JP2011230418A - Transfer device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To uniformly heat a transfer film in a short time, in a transfer device for transferring the transfer layer of the transfer film to the surface of a material to be transferred.SOLUTION: In the transfer device 10, the transfer film 60 is heated by saturated steam discharged by a steam-generating unit 82 and pressed to the side of the material to be transferred 50 by a pressure device 86, to transfer the transfer layer 66 of the transfer film 60 to the surface of the material to be transferred 50. At this time, the saturated steam has a high heat capacity, so that when the transfer film 60 is heated by the saturated steam, the decrease in the temperature of the saturated steam can be suppressed. Thus, the transfer film 60 can be heated in a short time. On the other hand, even when a part of the transfer film 60 is heated by the saturated steam, the decrease in the temperature of the saturated steam is suppressed, so that the other part of the transfer film 60 can be sufficiently heated by the saturated steam. Thus, the transfer film 60 can be uniformly heated.

Description

  The present invention relates to a transfer device that transfers a transfer layer of a transfer film onto the surface of a transfer object.

  In the following Patent Document 1, an ink layer of a transfer sheet is transferred to a steering wheel by heating the transfer sheet with hot air in a state where the transfer sheet is covered with the steering wheel.

  Here, the heat capacity of hot air is small. For this reason, when hot air heats a transfer sheet, the temperature of hot air falls easily.

  Accordingly, it takes a long time to heat the transfer sheet.

  Further, when hot air whose temperature has been lowered by heating one part of the transfer sheet heats the other part of the transfer sheet, the other part cannot be heated sufficiently. For this reason, the variation of the heating temperature by the part of a transfer sheet becomes large.

JP 2007-168121 A

  An object of the present invention is to provide a transfer device capable of uniformly heating a transfer film in a short time in consideration of the above facts.

  The transfer device according to claim 1, heating means for heating the transfer film by releasing saturated vapor in a state where the transfer film provided with the transfer layer is in contact with the transfer layer on the surface of the transfer object, Pressurizing means that pressurizes the transfer film toward the transfer object and transfers the transfer layer to the surface of the transfer object.

  A transfer device according to a second aspect is the transfer device according to the first aspect, wherein the saturated vapor is dry saturated vapor not including a liquid phase.

  According to a third aspect of the present invention, in the transfer device according to the first or second aspect, the saturated vapor is atmospheric pressure saturated vapor under atmospheric pressure.

  A transfer device according to a fourth aspect is the transfer device according to the first or second aspect, wherein the saturated vapor is a vacuum saturated vapor under an atmospheric pressure lower than atmospheric pressure.

  The transfer device according to claim 5 is the transfer device according to any one of claims 1 to 4, wherein the pressure adjustment for adjusting the air pressure on the opposite side of the transfer object with respect to the transfer film. Means.

  The transfer device according to claim 6 is the transfer device according to any one of claims 1 to 5, wherein the saturated vapor is sent from the lower side to the opposite side of the transfer object with respect to the transfer film. Supply.

  In the transfer device according to claim 1, in a state where the transfer film provided with the transfer layer is in contact with the transfer layer on the surface of the transfer object, the saturated vapor released by the heating means heats the transfer film, and The pressurizing means pressurizes the transfer film toward the transfer object and transfers the transfer layer of the transfer film onto the surface of the transfer object.

  Here, the saturated vapor is a vapor when the liquid and the gas are in an equilibrium state. The ratio of the liquid phase and the gas phase of the saturated vapor changes at a constant temperature (boiling point) due to a change in the heat capacity, and the gas phase ratio increases as the heat capacity increases.

  For this reason, when the saturated vapor heats the transfer film, the temperature does not decrease until the vapor phase of the saturated vapor disappears, so that the temperature of the saturated vapor can be suppressed from decreasing.

  Thereby, a transfer film can be heated in a short time.

  Moreover, when saturated steam heats one part of a transfer film, since the temperature of the said saturated steam is suppressed, the said saturated steam can fully heat the other part of a transfer film. Thereby, a transfer film can be heated uniformly.

  In the transfer apparatus according to the second aspect, the saturated steam is dry saturated steam that does not include a liquid phase. Saturated steam maximizes the heat capacity of dry saturated steam. For this reason, when the saturated vapor heats the transfer film, it is possible to maximize the heat capacity margin until the temperature of the saturated vapor decreases.

  Thereby, the transfer film can be uniformly heated in a shorter time.

  In the transfer device according to the third aspect, the saturated steam is atmospheric pressure saturated steam under atmospheric pressure. For this reason, since it is not necessary to control the vapor pressure of saturated vapor, the transfer device can be simplified.

  In the transfer apparatus according to the fourth aspect, the saturated steam is vacuum saturated steam under an atmospheric pressure lower than atmospheric pressure. Since the vacuum saturated steam is a saturated steam having a low boiling point, for example, the transfer layer of the transfer film can be transferred to a resin transfer object having a low heat resistance temperature.

  In the transfer device according to the fifth aspect, the pressure adjusting means adjusts the pressure on the opposite side of the transfer film from the transfer object. For this reason, for example, the pressure adjusting means adjusts the air pressure on the opposite side of the transfer film to the transfer film to be the same as the vapor pressure of the saturated vapor, thereby supplying saturated vapor to the transfer film while maintaining the temperature. Can do.

  In the transfer apparatus according to the sixth aspect, the saturated vapor is supplied from the lower side to the transfer film on the side opposite to the transfer target. For this reason, the liquid which the saturated vapor heated the transfer film and changed can be easily discharged downward.

It is a longitudinal cross-sectional view of the transfer apparatus which concerns on the 1st Embodiment of this invention. It is sectional drawing of a transfer film. (A) And (B) is sectional drawing which shows the transfer condition to the to-be-transferred object of the transfer layer of a transfer film, (A) is sectional drawing which shows the transfer pattern missing condition in the high temperature part of a transfer film. (B) is sectional drawing which shows the transfer pattern missing condition in the low-temperature part of a transfer film. It is a longitudinal cross-sectional view of the transfer apparatus which concerns on the 2nd Embodiment of this invention. It is a longitudinal cross-sectional view of another example of the transfer apparatus according to the first embodiment of the present invention.

  [First Embodiment]

  FIG. 1 shows a longitudinal sectional view of a transfer apparatus 10 according to the first embodiment of the present invention. In the drawing, the upper side of the transfer device 10 is indicated by an arrow UP, and the right side of the transfer device 10 is indicated by an arrow RH.

  As shown in FIG. 1, the transfer device 10 includes a transfer mold 20 having a substantially rectangular parallelepiped container shape as a container, and the transfer mold 20 is made of an aluminum material.

  The transfer mold 20 has a fixed mold 22 as an accommodating portion, and the fixed mold 22 constitutes an upper part of the transfer mold 20. The fixed mold 22 is formed in a substantially rectangular parallelepiped container shape having an open bottom, and is provided with an upper wall 22A and a peripheral wall 22B.

  The transfer mold 20 has a movable mold 24 as a storage portion, and the movable mold 24 constitutes a lower portion of the transfer mold 20 at a position facing the fixed mold 22. The movable mold 24 is formed in a substantially rectangular parallelepiped container shape having an upper opening, and is provided with a lower wall 24A and a peripheral wall 24B. A heat insulating material 25 is arranged inside the lower wall 24A and the peripheral wall 24B.

  The movable mold 24 is in communication with a mold clamping device 40, and the mold clamping device 40 is configured to be able to move the movable mold 24 in the vertical direction. For this reason, when the mold clamping device 40 moves the movable mold 24 downward, the movable mold 24 is separated from the fixed mold 22 and the inside of the transfer mold 20 is opened.

  A set base 27 as a mounting portion is fixed in the fixed mold 22, and the transfer object 50 is fixed to the set base 27 so that the transfer object 50 does not fall off while the transfer mold 20 is open. The transferred object 50 is a three-dimensional molded body made of resin. The transferred object 50 may be made of metal or wood.

  A transfer film 60 is disposed on the movable mold 24 side of the transfer object 50 with the inside of the transfer mold 20 being opened.

  As shown in FIG. 2, the transfer film 60 includes a film substrate 62, a release layer 64, and a transfer layer (ink layer) 66, and the release layer 64 and the transfer layer 66 are arranged in this order on the film substrate 62. Are stacked. A transfer pattern such as a leopard pattern is drawn on the transfer layer 66 by gravure printing or the like, and the transfer layer 66 is brought into contact with the transfer object 50. The transfer layer 66 is allowed to adhere to the transfer target 50 by being cooled after being heated to a predetermined temperature or higher. The release layer 64 is formed of a silicon-based resin or the like, and adjusts the release force of the transfer layer 66 from the film base material 62.

  As shown in FIG. 1, after the transfer object 50 and the transfer film 60 are disposed in the transfer mold 20, the mold clamping device 40 moves the movable mold 24 upward, thereby closing the transfer mold 20. Thus, the transfer film 60 is sandwiched between the opening edge of the fixed mold 22 and the opening edge of the movable mold 24. For this reason, the space between the transfer film 60 and the opening edge of the fixed mold 22 is hermetically sealed and surrounded by the transfer object 50 or the set base 27 and the transfer film 60 (hereinafter referred to as “atmospheric pressure adjustment space 26”). ) Is formed. In addition, the space between the transfer film 60 and the opening edge of the movable mold 24 is sealed to form a space surrounded by the movable mold 24 and the transfer film 60 (hereinafter referred to as “temperature adjustment space 28”).

  An exhaust hole 30 as a discharge portion is passed through the upper wall 22A of the fixed mold 22, and the exhaust hole 30 extends through the set table 27 to the end of the transfer object 50. A vacuum pump 32 as pressure reducing means is communicated with the exhaust hole 30 through a valve 33. The valve 33 is an open / close valve. The valve 33 is opened, and the exhaust hole 30 and the vacuum pump 32 communicate with each other via the valve 33, so that the vacuum pump 32 adjusts the atmospheric pressure via the exhaust hole 30. Air is discharged from the space 26 to reduce the pressure in the pressure adjusting space 26. For this reason, when the atmospheric pressure (atmospheric pressure) in the temperature adjustment space 28 becomes higher than the atmospheric pressure in the atmospheric pressure adjustment space 26, the transfer film 60 is pressed (pressurized) from the temperature adjustment space 28 side to the atmospheric pressure adjustment space 26 side. The surface of the transfer object 50 is coated following the surface shape.

  After the transfer film 60 is coated on the surface of the transfer object 50, the valve 33 is closed, so that the atmospheric pressure in the atmospheric pressure adjustment space 26 is maintained.

  The lower wall 24 </ b> A of the movable mold 24 is formed with an ejection hole 34 as a supply unit, and a valve 80 communicates with the ejection hole 34. The valve 80 is in communication with a steam generating device 82 as a heating means, a cooling device 84 as a cooling means, and a pressurizing device 86 as a pressurizing means. The valve 80 generates steam at the communication destination of the ejection hole 34. The device 82, the cooling device 84, and the pressurizing device 86 can be switched.

  The steam generating device 82 generates, for example, saturated steam (atmospheric pressure saturated steam) of water under atmospheric pressure, and supplies (spouts) the saturated steam to the temperature adjustment space 28 from the ejection hole 34 via the valve 80. . Here, the saturated vapor is a vapor when the liquid and the gas are in an equilibrium state. The ratio of the liquid phase and the gas phase of the saturated vapor changes at a constant temperature (boiling point) due to a change in the heat capacity, and the gas phase ratio increases as the heat capacity increases.

  When saturated steam is supplied to the temperature adjustment space 28, the transfer film 60 is heated by the saturated steam. A discharge hole 36 is formed through the lower wall 24 </ b> A of the movable mold 24, and a valve 37 is communicated with the discharge hole 36. The valve 37 is an on-off valve. When saturated steam is supplied to the temperature adjustment space 28, the valve 37 is opened, and compressed air is supplied to the temperature adjustment space 28 by a pressurizing device 86 as will be described later. When the valve 37 is closed, the valve 37 is closed.

  Next, compressed air is supplied from the ejection hole 34 to the temperature adjustment space 28 through the valve 80 by the pressurizing device 86. Thus, the transfer film 60 is pressed from the temperature adjustment space 28 side to the atmospheric pressure adjustment space 26 side, whereby the transfer film 60 is brought into close contact with the surface of the transfer object 50.

  In addition, after the pressurizing device 86 supplies the compressed air to the temperature adjustment space 28, the cooling device 84 supplies the cooling air from the ejection hole 34 to the temperature adjustment space 28 via the valve 80. For this reason, the cooling air cools the transfer film 60. At this time, by opening the valve 37, the liquid (drain) in which the temperature of the compressed air and the saturated steam is lowered and the saturated steam is changed is discharged from the movable mold 24 through the discharge hole 36 and the valve 37. .

  Next, the operation of the present embodiment will be described.

  In the transfer device 10 having the above configuration, the mold clamping device 40 moves the movable die 24 downward, and the inside of the transfer die 20 is opened. Further, the transfer object 50 is fixed to the set base 27 in the fixed mold 22, and the transfer film 60 is arranged on the movable mold 24 side of the transfer object 50. Then, when the mold clamping device 40 moves the movable mold 24 upward, the inside of the transfer mold 20 is closed.

  Thereafter, the vacuum pump 32 discharges air from the atmospheric pressure adjustment space 26 through the exhaust hole 30 to reduce the atmospheric pressure in the atmospheric pressure adjustment space 26. For this reason, when the atmospheric pressure in the temperature adjustment space 28 becomes higher than the atmospheric pressure in the atmospheric pressure adjustment space 26, the transfer film 60 is pressed from the temperature adjustment space 28 side to the atmospheric pressure adjustment space 26 side, and is applied to the surface of the transfer object 50. Covered.

  In this state, the steam generator 82 generates saturated steam under atmospheric pressure, and supplies the saturated steam to the temperature adjustment space 28 from the ejection hole 34. Thereby, the transfer film 60 is heated to a predetermined temperature or higher.

  Next, compressed air is supplied to the temperature adjustment space 28 by the pressurizing device 86. Thereby, the transfer film 60 (transfer layer 66) is brought into close contact with the surface of the transfer object 50 by pressing the transfer film 60 from the temperature adjustment space 28 side to the atmospheric pressure adjustment space 26 side.

  Thereafter, the cooling device 84 supplies cooling air from the ejection holes 34 to the temperature adjustment space 28, whereby the transfer film 60 is cooled and the transfer layer 66 is adhered to the surface of the transfer object 50. Thereby, the transfer layer 66 is transferred onto the surface of the transfer object 50.

  Further, when the mold clamping device 40 moves the movable mold 24 downward, the inside of the transfer mold 20 is opened. Then, by removing the film substrate 62 of the transfer film 60 from the transfer object 50, the transfer layer 66 of the transfer film 60 is released (separated) from the release layer 64, and only the transfer layer 66 is transferred. It remains on the surface of 50. Thereby, the surface of the transfer object 50 is decorated by the transfer pattern of the transfer layer 66.

  In this manner, the transfer film 60 is heated to a predetermined temperature or higher with saturated steam and then pressurized and cooled, whereby the transfer layer 66 is adhered to the surface of the transfer object 50, and the transfer layer 66 is transferred to the transfer object 50. Transferred to the surface.

  Here, the saturated steam has a large heat capacity, and when the saturated steam heats the transfer film 60, the temperature does not decrease until the saturated vapor disappears, so that the temperature of the saturated steam can be suppressed from decreasing.

  Thereby, the transfer film 60 can be heated to the saturated vapor temperature in a short time. For this reason, the process of transferring the transfer layer 66 of the transfer film 60 to the transfer object 50 can be performed in a short time, and the productivity can be improved.

  Further, when the saturated vapor heats one part of the transfer film 60, the temperature of the saturated vapor is suppressed from being lowered, so that the saturated vapor can sufficiently heat the other part of the transfer film 60. For this reason, the transfer film 60 can be heated uniformly.

  Thereby, when the transfer film 60 is removed from the transfer target 50 due to variations in the heating temperature of the transfer film 60, transfer defects in which the transfer layer 66 described below does not remain on the surface of the transfer target 50 can be suppressed.

  That is, for example, as shown in FIG. 3A, the transfer layer 66 is thermally deteriorated at a portion where the transfer film 60 is heated to a temperature considerably higher than a predetermined temperature. For this reason, when the film substrate 62 of the transfer film 60 is removed from the transfer object 50, the transfer layer 66 is divided at the intermediate portion in the thickness direction, and only a part of the transfer layer 66 in the thickness direction is transferred. The transfer pattern is lost by remaining on the surface.

  Further, for example, as shown in FIG. 3B, at the portion of the transfer film 60 that is only heated to a temperature considerably lower than a predetermined temperature, the transfer layer 66 is not heated due to insufficient heating of the transfer layer 66. Does not adhere properly. For this reason, when the film substrate 62 of the transfer film 60 is removed from the transferred object 50, the entire transfer layer 66 in the thickness direction does not remain on the surface of the transferred object 50, and the transfer pattern is lost. .

  Further, the inner wall of the transfer mold 20 is formed of a heat insulating material 25. For this reason, since the transfer mold 20 does not deprive the heat of the saturated steam supplied to the temperature adjustment space 28, it is possible to further suppress the temperature of the saturated steam from decreasing. Thereby, the transfer film 60 can be uniformly heated to a predetermined temperature or more in a shorter time.

  The steam generator 82 generates saturated steam under atmospheric pressure and supplies it to the temperature adjustment space 28 from the ejection hole 34. For this reason, since it is not necessary to control the vapor pressure of saturated vapor, the transfer device 10 can be simplified.

  Further, the steam generator 82 heats the transfer film 60 by supplying saturated steam from the ejection holes 34 formed in the lower wall 24 </ b> A of the movable mold 24. For this reason, the liquid in which the saturated vapor has changed by heating the transfer film 60 can be easily discharged to the lower side of the transfer mold 20 through the discharge hole 36.

  Further, the transfer film 60 is disposed on the lower side with respect to the transfer object 50 and saturated vapor is supplied to the transfer object 50 from below, so that the transfer layer 66 of the transfer film 60 is transferred to the transfer object 50. Is transferred to. For this reason, even if the liquid whose saturated vapor has changed due to the saturated vapor temperature being lower than the saturated temperature is attached to the surface of the transfer film 60, the transfer film 60 is disposed below the transfer target 50. As a result, the liquid is removed from the surface of the transfer film 60 by the convection of the saturated vapor in the temperature adjusting space 28, and the transfer film 60 can be continuously heated by the newly supplied saturated vapor. Thereby, the whole transfer film 60 can be heated uniformly.

  [Second Embodiment]

  FIG. 4 shows a longitudinal sectional view of a transfer apparatus 100 according to the second embodiment of the present invention. In the drawing, the upper side of the transfer device 100 is indicated by an arrow UP, and the right side of the transfer device 100 is indicated by an arrow RH.

  The transfer apparatus 100 according to the present embodiment has substantially the same configuration as that of the first embodiment, but differs in the following points.

  As shown in FIG. 4, in the transfer apparatus 100 of the present embodiment, the transfer object 50 is a three-dimensional molded body made of resin. In addition, the transfer layer 66 of the transfer film 60 can be bonded to the transfer object 50 by being cooled after being heated to a specific temperature lower than a predetermined temperature.

  The steam generator 82 generates, for example, water saturated steam (vacuum saturated steam) under atmospheric pressure below atmospheric pressure, and the vacuum saturated steam is ejected through the valve 80 while the valve 37 is closed. The temperature is supplied from 34 to the temperature adjustment space 28. Here, the vacuum saturated steam has a lower temperature (boiling point) than the atmospheric saturated steam.

  A pressure adjusting hole 92 as an adjusting portion is formed in the peripheral wall 24B of the movable mold 24, and the pressure adjusting hole 92 communicates with a pressure adjusting device 90 as a pressure adjusting means. The pressure adjustment device 90 discharges air from the temperature adjustment space 28 through the pressure adjustment hole 92 in a state where the valve 37 is closed, and the pressure in the temperature adjustment space 28 is equal to the vapor pressure of the vacuum saturated steam. Adjust to.

  Further, the vacuum pump 32 reduces the atmospheric pressure in the atmospheric pressure adjustment space 26 to an atmospheric pressure lower than the atmospheric pressure in the temperature adjustment space 28 with the valve 37 opened. For this reason, since the atmospheric pressure in the temperature adjustment space 28 is higher than the atmospheric pressure in the atmospheric pressure adjustment space 26, the transfer film 60 is pressed from the temperature adjustment space 28 side to the atmospheric pressure adjustment space 26 side to cover the surface of the transfer object 50. Is done.

  Next, the operation of the present embodiment will be described.

  In the transfer apparatus 100 having the above configuration, the transfer object 50 is fixed in the transfer mold 20 and the transfer film 60 is disposed after the transfer mold 20 is closed, as in the first embodiment.

  Thereafter, the vacuum pump 32 discharges air from the atmospheric pressure adjustment space 26 through the exhaust hole 30 to reduce the atmospheric pressure in the atmospheric pressure adjustment space 26. Further, the pressure adjusting device 90 discharges air from the temperature adjusting space 28 through the pressure adjusting hole 92 to reduce the pressure in the temperature adjusting space 28. As a result, the pressure in the temperature adjustment space 28 is made higher than the pressure in the pressure adjustment space 26, so that the transfer film 60 is pressed from the temperature adjustment space 28 side to the pressure adjustment space 26 side, and the surface of the transfer object 50 is moved. Cover.

  In this state, the steam generator 82 generates vacuum saturated steam under an atmospheric pressure lower than atmospheric pressure, and supplies the vacuum saturated steam to the temperature adjustment space 28 from the ejection hole 34. Thereby, the transfer film 60 is heated to a specific temperature or higher.

  Next, compressed air is supplied to the temperature adjustment space 28 by the pressurizing device 86. Accordingly, the transfer film 60 (transfer layer 66) is brought into close contact with the surface of the transfer object 50 by pressing the transfer film 60 from the temperature adjustment space 28 side to the atmospheric pressure adjustment space 26 side.

  Then, the cooling device 84 supplies cooling air from the ejection holes 34 to the temperature adjustment space 28, whereby the transfer film 60 is cooled and the transfer layer 66 is bonded to the surface of the transfer object 50. Thereby, the transfer layer 66 is transferred onto the surface of the transfer object 50.

  After that, as in the first embodiment, the transfer film 66 of the transfer film 60 is separated from the release layer 64 by removing the film base 62 of the transfer film 60 from the transfer target 50, and the transfer is performed. Only the layer 66 remains on the surface of the transfer object 50. Thereby, the surface of the transfer object 50 is decorated by the transfer pattern of the transfer layer 66.

  Here, also in this embodiment, the same operations and effects as those in the first embodiment can be obtained.

  Further, the vacuum saturated steam generated by the steam generator 82 is a saturated steam having a lower boiling point than that of the atmospheric pressure saturated steam. Therefore, for example, the transfer layer 66 of the transfer film 60 is applied to the resin transfer object 50 having a low heat resistance temperature. Can be transferred.

  Further, the pressure adjusting device 90 discharges air from the temperature adjusting space 28 through the pressure adjusting hole 92. For this reason, the vacuum saturated steam generated by the steam generator 82 is supplied so as to be drawn into the temperature adjustment space 28 from the ejection hole 34. Thereby, the vacuum saturated vapor can be satisfactorily supplied to the temperature adjustment space 28, and the transfer film 60 can be heated in a shorter time.

  Further, as described above, since the pressure adjusting device 90 discharges air from the temperature adjusting space 28 through the pressure adjusting hole 92, it is possible to satisfactorily suppress air from staying in the upper portion of the temperature adjusting space 28. For this reason, it can suppress that the staying air covers the upper part of the transfer film 60 as a heat insulation film, and the heating of the upper part of the transfer film 60 is inhibited. Thereby, the dispersion | variation in the heating temperature of the upper part of the transfer film 60 and another site | part can be suppressed favorably, and the transfer film 60 can be heated favorable uniformly.

  Further, the pressure adjusting device 90 adjusts the atmospheric pressure in the temperature adjusting space 28 to the same pressure as the vapor pressure of the vacuum saturated steam generated by the steam generating device 82. For this reason, the vacuum saturated steam can be supplied to the transfer film 60 while maintaining the temperature of the vacuum saturated steam. Thereby, the transfer film 60 can be appropriately heated by the vacuum saturated steam.

  (Modification)

  In the present modification, the steam generator 82 generates high-temperature (higher than 100 ° C.) saturated steam (for example, 140 ° C. saturated steam) under atmospheric pressure higher than atmospheric pressure, and passes through the ejection holes 34. The temperature is supplied to the temperature adjustment space 28. Further, the pressure adjusting device 90 adjusts the atmospheric pressure in the temperature adjustment space 28 to be equal to the vapor pressure of the saturated vapor.

  For this reason, the saturated steam generated by the steam generator 82 is released from the ejection hole 34 to the temperature adjustment space 28 under the same atmospheric pressure as the steam pressure of the saturated steam. Therefore, a decrease in temperature when saturated steam is opened to the temperature adjustment space 28 (when the atmospheric pressure of the temperature adjustment space 28 is atmospheric pressure, if 140 ° C. saturated steam is opened to the temperature adjustment space 28, 100 ° C. (Saturated steam) can be suppressed, and the temperature of the saturated steam can be maintained and supplied to the transfer film 60.

  Thereby, the transfer film 60 can be uniformly heated in a shorter time.

  In the first embodiment or the second embodiment (including modifications), the steam generator 82 generates dry saturated steam that does not include a liquid phase and supplies the dry saturated steam to the transfer film 60. May be.

  Here, since the ratio of the gas phase increases as the heat capacity of the saturated steam increases, the saturated steam has the maximum heat capacity of the dry saturated steam. For this reason, when the saturated vapor heats the transfer film 60, it is possible to maximize the heat capacity margin until the temperature of the saturated vapor decreases.

  Thereby, the transfer film 60 can be uniformly heated in a shorter time.

  In the first embodiment or the second embodiment (including modifications), the upper wall 22A of the fixed mold 22 becomes the upper wall of the transfer mold 20 and the lower wall 24A of the movable mold 24 is Although arranged so as to be the lower wall of the transfer mold 20, as shown in FIG. 5, the upper wall 22 </ b> A of the fixed mold 22 and the lower wall 24 </ b> A of the movable mold 24 may be arranged as side walls of the transfer mold 20. . (FIG. 5 shows a modified arrangement of the transfer mold 20 of the first embodiment.)

  Also in this case, for example, by forming the discharge hole 36 at the lower end of the peripheral wall 24 </ b> B of the movable mold 24, it is possible to easily discharge the liquid in which the saturated vapor has changed by heating the transfer film 60 from the discharge hole 36.

  Further, in this case, the transfer film 60 is disposed laterally with respect to the transfer object 50, and saturated vapor is supplied from the side with respect to the transfer object 50, whereby the transfer layer of the transfer film 60 is transferred. 66 is transferred to the transfer object 50. For this reason, even if the liquid whose saturated vapor has changed due to the saturated vapor temperature being lower than the saturated temperature adheres to the surface of the transfer film 60, the transfer film 60 is disposed laterally with respect to the transfer object 50. As a result, the liquid is removed from the surface of the transfer film 60 by the convection of the saturated vapor in the temperature adjusting space 28, and the transfer film 60 can be continuously heated by the newly supplied saturated vapor. Thereby, the whole transfer film 60 can be heated uniformly.

DESCRIPTION OF SYMBOLS 10 Transfer apparatus 50 Transfer object 60 Transfer film 82 Steam generator (heating means)
86 Pressurizing device (pressurizing means)
90 Pressure adjusting device (pressure adjusting means)
100 Transfer device

Claims (6)

Heating means for heating the transfer film by releasing saturated vapor in a state in which the transfer film provided with the transfer layer is in contact with the transfer layer on the surface of the transfer object;
A pressurizing unit that pressurizes the transfer film toward the transfer object and transfers the transfer layer to the surface of the transfer object;
A transfer device.   The transfer apparatus according to claim 1, wherein the saturated steam is dry saturated steam that does not include a liquid phase.   The transfer apparatus according to claim 1, wherein the saturated steam is atmospheric pressure saturated steam under atmospheric pressure.   The transfer apparatus according to claim 1, wherein the saturated steam is vacuum saturated steam under an atmospheric pressure lower than atmospheric pressure.   The transfer device according to any one of claims 1 to 4, further comprising a pressure adjusting unit that adjusts an air pressure on a side opposite to the transfer object with respect to the transfer film.   The transfer device according to any one of claims 1 to 5, wherein the saturated vapor is supplied from the lower side to the transfer film on the side opposite to the transfer target.

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