JP2011233341A - Method for manufacturing organic electroluminescent lighting device - Google Patents

Method for manufacturing organic electroluminescent lighting device Download PDF

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JP2011233341A
JP2011233341A JP2010102119A JP2010102119A JP2011233341A JP 2011233341 A JP2011233341 A JP 2011233341A JP 2010102119 A JP2010102119 A JP 2010102119A JP 2010102119 A JP2010102119 A JP 2010102119A JP 2011233341 A JP2011233341 A JP 2011233341A
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film
anode
spacers
forming
light emitting
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JP5748192B2 (en
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Yoshito Sakaguchi
嘉一 坂口
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Hotalux Ltd
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NEC Lighting Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8428Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic electroluminescent lighting device, which can improve manufacturing yield in a film formation process and hold an interval between substrates at a fixed value in a sealing process.SOLUTION: The method includes: a first film formation process for forming an anode film 2 on the surface of a transparent substrate 1; a spacer formation process for forming a plurality of spacers 3 which are arranged like a frame so as to continuously or intermittently surround the whole or a part of the surface of the anode film 2 and of which heights are higher than that of the anode film 2 and are the same height each other; a second film formation process for forming an organic light-emitting film 4 which covers the surface of the anode film 2 on the inside of the plurality of spacers 3 and of which height is lower than that of the plurality of spacers 3; a third film formation process for forming a cathode film 5 which covers the surface of the organic light-emitting film 4 and of which height is lower than that of the plurality of spacers 3; a seal part formation process for forming a seal part 6 which covers the plurality of spacers 3 and continuously surrounds the outer periphery of the organic light-emitting film 4 through the cathode film 5; and a sealing process for attaching a sealing substrate 7 to the plurality of spacers 3 in the sealing part 6 to cover an inner space 8.

Description

本発明は、有機発光膜を陽極膜と陰極膜とで挟んだ発光素子を光源とする有機エレクトロルミネッセンス照明装置の製造方法に関する。   The present invention relates to a method for manufacturing an organic electroluminescent lighting device using a light emitting element in which an organic light emitting film is sandwiched between an anode film and a cathode film as a light source.

有機発光膜を陽極膜と陰極膜とで挟んだ発光素子を光源とする有機エレクトロルミネッセンス照明装置の主要な製造工程には、成膜工程や封止工程などがある。成膜工程は、透明基板の表面に陽極膜、有機発光膜、陰極膜を順次積層して発光素子を形成する製造工程である。封止工程は、発光素子を外気から遮断する製造工程である。これらの製造工程を経て製造される有機エレクトロルミネッセンス照明装置では、封止部分の経時劣化に伴って装置内部に水分が浸入する場合がある。この場合、有機発光膜は水分に弱いので、発光しない領域(ダークスポット)が生じて発光面積が縮小(シュリンク)する可能性がある。そのため、封止工程は重要な製造工程となる。封止工程では、一般的に、発光素子が搭載された透明基板に対向して封止基板が配置される。封止基板は、発光素子を傷つけないようにするために透明基板に対して所定の間隔を取って配置される。透明基板と封止基板との間にはシール部が形成され、このシール部と封止基板とで発光素子を外気から遮断している。このような封止工程を有する有機エレクトロルミネッセンス照明装置の製造方法が特許文献1に開示されている。   A main manufacturing process of an organic electroluminescence lighting device using a light emitting element sandwiching an organic light emitting film between an anode film and a cathode film as a light source includes a film forming process and a sealing process. The film forming process is a manufacturing process in which a light emitting element is formed by sequentially laminating an anode film, an organic light emitting film, and a cathode film on the surface of a transparent substrate. A sealing process is a manufacturing process which interrupts | blocks a light emitting element from external air. In the organic electroluminescence lighting device manufactured through these manufacturing steps, moisture may enter the device as the sealed portion deteriorates with time. In this case, since the organic light emitting film is sensitive to moisture, a region that does not emit light (dark spot) may be generated, and the light emitting area may be reduced (shrink). Therefore, the sealing process is an important manufacturing process. In the sealing process, generally, a sealing substrate is disposed facing a transparent substrate on which a light emitting element is mounted. The sealing substrate is disposed at a predetermined interval with respect to the transparent substrate so as not to damage the light emitting element. A seal portion is formed between the transparent substrate and the sealing substrate, and the light emitting element is shielded from outside air by the seal portion and the sealing substrate. Patent Document 1 discloses a method for manufacturing an organic electroluminescence lighting device having such a sealing step.

特許文献1に開示された有機エレクトロルミネッセンス照明装置の製造方法では、封止基板(カラーフィルタ素子が搭載された基板)の表面に、その表面から突出しているリブ構造体がフォトリソグラフィー法により形成されている。封止工程では、このリブ構造体が、発光素子が搭載された基板に取り付けられる。これにより、発光素子が搭載された基板と封止基板との間隔を一定に保つことが可能となる。   In the method for manufacturing an organic electroluminescence lighting device disclosed in Patent Document 1, a rib structure projecting from a surface of a sealing substrate (a substrate on which a color filter element is mounted) is formed by a photolithography method. ing. In the sealing step, the rib structure is attached to the substrate on which the light emitting element is mounted. As a result, the distance between the substrate on which the light emitting element is mounted and the sealing substrate can be kept constant.

特開2008−235089号公報JP 2008-235089 A

封止工程とともに有機エレクトロルミネッセンス照明装置の主要な製造工程である成膜工程において、有機発光膜は、一般的に、開口部を備えたシャドウマスクを用いて陽極膜の表面に蒸着される。このとき、有機発光膜を目標領域に正確に蒸着するためには、シャドウマスクを陽極膜に近付けることが望ましい。しかし、シャドウマスクを陽極膜に近づけすぎると、シャドウマスクが陽極膜に接触した状態で有機発光膜の成膜工程が実施される場合がある。この場合、シャドウマスクの接触により陽極膜が損傷した不良品が増加して製造歩留まりの低下が懸念される。特許文献1には、封止基板側にリブ構造体を設けることによって基板間の間隔を一定に保つ技術は開示されているものの、上述した成膜工程における製造歩留まりの低下に対処する技術については開示されていない。   In the film forming process which is the main manufacturing process of the organic electroluminescence lighting device together with the sealing process, the organic light emitting film is generally deposited on the surface of the anode film using a shadow mask having an opening. At this time, in order to accurately deposit the organic light emitting film on the target region, it is desirable to bring the shadow mask close to the anode film. However, if the shadow mask is too close to the anode film, the organic light emitting film may be formed in a state where the shadow mask is in contact with the anode film. In this case, there is a concern that the number of defective products in which the anode film is damaged due to the contact with the shadow mask increases and the manufacturing yield decreases. Although Patent Document 1 discloses a technique for keeping a distance between substrates constant by providing a rib structure on the sealing substrate side, a technique for coping with a decrease in manufacturing yield in the above-described film formation process is disclosed. Not disclosed.

そこで、本発明は、成膜工程における製造歩留まりの向上が可能で、かつ封止工程において基板間の間隔を一定に保つことが可能な有機エレクトロルミネッセンス照明装置の製造方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide a method of manufacturing an organic electroluminescence lighting device that can improve the manufacturing yield in the film forming process and can maintain a constant spacing between the substrates in the sealing process. To do.

上記目的を達成するため、本発明による有機エレクトロルミネッセンス照明装置は、透明基板の表面に陽極膜を成膜する第1の成膜工程と、前記陽極膜の表面の全部または一部を連続してまたは断続的に囲むように枠状に配置され、前記透明基板の表面からの高さが前記陽極膜よりも高く互いに同一の高さの複数のスペーサを形成するスペーサ形成工程と、前記枠状に配置された複数のスペーサの内側で前記陽極膜の表面を覆い、前記透明基板の表面からの高さが前記複数のスペーサよりも低い有機発光膜を、シャドウマスクを用いて成膜する第2の成膜工程と、前記有機発光膜の表面を覆い、前記透明基板の表面からの高さが前記複数のスペーサよりも低い陰極膜を成膜する第3の成膜工程と、前記複数のスペーサを被覆し、前記陰極膜を介して前記有機発光膜の外周を連続して囲むシール部を形成するシール部形成工程と、封止基板を前記シール部で前記複数のスペーサに取り付けて、前記陰極膜の上方で前記シール部に囲まれた内部空間を前記封止基板で覆う封止工程と、を有する。   In order to achieve the above object, an organic electroluminescence lighting device according to the present invention includes a first film forming step of forming an anode film on the surface of a transparent substrate, and all or part of the surface of the anode film continuously. Or a spacer forming step of forming a plurality of spacers that are arranged in a frame shape so as to intermittently surround and have a height from the surface of the transparent substrate that is higher than the anode film and the same height as each other; A second organic light-emitting film is formed by using a shadow mask, covering the surface of the anode film inside the plurality of arranged spacers and having a height from the surface of the transparent substrate lower than that of the plurality of spacers. A film forming step, a third film forming step for covering the surface of the organic light emitting film and forming a cathode film having a height from the surface of the transparent substrate lower than that of the plurality of spacers, and the plurality of spacers. And coating the cathode film A sealing part forming step of continuously forming a sealing part surrounding the outer periphery of the organic light emitting film; and a sealing substrate is attached to the plurality of spacers by the sealing part, and the sealing part is provided above the cathode film. And a sealing step of covering the enclosed internal space with the sealing substrate.

本発明によれば、陽極膜を成膜する第1の成膜工程と、有機発光膜を成膜する第2の成膜工程との間に、透明基板の表面に、その表面からの高さが陽極膜よりも高いスペーサを形成するスペーサ形成工程がある。そのため、第2の成膜工程においてシャドウマスクを用いて有機発光膜を成膜する時に、シャドウマスクと陽極膜との接触がスペーサによって回避される。これにより、陽極膜を損傷させることなく有機発光膜を成膜できるので、成膜工程における製造歩留まりが向上する。また、封止工程において、封止基板がスペーサに取り付けられるので、透明基板と封止基板との間隔がスペーサによって一定に保たれる。   According to the present invention, the height from the surface of the transparent substrate is increased between the first film forming step for forming the anode film and the second film forming step for forming the organic light emitting film. There is a spacer forming step of forming a spacer whose height is higher than that of the anode film. Therefore, when the organic light emitting film is formed using the shadow mask in the second film forming step, the contact between the shadow mask and the anode film is avoided by the spacer. Thereby, since the organic light emitting film can be formed without damaging the anode film, the manufacturing yield in the film forming process is improved. Further, since the sealing substrate is attached to the spacer in the sealing step, the distance between the transparent substrate and the sealing substrate is kept constant by the spacer.

本発明の有機エレクトロルミネッセンス照明装置の製造方法の手順を示すフロー図である。It is a flowchart which shows the procedure of the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法における第1の成膜工程を説明するための断面図である。It is sectional drawing for demonstrating the 1st film-forming process in the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法におけるスペーサ形成工程を説明するための図である。It is a figure for demonstrating the spacer formation process in the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法における第2の成膜工程を説明するための断面図である。It is sectional drawing for demonstrating the 2nd film-forming process in the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法における第3の成膜工程を説明するための断面図である。It is sectional drawing for demonstrating the 3rd film-forming process in the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法におけるシール部形成工程を説明するための図である。It is a figure for demonstrating the seal | sticker part formation process in the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法における封止工程を説明するための図である。It is a figure for demonstrating the sealing process in the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法の他の実施形態を示す図である。It is a figure which shows other embodiment of the manufacturing method of the organic electroluminescent illuminating device of this invention. 本発明の有機エレクトロルミネッセンス照明装置の製造方法の他の実施形態を示す図である。It is a figure which shows other embodiment of the manufacturing method of the organic electroluminescent illuminating device of this invention. 図9に記載の切断線に沿った断面図である。FIG. 10 is a cross-sectional view taken along the cutting line shown in FIG. 9.

本発明の有機エレクトロルミネッセンス照明装置の製造方法の一実施形態について説明する。図1は、本発明の有機エレクトロルミネッセンス照明装置の製造方法の手順を示すフロー図である。以下、図1のフロー図に従って各工程を説明する。   An embodiment of a method for producing an organic electroluminescence lighting device of the present invention will be described. FIG. 1 is a flowchart showing the procedure of the method for manufacturing the organic electroluminescence lighting device of the present invention. Hereafter, each process is demonstrated according to the flowchart of FIG.

まず、第1の成膜工程(ステップS1)について説明する。図2は、第1の成膜工程を説明するための断面図である。図2に示すように、第1の成膜工程は、透明基板1の表面に陽極膜2を成膜する工程である。透明基板1は、ガラス基板やプラスチック基板などである。陽極膜2は、ITO(Indium Tin Oxide)やIZO(Indium Zinc Oxide)などを主材料とする。   First, the first film forming step (step S1) will be described. FIG. 2 is a cross-sectional view for explaining the first film formation step. As shown in FIG. 2, the first film formation step is a step of forming the anode film 2 on the surface of the transparent substrate 1. The transparent substrate 1 is a glass substrate or a plastic substrate. The anode film 2 is mainly made of ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or the like.

次に、スペーサ形成工程(ステップS2)について説明する。図3は、スペーサ形成工程を説明するための図である。図3(a)は平面図である。図3(b)は、図3(a)に記載の切断線A−Aに沿った断面図である。図3に示すように、スペーサ形成工程は、透明基板1の表面からの高さが陽極膜2よりも高く互いに同一の高さの複数のスペーサ3を形成する工程である(図3(b)参照)。複数のスペーサ3は、陽極膜2の表面の一部を断続的に囲むように枠状に配置されている(図3(a)参照)。本実施形態では、スペーサ3は、樹脂製でありフォトリソグラフィー法によって形成されている。そのため、図3(a)に示すように、複数のスペーサ3を任意の位置に任意の密度で配置できる。これにより、複数のスペーサ3を透明基板1の表面における特定の場所に凝集しないように配置することが可能となる。なお、本発明では、複数のスペーサ3は、陽極膜2の表面の全体を枠状に囲むように配置されていてもよい。また、本発明では、複数のスペーサ3は、陽極膜の表面を連続して囲むように配置されていてもよい。   Next, a spacer formation process (step S2) is demonstrated. FIG. 3 is a diagram for explaining the spacer forming step. FIG. 3A is a plan view. FIG. 3B is a cross-sectional view taken along a cutting line AA shown in FIG. As shown in FIG. 3, the spacer forming step is a step of forming a plurality of spacers 3 having a height from the surface of the transparent substrate 1 higher than that of the anode film 2 and the same height as each other (FIG. 3B). reference). The plurality of spacers 3 are arranged in a frame shape so as to intermittently surround a part of the surface of the anode film 2 (see FIG. 3A). In the present embodiment, the spacer 3 is made of resin and is formed by a photolithography method. Therefore, as shown to Fig.3 (a), the several spacer 3 can be arrange | positioned by arbitrary density in arbitrary positions. As a result, the plurality of spacers 3 can be arranged so as not to aggregate at specific locations on the surface of the transparent substrate 1. In the present invention, the plurality of spacers 3 may be arranged so as to surround the entire surface of the anode film 2 in a frame shape. In the present invention, the plurality of spacers 3 may be disposed so as to continuously surround the surface of the anode film.

次に、第2の成膜工程(ステップS3)について説明する。図4は、第2の成膜工程を説明するための図である。図4(a)は平面図である。図4(b)は、図4(a)に記載の切断線A−Aに沿った断面図である。   Next, the second film forming step (step S3) will be described. FIG. 4 is a diagram for explaining the second film forming step. FIG. 4A is a plan view. FIG. 4B is a cross-sectional view taken along the cutting line AA shown in FIG.

図4に示すように、第2の成膜工程は、枠状に配置された複数のスペーサ3の内側で陽極膜2の表面を覆い(図4(a)参照)、透明基板4からの高さがスペーサ3よりも低い(図4(b)参照)有機発光膜4を成膜する工程である。有機発光膜4は、シャドウマスクを用いて陽極膜2の表面に蒸着される。このとき、陽極膜2よりも透明電極1からの高さが高いスペーサ3が形成されているので、このシャドウマスクと陽極膜2との接触をスペーサ3によって防ぐことができる。なお、有機発光膜4の材料については特に制限されるものでなく従来と同様でよい。   As shown in FIG. 4, in the second film forming step, the surface of the anode film 2 is covered inside the plurality of spacers 3 arranged in a frame shape (see FIG. 4A), and the height from the transparent substrate 4 is increased. This is a step of forming the organic light emitting film 4 having a length lower than that of the spacer 3 (see FIG. 4B). The organic light emitting film 4 is deposited on the surface of the anode film 2 using a shadow mask. At this time, since the spacer 3 having a height higher than that of the anode 2 is formed from the transparent electrode 1, the contact between the shadow mask and the anode film 2 can be prevented by the spacer 3. The material of the organic light emitting film 4 is not particularly limited and may be the same as the conventional one.

次に、第3の成膜工程(ステップS4)について説明する。図5は、第3の成膜工程を説明するための図である。図5(a)は平面図である。図5(b)は、図5(a)に記載の切断線A−Aに沿った断面図である。図5に示すように、第3の成膜工程は、有機発光膜4の表面を覆い、透明基板1の表面からの高さがスペーサ3よりも低い陰極膜5を成膜する工程である。   Next, the third film forming step (step S4) will be described. FIG. 5 is a diagram for explaining the third film forming step. FIG. 5A is a plan view. FIG. 5B is a cross-sectional view taken along the cutting line AA shown in FIG. As shown in FIG. 5, the third film forming step is a step of forming a cathode film 5 that covers the surface of the organic light emitting film 4 and has a height from the surface of the transparent substrate 1 lower than that of the spacer 3.

次に、シール部形成工程(ステップS5)について説明する。図6は、シール部形成工程を説明するための図である。図6(a)は平面図である。図6(b)は、図6(a)に記載の切断線A−Aに沿った断面図である。図6に示すように、シール部形成工程は、スペーサ3を被覆し、陰極膜5を介して有機発光膜4の外周を連続して囲むシール部6を形成する工程である。   Next, the seal part forming step (step S5) will be described. FIG. 6 is a view for explaining a seal portion forming step. FIG. 6A is a plan view. FIG. 6B is a cross-sectional view taken along the cutting line AA shown in FIG. As shown in FIG. 6, the seal portion forming step is a step of forming a seal portion 6 that covers the spacer 3 and continuously surrounds the outer periphery of the organic light emitting film 4 with the cathode film 5 interposed therebetween.

次に、封止工程(ステップS6)について説明する。図7は、封止工程を説明するための断面図である。図7に示すように、封止工程は、封止基板7をシール部5でスペーサ3に取り付けて、陰極膜5の上方でシール部5に囲まれた内部空間8を封止基板7で覆う工程である。   Next, the sealing step (Step S6) will be described. FIG. 7 is a cross-sectional view for explaining the sealing step. As shown in FIG. 7, in the sealing step, the sealing substrate 7 is attached to the spacer 3 with the seal portion 5, and the internal space 8 surrounded by the seal portion 5 is covered with the sealing substrate 7 above the cathode film 5. It is a process.

上述したように、本実施形態では、陽極膜2を成膜する第1の成膜工程と、有機発光膜4を成膜する第2の成膜工程との間に、透明基板1の表面からの高さが陽極膜2よりも高いスペーサ3を形成するスペーサ形成工程がある。そのため、第2の成膜工程においてシャドウマスクを用いて有機発光膜4を成膜する時に、このシャドウマスクと陽極膜2との接触がスペーサ3によって回避される。これにより、陽極膜2を損傷させることなく有機発光膜4を成膜できるので、成膜工程における製造歩留まりが向上する。また、封止工程において、封止基板7がスペーサ3に取り付けられるので、透明基板1と封止基板7との間隔がスペーサ3によって一定に保たれる。   As described above, in the present embodiment, from the surface of the transparent substrate 1 between the first film forming step for forming the anode film 2 and the second film forming step for forming the organic light emitting film 4. There is a spacer forming step of forming a spacer 3 having a height higher than that of the anode film 2. Therefore, the contact between the shadow mask and the anode film 2 is avoided by the spacer 3 when the organic light emitting film 4 is formed using the shadow mask in the second film forming step. Thereby, since the organic light emitting film 4 can be formed without damaging the anode film 2, the manufacturing yield in the film forming process is improved. Further, since the sealing substrate 7 is attached to the spacer 3 in the sealing step, the distance between the transparent substrate 1 and the sealing substrate 7 is kept constant by the spacer 3.

また、本実施形態では、封止基板7における内部空間8に接する面に吸湿材9が取り付けられている。そのため、封止基板7やシール部6の経時劣化に伴って内部空間8に水分が浸入しても、この水分を吸湿材9で吸収できるので、有機発光膜4の劣化の進行を食い止めることが可能となる。   In the present embodiment, a hygroscopic material 9 is attached to the surface of the sealing substrate 7 that contacts the internal space 8. Therefore, even if moisture enters the internal space 8 due to deterioration of the sealing substrate 7 and the seal portion 6 with time, the moisture can be absorbed by the hygroscopic material 9, so that the progress of the deterioration of the organic light emitting film 4 can be stopped. It becomes possible.

なお、本実施形態では、図4(b)に示すように、第2の成膜工程において、陽極膜2の上面部を覆う有機発光膜4の厚さに比べ、陽極膜2の側面部を覆う有機発光膜4の厚さが薄くなっている。そして、図5(b)に示すように、第3の成膜工程において、陽極膜2の上面部および側面部は陰極膜5に覆われる。そのため、陽極膜2と陰極膜5との間に高電界が発生したときに、有機発光膜4では、陽極膜2の側面部を覆う部分が、陽極膜2の上面部を覆う部分に比べ絶縁破壊しやすくなる。   In the present embodiment, as shown in FIG. 4B, the side surface portion of the anode film 2 is compared with the thickness of the organic light emitting film 4 covering the upper surface portion of the anode film 2 in the second film formation step. The covering organic light emitting film 4 is thin. Then, as shown in FIG. 5B, in the third film forming step, the upper surface portion and the side surface portion of the anode film 2 are covered with the cathode film 5. Therefore, when a high electric field is generated between the anode film 2 and the cathode film 5, in the organic light emitting film 4, the portion covering the side surface portion of the anode film 2 is insulated compared to the portion covering the upper surface portion of the anode film 2. It becomes easy to destroy.

そこで、本発明では、図8に示すように、陽極膜2の側面部を覆い、透明基板1の表面からの高さがスペーサ3よりも低く絶縁性を備えた陽極エッジカバー10を形成する工程を有していてもよい。図8は、本発明の有機エレクトロルミネッセンス照明装置の製造方法の他の実施形態を示す図である。図8(a)は平面図である。図8(b)は、図8(a)に記載の切断線A−Aに沿った断面図である。   Therefore, in the present invention, as shown in FIG. 8, a step of forming an anode edge cover 10 that covers the side surface of the anode film 2 and has a lower insulating height than the spacer 3 from the surface of the transparent substrate 1. You may have. FIG. 8 is a diagram showing another embodiment of the method for producing an organic electroluminescent lighting device of the present invention. FIG. 8A is a plan view. FIG. 8B is a cross-sectional view taken along the cutting line AA shown in FIG.

陽極エッジカバー10が形成された有機エレクトロルミネッセンス照明装置を製造する場合、スペーサ形成工程で陽極膜2の側面部を覆うように絶縁性を備えた陽極エッジカバー10を形成することによって、第2の成膜工程で陽極膜2の側面部は、陽極エッジカバー10を介して有機発光膜4に覆われることになる(図8(b)参照)。そのため、陽極膜2の側面部と陰極膜5との間に高電界が発生しても、陽極エッジカバー10によって有機発光膜4にかかる電圧が緩和される。これにより、陽極エッジカバー10を介して陽極膜2の側面部を覆う有機発光膜4の部分が絶縁破壊しにくくなる。さらに、本発明では、透明基板1の表面からの高さが互いに異なるスペーサ3と、陽極エッジカバー10とを、半透過領域を備えたグレートーンマスクまたはハーフトーンマスクで同時に形成することとしてもよい。これにより、スペーサ3および陽極エッジカバー10の各々を個別に形成する場合に比べ、工程数を削減することが可能となる。   When manufacturing an organic electroluminescence lighting device in which the anode edge cover 10 is formed, by forming the anode edge cover 10 having insulation so as to cover the side surface portion of the anode film 2 in the spacer forming step, the second In the film forming process, the side surface portion of the anode film 2 is covered with the organic light emitting film 4 through the anode edge cover 10 (see FIG. 8B). Therefore, even when a high electric field is generated between the side surface portion of the anode film 2 and the cathode film 5, the voltage applied to the organic light emitting film 4 is relaxed by the anode edge cover 10. Thereby, the portion of the organic light emitting film 4 that covers the side surface portion of the anode film 2 via the anode edge cover 10 is less likely to break down. Furthermore, in the present invention, the spacers 3 having different heights from the surface of the transparent substrate 1 and the anode edge cover 10 may be simultaneously formed using a gray tone mask or a half tone mask having a semi-transmissive region. . Thereby, compared with the case where each of the spacer 3 and the anode edge cover 10 is formed separately, the number of processes can be reduced.

また、本発明では、複数の発光素子が設けられた有機エレクトロルミネッセンス照明装置を製造するために、図9、図10に示すように、絶縁性を備えた素子分離用リブ11を形成する工程を有してもよい。図9は、本発明の有機エレクトロルミネッセンス照明装置の製造方法の他の実施形態を示す平面図である。なお、図9では、素子分離用リブ11のレイアウトをわかりやすくするために陰極膜5の一部の記載を省略している。図10は、図9に記載の切断線に沿った断面図である。図10(a)は、図9に記載の切断線C−Cに沿った断面図である。図10(b)は、図9に記載の切断線D−Dに沿った断面図である。   Moreover, in this invention, in order to manufacture the organic electroluminescent illuminating device provided with the several light emitting element, as shown to FIG. 9, FIG. 10, the process of forming the element separation rib 11 provided with insulation is shown. You may have. FIG. 9 is a plan view showing another embodiment of the method for producing an organic electroluminescent lighting device of the present invention. In FIG. 9, a part of the cathode film 5 is omitted for easy understanding of the layout of the element isolation ribs 11. FIG. 10 is a cross-sectional view taken along the cutting line shown in FIG. FIG. 10A is a cross-sectional view taken along the cutting line CC shown in FIG. FIG. 10B is a cross-sectional view taken along the cutting line DD shown in FIG.

素子分離用リブ11が形成された有機エレクトロルミネッセンス照明装置を製造する場合、まず、第1の成膜工程において、複数の陽極膜2が互いに離して成膜される。その後、スペーサ形成工程において、透明基板1の表面における複数の陽極膜2の間に、透明基板1の表面からの高さが複数の陽極膜2よりも高くてスペーサ3よりも低い素子分離用リブ11を形成する。このとき、透明基板1の表面からの高さが互いに異なるスペーサ3と、素子分離用リブ11とを上述したグレートーンマスクまたはハーフトーンマスクで同時に形成することとしてもよい。これにより、スペーサ3および素子分離用リブ11の各々を個別に形成する場合に比べ、工程数を削減することが可能となる。なお、素子分離用リブ11を形成した後は、第2の成膜工程において複数の陽極膜2の表面を複数の有機発光膜4で個別に覆う。その後、第3の成膜工程において複数の有機発光膜4の表面を陰極膜5で個別に覆う。これにより、複数の発光素子が完成する。   In the case of manufacturing an organic electroluminescence lighting device in which the element isolation ribs 11 are formed, first, in the first film formation step, the plurality of anode films 2 are formed separately from each other. After that, in the spacer forming step, between the plurality of anode films 2 on the surface of the transparent substrate 1, the element isolation ribs whose height from the surface of the transparent substrate 1 is higher than the plurality of anode films 2 and lower than the spacer 3. 11 is formed. At this time, the spacers 3 having different heights from the surface of the transparent substrate 1 and the element isolation ribs 11 may be simultaneously formed using the above-described gray tone mask or half tone mask. As a result, the number of steps can be reduced as compared with the case where the spacer 3 and the element isolation rib 11 are individually formed. After the element isolation ribs 11 are formed, the surfaces of the plurality of anode films 2 are individually covered with the plurality of organic light emitting films 4 in the second film forming step. Thereafter, the surfaces of the plurality of organic light emitting films 4 are individually covered with the cathode film 5 in the third film forming step. Thereby, a plurality of light emitting elements are completed.

なお、上述した陽極エッジカバー10または素子分離用リブ11を備えた有機エレクトロルミネッセンス照明装置を製造する場合、陽極エッジカバー10および素子分離用リブ11の各々は、透明基板1の表面からの高さがスペーサ3よりも低いので、封止工程において、上述した吸湿材9が取り付けられた封止基板7を用いることも可能である。   When manufacturing the organic electroluminescence lighting device including the anode edge cover 10 or the element separation rib 11 described above, each of the anode edge cover 10 and the element separation rib 11 has a height from the surface of the transparent substrate 1. Is lower than the spacer 3, it is also possible to use the sealing substrate 7 to which the above-described hygroscopic material 9 is attached in the sealing step.

1 透明基板
2 陽極膜
3 スペーサ
4 有機発光膜
5 陰極膜
6 シール部
7 封止基板
8 内部空間
9 吸湿材
10 陽極エッジカバー
11 素子分離用リブ
DESCRIPTION OF SYMBOLS 1 Transparent substrate 2 Anode film 3 Spacer 4 Organic light emitting film 5 Cathode film 6 Seal part 7 Sealing substrate 8 Internal space 9 Hygroscopic material 10 Anode edge cover 11 Element isolation rib

Claims (4)

透明基板の表面に陽極膜を成膜する第1の成膜工程と、
前記陽極膜の表面の全部または一部を連続してまたは断続的に囲むように枠状に配置され、前記透明基板の表面からの高さが前記陽極膜よりも高く互いに同一の高さの複数のスペーサを形成するスペーサ形成工程と、
前記枠状に配置された複数のスペーサの内側で前記陽極膜の表面を覆い、前記透明基板の表面からの高さが前記複数のスペーサよりも低い有機発光膜を、シャドウマスクを用いて成膜する第2の成膜工程と、
前記有機発光膜の表面を覆い、前記透明基板の表面からの高さが前記複数のスペーサよりも低い陰極膜を成膜する第3の成膜工程と、
前記複数のスペーサを被覆し、前記陰極膜を介して前記有機発光膜の外周を連続して囲むシール部を形成するシール部形成工程と、
封止基板を前記シール部で前記複数のスペーサに取り付けて、前記陰極膜の上方で前記シール部に囲まれた内部空間を前記封止基板で覆う封止工程と、を有する有機エレクトロルミネッセンス照明装置の製造方法。
A first film forming step of forming an anode film on the surface of the transparent substrate;
Arranged in a frame shape so as to surround all or part of the surface of the anode film continuously or intermittently, and the height from the surface of the transparent substrate is higher than that of the anode film and a plurality of same heights. A spacer forming step of forming a spacer of
An organic light emitting film that covers the surface of the anode film inside the plurality of spacers arranged in a frame shape and is lower than the plurality of spacers from the surface of the transparent substrate is formed using a shadow mask. A second film forming step,
A third film forming step of covering the surface of the organic light emitting film and forming a cathode film having a height from the surface of the transparent substrate lower than that of the plurality of spacers;
A seal part forming step of covering the plurality of spacers and forming a seal part that continuously surrounds the outer periphery of the organic light emitting film through the cathode film;
A sealing step of attaching a sealing substrate to the plurality of spacers at the sealing portion, and covering the internal space surrounded by the sealing portion above the cathode film with the sealing substrate. Manufacturing method.
前記封止基板における前記内部空間に接する面に、吸湿材が取り付けられている、請求項1に記載の有機エレクトロルミネッセンス照明装置の製造方法。   The manufacturing method of the organic electroluminescent illuminating device of Claim 1 with which the hygroscopic material is attached to the surface which contact | connects the said internal space in the said sealing substrate. 前記スペーサ形成工程において、前記陽極膜の側面部を覆い前記透明基板の表面からの高さが前記複数のスペーサよりも低く絶縁性を備えた陽極エッジカバーを、グレートーンマスクまたはハーフトーンマスクを用いて前記複数のスペーサと同時に形成する、請求項1または2に記載の有機エレクトロルミネッセンス照明装置の製造方法。   In the spacer formation step, a gray-tone mask or a half-tone mask is used as the anode edge cover that covers the side surface portion of the anode film and has a lower insulating height than the plurality of spacers from the surface of the transparent substrate. The manufacturing method of the organic electroluminescent illuminating device of Claim 1 or 2 formed simultaneously with these spacers. 前記第1の成膜工程において、複数の陽極膜を互いに離して成膜し、
前記スペーサ形成工程において、前記透明電極の表面における前記複数の陽極膜の間に位置し、前記透明基板の表面からの高さが前記複数の陽極膜よりも高くて前記複数のスペーサよりも低く絶縁性を備えた素子分離用リブを、グレートーンマスクまたはハーフトーンマスクを用いて前記スペーサと同時に形成し、
前記第2の成膜工程において、前記複数の陽極膜の表面を複数の有機発光膜で個別に覆い、
前記第3の成膜工程において、前記複数の有機発光膜の表面を複数の陰極膜で個別に覆う、請求項1または2に記載の有機エレクトロルミネッセンス照明装置の製造方法。
In the first film formation step, a plurality of anode films are formed apart from each other,
In the spacer forming step, the insulating layer is located between the plurality of anode films on the surface of the transparent electrode, and is higher than the plurality of anode films and insulated from the plurality of spacers. Forming element isolation ribs having the same properties as the spacers using a gray-tone mask or a half-tone mask;
In the second film forming step, the surfaces of the plurality of anode films are individually covered with a plurality of organic light emitting films,
The manufacturing method of the organic electroluminescent illuminating device according to claim 1 or 2, wherein in the third film forming step, the surfaces of the plurality of organic light emitting films are individually covered with a plurality of cathode films.
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