JP2011235532A5 - - Google Patents
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- Publication number
- JP2011235532A5 JP2011235532A5 JP2010108805A JP2010108805A JP2011235532A5 JP 2011235532 A5 JP2011235532 A5 JP 2011235532A5 JP 2010108805 A JP2010108805 A JP 2010108805A JP 2010108805 A JP2010108805 A JP 2010108805A JP 2011235532 A5 JP2011235532 A5 JP 2011235532A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding film
- substrate
- film
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- 125000004429 atom Chemical group 0.000 claims 5
- 238000000862 absorption spectrum Methods 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 230000003213 activating effect Effects 0.000 description 2
- 230000009849 deactivation Effects 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010108805A JP5625470B2 (ja) | 2010-05-10 | 2010-05-10 | 接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010108805A JP5625470B2 (ja) | 2010-05-10 | 2010-05-10 | 接合方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011235532A JP2011235532A (ja) | 2011-11-24 |
| JP2011235532A5 true JP2011235532A5 (OSRAM) | 2013-08-29 |
| JP5625470B2 JP5625470B2 (ja) | 2014-11-19 |
Family
ID=45324043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010108805A Expired - Fee Related JP5625470B2 (ja) | 2010-05-10 | 2010-05-10 | 接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5625470B2 (OSRAM) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
| US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
| US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
| TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
| KR102353030B1 (ko) | 2014-01-27 | 2022-01-19 | 코닝 인코포레이티드 | 얇은 시트와 캐리어의 제어된 결합을 위한 물품 및 방법 |
| EP3129221A1 (en) | 2014-04-09 | 2017-02-15 | Corning Incorporated | Device modified substrate article and methods for making |
| KR101938755B1 (ko) * | 2014-07-10 | 2019-01-15 | 가부시키가이샤 사이콕스 | 반도체 기판 및 반도체 기판의 제조 방법 |
| EP3216050B1 (en) * | 2014-11-05 | 2021-09-08 | Corning Incorporated | Bottom-up electrolytic via plating method |
| KR102573207B1 (ko) | 2015-05-19 | 2023-08-31 | 코닝 인코포레이티드 | 시트와 캐리어의 결합을 위한 물품 및 방법 |
| JP7106276B2 (ja) | 2015-06-26 | 2022-07-26 | コーニング インコーポレイテッド | シート及び担体を有する物品及び方法 |
| TW201825623A (zh) | 2016-08-30 | 2018-07-16 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI821867B (zh) | 2016-08-31 | 2023-11-11 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| KR102659516B1 (ko) | 2017-08-18 | 2024-04-23 | 코닝 인코포레이티드 | 유리 적층체 |
| JP7053214B2 (ja) | 2017-10-17 | 2022-04-12 | スリーエム イノベイティブ プロパティズ カンパニー | 伸長可能フィルム及び表面コーティング組成物 |
| WO2019118660A1 (en) | 2017-12-15 | 2019-06-20 | Corning Incorporated | Method for treating a substrate and method for making articles comprising bonded sheets |
| US10917966B2 (en) | 2018-01-29 | 2021-02-09 | Corning Incorporated | Articles including metallized vias |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008307873A (ja) * | 2007-06-18 | 2008-12-25 | Seiko Epson Corp | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
| JP2009035720A (ja) * | 2007-07-11 | 2009-02-19 | Seiko Epson Corp | 接合膜付き基材、接合方法および接合体 |
-
2010
- 2010-05-10 JP JP2010108805A patent/JP5625470B2/ja not_active Expired - Fee Related
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