JP2011224652A - Flux for solder and solder composition - Google Patents
Flux for solder and solder composition Download PDFInfo
- Publication number
- JP2011224652A JP2011224652A JP2011052377A JP2011052377A JP2011224652A JP 2011224652 A JP2011224652 A JP 2011224652A JP 2011052377 A JP2011052377 A JP 2011052377A JP 2011052377 A JP2011052377 A JP 2011052377A JP 2011224652 A JP2011224652 A JP 2011224652A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- component
- rosin
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 title claims abstract description 67
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 64
- 239000000203 mixture Substances 0.000 title claims abstract description 18
- 238000002835 absorbance Methods 0.000 claims abstract description 9
- 238000004949 mass spectrometry Methods 0.000 claims abstract description 5
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- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 44
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- 239000000843 powder Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 8
- 230000004580 weight loss Effects 0.000 claims description 4
- 238000000870 ultraviolet spectroscopy Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- XSIFPSYPOVKYCO-UHFFFAOYSA-N butyl benzoate Chemical compound CCCCOC(=O)C1=CC=CC=C1 XSIFPSYPOVKYCO-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 238000006114 decarboxylation reaction Methods 0.000 description 2
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- 238000002845 discoloration Methods 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
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- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
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- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- YPGLTKHJEQHKSS-ASZLNGMRSA-N (1r,4ar,4bs,7r,8as,10ar)-1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,7,8,8a,9,10,10a-dodecahydrophenanthrene-1-carboxylic acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@@H](C(C)C)C[C@@H]2CC1 YPGLTKHJEQHKSS-ASZLNGMRSA-N 0.000 description 1
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- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VIZORQUEIQEFRT-UHFFFAOYSA-N Diethyl adipate Chemical compound CCOC(=O)CCCCC(=O)OCC VIZORQUEIQEFRT-UHFFFAOYSA-N 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- RWWVEQKPFPXLGL-ONCXSQPRSA-N L-Pimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC=C(C(C)C)C=C2CC1 RWWVEQKPFPXLGL-ONCXSQPRSA-N 0.000 description 1
- RWWVEQKPFPXLGL-UHFFFAOYSA-N Levopimaric acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CC=C(C(C)C)C=C1CC2 RWWVEQKPFPXLGL-UHFFFAOYSA-N 0.000 description 1
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- KGMSWPSAVZAMKR-ONCXSQPRSA-N Neoabietic acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CCC(=C(C)C)C=C2CC1 KGMSWPSAVZAMKR-ONCXSQPRSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
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- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
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- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
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- 125000004432 carbon atom Chemical group C* 0.000 description 1
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- 150000004678 hydrides Chemical class 0.000 description 1
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- 150000002430 hydrocarbons Chemical class 0.000 description 1
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- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
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- 238000004448 titration Methods 0.000 description 1
- HADKRTWCOYPCPH-UHFFFAOYSA-M trimethylphenylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C1=CC=CC=C1 HADKRTWCOYPCPH-UHFFFAOYSA-M 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/42—Absorption spectrometry; Double beam spectrometry; Flicker spectrometry; Reflection spectrometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
- G01N30/02—Column chromatography
- G01N30/62—Detectors specially adapted therefor
- G01N30/72—Mass spectrometers
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本発明は、はんだ用フラックスおよびはんだ組成物に関する。 The present invention relates to a solder flux and a solder composition.
ロジン類は、はんだ粉末の表面の酸化皮膜を除去する作用(清浄化作用)、はんだ粉末の再酸化を防止する作用(ベース樹脂作用)を有することから、はんだ用フラックスにひろく使用されている(たとえば、特許文献1参照)。 Rosin is widely used in solder flux because it has an action to remove the oxide film on the surface of the solder powder (cleaning action) and an action to prevent reoxidation of the solder powder (base resin action) ( For example, see Patent Document 1).
しかし、通常、ロジン類には、分子内に共役二重結合を有するアビエタン系の樹脂酸(アビエチン酸、レボピマル酸、パラストリン酸、ネオアビエチン酸等)が含まれている。アビエタン系の樹脂酸は、非常に酸化されやすいため、変色や品質劣化を生じるなど熱安定性が悪いという問題があった。 However, rosins usually contain an abietan-based resin acid having a conjugated double bond in the molecule (such as abietic acid, levopimaric acid, parastrinic acid, or neoabietic acid). Abietan-based resin acids are very easily oxidized, and thus have a problem of poor thermal stability such as discoloration and quality deterioration.
そこで、ロジン類の安定化等を目的としてロジンの水素化物(水添ロジン)、不均化物(不均化ロジン)等を使用することが提案されている(たとえば、特許文献2参照)。水添ロジンや不均化ロジンを用いた場合には、変色や品質劣化をある程度改善できるものの、さらなる改善が求められていた。なお、本願人は、リフロー後の残渣の色調が良好な水素化重合ロジンを含有するはんだフラックスを提案していた(特許文献3参照)が、よりフラックス残渣の色調が良好なはんだフラックスが求められていた。 Therefore, it has been proposed to use a rosin hydride (hydrogenated rosin), a disproportionate (disproportionated rosin) or the like for the purpose of stabilizing rosins (see, for example, Patent Document 2). When hydrogenated rosin or disproportionated rosin is used, discoloration and quality deterioration can be improved to some extent, but further improvement has been demanded. The applicant has proposed a solder flux containing a hydrogenated polymerized rosin with a good color tone of the residue after reflow (see Patent Document 3). However, a solder flux with a better color tone of the flux residue is required. It was.
本発明は、はんだ付け性が良好で、フラックス残渣の色調に優れ、残渣が目立たず、かつ、フラックス残渣を低減するはんだ組成物およびそのようなはんだ組成物を提供できるフラックスを提供することを目的とする。 An object of the present invention is to provide a solder composition having good solderability, excellent color tone of a flux residue, inconspicuous residue, and reducing the flux residue, and a flux capable of providing such a solder composition. And
本発明者は、鋭意検討した結果、特定の成分を含有するロジン類を用いることで、上記課題を解決できることを見出し、本発明を完成させた。 As a result of intensive studies, the present inventor has found that the above-described problems can be solved by using rosins containing specific components, and completed the present invention.
すなわち、本発明は、紫外線吸光光度法による254nm以上の領域での最大吸光度A(測定条件:試料濃度1g/dm3、セル長1cm)が0.15以下であり、メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量が分子量314〜320の成分の合計量の95%以上であるロジン類(A)を含有するはんだ用フラックス;粉末はんだおよび当該はんだ用フラックスを含有するはんだ組成物に関する。 That is, according to the present invention, the maximum absorbance A (measurement conditions: sample concentration 1 g / dm 3 , cell length 1 cm) in the region of 254 nm or more by ultraviolet absorption spectrophotometry is 0.15 or less, and the gas chromatograph of methylated products Solder flux containing rosin (A) whose molecular weight 320 component measured by mass spectrometry is 95% or more of the total amount of components having a molecular weight of 314 to 320; powder solder and solder flux The present invention relates to a solder composition.
本発明によれば、はんだ付け性が良好で、フラックス残渣の色調に優れ、残渣が目立たず、かつ、フラックス残渣を低減するはんだ用フラックスを提供することができる。また、本発明のはんだ用フラックスは、耐熱性に優れ、色調が良好なはんだ組成物を提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the soldering flux which is favorable for solderability, is excellent in the color tone of a flux residue, a residue is not conspicuous, and reduces a flux residue can be provided. Moreover, the solder flux of the present invention can provide a solder composition having excellent heat resistance and good color tone.
本発明のはんだ用フラックスは、紫外線吸光光度法による254nm以上の領域での最大吸光度A(測定条件:試料濃度1g/dm3、セル長1cm)が0.15以下であり、メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量が分子量314〜320の成分の合計量の95%以上であるロジン類(A)(以下、成分(A)という)を含有することを特徴とする。 The solder flux of the present invention has a maximum absorbance A (measurement condition: sample concentration of 1 g / dm 3 , cell length of 1 cm) in the region of 254 nm or more by ultraviolet absorption photometry, which is 0.15 or less. Containing rosins (A) (hereinafter referred to as component (A)) in which the content of components having a molecular weight of 320 measured by gas chromatography mass spectrometry is 95% or more of the total amount of components having a molecular weight of 314 to 320 Features.
(A)成分の紫外線吸光光度法による254nm以上の領域での最大吸光度A(測定条件:試料濃度1g/dm3、セル長1cm)が0.15を超える場合や、メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量が分子量314〜320の成分の合計量の95%未満となる場合は、分子中に反応性の高い共役2重結合や、各種の不純物を含有するため、はんだ組成物とした場合のはんだ付け時の耐熱安定性が悪化する。なお、成分(A)において、紫外線吸光光度法による254nm以上の領域での吸光度は主に、炭素−炭素不飽和結合に関するピークであり、当該値が大きくなることは分子中に不飽和結合が多くなることを意味する。また、着色性の不純物が多ければ、当該値が大きくなると考えられる。炭素−炭素不飽和結合は、反応性に富むため、酸素やはんだ組成物中の様々な成分と反応を起こしやすく、着色の原因となったり、不要な化合物の生成に繋がったりする。また、メチル化処理物の分子量が320の成分とは、成分(A)の樹脂酸成分のカルボキシル基がメチル化され、カルボン酸エステルとなったもののうち、分子内の炭素−炭素不飽和結合がすべて水素化されたものに相当する。分子量が314の成分とは、分子内に炭素−炭素不飽和結合を3つ有するものに相当する。そのため、分子量320の成分の含有量が分子量314〜320の成分の合計量の95%以上であるということは、当該成分(A)中に含まれる炭素−炭素不飽和結合を有する成分が極めて少ないことを意味する。 When the maximum absorbance A (measurement condition: sample concentration 1 g / dm 3 , cell length 1 cm) in the region of 254 nm or more by ultraviolet absorption spectrophotometry of the component (A) exceeds 0.15, or a gas chromatograph of methylated products When the content of a component having a molecular weight of 320 measured by mass spectrometry is less than 95% of the total amount of components having a molecular weight of 314 to 320, a highly reactive conjugated double bond or various impurities are contained in the molecule. For this reason, the heat stability during soldering in the case of a solder composition is deteriorated. In the component (A), the absorbance in the region of 254 nm or more by the ultraviolet spectrophotometry is mainly a peak related to the carbon-carbon unsaturated bond, and the increase in the value means that there are many unsaturated bonds in the molecule. It means to become. In addition, if there are many coloring impurities, the value is considered to increase. Since the carbon-carbon unsaturated bond is rich in reactivity, it easily reacts with oxygen and various components in the solder composition, causing coloration and leading to generation of unnecessary compounds. In addition, the component having a molecular weight of 320 of the methylated product means that the carboxyl group of the resin acid component of component (A) is methylated to form a carboxylic acid ester, and the carbon-carbon unsaturated bond in the molecule is present. All correspond to hydrogenated ones. The component having a molecular weight of 314 corresponds to a component having three carbon-carbon unsaturated bonds in the molecule. Therefore, the content of the component having the molecular weight of 320 is 95% or more of the total amount of the components having the molecular weight of 314 to 320, which means that the component having the carbon-carbon unsaturated bond contained in the component (A) is extremely small. Means that.
成分(A)は、通常、ウッドロジン、トール油ロジン、ガムロジン等の天然ロジン類および不均化ロジン、水添ロジン等のロジン誘導体(a)(以下、成分(a)という)を水素化することにより、テトラヒドロアビエチン酸およびテトラヒドロピマル酸等のメチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量が分子量314〜320の成分を含む成分の合計量の95%以上となるようにすることで得られる。なお、成分(a)は精製しておくことで、色調の向上や不純物の削減が出来るため好ましい。精製方法としては特に限定されないが、具体的には、例えば、蒸留、再結晶、抽出等が挙げられる。蒸留の場合は、例えば、未精製の成分(a)を通常は温度200〜300℃程度、圧力130〜1300Pa程度の範囲の蒸留条件で行う。蒸留時間は蒸留条件に応じて決定すればよい。再結晶の場合は、例えば、未精製の成分(a)を良溶媒に溶解し、ついで溶媒を留去して濃厚な溶液とし、この溶液に貧溶媒を添加することにより行なうことができる。良溶媒としてはベンゼン、トルエン、キシレン、クロロホルム、炭素数1〜3の低級アルコール、アセトン等のケトン類、酢酸エチル等の酢酸エステル類等が挙げられる。貧溶媒としてはn−ヘキサン、n−ヘプタン、シクロヘキサン、イソオクタン等が挙げられる。更に上記精製は未精製の成分(a)を、アルカリ水を用いてアルカリ水溶液となし、生じた不溶性の不ケン化物を有機溶媒により抽出した後、水層を中和してもよい。 Component (A) is usually a hydrogenation of natural rosins such as wood rosin, tall oil rosin, gum rosin and rosin derivatives (a) (hereinafter referred to as component (a)) such as disproportionated rosin and hydrogenated rosin. The content of the component having a molecular weight of 320 measured by gas chromatography mass spectrometry of methylated products such as tetrahydroabietic acid and tetrahydropimalic acid is 95% or more of the total amount of the components including the components having a molecular weight of 314 to 320. It is obtained by doing so. The component (a) is preferable because it can be refined to improve the color tone and reduce impurities. Although it does not specifically limit as a purification method, Specifically, distillation, recrystallization, extraction etc. are mentioned, for example. In the case of distillation, for example, the unpurified component (a) is usually performed under distillation conditions of a temperature of about 200 to 300 ° C. and a pressure of about 130 to 1300 Pa. The distillation time may be determined according to the distillation conditions. In the case of recrystallization, for example, the unpurified component (a) is dissolved in a good solvent, and then the solvent is distilled off to make a concentrated solution, and a poor solvent is added to this solution. Examples of the good solvent include benzene, toluene, xylene, chloroform, lower alcohols having 1 to 3 carbon atoms, ketones such as acetone, and acetates such as ethyl acetate. Examples of the poor solvent include n-hexane, n-heptane, cyclohexane, isooctane and the like. Further, in the above purification, the unpurified component (a) may be made into an alkaline aqueous solution using alkaline water, and the insoluble unsaponified product produced may be extracted with an organic solvent, and then the aqueous layer may be neutralized.
成分(a)の水素化は、公知の方法により行うことができる。具体的には、例えば、水素化触媒の存在下、通常1〜25MPa程度、好ましくは5〜20MPaの水素加圧下で0.5〜7時間程度、好ましくは1〜5時間、成分(a)を加熱することにより行なう。水素化触媒としては、パラジウム、ロジウム、ルテニウム、白金およびニッケル等の金属をアルミナ、シリカ、珪藻土、カーボン、チタニア等の担体に担持した担持触媒、ニッケル、白金等の金属粉末、ヨウ素、ヨウ化鉄等のヨウ化物等、各種公知のものを使用することができる。これらのなかでは、パラジウム、ロジウム、ルテニウムまたは白金系触媒が水素化効率(水素化率が良い、水素化時間が短い)の点で好ましい。該触媒の使用量は、成分(a)100重量部に対して、通常0.01〜10重量部程度、好ましくは0.01〜5重量部である。また、水素化温度は100〜300℃程度、好ましくは150〜290℃である。また、水素化は、必要に応じて、ロジンを溶剤に溶解した状態で行ってもよい。使用する溶剤は特に限定されないが、反応に不活性で原料や生成物が溶解しやすい溶剤が好ましい。たとえば、シクロヘキサン、n−ヘキサン、n−ヘプタン、デカリン、テトラヒドロフラン、ジオキサン等を1種または2種以上を組み合わせて使用できる。溶剤の使用量は特に制限されないが、通常、原料樹脂に対して固形分が10重量%程度以上となるように用いる。好ましくは10〜70重量%の範囲である。なお、一般的な水素化条件で水素化した水添ロジンの場合には、メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量は、分子量314〜320の成分の合計量の20重量%程度までしか増加しない。そのため、成分(A)を得るためには、成分(a)の水素化を繰り返す、触媒使用量を増やす、水素化温度を高める、水素圧を高める、反応時間を延ばす等、水素化条件を厳しくしたり触媒種を選定したりする必要がある。 Hydrogenation of a component (a) can be performed by a well-known method. Specifically, for example, in the presence of a hydrogenation catalyst, the component (a) is usually added at about 1 to 25 MPa, preferably about 5 to 20 MPa under hydrogen pressure for about 0.5 to 7 hours, preferably 1 to 5 hours. This is done by heating. Examples of hydrogenation catalysts include palladium, rhodium, ruthenium, platinum and nickel metals supported on alumina, silica, diatomaceous earth, carbon, titania and other supported metals, nickel, platinum and other metal powders, iodine and iron iodide. Various known materials such as iodides can be used. Among these, palladium, rhodium, ruthenium or platinum-based catalysts are preferable in terms of hydrogenation efficiency (good hydrogenation rate and short hydrogenation time). The amount of the catalyst used is usually about 0.01 to 10 parts by weight, preferably 0.01 to 5 parts by weight, per 100 parts by weight of component (a). The hydrogenation temperature is about 100 to 300 ° C, preferably 150 to 290 ° C. Moreover, you may perform hydrogenation in the state which melt | dissolved rosin in the solvent as needed. The solvent to be used is not particularly limited, but a solvent that is inert to the reaction and easily dissolves the raw materials and products is preferable. For example, cyclohexane, n-hexane, n-heptane, decalin, tetrahydrofuran, dioxane and the like can be used alone or in combination of two or more. Although the usage-amount of a solvent is not restrict | limited in particular, Usually, it uses so that solid content may be about 10 weight% or more with respect to raw material resin. Preferably it is the range of 10 to 70 weight%. In the case of hydrogenated rosin hydrogenated under general hydrogenation conditions, the content of the component having a molecular weight of 320 measured by gas chromatography mass spectrometry of the methylated product is the sum of the components having a molecular weight of 314 to 320. It only increases to about 20% by weight of the amount. Therefore, in order to obtain the component (A), the hydrogenation conditions are severely repeated such as repeating the hydrogenation of the component (a), increasing the amount of catalyst used, increasing the hydrogenation temperature, increasing the hydrogen pressure, extending the reaction time, etc. It is necessary to select the catalyst type.
このようにして得られた成分(A)の軟化点(環球法)は、特に限定されないが、通常、60℃程度以上とすることが好ましい。軟化点が60℃未満の成分(A)は脱炭酸等による低分子成分が増加しており、酸価の低下に伴う活性の低下等に繋がる。成分(A)の酸価は、特に限定されないが、通常、150mgKOH/g程度以上とすることが好ましい。酸価が150mgKOH/g未満の成分(A)は脱炭酸等による低分子成分が増加しており、酸価の低下に伴う活性の低下等に繋がる。成分(A)の色調を300ハーゼン(JIS K 0071−1)以下の無色透明とすることで、フラックス残渣の色調が良好となるため好ましい。また、成分(A)を、昇温速度5℃/分の熱重量測定における99%重量損失温度が500℃以下であるロジン誘導体とすることで、フラックス残渣が少なくなるため好ましい。 The softening point (ring ball method) of the component (A) thus obtained is not particularly limited, but it is usually preferably about 60 ° C. or higher. The component (A) having a softening point of less than 60 ° C. has increased low-molecular components due to decarboxylation and the like, leading to a decrease in activity associated with a decrease in acid value. Although the acid value of a component (A) is not specifically limited, Usually, it is preferable to set it as about 150 mgKOH / g or more. In the component (A) having an acid value of less than 150 mgKOH / g, low molecular components due to decarboxylation and the like are increasing, leading to a decrease in activity associated with a decrease in acid value. It is preferable to make the color tone of the component (A) colorless and transparent of 300 Hazen (JIS K 0071-1) or less because the color tone of the flux residue becomes good. In addition, it is preferable to use component (A) as a rosin derivative having a 99% weight loss temperature of 500 ° C. or less in thermogravimetry at a rate of temperature increase of 5 ° C./min.
本発明のはんだ用フラックスは、フローソルダリングに用いるポストフラックス、リフローソルダリングに用いられるクリームはんだ等のフラックス、マニュアルソルダリングに用いられるヤニ入りはんだ等のフラックスに使用できる。 The solder flux of the present invention can be used as a flux such as post flux used for flow soldering, flux such as cream solder used for reflow soldering, and solder containing solder used for manual soldering.
本発明のはんだ用フラックスは、成分(A)を含有することを特徴とするものであるが、さらに、公知の成分(A)以外のフラックスベース樹脂、チキソ剤、活性剤、これら以外の添加剤等を含有してもよい。 The solder flux of the present invention is characterized by containing the component (A), and further, a flux base resin other than the known component (A), a thixotropic agent, an activator, and other additives. Etc. may be contained.
フラックスベース樹脂としては、成分(A)と異なるものであれば、特に限定されず公知のものを使用することができる。具体的には、例えば、ガムロジン、重合ロジン、水添ロジン、不均化ロジン、その他各種ロジン誘導体や、ポリエステル樹脂、フェノキシ樹脂、テルペン樹脂、ポリアミド樹脂等の合成樹脂などが挙げられる。 As a flux base resin, if it is different from a component (A), it will not specifically limit and a well-known thing can be used. Specific examples include gum rosin, polymerized rosin, hydrogenated rosin, disproportionated rosin, various other rosin derivatives, and synthetic resins such as polyester resin, phenoxy resin, terpene resin, and polyamide resin.
溶剤としては、特に限定されず公知のものを使用することができる。具体的には、エタノール、n−プロパノール、イソプロパノール、イソブタノール等のアルコール類、ブチルカルビトール、ヘキシルカルビトール等のグリコールエーテル類、酢酸イソプロピル、プロピオン酸エチル、安息香酸ブチル、アジピン酸ジエチル等のエステル類、n−ヘキサン、ドデカン、テトラデセン等の炭化水素類等が挙げられる。 The solvent is not particularly limited, and known solvents can be used. Specifically, alcohols such as ethanol, n-propanol, isopropanol and isobutanol, glycol ethers such as butyl carbitol and hexyl carbitol, esters such as isopropyl acetate, ethyl propionate, butyl benzoate and diethyl adipate And hydrocarbons such as n-hexane, dodecane, and tetradecene.
チキソ剤としては、特に限定されず公知のものを使用することができる。具体的には、例えば、硬化ひまし油、蜜ロウ、カルナバワックス、ステアリン酸アミド、ヒドロキシステアリン酸エチレンビスアミド等を使用することができる。 The thixotropic agent is not particularly limited, and known ones can be used. Specifically, for example, hardened castor oil, beeswax, carnauba wax, stearamide, hydroxystearic acid ethylene bisamide and the like can be used.
活性剤としては、特に限定されず公知のものを使用することができる。具体的には、例えば、アミンのハロゲン化水素酸塩、有機酸類や有機アミン類等が挙げられる。 As an activator, it does not specifically limit but a well-known thing can be used. Specific examples include amine hydrohalides, organic acids, and organic amines.
添加剤としては、通常フラックスの調製に用いることができるものであれば特に限定されず公知のものを用いることができる。酸化防止剤、防黴剤、艶消し剤等の添加剤を含有することができる。 As an additive, if it can be normally used for preparation of a flux, it will not specifically limit, A well-known thing can be used. Additives such as antioxidants, antifungal agents and matting agents can be contained.
本発明のはんだ組成物は、はんだ粉末および上記はんだ用フラックスを含有するものである。 The solder composition of the present invention contains solder powder and the above solder flux.
本発明で用いられるはんだ粉末の合金組成は特に限定されず、各種公知のものを使用できる。たとえば、はんだ粉末の合金組成としては、従来公知の錫−鉛合金や、鉛フリーはんだとして開発されている錫−銀合金、錫−亜鉛系合金等;さらには上記はんだ合金に、銅、ビスマス、インジウム、アンチモン等を添加したもの等を使用できる。クリームはんだの各成分の使用量は特に限定されないが、通常、はんだ粉末80〜95重量部程度に対してはんだ用フラックスが5〜20重量部程度である。 The alloy composition of the solder powder used in the present invention is not particularly limited, and various known ones can be used. For example, the alloy composition of the solder powder includes conventionally known tin-lead alloys, tin-silver alloys and tin-zinc alloys that have been developed as lead-free solders; and the above solder alloys include copper, bismuth, What added indium, antimony, etc. can be used. Although the usage-amount of each component of cream solder is not specifically limited, Usually, the solder flux is about 5 to 20 parts by weight with respect to about 80 to 95 parts by weight of the solder powder.
本発明のはんだ組成物には、はんだ粉末、はんだ用フラックスの他に、通常、はんだ組成物の調製に用いられる溶剤等の公知の添加物を用いてもよい。 In addition to the solder powder and the solder flux, a known additive such as a solvent usually used for preparing the solder composition may be used for the solder composition of the present invention.
以下に本発明を実施例により更に具体的に説明する。ただし、本発明はこれら実施例に限定されるものではない。また実施例中、「%」および「部」は特に断りのない限り「重量%」、「重量部」を意味する。 Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples. In the examples, “%” and “part” mean “% by weight” and “part by weight” unless otherwise specified.
製造例1
中国産水添ロジン(広西梧州日成林産化工有限公司製)600gを1リットルのフラスコに仕込み、400Paの減圧下で蒸留し、195〜250℃で留出された成分を得た。195〜250℃で留出された成分200gと5%パラジウムアルミナ3.0g、シクロヘキサン200gを1リットルのオートクレーブに仕込み、系内を水素ガスで十分置換した後、反応初期水素圧力を6MPaとし、200℃まで昇温した後、水素圧力を10MPaとし、適宜圧力減少分を補給しながら4時間反応させた。触媒をろ別し、減圧蒸留にてシクロヘキサンを留去し、ロジン類1を得た。メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量は分子量314〜320の成分の合計量の100%であり、色調は200H、酸価174、軟化点84.5℃であった。
Production Example 1
600 g of Chinese hydrogenated rosin (manufactured by Guangxi Zhengzhou Nislin Industrial Chemical Co., Ltd.) was charged into a 1 liter flask and distilled under reduced pressure of 400 Pa to obtain a component distilled at 195 to 250 ° C. 200 g of a component distilled at 195 to 250 ° C., 3.0 g of 5% palladium alumina, and 200 g of cyclohexane were charged into a 1 liter autoclave, the inside of the system was sufficiently replaced with hydrogen gas, and the initial hydrogen pressure was set to 6 MPa. After raising the temperature to 0 ° C., the hydrogen pressure was set to 10 MPa, and the reaction was allowed to proceed for 4 hours while appropriately supplying the pressure decrease. The catalyst was filtered off, and cyclohexane was distilled off under reduced pressure to obtain rosins 1. The content of the component having a molecular weight of 320 measured by gas chromatography mass spectrometry of the methylated product is 100% of the total amount of the components having a molecular weight of 314 to 320, the color tone is 200H, the acid value is 174, and the softening point is 84.5 ° C. Met.
製造例2
中国産水添ロジン(広西梧州日成林産化工有限公司製)600gを1リットルのフラスコに仕込み、400Paの減圧下で蒸留し、195〜250℃で留出された成分を得た。195〜250℃で留出された成分200gと5%パラジウムカーボン(含水率50%)3.0g、シクロヘキサン200gを1リットルのオートクレーブに仕込み、系内を水素ガスで十分置換した後、反応初期水素圧力を6MPaとし、200℃まで昇温した後、水素圧力を10MPaとし、適宜圧力減少分を補給しながら4時間反応させた。触媒をろ別し、減圧蒸留にてシクロヘキサンを留去し、ロジン類2を得た。メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量は分子量314〜320の成分の合計量の96%であり、色調は200H、酸価176mgKOH/g、軟化点84.5℃であった。
Production Example 2
600 g of Chinese hydrogenated rosin (manufactured by Guangxi Zhengzhou Nislin Industrial Chemical Co., Ltd.) was charged into a 1 liter flask and distilled under reduced pressure of 400 Pa to obtain a component distilled at 195 to 250 ° C. 200 g of the component distilled at 195 to 250 ° C., 3.0 g of 5% palladium carbon (water content 50%), and 200 g of cyclohexane were charged into a 1 liter autoclave, and the system was sufficiently replaced with hydrogen gas. After raising the pressure to 6 MPa and raising the temperature to 200 ° C., the hydrogen pressure was set to 10 MPa, and the reaction was carried out for 4 hours while appropriately supplying the pressure decrease. The catalyst was filtered off, and cyclohexane was distilled off under reduced pressure to obtain rosins 2. The content of the component having a molecular weight of 320 measured by gas chromatography mass spectrometry of the methylated product is 96% of the total amount of the components having a molecular weight of 314 to 320, the color tone is 200H, the acid value is 176 mgKOH / g, and the softening point is 84. It was 5 ° C.
製造例3
中国産不均化ロジン(梧州松脂廠製)600gを1リットルのフラスコに仕込み、400Paの減圧下で蒸留し、195〜250℃で留出された成分を得た。195〜250℃で留出された成分200gと5%パラジウムカーボン(含水率50%)0.1gを1リットルのオートクレーブに仕込み、系内を水素ガスで十分置換した後、反応初期水素圧力を6MPaとし、200℃まで昇温した後、水素圧力を10MPaとし、適宜圧力減少分を補給しながら4時間反応させた。触媒をろ別し、減圧蒸留にてシクロヘキサンを留去し、ロジン類3を得た。メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量は分子量314〜320の成分の合計量の31%であり、色調は90H、酸価167mgKOH/g、軟化点85.5℃であった。
Production Example 3
600 g of a Chinese disproportionated rosin (manufactured by Zhengzhou Songpu) was charged into a 1 liter flask and distilled under a reduced pressure of 400 Pa to obtain a component distilled at 195 to 250 ° C. 200 g of the component distilled at 195 to 250 ° C. and 0.1 g of 5% palladium carbon (water content 50%) were charged into a 1 liter autoclave and the system was sufficiently replaced with hydrogen gas. After raising the temperature to 200 ° C., the hydrogen pressure was set to 10 MPa, and the reaction was allowed to proceed for 4 hours while appropriately supplying the pressure decrease. The catalyst was filtered off, and cyclohexane was distilled off under reduced pressure to obtain rosins 3. The content of the component having a molecular weight of 320 measured by gas chromatography mass spectrometry of the methylated product is 31% of the total amount of the components having a molecular weight of 314 to 320, the color tone is 90H, the acid value is 167 mgKOH / g, and the softening point is 85. It was 5 ° C.
製造例4
中国産水添ロジン(広西梧州日成林産化工有限公司製)600gを1リットルのフラスコに仕込み、400Paの減圧下で蒸留し、195〜250℃で留出された成分をロジン類4とした。メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量は分子量314〜320の成分の合計量の17%であり、色調は250H、酸価176mgKOH/g、軟化点79.0℃であった。
Production Example 4
600 g of Chinese hydrogenated rosin (manufactured by Guangxi Yinzhou Nislin Forestry Chemical Co., Ltd.) was charged into a 1 liter flask and distilled under a reduced pressure of 400 Pa. The content of the component having a molecular weight of 320 measured by gas chromatography mass spectrometry of the methylated product is 17% of the total amount of the components having a molecular weight of 314 to 320, the color tone is 250H, the acid value is 176 mgKOH / g, and the softening point is 79. It was 0 ° C.
製造例5
中国産ガムロジン(広西荒川化学工業有限公司製)600gを1リットルのフラスコに仕込み、400Paの減圧下で蒸留し、195〜250℃で留出された成分を得た。195〜250℃で留出された成分450g、キシレン400g、塩化亜鉛20gおよび硫酸3gを仕込み、窒素雰囲気下100℃で6時間、反応を行った。反応性生物を1N塩酸250gで洗浄し、更に温水250gにて2回洗浄した。洗浄後のキシレン溶液は液温200℃未満、減圧度1,300Paの条件下でキシレンを留去した後、更に液温200〜275℃、減圧度400Paの条件下で分解物及び未反応物約35gを留去して重合ロジンを得た。得られた重合ロジン250gとシクロヘキサン250gと5%パラジウムカーボン(含水率50%)2.5gを1リットルのオートクレーブに仕込み、系内の酸素を除去した後、水素圧力を10MPaとし、適宜圧力減少分を補給しながら4時間反応させた。触媒をろ別し、減圧蒸留にてシクロヘキサンを留去し、ロジン類5を得た。メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量は分子量314〜320の成分の合計量の53%であり、色調は300H、酸価147mgKOH/g、軟化点142.0℃であった。
Production Example 5
600 g of Chinese gum rosin (manufactured by Guangxi Arakawa Chemical Co., Ltd.) was charged into a 1-liter flask and distilled under reduced pressure of 400 Pa to obtain a component distilled at 195 to 250 ° C. 450 g of a component distilled at 195 to 250 ° C., 400 g of xylene, 20 g of zinc chloride and 3 g of sulfuric acid were charged, and the reaction was performed at 100 ° C. for 6 hours in a nitrogen atmosphere. The reactive organism was washed with 250 g of 1N hydrochloric acid and further washed twice with 250 g of warm water. After washing, the xylene solution was distilled off under conditions of a liquid temperature of less than 200 ° C. and a reduced pressure of 1,300 Pa, and further decomposed and unreacted substances under the conditions of a liquid temperature of 200 to 275 ° C. and a reduced pressure of 400 Pa. 35 g was distilled off to obtain a polymerized rosin. 250 g of the obtained polymer rosin, 250 g of cyclohexane, and 2.5 g of 5% palladium carbon (water content 50%) were charged into a 1 liter autoclave, and after removing oxygen in the system, the hydrogen pressure was adjusted to 10 MPa, and the pressure decreased appropriately. Was allowed to react for 4 hours. The catalyst was filtered off, and cyclohexane was distilled off under reduced pressure to obtain rosins 5. The content of the component having a molecular weight of 320 measured by gas chromatography mass spectrometry of the methylated product is 53% of the total amount of the components having a molecular weight of 314 to 320, the color tone is 300H, the acid value is 147 mgKOH / g, and the softening point is 142. It was 0 ° C.
(メチル化処理物のガスクロマトグラフ質量分析により測定された分子量320の成分の含有量の定量)
以下のガスクロマトグラフ質量分析装置で定量を実施した。
測定には、試料(ロジン類)0.005gをオンカラムメチル化剤(フェニルトリメチルアンモニウムヒドロキサイド(PTHA)0.2モルメタノール溶液、ジーエルサイエンス(株))0.5gに溶解させ、1μlをガスクロマトグラフ質量分析(GC/MS)に注入し、測定を行った。分子量314〜320の成分の合計ピーク面積に対する分子量320の成分のピーク面積比を測定し、これを分子量320の成分の含有量とした。
使用装置
ガスクロマトグラフ:「Agilent6890」(商品名、Agilent Technologies Inc.製)
質量分析計:「Agilent5973」(商品名、Agilent Technologies Inc.製)
カラム:「Advance−DS」(商品名、信和化工(株)製)
(Quantification of content of component having molecular weight of 320 measured by gas chromatography mass spectrometry of methylated product)
Quantification was performed with the following gas chromatograph mass spectrometer.
For the measurement, 0.005 g of a sample (rosin) was dissolved in 0.5 g of an on-column methylating agent (phenyltrimethylammonium hydroxide (PTHA) 0.2 molar methanol solution, GL Sciences) and 1 μl was gas chromatographed. The measurement was carried out by injection into mass spectrometry (GC / MS). The ratio of the peak area of the component having a molecular weight of 320 to the total peak area of the components having a molecular weight of 314 to 320 was measured, and this was used as the content of the component having a molecular weight of 320.
Equipment used gas chromatograph: “Agilent 6890” (trade name, manufactured by Agilent Technologies Inc.)
Mass spectrometer: “Agilent 5973” (trade name, manufactured by Agilent Technologies Inc.)
Column: “Advanced-DS” (trade name, manufactured by Shinwa Kako Co., Ltd.)
(色調)
JIS K 0071−1に準じてハーゼン単位(H)で測定した。比較例4〜6のロジン類については、ガードナー色調をJIS0071―2に準じて測定した。
(Color tone)
It was measured in Hazen units (H) according to JIS K0071-1. For the rosins of Comparative Examples 4 to 6, the Gardner color tone was measured according to JIS0071-2.
(酸価)
JIS K 0070に準じて中和滴定法で測定した。
(Acid value)
It measured by the neutralization titration method according to JISK0070.
(軟化点)
JIS K 5902に準じて環球法で測定した。
(Softening point)
It was measured by the ring and ball method according to JIS K 5902.
(吸光度)
試料(ロジン類)25.0mgを、25mlメスフラスコに精秤し、シクロヘキサンで溶解した後、25mlの秤線まで定容する。UV分光光度計((株)日立製作所製、HITACHI u−3210 spectrophotometer)にて、セル長1cmの石英セルを用いることにより吸光度を測定する。254nm以上の領域での最大吸光度を読み取った。結果を表1に示す。
(Absorbance)
A sample (rosin) 25.0 mg is precisely weighed into a 25 ml volumetric flask, dissolved in cyclohexane, and then adjusted to a 25 ml weighing line. Absorbance is measured by using a quartz cell having a cell length of 1 cm with a UV spectrophotometer (HITACHI u-3210 spectrophotometer, manufactured by Hitachi, Ltd.). The maximum absorbance in the region of 254 nm or more was read. The results are shown in Table 1.
(熱重量測定における99%重量損失温度の測定)
試料(ロジン類)を用いて示差熱・熱重量同時測定装置(セイコーインスツル(株)製、商品名「TG/DTA220」)により、窒素雰囲気下で5℃/分の昇温速度にて99%重量損失温度を測定した。さらに、熱重量測定後の残渣の状態を以下の基準で評価した。結果を表1に示す。
1:目視で全く残渣が確認されない
2:わずかに残渣が確認されるが外観は良い
3:黒色または褐色の残渣が有り、外観が悪い
(Measurement of 99% weight loss temperature in thermogravimetry)
Using a sample (rosin), a differential thermal / thermogravimetric simultaneous measurement apparatus (trade name “TG / DTA220” manufactured by Seiko Instruments Inc.) at a heating rate of 5 ° C./min in a nitrogen atmosphere is 99. The% weight loss temperature was measured. Furthermore, the state of the residue after thermogravimetry was evaluated according to the following criteria. The results are shown in Table 1.
1: No residue is visually confirmed 2: A slight residue is confirmed, but the appearance is good 3: There is a black or brown residue, and the appearance is poor
実施例1〜2、比較例1〜6
ロジン類1〜8を用いて、下記方法により、ロジン類の加熱安定性、クリームはんだ用フラックスとポストフラックスのフラックス残渣評価(外観及び残渣低減率)及びはんだ付け性の評価を行った。
結果を表1に示す。
Examples 1-2 and Comparative Examples 1-6
Using rosins 1-8, the heat stability of rosins, flux residue evaluation of cream solder flux and post flux (appearance and residue reduction rate) and solderability were evaluated by the following methods.
The results are shown in Table 1.
(加熱安定性)
試料(ロジン類)を内径1.5cm、高さ15cmの試験管にサンプル10gをいれ、空気雰囲気下で120℃の循風乾燥機に静置して、経時による色調(ガードナー色調、JIS0071―2に準じて測定。)の変化を観察した。なお、このロジン類の加熱安定性の評価は、ロジン類を含有するはんだ用フラックス及びポストフラックスの耐熱性を推測する指標として用いることが出来る。加熱後の色調が良好なロジン類は、はんだ用フラックス等が必要な加熱安定性を有していると考えられる。
(Heating stability)
A sample (rosin) is placed in a test tube having an inner diameter of 1.5 cm and a height of 15 cm, and 10 g of the sample is placed in a circulating dryer at 120 ° C. in an air atmosphere, and the color tone over time (Gardner color tone, JIS0071-2). Measured according to the above). The evaluation of the heat stability of the rosins can be used as an index for estimating the heat resistance of solder flux and post flux containing rosins. Rosin having a good color tone after heating is considered to have heating stability that requires solder flux and the like.
(クリームはんだ用フラックスの調製)
試料(ロジン類)を50部、ジエチレングリコールモノヘキシルエーテル45部、12−ヒドロキシステアリン酸エチレンビスアミド5部を、加熱溶解させた後、冷却してフラックス組成物を作成した。
(Preparation of flux for cream solder)
50 parts of a sample (rosins), 45 parts of diethylene glycol monohexyl ether and 5 parts of 12-hydroxystearic acid ethylene bisamide were dissolved by heating and then cooled to prepare a flux composition.
(クリームはんだの調製)
はんだ粉末(5〜20μnの平均粒径を持つSn−Ag−Cu合金、96.5重量%/3重量%/0.5重量%)90部および上記方法で調製したフラックス10部を攪拌してクリームはんだを調製した。
(Preparation of cream solder)
90 parts of solder powder (Sn—Ag—Cu alloy having an average particle diameter of 5 to 20 μn, 96.5 wt% / 3 wt% / 0.5 wt%) and 10 parts of the flux prepared by the above method were stirred. A cream solder was prepared.
(クリームはんだのはんだ付け性)
調製したクリームはんだについて、「JIS Z3284付属書10 ぬれ効力およびディウェッティング試験」に準拠し、はんだ付け性(濡れ性)を評価したところ、いずれも良好(○:広がり度合いの区分1または2)であった。
(Solderability of cream solder)
The cream solder thus prepared was evaluated in accordance with “JIS Z3284 Appendix 10 Wetting Efficacy and Dewetting Test” and evaluated for solderability (wetting property). Both were good (○: Spreading degree category 1 or 2). Met.
(クリームはんだのフラックス残渣評価)
1.残渣低減率
銅基板上に、クリームはんだをスクリーン印刷し、得られた印刷基板を窒素リフロー炉にてはんだ付けを行い(プリヒート条件:180℃で100秒、メインヒート条件:240℃で約10秒)、はんだ付け前後の基板上の残渣(フラックス残渣)重量を測定してフラックス残渣の低減率を以下の式により算出した。
残渣低減率(%)=(印刷したクリームはんだ中のフラックスの固形分量−銅基板上に残ったフラックス残渣量)/(印刷したクリームはんだ中のフラックスの固形分量)×100
固形分量:クリームはんだ中の溶剤(ジエチレングリコールモノヘキシルエーテル)以外のフラックス成分
2.外観
また、はんだ付け部位を顕微鏡VW−6000((株)キーエンス製:30倍)で観察することによって、フラックス残渣の色調を以下の基準で目視判断した。
1:フラックス残渣が目立たない
2:フラックス残渣が若干目立つ
3:フラックス残渣が著しく目立つ
(Cream solder flux residue evaluation)
1. Residue reduction rate Cream solder is screen printed on a copper substrate, and the resulting printed substrate is soldered in a nitrogen reflow furnace (preheating condition: 180 ° C. for 100 seconds, main heating condition: 240 ° C. for about 10 seconds) ), The residue (flux residue) weight on the substrate before and after soldering was measured, and the reduction rate of the flux residue was calculated by the following formula.
Residual reduction rate (%) = (solid content of flux in printed cream solder−amount of flux residue remaining on copper substrate) / (solid content of flux in printed solder paste) × 100
Solid content: flux components other than the solvent (diethylene glycol monohexyl ether) in cream solder Appearance Further, the soldering part was observed with a microscope VW-6000 (manufactured by Keyence Co., Ltd .: 30 times), whereby the color tone of the flux residue was visually judged based on the following criteria.
1: Flux residue is not noticeable 2: Flux residue is slightly noticeable 3: Flux residue is noticeable
(ポストフラックスの調製)
試料(ロジン類)を25部、イソプロピルアルコール75部を加熱溶解させた後、冷却してポストフラックスを作成した。
(Preparation of post flux)
25 parts of a sample (rosins) and 75 parts of isopropyl alcohol were heated and dissolved, and then cooled to prepare a post flux.
(ポストフラックス残渣評価)
1.残渣低減率
18mm×60mmの厚さ1mmのガラス板上にポストフラックスを0.1g滴下し、270℃のホットプレート上に10秒間静置し、加熱前後の重量を測定してポストフラックス残渣の低減率を以下の式により算出した。
残渣低減率(%)=(ポストフラックス中の固形分全量−ガラス板に残ったポストフラックス残渣量)/(ポストフラックス中の固形分全量)×100
固形分量:ポストフラックス中の溶剤(イソプロピルアルコール)以外のフラックス成分
2.外観
また、外観を目視で観察し、以下の基準で評価した。
1:ポストフラックス残渣が目立たない
2:ポストフラックス残渣が若干目立つ
3:ポストフラックス残渣が著しく目立つ
(Post flux residue evaluation)
1. Reduction of post-flux residue by dropping 0.1 g of post flux on a 1 mm thick glass plate with a residue reduction rate of 18 mm x 60 mm, leaving it on a 270 ° C hot plate for 10 seconds, and measuring the weight before and after heating. The rate was calculated by the following formula.
Residual reduction rate (%) = (total amount of solid content in post flux−post flux residue amount remaining on glass plate) / (total amount of solid content in post flux) × 100
Solid content: flux components other than the solvent (isopropyl alcohol) in the post-flux 2. Appearance Also, the appearance was visually observed and evaluated according to the following criteria.
1: Post flux residue is not noticeable 2: Post flux residue is slightly noticeable 3: Post flux residue is noticeable
(ポストフラックスのはんだ付け性)
「JIS Z3197 はんだ広がり法」に準拠し、はんだ付け性(濡れ性)を評価し、広がり率を計算した。
(Post flux solderability)
In accordance with “JIS Z3197 Solder Spreading Method”, the solderability (wetability) was evaluated and the spreading rate was calculated.
*2:ロジン類7:中国産不均化ロジン
*3:ロジン類8:中国産水添ロジン
Claims (5)
The solder composition according to claim 4, wherein the solder powder is a lead-free solder powder.
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JP2014014867A (en) * | 2012-06-13 | 2014-01-30 | Arakawa Chem Ind Co Ltd | Base resin for soldering flux, soldering flux, and solder paste |
CN106001996A (en) * | 2015-03-26 | 2016-10-12 | 株式会社田村制作所 | Solder composition and electronic substrate using the same |
JP2017064730A (en) * | 2015-09-28 | 2017-04-06 | 株式会社タムラ製作所 | Flux composition for non-cleaned solder paste and no-clean solder paste, and flux scattering evaluation method of solder paste |
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CN111375929B (en) * | 2020-03-31 | 2021-08-13 | 北京瑞投安信科技有限公司 | Resin-soluble soldering paste and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02145668A (en) * | 1988-11-28 | 1990-06-05 | Harima Chem Inc | Production of hydrogenated rosin |
JPH06279734A (en) * | 1993-03-26 | 1994-10-04 | Ryutaro Kinoshita | Production of hydrogenated rosin |
JPH10219227A (en) * | 1997-01-31 | 1998-08-18 | Arakawa Chem Ind Co Ltd | Tack-imparting resin emulsion and aqueous tacky agent composition |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0910988A (en) | 1995-06-28 | 1997-01-14 | Sony Corp | Flux |
JP2002144077A (en) | 2000-11-08 | 2002-05-21 | Uchihashi Estec Co Ltd | Soldering method and solder paste |
JP4686083B2 (en) * | 2001-09-20 | 2011-05-18 | 日東電工株式会社 | Photopolymerizable composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet |
JP2006225531A (en) * | 2005-02-18 | 2006-08-31 | Sliontec Corp | Film adhesive tape |
JP4864545B2 (en) * | 2006-05-26 | 2012-02-01 | 太陽ホールディングス株式会社 | Thermosetting solder resist composition for flexible substrate, flexible substrate and method for producing flexible substrate |
JP4994923B2 (en) * | 2007-04-06 | 2012-08-08 | 太陽ホールディングス株式会社 | Black solder resist composition and cured product thereof |
TWI498184B (en) * | 2008-01-31 | 2015-09-01 | Arakawa Chem Ind | Solder flux and solder paste |
JP5067565B2 (en) | 2008-05-30 | 2012-11-07 | 荒川化学工業株式会社 | Solder flux and cream solder |
JP5019057B2 (en) * | 2008-01-31 | 2012-09-05 | 荒川化学工業株式会社 | Solder flux and cream solder |
-
2011
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- 2011-03-22 KR KR1020110025396A patent/KR101665731B1/en active IP Right Grant
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02145668A (en) * | 1988-11-28 | 1990-06-05 | Harima Chem Inc | Production of hydrogenated rosin |
JPH06279734A (en) * | 1993-03-26 | 1994-10-04 | Ryutaro Kinoshita | Production of hydrogenated rosin |
JPH10219227A (en) * | 1997-01-31 | 1998-08-18 | Arakawa Chem Ind Co Ltd | Tack-imparting resin emulsion and aqueous tacky agent composition |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014014867A (en) * | 2012-06-13 | 2014-01-30 | Arakawa Chem Ind Co Ltd | Base resin for soldering flux, soldering flux, and solder paste |
CN106001996A (en) * | 2015-03-26 | 2016-10-12 | 株式会社田村制作所 | Solder composition and electronic substrate using the same |
JP2016182633A (en) * | 2015-03-26 | 2016-10-20 | 株式会社タムラ製作所 | Solder composition and electronic substrate using the same |
JP2017064730A (en) * | 2015-09-28 | 2017-04-06 | 株式会社タムラ製作所 | Flux composition for non-cleaned solder paste and no-clean solder paste, and flux scattering evaluation method of solder paste |
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CN102205472B (en) | 2014-10-15 |
KR20110109890A (en) | 2011-10-06 |
JP5776877B2 (en) | 2015-09-09 |
KR101665731B1 (en) | 2016-10-12 |
CN102205472A (en) | 2011-10-05 |
TWI546150B (en) | 2016-08-21 |
TW201143959A (en) | 2011-12-16 |
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