JP2011228130A - Led bulb - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute efficient heat radiation by simultaneously dissipating heat generated by LED elements of an LED module and that generated by a circuit of a driver module for communication.SOLUTION: The LED bulb 1 is provided with an LED module 2 with a plurality of LED elements 12 mounted on an element substrate 11 and attached to a heat-radiating plate 13, a circuit module including a driver module for communication 4 for bidirectional radio communication by a radio remote controller, a heat sink 3 with the LED module 2 and the circuit module fitted for dissipating heat of the plurality of LED elements 12 through the heat-radiating plate 13, and a globe 9 attached to the heat sink 3 so as to cover the plurality of LED elements 12, with a part of the substrate of the circuit module and the heat sink 3 thermally coupled.

Description

  The present invention relates to an LED bulb using a plurality of LED (Light Emitting Diode) elements as semiconductor light emitting elements.

  In recent years, the advantages of low power consumption (1/10 of incandescent light bulbs) and long life (40 times that of incandescent light bulbs) of LED elements, which are semiconductor light emitting elements, have been met by the demands of the times. The market for LED bulbs used in the market is rapidly rising.

  As an LED bulb using an LED element as this type of light source, for example, one disclosed in Patent Document 1 below is known. As shown in FIG. 5, the LED bulb 51 disclosed in Patent Document 1 includes a heat sink 52, a substrate 53 attached to the heat sink 52, and an LED element 54 mounted on the main surface of the substrate 53 opposite to the heat sink 52. And a glass bulb 55 that is mounted on the heat sink 52 and covers the substrate 53 including the LED element 54. Further, the inner surface of the bulb 55 is formed of a translucent material having a thermal conductivity higher than the thermal conductivity of the bulb 55, and a part 56 a of the translucent layer 56 is formed on the inner surface of the bulb 55. Is connected to the heat sink 52 via a heat transfer portion 57 made of a heat transfer material having a thermal conductivity equal to or higher than that.

  However, in this type of LED bulb, when trying to secure a luminous flux equivalent to that of an incandescent bulb or the like, the input power to the LED element increases, and accordingly, the temperature of the LED element during lighting increases. . And when the temperature of the LED element becomes high, the luminous efficiency of the LED element may decrease and the LED element may not operate, and thus it is necessary to dissipate the heat of the LED element. Therefore, in a conventional LED bulb, a substrate on which an LED element is mounted is mounted on a heat sink, and heat from the LED element is released to the heat sink through the substrate.

JP 2010-16223 A

  In this type of LED bulb, a communication driver module for controlling the driving of the LED element by bidirectional wireless communication using a wireless remote controller by forming a housing portion in a heat sink located directly below the substrate on which the LED element is mounted In addition, there has been a demand for a configuration in which the power supply circuit module is housed in the housing portion and ON / OFF control of a plurality of LED bulbs and light adjustment (dimming / coloring) of the LED bulbs can be performed with one wireless remote controller.

  However, when the communication driver module and the power supply circuit module are housed in the housing portion of the heat sink of the LED bulb, heat is generated from these circuits (particularly, the IC chip of the communication driver module). In addition, it was necessary to dissipate heat generated from the circuit.

  In the configuration in which the communication driver module and the power supply circuit module are accommodated in the heat sink accommodating portion, the communication driver module to which the antenna is connected is covered with the heat sink and the substrate made of metal such as aluminum, and the configuration as it is. However, it was difficult to perform good wireless communication in both directions with the wireless remote controller.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide an LED bulb that can efficiently dissipate heat and perform good wireless communication.

To achieve the above object, the LED bulb according to claim 1 according to the present invention includes an LED module in which a plurality of LED elements are mounted on a substrate and attached to a heat sink,
A circuit module including a communication driver module for two-way wireless communication with a wireless remote controller;
The LED module and the circuit module are attached, and a heat sink for dissipating heat of the plurality of LED elements through the heat dissipation plate,
An LED bulb including a globe attached to the heat sink so as to cover the plurality of LED elements,
A part of the substrate of the circuit module is thermally coupled in contact with the heat sink.

The LED bulb described in claim 2 according to the present invention is the LED bulb of claim 1,
The antenna line of the communication driver module is led out to a position that does not hinder the light emission of the LED element while maintaining the outer shape of the LED bulb.

  According to the present invention, not only the heat sink of the LED module but also a part of the circuit module substrate is thermally coupled in contact with the heat sink, so that not only the heat of the LED element but also the heat generated by the circuit is simultaneously released. And efficient heat dissipation can be performed.

  In addition, while maintaining the outer shape of the LED bulb, the antenna line of the communication driver module is led out to a position that does not interfere with the light emission of the LED element, so that sufficient heat dissipation can be performed with an external wireless remote controller. Good wireless communication can be performed in both directions.

It is a side view which shows the external appearance of the LED bulb which concerns on this invention. It is a top view in the state where the globe of the LED bulb concerning the present invention was removed. It is a sectional side view of the LED bulb which concerns on this invention. (A) It is a top view which shows the outline of the circuit board of the driver module for communication of the LED bulb which concerns on this invention. (B) It is a top view which shows the outline of the circuit board of the power supply circuit module of the LED bulb concerning this invention. It is a block diagram of the conventional LED bulb | bulb disclosed by patent document 1. FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be specifically described with reference to the drawings. 1 is a side view showing the appearance of an LED bulb according to the present invention, FIG. 2 is a plan view of the LED bulb with the globe removed, FIG. 3 is a side sectional view of the LED bulb, and FIG. FIG. 4B is a plan view showing an outline of the circuit board of the power supply circuit module of the LED bulb. FIG.

  The LED bulb according to the present invention can perform on / off control of a plurality of LED bulbs and adjustment (dimming and toning) of light of the LED bulbs with one external wireless remote controller, for example, hotels, restaurants, movie theaters, events Used in lighting systems at venues.

  As shown in FIGS. 1 to 4, the LED bulb 1 of this example includes an LED module 2, a heat sink 3, a communication driver module 4, a power supply circuit module 5, as shown in FIGS. A base module 6, a connection member 7, a coupling member 8, and a globe 9 are provided and schematically configured.

  The LED module 2 is a module for obtaining desired emitted light, and includes an element substrate 11, an LED element 12, and a heat radiating plate 13, as shown in FIG.

  The element substrate 11 has a substantially rectangular shape made of, for example, an aluminum substrate or a white alumina substrate. A rectangular partition portion 14 having a predetermined height is formed on the surface 11 a which is one surface of the element substrate 11. The partition part 14 consists of dam materials, such as white silicone rubber, for example, and functions as a reflector which reflects light efficiently while defining the area | region of the rectangular planar light emission surface 15 as shown in FIG. The partition portion 14 is filled with the phosphor resin 16 to substantially the same height as the partition portion 14. The phosphor resin 16 is made of, for example, a silicate yellow phosphor and a transparent silicone rubber.

  In addition, the surface (light emitting surface 15) of the partition part 14 filled with the phosphor resin 16 is not limited to a flat surface. For example, if the surface (light emitting surface 15) of the partition 14 filled with the phosphor incoming 16 is formed in a convex surface or a concave surface, the emitted light can be diffused or narrowed down. Although not shown, a wiring pattern having a predetermined pattern shape is formed on the surface 11 a of the element substrate 11 according to the arrangement of the LED elements 12 of a plurality of colors.

  The LED element 12 is composed of a plurality of color semiconductor light emitting elements mounted on a wiring pattern (not shown) formed on the surface 11 a of the element substrate 11 in the partition part 14. The multi-color LED elements 12 mounted on the element substrate 11 can be configured by, for example, red and blue elements as one unit. The LED elements 12 composed of these two-color elements are arranged from the inner side to the outer side of the partition portion 14 using wire bonding or three-dimensional wiring using thick film resistors so that the LED elements 12 of a plurality of units are separated in a circuit for each color. Are connected to the terminal portions of the connector 17 through wiring patterns led out together in one place. The connector 17 is wired to the communication driver module 4 that is driven by power supply from the base module 6 through the power supply circuit module 5. And by the drive control of the LED element 12 based on bidirectional wireless communication between the external wireless remote controller and the antenna line 4b of the communication driver module 4, red, blue monochromatic light, light bulb color, daylight white, etc. Light can be obtained.

  The multi-color LED elements 12 mounted on the surface 11a of the element substrate 11 are not limited to two colors of red and blue. For example, four color elements of red, green, blue, and amber are used. It may be used as a unit, and may be wired to the terminal portion of the connector 17 so that the LED elements 12 of each unit are separated in a circuit for each color. If the LED element 12 is driven and controlled based on bidirectional wireless communication between the external wireless remote controller and the antenna line 4b of the communication driver module 4, red, green, blue, and amber monochromatic light, these Light of any colorant such as an intermediate color, a light bulb color, or a daylight white color combined with each other can be emitted to obtain light with good color mixing and light distribution.

  The heat radiating plate 13 radiates the heat generated by the LED elements 12, and is made of, for example, an aluminum plate. As shown in FIG. 3, the element substrate 11 is fixed to the surface with screws (four locations in the example of FIG. 2). Implemented. As shown in FIGS. 2 and 3, the heat radiating plate 13 is formed with an opening hole 13 a for leading the antenna wire 4 b from the communication driver module 4 onto the heat radiating plate 13. Furthermore, the outer peripheral part of the heat sink 13 forms an L-shaped locking piece 13b.

  The heat sink 3 is formed of, for example, aluminum die casting using aluminum as a material, and has a truncated cone shape having end faces 3a and 3b parallel to each other. As shown in FIG. 3, a mounting portion 3c for mounting the circuit board 4a of the communication driver module 4 and the circuit board 5a of the power supply circuit module 5 and mounting them with screws is integrated on the inner peripheral surface of the heat sink 3. It is formed. The heat sink 3 has a stepped portion 3d in which the outer peripheral portion of the end surface 3a on the large-diameter portion side matches the thickness of the locking piece 13b of the heat sink 13, and the locking piece 13b is attached to the stepped portion 3d. The LED module 2 is disposed in a locked state, and the LED module 2 is thermally coupled to the heat sink 3 via the heat dissipation plate 13. In addition, a space portion below the heat dissipation plate 13 in the heat sink 3 forms an accommodating portion 3 e for accommodating the communication driver module 4 and the power supply circuit module 5.

  In this example, the case where aluminum is used as the material and the heat sink 3 is formed by aluminum die casting is illustrated and described. However, the present invention is not limited to this. For example, the heat sink 3 can be formed by drawing aluminum. In this case, although not shown, a circuit board 4a of the communication driver module 4 and a circuit board 5a of the power supply circuit module 5, which will be described later, are formed on the inner surface of the heat sink 3 via a member having good thermal conductivity such as a copper piece. It is fixed with screws.

  Further, the material of the heat sink 3 is not limited to aluminum. For example, the heat sink 3 can be formed of ceramics made of an insulating material such as alumina. In this case, since the heat sink 3 itself is made of an insulating material, it is not necessary to separately cover the power circuit module 5 with a protective member made of an insulating material, and the configuration can be simplified by reducing the number of components.

  The communication driver module 4 corresponds to the Z-Wave wireless communication standard, and an IC chip including a CPU is mounted on a circular circuit board 4a. The circuit board 4a is configured by a board containing a large amount of a material having good thermal conductivity, for example, a four-layer glass epoxy board having many Cu foil layers. The circuit board 4a is housed in the housing part 3e by being screwed and fixed to the mounting part 3c of the heat sink 3 in a state of being directly below the heat radiating plate 13. Thereby, part of the circuit board 4 a is thermally coupled to the heat sink 3 in the communication driver module 4, and heat generated by the circuit of the circuit board 4 a is transmitted from the circuit board 4 a to the heat sink 3. When the temperature of the heat sink 3 rises, heat is radiated as heat radiation from the surface of the heat sink 3 by natural air cooling due to contact between the heat sink 3 and the outside air.

  The communication driver module 4 is connected to an antenna line 4b having a length corresponding to the frequency to be used in order to perform two-way wireless communication with an external wireless remote controller compatible with the Z-Wave wireless communication standard. The The antenna line 4 b is made of, for example, a coaxial cable, is led out from the circuit board 4 a of the communication driver module 4 to the heat sink 13 through the opening hole 13 a of the heat sink 13, and is mounted in the mounting groove 8 b of the coupling member 8. The communication driver module 4 is driven by the power supplied from the base module 6 via the power supply circuit module 5, and wirelessly communicates with the wireless remote controller via the antenna line 4b in both directions. Are simultaneously or individually controlled, or the LED element 11 is independently driven and controlled for each color to adjust the light (dimming and toning).

  In the power supply circuit module 5, a power supply circuit including a DC / AC converter is mounted on a circular circuit board 5a and connected to the communication driver module 4 and the base module 6 by wiring. The circuit board 5a is configured by a board containing a large amount of a material having good thermal conductivity, for example, a four-layer glass epoxy board having many Cu foil layers. The power supply circuit module 5 supplies power necessary for driving the LED element 12 and power necessary for bidirectional wireless communication with an external wireless remote controller to the communication driver module 4 by the power supplied from the base module 6. Yes.

  Further, the circuit board 5a of the power supply circuit module 5 is housed in the housing portion 3e by being screwed and fixed to the mounting portion 3c of the heat sink 3 in a state of being directly below the communication driver module 4. Thereby, in the power supply circuit module 5, a part of the circuit board 5a is thermally coupled to the heat sink 3, and heat generated by the circuit of the circuit board 5a is transmitted from the circuit board 5a to the heat sink 3. When the temperature of the heat sink 3 rises, heat is radiated as heat radiation from the surface of the heat sink 3 by natural air cooling due to contact between the heat sink 3 and the outside air. The power circuit module 5 is protected by a protection member (not shown) made of an insulating material. In this example, the communication driver module 4 and the power supply circuit module 5 described above are collectively referred to as a circuit module.

  The base module 6 is, for example, an E-shaped (Edison type) E26, and is connected to the power supply circuit module 5 by wiring.

  The connection member 7 is formed in a ring shape having a predetermined thickness by an insulating material such as polycarbonate (PC). In the connection member 7, the heat sink 3 is connected to one end surface 7a, and the base module 6 is connected to the other end surface 7b. Thus, the heat sink 3 and the base module 6 are connected via the connection member 7.

  The coupling member 8 is formed in a ring shape from an insulating material such as polycarbonate (PC). The coupling member 8 is configured such that the engagement piece 13b of the heat sink 13 is engaged with the stepped portion 3b on the large diameter portion side of the heat sink 3 and the heat sink 13 is sandwiched between the heat sink 3 and the heat sink 3. It is fixedly attached to the heat radiating plate 13 by screwing it to a mounting portion (not shown) provided on the peripheral surface. In addition, a fitting groove 8 a for fitting the circumferential end of the globe 9 and fitting the globe 9 is formed on the entire peripheral surface on the surface side of the coupling member 8. Furthermore, an attachment groove 8b for attaching the antenna wire 4b led out from the communication driver module 4 through the opening hole 13a of the heat sink 13 is formed on the inner peripheral side of the fitting groove 8a.

  The globe 9 is made of an insulating material such as polycarbonate (PC), for example, and is formed in a hemispherical shape by applying a diffusion material on the inner surface. The globe 9 is fitted and attached to the fitting groove 8 a of the coupling member 8.

  Thus, according to the LED light bulb 1 of this example, a part of the heat sink 13 of the LED module 2 is in contact with the heat sink 3 and thermally coupled, and the communication driver module 4 which is a circuit module and the power source Since part of the circuit boards 4a and 5a of the circuit module 5 is also in contact with the heat sink 3 and thermally coupled, not only the heat of the LED element 12 but also the circuits of the communication driver module 4 and the power circuit module 5 are generated. Heat can be dissipated at the same time, and efficient heat dissipation can be performed.

  In addition, since the antenna wire 4b of the communication driver module 4 is led out to a position that does not hinder the light emission of the LED element 12 while maintaining the outer shape of the LED bulb 1, an external wireless communication is performed while performing sufficient heat dissipation. Good wireless communication can be performed bidirectionally with the remote controller.

  Further, the circuit board 4a of the communication driver module 4 and the circuit board 5a of the power supply circuit module 5 are formed in a circular shape, and these circuit boards 4a and 5a are vertically arranged and attached to the accommodating portion 3e in the heat sink 3. The space portion of the heat sink 3 can be used efficiently, and a sufficient area for mounting circuit components can be secured.

  By the way, in the example of illustration, although the structure which attached the antenna wire 4b in the attachment groove | channel 8b of the coupling member 8 was demonstrated, it is not limited to this structure. The antenna line 4b may be configured to be led out from the communication driver module 4 up to a position where it does not interfere optically while maintaining the outer shape of the LED bulb 1. For example, a mounting groove is formed on the surface of the heat radiating plate 13, and the antenna wire 4b is mounted in the mounting groove via an insulating layer. A mounting groove is formed on the inner peripheral surface of the globe 9, and the antenna wire is formed in the mounting groove. The antenna wire 4b may be attached to the element substrate 11 or the heat radiating plate 13, for example, by thickening the covering material made of an insulating material of the antenna wire 4b. According to these configurations, the connecting member 8 can be omitted, the number of components can be reduced, and the configuration can be simplified.

DESCRIPTION OF SYMBOLS 1 LED light bulb 2 LED module 3 Heat sink 3a, 3b End surface 3c Mounting part 3d Step part 3e Storage part 4 Communication driver module 4a Circuit board 4b Antenna wire 5 Power supply circuit module 5a Circuit board 6 Cap module 7 Connection member 7a One end surface 7b Other end face 8 Coupling member 8a Fitting groove 8b Mounting groove 9 Globe 11 Element substrate 11a Surface 12 LED element 13 Heat sink 13a Opening hole 13b Locking piece 14 Partition part 15 Light emitting surface 16 Phosphor resin 17 Connector

Claims (2)

An LED module in which a plurality of LED elements are mounted on a substrate and attached to a heat sink;
A circuit module including a communication driver module for two-way wireless communication with a wireless remote controller;
The LED module and the circuit module are attached, and a heat sink for dissipating heat of the plurality of LED elements through the heat dissipation plate,
An LED bulb including a globe attached to the heat sink so as to cover the plurality of LED elements,
A part of the substrate of the circuit module is in contact with the heat sink and thermally coupled thereto. 2. The LED bulb according to claim 1, wherein the antenna wire of the communication driver module is led out to a position that does not hinder the light emission of the LED element in a state in which the outer shape of the LED bulb is maintained.

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