JP2011240467A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a reverse oscar type polishing device capable of easily controlling a polishing amount, and performing stable polishing even if dropping a polishing liquid to a color filter outside an upper platen and polishing the color filter.SOLUTION: In the polishing device, the upper platen 33 comprises an upper platen upper layer 33a and an upper platen lower layer 33b so as to limit a distribution of a load on a lower platen 1 facing the upper platen to only an outer circumferential part of the upper platen, and is provided with a plurality of push-in bolts 31 from an inner face r except the center q of the upper platen upper layer 33a toward an outer circumferential part t as an adjustment mechanism for forming the lower face of the upper platen in a center recessed concave shape 50. An upper platen 43 is formed with a slit 44 dividing the upper platen into two parts in the thickness direction from an inner face except the center toward an outer circumferential part, and provided with a plurality of push-in bolts 41 from the inner face except the center of an upper platen upper half part 43a toward the outer circumferential part.

Description

  The present invention relates to a polishing apparatus used for manufacturing a color filter, and in particular, even if polishing is performed by dropping a polishing liquid from an upper polishing liquid dropping nozzle onto a color filter outside an upper surface plate. The present invention relates to a polishing apparatus that can easily control the amount, easily obtain a target polishing amount, and perform stable polishing with little variation.

  In a display device such as a liquid crystal display device, it is a useful means to use a color filter for purposes such as color display, reflectance reduction, contrast adjustment, and spectral characteristic control. In many cases, the color filter used in this display device is formed and used as a pixel. As a method for forming a pixel of a color filter used in a display device, a printing method, a photolithography method, and the like can be given as methods that have been practically used.

  FIG. 1 is an enlarged plan view illustrating an example of a pixel of a color filter used in a liquid crystal display device. 2 is a cross-sectional view taken along line XX of the pixel of the color filter shown in FIG. As shown in FIGS. 1 and 2, the color filter used in the liquid crystal display device has a black matrix (21), a colored pixel (22), and a transparent conductive film (23) sequentially on a glass substrate (10). It is formed.

  As a manufacturing method of the color filter used in the liquid crystal display device, first, a black matrix (21) is formed on a glass substrate (10), and then black on the glass substrate on which the black matrix (21) is formed. A method of forming a colored pixel (22) in alignment with the opening of the matrix and further forming a transparent conductive film (23) is widely used.

  The black matrix (21) has a light-shielding property, and the positions of the colored pixels on the glass substrate are determined at the opening to make the size uniform. In addition, when used in a display device, it has a function of blocking unwanted light and making an image of the display device a uniform image with no unevenness and an improved contrast. The black matrix (21) is formed by, for example, providing a black photoresist coating film on a glass substrate (10), and forming the black matrix by exposing and developing the coating film through a photomask. Lithography is used.

  The colored pixel (22) is, for example, a pixel in which three primary colors of red, green, and blue are functioned as a color reproduction filter. A pigment or the like is formed on a glass substrate (10) on which a black matrix is formed. A photolithographic method is employed in which a colored photoresist coating film in which the above dye is dispersed is provided, and colored pixels are formed by exposing and developing the coated film through a photomask.

  The transparent conductive film (23) is formed by forming a transparent conductive film on a glass substrate on which colored pixels are formed, for example, by sputtering using ITO (Indium Tin Oxide).

Resist residue remaining on the colored pixels formed by the photolithography method is used for the adhesion of the transparent conductive film (23) in the film formation of the transparent conductive film, or the peripheral portion (margin portion) of the color filter as a subsequent process. ) Is not preferable for the adhesion when sealing with the counter substrate, and the color filter surface is subjected to a polishing process in order to remove the residual resist residue.

3 and 4 are explanatory views showing an outline of an example of a flat plate polishing apparatus called an inverted Oscar type that is generally used when polishing a color filter. FIG. 3 is a sectional view of a rotating portion of the flat plate polishing apparatus, and FIG. 4 is a plan view.
As shown in FIGS. 3 and 4, the rotating portion of the polishing apparatus includes a disk-shaped lower surface plate (1), a rotating shaft (2) fixed integrally with the lower surface plate and rotating the lower surface plate, a disk-shaped surface plate. The upper surface plate (3) is composed of a rotating shaft (4) fixed integrally with the upper surface plate and rotating the upper surface plate.

  The size of the upper surface plate (3) is smaller than that of the lower surface plate (1), and the lower surface plate (1) and the upper surface plate (3) are driven and rotated separately. The upper surface plate (3) swings (C) in an arc shape on the upper surface of the lower surface plate (1). Further, the pressure (D) set from the upper part of the upper surface plate (3) is applied for polishing. The upper surface plate (3) may swing linearly. A polishing cloth (5) is bonded to the lower surface of the upper surface plate (3), and a dripping nozzle (9) for polishing liquid is provided above the lower surface plate (1).

  In the polishing method, first, the color filter (6) is attached to the upper surface of the lower surface plate (1) so that the surface of the color filter faces upward. The polishing liquid (slurry) (8) is dropped from the polishing liquid lower nozzle (9) above the color filter (6) onto the color filter indicated by x in FIG. Polishing is performed while dripping the polishing liquid onto the color filter.

  Next, the upper surface plate (3) is lowered onto the color filter, and the set pressure is applied. The rotating shaft (2) and the rotating shaft (4) are driven to rotate the lower surface plate (1) and the upper surface plate (3) in a fixed direction (A, B), and also to the rotating shaft (2). The upper surface plate (3) is swung in a fixed direction (C) by a connected drive mechanism (not shown). In this way, the surface of the color filter (6) is polished. Note that reference numeral (7) represents a backing and a template.

The polishing amount of an object to be polished by such a polishing apparatus is expressed by the Preston formula (the following mathematical formula (1)).
V = k · p · v · t (1)
V: Polishing amount k: Constant according to processing conditions such as polishing liquid
p: Polishing pressure v: Relative speed t: Time As shown in Formula (1), the polishing amount depends on parameters of p, v, and t.

  FIG. 5 is a cross-sectional view illustrating a state of a load acting on this type of upper surface plate (13) by pressurization from above. FIG. 5 shows a state in which the load is evenly distributed in the lower surface of the upper surface plate (13) during polishing. As shown in FIG. 5, the load (W) acting on the upper surface plate (13) due to external pressure (D) causes the lower surface plate (1) (on the lower surface plate) to face the upper surface plate (13). An equal load is applied at each action point (a1 to an) of the attached color filter (6).

In FIG. 5, the load (W1-1) at the action point (a1) at the left end (outer peripheral part) of the upper surface plate (13) and the load (W1-n) at the action point (an) at the right end (outer peripheral part). In addition, all the loads ((W1-2) to (W1- (n-1))) at the respective operation points (a2 to a (n-1)) during this period are the same, and the distribution is uniform. It has become.
The load (W) corresponds to the polishing pressure in the formula (1). At the time of polishing, as shown in FIG. 5, it is desirable that the value be uniform within the lower surface of the upper surface plate (13).

However, in the above flat plate polishing apparatus, the polishing liquid (8) is dropped from the upper polishing liquid dropping nozzle (9) onto the color filter outside the upper surface plate (3) indicated by x in FIG. Therefore, it is difficult to take the polishing liquid (8) into the lower surface of the upper surface plate (3), that is, the entire surface of the lower surface of the polishing cloth (5), and to extend the polishing liquid (8). A large amount is supplied in the vicinity of the outer periphery of (3).
That is, the polishing liquid (8) is abundant in the vicinity of the outer peripheral portion of the upper surface plate (3) (the outer peripheral portion of the polishing cloth (5)), and within the lower surface of the upper surface plate (3) (the lower surface of the polishing cloth (5)). It is in an unevenly distributed state such that the number of

  Accordingly, as indicated by arrows in FIG. 6, the load (W2-1) at the action point (a1) at the left end (outer peripheral part) of the upper surface plate (3) and the action point (an) at the right end (outer peripheral part). The load (W2-n) is large. Moreover, each load ((W2-2)-(W2- (n-1))) in each action point (a2-a (n-1)) other than the outer peripheral part of the upper surface plate (3) is small. It becomes a thing.

  As described above, when polishing is performed in a state where the load is large at the outer peripheral portion of the upper surface plate (3) and the load is small within the lower surface of the upper surface plate (3), the amount of polishing is not easily controlled, and the target It is difficult to obtain the polishing amount, and the variation in the polishing amount becomes large. That is, there is a problem that it is difficult to obtain a stable polishing amount.

JP 2008-302469 A JP 2004-195602 A JP 2005-288649 A

  The present invention has been made to solve the above problems, and in an inverted Oscar type polishing apparatus used when polishing a color filter, the upper polishing liquid is dropped on the color filter outside the upper surface plate. Even if the polishing liquid is dropped from the nozzle, the polishing amount can be easily controlled, the target polishing amount can be easily obtained, and the variation in the polishing amount can be reduced, that is, stable polishing. It is an object of the present invention to provide a polishing apparatus capable of performing the above.

The present invention has a lower surface plate that rotates horizontally with a color filter pasted on its upper surface,
A polishing cloth is bonded to the lower surface, and the polishing cloth faces the color filter and rotates and swings horizontally on the lower surface plate, a disk-shaped upper surface plate smaller in size than the lower surface plate,
A polishing liquid dropping nozzle for dropping the polishing liquid from above on the color filter outside the upper surface plate,
In a polishing apparatus having at least a pressurizing mechanism that pressurizes the upper surface plate downward,
In order to distribute the load to the lower surface plate facing the upper surface plate only to the outer peripheral portion of the upper surface plate, a polishing apparatus provided with an adjusting mechanism that makes the lower surface of the upper surface plate a concave shape is there.

  Further, the present invention is the polishing apparatus according to the above invention, wherein the upper surface plate is composed of an upper surface plate upper layer and an upper surface layer lower layer, and the adjusting mechanism has an inner surface excluding the central portion of the upper surface plate upper layer as the adjusting mechanism. A polishing apparatus characterized in that a plurality of the polishing apparatus is provided from the portion toward the outer peripheral portion.

Further, the present invention is the polishing apparatus according to the above invention, wherein the upper platen is provided with a slit that bisects the thickness direction from the inner surface portion excluding the central portion toward the outer peripheral portion, The polishing apparatus is characterized in that a plurality of bolts are provided from the inner surface portion excluding the central portion of the upper half of the upper surface plate divided from the inner surface toward the outer peripheral portion.

  Further, in the polishing apparatus according to the present invention, the concave depth of the lower surface of the upper surface plate is 20 to 40 μm at the center when the diameter of the upper surface plate is 40 to 100 cm. A polishing apparatus characterized by the following.

  Further, the present invention is the polishing apparatus according to the above invention, wherein the lower surface plate is provided with an adjusting mechanism for flattening an upper surface thereof.

  In the present invention, the upper surface plate is composed of the upper surface plate upper layer and the upper surface plate lower layer so that the load distribution to the lower surface plate facing the upper surface plate is limited only to the outer peripheral portion of the upper surface plate. Since a plurality of push bolts are provided from the inner surface except the center of the upper surface plate to the outer periphery, the polishing liquid is dropped from the upper polishing liquid dropping nozzle onto the color filter outside the upper surface plate. Even if polishing is performed, the polishing amount can be easily controlled, the target polishing amount can be easily obtained, and the variation in the polishing amount can be reduced, that is, a polishing apparatus capable of performing stable polishing. Become.

  Further, in the present invention, in order to distribute the load to the lower surface plate facing the upper surface plate only at the outer peripheral portion of the upper surface plate, the inner surface excluding the central portion of the slit that bisects the thickness direction into the upper surface plate. As the adjusting mechanism, a plurality of push bolts are provided from the inner surface to the outer periphery excluding the central part of the upper half of the upper surface plate. Even when the polishing liquid is dropped from the upper polishing liquid dropping nozzle onto the color filter, the polishing amount can be easily controlled, the target polishing amount can be easily obtained, and the variation in the polishing amount is small. That is, the polishing apparatus can perform stable polishing.

It is a top view which expands and shows an example of the pixel of the color filter for liquid crystal display devices. It is sectional drawing in the XX line of the pixel of the color filter shown in FIG. It is sectional drawing of the rotation part of an example of a flat plate grinding | polishing apparatus. It is a top view of the rotation part of an example of a flat board grinding | polishing apparatus. It is sectional drawing explaining the state of the load which acts on an upper surface plate by the pressurization from upper part. It is sectional drawing explaining the state of the load which acts on the conventional upper surface plate. It is sectional drawing explaining an empirical rule. It is sectional drawing which shows an example of the upper surface plate in the grinding | polishing apparatus of invention. It is a top view which shows an example of the upper surface plate in the grinding | polishing apparatus of invention, and another example. It is sectional drawing which shows the other example of the upper surface plate in the grinding | polishing apparatus of invention.

Hereinafter, embodiments of the present invention will be described in detail.
The inventor has attached a color filter to a lower surface plate that rotates horizontally, and a disk-shaped upper surface plate that is horizontally rotated and swings on the lower surface plate with a polishing cloth facing the color filter. A polishing apparatus having a plate, a dropping nozzle for dropping the polishing liquid onto the color filter outside the upper surface plate, and a pressurizing mechanism for pressing the upper surface plate downward is used, and is located outside the upper surface plate. When the polishing liquid is dropped from the upper polishing liquid dropping nozzle onto the color filter affixed to the upper surface of the lower surface plate, the bottom surface is made concave to ensure stable polishing. From the rule of thumb, it has been found that the use of the surface plate, that is, the distribution of the load on the lower surface plate of the upper surface plate is only the outer periphery of the upper surface plate.

FIG. 7 is a sectional view for explaining this rule of thumb. As shown in FIG. 7, the lower surface of the disk-shaped upper surface plate (63) has a concave shape (50). The concave shape (50) is gradually deeper from the outer peripheral portion toward the central portion (q).
The load acting on the upper platen (63) by external pressure (D) is the load (W3-1) at the point of action (a1) at the left end (outer peripheral part) of the upper platen (63) in FIG. ) And the load (W3-n) at the action point (an) at the right end (outer peripheral portion). There is no point of action during this time, and there is no load at each point of action (a2 to a (n-1)) other than the outer peripheral portion shown in FIG.

  As a result, conventionally, it is difficult to control the polishing amount, and it is difficult to obtain a target polishing amount, and the variation in the polishing amount becomes large. That is, it has been found that the problem that it is difficult to obtain a stable polishing amount is solved.

  Specifically, when the diameter (φ1) of the upper surface plate (63) is about 40 to 100 cm, the depth of the middle concave shape (50) at the center (q) of the upper surface plate (63) ( It was found that good results were obtained when d) was 20 to 40 μm.

  However, it has been found that it is extremely difficult to stably grind the lower surface of the upper surface plate (63) into a middle concave shape (50) having a depth of 20 to 40 μm. The present inventors have scrutinized a method for easily and stably shaping into an indented shape (50) and arrived at the present invention.

8 and 9 are a cross-sectional view and a plan view showing an example of the upper surface plate in the polishing apparatus of the present invention. A cross section taken along line XX in FIG. 9 corresponds to FIG.
As shown in FIGS. 8 and 9, the upper surface plate (33) shown in this example is composed of two layers, an upper surface plate upper layer (33a) and an upper surface plate lower layer (33b). The upper surface plate (33) is obtained by superposing the upper surface plate upper layer (33a) on the upper surface plate lower layer (33b). The upper surface plate lower layer (33b) and the upper surface plate upper layer (33a) Only in the central part (q), it is fixed integrally by a restraining tool (not shown).

  The surface finish of the upper surface plate lower layer (33b) and the upper surface plate upper layer (33a) is preferably 20 μm or less. Further, for example, a material having high rigidity is used as the material of the upper surface plate upper layer (33a), and a material having lower rigidity than the material of the upper surface plate upper layer (33a) is used as the material of the upper surface plate lower layer (33b). The lower surface of the upper surface plate lower layer (33b) can be easily formed into a concave shape by pressing with a pressing bolt. The ratio of the thickness of the upper surface plate lower layer (33b) and the upper surface plate upper layer (33a) is appropriately set.

As an adjustment mechanism for making the lower surface of the upper surface plate (33) into a concave shape, the push bolt (31) moves the intermediate portion (s) from the inner surface portion (r) excluding the central portion (q) of the upper surface plate upper layer (33a). A plurality are provided toward the outer periphery (t).
As shown in FIG. 9, in this example, push bolts (31) are provided concentrically on the upper surface plate upper layer (33a).

The arrows (Kr, Ks, Kt) shown in FIG. 8 represent the direction and strength of the pressing that the pressing bolt (31) presses the upper surface plate lower layer (33b). The pressure is gradually increased from the inner surface portion (r) toward the outer peripheral portion (t).
Thereby, the lower surface of the upper surface plate lower layer (33b) is shaped into a concave shape. In this case, the pressure is adjusted by using pressure sensitive paper or a pressure distribution measuring device while checking the distribution state.

  As described above, the upper surface plate (33) in the present invention is composed of the upper surface plate upper layer (33a) and the upper surface plate lower layer (33b), and the push bolt (31) is used as the upper platen upper layer ( 33a) has a structure in which a plurality of inner surface portions (r) excluding the central portion (q) are provided from the inner surface portion (r) toward the outer peripheral portion (t), so that the lower surface of the upper surface plate lower layer (33b) is formed in a concave shape. (50).

  Therefore, the polishing apparatus according to the present invention can easily control the polishing amount, can easily obtain the target polishing amount, and can reduce variations in the polishing amount. This enables not only the color filter polished by one polishing apparatus but also a large amount of stable polishing with the same polishing amount even when a plurality of polishing apparatuses are used.

FIG. 10 is a cross-sectional view showing another example of the upper surface plate in the polishing apparatus of the present invention. FIG. 9 is a plan view of another example. FIG. 9 also serves as a plan view of the above example of the upper surface plate. A cross section taken along line XX in FIG. 9 corresponds to FIG.
As shown in FIGS. 10 and 9, in the upper surface plate (43) shown in this other example, the slit (44) that bisects the thickness direction has an inner surface portion (r) excluding the central portion (q). To the outer peripheral part (t), and the upper part other than the center part is divided into an upper surface plate upper half part (43a) and an upper surface plate lower half part (43b).

  The surface finish of the lower surface of the upper half of the upper surface plate (43b) is preferably 20 μm or less. Further, since the material of the upper half of the upper platen (43a) and the material of the upper half of the upper platen (43b) are the same material, the lower surface of the lower half of the upper platen (43b) is pressed by the pressing bolt. In order to facilitate the formation of a middle concave shape, it is preferable to make the thickness (T2) of the lower half (43b) of the upper surface plate smaller than the thickness (T1) of the upper half (43a) of the upper surface plate. The ratio of the thickness of the upper half (43a) of the upper platen and the lower half (43b) of the upper platen is appropriately set.

As an adjusting mechanism for making the lower surface of the upper surface plate (43) into a concave shape, the push bolt (41) has an intermediate portion (s) from the inner surface portion (r) excluding the central portion (q) of the upper half portion (43a) of the upper surface plate (43a). ) Through the outer peripheral part (t).
As shown in FIG. 9, in this other example, push bolts (41) are provided concentrically on the upper half (43a) of the upper surface plate.

The arrows (K2-r, K2-s, K2-t) shown in FIG. 10 represent the direction and strength of pressing in which the pushing bolt (41) presses the upper half of the upper surface plate (43b). is there. The pressure is gradually increased from the inner surface portion (r) toward the outer peripheral portion (t).
Thereby, the lower surface of the upper half of the upper surface plate (43b) is shaped into a concave shape. In this case, the pressure is adjusted by using pressure sensitive paper or a pressure distribution measuring device while checking the distribution state.

As described above, the upper surface plate (43) in the present invention is divided into the upper surface plate upper half portion (43a) and the upper surface plate lower half portion (43b) except for the central portion, and a push bolt is used as an adjustment mechanism. (41) is a structure in which a plurality of (41) are provided from the inner surface (r) excluding the central portion (q) of the upper half (43a) toward the outer periphery (t), so that The lower surface of the lower half (43b) of the surface plate can be shaped into a concave shape (50).
Therefore, the polishing apparatus according to the present invention can easily control the polishing amount, can easily obtain the target polishing amount, and can reduce variations in the polishing amount.

  In the above, an adjustment mechanism is provided for adjusting the upper surface plate, but an adjustment mechanism may be provided on the lower surface plate in order to adjust the upper surface of the lower surface plate to be flat. By providing the adjustment mechanism, the lower surface plate can be used for adjustment to keep the upper surface flat, instead of making the upper surface into a middle concave shape or a middle convex shape.

DESCRIPTION OF SYMBOLS 1 ... Lower surface plate 2 ... Rotating shaft 3, 13, 63 ... The upper surface plate 4 ... Rotating shaft 5 which rotates an upper surface plate ... Polishing cloth 6 ... Color filter 7 ... backing and template 8 ... polishing liquid 9 ... polishing liquid dropping nozzle 10 ... glass substrate 21 ... black matrix 22 ... colored pixel 23 ... transparent conductive film 31 41 ... Push bolts 33, 43 ... Upper surface plates 33a, 33b ... Upper surface plate upper layer, upper surface plate lower layers 43a, 43b ... Upper surface plate upper half, upper surface plate Lower half 50 ... Middle concave A ... Lower platen rotation B ... Upper platen rotation C ... Upper platen arcuate swing D ... Pressure from above (W1) -1) to each load (W1-n)
a1 to an ... each action point

Claims (5)

A lower surface plate that rotates horizontally with a color filter pasted on its upper surface,
A polishing cloth is bonded to the lower surface, and the polishing cloth faces the color filter and rotates and swings horizontally on the lower surface plate, a disk-shaped upper surface plate smaller in size than the lower surface plate,
A polishing liquid dropping nozzle for dropping the polishing liquid from above on the color filter outside the upper surface plate,
In a polishing apparatus having at least a pressurizing mechanism that pressurizes the upper surface plate downward,
A polishing apparatus comprising an adjusting mechanism for making the lower surface of the upper surface plate a concave shape so that the load distribution to the lower surface plate facing the upper surface plate is limited to only the outer peripheral portion of the upper surface plate.   The upper surface plate is composed of an upper surface plate upper layer and an upper surface plate lower layer, and as the adjusting mechanism, a plurality of pushing bolts are provided from the inner surface portion to the outer peripheral portion excluding the central portion of the upper surface plate upper layer. The polishing apparatus according to claim 1, wherein:   The upper surface plate is provided with a slit that bisects the thickness direction from the inner surface portion excluding the central portion toward the outer peripheral portion, and the upper half of the upper surface plate that is divided into two as the adjusting mechanism The polishing apparatus according to claim 1, wherein a plurality of inner surfaces excluding the central portion are provided from the inner surface portion toward the outer peripheral portion.   The depth of the concave shape of the lower surface of the upper surface plate is 20 to 40 µm at the center when the diameter of the upper surface plate is 40 to 100 cm. Polishing equipment.   The polishing apparatus according to claim 1, wherein an adjustment mechanism for flattening an upper surface of the lower surface plate is provided.

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