measurement part 16b 1st 1 slit 16c second slit 18b first continuity test board piece 18c second continuity test board piece

Claims (4)

A V-cut process is performed to divide the first printed board and the second printed board, and the first printed board and the second printed board are used to determine the state of the V-cut process. A printed circuit board having a circuit pattern for continuity testing formed so as to be in electrical communication with
A first slit formed so as to surround a part of the outer periphery of the circuit pattern;
The circuit pattern is
A first conductive portion formed on a surface of the first printed circuit board;
A second conductive portion formed on the surface of the second printed circuit board;
A connecting conductive portion that is a conductive pattern formed so as to electrically connect the first conductive portion and the second conductive portion;
The connection conductive part is formed at a position where the connection conductive part is separated when the V-cut processing is performed,
When the first slit is divided into the first printed circuit board and the second printed circuit board so as to surround the outer periphery of the first conductive portion and in the region where the V-cut processing is performed. The printed circuit board, wherein the first conductive portion formed on the first printed circuit board is separated from the first printed circuit board. The first conductive portion has a first through hole that communicates the front surface and the back surface of the substrate,
The second conductive portion has a second through hole that communicates the front surface and the back surface of the substrate,
The printed circuit board according to claim 1, wherein the connecting conductive portion is formed so as to connect the first through hole and the second through hole inside the substrate.   When the second printed circuit board is divided into the first printed circuit board and the second printed circuit board so as to surround the second conductive portion of the second printed circuit board and in the region where the V-cut processing is performed, The said 2nd electroconductive part formed in the 2nd printed circuit board has a 2nd slit formed so that it might isolate | separate from the said 2nd printed circuit board. Printed circuit board. A printed circuit board having a circuit pattern for continuity testing for determining the state of V-cut processing,
A printed board having a slit formed so as to surround a part of an outer periphery of the circuit pattern and provided to separate the circuit pattern when the V-cut processing is performed.

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